JP2004255423A - Laser cutting device, and laser cutting method - Google Patents

Laser cutting device, and laser cutting method Download PDF

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JP2004255423A
JP2004255423A JP2003049575A JP2003049575A JP2004255423A JP 2004255423 A JP2004255423 A JP 2004255423A JP 2003049575 A JP2003049575 A JP 2003049575A JP 2003049575 A JP2003049575 A JP 2003049575A JP 2004255423 A JP2004255423 A JP 2004255423A
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cut
cutting
laser head
laser
distance
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JP2003049575A
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JP4198490B2 (en
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Noboru Soeda
昇 副田
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Press Kogyo Co Ltd
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Press Kogyo Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a laser cutting device and a laser cutting method by which the detection of the cutting starting position of the edge part of the member to be cut and the control of the intervals between a laser head and the member to be cut in the cutting starting position can automatically and swiftly be performed. <P>SOLUTION: The laser cutting device is provided with a laser head 15, a detection means of detecting the intervals between the laser head 15 and the member W to be cut, and a control unit 16 of relatively moving the laser head 15 and the member W to be cut and controlling the intervals to a prescribed value based on the detected value from the detection means. In the control unit 16, when cutting is started from the edge part of the member W to be cut, at first, the intervals between the laser head 15 and the member W to be cut are controlled to a prescribed value on the member W to be cut, next, in a state where a laser is not applied and also in a state where the intervals are held to have the prescribed value, the laser head 15 is moved to a direction reverse to the cutting direction D along a cutting line CL, and when the detected value from the detection means is rapidly changed, the fact that the laser head 15 reaches the cutting starting position SP is judged: Then, with the intervals as intervals directly before the rapid change of the detected values from the detecting means, cutting is started from the cutting starting position SP. <P>COPYRIGHT: (C)2004,JPO&NCIPI

Description

【0001】
【発明の属する技術分野】
本発明は、レーザ切断装置及びレーザ切断方法に係り、特に、被切断部材の端部から切断を開始する際に、切断開始位置の検出、及び切断開始位置におけるレーザヘッドと被切断部材との間隔調節を自動的かつ迅速に実行できるレーザ切断装置及びレーザ切断方法に関するものである。
【0002】
【従来の技術】
金属製の板材等を所定の切断ラインに沿って切断する装置としてレーザ切断装置が知られている。
【0003】
レーザ切断装置の一例を図5に示す。
【0004】
図5に示すように、レーザ切断装置10は、被切断部材Wをその上に保持すると共に、X軸方向に移動可能なテーブル11と、そのテーブル11を跨ぐように設けられたフレーム12に対してY軸方向に移動可能に取り付けられたキャリッジ13と、そのキャリッジ13に対してZ軸方向に移動可能に設けられると共に、被切断部材Wに向かってレーザを照射して切断を行うレーザヘッド15とを備える。テーブル11、キャリッジ13及びレーザヘッド15のX,Y,Z軸方向への移動や、レーザヘッド15からのレーザの照射等が制御装置16により制御される。このようなレーザ切断装置10は、例えば特許文献1等にも記載されている。
【0005】
【特許文献1】
特開平9−136174号公報(図5など)
