JP2014113051A - Power conversion apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the height and the cost of a power conversion apparatus, and to increase a ratio of the maximum amount of power to be converted to the cubic volume of the power conversion apparatus.SOLUTION: A plurality of power semiconductor modules 300 are inserted from a side face into a passage forming body 12 which is formed in shape of a substantially rectangular parallelepiped, with a smoothing capacitor module 500 fixed to the underside, while a first AC bus bar 801 and further a circuit board 20 fixed to the top face of the passage forming body 12, respectively, in which way a module is fabricated. This construction helps to reduce the height of the constituent components, making it possible to improve production assemblability and reduce costs.

Description

  The present invention relates to a power conversion device used for converting DC power into AC power or converting AC power into DC power.

  An example of a power converter is disclosed in Japanese Patent Application Laid-Open No. 2008-193867.

  In Japanese Patent Application Laid-Open No. 2008-193867, the semiconductor module has a cooling metal on both sides, and the semiconductor chip for the upper arm and the semiconductor chip for the lower arm are sandwiched between the cooling metals, and the semiconductor module is placed in the water channel housing main body. The structure inserted in is disclosed.

JP 2008-193867 A

  However, it is required to efficiently cool the semiconductor module when the coolant for cooling the semiconductor module flows in the flow path.

  Accordingly, an object of the present invention is to improve the cooling performance of the semiconductor module with respect to the conventional power conversion device.

  In order to solve the above problems, a power conversion device according to the present invention includes a semiconductor module having a semiconductor element, and a flow path forming body that houses the semiconductor module and forms a flow path through which a cooling refrigerant flows. The semiconductor module includes: a first heat dissipating part that forms fins; a second heat dissipating part that is disposed opposite to the first heat dissipating part across the semiconductor element and that forms fins; and the first heat dissipating part A side wall portion connecting the second heat radiating portion, and the flow path forming body is formed in a direction parallel to the mold drawing direction and forms a tapered shape, and crosses the mold drawing direction. A first flow path wall formed on the second flow path, and a second flow path wall facing the first flow path wall with the flow path interposed therebetween, wherein the semiconductor module includes the first heat radiation portion and the first flow path wall. 2 The arrangement direction of the heat radiating part is along the drawing direction of the mold And the side wall portion is disposed so as to face the tapered surface, the first flow path wall forms a first flow path with the first heat radiating section, and the second flow path wall is A second flow path is formed between the second heat dissipating part.

  ADVANTAGE OF THE INVENTION According to this invention, the cooling performance of a power converter device can be improved.

1 is a system diagram showing a system of a hybrid vehicle. It is a circuit diagram which shows the structure of the electric circuit shown in FIG. It is a disassembled perspective view for demonstrating the structure of a power converter device. 4 is an exploded perspective view for explaining the configuration of a flow path forming body 12 and a power semiconductor module 300. FIG. It is the perspective view disassembled in the component in order to explain the whole composition of power conversion module 200. (A) is a cross-sectional perspective view for demonstrating the fastening structure of the inlet piping 13 and the outlet piping 14 vicinity. (B) is a cross-sectional perspective view for demonstrating the fastening structure of the facing side of the surface where an entrance / exit piping is attached. (A) is the perspective view which looked at the flow-path cover 420 from the side which contacts the opening surface 400 of the flow-path formation body 12. FIG. FIG. 4B is a perspective view of the flow path cover 420 as viewed from the upper surface of the flow path forming body 12. (A) is a perspective view which shows the external appearance of the power semiconductor module 300a. (B) is sectional drawing of the power semiconductor module 300a. (A) is an internal cross-sectional view of the power semiconductor module 300a from which the module case 304, the insulating sheet 333, the first sealing resin 348, and the second sealing resin 351 are removed in order to help understanding. (B) is a perspective view for demonstrating the internal structure of the power semiconductor module 300a. FIG. 10A is an exploded view for helping understanding of the structure of FIG. FIG. 4B is a circuit diagram of the power semiconductor module 300. FIG. (A) is a circuit diagram explaining the reduction effect of an inductance. (B) is explanatory drawing for demonstrating the reduction effect | action of an inductance. (A) is a perspective view of the auxiliary mold body 600. FIG. FIG. 6B is a transparent view of the auxiliary mold body 600. 4 is an exploded perspective view for explaining an internal structure of a smoothing capacitor module 500. FIG. FIG. 3 is a perspective view disassembled into components for explaining the overall configuration of the connector module 120. It is a figure from the upper surface of the state which removed the cover 8 from the electrical converter 100. FIG. It is the perspective view which showed the components attached to the side surface of the electric converter 100 shown in FIG. 4 is a cross-sectional view of a flow path forming body and a cooling medium passage of a power semiconductor module 300. (A) is sectional drawing of the conventional structure, (b) is sectional drawing of this Embodiment.

  The power conversion device described in the embodiment to which the present invention is applied and the system using the device described below solve various problems that are desired to be solved for commercialization. One of the various problems solved by these embodiments is the problem of improving productivity described in the column of problems to be solved by the above-mentioned invention, and also described in the column of effects of the above-mentioned invention. It has the effect of improving productivity.

  Moreover, not only the structure described in the column of means for solving the above-mentioned problem but also the other problems can solve the above-mentioned problem, and the above-described effects can be obtained.

  In other words, the configurations other than those described above with regard to the problems and effects of lowering the cost and lowering the cost largely lead to solving the problems and achieving the effects related to lowering the cost and lowering the cost. The problem is solved and the effect is obtained. Some typical examples are listed below. Further, other matters will be described in the description of the embodiment.

  A configuration 1 for solving a problem in which a lower profile and a lower cost are desirable will be described below. Configuration 1 is a module in which a power semiconductor module is inserted from the side of the refrigerant passage, a smoothing capacitor module is arranged on the lower surface of the refrigerant passage, an AC bus bar and a circuit board are arranged on the upper surface of the refrigerant passage. The module is assembled to the housing, and the electrical wiring, refrigerant piping, and signal wiring are assembled.

  With this configuration, the overall configuration of the power conversion device can be arranged in a more orderly manner, and the power conversion device can be downsized. Further, it is possible to obtain a low profile effect that can further reduce the size of the power converter in the lateral direction across the refrigerant flow path.

  The above effect can be obtained particularly when using a power semiconductor module incorporating a series circuit of upper and lower arms of an inverter, but when using a power semiconductor module in which one of the upper and lower arms is inserted. Even if it is, the effect can be achieved.

  However, when a power semiconductor module into which one arm is inserted is used, the inverter upper arm and lower power semiconductor modules are used separately, and the bus bar configuration for connecting these arms increases.

  Furthermore, in the above-described configuration 1, by providing a flow path forming body that forms a refrigerant flow path along the upper surface of the smoothing capacitor module, and fixing the smoothing capacitor module to the flow path forming body, The power semiconductor module and the smoothing capacitor module can be cooled together. Further, since the AC bus bar and the circuit board can be arranged close to the refrigerant passage side, cooling can be performed efficiently.

  Next, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 is a system in which a power conversion apparatus according to the present invention is applied to a so-called hybrid vehicle that travels using both an engine and a motor. The power conversion device according to the present invention can be applied not only to a hybrid vehicle but also to a so-called electric vehicle that travels only by a motor, and also as a power conversion device for driving a motor used in a general industrial machine. It can be used.

