JP5314933B2 - Power converter - Google Patents

Description

  The present invention relates to a power conversion device.

In a conventional power conversion device, in order to improve the heat dissipation efficiency, a hole is provided in the base member, and a semiconductor element provided with a ceramic heat dissipation member is inserted into the hole. There is a structure in which a semiconductor element is cooled by flowing a coolant through a hole in a base member (see Patent Document 1).
JP 2007-159250 A

  However, the above-described conventional power conversion device has a problem that the entire device becomes large because a thick and large base member for mounting the semiconductor element is required. Further, since the heat dissipating member provided below the semiconductor element is inserted into the hole of the base member, there is a problem that a large cooling passage cannot be secured for the refrigerant and sufficient cooling performance cannot be obtained.

  Therefore, an object of the present invention is to provide a power conversion device that can secure a large cooling passage and exhibit sufficient cooling performance by downsizing.

In order to achieve the above object, the invention described in claim 1 integrally holds a plurality of semiconductor modules (for example, the power modules 40a to 40g in the embodiment), and the semiconductor module is mounted on a heat dissipation member (for example, an implementation). A power conversion device including a cooling device (for example, the cooling device CO in the embodiment) that dissipates heat using the heat sink 41 in the embodiment, and a plurality of metal base frames (for example, the base frame 50 in the embodiment) An opening (for example, the opening 51 in the embodiment) is provided, a heat radiating member is integrally attached to each semiconductor module, the semiconductor module is exposed on one surface of the base frame, and the other of the base frame is exposed. The semiconductor module is placed in each opening of the base frame with the heat radiating member exposed on the surface. Place Yuru, and an outer peripheral edge of the inner peripheral edge and the semiconductor module of the opening of the base frame module units are integrally fixed by a resin material (e.g., module unit MU in the embodiment) is formed, said module units On the other surface side of the base frame, a refrigerant channel (for example, the refrigerant channel 57 in the embodiment) is partitioned by a resin portion (for example, the resin portion 55 in the embodiment) formed of the resin material. The resin portion constitutes a part of a cooling device capable of directly contacting the refrigerant with the heat radiating member.

The invention described in claim 2 is characterized in that the refrigerant flow path is formed by the resin portion and a flow path case (for example, the water jacket 32 in the embodiment) that comes into contact with the resin portion. .
According to a third aspect of the present invention, the outer peripheral edge of the module unit is configured by a flange portion of the base frame (for example, the flange portion 53 in the embodiment), and the flow path case is connected to the flange portion from the heat radiating member side. It is characterized by being liquid-tightly joined.
According to a fourth aspect of the present invention, a unit case (for example, the unit case 31 in the embodiment) that covers the module unit from the semiconductor module side is provided, and the unit case and the flange portion are joined in a liquid-tight manner. Features.

The invention described in claim 5 is characterized in that a plate-like conductive member for power input / output (for example, the bus bar 59 in the embodiment) is embedded in the resin portion.
According to a sixth aspect of the present invention, in the cross section in a direction perpendicular to the flow direction of the refrigerant flow path, the resin portion is placed on the outside of the semiconductor module so as to sandwich one surface and the other surface of the heat radiating member. A peripheral edge is fixed to each opening of the base frame.
The invention described in claim 7 is characterized in that a labyrinth structure is formed by the resin portion and the flow path case.
According to an eighth aspect of the present invention, a plurality of protrusions (for example, the fixing boss 52 in the embodiment) protruding from the one surface side are formed on the base frame, and the semiconductor module is driven in the protrusions. A control substrate to be controlled (for example, the gate drive substrate 9 in the embodiment) is held.

