JP4143369B2

JP4143369B2 - Plating peeling apparatus and plating peeling method

Info

Publication number: JP4143369B2
Application number: JP2002259576A
Authority: JP
Inventors: 正久佐藤; 茂樹岩本
Original assignee: Shinko Electric Industries Co Ltd
Current assignee: Shinko Electric Industries Co Ltd
Priority date: 2002-09-05
Filing date: 2002-09-05
Publication date: 2008-09-03
Anticipated expiration: 2022-09-05
Also published as: JP2004099920A

Description

【０００１】
【発明の属する技術分野】
本発明は、電解剥離液が入れられる剥離処理槽と、剥離処理槽内に、電解剥離液に浸されるように配設された、陰極に印加される電極板とを備え、陽極に印加されるワークを前記剥離処理槽内の電解剥離液中に入れて、ワークに施されためっきを電解剥離するめっき剥離装置およびそれを用いためっき剥離方法に関する。
【０００２】
【従来の技術】
半導体装置に用いられる、鉄を主成分とするリードフレームの一部（多くはステージやインナーリードの部分）に、銀めっきを施す処理が、従来より行われている。鉄を主成分とするリードフレームには、直接銀めっきは付きにくいため、この処理は、以下の様な工程を踏んで行われている。
まず、長尺の金属板から形成されたリードフレームＷの全表面に銅めっきを施す。次いで、リードフレームＷのステージやインナーリード等、銀めっきを施したい箇所に、銀めっきを部分めっきする。銀めっきを、銅めっきの上層に施すことにより、好適に銀めっきを付着させることが可能となる。次いで、リードフレームＷを銅めっきの電解剥離液に浸して銅めっきの電解剥離を施すことで、銀めっきを施した部位以外の露出している銅めっきを剥離することができ、一部のみに銀めっきが施されたリードフレームＷを得る。
【０００３】
図４〜図６は、上記工程における、ワークとしての平板状のリードフレームＷに施された銅めっきを電解剥離する従来のめっき剥離装置の例を示す図である。従来のめっき剥離装置は、銅めっきの電解剥離液９６が入れられる剥離処理槽９２と、剥離処理槽９２内に、電解剥離液９６に浸されるように配設され、電源装置９５の電極に接続されて陰極に印加される電極板９４とを備える。リードフレームＷは、長尺の金属板によって形成され、ローラー９８とローラー９９とにまたがって巻かれ、ローラー９８とローラー９９の中途部のリードフレームＷａは、剥離処理槽９２内の電解剥離液に浸かるように配設される。ローラー９９が図示しない駆動装置によってリードフレームＷを巻き取る方向Ａに回転されることで、ローラー９８が方向Ｂに回転して、ローラー９８から巻き出されたリードフレームＷは、剥離処理槽９２内の電解剥離液９６中に進入し、ローラー９９によって巻き取られる。剥離処理槽９２は、長手方向がリードフレームＷの進行方向に沿うように細長に形成される。また、リードフレームＷは、電源装置９５の電極に接されて陽極に印加される。
【０００４】
図５に、剥離処理槽９２の側断面図を示す。電極板９４は、剥離処理槽９２の、対向する長手の周壁のそれぞれに沿って、電解剥離液９６に浸されるように配設される。対向する電極板９４の間は、リードフレームＷを、板面が水平の状態で進入させることができる間隔にあけられる。これにより、リードフレームＷを捻ることなく、リードフレームＷを電極板９４間に進入させることができる。
【０００５】
電解剥離液９６中で、電極板９４は陰極に印加され、リードフレームＷは陽極に印加されるため、リードフレームＷに施された銅めっきは、電解剥離されて、電解剥離液９６中に銅イオンとして溶解する。
【０００６】
なお、水平に配されたリードフレームの上方に、リードフレームと平行となるように陰極板を配するめっき剥離装置も開示されている（特許文献１参照）。
しかしながら、特許文献１に開示された不要メッキ電解剥離装置によると、電解剥離層内にリードフレームを搬送する平ベルトコンベアを配すると共に、電解剥離層の側面にリードフレームが通過するスリットを設けて、そのスリットから電解剥離液が漏れ出さないようにシールする必要がある等、装置の構成が複雑となる。
【０００７】
【特許文献１】
特開平１１−１２７９３号公報（第１図）
【０００８】
【発明が解決しようとする課題】
図４〜図６に示した上記従来のめっき剥離装置およびめっき剥離方法によると、図５に示すように、電解剥離液９６中に溶け出した銅イオンの一部が、陰極に印加された電極板９４に析出して、電極板９４上にめっきカスＳが形成される。めっきカスＳは、ある程度の大きさに成長すると、図６に示すように電極板９４から離れて電解剥離液９６を浮遊し、その一部がリードフレームＷに付着する場合がある。特に、平板状のリードフレームＷを、板面を水平にしてめっき剥離を行うと、リードフレームＷの上面にめっきカスＳが載りやすい。また、特に、めっき剥離の効率を上げるために、電解剥離液９６を攪拌しながらめっき剥離を行う場合に、電極板９４に析出しためっきカスＳは、電極板９４を離れて電解剥離液９６中に浮遊しやすく、リードフレームＷに付着しやすくなる。
このため、上記従来のめっき剥離装置およびめっき剥離方法においては、リードフレームＷにめっきカスＳが付着することにより、リード間にめっきカスＳが挟まってリードショートを起こす等、リードフレームＷの不良を招くという課題がある。
