JP4166454B2 - Laser processing apparatus and laser processing method - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a laser processing apparatus and a laser processing method for performing a cleaving process with a laser beam on a workpiece made of, for example, an automobile instrument panel.
[0002]
[Prior art]
In general, an airbag for a passenger seat of an automobile is arranged inside an instrument panel of a dashboard. An opening is formed in the instrument panel so as to face the airbag, and a lid plate is attached to the opening. Or although the opening is not provided, the groove part for cleavage of a predetermined shape is formed in the instrument panel so that the opening part may be comprised. And, normally, the airbag is covered with a lid plate or an opening portion, and when the airbag is activated, the lid plate is scattered or the opening portion is cleaved from the groove portion, and the airbag is instrument panel. It is designed to bulge from the inside to the outside.
[0003]
However, in the airbag covering structure as described above, there is a problem that the external appearance is deteriorated because the outer shape of the cover plate and the groove portion of the open portion appear on the surface of the instrument panel. In addition, since the outer shape of the lid plate and the groove portion of the open portion are reflected in the front window, there is a problem that it is difficult to drive.
[0004]
In order to cope with these problems, a method has also been proposed in which blind holes are formed on the back surface of the instrument panel, and the holes are arranged at predetermined intervals to form a cleavage portion. In this processing method, it is necessary to secure a remaining thickness portion having a certain thickness between the inner bottom portion of the perforation and the surface side of the panel, and to form the fracture strength of the cleavage portion at a predetermined value over the entire circumference. There is.
[0005]
In order to stabilize the thickness of the remaining portion, it is necessary to stabilize the output of the laser beam. However, for this stabilization, various elements or conditions such as the supply voltage to the oscillator of the laser processing apparatus, the cooling water temperature of the optical system, and the ambient temperature of the processing apparatus need to be constant. Actually, these elements and conditions are not often maintained constant, and the actual output of the laser light is almost always changed due to changes in the optical system over time.
[0006]
If laser processing is performed in a state where the output of the laser beam changes, the thickness of the remaining part of the workpiece changes, which may hinder the tearing of the airbag when it is inflated, or the laser beam passes through the workpiece. As a result, there is a risk that a small hole is made in the workpiece or a scar remains.
[0007]
[Problems to be solved by the invention]
In order to compensate for the changing output of laser light, for example, a technique described in Japanese Patent Laid-Open No. 63-278687 has been proposed. In this technique, as shown in FIG. 9, the output of the pulse laser beam according to the reference pulse oscillated at a predetermined fundamental frequency is detected for each pulse, the output is integrated by an integration circuit, and the integrated value and An error between them is determined by comparing with a reference value.
[0008]
However, when integrating the output of the pulse laser beam, a discharge time in the integration circuit is required. However, for example, a pulse laser beam oscillated at a high speed of 5 KHz has an output OFF time that is too short. It is difficult to secure.
[0009]
For this purpose, it is conceivable to shorten the time constant of the integration circuit. However, as will be apparent from the integration value 30 shown in FIG. If the time constant is increased, the discharge time of the integration circuit cannot be secured as described above. Therefore, in the conventional method, a value far from the actual output value is monitored, and the laser output cannot be accurately detected. Therefore, when this conventional method is applied to instrument panel tearing, laser output control becomes impossible, and as a result, it is difficult to make the thickness of the remaining portion constant.
[0010]
The present invention has been made paying attention to such problems existing in the prior art. An object of the present invention is to provide a laser processing apparatus and a laser processing method capable of accurately acquiring an output value of laser light by pulse oscillation and stabilizing the thickness of the remaining portion.