According to the first aspect of the present invention, each semiconductor module is integrated with the heat radiating member and fixed to the metal base frame, so that the size can be reduced, and a large refrigerant flow path can be secured correspondingly, thereby exhibiting sufficient cooling performance. In addition, since the semiconductor modules are combined, it is possible to replace each semiconductor module, thereby improving the yield and reducing the cost. Further, since a metal base frame is used, it is advantageous in terms of strength and rigidity.
Further, since the coolant channel can be partitioned by effectively using the resin material that integrally fixes the inner periphery of the opening of the base frame and the outer periphery of the semiconductor module, the base frame and the resin portion block the coolant channel. It also serves as a part of the lid and the refrigerant flow path. Therefore, there is no need for a sealing material or other members as in the case of using a separate member, which can reduce the size and cost by reducing the number of parts. Can be achieved.
According to the second aspect of the present invention, since it is sufficient to have a simple configuration in which the flow path case is brought into contact with the resin portion, there is an advantage that it can be manufactured at low cost.
According to the third aspect of the present invention, there is an effect that the attachment strength of the flow path case can be ensured.
According to the invention described in claim 4 , there is an effect that the mounting strength of the unit case can be ensured.
According to the fifth aspect of the present invention, the heat of the plate-like conductive member can be transferred into the resin portion to reduce the temperature of the plate-like conductive member, and compared with the case where it is exposed to the outside. Since the atmospheric temperature in the unit case can be reduced, the plate-like conductive member can be reduced in size.
According to the sixth aspect of the present invention, there is an effect that the holding strength of the semiconductor module with respect to the base frame can be ensured without affecting the flow direction of the refrigerant flow path.
According to the seventh aspect of the present invention, there is an effect that liquid-tightness between the resin portion and the flow path case can be improved by a labyrinth structure.
According to the invention described in claim 8, there is no need for a dedicated fixing tool for fixing the control board, and it is possible to reduce the number of parts and to reduce the size. Further, since the control board is fixed to the metal base frame, the vibration resistance performance is improved.

Next, embodiments of the present invention will be described with reference to the drawings.
FIG. 1 shows a circuit configuration including a power control unit (PCU) 1 for a hybrid vehicle. The hybrid vehicle includes an engine (not shown), a generator (GEN) 2 driven by the mechanical output of the engine, a high-voltage battery (BAT) 3 charged by the power generation output of the generator 2, a battery And a motor (MOT) 4 that drives drive wheels (not shown) using at least one of the discharge output 3 and the power generation output of the generator 2.

The power control unit 1 drives the motor 4 via the converter 7 that functions as a booster circuit by the power supplied from the battery 3 and also uses the converter 7 that functions as a step-down circuit when the motor 4 is regeneratively operated. The first inverter (Tr / M PDU) 5 supplied to the battery 3 and the power generated by the generator 2 are supplied to the battery 3 via the converter 7 functioning as a step-down circuit, or the power generated by the generator 2 A second inverter (GEN PDU) 6 for driving the motor 4 is provided.
The converter 7, the first inverter 5, and the second inverter 6 are driven and controlled through a gate drive substrate (GDCB) 9 according to a control command from a control substrate (ECU) 8.

  The first inverter 5 is, for example, a PWM inverter using pulse width modulation (PWM) including a bridge circuit 5a formed by bridge connection using a plurality of transistor switching elements (for example, IGBT: Insulated Gate Bipolar Transistor) and a smoothing capacitor 5b. Thus, the motor 4 and the converter 7 are connected to the first inverter 5. The converter 7 includes a reactor 7a and a chopper circuit 7b composed of two transistor switching elements (for example, IGBT: Insulated Gate Bipolar Transistor), and is a voltage converter provided on the input side of the first inverter 5, A secondary smoothing capacitor 7c is connected in parallel to the downstream side of the chopper circuit 7b, and a primary smoothing capacitor 7d is connected in parallel to the upstream side of the reactor 7a.

  Between the converter 7 and the first inverter 5, a second inverter 6 having the same configuration as that of the first inverter 5 is connected to the positive terminal Pt and the negative terminal Nt. Is connected. Like the first inverter 5, the second inverter 6 is a PWM inverter by pulse width modulation (PWM) comprising a bridge circuit 6a formed by bridge connection using a plurality of transistor switching elements and a smoothing capacitor 6b. The generator 2 and the converter 7 are connected to the second inverter 6. The second inverter 6 steps down the output voltage of the generator 2 by the converter 7 to charge the battery 3 or drives the motor 4 via the first inverter 5.

