JP4153296B2 - Substrate processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a CVD apparatus for forming a predetermined film on a substrate, a PVD apparatus such as sputtering, or a substrate processing apparatus such as an etching apparatus or an ashing apparatus.
[0002]
[Prior art]
For example, a CVD apparatus which is a substrate processing apparatus has a vacuum chamber provided with a vacuum exhaust means. A gas ejection means for introducing a mixed gas of the reaction gas and the source gas into the chamber is provided at the ceiling of the vacuum chamber. A substrate stage is provided in the vacuum chamber so as to face the gas ejection means, and a predetermined substrate such as a wafer is placed on the substrate stage. In order to load a substrate onto the substrate stage, a substrate transfer port provided with a gate valve is provided on the side surface of the vacuum chamber between the substrate stage and the gas jetting means.
[0003]
In this case, a load lock chamber may be attached to the outer wall of the vacuum chamber corresponding to the substrate transfer port. The transfer of the substrate between the load lock chamber and the substrate stage is performed by a vacuum transfer means having a fork-shaped arm at the tip. Then, the substrate is loaded on the substrate stage by the vacuum transfer means, and the mixed gas composed of the reaction gas and the raw material gas mixed at a predetermined mixing ratio is introduced into the vacuum chamber through the gas ejection means, and the gas phase A predetermined film is formed on the substrate by chemical reaction. In addition, the exhaust gas containing the mixed gas etc. which do not contribute to a process is discharged | emitted outside by the vacuum exhaust means provided in the vacuum chamber (patent document 1).
[0004]
Here, when loading / unloading a substrate to / from the substrate stage, the space formed between the substrate and the substrate stage can be used as long as the substrate can be supported at a plurality of locations on the substrate stage and supported at a predetermined height. The arm can be taken in and out, and the substrate can be supported by the arm. In this case, for example, a vacuum chuck mechanism for adsorbing the substrate can be omitted, and the structure of the transport means can be simplified. For this reason, it is conceivable to provide a plurality of substrate lifting means for supporting the substrate on the substrate stage when loading or unloading the substrate. Each substrate lift means has a drive means such as an air cylinder driven by compressed air, for example, and drives lift pins inserted into openings provided in the substrate stage.
[0005]
[Patent Document 1]
Japanese Unexamined Patent Publication No. 2000-2127495 (see, for example, FIG. 1)
[0006]
[Problems to be solved by the invention]
However, if each lift pin is provided with a driving means, the number of parts increases and the cost increases. In particular, a drive part such as an air cylinder needs to be vacuum-sealed using, for example, a bellows, so that the cost is increased and durability is also a problem.
[0007]
Also, when a hole is provided in a metal substrate stage (material with high thermal expansion) and a lift pin fixed to the chamber is passed through the hole from the lower side of the substrate stage, the temperature of the substrate stage is increased. When raised, there is a difference between the position of the lift pin and the hole of the substrate stage, which may collide with each other and damage the lift pin or the substrate stage.
[0008]
Therefore, in view of the above points, the present invention provides a substrate processing apparatus having a substrate lifting means that can be manufactured at a low cost by reducing the number of components, has high durability, and can be easily mounted on a freely movable substrate stage. The issue is to provide.
[0009]
[Means for Solving the Problems]
In order to solve the above-described problems, the substrate processing apparatus of the present invention has a chamber, and can move up and down between a process position where a predetermined process is performed in the chamber and a substrate transfer position where the substrate can be loaded and unloaded. a substrate stage which is provided on said at least one substrate lifting means provided on the substrate stage, a substrate processing apparatus including a stopper provided on the lower side of the substrate stage in the chamber, said substrate lifting means is constituted by a cylindrical guide member mounted in a through hole formed on the substrate stage, from movable in the substrate stage lower a inserted the lift pins to that projects downward into the guide member, the substrate When the stage is moved to the substrate transfer position, the lift pins and stopper and engages, the lift pins with the descent of the substrate stage or the substrate stage Projects upward carries the substrate at a predetermined height, the substrate stage is loaded and moved to the unload position, the engagement between the lift pin and the stopper is released, the with increasing the substrate stage The lift pin is housed in the guide member and the substrate is placed on the substrate stage. The lift pin protrudes downward from the lower end of the substrate stage and has a hole through which the lift pin and the guide member have the holes. The second guide member for preventing the drop from the through hole is provided at a predetermined interval from the lower end of the guide member .