[0011]
[Means for Solving the Problems]
  In order to achieve the above-described object, the invention according to claim 1 is configured to perform drilling by irradiating a laser beam by pulse oscillation from a nozzle onto a workpiece formed of a panel supported on a jig, and to form a nozzle and a workpiece. By arranging the drilling points in a line by relative movement between them, the laser is designed to perform a cleaving process with a remaining thickness of a constant thickness between the inner bottom of the drilling and one surface side of the workpiece. In the processing apparatus, according to the workpiece thickness detection means for detecting the thickness of the workpiece, and the detection result by the thickness detection means of the workpiece, the output of the laser beam at the time of high output irradiation is set, After the laser beam at the drilling point is irradiated with high power, A predetermined ratio to this high-power laser beamAn output control means for controlling the output of the laser light so as to be switched to a small output, and a laser light detection means for detecting the actual output of the laser light at the time of the high output irradiation for each pulse , An adder for adding the detected outputs, and according to the addition result by the adder, the set laser beam at the time of high output irradiationConsists of at least one of pulse frequency, peak power, and number of pulsesOutput value and actualConsists of at least one of pulse frequency, peak power, and number of pulsesAdjusting means for adjusting the output of the laser beam at the time of the small output irradiation following the high output irradiation so as to compensate for the excess and deficiency compared with the set output value of the laser beam based on the difference with the output value; A workpiece thickness by the workpiece thickness detection meansButAfter the detection, the output control means sets the output of the laser beam at the time of the high output irradiation according to the detection result, and then drilling is performed by the high output laser beam based on the set output value. In addition, the actual output of the laser beam output is detected by the laser beam detection means, and the detected actual output value is added by the adder, and the laser processing with the set high output laser beam is finished. The adjustment means compares the total output value of the actual large output laser beam calculated by the addition by the adder with the set output value of the large output laser beam, and as a result of this comparison, the actual total output value is compared. The output of the laser beam at the time of the next small output irradiation is adjusted so as to compensate for the excess or deficiency of the output value.
[0012]
  Therefore, in the invention according to the first aspect, it is possible to form a machining hole in which a remaining portion is provided on a workpiece by performing drilling with a pulsed laser beam. And if this processed hole is made continuous in the form of a perforation along the surface of the workpiece, it is possible to form a groove-like unbreakable. In this case, drilling with a high-power pulsed laser beam is performed, followed by drilling with a low-power pulsed laser beam, and the number of pulses of the small-power laser beam is set according to the laser beam output by the high-power laser beamSettingAdjusted to match the value. For this reason, even if an error occurs in the drilling depth by the high output laser beam, the error can be eliminated in the drilling by the small output laser beam, and the thickness of the remaining portion can be made constant. In addition, since the drilling by the small output laser beam is performed following the drilling by the high output laser beam, the opening side of the processing hole is widely formed. For this reason, discharge of inert gas, workpiece chips and the like is performed smoothly, and highly accurate and efficient drilling work becomes possible. Furthermore, in determining the output of the laser beam, the output for each pulse of the pulsed laser beam is simply added, so that the actual output can be accurately calculated. For this reason, it is possible to accurately ensure the drilling depth, in other words, the thickness of the remaining portion based on the accurate output value. Also, by adjusting the output of the pulsed laser beam according to the thickness of the workpiece, the depth of the drilled hole can be adjusted, and the thickness of the remaining part can be kept constant even if the thickness of the workpiece changes. Can be secured.
[0014]
  Claim2In the invention described in claim 1,1The power of small output irradiation at the perforation point is 70% or less and 20% or more with respect to the power of high output irradiation.
[0015]
  Therefore, the claims2In the invention described in (1), since the power of the small output irradiation is sufficiently lower than the power of the large output irradiation, the depth of the processed hole can be adjusted with high accuracy by the small output laser beam.
[0016]
  In invention of Claim 3, it is related with the laser processing method, and while irradiating a laser beam from a nozzle with respect to the workpiece | work consisting of the panel supported on the jig | tool, a nozzle and a workpiece | work Laser drilling is performed by providing a remnant part with a certain thickness between the inner bottom part of the perforation and one surface side of the workpiece by arranging the perforation points by relative movement between them. In the method, after detecting the thickness of the workpiece, setting the output of the laser beam at the time of the high-power irradiation according to the detection result of the thickness of the workpiece, after irradiating the laser beam at each of the drilling points with the high output, A predetermined ratio to this high-power laser beamSwitch to small output and irradiate, detect the actual output of the laser beam at the time of high output irradiation for each pulse, then add the detected output, and the setting at the time of high output irradiation according to the addition result Laser lightConsists of at least one of pulse frequency, peak power, and number of pulsesOutput value and actualConsists of at least one of pulse frequency, peak power, and number of pulsesBased on the difference from the output value, the output of the laser beam at the time of the small output irradiation following the high output irradiation is adjusted so as to compensate for the excess and deficiency compared with the set output value of the laser beam. It is.