  However, as described above or below, when the power conversion device according to the present invention is applied particularly to the hybrid vehicle or the electric vehicle described above, it has excellent effects from various viewpoints in terms of downsizing or reliability. can get. The power conversion device applied to the hybrid vehicle has substantially the same configuration as the power conversion device applied to the electric vehicle, and the power conversion device applied to the hybrid vehicle will be described as a representative example.

  FIG. 1 is a diagram showing a control block of a hybrid vehicle (hereinafter referred to as “HEV”). The engine (ENG) and the motor generator (MG) generate vehicle running torque. The motor generator not only generates rotational torque, but also has a function of converting mechanical energy applied from the outside to the motor generator into electric power.

  The motor generator is, for example, a synchronous machine or an induction machine, and operates as a motor or a generator depending on the operation method as described above. When the motor generator is mounted on an automobile, it is desirable to obtain a small and high output, and a permanent magnet type synchronous motor using a magnet such as neodymium (Nd) is suitable. In addition, the permanent magnet type synchronous motor generates less heat from the rotor than the induction motor, and is excellent for automobiles from this viewpoint.

  The output torque on the output side of the engine is transmitted to the motor generator via the power distribution mechanism (TSM), and the rotational torque from the power distribution mechanism or the rotational torque generated by the motor generator is transmitted to the wheels via the transmission TM and the differential gear DEF. Communicated. On the other hand, during regenerative braking operation, rotational torque is transmitted from the wheels to the motor generator, and AC power is generated based on the supplied rotational torque. The generated AC power is converted into DC power by the power conversion device 100 as described later, and the high-voltage battery 136 is charged, and the charged power is used again as travel energy.

  Next, the power conversion apparatus 100 will be described. The inverter circuit 140 is electrically connected to the battery 136 via the DC connector unit 138, and power is exchanged between the battery 136 and the inverter circuit 140. When operating the motor generator as a motor, the inverter circuit 140 converts the DC power supplied from the battery 136 through the DC connector unit 138 into AC power and supplies the AC power to the motor generator through the AC connector unit 188.

  In the present embodiment, the vehicle can be driven only by the power of the motor generator by operating the motor generator unit as an electric unit by the electric power of the battery 136. Furthermore, in the present embodiment, the battery 136 can be charged by operating the motor generator with the power of the engine or the power from the wheels to generate power by using the motor power generation unit as the power generation unit.

  The power conversion apparatus 100 includes a smoothing capacitor module 500 for smoothing the DC power supplied to the inverter circuit 140.

  The power conversion device 100 includes a signal connector 21 for communication for receiving a command from a host control device (not shown) or transmitting data representing a state to the host control device. The control circuit 172 calculates a control amount of the motor generator based on a command from the signal connector 21, calculates whether to operate as a motor or a generator, and generates a control pulse based on the calculation result. The control pulse is supplied to the circuit 174. Based on the control pulse, the driver circuit 174 generates a drive pulse for controlling the inverter circuit 140.

  Next, the configuration of the electric circuit of the inverter circuit 140 will be described with reference to FIG. In the following, an insulated gate bipolar transistor is used as a semiconductor element, and hereinafter abbreviated as IGBT. The inverter circuit 140 includes a U-phase, a V-phase of AC power to be output from a series circuit 150 of upper and lower arms composed of an IGBT 328 and a diode 156 that operate as an upper arm, and an IGBT 330 and a diode 166 that operate as a lower arm. Corresponding to three phases consisting of W phase.

  In this embodiment, these three phases correspond to the three-phase windings of the armature winding of the motor generator. The series circuit 150 of the upper and lower arms of each of the three-phase IGBTs outputs an alternating current from an intermediate electrode 169 that is the middle point portion of the series circuit, and this alternating current passes through the alternating current terminal 159 and the alternating current connector 188 to generate a motor generator. It is connected to the bus bar holding member 802, which is an AC power line, and is transmitted.

  The collector electrode 153 of the IGBT 328 in the upper arm is connected to the capacitor terminal 506 on the positive electrode side of the smoothing capacitor module 500 through the positive electrode terminal 157, and the emitter electrode of the IGBT 330 in the lower arm is connected to the negative electrode side of the smoothing capacitor module 500 through the negative electrode terminal 158. Each capacitor terminal 504 is electrically connected.

  As described above, the control circuit 172 receives a control command from the host control device via the signal connector 21 and configures the upper arm or the lower arm of each phase series circuit 150 constituting the inverter circuit 140 based on the control command. A control pulse that is a control signal for controlling the IGBT 328 and the IGBT 330 is generated and supplied to the driver circuit 174. Based on the control pulse, the driver circuit 174 supplies a drive pulse for controlling the IGBT 328 and IGBT 330 constituting the upper arm or the lower arm of each phase series circuit 150 to the IGBT 328 and IGBT 330 of each phase. The IGBT 328 and the IGBT 330 perform conduction or cutoff operation based on the drive pulse from the driver circuit 174, convert the DC power supplied from the battery 136 into three-phase AC power, and this control-converted AC power is sent to the motor generator. Supplied.

  The IGBT 328 includes a collector electrode 153, a signal emitter electrode 155, and a gate electrode 154. The IGBT 330 includes a collector electrode 163, a signal emitter electrode 165, and a gate electrode 164. A diode 156 is electrically connected between the collector electrode 153 and the emitter electrode. A diode 166 is electrically connected between the collector electrode 163 and the emitter electrode 155. As the power semiconductor element for switching, a metal oxide semiconductor field effect transistor (hereinafter abbreviated as MOSFET) may be used.

  In this case, the diode 156 and the diode 166 are unnecessary. As a switching power semiconductor element, IGBT is suitable when the DC voltage is relatively high, and MOSFET is suitable when the DC voltage is relatively low.

  The smoothing capacitor module 500 includes a plurality of capacitor terminals 506 on the positive electrode side, a plurality of capacitor terminals 504 on the negative electrode side, a power supply terminal 509 on the positive electrode side, and a power supply terminal 508 on the negative electrode side. The high-voltage DC power from the battery 136 is supplied to the positive-side power terminal 509 and the negative-side power terminal 508 via the DC connector unit 138, and a plurality of positive-side capacitor terminals 506 of the smoothing capacitor module 500 A plurality of capacitor terminals 504 on the negative electrode side are supplied to the inverter circuit 140.

  On the other hand, the DC power converted from the AC power by the inverter circuit 140 is supplied to the smoothing capacitor module 500 from the capacitor terminal 506 on the positive electrode side or the capacitor terminal 504 on the negative electrode side, and the power terminal 509 on the positive electrode side or the power terminal on the negative electrode side. 508 is supplied to the battery 136 via the DC connector unit 138 and stored in the battery 136.