[0010]
According to the present invention, the substrate stage is moved to the substrate transfer position, and the substrate is loaded onto the substrate stage by the transfer means. At the substrate transfer position, the substrate lift means provided on the substrate stage engages with the stopper and protrudes upward from the substrate stage, so that the substrate is supported by each lift means. In this case, since a predetermined space is defined between the substrate and the upper surface of the substrate stage, the arm at the front end of the transfer means can be taken in and out using this space, and the substrate can be supported by the arm.
[0011]
When the substrate is loaded on the substrate stage, the substrate stage rises and reaches the process position. At that time, since the engagement between the substrate lifting means and the stopper is released and moves downward, the substrate on the substrate stage is lowered to a predetermined height. Then, predetermined substrate processing is performed at the process position of the substrate stage.
[0012]
When the substrate processing is completed, the substrate stage is lowered to unload the substrate. When the substrate stage is lowered to a predetermined position, the substrate lift means is engaged with the stopper again. In this case, the substrate lift means protrudes from the upper surface of the substrate stage as the substrate stage descends, and the substrate is supported at a predetermined height from the substrate stage by the substrate lift means at the substrate transfer position.
[0013]
As a result, the substrate can be raised and lowered on the substrate stage only by raising and lowering the substrate stage without providing a driving means for each substrate lifting means. Further, vacuum seal parts such as bellows, which have a problem with durability, are not necessary. Then, the substrate is unloaded by the transfer means, and the next substrate to be processed is loaded.
[0016]
Here, when the lift pin moves inside the guide member, if the friction increases, there is a risk that the smooth movement of the lift pin is hindered. Therefore, in the present invention, a second guide member that has a hole through which a part of the lift pin protruding downward from the lower end of the substrate stage passes and prevents the lift pin and the guide member from falling off the through hole is provided on the substrate. Since it is provided below the stage, it is possible to prevent the lift pins from rattling within the guide member and to prevent the guide member and lift pins from falling.
[0017]
Furthermore, the substrate stage, when moving to the process position from the substrate transfer position, a moving means for moving the lift pins downward is provided, the mobile unit includes a weigh provided at the lower end of the lift pin, the heavy And a spring contracted between the guide member and the guide member.
[0018]
Further, the lift pin is composed of a lower pin having a flange on the upper part and an upper pin connected to the flange, and when the substrate stage is in the process position, the flange faces the lower end of the guide member inward. The upper pin may be in contact with the bent portion and the upper end surface of the upper pin may be flush with the upper surface of the substrate stage.
[0019]
DETAILED DESCRIPTION OF THE INVENTION
1 and 2, reference numeral 1 denotes a CVD apparatus which is an example of a substrate processing apparatus of the present invention. The CVD apparatus 1 forms a thin film by a gas phase chemical reaction on a substrate S such as a silicon wafer or glass, and includes a vacuum chamber 11 having a predetermined volume having a vacuum exhaust means 11a such as a turbo molecular pump. Near the center of the ceiling portion 12 of the vacuum chamber 11, gas ejection means 2 for introducing a mixed gas composed of a reaction gas and a raw material gas into the vacuum chamber 11 is provided.
[0020]
The gas ejection means 2 is composed of an annular projecting portion 21 projecting inward from the top 12 of the vacuum chamber 11 and a shower plate 22 attached to the tip of the chamber and having a plurality of holes. The In this case, a gas diffusion chamber 23 is formed on the upper portion of the vacuum chamber 11 by the protruding portion 21 and the shower plate 22, and the mixed gas introduced into the gas diffusion chamber 23 is diffused over the entirety. A gas introduction pipe 24 having one end connected to a mixer (not shown) is also connected to the ceiling portion 12 of the vacuum chamber 11, and the mixed gas mixed in the mixer connected to a plurality of gas sources is diffused. It is introduced into the chamber 23. A substrate stage 3 is provided in the vacuum chamber 11 with respect to the gas ejection means 2, and a substrate S such as a wafer is placed on the substrate stage 3.