[0017]
  For this reason, the same effect as that of the first aspect can be obtained..
[0018]
Claim4In the invention described in claim 1,3The power of small output irradiation at the perforation point is 70% or less and 20% or more with respect to the power of high output irradiation.
[0019]
  Therefore, the claims4In the invention described in item (3), the same effect as in the third aspect can be obtained.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
As shown in FIG. 1, in the laser processing apparatus of this embodiment, a support member 11 made of a conductor constituting a jig is provided on a table 10. The support member 11 is moved in the X direction and the Y direction by a drive mechanism (not shown). The workpiece 12 is supported and fixed on the upper surface of the support member 11 in a mounted state. In this embodiment, the work 12 is an instrument panel that covers a passenger airbag (not shown) of an automobile as shown in FIG.
[0021]
The laser head 13 shown in FIGS. 1 and 2 is driven and controlled by a motor (not shown) so as to be able to approach and separate and tilt with respect to the support member 11, and a laser irradiation nozzle 14 is provided below the laser head 13. Projected. Then, the laser head 13 including the laser irradiation nozzle 14 is relatively moved in the X and Y directions with a predetermined vertical distance L1 with respect to the support member 11, and the laser irradiation nozzle 14 is determined in advance on the workpiece 12. Moved to the drilled position.
[0022]
As shown in FIGS. 1 and 2, a laser oscillator 15 is connected to the laser head 13. A plurality of mirrors 21 to 23 and a condensing lens 14a are arranged between the laser oscillator 15 and the laser irradiation nozzle 14, and a laser optical path between the laser head 13 and the laser oscillator 15 is formed by these. One of the mirrors 21 to 23 is a half mirror, and a part of the laser beam is transmitted through the half mirror. A detection sensor 24 serving as a laser beam detection unit is disposed on the transmitted light path, and an actual output of the laser beam by pulse oscillation generated from the oscillator 15 is detected.
[0023]
The laser oscillator 15 is electrically connected to the control device 16. The control device 16 controls the operation of the entire laser processing apparatus including the laser oscillator 15. A memory 20 is connected to the control device 16, and various data, programs, and the like are stored in the memory 20. The control device 16 and the memory 20 constitute correction means, adjustment means, and output control means. Based on the control of the control device 16 based on the various data and programs stored in the memory 20, laser light is supplied from the laser oscillator 15 to the laser head 13, and the workpiece 12 is irradiated with the laser light. Is done. Therefore, by this laser beam, as shown in FIG. 4, a processed hole 12 a is formed in the workpiece 12 so that a remaining portion t having a predetermined dimension remains. Based on the relative movement of the laser head 13 and the workpiece W in the X and Y directions, a plurality of the machining holes 12a are continuous along the surface of the workpiece W, and the continuous portions are intermittently formed. As a result, a perforated cleavage portion is formed with respect to the workpiece W.
[0024]
That is, as shown in FIG. 6, the control device 16 outputs a reference pulse of a fundamental frequency (for example, 5 KHz) to the laser oscillator 15, and outputs an on signal, an off signal, and a switching signal. When the ON signal is output, the laser oscillator 15 oscillates a continuous pulsed laser beam with a large output according to the reference pulse. Next, when the switching signal is output, the oscillated laser beam is switched to a small output of a predetermined ratio with respect to the large output laser beam. In this embodiment, the small output power is 50% of the large output power. When the off signal is output, the output of the low-power pulsed laser beam is stopped. In this embodiment, the number of pulses of the large output laser beam and the number of pulses of the small output laser beam are set in advance. However, the number of pulses of the large output laser beam and the small output laser beam is set or changed to a different number under the control of the control device 16 as will be apparent from the following description.