【0006】
【発明が解決しようとする課題】
ところで、かかるレーザ切断装置10において、切断精度を高く、かつ良好な切断面を得られるようにするためには、レーザヘッド15と被切断部材Wとの間隔(Z軸方向距離)を適切に保つ必要がある。被切断部材Wは必ずしも平坦状ではなく、湾曲している(反っている)場合等がある。このような場合、被切断部材Wの高さ(Z軸方向位置)が部位によって異なるため、レーザヘッド15の高さを適宜調節しながら切断していく必要がある。
【0007】
そこで従来から、レーザヘッド15に、レーザヘッド15と被切断部材Wとの間隔を検出するハイトセンサ(図示せず)を設けて、そのハイトセンサの検出値に基づいてレーザヘッド15を上下させて、レーザヘッド15と被切断部材Wとの間隔を常に一定に保つようにしている。
【0008】
ここで問題となるのは、図6に示すように、被切断部材Wの端部SPから切断を開始する場合、端部SPにおけるレーザヘッド15と被切断部材Wとの間隔調整(レーザヘッド15の高さ調整)が困難なことである。なぜなら、被切断部材Wの端部SPでは、ハイトセンサがレーザヘッド15とテーブル11との間隔を検出してしまい、レーザヘッド15がテーブル11に対して高さ合わせされてしまう場合があるからである。そうすると、レーザヘッド15が被切断部材Wに対して近すぎることになり、良好な切断ができなくなってしまう。
【0009】
そこで従来は、作業者が目視により、レーザヘッド15を切断開始位置SPに合わせて高さ調節していた。しかしながら、この方法でも、作業者の目視による調整であるため、高精度な調節は困難であると共に、作業者を介さずに行うことができない。
【0010】
また他の方法として、図7に示すような方法も知られている。図7は切断開始位置SP近傍の拡大図であり、この方法は、まず被切断部材Wの製品とならない部分(スクラップとなる部分)上のある点P1でハイトセンサの検出値に基づいてレーザヘッド15の高さ調節を行う。そして、レーザヘッド15を所定の切断ラインCLに沿って移動して、切断開始位置SPまで切断を行う。なお、この方法では切断開始位置SPは切断を開始する位置ではないが、便宜上、図6と合わせて切断開始位置と言う。次に、再度被切断部材Wのスクラップ部分上のある点P2でレーザヘッド15の高さ調節を行い、今度は切断ラインCLを逆方向に切断していく。この方法であれば、レーザヘッド15の高さ調節を高精度で行うことができる。しかしながら、この方法では、一本の切断ラインCLを切断するのに二回の切断作業が必要となるため、効率が悪く製造コストが高い。また、二回の切断作業の交点部分IPにノッチ等が成形されてしまう場合があるため、品質が悪化してしまう。あるいは、このノッチを除去する作業が必要となり、製造工程及び製造コストが上昇する。
【0011】
更に別の方法として、タッチプローブを用いて、切断開始位置SPのX,Y,Z座標を検出して、その検出値に基づいてレーザヘッド15の位置合わせを行う方法もあるが、この場合、切断開始位置SPの検出に時間がかかるため、効率が悪く製造コストが上昇してしまう。
【0012】
そこで、本発明の目的は、上記課題を解決し、被切断部材の端部から切断を開始する際に、切断開始位置の検出、及び切断開始位置におけるレーザヘッドと被切断部材との間隔調節を自動的かつ迅速に実行できるレーザ切断装置及びレーザ切断方法を提供することにある。
【0013】
【課題を解決するための手段】
上記目的を達成するために本発明は、被切断部材にレーザを照射するレーザヘッドと、そのレーザヘッドと上記被切断部材との間隔を検出する検出手段と、上記レーザヘッドと上記被切断部材とを相対的に移動させると共に、上記検出手段の検出値に基づいて上記レーザヘッドと上記被切断部材との間隔を所定値に調節する制御装置とを備えたレーザ切断装置であって、上記制御装置は、上記被切断部材の端部から切断を開始する場合、まず、上記被切断部材上の任意の位置で上記レーザヘッドと上記被切断部材との間隔を所定値に調節し、次に、レーザを照射しない状態で、かつ上記レーザヘッドと上記被切断部材との間隔を上記所定値に維持した状態で、上記レーザヘッドを所定の切断ラインに沿って予め定められた切断方向と逆方向に移動させ、上記検出手段の検出値が急激に変化したときに上記レーザヘッドが上記被切断部材の端部の切断開始位置に到達したことを判断し、上記レーザヘッドと上記被切断部材との間隔を上記検出手段の検出値が急激に変化する直前の間隔として上記切断開始位置から切断を開始するものである。
【0014】
ここで、上記制御装置は、上記レーザヘッドが上記切断開始位置から所定距離切断するまでの間、上記検出手段の検出値に基づく上記レーザヘッドと上記被切断部材との間隔調節を実行しないようにしても良い。
【0015】
また本発明は、被切断部材とレーザヘッドとの間隔を検出する検出手段の検出値に基づいて上記レーザヘッドと上記被切断部材との間隔を所定値に調節しつつ、レーザヘッドと被切断部材とを相対的に移動させて切断するレーザ切断方法であって、上記被切断部材上の任意の位置で上記レーザヘッドと上記被切断部材との間隔を上記所定値に調節するステップと、レーザを照射しない状態で、かつ上記レーザヘッドと上記被切断部材との間隔を上記所定値に維持した状態で、上記レーザヘッドを所定の切断ラインに沿って予め定められた切断方向と逆方向に移動させるステップと、上記検出手段の検出値が急激に変化したときに上記レーザヘッドが上記被切断部材の端部の切断開始位置に到達したことを判断するステップと、上記レーザヘッドと上記被切断部材との間隔を上記検出手段の検出値が急激に変化する直前の間隔として上記切断開始位置から切断を開始するステップとを備えたものである。
【0016】
ここで、上記切断開始位置から所定距離切断するまでの間、上記レーザヘッドと上記被切断部材との間隔調節を実行しないステップを更に含むようにしても良い。
【0017】
【発明の実施の形態】
以下、本発明の好適な一実施形態を添付図面に基づいて詳述する。
【0018】
本実施形態のレーザ切断装置の概略構成は、図5に示すものと同様である。即ち、本実施形態のレーザ切断装置は、被切断部材Wをその上に保持すると共に、X軸方向に移動可能なテーブル11と、そのテーブル11を跨ぐように設けられたフレーム12に対してY軸方向に移動可能に取り付けられたキャリッジ13と、そのキャリッジ13に対してZ軸方向に移動可能に設けられると共に、被切断部材Wに向かってレーザを照射して切断を行うレーザヘッド15とを備える。テーブル11、キャリッジ13及びレーザヘッド15のX,Y,Z軸方向への移動(つまり、レーザヘッド15と被切断部材Wとの相対移動)や、レーザヘッド15からのレーザの照射等が制御装置16により制御される。
【0019】