  The first inverter 5 and the second inverter 6 include a high-side, low-side U-phase transistor UH, UL and a high-side, low-side V-phase transistor VH, VL, and a high-side, low-side W-phase transistor that are paired for each phase. Bridge circuits 5a and 6a formed by bridge-connecting WH and WL, and smoothing capacitors 5b and 6b are provided. Each transistor UH, VH, WH is connected to the positive terminal Pt of the converter 7 to constitute a high side arm, and each transistor UL, VL, WL is connected to the negative terminal Nt of the converter 7 to constitute a low side arm. The transistors UH, UL and VH, VL and WH, WL that make a pair for each phase are connected in series to the converter 7. Diodes DUH, DUL, DVH, DVL, DWH, and DWL are connected between the collectors and emitters of the transistors UH, UL, VH, VL, WH, and WL, respectively, in a forward direction from the emitter to the collector. ing.

The reactor 7a of the converter 7 has one end connected to the battery 3 and is applied with a battery voltage, and the chopper circuit 7b is a first and second switching element connected to the other end of the reactor 7a. It is composed of one transistor S1 and a second transistor S2. Diodes DS1 and DS2 are connected between the collectors and emitters of the transistors S1 and S2, respectively, so as to be in the forward direction from the emitter to the collector.
One end of the reactor 7a is connected to the positive terminal of the battery 3, and the other end of the reactor 7a is connected to the collector of the first transistor S1 and the emitter of the second transistor S2. The emitter of the first transistor S1 is connected to the negative terminal of the battery 3 and the negative terminal Nt of the converter 7. Further, the collector of the second transistor S2 is connected to the positive terminal Pt of the converter 7.

  Here, a bus between the transistor S2 of the converter 7 and the transistor WH of the first inverter 5 and a bus between the positive terminal Pt of the first inverter 5 (converter 7) connected thereto and the transistor WH of the second inverter 6 are provided. The Pout bus bar 20 is configured. The bus between the transistor S1 of the converter 7 and the transistor WL of the first inverter 5 and the bus between the negative terminal Nt of the first inverter 5 (converter 7) connected thereto and the transistor WL of the second inverter 6 are N. It is configured as a bus bar 21.

Three buses connected from the first inverter 5 to the U-phase, V-phase, and W-phase coils of the motor 4 constitute an Out bus TrU22, an Out bus TrV23, and an Out bus TrW24. The three buses connected to the U-phase, V-phase, and W-phase coils of the generator 2 constitute an Out bus GENU 25, an Out bus GENV 26, and an Out bus GENW 27, and the reactor 7a to the first transistor S1 of the converter 7 A bus connected to the second transistor S2 constitutes a PIN bus bar 28.
A current sensor 30 that sends a signal to the control board 8 is connected to each of the Out bus TrU22, Out bus TrV23, Out bus TrW24, Out bus GENU25, Out bus GENV26, and Out bus GENW27. A signal line from the gate drive substrate 9 is connected to the gates of the transistors of the first inverter 5, the second inverter 6, and the converter 7.

  2 to 10 show the hardware configuration of the power control unit 1. The power control unit 1 is mounted, for example, in an engine room of a hybrid vehicle. As shown in FIG. 2, a unit case 31 made of aluminum die cast is provided at the upper part, and a water jacket 32 is provided at the lower part. Is provided. The opening of the unit case 31 and the peripheral edge of the water jacket 32 are put together by sandwiching a base frame 50 described later, and both are fixed by bolts B. The water jacket 32 is provided with a refrigerant inlet 33 (see FIG. 5), and a refrigerant outlet 34 is provided in front of the water jacket 32. The inflow port 33 and the outflow port 34 are connected to devices such as a pump of the cooling device CO.

