JP4164726B2 - Method for manufacturing circuit case combined with liquid-cooled circuit board - Google Patents

Method for manufacturing circuit case combined with liquid-cooled circuit board Download PDF

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Publication number
JP4164726B2
JP4164726B2 JP2000355622A JP2000355622A JP4164726B2 JP 4164726 B2 JP4164726 B2 JP 4164726B2 JP 2000355622 A JP2000355622 A JP 2000355622A JP 2000355622 A JP2000355622 A JP 2000355622A JP 4164726 B2 JP4164726 B2 JP 4164726B2
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Prior art keywords
plate
liquid
manufacturing
circuit board
side frame
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JP2002158477A (en
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渉 舟津
靖之 大河内
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Denso Corp
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Denso Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Description

【０００１】
【発明の属する技術分野】
本発明は、液冷式回路基板兼用回路ケースの製造方法に関し、特に電力用半導体装置が搭載される積層冷却板を有する液冷式回路基板兼用回路ケースの製造方法に関する。
【０００２】
【従来の技術】
車両走行モータなどを制御する電力用インバータ装置は発熱が大きいため、従来は水冷基板に実装した半導体モジュールを用いている。
【０００３】
このため、回路収容用のケース（回路ケースともいう）に開口を貫孔して内部の水冷基板に冷却水を供給する配管を挿通している。
【０００４】
【発明が解決しようとする課題】
しかしながら、上記した従来の車載回路装置では、回路ケース内に大重量の水冷基板およびそれに連結される冷却液配管を収容するので、それらを支承する回路ケースが堅牢なものである必要があり、装置全体の大型、大重量化を招いていた。また、回路ケースの開口に冷却液配管を挿通させ、その後、回路ケースの開口の隙間を確実に封止する作業が必要であり、作業工程が複雑であった。
【０００５】
この問題を解決するために、ケ−ス自体に回路装置を実装し、ケースのうち、回路装置（特にその半導体装置部分）が接する部分（特に底板部）に、冷却液流路を設け、ケ−ス自体に冷却液を循環させれば、液冷型回路装置を小型軽量化することができるはずであるが、箱形形状のケースに冷却液流路を液密に設けることは、容易ではなかった。これは、その上に回路部が実装されるケ−スの底板部が、複雑な冷却液流路をもつ他に、回路部に外部衝撃などにより曲げ応力が掛からないように十分な剛性をもつ必要と、回路部の一時的な大発熱を良好に吸収するヒートシンクとしての機能をもつ必要とがあるため、単純な板金加工などでは製造できず、といって厚板ブロックに冷却液流路を穿設加工するのも容易ではないためである。
【０００６】
本発明は上記問題点に鑑みなされたものであり、優れた剛性及びヒートシンク機能を有する液冷式回路基板兼用回路ケースを簡素な製造方法で製造する方法を提供することをその目的としている。
【０００７】
【課題を解決するための手段】
請求項１記載の液冷式回路基板兼用回路ケースの製造方法は、冷却液流路をなす溝部を有する複数の溝付き金属板を積層してなる流路内蔵板部と、前記流路内蔵板部の両主面に接合されて前記溝部を遮蔽する金属板製の外側遮蔽板部とを有する回路実装用の積層冷却板を作製し、