[0021]
In order to load and unload the substrate S on the substrate stage 3, a substrate transfer port 13 having a gate valve is provided in the vacuum chamber 11. In this case, when the CVD process is performed, even if the mixed gas is uniformly ejected to the substrate S through the gas ejection means 2 so that the film thickness distribution and the composition distribution of the thin film on the substrate S are uniform, When 13 is positioned above the substrate stage 3, turbulent flow is generated around the substrate transfer port 13, and the gas flow is disturbed, so that the gas flow on the substrate S is also disturbed and the film thickness distribution of the thin film. And the composition distribution is not uniform.
[0022]
In the present embodiment, the substrate stage 3 is formed to be movable up and down between a process position for executing a CVD process, which is a substrate process, and a substrate transfer position at which the substrate can be loaded and unloaded. The substrate transfer port 13 is positioned below the stage 3. Further, it is desirable that the conductance relating to the gas flow has a larger value in the space B below the substrate stage 3 than in the space A between the shower plate 22 and the substrate stage 3 (see FIG. 2).
[0023]
The substrate stage 3 is configured by connecting a lifting / lowering rod 32 provided to protrude from the bottom surface of the vacuum chamber 11 into the vacuum chamber 11 to a metal substrate mounting portion 31 facing the gas ejection means 2. A heater (not shown) that can heat the substrate S is incorporated in the substrate platform 31. The elevating rod 32 is driven by, for example, compressed air or a motor, and a bellows 33 is provided around the elevating rod 32 for vacuum sealing.
[0024]
By the way, when a substrate is loaded and unloaded on the substrate stage 3 by a known vacuum transfer means that can move in a three-dimensional direction and is provided with a fork-shaped arm at the tip, a plurality of locations on the substrate platform 31 are used. If the substrate S can be supported and supported at a predetermined height, the structure of the vacuum transfer means can be simplified. In the present embodiment, the three substrate lift means 4 are provided at predetermined positions of the substrate platform 31 corresponding to the vertices of the equilateral triangle so that the substrate S can be lifted horizontally.
[0025]
Referring to FIG. 3, the substrate lift means 4 has a hollow cylindrical guide member 41 screwed from below into a through hole 31 a provided in the substrate platform 31. In this case, the lower end portion of the guide member 41 protrudes from the back surface of the substrate platform 31. A lift pin 42 is inserted into the guide member 41. The lift pin 42 includes a lower pin 42a having a flange 42c at an upper portion and an upper pin 42b connected to the flange 42c. In this case, the lift pins 42 are integrally formed from a material having heat resistance and mechanical strength, for example, ceramics even in a vacuum. In particular, the material of the lift pins 42 is preferably a heat-resistant material such as high-purity alumina ceramics in consideration of the fact that the substrate stage 3 is heated.
[0026]
The length dimension of the upper pin 42b is such that the upper end surface of the upper pin 42b is the upper surface of the substrate mounting portion 31 when the flange 42c comes into contact with a bent portion 41a in which the lower end of the guide member 41 is bent inward. The upper pins 42b are sized so that they are slightly lower than the substrate placement portion 31. On the other hand, when the substrate stage 3 is in the substrate transfer position, the lower pin 42a engages with the stopper 14 provided on the bottom surface of the vacuum chamber 11 when the substrate stage 3 is in the substrate transfer position, and the upper pin 42b It is dimensioned so as to protrude by a predetermined height from the upper surface. The lower end of the lower pin 42a is preferably rounded.
[0027]
Further, a hole through which the lower pin 42a protruding from the guide member 41 penetrates so that the guide pin 41 loosens as the substrate stage 3 moves up and down and the lift pin 42 and the guide member 41 do not rattle when moving up and down. You may provide the 2nd guide member 5 provided with. Thereby, it can prevent that the lift pin 42 and the guide member 41 fall. Furthermore, when the guide member 41 moves up and down, the outer peripheral surface of the flange 42c may be spherically processed so that the frictional resistance increases and the smooth movement of the guide member 41 with respect to the lift pin 42 is not hindered. The inner peripheral surface may be mirror-finished.
[0028]
As shown in FIG. 4, a weight 43 may be provided at the lower end of the lower pin 42a, and a spring 44 may be provided between the weight 43 and the guide member 41 to urge the lift pin 42 downward. .