[0025]
The laser light detection sensor 24 detects the output of the high-power laser light. And the control apparatus 16 calculates the perforation depth for every pulse of a high output laser beam based on the detected output of a high output laser beam.
[0026]
  On the other hand, the control device 16 is provided with an adder 25. The adder 25 adds the output of the high-power laser beam detected by the detection sensor 24, and the added value is stored in the memory 20. And the control apparatus 16 adjusts the output timing of the said OFF signal based on the addition result of the output by the adder 25. FIG.
Therefore, the output value of the small output laser beam following the output of the large output laser beam is corrected by adjusting the output timing of the off signal. In this embodiment, the output value of the small output laser beam is at least one of the pulse frequency of the laser beam, the peak power of each pulse laser beam, and the number of pulses.The value of theShall be included.
[0027]
The base material of the laser irradiation nozzle 14 is made of an insulating material, the first electrode 17 is formed at the tip thereof, and the second electrode 18 is formed on the outer peripheral surface by coating or the like. The first electrode 17 and the second electrode 18 are connected to a capacitance sensor 19 as a work thickness detecting means. When laser processing is performed on the workpiece 12, the capacitance according to the thickness of the workpiece 12 between the support member 11 and the laser irradiation nozzle 14 is detected by the capacitance sensor 19, and the detection result is sent to the control device 16. Is output.
[0028]
  As apparent from FIG. 5, the detection voltage having a smaller electrostatic capacity is output as the plate thickness of the workpiece 12 increases. Based on this, the control device 16 adjusts the output timing of the switching signal shown in FIG. In this embodiment, as will be described later, approximately 80% of the depth of the processing hole is drilled by the high-power laser beam, and the rest is drilled by the low-power laser beam. Therefore, the output of the high-power laser beam is set according to the plate thickness of the workpiece 12. Further, the control device 16 adjusts the output timing of the switching signal in the subsequent drilling based on the perforation amount per one pulse of the high-power laser beam described above and the value added by the adder 25, and the subsequent The output value of the large output pulsed laser beam is corrected. In this embodiment, the output value of the high-power laser beam is at least one of the pulse frequency of the laser beam, the peak power of each pulsed laser beam, and the number of pulses.The value of theShall be included.
[0029]
A thermoelectric power monitor 21 is disposed at one corner of the support member 11. The thermoelectric power monitor 21 receives the laser beam irradiation before starting the processing or during the processing setup, and measures the intensity of the laser beam. The control device 16 receives the detection signal from the thermoelectric power monitor 21 and determines the difference between the laser beam intensity command value and the actual intensity output value. Based on this determination, the control device 16 adjusts the output level of the laser beam for each pulse so that the actual output level of the intensity approaches the command value.
[0030]
The input means 26 such as an input panel shown in FIG. 1 is for manually inputting various data and commands.
Next, a laser processing method by the operation of the laser processing apparatus of this embodiment configured as described above will be described based on the flowchart of FIG. The flowchart of FIG. 7 proceeds when the program stored in the memory 20 is operated under the control of the control device 16.
[0031]
When laser processing is started, the laser irradiation nozzle 14 is first lowered to a predetermined programmed position above the work 12 placed and fixed on the support member 11, and a predetermined vertical distance L <b> 1 with respect to the support member 11. (Step S1). For this reason, the distance between the laser irradiation nozzle 14 and the support member 11 is maintained at a constant value.
[0032]
In this state, the laser head 13 including the laser irradiation nozzle 14 and the support member 11 that supports the workpiece 12 are relatively moved in the X and Y directions, and laser processing on the workpiece 12 is started (step S2). In this case, first, in a state where the laser irradiation nozzle 14 corresponds to one punching position on the workpiece 12, the capacitance is detected by the capacitance sensor 19, and the detected voltage corresponding to the plate thickness of the workpiece 12 is controlled by the control device. 16 (step S3).