両端開口で角枠形状を有する側枠部の一方の開口端縁を前記外側遮蔽板部の周縁部に接合し、前記積層冷却板に回路部品を固定し、前記側枠部の他方の開口端縁に蓋板を取り付けて前記回路部品を密閉することを特徴としている。
【０００８】
すなわち、本発明は、側枠部を周縁部に接合した積層冷却板により、回路部品を収容する回路ケ−スの主部を構成た点にその特徴を有する。
【０００９】
このようにすれば、回路ケースの底板部をなす積層冷却板に実装された回路部品は積層冷却板を流れる冷却液により良好に間接冷却することができる。
【００１０】
また、積層冷却板自体が回路ケースの底板部を兼ねるので、大重量の液冷基板およびそれに連結される冷却液配管を収容するための堅牢な回路ケースを実質的に省略することができ、装置全体の体格重量を大幅に削減することができる。
【００１１】
また、回路ケースの開口に冷却液配管を挿通させ、その後、回路ケースの開口の隙間を確実に封止する作業が不要となる。
【００１２】
更に、積層冷却板は、必要部分が打ち抜かれた金属薄板を多数積層して形成するので、製造工程が簡単であるにもかかわらず、優れた剛性及びヒートシンク性能を実現することができる。
【００１３】
請求項２記載の構成は請求項１記載の液冷式回路基板兼用回路ケースの製造方法において更に、前記外側遮蔽板部の外表面に接して全周にわたって曲設されたリブを、前記側枠部の積層冷却板側の開口端縁に設け、前記外側遮蔽板部、溝付き金属板、外側遮蔽板部、側枠部をこの順に重ねて同時にろう付けして、それらを一体接合することを特徴としている。
【００１４】
本構成によれば、側枠部及び積層冷却板を一工程で製造することができるので、製造工程を簡素化することができる。
【００１５】
請求項３記載の構成は請求項１記載の液冷式回路基板兼用回路ケースの製造方法において更に、前記積層冷却板の側面に、前記溝付き金属板および側枠部の各周縁を不一致に形成して前記積層冷却板の側面に凹凸部を設け、固化して前記側枠部をなす液状材料を前記凹凸部に接して成形することを特徴としている
本構成によれば、樹脂成形（またはダイキャスト成形）により側枠部を製造するに際して、側枠部と積層冷却板との接合強度を向上でき、気密性も良好に確保することができる。
【００１６】
請求項４記載の構成は請求項１記載の液冷式回路基板兼用回路ケースの製造方法において更に、前記外側遮蔽板部を絞り加工することにより、前記外側遮蔽板部の周縁部を前記積層冷却板から立設させて前記側枠部となすことを特徴としている。
【００１７】
本構成によれば、積層冷却板の外側遮蔽板部の周縁部が側枠部を兼ねるので、部品点数、材料費及び製造工数を削減することができる。
【００１８】
請求項５記載の構成は請求項４記載の液冷回路ケースの製造方法において更に、前記絞り加工により形成される前記外側遮蔽板部の曲部を、前記溝付き金属板の側端より外側に配置することを特徴としている。
【００１９】
本構成によれば、外側遮蔽板部の周縁部を絞り加工する際に外側遮蔽板部の周縁部に生じる歪みによりろう付け不良が生じるのを防止することができるので、液漏れ不良を防止することができる。
【００２０】
【発明の実施の形態】
本発明の液冷式回路基板兼用回路ケースの製造方法の好適な態様を以下の実施例を参照して説明する。
【００２１】
【実施例１】
本発明の回路装置の一実施例を図１を参照して説明する。
【００２２】
１はアルミ製の積層冷却板、２はアルミ製の側枠部、３は半導体モジュール、４は冷却液出入管、５は蓋板である。
【００２３】
積層冷却板１は、多数のアルミ薄板を積層し、側枠部２とともにろう付けしてなる。積層冷却板１の最も外側の二枚おアルミ薄板１１、１２は、平板形状の外側遮蔽板部を構成し、最も外側の二枚以外のアルミ薄板（溝付き金属板）１３は、打ち抜きにより内部に冷却液流路をなす溝部が形成された溝付き板からなる。冷却液流路は、種々の形状に形成されることができるが、少なくともその両端は積層された溝付き板の側面に開口しており、この開口には、冷却液出入管４がそれぞれろう付けされ、冷却液出入管４は図示しない外部の放熱器に冷却液循環用のポンプを通じて連結されている。
【００２４】
側枠部２は、穴あきアルミ薄板を略角枠形に絞り加工して形成されており、両開口の端縁にはリブ２１、２２が積層冷却板１と平行に設けられている。
【００２５】
半導体モジュール３は、アルミ薄板１１の外表面に熱伝導性に優れた接着材により接着されている。