  FIG. 3 is an overall configuration diagram in which the unit case 31 and the water jacket 32 are shown by chain lines. As shown in the figure, in a unit case 31, a reactor 7a, a water jacket 32, a base frame 50 to which seven power modules 40a to 40g (see FIG. 6) are fixed, and a plurality of bus bars 20 to 28 (see FIG. 1), a bus bar plate component 29, a shield plate 11, a gate drive substrate 9, a control substrate 8, and a capacitor unit 12 are arranged.

As shown in FIG. 4, the reactor 7a is installed on the board | substrate 35, The aluminum water jacket 32 is arrange | positioned above this reactor 7a.
As shown in FIG. 5, a concave portion 36 is formed in the corner portion of the upper surface of the water jacket 32, and a terminal for the PIN bus bar 28 extending from the reactor 7a and a terminal for the N bus bar 21 are drawn into the concave portion 36. . On the upper surface of the water jacket 32, a meandering concave groove 37 is formed in the remaining portion of the concave portion 36. The concave groove 37 first forms a path that bends to the front of the concave portion 36 after being bent into a U-shape. An inflow port 33 is formed at the bottom of the start end of the path, and the end of the path communicates with the outflow port 34 of the case. The meandering concave groove 37 of the water jacket 32 receives the heat sink 41 corresponding to each heat sink 41 (see FIG. 7) of the power modules 40a to 40g (see FIG. 6) mounted on the base frame 50. ing.

6 is a perspective view of the power modules 40a to 40g mounted on the base frame 50, and FIG. 7 is a perspective view of the base frame 50 as viewed from below.
As shown in FIGS. 6 and 7, an aluminum die-cast base frame 50 is disposed above the water jacket 32. The base frame 50 is formed with seven openings 51, and seven power modules 40a to 40g are fixed to the opening 51 with resin to constitute a module unit MU. Here, a resin portion 55 is formed of a resin that fixes the power modules 40 a to 40 g to the base frame 50, the resin portion 55 forms a vertical wall 56, and a coolant channel 57 is formed between the water jacket 32. ing.

  Each of the power modules 40a to 40g is of the heat sink 41 integrated type. In the power inverter 40a and the second inverter 6 in which the first transistor S1 and the second transistor S2 of the converter 7 in the circuit configuration described above are mounted, Three power modules 40b, 40c, and 40d of transistors UH and UL, transistors VH and VL, and transistors WH and WL that are paired on the high side and the low side, and the first inverter 5, Three power modules 40e, 40f, and 40g of transistors UH and UL, transistors VH and VL, and transistors WH and WL that are paired on the low side are mounted in order from the near side to the far side in FIG. As shown in FIG. 7, the fins 42 of the heat sink 41 have heat radiating surfaces arranged in a direction along the refrigerant flow path 57 through which the refrigerant flows.

  As shown in FIG. 8, at the upper part of the base frame 50, each of the plate-like Pout bus bar 20, N bus bar 21, three out buses Tr (U, V, W) 22, 23, 24 and three out buses. A bus bar plate component 29 in which buses GEN (U, V, W) 25, 26, 27 and a PIN bus bar 28 are integrated with a resin mold is disposed. As shown in FIG. 9, the shield plate 11 is disposed on the bus bar plate component 29 so as to cover it.

As shown in FIG. 10, the gate drive substrate 9 is fixed to a fixing boss 52 protruding from the base frame 50 above the shield plate 11, and the control substrate 8 is disposed above the gate drive substrate 9. . Here, the control board 8 is fixed to the unit case 31 (see FIG. 3) side.
As shown in FIG. 3, the capacitor unit 12 mounted inside the unit case 31 is disposed on the control board 8. This capacitor unit 12 is formed by unitizing the smoothing capacitor 5b of the first inverter 5, the smoothing capacitor 6b of the second inverter 6, the primary smoothing capacitor 7d and the secondary smoothing capacitor 7c of the converter 7 shown in FIG. It is fixed inside the unit case 31 by the potting used.