  The control circuit 172 includes a microcomputer (hereinafter referred to as “microcomputer”) for calculating the switching timing of the IGBT 328 and the IGBT 330. Information input to the microcomputer includes a target torque value required for the motor generator, a current value supplied from the upper and lower arm series circuit 150 to the motor generator, and a magnetic pole position of the rotor of the motor generator. The target torque value is based on a command signal output from a host controller (not shown). The current value is detected by the current sensor 180 and fed back to determine whether the current is as commanded. The magnetic pole position is detected based on a detection signal output from a rotating magnetic pole sensor (not shown) such as a resolver provided in the motor generator. In this embodiment, the current sensor 180 detects the current value of three phases, but the current value for two phases may be detected and the current for three phases may be obtained by calculation. .

  The microcomputer in the control circuit 172 calculates the d and q axis current command values of the motor generator based on the target torque value, the calculated d and q axis current command values, and the detected d and q axes. The voltage command values for the d and q axes are calculated based on the difference from the current value, and the calculated voltage command values for the d and q axes are calculated based on the detected magnetic pole position. Convert to phase voltage command value. Then, the microcomputer generates a pulse-like modulated wave based on a comparison between the fundamental wave (sine wave) and the carrier wave (triangular wave) based on the voltage command values of the U phase, V phase, and W phase, and the generated modulation wave The wave is output to the driver circuit 174 as a PWM (pulse width modulation) signal. When driving the lower arm, the driver circuit 174 outputs a drive signal obtained by amplifying the PWM signal to the gate electrode of the corresponding IGBT 330 of the lower arm.

  Further, when driving the upper arm, the driver circuit 174 amplifies the PWM signal after shifting the level of the reference potential of the PWM signal to the level of the reference potential of the upper arm, and uses this as a drive signal as a corresponding upper arm. Are output to the gate electrodes of the IGBTs 328 respectively.

  In addition, the control unit 170 performs abnormality detection (overcurrent, overvoltage, overtemperature, etc.) to protect the upper and lower arm series circuit 150. For this reason, sensing information is input to the control circuit 172. For example, information on the current flowing through the emitter electrodes of the IGBTs 328 and IGBTs 330 is input from the signal emitter electrode 155 and the signal emitter electrode 165 of each arm to the corresponding drive unit (IC). Thereby, each drive part (IC) detects overcurrent, and when overcurrent is detected, it stops the switching operation of corresponding IGBT328 and IGBT330, and protects corresponding IGBT328 and IGBT330 from overcurrent. Information on the temperature of the upper and lower arm series circuit 150 is input to the microcomputer from a temperature sensor (not shown) provided in the upper and lower arm series circuit 150.

  In addition, voltage information on the DC positive side of the upper and lower arm series circuit 150 is input to the microcomputer. The microcomputer performs overtemperature detection and overvoltage detection based on such information, and stops switching operations of all the IGBTs 328 and IGBTs 330 when an overtemperature or overvoltage is detected.

FIG. 3 is an exploded perspective view of the power conversion apparatus 100 as an embodiment according to the present invention.
The power conversion device 100 includes a housing 10 and a cover 8 for fixing and protecting the power conversion module 200 with a power conversion module 200 described later as a core. The connector module 120 that is an output unit, the signal connector 21 that transmits signals to the control circuit, and the inlet pipe 13 and the outlet pipe 14 for introducing and discharging the cooling medium to and from the flow path forming body 12 are configured. The flow path forming body 12 and the housing 10 are separate parts as illustrated. Since the power converter 100 has a substantially rectangular shape at the bottom and top surfaces, it can be easily attached to the vehicle and can be easily produced. In the following embodiments, the direction from the bottom surface of the housing 10 to the cover 8 is upward, the opposite is downward, and the vertical direction is the height direction.

  The flow path forming body 12 holds components such as a power semiconductor module 300, a smoothing capacitor module 500, a first AC bus bar 801, and the circuit board 20 described later, and cools them with a cooling medium.

  The housing 10 houses circuit components constituting the power conversion module 200, and an opening is provided in the side wall of the housing 10, and the signal connector 21 is fixed. The signal connector 21 is connected to an external control device through the opening, and performs signal transmission between the control circuit 172 provided on the circuit board 20 and an external control device such as a host control device. Low voltage DC power for operating the control circuit in the power converter 100 is supplied from the signal connector 21.

  Further, a connector module 120 for connecting a direct current and an alternating current power supply to the outside is fixed to another opening provided in the side wall of the housing 10. The connector module 120 is provided with a DC connector portion 138 for transmitting and receiving DC power to and from the battery 136, and a negative power line 139 b and a positive electrode for supplying high voltage DC power to the power converter 100. The side power line 139a electrically connects the battery 136 and the smoothing capacitor module 500 or the like. Further, the connector module 120 is provided with an AC connector portion 188 for transmitting and receiving an AC current between the motor generator and the power semiconductor module 300, and an AC wiring 189a for supplying high voltage AC power to the motor generator. ˜189c electrically connect the motor generator and the power semiconductor modules 300a to 300c.

  FIG. 4 is an exploded perspective view for assisting in understanding the components and the water channel configuration incorporated in the flow path forming body 12 that is a component of the power conversion module 200. The flow path forming body 12 has a smaller size in the vertical direction than the dimensions in the other directions and has a flat shape, and an outlet connecting the inlet pipe connection portion 12a and the outlet pipe 14 on the side surface. A pipe connecting portion 12b is provided, and the cooling flow path 19 is formed in a U shape so as to connect two pipes. The upper surface on one side of the cooling flow path 19 is open.

  The cooling medium flows in from the inlet pipe 13, and the flow path 19a into which the power semiconductor module 300a is inserted, the flow path 19b into which the power semiconductor module 300b is inserted, the folded flow path portion 19c, and the flow path into which the power semiconductor module 300c is inserted. It is discharged from the outlet pipe 14 through 19d and the flow path 19e.

  The opening surface 400 is closed by the flow path cover 420 and the flow path cover part seal member 405. Furthermore, openings 402 a to 402 c are formed on the side surface of the flow path forming body 12 along the flow of the refrigerant. The openings 402 a to 402 c are closed by the inserted power semiconductor modules 300 a to 300 c and the flange seal members 406 a to 406 c, and the power semiconductor modules 300 a to 300 c are cooled by the cooling medium flowing through the cooling flow path 19.

  According to the present embodiment, the dimension in the height direction of the flow path forming body 12 that accommodates the power semiconductor module 300 is set to the width of the flange 304B provided in the power semiconductor module 300 and the plate thickness of the flow path cover 420. It is possible to reduce the height because it can be held to the dimension with added.

  Further, by providing the opening surface 400 on the upper surface of the flow channel 19, the folded flow channel portion 19c is provided in the flow channel, and the degree of freedom of layout of the power semiconductor modules 300a to 300c is increased without deteriorating the cooling performance. Miniaturization is also possible. In FIG. 4, the power semiconductor modules 300a and 300b are provided in the cooling flow path 19 in the refrigerant flow direction 418a, which is the forward path, and the power semiconductor module 300c is provided in the cooling flow path 19 in the refrigerant flow direction 418c, which is the return path. .

  In addition to the above-described configuration, when the direction of flow of the cooling refrigerant is reversed, the configuration in which the power semiconductor modules 300a to 300c are arranged on one surface, and the power semiconductor module 300b are connected to the inlet piping connection portion 12a and the outlet piping. The structure inserted from the surface opposite to the surface of the portion 12b and disposed at the position of the cooling channel 19c, or three power semiconductor modules 300 are disposed on one surface, and three power semiconductor modules 300 are disposed on the opposite surface. Even in a configuration using two motor generators arranged in the same manner, the effect of reducing the height and the effect thereof is the same.

