JPS60126854A - Cooling device for semiconductor element - Google Patents
Cooling device for semiconductor elementInfo
- Publication number
- JPS60126854A JPS60126854A JP23422283A JP23422283A JPS60126854A JP S60126854 A JPS60126854 A JP S60126854A JP 23422283 A JP23422283 A JP 23422283A JP 23422283 A JP23422283 A JP 23422283A JP S60126854 A JPS60126854 A JP S60126854A
- Authority
- JP
- Japan
- Prior art keywords
- cooling device
- cooling
- semiconductor element
- fluid
- bonded
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
- H01L23/4336—Auxiliary members in containers characterised by their shape, e.g. pistons in combination with jet impingement
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は小さな面積で高い発熱量のある半導体素子の放
熱に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to heat dissipation of a semiconductor element that has a small area and generates a large amount of heat.
配線基板上に搭載された半導体素子（たとえばＬＳ Ｉ
、ＶＬＳ Ｉ）は動作時にかなりの熱を発生し、その使
用温度が高−′まる。使用温度が高いと信頼性が低下す
るため、従来はファンを用いて空気を強制的に半導体素
子に吹きつけて熱除去することが行われているが、強制
空冷では熱除去できないくらいに半導体素子の集積度が
高まり発熱量が増加している。Semiconductor elements (for example, LSI
, VLSI) generate considerable heat during operation, increasing their operating temperature. Reliability decreases when operating temperatures are high, so conventionally a fan has been used to forcefully blow air onto semiconductor devices to remove heat. The degree of integration is increasing and the amount of heat generated is increasing.
なお関連する先行技術としてｉよ、特公昭５７−１９８
６４号がある。In addition, as related prior art, Iyo, Special Publication No. 1986-198
There is No. 64.
本発明の目的は強制空冷では熱除去が不可能なくらい集
積度が高まっている半導体素子から熱除去を効果的に行
うことを目的としている。SUMMARY OF THE INVENTION An object of the present invention is to effectively remove heat from semiconductor devices whose integration density has increased to such an extent that forced air cooling cannot remove heat.
本発明の特徴は、半導体素子ごとに冷却装置を取り付け
、その冷却装置内に多数のノズルと冷却流体の流路をも
ち、冷却流体の衝突噴流により冷却するような構造とし
、さらに多数の板の積層によりそのような構造の冷却装
置を形成することを特徴とするものである。The features of the present invention are that a cooling device is attached to each semiconductor element, that the cooling device has a large number of nozzles and channels for cooling fluid, and has a structure in which cooling is performed by colliding jets of cooling fluid. A cooling device having such a structure is formed by laminating layers.
以下、本発明の一実施例を図面に従って説明する。第１
図は本発明の冷却装置の平面図、第２図は第１図のＡ−
Ａ’断面図、第３図は第２図に示した冷却装置の分解図
である。配線基板１に半田端子２により半導体素子３（
たとえばＬ’Ｓ Ｉ 。An embodiment of the present invention will be described below with reference to the drawings. 1st
The figure is a plan view of the cooling device of the present invention, and FIG. 2 is A-A in FIG.
3 is an exploded view of the cooling device shown in FIG. 2. A semiconductor element 3 (
For example, L'SI.
ＶＬＳ Ｉ）が電気的に接続され、一方半導体素子３の
背面に本発明の冷却装置４が半田などにより接着されて
いる。冷却装置４はスリットや穴のある板１０〜１６を
積層状に張り合わせて構成されている。冷却装置４内に
は半一体の背面方向を向いた多数のノスル５及び冷却流
体流Ｍ６が設けられている。各冷却装置４は管７により
つながれている。A cooling device 4 of the present invention is bonded to the back surface of the semiconductor element 3 by soldering or the like. The cooling device 4 is constructed by laminating plates 10 to 16 having slits and holes. In the cooling device 4 there are provided a number of semi-integral rear facing nostles 5 and cooling fluid streams M6. Each cooling device 4 is connected by a pipe 7.
このような冷却袋Ｍ４に冷却流体（たとえば水、フロン
、流体金属）を流す場合、管７から冷却装置４に流入し
た冷却流体は流入部８に入り、ノズル５より噴き出され
て半導体素子３に接着している板１０に衝突し、半導体
素子３を冷却する。衝突して吸熱した流体は流路６を経
て排出部９に入り、管７を通って排出される。When a cooling fluid (for example, water, fluorocarbon, or fluid metal) is caused to flow through the cooling bag M4, the cooling fluid that has flowed into the cooling device 4 from the pipe 7 enters the inflow portion 8, is jetted out from the nozzle 5, and is sprayed onto the semiconductor element 3. The semiconductor element 3 is cooled by colliding with the plate 10 that is adhered to the semiconductor element 3. The fluid that has absorbed heat due to the collision enters the discharge section 9 through the flow path 6 and is discharged through the pipe 7.