  Here, FIG. 11 shows a power module integrated with a heat sink, here, a power module 40 f of the first inverter 5. FIG. 12 is a cross-sectional view taken along the line AA in the arrangement portion of one transistor VL in FIG.

  11 and 12, the power module 40f includes a heat sink 41 having a plurality of plate-like fins 42 arranged in one direction at the bottom, and an insulating material 44 made of epoxy resin is applied on a base 43 of the heat sink 41, A bus bar 45 is placed. For example, a transistor VL is mounted on the upper portion of the bus bar 45 serving as a base via a solder 46, and an upper bus bar 48 is stacked on the transistor VL via a solder 47. The upper bus bar 48 has an L-shaped connection piece 49 formed at the end (see FIG. 19). The base bus bar 45, the transistor VL, and the upper bus bar 48 are cast with epoxy resin in the mold with the connection piece 49 of the upper bus bar 48 exposed to form a mold part M, and the base frame 50 openings 51 are mounted. The bus bar 48 indicates the emitter side of the transistor VL, and the connection piece 49 is connected to the N bus bar 21.

  As shown in FIG. 13, the base frame 50 has a flange portion 53 on the outer periphery, and corresponds to the seven rectangular openings 51 for mounting seven power modules inside and the concave portion 36 of the water jacket 32. An escape hole 54 is formed at a position where the clearance occurs. Each opening 51 is formed larger than the base 43 of the heat sink 41 corresponding to the seven power modules 40 a to 40 g.

  Then, as shown in FIG. 14, the power modules 40 a to 40 g are disposed in the openings 51 with the mold part M exposed on the upper surface of the base frame 50 and the heat sink 41 exposed on the back surface of the base frame 50. . Here, as described above, the power module 40a for one converter 7 is provided in the opening 51 on the near side in FIG. 13, and the power modules 40b to 40d for three second inverters 6 are provided on the rear side. Further, three power modules 40f to 40g for the first inverter 5 are arranged on the far side.

Next, as shown in FIGS. 15 and 16, a gap C (see FIGS. 12 and 14) between the inner periphery of the opening 51 of the base frame 50 and the outer periphery of each power module 40 a to 40 g is filled. Then, the resin material is supplied from the inside of the mold, and the power modules 40a to 40g are integrally molded and fixed to the base frame 50 with the resin material to form the module unit MU described above.
Here, as shown in FIG. 16, the resin material that integrally fixes the inner periphery of the opening 51 of the base frame 50 and the outer periphery of each of the power modules 40a to 40g is formed on the back surface of the base frame 50 of the module unit MU. A coolant channel 57 is defined by the vertical wall 56 of the resin portion 55 formed of a resin material together with the concave groove 37 of the water jacket 32, and cooling that allows the coolant to directly contact the fins 42 of the heat sink 41 by the resin portion 55. It constitutes a part of the device CO.

  FIG. 17 is a cross-sectional view of the power module 40c and the power module 40f. As shown in the figure, in the cross section in the direction perpendicular to the refrigerant flow direction, the refrigerant flow path 57 constituting a part of the cooling device CO has a vertical wall 56 of the resin portion 55 and a vertical wall 56 of the resin portion 55. It is formed toward the front and back sides of the paper surface by the concave groove 37 of the water jacket 32 that is in contact with the surface. In this case, the vertical wall 56 of the resin portion 55 sandwiches one surface and the other surface of the fin 42 of the heat sink 41 so as to sandwich the outer peripheral edge of the power modules 40 a to 40 g and the inner peripheral edge of the opening 51 of the base frame 50. Both are fixed in a U-shape to prevent them from falling out.