本実施形態のレーザ切断装置は更に、図示はしないが、レーザヘッド15に設けられ、レーザヘッド15と被切断部材Wとの間隔(Z軸方向距離)を検出するハイトセンサ(検出手段)を備える。本実施形態では、ハイトセンサは比較的高感度の測定が可能な静電容量センサが用いられる。静電容量センサの検出値は制御装置16に入力される。
【0020】
制御装置16には、所定の切断ラインCL(図2参照)のX,Y座標が予め入力されており、切断作業時には、レーザヘッド15が被切断部材Wに対して切断ラインCLに沿って予め定められた切断方向Dに相対的に移動するように、キャリッジ13及びテーブル11を移動させる。また、制御装置16は基本的には、レーザヘッド15を切断ラインCLに沿って移動させる間、ハイトセンサの検出値に基づいてレーザヘッド15を適宜Z軸方向に移動させて、レーザヘッド15と被切断部材Wとの間隔を一定に維持する。
【0021】
さて、本実施形態のレーザ切断装置は、図2に示すように、被切断部材Wの端部の切断開始位置SPから切断を開始する際に、その切断開始位置SPの検出、及び切断開始位置SPにおけるレーザヘッド15と被切断部材Wとの間隔調節を自動的かつ迅速に実行できるようにしたものであり、以下その点について説明する。
【0022】
図1は、制御装置16が実行する切断開始制御のフローチャートであり、このフローチャートと図2とに基づいて、本実施形態のレーザ切断装置による切断方法を説明する。
【0023】
まず、ステップS1において、レーザヘッド15が被切断部材Wの切断ラインCL上の測定ポイントMPに位置するように、キャリッジ13及びテーブル11を移動させる。この測定ポイントMPは、切断ラインCL上の任意の位置に設定できるものであり、そのX,Y座標が予め制御装置16に入力される。
【0024】
次に、ステップS2において、ハイトセンサを駆動(ON)して、ステップS3で、レーザヘッド15と被切断部材Wとの間隔を測定する。
【0025】
そして、ステップS4において、ステップS3で測定した間隔が予め制御装置16に入力された設定間隔と等しいか否かを判定する。設定間隔は、良好な切断を得るために必要な値に設定される。なお、設定間隔には所定の許容誤差(例えば±0.数ミリ程度)を設けても良い。
【0026】
測定間隔と設定間隔とが等しくない場合は、その差を縮める方向にレーザヘッド15を移動させると共に、ステップS2に戻り、ハイトセンサによる間隔測定を継続する。
【0027】
つまり、ステップS2〜S4では、測定ポイントMPにおけるレーザヘッド15の高さ調節(レーザヘッド15と被切断部材Wとの間隔調節)を行う。
【0028】
ステップS4において測定間隔と設定間隔とが等しいと判定された場合、ステップS5に進み、レーザヘッド15が切断ラインCLに沿って予め定められた切断方向Dと逆方向に移動するように、キャリッジ13及びテーブル11を移動させる。このときレーザヘッド15からレーザは照射せず、被切断部材Wの切断は行わない。
【0029】
レーザヘッド15が切断ラインCLに沿って逆方向に移動する間、ステップS6において、ハイトセンサの検出値の変化量Vを常に演算し、ステップS7でその変化量Vが所定のしきい値Tよりも大きいか否かを判定する。しきい値Tは、ハイトセンサの検出値が急激に変化したと見なせるような値であり、予め制御装置16に入力される。
【0030】
変化量Vがしきい値T以下であると判定された場合、ステップS2に戻り、レーザヘッド15と被切断部材Wとの間隔が設定間隔となるように、つまり変化量Vをうち消すようにレーザヘッド15を移動させる。要するに、レーザヘッド15が切断ラインCLに沿って切断方向Dと逆方向に移動する間、ハイトセンサからの検出値に基づいてレーザヘッド15の高さ調節を行い、レーザヘッド15と被切断部材Wとの間隔を設定間隔に維持する。
【0031】
一方、ステップS7で変化量Vがしきい値Tよりも大きいと判定された場合、ステップS8に進み、キャリッジ13及びテーブル11の移動を停止して、レーザヘッド15の被切断部材Wに対する移動を停止する。変化量Vがしきい値Tよりも大きくなったということは、ハイトセンサの検出値が急激に変化したということであり、レーザヘッド15が被切断部材Wの切断開始位置SPに到達したことを意味している。つまり、被切断部材Wの反り等による高さの変化は急激なものではなく連続的に変化するものであるので、ハイトセンサの検出値が急激に変化した場合、レーザヘッド15が被切断部材Wの端部SPに到達してハイトセンサがレーザヘッド15とテーブル11との間隔を検出したと判断できる。
【0032】
ステップS7で変化量Vがしきい値Tよりも大きいと判定されたとき、レーザヘッド15の高さは、変化量Vがしきい値Tを越える直前の位置に維持される。つまり、変化量Vがしきい値Tを越えた場合、レーザヘッド15の高さ調節は行わない。従って、レーザヘッド15は、被切断部材Wの切断開始位置SPに対して設定間隔だけ隔てた高さに位置する。
【0033】
次に、ステップS9に進み、レーザヘッド15が切断ラインCLに沿って切断方向Dに移動するようにキャリッジ13及びテーブル11を移動させ、ステップS10で、レーザヘッド15からレーザを照射して被切断部材Wの切断を開始する。この切断開始時には、レーザヘッド15は、当然、被切断部材Wの切断開始位置SPに適した高さに調節されている。切断開始後は、ハイトセンサからの検出値に基づいてレーザヘッド15を適宜上下して、レーザヘッド15と被切断部材Wとの間隔を設定間隔に維持する。
【0034】
このように、本実施形態のレーザ切断装置及びレーザ切断方法によれば、被切断部材Wの端部の切断開始位置SPの検出、及びその切断開始位置SPにおけるレーザヘッド15と被切断部材Wとの間隔調節を自動的かつ迅速に実行することができる。従って、低コストで良好な切断が実行できる。
【0035】
次に、本発明の他の実施形態を説明する。
【0036】
この形態は、図3に示すように、被切断部材Wの幅L1が製品としての幅L2よりも若干大きい場合などに適したものである。この場合、レーザヘッド15が切断開始位置SPから距離L3だけ移動するまでの間はさほど高精度な切断を必要としないので、その間はハイトセンサの検出値に基づくレーザヘッド15の高さ調節を実行しないようにしたものである。
【0037】
図4のフローチャートを用いて本実施形態の切断方法を説明する。
【0038】
ステップS101〜S104は、図1のステップS1〜S4と同様であるので説明を省略する。
【0039】
ステップS104において、測定ポイントMPにおけるレーザヘッド15と被切断部材Wとの間隔が設定間隔と等しいと判定された場合、ステップS105に進みハイトセンサを無効(OFF)にする。この形態では、測定ポイントMPは被切断部材Wの切断開始位置SPから上記距離L3だけ内側の位置に設定される。測定ポイントMPにてレーザヘッド15の高さ調節が行われ、その位置でハイトセンサが無効とされる。
【0040】