[0033]
  Based on the detection result of the capacitance, the control device 16 sets and corrects the output of the high-power laser beam, for example, the number of pulses, among the pulsed laser beam outputs (steps S4 and S5). At this time, the number of pulses of the small output laser beam is determined in advance. That is, in steps S4 and S5, as is apparent from FIG. 4, according to the thickness of the workpiece 12 detected by the capacitance sensor 19 so that the thickness of the remaining portion t is constant, The number of pulses of high-power laser light is set. In this embodiment, the perforation by the high-power laser beam is, Workpiece corresponding to the depth of drillingthicknessMin80% of drilling with a low power laser, Workpiece corresponding to the depth of drillingthicknessMinThe perforation ratio is set as a standard value in advance so as to be 20% of the above.
[0034]
Next, an ON signal shown in FIG. 6 is output from the control device 16, and a high-power pulsed laser beam is irradiated to the drilling position of the workpiece 12 in accordance with the reference pulse number of the fundamental frequency (step S6). Start (see FIG. 4 and FIG. 8). At the time of output of this large output laser beam, the output (power) is detected by the laser beam detection sensor 24 (step S7), and the detected output value is added with time by the adder 25, and the result of the addition shown in FIG. The value 31 is accumulated (step S8).
[0035]
  In this way, when the laser processing with the high-power pulse laser beam by the set pulse oscillation is completed (step S9), the actual total output value of the high-power laser beam calculated by the addition by the adder 25, the settingWasTotal output to be obtained by laser lightValue andComparison is performed (step S10). If the actual output is insufficient as a result of this comparison, the settings described aboveTotal outputValue of the next small output laser lightSettingIf the output is increased and more,SettingAdjustment that the output is decreased is executed (step S11). If both output values are equal, setOutputThe value is maintained without adjustment.
[0036]
Then, low-power laser processing is performed for the number of pulses set in step S11 (step S12), and when the set number is reached, drilling of the processing hole 12a is completed (step S13). Therefore, when the remaining portion t having a specified dimension thickness is formed in the workpiece 12, the drilling by the small output laser beam is stopped.
[0037]
Next, it is determined whether or not there is a subsequent perforation (step S14). If there is no subsequent drilling, the laser processing is stopped (step S16). The adder 25 uses the time at the end of processing to discharge the accumulated charges as shown in FIG. 8 and prepare for the next addition operation. If there is a subsequent perforation, the perforation depth per pulse of the high-power laser light is calculated based on the actual output of the high-power laser light measured in step S6 (step S15).
[0038]
Then, the routine returns to step S3, the thickness of the workpiece 12 is detected by the capacitance sensor 19, and the number of pulses by the high-power laser beam is calculated so as to correspond to the thickness. The number of pulses is calculated based on the drilling depth per pulse calculated in step S15. That is, the number of pulses of the high-power laser beam is calculated and corrected as necessary so that the value obtained by multiplying the number of pulses per pulse by the number of pulses becomes the drilling depth of the high-power laser beam.
[0039]
Then, the routine after step S3 described above is executed. For this reason, by repeating this routine, a plurality of machining holes 12a are continuous along the surface of the workpiece W, and the continuous portions are intermittently formed. As shown in FIG. A cleaved portion 1 having a shape can be provided.
[0040]
Therefore, according to this embodiment, the following effects can be obtained.
・ Laser beam output correction was performed at the time of small output irradiation following high output irradiation. For this reason, even if an error occurs in the drilling depth by the high-power laser beam, the error can be eliminated in the drilling by the small-power laser beam. Therefore, it is always possible to ensure the remaining thickness portion t having a constant thickness with an accurate remaining thickness. Therefore, it is possible to form the cleavage portion 1 that is surely opened under a predetermined condition.
[0041]
Prior to drilling with the low-power laser beam, drilling with the high-power laser beam is performed, so that the opening side of the processing hole 12a is widely formed. For this reason, the inert gas, the workpiece chips and the like are smoothly discharged from the processing hole 12a during the laser beam irradiation, and a highly accurate and efficient drilling operation can be performed.