  In addition, the cooling channel 19 has an effect of increasing the mechanical strength in addition to the cooling effect by making the main structure of the cooling channel 19 of the channel forming body 12 integrally with the channel forming body 12 by casting aluminum. . Moreover, the flow path forming body 12 and the cooling flow path 19 are integrated with each other by being made by aluminum casting, heat conduction is improved, and cooling efficiency is improved. The power semiconductor modules 300a to 300c are fixed to the cooling channel 19 to complete the cooling channel 19, and a water leak test is performed on the water channel.

  FIG. 5 is an exploded perspective view for assisting in understanding the configuration of the power conversion module 200. A power semiconductor module 300 is accommodated in the flow path forming body 12. The smoothing capacitor module 500 is assembled at a position close to the lower surface of the flow path forming body 12.

  Furthermore, since the power semiconductor module 300 is not assembled in the flow path 19e portion of the flow path forming body 12, the flow path 19e portion can suppress the depth of the flow path. The lower surface has a recessed shape, and a resistor 450 is fixed to the recessed portion. The current sensor 180 is fixed to the upper surface of the flow path cover 420 that forms the upper surface of the flow path forming body 12, and the bus bar assembly 800 is also fixed.

  The bus bar assembly 800 includes bus bar bodies 801a, 801b and 801c that transmit AC power, a heat transfer member 803, and a bus bar holding member 802. The bus bar assembly 800 is fixed to the flow path cover 420 at the lower part, and the circuit at the upper part. It is fixed to the substrate 20. The terminals provided on the smoothing capacitor module 500 and the AC bus bars 801a to 800c are electrically connected to the power semiconductor modules 300a to 300c, and the connecting portions are joined by welding.

  According to the present embodiment, in the surface constituting the surface of the flow path forming body 12, the heat generating components can be arranged close to both the upper surface and the lower surface, that is, the surface having a large area. In contrast, the cooling efficiency is greatly improved.

  Further, since the area that can be used for the layout of the smoothing capacitor module 500 can be the same area as that of the flow path forming body 12, the dimension in the height direction is suppressed while ensuring the capacitor capacity necessary for ensuring the inverter performance. Can be reduced in height.

  Also in the circuit board 20, since the area where the board can be used for layout is small in the conventional configuration, the board of the driver circuit 174 and the board of the control circuit 172 cannot be arranged on the same plane. According to the embodiment, the driver circuit 174 and the control circuit 172 can be arranged on the same circuit board 20 and the height can be reduced.

  Further, since all the parts constituting the power conversion module 200 shown in FIG. 5 can be assembled in a sub-assembly state before being assembled into the housing 10, the assembly work including welding is performed by the power conversion module 200. This is possible from all directions, and as a result, the degree of freedom in design is increased, so that it is possible to reduce the size and cost, and the productivity is improved in the production department.

  As explained in FIG. 3, since the flow path forming body 12 and the housing 10 are separate parts, the inspection can be performed in the state of the power conversion module 200 at the production site. In addition, since the parts such as the housing 10 are not discarded, the yield can be reduced.

  FIG. 6 illustrates a means for fixing the flow path forming body 12 to the housing 10. FIG. 6A is a cross-sectional view of the vicinity of the inlet pipe 13 and the outlet pipe 14. FIG. 6B is a cross-sectional view of the facing side of the surface to which the inlet / outlet pipe is attached.

  6A, the flow path forming body 12 is provided with an inlet pipe connecting portion 12a and an outlet pipe connecting portion 12b shown in FIG. 4, and a flange 12c including both the connecting portions is formed. Moreover, the housing 10 is provided with an opening 10a matched to the flow path forming body flange 12c. As a result, the cooling medium enters the flow path forming body 12 directly from the inlet pipe 13, and is discharged from the outlet pipe 14 through the cooling flow path 19.

  Therefore, since the cooling medium does not touch the housing 10, the required specification for the housing 10 is lower than that of the conventional housing. For example, when a housing is manufactured by aluminum die casting, conventionally, the housing is machined or impregnated in order to prevent leakage of the cooling medium. However, in this embodiment, it is not necessary, and the cost can be reduced. In the present embodiment, since an alternative material such as resin can be selected for the housing 10, it is possible to reduce the weight and reduce the cost.

  An internal thread is provided on the flange 12c provided on the flow path forming body 12 described above, and after the seal member 407 matched to the flange shape is assembled, the fastening screw 31 is used to make a perpendicular to the flange 12c. It is fixed to the housing 10 by tightening from the direction. On the other hand, the housing 10 is provided with a female screw 10c on the opposite side of the surface to which the inlet / outlet pipe is attached, and the flange 12e of the flow path forming body 12 is fastened in the vertical direction using the fastening screw 32. .

  Since the fastening direction of the screw fastening screw 31 on the flange 12c side to which the inlet / outlet pipe is attached and the fastening screw 32 on the opposite side is perpendicular, when a vibration is applied in the vehicle, a stress in the shearing direction is generated in the fastening screw 31 and breaks. There is a fear. In order to prevent breakage, a support portion 12d is provided at the lower portion of the flange 12c, and a support portion 10b is provided on the opposite housing 10 so that the load in the vertical direction is received by the indication portion 12d and the support portion 10, and a fastening screw 31 has the function of suppressing the stress in the shearing direction generated at 31.

  FIG. 7 illustrates the flow path cover 420 to facilitate understanding. FIG. 7A is a perspective view of the flow path cover 420 as viewed from the side in contact with the opening surface 400 of the flow path forming body 12. The flow path cover 420 is provided with a convex portion 420a in accordance with the cooling flow path 19 and the power semiconductor module 300, so that the clearance with the heat radiating portion provided in the power semiconductor module 300 can be made uniform and appropriate. Will improve.

  FIG. 7B is a perspective view of the flow path cover 420 as viewed from the upper surface of the flow path forming body 12. The flow path cover 420 has a shape 420b that is recessed according to the protrusion 420a, and an AC bus bar holding member mounting boss 420c is provided in the recessed portion. Since the mounting boss 420c is provided in the recessed portion, the height of the boss can be suppressed and the height can be reduced.

  A circuit board mounting boss 420d is provided on the surface of the flow path cover 420 shown in FIG. Since the mounting boss 420d can be arranged at an arbitrary position, the distance between the support points when mechanical vibration occurs can be shortened, and the resonance frequency can be increased, thereby improving the reliability. In addition, since the flow path cover 420 is located between the power semiconductor module 300 and the circuit board 20, an electromagnetic shielding effect can be obtained. In the conventional configuration, a dedicated metal plate is used, but in the present embodiment, since it can be integrated into the flow path cover 420, there is an effect of cost reduction. If the effect of electromagnetic shielding / board cooling is low, an electromagnetic shielding / board cooling can be achieved by placing a thin conductive metal plate between the bus bar assembly 800 and the circuit board 20. However, the effect of cost reduction can be obtained.