Here, between the adjacent power modules 40a to 40g, the resin portion 55 is integrated so as to wrap the base frame 50 next to each other. Further, the lower end portion of the vertical wall 56 of the resin portion 55 is liquid-tightly joined to the upper surface of the water jacket 32. As indicated by a chain line, a recess 38 is provided at a portion where the resin portion 55 abuts, a projection 58 is provided on the corresponding resin portion 55, and the projection 58 is inserted and fixed in the recess 38 to improve liquid tightness. It may be a labyrinth structure. In this case, the concave portion 38 and the convex portion 58 may be arranged in reverse.
As shown in FIG. 18, the upper surface of the water jacket 32 is flattened and the vertical wall 56 of the resin portion 55 is extended toward the upper surface of the water jacket 32, and the lower end thereof is liquid-tightly joined to the upper surface of the water jacket 32. May be.

  FIG. 19 is a cross-sectional view of the power module 40f and the power module 40g. As shown in the figure, in the cross section in the direction along the flow direction of the refrigerant flow path 57, the vertical wall 56 of the resin portion 55 is cut off on the back surface of the base frame 50, and in the direction of the arrow along the surface of the fin 42 of the heat sink 41. The refrigerant flowing through the pipe is not given flow resistance. Here, between the adjacent power modules 40a to 40g, the resin portion 55 is integrated with each other so as to cover the base frame 50 from the upper surface.

  Here, as shown in FIGS. 13 and 20, the upper surface of the base frame 50 surrounds a plurality of openings 51 excluding the escape holes 54 corresponding to the recesses 36 of the water jacket 32, and the center of the base frame 50. The portion is provided with a plurality of metal fixing bosses 52 having a circular cross section. The resin material also flows around the fixing boss 52 when the resin is poured into the gap C (see FIG. 12) between the pedestal 43 and the opening 51 of the heat sink 41 of the power modules 40a to 40g. As shown in FIG. 21, the gate drive substrate 9 is held and fixed with the shield plate 11 sandwiched between the tips of the fixing bosses 52 (see FIG. 9).

Then, as shown in a cross-sectional view of the power modules 40 a, 40 b, and 40 e in FIG. 22, the flange portion of the module unit MU in which the seven power modules 40 a to 40 g are fixed to the base frame 50, that is, the flange portion of the base frame 50. 53, the peripheral edge of the upper surface of the water jacket 32 is liquid-tightly bonded, and the peripheral wall of the unit case 31 is liquid-tightly bonded to the position corresponding to the bonded portion from the mold part M side of the power modules 40a to 40g. .
Accordingly, the two seal portions SE1 and SE2 are set to be aligned with the portion where the unit case 31 and the flange portion 53 of the base frame 50 and the flange portion 53 of the base frame 50 and the water jacket 32 overlap.

  Here, as shown in FIG. 23, the resin portion 55 used for fixing the space between the base 43 of the heat sink 41 of the power modules 40a to 40g and the opening 51 of the base frame 50 is used for power input / output. A bus bar 59 may be embedded. Further, instead of embedding the bus bar 59, as shown in FIG. 24, a groove 62 is provided in the resin portion 55, and the gel 63 is filled therein, and the bus bar 59 is disposed in the gel 63. May be.

  According to the above embodiment, as shown in FIGS. 5, 17, and 19, the refrigerant sent from the pump of the cooling device CO enters through the inlet 33 of the water jacket 32 and flows through the meandering refrigerant flow path 57. When it flows out from the outflow port 34, it heat-exchanges in the fin 42 of each heat sink 41 of the power modules 40a-40g, and cools the power modules 40a-40g. Thereby, the thermal load of each power module 40e-40g can be reduced.

  Here, each of the power modules 40a to 40g is integrated with the heat sink 41 and fixed to the base frame 50 made of aluminum die cast, so that the power module 40a to 40g can be downsized. It can be demonstrated. Since each of the power modules 40a to 40g is mounted and combined in the opening 51, if any of the power modules 40a to 40g has a problem, replace only the defective module. Therefore, compared to the case where all the power modules 40a to 40g are replaced, the manufacturing yield is improved and the cost can be reduced. And if you want to increase the power module, you can easily cope. Furthermore, since the base frame 50 is made of aluminum die cast, it is advantageous in that the mounting strength of the power modules 40a to 40g can be sufficiently secured.