[0042]
-Since the output for each pulse of the pulsed laser beam is added by the adder 25, unlike the case of integration, the total output value of the pulsed laser beam can be accurately calculated, and the drilling depth, that is, the remaining portion Thickness can be ensured accurately.
[0043]
-By detecting the thickness of the workpiece 12 and adjusting the output of the laser beam according to the change in the thickness, the depth of the processing hole 12a can be adjusted according to the thickness of the workpiece 12, The thickness of the remaining portion t can be made constant.
[0044]
・ By using the capacitance sensor 19 for detecting the thickness of the workpiece 12, unlike the case where a sensor that detects the laser beam transmitted through the workpiece 12 is used, a through-hole is formed in the workpiece. The workpiece thickness can be detected reliably. Further, it is not necessary to provide sensors on both the front and back sides of the work 12, and the configuration is simple.
[0045]
-When adjusting the laser beam according to the thickness of the workpiece 12, the number of pulses of the laser beam with a large weight of the drilling depth becomes an adjustment target because the high-power laser beam output is adjusted. Therefore, the drilling depth by laser processing can be effectively corrected.
[0046]
-When adjusting the output of the pulsed laser beam according to the addition result of the adder 25, the number of small output laser beams is adjusted so that the drilling depth can be finely adjusted, and the accurate thickness can be adjusted. The remaining portion t can be secured.
[0047]
-According to the result of addition by the adder 25, the output of the pulsed laser beam in the subsequent drilling is corrected, so that the remaining thickness of a constant thickness can be obtained even in the subsequent drilling in which various conditions are almost the same. The part t can be formed. For this reason, as a whole, a remaining portion having a uniform thickness can be provided.
[0048]
(Example of change)
In addition, this embodiment can also be changed and embodied as follows.
In the embodiment, the output of the high-power laser beam is detected, and the laser output for subsequent drilling is corrected. On the other hand, the outputs of both the high-power laser beam and the small-power laser beam are detected and reflected in subsequent drilling. In this way, more accurate drilling is possible.
[0049]
In the embodiment, the output of the high-power laser beam is detected, and the laser output of the subsequent high-power laser beam is corrected. On the other hand, correct the output of the low-power laser beam. In this way, fine adjustment of the drilling depth becomes possible.
[0050]
-In the said embodiment, it was made to reflect in the output of a high output pulse laser beam with an electrostatic capacitance detector. On the other hand, it should be configured to reflect the output of the small output pulse laser beam.
[0051]
In the embodiment, the irradiation power of the small output laser beam is 50% of that of the large output laser beam. On the other hand, set it to any value between 70% or less and 20% or more.
[0052]
As a detecting means for detecting the thickness of the workpiece 12, a sensor other than a capacitance sensor, for example, a sensor that mechanically detects the workpiece thickness by contacting the upper surface of the workpiece 12 is used. In this way, the cost for the detection means can be reduced.
[0053]
-The present invention is applied to a case where a cleaving process is performed on a center cover of a steering wheel other than an automobile instrument panel. Also in this case, the same effect as that of the above embodiment can be obtained.
[0054]
【The invention's effect】
As described above in detail, in the present invention, in the laser light irradiation by pulse oscillation, the output value of the preceding large output laser light is accurately obtained, and the irradiation output of the subsequent small output laser light is accordingly obtained. Since the thickness of the remaining portion can be stabilized, an excellent effect is exhibited.
[Brief description of the drawings]
FIG. 1 is a configuration diagram showing a laser processing apparatus according to an embodiment.
FIG. 2 is a cross-sectional view showing a processed part in the same processing state.
FIG. 3 is a perspective view showing a laser processing state on a workpiece.
FIG. 4 is an explanatory view showing a processing hole.
FIG. 5 is a diagram showing a relationship between a workpiece thickness and a detection voltage.
FIG. 6 is a diagram showing a signal for driving pulsed laser light.
FIG. 7 is a flowchart showing the operation of the laser processing apparatus.