  A detailed configuration of the power semiconductor modules 300a to 300c used in the inverter circuit 140 will be described with reference to FIGS. The power semiconductor modules 300a to 300c have the same structure, and the structure of the power semiconductor module 300a will be described as a representative. 7 to 11, the signal terminal 325U corresponds to the gate electrode 154 and the signal emitter electrode 155 disclosed in FIG. 2, and the signal terminal 325L corresponds to the gate electrode 164 and the emitter electrode 165 disclosed in FIG. To do. The DC positive terminal 315B is the same as the positive terminal 157 disclosed in FIG. 2, and the DC negative terminal 319B is the same as the negative terminal 158 disclosed in FIG. The AC terminal 321 is the same as the AC terminal 159 disclosed in FIG.

  FIG. 8A is a perspective view in which the terminal shape is changed so that the power semiconductor module 300a of this embodiment can be easily described. FIG. 8B is a cross-sectional view of the power semiconductor module 300a of this embodiment.

  The power semiconductor elements (IGBT 328, IGBT 330, diode 156, and diode 166) constituting the series circuit 150 of the upper and lower arms are connected by the conductor plate 315 or the conductor plate 318 or the conductor plate 316 or the conductor plate as shown in FIGS. By 319, it is fixed by being sandwiched from both sides. These conductor plates are assembled with an auxiliary molded body 600 formed by integrally molding the signal wirings which are the signal terminals 325U and 325L. The conductor plate 315 and the like are sealed with the first sealing resin 348 with the heat dissipation surface exposed, and the insulating sheet 333 is thermocompression bonded to the heat dissipation surface. The module primary sealing body 302 sealed with the first sealing resin 348 is inserted into the module case 304 and sandwiched with the insulating sheet 333, and is thermocompression bonded to the inner surface of the module case 304 that is a CAN type cooler. The Here, the CAN-type cooler is a cylindrical cooler having an insertion port 306 on one surface and a bottom on the other surface.

  The module case 304 is made of an aluminum alloy material such as Al, AlSi, AlSiC, Al—C, or the like, and is formed by joining one or more parts. The module case 304 has a structure in which no opening other than the insertion port 306 is provided. The insertion port 306 is surrounded by a flange 304B.

  Further, as shown in FIG. 8 (a), the first heat radiating surface 307A and the second heat radiating surface 307B, which are wider than the other surfaces, are arranged facing each other, and the facing first heat radiating surface 307A and The three surfaces connected to the second heat radiating surface 307B constitute a surface sealed with a narrower width than the first heat radiating surface 307A and the second heat radiating surface 307B, and the insertion port 306 is formed on the other side surface. The shape of the module case 304 does not have to be an accurate rectangular parallelepiped, and the corners may form a curved surface as shown in FIG.

  By using the metallic case having such a shape, even when the module case 304 is inserted into the cooling channel 19 through which a coolant such as water or oil flows, a seal against the coolant can be secured by the flange 304B. It is possible to prevent the medium from entering the inside of the module case 304 with a simple configuration. Further, the fins 305 are uniformly formed on the first heat radiation surface 307A and the second heat radiation surface 307B facing each other.

  Further, a curved portion 304A having an extremely thin thickness is formed on the outer periphery of the first heat radiating surface 307A and the second heat radiating surface 307B. Since the curved portion 304A is extremely thin to such an extent that it can be easily deformed by pressurizing the fin 305, the productivity after the module primary sealing body 302 is inserted is improved.

  The gap remaining inside the module case 304 is filled with the second sealing resin 351. Further, as shown in FIGS. 9 and 10, a DC positive electrode wiring 315A and a DC negative electrode wiring 319A for electrical connection with the smoothing capacitor module 500 are provided, and a DC positive electrode terminal 315B (157) is provided at the tip thereof. ) And a DC negative terminal 319B (158). An AC wiring 320 for supplying AC power to the motor generator or 194 is provided, and an AC terminal 321 (159) is formed at the tip thereof. In the present embodiment, the DC positive electrode wiring 315A is integrally formed with the conductor plate 315, the DC negative electrode wiring 319A is integrally formed with the conductor plate 319, and the AC wiring 320 is integrally formed with the conductor plate 316.

  As described above, by thermally pressing the conductor plate 315 or the like to the inner wall of the module case 304 via the insulating sheet 333, the gap between the conductor plate and the inner wall of the module case 304 can be reduced, and the power semiconductor element The generated heat can be efficiently transmitted to the fins 305. Further, by providing the insulating sheet 333 with a certain degree of thickness and flexibility, the generation of thermal stress can be absorbed by the insulating sheet 333, which is favorable for use in a power conversion device for a vehicle having a large temperature change. .

  FIG. 9A is an internal cross-sectional view in which the module case 304, the insulating sheet 333, the first sealing resin 348, and the second sealing resin 351 are removed in order to help understanding. FIG. 9B is an internal perspective view.

  FIG. 10 (a) is an exploded view for helping understanding of the structure of FIG. 9 (b). FIG. 10B is a circuit diagram of the power semiconductor module 300. FIG. 11A is a circuit diagram for explaining the inductance reduction effect, and FIG. 11B is a perspective view showing a current flow for explaining the inductance reduction effect.

  First, the arrangement of the power semiconductor elements (IGBT 328, IGBT 330, diode 156, diode 166) and the conductor plate will be described in association with the electric circuit shown in FIG. As shown in FIG. 9B, the direct current positive electrode side conductor plate 315 and the alternating current output side conductor plate 316 are arranged in substantially the same plane. To the conductor plate 315, the collector electrode of the IGBT 328 on the upper arm side and the cathode electrode of the diode 156 on the upper arm side are fixed. On the conductor plate 316, the collector electrode of the IGBT 330 on the lower arm side and the cathode electrode of the diode 166 on the lower arm side are fixed.

  Similarly, the AC conductor plate 318 and the conductor plate 319 are arranged in substantially the same plane. On the AC conductor plate 318, the emitter electrode of the IGBT 328 on the upper arm side and the anode electrode of the diode 156 on the upper arm side are fixed. On the conductor plate 319, an emitter electrode of the IGBT 330 on the lower arm side and an anode electrode of the diode 166 on the lower arm side are fixed. Each power semiconductor element is fixed to an element fixing portion 322 provided on each conductor plate via a metal bonding material 160. The metal bonding material 160 is, for example, a low-temperature sintered bonding material including a solder material, a silver sheet, and fine metal particles.

  Each power semiconductor element has a flat plate-like structure, and each electrode of the power semiconductor element is formed on the front and back surfaces. As shown in FIG. 9A, each electrode of the power semiconductor element is sandwiched between the conductor plate 315 and the conductor plate 318, or the conductor plate 316 and the conductor plate 319. In other words, the conductor plate 315 and the conductor plate 318 are stacked so as to face each other substantially in parallel via the IGBT 328 and the diode 156. Similarly, the conductor plate 316 and the conductor plate 319 have a stacked arrangement facing each other substantially in parallel via the IGBT 330 and the diode 166. Further, the conductor plate 316 and the conductor plate 318 are connected via an intermediate electrode 329. By this connection, the upper arm circuit and the lower arm circuit are electrically connected to form an upper and lower arm series circuit.