  The resin portion 55 is formed of a resin material that integrally fixes the inner periphery of the opening 51 of the base frame 50 and the base 43 of the heat sink 41 that forms the outer periphery of the power modules 40a to 40g. Since the coolant channel 57 can be partitioned by effectively using the wall 56, the base frame 50 and the resin portion 55 also serve as a lid for closing the coolant channel 57 and a part of the coolant channel 57. Therefore, a sealing material and other members are not required as in the case of using another member, and the size can be reduced and the number of parts can be reduced to reduce the cost.

  Then, the coolant channel 57 is formed by the vertical wall 56 of the resin portion 55 and the concave groove 37 of the water jacket 32 in contact with the vertical wall 56 of the resin portion 55, and is formed on the vertical wall 56 of the resin portion 55. Since it is sufficient to have a simple configuration in which the water jacket 32 is brought into contact with the water jacket 32, there is an advantage that it can be manufactured at a low cost. In addition, when this contact part is made into the labyrinth structure by the recessed part 38 and the convex part 58, liquid-tightness can be improved further.

  As shown in FIG. 22, the water jacket 32 is liquid-tightly joined to the flange portion 53 of the base frame 50, which is the outer peripheral edge of the module unit MU, from the fin 42 side of the heat sink 41 by the seal portion SE2. Mounting strength can be secured. Furthermore, a unit case 31 that covers the module unit MU from the mold part M side of the power modules 40a to 40g is provided, and the peripheral wall of the unit case 31 and the flange part 53 are joined in a liquid-tight manner by the seal part SE1, thereby the unit case 31. The mounting strength of can be secured.

  In particular, the seal part SE <b> 2 that is in contact with the flange part 53 of the base frame 50 of the water jacket 32 and the seal part SE <b> 1 in which the peripheral wall of the unit case 31 is in contact with the flange part 53 are aligned on the front and back of the flange part 53. Therefore, the seal portions SE1 and SE2 are small, and it is easy to secure the surface pressure, and the sealing performance can be improved. In addition, since the seal part SE1 and the seal part SE2 are arranged at the matching positions, the water jacket 32 and the unit case 31 can be made smaller than when the seal parts SE1 and SE2 are shifted to each other, which contributes to downsizing of the apparatus. .

  A refrigerant flow path 57 constituting a part of the cooling device CO is formed between the vertical wall 56 of the resin portion 55 and the water jacket 32 in contact with the vertical wall 56 in a cross section perpendicular to the refrigerant flow direction. The vertical wall 56 of the resin part 55 covers both the outer peripheral edge of the power modules 40 a to 40 g and the inner peripheral edge of the opening 51 of the base frame 50 so as to sandwich the one surface and the other surface of the fin 42 of the heat sink 41. It is secured in a U-shape. Accordingly, the holding strength of the power modules 40a to 40g with respect to the base frame 50 can be ensured without affecting the flow direction of the refrigerant flow path 57.

  As shown in FIG. 23, when the bus bar 59 is embedded in the resin part 55, the heat held by the bus bar 59 can be transferred to the resin part 55 to lower the temperature of the bus bar 59 and to the outside. Since the ambient temperature in the unit case 31 can be reduced as compared with the case where it is exposed, the bus bar 59 can be downsized.

Further, as shown in FIG. 20, at the upper surface of the base frame 50, the position surrounding the plurality of openings 51 excluding the escape holes 54 corresponding to the recesses 36 of the water jacket 32, and the central portion of the base frame 50. Since a plurality of metal fixing bosses 52 having a circular cross section are provided, and the gate drive substrate 9 is held and fixed at the tip of the fixing boss 52, a dedicated fixing tool is used to fix the gate drive substrate 9. This is unnecessary, the number of parts can be reduced, and the size can be reduced.
Moreover, since the gate drive board | substrate 9 is fixed to the base frame 50 made from aluminum die-casting, vibration-resistant performance improves and it is suitable as a power converter device of a hybrid vehicle.