FIG. 8 is a graph showing the added value of high-power laser light.
FIG. 9 is a graph showing an integrated value of laser light in a conventional laser processing apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 12 ... Work, 12a ... Processing hole, 13 ... Laser head, 14 ... Laser irradiation nozzle, 15 ... Laser oscillator, 16 ... Control apparatus which comprises output control means, correction | amendment means, adjustment means, setting means, 19 ... Work thickness Capacitance sensor constituting detection means, 20 ... output control means, correction means, adjustment means, memory constituting setting means, 24 ... laser light detection sensor constituting laser light detection means, 25 ... adder, l ... Cleavage part, t ... remaining meat part.

Claims (4)

Drilling is performed by irradiating a laser beam by pulse oscillation from a nozzle onto a workpiece consisting of a panel supported on a jig, and by arranging the drilling points by relative movement between the nozzle and the workpiece. In the laser processing apparatus adapted to perform a cleaving process with a remaining thickness portion having a constant thickness between the inner bottom portion and one surface side of the workpiece,
A workpiece thickness detecting means for detecting the thickness of the workpiece;
According to the detection result by the thickness detection means of the workpiece, the output of the laser beam at the time of the high output irradiation is set, and after the laser beam at each of the perforation points is irradiated with the high output, this high output laser beam Output control means for controlling the output of the laser light so as to be switched to a small output of a predetermined ratio for irradiation,
Laser light detection means for detecting the actual output of the laser light at the time of the high-power irradiation for each pulse;
An adder for adding the detected outputs;
According to the addition result by the adder, the output value consisting of at least one of the set pulse frequency, peak power, and pulse number of the laser beam at the time of high output irradiation, the actual pulse frequency, peak power, Laser light at the time of small output irradiation following high output irradiation so as to compensate for the excess and deficiency compared with the output value of the set laser light based on the difference from the output value consisting of at least one value of the number of pulses Adjusting means for adjusting the output of the
By the workpiece thickness detecting means, after the workpiece thickness is detected by the output control means in accordance with the detection result, the output of the laser light during a large output radiation is set, then the set output value Drilling is performed by the high-power laser beam based on the above, and the actual output of the laser beam output is detected by the laser beam detection means, and the value of the detected actual output is added by the adder and set When the laser processing with the high-power laser beam is completed, the adjustment means calculates the total output value of the actual high-power laser light calculated by the addition by the adder, and the set output value of the high-power laser light. As a result of this comparison, the laser processing apparatus is characterized in that the output of the laser beam at the next small output irradiation is adjusted so as to compensate for the excess or deficiency of the actual total output value. . Oite to claim 1,
A laser processing apparatus characterized in that the power of low-power irradiation at the perforation point is 70% or less and 20% or more of the power of high-power irradiation. By drilling a workpiece consisting of a panel supported on a jig by irradiating a laser beam from the nozzle, and by arranging the drilling points by relative movement between the nozzle and the workpiece, the inner bottom of the drilling In a laser processing method in which a cleaving process in which a remaining portion having a certain thickness is provided between the surface side of the workpiece and one surface of the workpiece is performed,
Detecting the thickness of the workpiece, in accordance with its work thickness detection result, and sets the output of the high output during irradiation of laser light, after the laser beam in each of perforation points irradiated with high power, the large The laser beam of the output is switched to a small output at a predetermined ratio and irradiated, and the actual output of the laser beam at the time of high power irradiation is detected for each pulse, and then the detected output is added, and the addition result Depending on the output value of at least one of the set pulse frequency, peak power, and pulse number of the laser beam at the time of high power irradiation, and at least one of the actual pulse frequency, peak power, and pulse number to compensate for the excess and deficiency compared to the set output value of the laser beam on the basis of the difference between the output value composed of values, to adjust the output of the laser beam during the subsequent low output radiation to a large output radiation Laser processing method, wherein a. In claim 3 ,
A laser processing method, characterized in that the power of small output irradiation at a perforation point is 70% or less and 20% or more with respect to the power of high output irradiation.

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