【００２６】
蓋板５は、側枠部２の上端側の開口端縁のリブに締結されて内部に収容された半導体モジュール３を密閉封止している。
【００２７】
この回路装置では、積層冷却板１形成用の多数のアルミ薄板、冷却液出入管４及び側枠部２の必要箇所にろう材を塗布した後、それらを一緒に積層し、図示しない治具で保持して送風加熱路にてろう材を溶融し、冷却して一括にろう付けを完了するので、底板部に冷却液流路をもつ液冷式回路ケースを簡単な製造工程で作製することができる。
【００２８】
なお、外側遮蔽板部をなすアルミ薄板１１の外表面にスタッドボルトをろう付けし、このスタッドボルトにより半導体モジュール３をアルミ薄板１１に締結してもよい。
【００２９】
【実施例２】
本発明の回路装置の他実施例を図２を参照して説明する。
【００３０】
この実施例は、実施例１において、側枠部２０を樹脂成形品とし、更に、積層冷却板１の側端面に凹凸部を設けた点が実施例１と異なっている。
【００３１】
更に詳しく説明すると、積層冷却板１を構成する各アルミ薄板は厚さ方向へ一枚ごとに異なる端縁位置もち、これにより上記凹凸部が形成されている。
【００３２】
上記したろう付けにより完成された積層冷却板１は樹脂成形金型にセットされ、金型のキャビティに樹脂を注入し、側枠部２０をインサート成形する。側枠部２０は積層冷却板１の上記凹凸部を覆う形状を有し、これにより、側枠部２０はその全周にわたって強固に積層冷却板１に接合される。
【００３３】
なお、たとえば積層冷却板１を銅とし、側枠部をアルミダイキャスト成形しても同様の効果を得ることができる。
【００３４】
【実施例３】
本発明の回路装置の他実施例を図３を参照して説明する。
【００３５】
この実施例は、実施例１において、積層冷却板１の外側遮蔽板部をなすアルミ薄板１１０を他のアルミ薄板よりも大形とし、その周縁部を絞り加工することにより、外側遮蔽板部と一体の側枠部を形成する点が、実施例１と異なっている。
【００３６】
また、この実施例では、積層冷却板１のアルミ薄板１１０に接合されるアルミ薄板はアルミ薄板１１０の平坦部にろう付けされ、アルミ薄板１１０の絞り加工による曲がり部にはろう付けされないので、絞り加工によるアルミ薄板１１０の歪みによるろう付け不良が生じにくい利点をもつ。
更に、上記各実施例では、積層冷却板の片面のみに側枠部、回路部品を設けているが、両面に設けてもよいことは勿論である。
【図面の簡単な説明】
【図１】実施例１の製造方法により製造した装置の断面図である。
【図２】実施例２の製造方法により製造した装置の断面図である。
【図３】実施例３の製造方法により製造した装置の断面図である。
【符号の説明】
１ 積層冷却板
１１、１２ アルミ薄板（外側遮蔽板部）
１３ アルミ薄板（溝付き金属板）
２ 側枠部
３ 半導体モジュール（回路部品）
４ 冷却液出入管
５ 蓋板[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a liquid-cooled circuit board and circuit case, and more particularly, to a method for manufacturing a liquid-cooled circuit board and circuit case having a laminated cooling plate on which a power semiconductor device is mounted.
[0002]
[Prior art]
Since a power inverter device for controlling a vehicle running motor generates a large amount of heat, a semiconductor module mounted on a water-cooled substrate is conventionally used.
[0003]
For this reason, a pipe for supplying cooling water to the internal water-cooled substrate through the opening of the circuit housing case (also referred to as a circuit case) is inserted.