[0029]
Next, the operation of the substrate lift means 4 will be described. In the substrate transfer position of the substrate stage 3 shown in FIG. 1, the lower pin 42 a protruding from the lower end surface of the guide member 41 is in contact with the stopper 14, so that the upper pin 42 b extends from the upper surface of the substrate platform 31. It protrudes. In this state, the gate valve provided at the substrate transfer port 13 is opened, and a predetermined substrate S is loaded onto the substrate platform 31 by the vacuum transfer means. When the substrate S is loaded and the gate valve is closed, the substrate stage 3 is raised.
[0030]
Here, even if the substrate stage 3 is raised, the lift pin 42 does not start to move at the beginning, but the guide member 41 attached to the substrate platform 31 rises, so that the substrate S, the substrate platform 31, The distance between is shortened. When the flange 42c comes into contact with the bent portion 41a of the guide member 41, the substrate S is placed on the substrate placing portion 31 and the substrate stage 3 reaches the process position. In this case, most of the lower pin 42 a protrudes from the lower end surface of the guide member 41.
[0031]
When the substrate stage 3 is lowered after the predetermined CVD process is completed at the process position, the lower end surface of the lower pin 42 a protruding from the lower end surface of the guide member 41 first comes into contact with the stopper 14. When the lower pin 42a comes into contact with the stopper 14, the lift pin 42 no longer descends. For this reason, as the substrate stage 3 is lowered, the upper pin 42 b protrudes from the upper surface of the substrate platform 31, thereby raising the substrate S. When the substrate stage 3 reaches the substrate transfer position, the substrate S is carried from the substrate platform 31 at a predetermined height. Then, the substrate S is unloaded by the vacuum transfer means, and a new substrate is loaded.
[0032]
Thereby, each substrate lift means 4 can raise and lower the substrate S on the substrate stage 3 only by raising and lowering the substrate stage 3, and a separate driving means is not necessary.
[0033]
【The invention's effect】
As described above, according to the present invention, the substrate lifting means can be manufactured at a low cost with a small number of parts, and has high durability. In addition, the substrate lifting means can be easily mounted even if the substrate stage can be raised and lowered.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a substrate processing apparatus of the present invention in which a substrate stage is in a substrate transfer position. FIG. 2 is a cross-sectional view of the substrate processing apparatus of the present invention in which a substrate stage is in a process position. FIG. 4 is a diagram showing another modification of the substrate lifting means.
1 Substrate processing equipment (CVD equipment)
3 Substrate stage 4 Substrate lift means 41 Guide member 42 Lift pin

Claims (3)

Has a chamber, into the chamber, a substrate stage which is provided vertically movably between the substrate transfer position the process position and a substrate loading may perform unloading for performing predetermined processing,
At least one substrate lifting means provided on the substrate stage ;
A substrate processing apparatus comprising a stopper provided below the substrate stage in the chamber;
The substrate lift means comprises a cylindrical guide member mounted in a through-hole formed in the substrate stage, and lift pins that are movably inserted into the guide member and project downward from the lower end of the substrate stage. And
When the substrate stage is moved to the substrate transfer position, the lift pins and the stoppers are engaged, and as the substrate stage is lowered, the lift pins protrude upward from the substrate stage to carry the substrate at a predetermined height. When the substrate stage is moved to the load / unload position, the engagement between the lift pin and the stopper is released, and the lift pin is accommodated in the guide member as the substrate stage rises, and the substrate stage is moved to the substrate stage. In what the substrate is placed on ,
A portion of the lift pin protruding downward from the lower end of the substrate stage has a hole through which a second guide member for preventing the lift pin and the guide member from falling off the through hole is spaced from the lower end of the guide member by a predetermined distance. substrate processing apparatus is characterized in that provided it exists a. When the substrate stage is moved from the substrate transfer position to the process position, moving means for moving the lift pin downward is provided, the moving means includes a weight provided at a lower end portion of the lift pin, the weight The substrate processing apparatus according to claim 1, comprising a spring contracted between the guide member and the guide member.   The lift pin is composed of a lower pin having a flange on the upper part and an upper pin connected to the flange. When the substrate stage is in the process position, the flange bends the lower end of the guide member inward. The substrate processing apparatus according to claim 1, wherein the upper end surface of the upper pin is flush with an upper surface of the substrate stage.

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