次に、ステップS106に進み、レーザヘッド15が切断ラインCLに沿って切断方向Dと逆方向に移動するようにキャリッジ13及びテーブル11を移動させて、図1の実施形態と同様に被切断部材Wの端部の切断開始位置SPを検出する。そして、ステップS107に進み、レーザヘッド15が切断ラインCLに沿って切断方向Dに移動するようにキャリッジ13及びテーブル11を移動させると共に、レーザヘッド15からレーザを照射して被切断部材Wの切断を開始する。このとき、ハイトセンサは無効にしたままであり、レーザヘッド15の高さ調整は実行しない。
【0041】
レーザヘッド15が切断ラインCLに沿って距離L3だけ移動してポイントMPに到達したならば、ステップS108に進みハイトセンサを有効(ON)にする。次に、ステップS109に進み、切断ラインCLに沿った切断を継続する。このとき、ハイトセンサは有効であるので、ポイントMP以降の切断を行う間は、ハイトセンサの検出値に基づいてレーザヘッド15の高さ調節が実行される。また、切断ラインCLの切断終了側において、切断終了位置EPよりも距離L3だけ内側のポイントMP’に到達したときに、再度ハイトセンサを無効にして、それ以降(即ち、ポイントMP’からポイントEP間を切断する間)はレーザヘッド15の高さ調節を実行しないようにしても良い。
【0042】
この形態によれば、高精度な切断を必要としない部分ではレーザヘッド15と被切断部材Wとの間隔調節を行わないので、作業時間の短縮が図れる。
【0043】
なお、図1に示した制御を実行するプログラムと、図4に示した制御を実行するプログラムとの両方を制御装置16に入力しておき、被切断部材Wの状態などに応じて実行するプログラムを選択するようにしても良い。
【0044】
本発明は、図5に示したようなレーザ切断装置に限定はされず、様々なタイプのレーザ切断装置に適用できるものである。例えば、テーブル11がX軸とY軸とに移動できるタイプや、レーザヘッド15がX,Y,Z軸方向に移動できるタイプでも当然適用可能である。
【0045】
また、ハイトセンサは静電容量センサに限定はされず、レーザヘッド15と被切断部材Wとの間隔を検出できるものであれば、あらゆるタイプのものが適用可能である。
【0046】
更に、上記実施形態では最初にレーザヘッド15と被切断部材Wとの間隔調整を行う測定ポイントMPを切断ラインCL上に設定するとして説明したが、必ずしもその必要はない。つまり、被切断部材W上の任意の点で間隔調整を行った後、レーザヘッド15を切断ラインCL上に位置させて、その後、切断ラインCLに沿って移動させても良い。
【0047】
【発明の効果】
以上要するに、本発明によれば、被切断部材の端部における切断開始位置の検出、及び切断開始位置におけるレーザヘッドと被切断部材との間隔調節を自動的かつ迅速に実行できるという優れた効果を発揮するものである。
【図面の簡単な説明】
【図1】本発明の一実施形態の切断方法を示すフローチャートである。
【図2】図1の実施形態の切断方法を説明するための図であり、被切断部材及びその切断ラインを示している。
【図3】本発明の他の実施形態の切断方法を説明するための図であり、被切断部材及びその切断ラインを示している。
【図4】本発明の他の実施形態の切断方法を示すフローチャートである。
【図5】レーザ切断装置の斜視図である。
【図6】被切断部材の端部から切断を開始する場合を説明するための図であり、被切断部材及びその切断ラインを示している。
【図7】従来の切断方法を説明するための図であり、切断開始位置近傍の拡大図である。
【符号の説明】
10 レーザ切断装置
11 テーブル
13 キャリッジ
15 レーザヘッド
16 制御装置
SP 切断開始位置
W 被切断部材
[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a laser cutting device and a laser cutting method, and in particular, when starting cutting from an end of a member to be cut, detection of a cutting start position and a distance between a laser head and a member to be cut at the cutting start position. The present invention relates to a laser cutting apparatus and a laser cutting method capable of automatically and quickly performing adjustment.
[0002]
[Prior art]
A laser cutting device is known as a device for cutting a metal plate or the like along a predetermined cutting line.
[0003]
An example of a laser cutting device is shown in FIG.
[0004]
As shown in FIG. 5, the laser cutting device 10 holds a member W to be cut on the table 11 that is movable in the X-axis direction and a frame 12 that is provided so as to straddle the table 11. A carriage 13 movably mounted in the Y-axis direction, and a laser head 15 which is provided so as to be movable in the Z-axis direction with respect to the carriage 13 and irradiates a laser beam toward the member W to be cut. With. The control device 16 controls the movement of the table 11, the carriage 13, and the laser head 15 in the X, Y, and Z-axis directions, laser irradiation from the laser head 15, and the like. Such a laser cutting device 10 is also described in, for example, Patent Document 1.
[0005]
[Patent Document 1]
JP-A-9-136174 (FIG. 5 etc.)