第２図及び第３図は７枚の板で冷却装置を構成したが、
流路の断面積を大きくするなどの必要性により、枚数は
７枚に限ることはない。また、半導体素子３に接着して
いる板１０には冷却伝熱性能を促進するためフィンを設
けてもよい。また、板１０を除き板１１を半導体素子３
に接着させて、半導体素子３を直接冷却させてもよい。In Figures 2 and 3, the cooling device is constructed with seven plates.
The number of sheets is not limited to seven, depending on the need to increase the cross-sectional area of the flow path. Further, the plate 10 bonded to the semiconductor element 3 may be provided with fins to promote cooling heat transfer performance. In addition, except for the plate 10, the plate 11 is used as the semiconductor element 3.
Alternatively, the semiconductor element 3 may be cooled directly by being attached to the substrate.
本発明の他の実施例の冷却装置の分解図を第４図に示す
。冷却流体流路６、流入部８、流出部９の形状を変えた
ものである。An exploded view of a cooling device according to another embodiment of the present invention is shown in FIG. The shapes of the cooling fluid flow path 6, the inflow section 8, and the outflow section 9 are changed.
本発明の冷却装置を用いることにより、半導体素子を効
果的に冷却することができ、半導体素子の信頼性を向上
することができる。By using the cooling device of the present invention, a semiconductor element can be effectively cooled, and the reliability of the semiconductor element can be improved.
第１図は本発明の一実施例を示す平面図、第２図は第１
図のＡ−Ａ’断面図、第３図は第２図の分解斜視図、第
４図は本発明の他の実施例を示す分解図である。
■・・・配線基板、２・・・半田端子、３・・・半導体
素子、４・・・冷却装置、５・・・ノズル、６・・・流
路、７・・・管、葛 １ 図
第 ２ 図
Ｙ ３ 図
方 ４ 口Fig. 1 is a plan view showing one embodiment of the present invention, and Fig. 2 is a plan view showing an embodiment of the present invention.
3 is an exploded perspective view of FIG. 2, and FIG. 4 is an exploded view showing another embodiment of the present invention. ■... Wiring board, 2... Solder terminal, 3... Semiconductor element, 4... Cooling device, 5... Nozzle, 6... Channel, 7... Tube, kudzu 1 Figure Figure 2 Y 3 Figure 4 Mouth
Claims (1)
や穴のある板を積層状に張り合わせることにより形成し
、その冷却装置内に半一体素子の背面方向に向いた多数
のノズルと冷却流体の流路を６″″）′−２を竺徴とす
る半導体素子の冷却装置。 、 。■A cooling device that is attached to the back surface of a semiconductor element is formed by laminating plates with slits and holes, and inside the cooling device there are many nozzles facing toward the back surface of the semi-integrated device and cooling fluid. A cooling device for a semiconductor device whose main feature is a flow path of 6'''')'-2. , .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23422283A JPS60126854A (en) | 1983-12-14 | 1983-12-14 | Cooling device for semiconductor element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23422283A JPS60126854A (en) | 1983-12-14 | 1983-12-14 | Cooling device for semiconductor element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60126854A true JPS60126854A (en) | 1985-07-06 |
Family
ID=16967610
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23422283A Pending JPS60126854A (en) | 1983-12-14 | 1983-12-14 | Cooling device for semiconductor element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60126854A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0538465A1 (en) * | 1991-04-09 | 1993-04-28 | United States Department Of Energy | Thin planer package for cooling an array of edge-emitting laser diodes |
| JP2002158477A (en) * | 2000-11-22 | 2002-05-31 | Denso Corp | Method of manufacturing circuit case also serving as liquid-cooled circuit board |
| JP2007227902A (en) * | 2006-01-17 | 2007-09-06 | Delphi Technologies Inc | Micro channel heatsink |
-
1983
- 1983-12-14 JP JP23422283A patent/JPS60126854A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0538465A1 (en) * | 1991-04-09 | 1993-04-28 | United States Department Of Energy | Thin planer package for cooling an array of edge-emitting laser diodes |
| JP2002158477A (en) * | 2000-11-22 | 2002-05-31 | Denso Corp | Method of manufacturing circuit case also serving as liquid-cooled circuit board |
| JP2007227902A (en) * | 2006-01-17 | 2007-09-06 | Delphi Technologies Inc | Micro channel heatsink |
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