JP4151799B2 - モザイク研磨パッド及びこれに関連する方法 - Google Patents

モザイク研磨パッド及びこれに関連する方法 Download PDF

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Publication number
JP4151799B2
JP4151799B2 JP54832798A JP54832798A JP4151799B2 JP 4151799 B2 JP4151799 B2 JP 4151799B2 JP 54832798 A JP54832798 A JP 54832798A JP 54832798 A JP54832798 A JP 54832798A JP 4151799 B2 JP4151799 B2 JP 4151799B2
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Japan
Prior art keywords
pad
tiles
polishing
tile
mosaic
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Expired - Fee Related
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JP54832798A
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English (en)
Japanese (ja)
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JP2002504864A5 (enExample
JP2002504864A (ja
Inventor
ジョン ヴィー．エイチ． ロバーツ
リー メルボルン クック
デヴィッド ビー． ジェームス
ハインツ エフ． ラインハート
Original Assignee
ローム アンド ハース エレクトロニック マテリアルズ シーエムピー ホウルディングス インコーポレイテッド
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Publication of JP2002504864A publication Critical patent/JP2002504864A/ja
Publication of JP2002504864A5 publication Critical patent/JP2002504864A5/ja
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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/26—Lapping pads for working plane surfaces characterised by the shape of the lapping pad surface, e.g. grooved
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B41/00—Component parts such as frames, beds, carriages, headstocks
    • B24B41/04—Headstocks; Working-spindles; Features relating thereto
    • B24B41/047—Grinding heads for working on plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D7/00—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor
    • B24D7/06—Bonded abrasive wheels, or wheels with inserted abrasive blocks, designed for acting otherwise than only by their periphery, e.g. by the front face; Bushings or mountings therefor with inserted abrasive blocks, e.g. segmental
    • B24D7/066—Grinding blocks; their mountings or supports

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
JP54832798A 1997-05-09 1998-05-08 モザイク研磨パッド及びこれに関連する方法 Expired - Fee Related JP4151799B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US4610497P 1997-05-09 1997-05-09
US60/046,104 1997-05-09
PCT/US1998/009037 WO1998050201A1 (en) 1997-05-09 1998-05-08 Mosaic polishing pads and methods relating thereto

Publications (3)

Publication Number Publication Date
JP2002504864A JP2002504864A (ja) 2002-02-12
JP2002504864A5 JP2002504864A5 (enExample) 2005-11-24
JP4151799B2 true JP4151799B2 (ja) 2008-09-17

Family

ID=21941643

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54832798A Expired - Fee Related JP4151799B2 (ja) 1997-05-09 1998-05-08 モザイク研磨パッド及びこれに関連する方法

Country Status (6)

Country Link
US (1) US6019666A (enExample)
EP (1) EP1007283A4 (enExample)
JP (1) JP4151799B2 (enExample)
KR (1) KR100485846B1 (enExample)
CN (1) CN1118354C (enExample)
WO (1) WO1998050201A1 (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200276685A1 (en) * 2019-02-28 2020-09-03 Kevin H. Song Controlling Chemical Mechanical Polishing Pad Stiffness By Adjusting Wetting in the Backing Layer

