JP4147588B2 - Led冷却モジュール - Google Patents
Led冷却モジュール Download PDFInfo
- Publication number
- JP4147588B2 JP4147588B2 JP2004088787A JP2004088787A JP4147588B2 JP 4147588 B2 JP4147588 B2 JP 4147588B2 JP 2004088787 A JP2004088787 A JP 2004088787A JP 2004088787 A JP2004088787 A JP 2004088787A JP 4147588 B2 JP4147588 B2 JP 4147588B2
- Authority
- JP
- Japan
- Prior art keywords
- heat
- led
- receiving plate
- air
- cooling module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000001816 cooling Methods 0.000 title claims description 38
- 238000007664 blowing Methods 0.000 claims description 30
- 239000000758 substrate Substances 0.000 claims description 27
- 229910052751 metal Inorganic materials 0.000 description 23
- 239000002184 metal Substances 0.000 description 23
- 230000005855 radiation Effects 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000012530 fluid Substances 0.000 description 5
- 229910052782 aluminium Inorganic materials 0.000 description 4
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 4
- 230000001965 increasing effect Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 230000007423 decrease Effects 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000020169 heat generation Effects 0.000 description 2
- 230000002452 interceptive effect Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000004512 die casting Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 230000004043 responsiveness Effects 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 229920003002 synthetic resin Polymers 0.000 description 1
- 239000000057 synthetic resin Substances 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Images
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
2 金属基板(基板)
4 受熱プレート(接続部)
5 ヒートパイプ
11 モジュール本体
12 ケーシング(外郭部材)
13 カバー部材(外郭部材)
16 送風部
17,18 吸気孔
19 排気孔
21 放熱部
Claims (3)
- 送風部と、LEDを装着した基板の接続部と、前記送風部からの風が吹き付けられる放熱部とを備え、前記接続部と前記放熱部との間を熱輸送体で接続し、前記接続部と前記送風部の部材を共通部品で一体形成し、前記熱輸送体の他に前記接続部から前記送風部の部材へ熱移動を可能にしたことを特徴とするLED冷却モジュール。
- 前記送風部に複数の排気孔を備え、前記各排気孔の一部または全てに前記放熱部を各々設けたことを特徴とする請求項1記載のLED冷却モジュール。
- 前記送風部はモジュール本体に設けられ、該モジュール本体は前記送風部と対向する両面に吸気孔を設けたことを特徴とする請求項1または2記載のLED冷却モジュール。
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004088787A JP4147588B2 (ja) | 2004-03-25 | 2004-03-25 | Led冷却モジュール |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2004088787A JP4147588B2 (ja) | 2004-03-25 | 2004-03-25 | Led冷却モジュール |
Publications (2)
Publication Number | Publication Date |
---|---|
JP2005276646A JP2005276646A (ja) | 2005-10-06 |
JP4147588B2 true JP4147588B2 (ja) | 2008-09-10 |
Family
ID=35176077
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2004088787A Expired - Lifetime JP4147588B2 (ja) | 2004-03-25 | 2004-03-25 | Led冷却モジュール |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP4147588B2 (ja) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101243772B1 (ko) * | 2011-04-27 | 2013-03-14 | 부경대학교 산학협력단 | 차량용 엘이디 헤드램프 방열장치 |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100767678B1 (ko) * | 2005-10-10 | 2007-10-17 | 엘지전자 주식회사 | Led 냉각 시스템 |
CN100429457C (zh) * | 2005-10-17 | 2008-10-29 | 李旭明 | Led灯具 |
KR100704669B1 (ko) * | 2006-01-06 | 2007-04-09 | 삼성전자주식회사 | 발광다이오드 냉각장치 및 이를 이용한 디스플레이장치 |
KR100879749B1 (ko) * | 2007-05-24 | 2009-01-21 | 장인성 | 고용량 엘이디램프의 냉각장치 |
JP4927650B2 (ja) * | 2007-06-25 | 2012-05-09 | 古河電気工業株式会社 | 面上発熱源の放熱構造体 |
KR100922433B1 (ko) | 2009-04-07 | 2009-10-16 | (주)브이엘시스템 | 히트파이프를 이용한 엘이디 조명장치의 방열구조 |
KR101110125B1 (ko) * | 2009-08-28 | 2012-01-31 | 주식회사 케이에스비 | 냉각 쿨러를 구비하는 엘이디 조명등 |
JP5488801B2 (ja) * | 2009-12-25 | 2014-05-14 | 株式会社デンソー | 表示装置 |
JP2012253175A (ja) * | 2011-06-02 | 2012-12-20 | Mitsubishi Electric Corp | 発光素子の温度制御装置及びこれを用いたディスプレイ装置 |
JP6845401B2 (ja) * | 2017-10-25 | 2021-03-17 | 株式会社Smaco技術研究所 | 冷却装置およびその冷却装置を備えた冷却システム |
-
2004
- 2004-03-25 JP JP2004088787A patent/JP4147588B2/ja not_active Expired - Lifetime
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR101243772B1 (ko) * | 2011-04-27 | 2013-03-14 | 부경대학교 산학협력단 | 차량용 엘이디 헤드램프 방열장치 |
Also Published As
Publication number | Publication date |
---|---|
JP2005276646A (ja) | 2005-10-06 |
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