  In addition, this invention is not restricted to embodiment mentioned above, For example, it is not restricted to a hybrid vehicle, It can apply to the power converter device of an electric vehicle.

It is a circuit diagram containing the power converter device of embodiment of this invention. It is a perspective view of the power converter device of this invention. It is a perspective view which shows the internal structure of FIG. It is a perspective view of a reactor. It is the perspective view which mounted the water jacket on the reactor. It is the perspective view which mounted the module unit on the water jacket. It is the perspective view which removed the water jacket from FIG. 3 and was seen from the bottom. It is the perspective view which mounted the bus-bar plate component on the module unit. It is a perspective view which mounts a shield plate on a module unit. It is the perspective view which mounted the gate drive board | substrate and the control board on the shield plate. It is a perspective view of a power module. It is sectional drawing which follows the AA line of FIG. It is a perspective view of a power module and a base frame. It is a perspective view of the set state of a power module and a base frame. It is a perspective view of a module unit. It is sectional drawing equivalent to FIG. 12 of FIG. It is sectional drawing of the direction perpendicular | vertical to the flow direction of the refrigerant | coolant of a module unit. It is sectional drawing equivalent to FIG. 17 of other embodiment. It is sectional drawing of the direction along the flow direction of the refrigerant | coolant of a module unit. It is a perspective view of a fixing boss. It is the perspective view which fixed the gate drive board | substrate. It is sectional drawing which shows the sealing state of a unit case, a water jacket, and a base frame. It is sectional drawing which inserted the bus bar into the resin part. It is sectional drawing equivalent to FIG. 23 of other embodiment.

Explanation of symbols

9 Gate drive substrate (control substrate)
31 Unit case 32 Water jacket (flow path case)
40a-40g Power module (semiconductor module)
41 heat sink (heat dissipation member)
50 Base frame 51 Opening 52 Fixing boss (projection)
53 Flange part 55 Resin part 57 Refrigerant flow path 59 Bus bar CO Cooling device MU Module unit

Claims (8)

A power conversion device including a cooling device that integrally holds a plurality of semiconductor modules and radiates heat from the semiconductor modules using a heat radiating member, wherein a plurality of openings are provided in a metal base frame, and each of the semiconductors Each heat dissipating member is integrally attached to the module, the semiconductor module is exposed on one surface of the base frame, and the heat dissipating member is exposed on the other surface of the base frame. The semiconductor module is disposed on the base frame, and an inner peripheral edge of the opening of the base frame and an outer peripheral edge of the semiconductor module are integrally fixed with a resin material to form a module unit, and the other surface of the base frame of the module unit On the side, a refrigerant flow path is defined by a resin portion made of the resin material, and the resin portion Power conversion device is characterized in that constitutes a part of the direct contact capable cooling device the coolant to the heat dissipation member. The refrigerant flow path, and the resin portion, a power converter according to claim 1, characterized in that formed between the abutted the channel case to the resin portion. The power converter according to claim 2 , wherein an outer peripheral edge of the module unit is configured by a flange portion of the base frame, and the flow path case is liquid-tightly joined to the flange portion from the heat radiating member side. The power conversion device according to claim 3 , wherein a unit case that covers the module unit from the semiconductor module side is provided, and the unit case and the flange portion are joined in a liquid-tight manner. Power converter according to any one of claims 1 to 4, characterized in that the embedded plate-like conductive member for power input and output in the resin portion. In the cross section in the direction perpendicular to the flow direction of the refrigerant flow path, the outer peripheral edge of the semiconductor module is connected to each opening of the base frame so that the resin portion sandwiches one surface and the other surface of the heat dissipation member. power converter according to any one of claims 1 to 5, characterized in that fixed to. The power converter according to claim 2 , wherein a labyrinth structure is formed by the resin portion and the flow path case. Said base frame, a projection projecting from said one side forming a plurality of, claims 1 to 7, characterized in that holding the control board for controlling the drive of the semiconductor module to the protruding portion The power converter device in any one of.

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