[0004]
[Problems to be solved by the invention]
However, in the above-described conventional vehicle-mounted circuit device, since the heavy water-cooled substrate and the coolant pipe connected thereto are accommodated in the circuit case, the circuit case that supports them needs to be robust, and the device The overall size and weight have been increased. Further, it is necessary to insert a coolant pipe into the opening of the circuit case and then securely seal the gap of the opening of the circuit case, and the work process is complicated.
[0005]
In order to solve this problem, a circuit device is mounted on the case itself, and a coolant flow path is provided in a portion (particularly the bottom plate portion) of the case where the circuit device (particularly the semiconductor device portion) is in contact with the case. -If the coolant is circulated in the casing itself, the liquid-cooled circuit device should be able to be reduced in size and weight. However, it is not easy to provide the coolant channel in a box-shaped case in a liquid-tight manner. There wasn't. This is because the bottom plate part of the case on which the circuit part is mounted has sufficient rigidity so that the circuit part is not subjected to bending stress due to external impact or the like in addition to having a complicated coolant flow path. It is necessary to have a function as a heat sink that absorbs temporary large heat generation of the circuit part well, so it can not be manufactured by simple sheet metal processing etc. This is because drilling is not easy.
[0006]
The present invention has been made in view of the above problems, and an object of the present invention is to provide a method for manufacturing a liquid-cooled circuit board combined circuit case having excellent rigidity and a heat sink function by a simple manufacturing method.
[0007]
[Means for Solving the Problems]
The manufacturing method of a circuit case for a liquid-cooled circuit board according to claim 1 includes: a plate with a built-in channel formed by laminating a plurality of grooved metal plates having a groove that forms a coolant channel; and the plate with a built-in channel. A laminated cooling plate for circuit mounting having an outer shielding plate part made of a metal plate that is bonded to both main surfaces of the part and shields the groove part,
One opening edge of a side frame portion having a square frame shape at both ends is joined to a peripheral edge portion of the outer shielding plate portion, a circuit component is fixed to the laminated cooling plate, and the other opening end of the side frame portion A lid plate is attached to the edge to seal the circuit component.
[0008]
That is, the present invention is characterized in that the main part of the circuit case that accommodates the circuit components is constituted by the laminated cooling plate in which the side frame part is joined to the peripheral part.
[0009]
If it does in this way, the circuit component mounted in the lamination | stacking cooling plate which makes the bottom board part of a circuit case can be indirectly cooled favorably with the cooling fluid which flows through a lamination | stacking cooling plate.
[0010]
Further, since the laminated cooling plate itself also serves as a bottom plate portion of the circuit case, a robust circuit case for housing a heavy liquid cooling substrate and a cooling liquid pipe connected thereto can be substantially omitted. The overall physique weight can be greatly reduced.
[0011]
Further, it is not necessary to insert the coolant pipe through the opening of the circuit case and then securely seal the gap of the opening of the circuit case.
[0012]
Furthermore, since the laminated cooling plate is formed by laminating a large number of thin metal plates in which necessary portions are punched, excellent rigidity and heat sink performance can be realized even though the manufacturing process is simple.
[0013]
According to a second aspect of the present invention, in the method for manufacturing a liquid-cooled circuit board combined circuit case according to the first aspect, ribs bent over the entire circumference in contact with the outer surface of the outer shielding plate portion are further provided on the side frame. Provided at the opening edge of the laminated cooling plate side of the part, the outer shielding plate part, the grooved metal plate, the outer shielding plate part, the side frame part are overlapped in this order and simultaneously brazed, and they are integrally joined. It is a feature.
[0014]
According to this structure, since a side frame part and a lamination | stacking cooling plate can be manufactured in one process, a manufacturing process can be simplified.