  The direct current positive electrode wiring 315A and the direct current negative electrode wiring 319A have a shape extending substantially in parallel while facing each other through an auxiliary mold body 600 formed of a resin material. The signal terminal 325U and the signal terminal 325L are formed integrally with the auxiliary mold body 600 and extend in the same direction as the DC positive electrode wiring 315A and the DC negative electrode wiring 319A. As the resin material used for the auxiliary mold body 600, a thermosetting resin having an insulating property or a thermoplastic resin is suitable.

  As a result, it is possible to ensure insulation between the DC positive electrode wiring 315A, the DC negative electrode wiring 319A, the signal terminal 325U, and the signal terminal 325L, thereby enabling high-density wiring. Furthermore, the direct current positive electrode wiring 315A and the direct current negative electrode wiring 319A are arranged so as to face each other substantially in parallel, so that currents that instantaneously flow during the switching operation of the power semiconductor element face each other in the opposite direction. As a result, the magnetic fields produced by the currents cancel each other out, and this action can reduce the inductance.

  The effect of reducing the inductance will be described with reference to FIG. In FIG. 11A, the lower arm side diode 166 is in a conductive state in a forward bias state. In this state, when the upper arm side IGBT 328 is turned on, the diode 166 on the lower arm side is reversely biased, and a recovery current caused by carrier movement passes through the upper and lower arms.

  At this time, the recovery current 360 shown in FIG. 11B flows through the conductor plates 315, 316, 318, and 319. As indicated by the dotted line, the recovery current 360 passes through the DC positive terminal 315B (157) disposed opposite to the DC negative terminal 319B (158), and is subsequently formed by the conductor plates 315, 316, 318, and 319. It flows through the loop-shaped path, and again flows as shown by the solid line through the DC negative terminal 319B (158) arranged opposite to the DC positive terminal 315B (157).

  As a current flows through the loop-shaped path, an eddy current 361 flows through the first heat dissipation surface 307A and the second heat dissipation surface 307B of the module case 304. Due to the magnetic field canceling effect generated by the equivalent circuit 362 in the current path of the eddy current 361, the wiring inductance 363 in the loop-shaped path is reduced.

  Note that the closer the current path of the recovery current 360 is to the loop shape, the greater the inductance reduction action. In the present embodiment, the loop-shaped current path flows through a path close to the DC positive terminal 315B (157) side of the conductor plate 315 and passes through the IGBT 328 and the diode 156 as indicated by a dotted line. The loop-shaped current path flows through a path farther from the DC positive terminal 315B (157) side of the conductor plate 318, as shown by the solid line, and then farther from the DC positive terminal 315B (157) side of the conductor plate 316, as shown by the dotted line. The path flows through the IGBT 330 and the diode 166. Further, as indicated by the solid line, the loop-shaped current path flows along a path close to the DC negative electrode wiring 319A side of the conductor plate 319. Thus, the loop-shaped current path passes through a path closer to or farther from the DC positive terminal 315B (157) or the DC negative terminal 319B (158), thereby forming a current path closer to the loop shape. Is done.

  12A is a perspective view of the auxiliary mold body 600, and FIG. 12B is a transparent view of the auxiliary mold body 600.

  In the auxiliary mold body 600, the signal conductor 324 is integrated by insert molding. Here, the signal conductor 324 receives the temperature information of the upper arm side gate electrode terminal 154 and the emitter electrode terminal 155, the upper arm side gate electrode terminal 164 and the emitter electrode terminal 165 (see FIG. 2), and the power semiconductor element. A terminal for transmission is included. In the description of this embodiment, these terminals are collectively referred to as signal terminals 325U and 325L.

  The signal conductor 324 forms signal terminals 325U and 325L at one end, and forms element-side signal terminals 326U and 326L at the other end. The element-side signal terminals 326U and 326L are connected to signal pads provided on the surface electrode of the power semiconductor element by, for example, wires. The first sealing portion 601A has a shape extending in a direction transverse to the major axis of the shape of the DC positive electrode wiring 315A, the DC negative electrode wiring 319A, or the AC wiring 320 shown in FIG.

  On the other hand, the second sealing portion 601B has a shape extending in a direction substantially parallel to the major axis of the shape of the DC positive electrode wiring 315A, the DC negative electrode wiring 319A, or the AC wiring 320. The second sealing portion 601B includes a sealing portion for sealing the signal terminal 325U on the upper arm side and a sealing portion for sealing the signal terminal 325L on the lower arm side.

  The auxiliary mold body 600 is formed to have a length longer than the entire length of the conductor plates 315 and 316 arranged side by side or the entire length of the conductor plates 319 and 320 arranged side by side. That is, the lengths of the conductor plates 315 and 316 arranged side by side or the lengths of the conductor plates 319 and 320 arranged side by side are within the range of the lateral length of the auxiliary mold body 600.

  The first sealing portion 601A has a hollow shape and forms a wiring fitting portion 602B for fitting the DC negative electrode wiring 319A into the hollow. The first sealing portion 601A has a hollow shape and forms a wiring fitting portion 602A for fitting the DC positive electrode wiring 315A into the hollow. Further, the first sealing portion 601A is disposed on the side of the wiring fitting portion 602A, has a hollow shape, and further forms a wiring fitting portion 602C for fitting the AC wiring 320 into the hollow. To do. Each wiring is positioned by fitting each wiring to these wiring fitting portions 602A to 602C. Thereby, it becomes possible to perform the filling operation of the resin sealing material after firmly fixing each wiring, and the mass productivity is improved.

  Moreover, the wiring insulation part 608 protrudes in a direction away from the first sealing part 601A from between the wiring fitting part 602A and the wiring fitting part 602B. Since the plate-shaped wiring insulating portion 608 is interposed between the DC positive electrode wiring 315A and the DC negative electrode wiring 319A, it is possible to arrange the wiring insulating portion 608 so as to reduce the inductance while ensuring insulation.

  Further, the first sealing portion 601A is formed with a mold pressing surface 604 that comes into contact with a mold used for resin sealing, and the mold pressing surface 604 prevents resin leakage during resin sealing. A protruding portion 605 for preventing is formed around the outer periphery in the longitudinal direction of the first sealing portion 601. A plurality of protrusions 605 are provided to enhance the resin leakage prevention effect. Furthermore, since the protrusions 605 are also provided in the wiring fitting part 602A and the wiring fitting part 602B, it is possible to prevent the resin sealing material from leaking from the periphery of the DC positive electrode wiring 315A and the DC negative electrode wiring 319A. Here, considering that the first sealing portion 601A, the second sealing portion 601B, and the protrusion 605 are installed in a mold of about 150 to 180 ° C., heat that can be expected to have high heat resistance. A liquid crystal polymer of plastic resin, polybutylene terephthalate (PBT) or polyphenylene sulfide resin (PPS) is desirable.

  In addition, a plurality of through holes 606 shown in FIG. 12B are provided in the longitudinal direction on the power semiconductor element side in the short direction of the first sealing portion 601A. As a result, the first sealing resin 348 flows into the through-hole 606 and hardens, whereby an anchor effect is exerted, and the auxiliary mold body 600 is firmly held by the first sealing resin 348, and temperature changes and machine Even if stress is applied by mechanical vibration, both do not peel off. It is difficult to peel even if the shape is uneven instead of the through hole. Further, a certain degree of effect can be obtained by applying a polyimide coating agent to the first sealing portion 601A or roughening the surface.