[0006]
[Problems to be solved by the invention]
By the way, in this laser cutting apparatus 10, in order to obtain a high cutting accuracy and a good cut surface, the distance (Z-axis direction distance) between the laser head 15 and the member W to be cut is appropriately maintained. There is a need. The member to be cut W is not necessarily flat but may be curved (warped). In such a case, since the height (Z-axis direction position) of the member W to be cut differs depending on the part, it is necessary to cut the laser head 15 while adjusting the height appropriately.
[0007]
Therefore, conventionally, a height sensor (not shown) for detecting the distance between the laser head 15 and the member W to be cut is provided in the laser head 15, and the laser head 15 is moved up and down based on the detection value of the height sensor. The distance between the laser head 15 and the member W to be cut is always kept constant.
[0008]
The problem here is that, as shown in FIG. 6, when the cutting is started from the end SP of the member to be cut W, the distance between the laser head 15 and the member W to be cut at the end SP (laser head 15). (Height adjustment) is difficult. This is because the height sensor detects the distance between the laser head 15 and the table 11 at the end SP of the member W to be cut, and the laser head 15 may be aligned with the table 11. is there. If it does so, the laser head 15 will be too close with respect to the to-be-cut member W, and it will become impossible to cut | disconnect favorable.
[0009]
Therefore, conventionally, the operator adjusts the height of the laser head 15 to the cutting start position SP by visual observation. However, even with this method, since the adjustment is made by visual observation by the operator, high-precision adjustment is difficult and cannot be performed without the operator.
[0010]
As another method, a method as shown in FIG. 7 is also known. FIG. 7 is an enlarged view in the vicinity of the cutting start position SP. This method is based on the laser head based on the detection value of the height sensor at a certain point P1 on a portion (a scrap portion) of the member W to be cut. Adjust 15 heights. Then, the laser head 15 is moved along a predetermined cutting line CL to perform cutting to the cutting start position SP. In this method, the cutting start position SP is not a position at which cutting is started, but is referred to as a cutting start position together with FIG. 6 for convenience. Next, the height of the laser head 15 is adjusted again at a certain point P2 on the scrap portion of the member to be cut W, and this time, the cutting line CL is cut in the reverse direction. With this method, the height of the laser head 15 can be adjusted with high accuracy. However, this method requires two cutting operations to cut one cutting line CL, so that the efficiency is low and the manufacturing cost is high. In addition, since a notch or the like may be formed at the intersection part IP of the two cutting operations, the quality deteriorates. Or the operation | work which removes this notch is needed, and a manufacturing process and manufacturing cost rise.
[0011]
As yet another method, there is a method of detecting the X, Y, Z coordinates of the cutting start position SP using a touch probe and aligning the laser head 15 based on the detected value. Since it takes time to detect the cutting start position SP, the efficiency is poor and the manufacturing cost increases.
[0012]
Accordingly, an object of the present invention is to solve the above-described problems, and to detect the cutting start position and adjust the distance between the laser head and the member to be cut at the cutting start position when starting cutting from the end of the member to be cut. It is an object of the present invention to provide a laser cutting apparatus and a laser cutting method that can be executed automatically and quickly.
[0013]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a laser head for irradiating a member to be cut with laser, detection means for detecting a distance between the laser head and the member to be cut, the laser head and the member to be cut. And a control device that adjusts the distance between the laser head and the member to be cut to a predetermined value based on the detection value of the detection means, the control device When cutting from the end of the member to be cut, first, the gap between the laser head and the member to be cut is adjusted to a predetermined value at an arbitrary position on the member to be cut, and then the laser In a state where the laser head is not irradiated and the distance between the laser head and the member to be cut is maintained at the predetermined value, the laser head is moved in a direction opposite to a predetermined cutting direction along a predetermined cutting line. And determining that the laser head has reached the cutting start position at the end of the member to be cut when the detection value of the detection means changes abruptly, and the interval between the laser head and the member to be cut Is the interval immediately before the detection value of the detection means suddenly changes, and the cutting is started from the cutting start position.
[0014]
Here, the control device does not adjust the interval between the laser head and the member to be cut based on the detection value of the detection means until the laser head cuts a predetermined distance from the cutting start position. May be.
[0015]
Further, the present invention provides a laser head and a member to be cut while adjusting the distance between the laser head and the member to be cut to a predetermined value based on a detection value of a detecting means for detecting a distance between the member to be cut and the laser head. A laser cutting method in which the distance between the laser head and the member to be cut is adjusted to the predetermined value at an arbitrary position on the member to be cut; The laser head is moved in a direction opposite to a predetermined cutting direction along a predetermined cutting line in a state where the laser head is not irradiated and the distance between the laser head and the member to be cut is maintained at the predetermined value. A step of determining that the laser head has reached the cutting start position at the end of the member to be cut when the detection value of the detection means changes abruptly; and the laser head And the distance between the target cutting member is obtained by a step of starting the cutting from the cutting start position as the last interval in which detection value changes sharply in the detection means.
[0016]
Here, it may further include a step of not performing the adjustment of the distance between the laser head and the member to be cut until the predetermined distance is cut from the cutting start position.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a preferred embodiment of the present invention will be described in detail with reference to the accompanying drawings.
[0018]
The schematic configuration of the laser cutting device of the present embodiment is the same as that shown in FIG. That is, the laser cutting device of the present embodiment holds the member W to be cut on the table 11 that is movable in the X-axis direction and the frame 12 provided so as to straddle the table 11. A carriage 13 attached so as to be movable in the axial direction, and a laser head 15 provided so as to be movable in the Z-axis direction with respect to the carriage 13 and irradiating a laser beam toward the member W to be cut. Prepare. The control device controls the movement of the table 11, the carriage 13, and the laser head 15 in the X, Y, and Z-axis directions (that is, relative movement between the laser head 15 and the member W to be cut), laser irradiation from the laser head 15, and the like. 16 is controlled.