[0015]
According to a third aspect of the present invention, in the method for manufacturing a liquid-cooled circuit board combined circuit case according to the first aspect, the peripheral edges of the grooved metal plate and the side frame portion are formed inconsistently on the side surface of the laminated cooling plate. According to the present configuration, the concave and convex portions are provided on the side surfaces of the laminated cooling plate, and the liquid material forming the side frame portion is molded in contact with the concave and convex portions. When manufacturing the side frame by casting, the bonding strength between the side frame and the laminated cooling plate can be improved, and the airtightness can be secured well.
[0016]
According to a fourth aspect of the present invention, in the method of manufacturing a liquid-cooled circuit board combined circuit case according to the first aspect, the outer peripheral shielding plate portion is drawn to further reduce the peripheral edge portion of the outer shielding plate portion. It is characterized in that it is erected from a plate to become the side frame portion.
[0017]
According to this structure, since the peripheral part of the outer side shielding board part of a laminated cooling plate serves as a side frame part, a number of parts, a material cost, and a manufacturing man-hour can be reduced.
[0018]
According to a fifth aspect of the present invention, in the method for manufacturing a liquid-cooled circuit case according to the fourth aspect of the present invention, the curved portion of the outer shielding plate portion formed by the drawing is further outward than the side end of the grooved metal plate. It is characterized by arranging.
[0019]
According to this configuration, it is possible to prevent the occurrence of brazing failure due to distortion generated in the peripheral portion of the outer shielding plate portion when the peripheral portion of the outer shielding plate portion is drawn, thereby preventing liquid leakage failure. be able to.
[0020]
DETAILED DESCRIPTION OF THE INVENTION
A preferred embodiment of the method for producing a liquid-cooled circuit board combined circuit case of the present invention will be described with reference to the following examples.
[0021]
[Example 1]
An embodiment of the circuit device of the present invention will be described with reference to FIG.
[0022]
Reference numeral 1 denotes an aluminum laminated cooling plate, 2 denotes an aluminum side frame portion, 3 denotes a semiconductor module, 4 denotes a coolant inlet / outlet pipe, and 5 denotes a lid plate.
[0023]
The laminated cooling plate 1 is formed by laminating many aluminum thin plates and brazing together with the side frame portion 2. The outermost two aluminum thin plates 11 and 12 of the laminated cooling plate 1 constitute a flat plate-shaped outer shielding plate portion, and the aluminum thin plate (grooved metal plate) 13 other than the outermost two sheets is formed by punching. And a grooved plate in which a groove portion forming a coolant flow path is formed. The coolant flow path can be formed in various shapes, but at least both ends thereof are opened on the side surfaces of the laminated grooved plates, and the coolant inlet / outlet pipes 4 are brazed to the openings. The coolant inlet / outlet pipe 4 is connected to an external radiator (not shown) through a coolant circulation pump.
[0024]
The side frame portion 2 is formed by drawing a perforated aluminum thin plate into a substantially square frame shape, and ribs 21 and 22 are provided in parallel to the laminated cooling plate 1 at the edges of both openings.
[0025]
The semiconductor module 3 is bonded to the outer surface of the aluminum thin plate 11 with an adhesive having excellent thermal conductivity.
[0026]
The cover plate 5 is fastened and sealed to the semiconductor module 3 housed inside by being fastened to the rib on the opening edge on the upper end side of the side frame portion 2.
[0027]
In this circuit device, a brazing material is applied to a large number of aluminum thin plates for forming the laminated cooling plate 1, the coolant inlet / outlet pipe 4 and the side frame portion 2 at necessary locations, and then laminated together with a jig (not shown). Hold and melt the brazing filler metal in the blast heating path, cool and complete the brazing all at once, so it is possible to produce a liquid-cooled circuit case with a coolant flow path on the bottom plate part with a simple manufacturing process it can.
[0028]
A stud bolt may be brazed to the outer surface of the aluminum thin plate 11 forming the outer shielding plate portion, and the semiconductor module 3 may be fastened to the aluminum thin plate 11 with this stud bolt.