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KR100598090B1 (ko) * 1999-08-25 2006-07-07 삼성전자주식회사 폴리싱 면의 균일성을 얻기 위한 화학적 기계적 폴리싱 시스템
US6848970B2 (en) * 2002-09-16 2005-02-01 Applied Materials, Inc. Process control in electrochemically assisted planarization
US7059948B2 (en) * 2000-12-22 2006-06-13 Applied Materials Articles for polishing semiconductor substrates
US6390891B1 (en) * 2000-04-26 2002-05-21 Speedfam-Ipec Corporation Method and apparatus for improved stability chemical mechanical polishing
US6561891B2 (en) 2000-05-23 2003-05-13 Rodel Holdings, Inc. Eliminating air pockets under a polished pad
DE60110226T2 (de) 2000-06-30 2006-03-09 Rohm and Haas Electronic Materials CMP Holdings, Inc., Wilmington Unterlage für polierscheibe
US6612917B2 (en) 2001-02-07 2003-09-02 3M Innovative Properties Company Abrasive article suitable for modifying a semiconductor wafer
US6632129B2 (en) 2001-02-15 2003-10-14 3M Innovative Properties Company Fixed abrasive article for use in modifying a semiconductor wafer
US6673220B2 (en) * 2001-05-21 2004-01-06 Sharp Laboratories Of America, Inc. System and method for fabricating silicon targets
US7070480B2 (en) * 2001-10-11 2006-07-04 Applied Materials, Inc. Method and apparatus for polishing substrates
US20030194959A1 (en) * 2002-04-15 2003-10-16 Cabot Microelectronics Corporation Sintered polishing pad with regions of contrasting density
EP1594656B1 (en) * 2003-02-18 2007-09-12 Parker-Hannifin Corporation Polishing article for electro-chemical mechanical polishing
US7086932B2 (en) * 2004-05-11 2006-08-08 Freudenberg Nonwovens Polishing pad
JP2005019669A (ja) * 2003-06-26 2005-01-20 Matsushita Electric Ind Co Ltd 研磨パッド、研磨装置、及びウェハの研磨方法
JP2005294412A (ja) * 2004-03-31 2005-10-20 Toyo Tire & Rubber Co Ltd 研磨パッド
CN100436060C (zh) * 2004-06-04 2008-11-26 智胜科技股份有限公司 研磨垫及其制造方法
TWI254354B (en) * 2004-06-29 2006-05-01 Iv Technologies Co Ltd An inlaid polishing pad and a method of producing the same
US7252582B2 (en) * 2004-08-25 2007-08-07 Jh Rhodes Company, Inc. Optimized grooving structure for a CMP polishing pad
CN100513082C (zh) * 2004-10-06 2009-07-15 拉杰夫·巴贾 用于改善的化学机械抛光的方法和设备
WO2006057713A2 (en) * 2004-11-29 2006-06-01 Rajeev Bajaj Electro-method and apparatus for improved chemical mechanical planarization pad with uniform polish performance
WO2006057720A1 (en) * 2004-11-29 2006-06-01 Rajeev Bajaj Method and apparatus for improved chemical mechanical planarization pad with pressure control and process monitor
US20080318505A1 (en) * 2004-11-29 2008-12-25 Rajeev Bajaj Chemical mechanical planarization pad and method of use thereof
US20070224925A1 (en) * 2006-03-21 2007-09-27 Rajeev Bajaj Chemical Mechanical Polishing Pad
US7846008B2 (en) * 2004-11-29 2010-12-07 Semiquest Inc. Method and apparatus for improved chemical mechanical planarization and CMP pad
US7815778B2 (en) * 2005-11-23 2010-10-19 Semiquest Inc. Electro-chemical mechanical planarization pad with uniform polish performance
US20090061744A1 (en) * 2007-08-28 2009-03-05 Rajeev Bajaj Polishing pad and method of use
US7762871B2 (en) * 2005-03-07 2010-07-27 Rajeev Bajaj Pad conditioner design and method of use
US8398463B2 (en) * 2005-03-07 2013-03-19 Rajeev Bajaj Pad conditioner and method
US7179159B2 (en) * 2005-05-02 2007-02-20 Applied Materials, Inc. Materials for chemical mechanical polishing
KR100711010B1 (ko) * 2005-06-14 2007-04-25 한국화학연구원 지르코늄 산화물 박막 제조 방법
JP4712539B2 (ja) * 2005-11-24 2011-06-29 ニッタ・ハース株式会社 研磨パッド
US20070128991A1 (en) * 2005-12-07 2007-06-07 Yoon Il-Young Fixed abrasive polishing pad, method of preparing the same, and chemical mechanical polishing apparatus including the same
JP5100225B2 (ja) * 2006-11-06 2012-12-19 株式会社ジェイテクト 傾斜溝入り砥石及びその製造方法
JP4999560B2 (ja) * 2007-06-07 2012-08-15 豊田バンモップス株式会社 研削盤における砥石軸装置
US9180570B2 (en) 2008-03-14 2015-11-10 Nexplanar Corporation Grooved CMP pad
TWI449597B (zh) * 2008-07-09 2014-08-21 Iv Technologies Co Ltd 研磨墊及其製造方法
KR20100096459A (ko) * 2009-02-24 2010-09-02 삼성전자주식회사 화학적 기계적 연마장치
TWI535527B (zh) * 2009-07-20 2016-06-01 智勝科技股份有限公司 研磨方法、研磨墊與研磨系統
US20120302148A1 (en) 2011-05-23 2012-11-29 Rajeev Bajaj Polishing pad with homogeneous body having discrete protrusions thereon
KR20140037891A (ko) * 2011-07-15 2014-03-27 도레이 카부시키가이샤 연마 패드
US9067297B2 (en) 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with foundation layer and polishing surface layer
US9067298B2 (en) 2011-11-29 2015-06-30 Nexplanar Corporation Polishing pad with grooved foundation layer and polishing surface layer
JP5923353B2 (ja) * 2012-03-21 2016-05-24 富士紡ホールディングス株式会社 研磨パッド用シート及びその製造方法、研磨パッド及びその製造方法、並びに研磨方法
US9597769B2 (en) 2012-06-04 2017-03-21 Nexplanar Corporation Polishing pad with polishing surface layer having an aperture or opening above a transparent foundation layer
US10226853B2 (en) 2013-01-18 2019-03-12 Applied Materials, Inc. Methods and apparatus for conditioning of chemical mechanical polishing pads
TWI599447B (zh) 2013-10-18 2017-09-21 卡博特微電子公司 具有偏移同心溝槽圖樣之邊緣排除區的ｃｍｐ拋光墊
CN103551961A (zh) * 2013-11-04 2014-02-05 无锡雨田精密工具有限公司 一种机夹切削打磨刀具
US11685013B2 (en) * 2018-01-24 2023-06-27 Taiwan Semiconductor Manufacturing Company, Ltd. Polishing pad for chemical mechanical planarization
EP3616840B1 (en) * 2018-09-03 2024-10-30 3M Innovative Properties Company Abrasive article
CN110802508B (zh) * 2019-11-12 2021-08-24 西安奕斯伟硅片技术有限公司 抛光垫及化学机械抛光设备

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20200276685A1 (en) * 2019-02-28 2020-09-03 Kevin H. Song Controlling Chemical Mechanical Polishing Pad Stiffness By Adjusting Wetting in the Backing Layer
US12257664B2 (en) * 2019-02-28 2025-03-25 Applied Materials, Inc. Controlling chemical mechanical polishing pad stiffness by adjusting wetting in the backing layer

Also Published As

Publication number Publication date
CN1255080A (zh) 2000-05-31
US6019666A (en) 2000-02-01
EP1007283A1 (en) 2000-06-14
KR100485846B1 (ko) 2005-04-28
WO1998050201A1 (en) 1998-11-12
EP1007283A4 (en) 2002-05-08
JP2002504864A (ja) 2002-02-12
KR20010012359A (ko) 2001-02-15
CN1118354C (zh) 2003-08-20

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