[0019]
Although not shown, the laser cutting device of the present embodiment further includes a height sensor (detection means) that is provided in the laser head 15 and detects the distance (Z-axis direction distance) between the laser head 15 and the member W to be cut. . In this embodiment, the height sensor is a capacitance sensor capable of measuring with relatively high sensitivity. The detection value of the capacitance sensor is input to the control device 16.
[0020]
The X and Y coordinates of a predetermined cutting line CL (see FIG. 2) are input to the control device 16 in advance, and the laser head 15 moves in advance along the cutting line CL with respect to the member W to be cut during the cutting operation. The carriage 13 and the table 11 are moved so as to move relative to the determined cutting direction D. The control device 16 basically moves the laser head 15 in the Z-axis direction as appropriate based on the detection value of the height sensor while moving the laser head 15 along the cutting line CL. The distance from the member to be cut W is kept constant.
[0021]
Now, as shown in FIG. 2, the laser cutting device of this embodiment detects the cutting start position SP and starts the cutting start position when starting cutting from the cutting start position SP at the end of the member W to be cut. The distance between the laser head 15 and the member W to be cut in SP can be automatically and quickly adjusted, and this point will be described below.
[0022]
FIG. 1 is a flowchart of the cutting start control executed by the control device 16, and the cutting method by the laser cutting device of the present embodiment will be described based on this flowchart and FIG.
[0023]
First, in step S1, the carriage 13 and the table 11 are moved so that the laser head 15 is positioned at the measurement point MP on the cutting line CL of the member W to be cut. The measurement point MP can be set at an arbitrary position on the cutting line CL, and its X and Y coordinates are input to the control device 16 in advance.
[0024]
Next, in step S2, the height sensor is driven (ON), and in step S3, the distance between the laser head 15 and the member to be cut W is measured.
[0025]
In step S4, it is determined whether or not the interval measured in step S3 is equal to the set interval input to the control device 16 in advance. The setting interval is set to a value necessary for obtaining a good cutting. It should be noted that a predetermined allowable error (for example, about ± 0.00 mm) may be provided in the set interval.
[0026]
If the measurement interval is not equal to the set interval, the laser head 15 is moved in a direction to reduce the difference, and the process returns to step S2 to continue the interval measurement by the height sensor.
[0027]
That is, in steps S2 to S4, height adjustment of the laser head 15 at the measurement point MP (adjustment of the distance between the laser head 15 and the member W to be cut) is performed.
[0028]
If it is determined in step S4 that the measurement interval is equal to the set interval, the process proceeds to step S5, and the carriage 13 is moved so that the laser head 15 moves in the direction opposite to the predetermined cutting direction D along the cutting line CL. And the table 11 is moved. At this time, no laser is irradiated from the laser head 15, and the member W to be cut is not cut.
[0029]
While the laser head 15 moves in the reverse direction along the cutting line CL, in step S6, the change amount V of the detection value of the height sensor is always calculated, and in step S7, the change amount V is greater than a predetermined threshold value T. It is determined whether or not it is larger. The threshold value T is a value that can be considered that the detection value of the height sensor has changed rapidly, and is input to the control device 16 in advance.
[0030]
If it is determined that the change amount V is equal to or less than the threshold value T, the process returns to step S2, and the interval between the laser head 15 and the member W to be cut becomes the set interval, that is, the change amount V is eliminated. The laser head 15 is moved. In short, while the laser head 15 moves in the direction opposite to the cutting direction D along the cutting line CL, the height of the laser head 15 is adjusted based on the detection value from the height sensor, and the laser head 15 and the member W to be cut W. The interval between and is maintained at the set interval.
[0031]
On the other hand, when it is determined in step S7 that the change amount V is larger than the threshold value T, the process proceeds to step S8, the movement of the carriage 13 and the table 11 is stopped, and the movement of the laser head 15 relative to the member W to be cut is performed. Stop. That the change amount V is larger than the threshold value T means that the detection value of the height sensor has changed abruptly, and that the laser head 15 has reached the cutting start position SP of the member W to be cut. I mean. That is, the change in height due to the warp of the member to be cut W is not abrupt, but continuously changes. Therefore, when the detection value of the height sensor changes abruptly, the laser head 15 moves the member W to be cut. It can be determined that the height sensor has detected the distance between the laser head 15 and the table 11 by reaching the end SP.
[0032]
When it is determined in step S7 that the change amount V is larger than the threshold value T, the height of the laser head 15 is maintained at a position immediately before the change amount V exceeds the threshold value T. That is, when the change amount V exceeds the threshold value T, the height adjustment of the laser head 15 is not performed. Accordingly, the laser head 15 is positioned at a height that is separated from the cutting start position SP of the member W by a set interval.
[0033]
Next, proceeding to step S9, the carriage 13 and the table 11 are moved so that the laser head 15 moves in the cutting direction D along the cutting line CL. In step S10, the laser head 15 irradiates a laser to be cut. The cutting of the member W is started. At the start of cutting, the laser head 15 is naturally adjusted to a height suitable for the cutting start position SP of the member W to be cut. After the start of cutting, the laser head 15 is appropriately moved up and down based on the detection value from the height sensor, and the interval between the laser head 15 and the member W to be cut is maintained at the set interval.