[0029]
[Example 2]
Another embodiment of the circuit device of the present invention will be described with reference to FIG.
[0030]
This embodiment is different from the first embodiment in that the side frame portion 20 is a resin molded product in the first embodiment, and the uneven portion is provided on the side end face of the laminated cooling plate 1.
[0031]
More specifically, each of the aluminum thin plates constituting the laminated cooling plate 1 has a different edge position for each sheet in the thickness direction, thereby forming the uneven portion.
[0032]
The laminated cooling plate 1 completed by the brazing described above is set in a resin molding die, the resin is injected into the cavity of the die, and the side frame portion 20 is insert-molded. The side frame portion 20 has a shape that covers the concavo-convex portion of the laminated cooling plate 1, whereby the side frame portion 20 is firmly joined to the laminated cooling plate 1 over the entire circumference.
[0033]
For example, the same effect can be obtained even if the laminated cooling plate 1 is made of copper and the side frame portion is formed by aluminum die casting.
[0034]
[Example 3]
Another embodiment of the circuit device of the present invention will be described with reference to FIG.
[0035]
In this embodiment, the aluminum thin plate 110 that forms the outer shielding plate portion of the laminated cooling plate 1 in the first embodiment is made larger than the other aluminum thin plates, and the peripheral edge portion thereof is drawn to obtain the outer shielding plate portion. The point which forms an integral side frame part differs from Example 1. FIG.
[0036]
Further, in this embodiment, the aluminum thin plate joined to the aluminum thin plate 110 of the laminated cooling plate 1 is brazed to the flat portion of the aluminum thin plate 110 and is not brazed to the bent portion of the aluminum thin plate 110 by drawing. There is an advantage that a brazing failure due to distortion of the aluminum thin plate 110 due to processing is less likely to occur.
Further, in each of the above embodiments, the side frame portion and the circuit component are provided on only one side of the laminated cooling plate, but it is needless to say that the side frame portion and the circuit component may be provided on both sides.
[Brief description of the drawings]
1 is a cross-sectional view of an apparatus manufactured by the manufacturing method of Example 1. FIG.
2 is a cross-sectional view of an apparatus manufactured by the manufacturing method of Example 2. FIG.
3 is a cross-sectional view of an apparatus manufactured by the manufacturing method of Example 3. FIG.
[Explanation of symbols]
1 Laminated cooling plates 11 and 12 Aluminum thin plate (outer shielding plate part)
13 Aluminum sheet (grooved metal sheet)
2 Side frame 3 Semiconductor module (circuit parts)
4 Coolant inlet / outlet pipe 5 Cover plate

Claims (5)

冷却液流路をなす溝部を有する複数の溝付き金属板を積層してなる流路内蔵板部と、前記流路内蔵板部の両主面に接合されて前記溝部を遮蔽する金属板製の外側遮蔽板部とを有する回路実装用の積層冷却板を作製し、
両端開口で角枠形状を有する側枠部の一方の開口端縁を前記外側遮蔽板部の周縁部に接合し、
前記積層冷却板に回路部品を固定し、
前記側枠部の他方の開口端縁に蓋板を取り付けて前記回路部品を密閉することを特徴とする液冷式回路基板兼用回路ケースの製造方法。A plate with a built-in channel formed by laminating a plurality of grooved metal plates having a groove forming a coolant channel, and a metal plate that is bonded to both main surfaces of the plate with a built-in channel and shields the groove. A laminated cooling plate for circuit mounting having an outer shielding plate part is manufactured,
Bonding one opening edge of the side frame part having a square frame shape at both ends opening to the peripheral part of the outer shielding plate part,