  In the sealing step of the first sealing resin 348 in the module primary sealing body 302, first, the auxiliary mold body 600 supporting each wiring is inserted into a mold preheated to about 150 to 180 ° C. In the present embodiment, the auxiliary mold body 600, the direct current positive electrode wiring 315A, the direct current negative electrode wiring 319A, the alternating current wiring 320, the conductor plate 315, the conductor plate 316, the conductor plate 318, and the conductor plate 319 are firmly connected to each other. By installing the mold body 600 at a predetermined position, the main circuit and the power semiconductor element are installed at the predetermined position. Therefore, productivity is improved and reliability is improved.

  The second sealing portion 601B is formed to extend from the vicinity of the module case 304 to the vicinity of the driver circuit board. As a result, when wiring with the driver circuit board through the high-power wiring, the switching control signal can be normally transmitted even when exposed to a high voltage. Further, even if the DC positive wiring 315A, the DC negative wiring 319A, the AC wiring 320, the signal terminal 325U, and the signal terminal 325L protrude from the module case 304 in the same direction, it is possible to ensure electrical insulation and ensure reliability. it can.

  FIG. 13 is an exploded perspective view for explaining the internal structure of the smoothing capacitor module 500. The laminated conductor plate 501 is composed of a negative electrode conductor plate 505 and a positive electrode conductor plate 507 formed of plate-like wide conductors, and an insulating sheet (not shown) sandwiched between the negative electrode conductor plate 505 and the positive electrode conductor plate 507. . As described below, the laminated conductor plate 501 cancels out the magnetic flux with respect to the current flowing through the series circuit 150 of the upper and lower arms of each phase, so that the inductance of the current flowing through the series circuit 150 of the upper and lower arms is reduced. . The laminated conductor plate 501 has a substantially square shape. The negative power supply terminal 508 and the positive power supply terminal 509 are formed so as to rise from one side of the laminated conductor plate 501 and are connected to the positive conductor plate 507 and the negative conductor plate 505, respectively. DC power is supplied to the positive power supply terminal 509 and the negative power supply terminal 508 via the DC connector 138 as described with reference to FIG.

  The capacitor terminal 503c is raised from the same side as the negative power supply terminal 508 and the positive power supply terminal 509, and the capacitor terminals 503a and 503b are raised from opposite sides of the capacitor terminal 503c. It is formed corresponding to the positive terminal 157 (315B) and the negative terminal 158 (319B) of the semiconductor module 300. Capacitor terminals 503a to 503c are connected to power semiconductor modules 300a to 300c, respectively. A part of an insulating sheet (not shown) is provided between the negative-side capacitor terminal 504a and the positive-side capacitor terminal 506a constituting the capacitor terminal 503a to ensure insulation. The same applies to the other capacitor terminals 503b and 503c. In the present embodiment, the negative electrode conductor plate 505, the positive electrode conductor plate 507, the battery negative electrode side terminal 508, the battery negative electrode side terminal 509, and the capacitor terminals 503a to 503f are configured by integrally formed metal plates, and the upper and lower arms This has the effect of reducing the inductance with respect to the current flowing through the series circuit 150.

  A plurality of capacitor cells 514 are provided on the inner side of the smoothing capacitor module 500 below the laminated conductor plate 501. In the present embodiment, four capacitor cells 514 are arranged in a line along one side of multilayer conductor plate 501, and another twelve capacitor cells 514 are along the other side of multilayer conductor plate 501. A total of 16 capacitor cells are provided. In the present embodiment, the refrigerant flow path is provided in the state close to the upper surface of the smoothing capacitor module 500, so that the cooling efficiency is improved.

  Capacitor cell 514 is a unit structure of a power storage unit of smoothing capacitor module 500, and two films each having a metal such as aluminum deposited thereon are stacked and wound to form a positive electrode and a negative electrode, respectively. Use a film capacitor. The electrode of the capacitor cell 514 is manufactured by spraying a conductor such as tin, with the wound shaft surfaces serving as a positive electrode and a negative electrode, respectively.

  The capacitor case 502 includes a storage portion 511 for storing the capacitor cell 514, and the storage portion 511 has a substantially rectangular upper surface and lower surface shown in the drawing. The capacitor case 502 is provided with fixing means for fixing the smoothing capacitor module 500 to the flow path forming body 12, for example, holes 520a to 520d for allowing a screw to pass therethrough. The bottom surface portion 513 of the storage portion 511 has a smooth uneven shape or corrugated shape so as to match the surface shape of the cylindrical capacitor cell 514. This facilitates positioning of the module in which the laminated conductor plate 501 and the capacitor cell 514 are connected to the capacitor case 502. After the multilayer conductor plate 501 and the capacitor cell 514 are accommodated in the capacitor case 502, the multilayer conductor plate 501 is covered except for the capacitor terminals 503a to 503f, the negative power supply terminal 508, and the positive power supply terminal 509. In this way, the capacitor case 502 is filled with a filler (not shown). Since the bottom surface portion 513 has a corrugated shape in accordance with the shape of the capacitor cell 514, the capacitor cell 514 can be prevented from being displaced from a predetermined position when the filler is filled in the capacitor case 502.

  Further, the capacitor cell 514 generates heat due to a ripple current at the time of switching due to an electric resistance of a metal thin film and an internal conductor deposited on the internal film. Therefore, in order to easily release the heat of the capacitor cell 514 through the capacitor case 502, the capacitor cell 514 is molded with a filler. Furthermore, the moisture resistance of the capacitor cell 514 can be improved by using a resin filler.

  The tip of AC terminal 321 (159) of power semiconductor module 300 is connected to the tips of AC bus bars 801a-c by welding.

  The bus bar assembly 800 includes AC bus bars 801a to 801c, a heat transfer member 803, and a bus bar holding member 802. The AC bus bars 801a to 801c and the heat transfer member 803 are fixed to the flow path cover 420 by the bus bar holding member 802. Since heat generated by energization of the AC bus bars 801a to 801c is transmitted to the flow path forming body 12 via the heat transfer member 803, there is an effect of cooling the AC bus bars 801a to 801c.

  FIG. 14 is a perspective view disassembled into components for explaining the overall configuration of the connector module 120.

  The DC bus bars 814 a and 814 b are held by a DC bus bar holding member 818 and fixed to the connector housing 121. One ends of the DC bus bars 814 a and 814 b are respectively connected to the positive power terminal 509 and the negative power terminal 508 provided in the smoothing capacitor module 500.

  The second AC bus bars 804 a to 804 c are held by an AC bus bar holding member 817 and fixed to the connector housing 121. One ends of the second AC bus bars 804a to 804c are connected to the first AC bus bars 801a to 801c included in the power conversion module 200, respectively.