[0034]
Thus, according to the laser cutting device and the laser cutting method of the present embodiment, the detection of the cutting start position SP at the end of the member to be cut W, and the laser head 15 and the member to be cut W at the cutting start position SP are performed. The interval adjustment can be performed automatically and quickly. Therefore, good cutting can be performed at low cost.
[0035]
Next, another embodiment of the present invention will be described.
[0036]
This form is suitable when the width L1 of the member W to be cut is slightly larger than the width L2 as a product, as shown in FIG. In this case, since the cutting with high accuracy is not required until the laser head 15 moves from the cutting start position SP by the distance L3, the height adjustment of the laser head 15 based on the detection value of the height sensor is executed during that time. This is what I did not.
[0037]
The cutting method of this embodiment is demonstrated using the flowchart of FIG.
[0038]
Steps S101 to S104 are the same as steps S1 to S4 in FIG.
[0039]
If it is determined in step S104 that the interval between the laser head 15 and the member W to be cut at the measurement point MP is equal to the set interval, the process proceeds to step S105 and the height sensor is disabled (OFF). In this embodiment, the measurement point MP is set at a position on the inner side by the distance L3 from the cutting start position SP of the member W to be cut. The height of the laser head 15 is adjusted at the measurement point MP, and the height sensor is invalidated at that position.
[0040]
In step S106, the carriage 13 and the table 11 are moved so that the laser head 15 moves in the direction opposite to the cutting direction D along the cutting line CL, and the member to be cut is the same as in the embodiment of FIG. The cutting start position SP at the end of W is detected. In step S107, the carriage 13 and the table 11 are moved so that the laser head 15 moves in the cutting direction D along the cutting line CL, and the laser W is irradiated with the laser to cut the member W to be cut. To start. At this time, the height sensor remains invalid and the height adjustment of the laser head 15 is not executed.
[0041]
When the laser head 15 moves along the cutting line CL by the distance L3 and reaches the point MP, the process proceeds to step S108, and the height sensor is enabled (ON). Next, it progresses to step S109 and the cutting | disconnection along the cutting line CL is continued. At this time, since the height sensor is effective, the height adjustment of the laser head 15 is executed based on the detection value of the height sensor while cutting after the point MP. On the cutting end side of the cutting line CL, when the point MP ′ that is inward by the distance L3 from the cutting end position EP is reached, the height sensor is invalidated again and thereafter (that is, from the point MP ′ to the point EP). The height adjustment of the laser head 15 may not be executed during the interval).
[0042]
According to this embodiment, since the distance between the laser head 15 and the member to be cut W is not adjusted in a portion that does not require high-precision cutting, the working time can be shortened.
[0043]
It should be noted that both the program for executing the control shown in FIG. 1 and the program for executing the control shown in FIG. 4 are input to the control device 16 and executed in accordance with the state of the member W to be cut. May be selected.
[0044]
The present invention is not limited to the laser cutting apparatus as shown in FIG. 5, and can be applied to various types of laser cutting apparatuses. For example, a type in which the table 11 can move in the X axis and the Y axis and a type in which the laser head 15 can move in the X, Y, and Z axis directions are naturally applicable.
[0045]
The height sensor is not limited to a capacitance sensor, and any type can be applied as long as the distance between the laser head 15 and the member to be cut W can be detected.
[0046]
Furthermore, in the above embodiment, the measurement point MP for adjusting the distance between the laser head 15 and the member to be cut W is first set on the cutting line CL, but this is not always necessary. That is, after adjusting the interval at an arbitrary point on the member to be cut W, the laser head 15 may be positioned on the cutting line CL and then moved along the cutting line CL.
[0047]
【The invention's effect】
In short, according to the present invention, the excellent effect that the detection of the cutting start position at the end of the member to be cut and the adjustment of the distance between the laser head and the member to be cut at the cutting start position can be executed automatically and quickly. It is something that demonstrates.
[Brief description of the drawings]
FIG. 1 is a flowchart showing a cutting method according to an embodiment of the present invention.
FIG. 2 is a view for explaining the cutting method of the embodiment of FIG. 1, showing a member to be cut and its cutting line.
FIG. 3 is a view for explaining a cutting method according to another embodiment of the present invention, and shows a member to be cut and its cutting line.
FIG. 4 is a flowchart showing a cutting method according to another embodiment of the present invention.
FIG. 5 is a perspective view of a laser cutting device.
FIG. 6 is a diagram for explaining a case where cutting is started from an end of the member to be cut, and shows the member to be cut and its cutting line.
FIG. 7 is a diagram for explaining a conventional cutting method, and is an enlarged view in the vicinity of a cutting start position.