Fixing circuit components to the laminated cooling plate;
A method of manufacturing a circuit case for both a liquid-cooled circuit board, wherein a lid plate is attached to the other opening edge of the side frame portion to seal the circuit component. 請求項１記載の液冷式回路基板兼用回路ケースの製造方法において、
前記外側遮蔽板部の外表面に接して全周にわたって曲設されたリブを、前記側枠部の積層冷却板側の開口端縁に設け、
前記外側遮蔽板部、溝付き金属板、外側遮蔽板部、側枠部をこの順に重ねて同時にろう付けして、それらを一体接合することを特徴とする液冷式回路基板兼用回路ケースの製造方法。In the manufacturing method of the liquid cooling type circuit board combined circuit case of Claim 1,
Ribs bent over the entire circumference in contact with the outer surface of the outer shielding plate part are provided at the opening edge of the side frame part on the laminated cooling plate side,
Manufacturing the liquid-cooled circuit board combined circuit case, wherein the outer shielding plate portion, the grooved metal plate, the outer shielding plate portion, and the side frame portion are overlapped in this order and simultaneously brazed, and they are integrally joined. Method. 請求項１記載の液冷式回路基板兼用回路ケースの製造方法において、
前記積層冷却板の側面に、前記溝付き金属板および側枠部の各周縁を不一致に形成して前記積層冷却板の側面に凹凸部を設け、
固化して前記側枠部をなす液状材料を前記凹凸部に接して成形することを特徴とする液冷式回路基板兼用回路ケースの製造方法。In the manufacturing method of the liquid cooling type circuit board combined circuit case of Claim 1,
On the side surface of the laminated cooling plate, each peripheral edge of the grooved metal plate and the side frame portion is formed inconsistently, and an uneven portion is provided on the side surface of the laminated cooling plate
A liquid-cooled circuit board combined circuit case manufacturing method, wherein the liquid material which solidifies to form the side frame portion is formed in contact with the uneven portion. 請求項１記載の液冷式回路基板兼用回路ケースの製造方法において、
前記外側遮蔽板部を絞り加工することにより、前記外側遮蔽板部の周縁部を前記積層冷却板から立設させて前記側枠部となすことを特徴とする液冷式回路基板兼用回路ケースの製造方法。In the manufacturing method of the liquid cooling type circuit board combined circuit case of Claim 1,
A circuit case combined with a liquid-cooled circuit board, wherein the outer shielding plate portion is drawn to make a peripheral portion of the outer shielding plate portion stand up from the laminated cooling plate to form the side frame portion. Production method. 請求項４記載の液冷式回路基板兼用回路ケースの製造方法において、
前記絞り加工により形成される前記外側遮蔽板部の曲部を、前記溝付き金属板の側端より外側に配置することを特徴とする液冷式回路基板兼用回路ケースの製造方法。In the manufacturing method of the liquid cooling type circuit board combined circuit case of Claim 4,
A method for manufacturing a circuit case for a liquid-cooled circuit board, wherein a curved portion of the outer shielding plate portion formed by the drawing process is disposed outside a side end of the grooved metal plate.
JP2000355622A 2000-11-22 2000-11-22 Method for manufacturing circuit case combined with liquid-cooled circuit board Expired - Fee Related JP4164726B2 (en)

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CN110618372B (en) * 2019-09-06 2021-12-17 苏州浪潮智能科技有限公司 Immersion liquid cooling-based high-precision electrical loss testing device for PCB laminated board
CN113939171A (en) * 2021-09-22 2022-01-14 哈尔滨工业大学 Water-cooling shielding device for circuit board of photoetching machine
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JPS60126854A (en) * 1983-12-14 1985-07-06 Hitachi Ltd Cooling device for semiconductor element
JPH0676872B2 (en) * 1989-05-19 1994-09-28 日本発条株式会社 heatsink
JPH09102568A (en) * 1995-10-05 1997-04-15 Mitsubishi Electric Corp Plate type heat sink
JPH1075583A (en) * 1996-08-30 1998-03-17 Matsushita Electric Ind Co Ltd Coole or inverter
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