  The other ends of the DC bus bars 814a and 814b and the second AC bus bars 804a to 804c are generally connected to a DC wiring 139 and an AC wiring 189 provided on the vehicle side. In the present embodiment, after inserting the DC wiring 139 into the DC connector portion 138 of the connector housing 121, the DC bus bar 814 and the DC wiring 139 are fastened with the fastening screw 36 shown in FIG. 15 and sealed with the DC connector cover 822. To do. Similarly, after the AC wiring 189 is inserted into the AC connector portion 188 of the connector housing 121, the second AC bus bar 804 and the AC wiring 189 are fastened with the fastening screw 35 shown in FIG. 15 and sealed with the AC connector cover 821. It is configured to do. In the present embodiment, the connector module 120 has the DC connector portion 138 and the AC connector portion 188 integrated, but each connector module 120 may be separately manufactured and fixed to the housing 10. In the embodiment, the connection between the DC wiring 139 and the AC wiring 189 is fastened with a screw. However, the above-described effect can be obtained in the same manner by using a metal spring force to ensure electrical contact.

  FIG. 15 is a view from the top surface of the power conversion apparatus 100 with the cover 8 removed. FIG. 16 is a perspective view showing parts easily attached to the side surface of the power conversion apparatus 100 shown in FIG. In the power conversion module 200, the components are assembled in a module state, and are fixed to the housing 10 with fastening screws 31 and 32. The fastening screw 32 performs a fastening operation from the opening of the housing 10, and the fastening screw 31 performs a fastening operation from the external side surface. According to the present embodiment, by changing only the housing 10 without changing the power conversion module 200, for example, the fixing position of the housing 10 to the vehicle can be freely set. It is possible to obtain effects such as cost reduction of molds when manufacturing, standardization of production equipment, and reduction of design man-hours.

  Further, the inlet pipe 13, the outlet pipe 14, the connector module 120, and the signal connector 21 are fastened with fastening screws 33, 34, and 37, and the DC bus bar 814 and the power terminals 508 and 509 are fastened with the fastening screws 36. The 1 AC bus bar 801 and the second AC bus bar 804 are connected by the fastening screw 35. Further, by inserting the board connector 38 of the signal connector 21 into the circuit board 20, the connection of each part is completed. According to the present embodiment, in addition to the above effects, by changing only the cooling medium connection pipes 13 and 14, the signal connector 21, the DC connector part 138, and the AC connector part 188 that are interfaces with the outside, Since a wide range of measures can be taken, effects such as standardization of parts, cost reduction of molds of component parts, standardization of production facilities, and reduction of design man-hours can be obtained.

  FIG. 17 is a cross-sectional view of the flow path forming body and the cooling medium passage of the power semiconductor module 300. FIG. 17A is a cross-sectional view of a conventional configuration, and FIG. 17B is a cross-sectional view of the present embodiment. The flow path forming body generally uses die-cast aluminum in consideration of strength, heat dissipation, sealing performance of the cooling refrigerant, cost, and the like. Die casting is a manufacturing method in which molten aluminum is injected into a metal mold at a high pressure, and the product is taken out of the mold after cooling. Therefore, the surface parallel to the mold drawing direction is tapered so that the mold and the product can be easily separated when the product is taken out.

  In the conventional configuration shown in FIG. 17A, the power semiconductor module 300 is inserted from the upper surface of the flow path forming body 901, and the lower surface of the flow forming body 901 is sealed by the lower cover 902. Yes. In this configuration, when the flow path forming body 901 is manufactured by die casting, the die is drawn in the direction of the upper die casting die 912 and the lower die casting die 913 with the die dividing surface 911 as a boundary. At this time, since the surface parallel to the drawing direction facilitates separation from the mold, a tapered surface 914 is required. In this state, when the power semiconductor module 300 is assembled to the flow path forming body 901, the clearance 916 between the heat radiation fin 305 and the tapered surface 914 provided in the power semiconductor module 300 differs depending on the location. Since the cooling refrigerant passes through a large portion, the cooling performance is non-uniform, and there is a concern that the performance of the power semiconductor module 300 may be reduced. In order to prevent performance degradation, the taper surface 914 can be machined to make the clearance 916 uniform. However, since machining is required, this has been a factor in increasing costs.

  On the other hand, in the configuration of the present embodiment shown in FIG. 17B, the power semiconductor module 300 is inserted from the side surface of the flow path forming body 12, and the upper surface of the flow path forming body 12 is sealed with the flow path cover 420. It is configured to be stopped. In this configuration, when the flow path forming body 12 is manufactured by die casting, the die is drawn in the upward die casting direction 922. At this time, the tapered surface 924 which is a surface parallel to the drawing direction is close to the side surface of the power semiconductor module 300 which is a surface perpendicular to the heat radiation fin 305 of the power semiconductor module 300. On the other hand, the surface close to the heat radiation fin 305 provided in the power semiconductor module 300 becomes a surface 925 that does not require a taper, so that a uniform and minimum clearance 926 can be secured. This can improve the performance of the power semiconductor module 300 and can reduce the cost because machining is unnecessary.

8 Cover 10 Housing 12 Channel Forming Body 13 Inlet Pipe 14 Outlet Pipe 19 Cooling Channel 20 Circuit Board 21 Signal Connector 100 Power Converter 120 Connector Module 121 Connector Housing 136 Battery 138 DC Connector Part 140 Inverter Circuit 150 Series Circuit of Upper and Lower Arms 150A Upper arm semiconductor module 150B Lower arm semiconductor module 174 Driver circuit 180 Current sensor 188 AC connector unit 200 Power conversion module 300 Power semiconductor module 420 Flow path cover 450 Resistor 500 Smoothing capacitor module 504 Negative side capacitor terminal 506 Positive side capacitor Terminal 508 Negative power terminal 509 Positive power terminal 514 Capacitor cell 800 Bus bar assembly 801 First AC bus bar 8 Second bus bar holding member 803 heat transfer member 804 second ac busbar 814 DC bus bar

Claims (3)

A semiconductor module having a semiconductor element;
A flow path forming body that houses the semiconductor module and forms a flow path for flowing a cooling refrigerant,
The semiconductor module includes: a first heat dissipating part that forms fins; a second heat dissipating part that is disposed opposite to the first heat dissipating part across the semiconductor element and that forms fins; and the first heat dissipating part A side wall portion connecting the second heat radiating portion,
The flow path forming body includes a tapered surface formed in a direction parallel to a mold drawing direction and having a tapered shape, a first flow path wall formed to cross the mold drawing direction, and the flow path. A second flow path wall opposite to the first flow path wall,
The semiconductor module is arranged such that an arrangement direction of the first heat radiation part and the second heat radiation part is along a drawing direction of the mold and the side wall part is opposed to the tapered surface,
The first flow path wall forms a first flow path with the first heat dissipation part,
The power conversion device in which the second flow path wall forms a second flow path with the second heat radiating portion. The power conversion device according to claim 1,
The flow path forming body forms an opening at a position facing the second heat radiating portion,
The first flow path wall is integrally formed with the tapered surface,
The power conversion device, wherein the second flow path wall is formed of a separate member separated from the first flow path wall and the tapered surface and closes the opening of the flow path forming body. The power conversion device according to claim 1 or 2,
The flow path forming body forms an insertion opening for inserting the semiconductor module on a surface facing the tapered surface across the flow path,
The semiconductor module is a power conversion device that closes the insertion opening.