[Explanation of symbols]
10 Laser Cutting Device 11 Table 13 Carriage 15 Laser Head 16 Control Device SP Cutting Start Position W Member to be Cut

Claims (4)

被切断部材にレーザを照射するレーザヘッドと、該レーザヘッドと上記被切断部材との間隔を検出する検出手段と、上記レーザヘッドと上記被切断部材とを相対的に移動させると共に、上記検出手段の検出値に基づいて上記レーザヘッドと上記被切断部材との間隔を所定値に調節する制御装置とを備えたレーザ切断装置であって、
上記制御装置は、上記被切断部材の端部から切断を開始する場合、まず、上記被切断部材上の任意の位置で上記レーザヘッドと上記被切断部材との間隔を所定値に調節し、次に、レーザを照射しない状態で、かつ上記レーザヘッドと上記被切断部材との間隔を上記所定値に維持した状態で、上記レーザヘッドを所定の切断ラインに沿って予め定められた切断方向と逆方向に移動させ、上記検出手段の検出値が急激に変化したときに上記レーザヘッドが上記被切断部材の端部の切断開始位置に到達したことを判断し、上記レーザヘッドと上記被切断部材との間隔を上記検出手段の検出値が急激に変化する直前の間隔として上記切断開始位置から切断を開始することを特徴とするレーザ切断装置。
A laser head for irradiating a member to be cut with laser; a detecting means for detecting a distance between the laser head and the member to be cut; and a means for moving the laser head and the member to be cut relative to each other, and the detecting means. A laser cutting device comprising a control device for adjusting a distance between the laser head and the member to be cut to a predetermined value based on a detected value of
When starting the cutting from the end of the member to be cut, the control device first adjusts the interval between the laser head and the member to be cut to a predetermined value at an arbitrary position on the member to be cut. In addition, the laser head is opposite to a predetermined cutting direction along a predetermined cutting line in a state where the laser is not irradiated and the distance between the laser head and the member to be cut is maintained at the predetermined value. When the detected value of the detection means changes suddenly, it is determined that the laser head has reached the cutting start position at the end of the member to be cut, and the laser head, the member to be cut, The laser cutting device is characterized in that the cutting is started from the cutting start position with the interval immediately before the detection value of the detecting means changes abruptly.
上記制御装置は、上記レーザヘッドが上記切断開始位置から所定距離切断するまでの間、上記検出手段の検出値に基づく上記レーザヘッドと上記被切断部材との間隔調節を実行しない請求項1記載のレーザ切断装置。2. The control device according to claim 1, wherein the controller does not adjust the distance between the laser head and the member to be cut based on a detection value of the detection unit until the laser head cuts a predetermined distance from the cutting start position. Laser cutting device. 被切断部材とレーザヘッドとの間隔を検出する検出手段の検出値に基づいて上記レーザヘッドと上記被切断部材との間隔を所定値に調節しつつ、レーザヘッドと被切断部材とを相対的に移動させて切断するレーザ切断方法であって、
上記被切断部材上の任意の位置で上記レーザヘッドと上記被切断部材との間隔を上記所定値に調節するステップと、
レーザを照射しない状態で、かつ上記レーザヘッドと上記被切断部材との間隔を上記所定値に維持した状態で、上記レーザヘッドを所定の切断ラインに沿って予め定められた切断方向と逆方向に移動させるステップと、
上記検出手段の検出値が急激に変化したときに上記レーザヘッドが上記被切断部材の端部の切断開始位置に到達したことを判断するステップと、
上記レーザヘッドと上記被切断部材との間隔を上記検出手段の検出値が急激に変化する直前の間隔として上記切断開始位置から切断を開始するステップとを備えたことを特徴とするレーザ切断方法。
Based on the detection value of the detecting means for detecting the distance between the member to be cut and the laser head, the distance between the laser head and the member to be cut is adjusted to a predetermined value, and the laser head and the member to be cut are relatively moved. A laser cutting method of moving and cutting,
Adjusting the interval between the laser head and the member to be cut to the predetermined value at an arbitrary position on the member to be cut;
In a state in which the laser head is not irradiated and the distance between the laser head and the member to be cut is maintained at the predetermined value, the laser head is moved in a direction opposite to a predetermined cutting direction along a predetermined cutting line. A moving step;
Determining that the laser head has reached the cutting start position at the end of the member to be cut when the detection value of the detection means changes abruptly;
And a step of starting cutting from the cutting start position with the interval between the laser head and the member to be cut as the interval immediately before the detection value of the detecting means changes abruptly.
上記切断開始位置から所定距離切断するまでの間、上記レーザヘッドと上記被切断部材との間隔調節を実行しないステップを更に含む請求項3記載のレーザ切断方法。The laser cutting method according to claim 3, further comprising a step of not performing an adjustment of a distance between the laser head and the member to be cut until the predetermined distance is cut from the cutting start position.
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Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2971724A1 (en) * 2011-02-18 2012-08-24 Air Liquide Welding France Laser beam cutting of metallic material e.g. plate, comprises positioning outlet orifice of nozzle of cutting head to top of material using scanning head, and moving the head according to movement with respect to material
JP2016124011A (en) * 2015-01-05 2016-07-11 Jfeスチール株式会社 Cutting method and cutting device of steel sheet
CN110560932A (en) * 2019-09-30 2019-12-13 合肥工业大学 self-detection teaching laser cutting machine
CN114535791A (en) * 2022-02-28 2022-05-27 大族激光科技产业集团股份有限公司 Plate laser cutting method, laser processing equipment and storage medium
CN117564511A (en) * 2023-10-10 2024-02-20 安徽大学绿色产业创新研究院 Glass plate positioning equipment for laser cutting processing

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2971724A1 (en) * 2011-02-18 2012-08-24 Air Liquide Welding France Laser beam cutting of metallic material e.g. plate, comprises positioning outlet orifice of nozzle of cutting head to top of material using scanning head, and moving the head according to movement with respect to material
JP2016124011A (en) * 2015-01-05 2016-07-11 Jfeスチール株式会社 Cutting method and cutting device of steel sheet
CN110560932A (en) * 2019-09-30 2019-12-13 合肥工业大学 self-detection teaching laser cutting machine
CN114535791A (en) * 2022-02-28 2022-05-27 大族激光科技产业集团股份有限公司 Plate laser cutting method, laser processing equipment and storage medium
CN117564511A (en) * 2023-10-10 2024-02-20 安徽大学绿色产业创新研究院 Glass plate positioning equipment for laser cutting processing

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