【０００９】
また、上記従来のめっき剥離装置およびめっき剥離方法においては、図６に示すように、電極板９４は、剥離処理槽９２の対向する周壁のそれぞれに沿って鉛直に配設され、平板状のリードフレームＷは、水平方向に対向する電極板９４の間に、板面が水平の状態で進入する。
従って、電極板９４とリードフレームＷの幅方向の端部（縁部）との間の電流経路ｃは、幅方向の中央部との間の電流経路ｄに比較して、非常に近くなる。このため、リードフレームの幅方向の端部（縁部）は、電流がより流れやすくなって電流密度が高くなり、めっきの剥離量が多くなる。
このため、上記従来のめっき剥離装置およびめっき剥離方法においては、リードフレームＷの幅方向の端部と中央部とで、めっき剥離後のめっき厚（めっき剥離量）の不均等が生じるという課題がある。
【００１０】
本発明は上記課題を解決すべくなされ、その目的とするところは、ワークにめっきカスが付きにくいと共に、ワークの電極板側の端部と中央部とで、めっき剥離量の差を小さく抑えることのできるめっき剥離装置およびめっき剥離方法を提供することにある。
【００１１】
【課題を解決するための手段】
本発明に係るめっき剥離装置は、上記課題を解決するために、以下の構成を備える。すなわち、電解剥離液が入れられた剥離処理槽と、該電解剥離液に浸されるように前記剥離処理槽の内周壁に沿って配設され、陰極に印加される電極板とを備え、陽極に印加される平板状のワークを前記剥離処理槽内の電解剥離液中に、前記電極板に対して直角状態で進入し、該ワークに施されためっきを電解剥離するめっき剥離装置であって、前記ワークから電解剥離しためっきが前記電極板上に析出して形成されためっきカスがワークに付着しないように、前記剥離処理槽内で該電極板と該ワークとを隔てるメッシュ部材が、前記剥離処理槽内を縦断するように配設され、かつ前記剥離処理液がワーク側からメッシュ部材を通過して電極板側に流れるように、前記剥離処理槽の内周壁の下部または該メッシュ部材で隔てられた電極板側の底壁に形成された、前記電極板近傍のめっきカスを含む剥離処液を排出する剥離液排出口と、該剥離液排出口から排出された電解剥離液中のめっきカスを濾過する濾過手段と、該濾過手段で濾過した電解剥離液を前記メッシュ部材で隔てられたワーク側の剥離処理槽内に再供給する剥離液供給口とを具備する剥離液供給手段が設けられていることを特徴とする。
これによれば、電極板とワークとがメッシュ部材によって隔てられるため、電極板上に析出しためっきカスがワークへ浮遊していって付着するのを防ぐことができる。
さらに、電極板とメッシュ部材とを、剥離処理槽の周壁に沿ってコンパクトに設けることができると共に、剥離処理槽内に入れられたワークに電極板を好適に対向させることができる。
また、剥離処理槽内の電解剥離液を随時濾過してめっきカス等を除去することができると共に、メッシュ部材で隔てられた剥離処理槽内の、ワークが位置する側から、電極板が位置する側へ、電解剥離液の流れを発生させて、電極板に析出しためっきカスがワークに向かって流れるのを防ぐことができる。
【００１２】
さらに、剥離液供給口を、剥離処理槽内に水平状に進入されたワークの下面側に剥離液が噴きつけられるように設けることによって、ワークの下面側に施されためっきを効率的に剥離できる。
【００１３】
ワークとして、長尺状の金属板のワークを用い、剥離処理槽をワークの進行方向に沿うように細長に形成することによって、長尺状のワークを効率的に処理できる。
【００１４】
かかるワークとして、リードフレームを用い、二個のローラの一方側のローラから他方側のローラに巻き取られるリードフレームが、剥離処理液に浸されるように剥離処理槽を配設することによって、リードフレームを捩ることなく剥離処理槽内に進入できる。
【００１５】
また、電極板とワークとの間に配設し、該電極板とワークとの間の電流経路を迂回させる絶縁部材を設けることによって、電極板とワークとを結ぶ電流経路が、絶縁部材を回りこんで迂回するようになる。そのため、ワークの電極板側の端部と中央部とで、電極板からの電流経路の長さの差を小さくすることができ、電流密度がより均一となるため、めっき剥離量の差を小さく抑えることができる。
【００１６】
かかる前記絶縁部材としては、板状に形成されて板面が鉛直に配設され、下端部が前記ワーク側に折れ曲がって形成されているものを好適に用いることができる。
これによれば、電極板とワークの電極板側の端部とを結ぶ電流経路は、絶縁部材の下端部の折れ曲がった部分を回りこむためにより長くなり、ワークの電極板側の端部と中央部との電極板からの電流経路の長さの差を、より小さくすることができる。
【００１７】
また、本発明に係るめっき剥離方法は、上記課題を解決するために、以下の構成を備える。すなわち、前述しためっき剥離装置を用い、前記電極板を陰極に印加し、前記ワークを陽極に印加した状態で、該ワークを前記剥離処理槽内の電解剥離液中に入れて、該ワークに施されためっきを電解剥離することを特徴とする。
【００１８】
【発明の実施の形態】
以下、本発明に係るめっき剥離装置およびめっき剥離方法の好適な実施の形態を図面に基づいて詳細に説明する。
図１は、本発明に係るめっき剥離装置の実施の形態の正面説明図である。本実施の形態のめっき剥離装置は、ワークとしての平板状のリードフレームＷに施されためっきを電解剥離する装置である。本めっき剥離装置は、電解剥離液６が入れられる剥離処理槽２と、剥離処理槽２内に、電解剥離液６に浸されるように配設され、電源装置５の電極に接続されて陰極に印加される電極板４とを備える。リードフレームＷは、長尺の金属板によって形成され、ローラー８とローラー９とにまたがって巻かれ、ローラー８とローラー９の中途部のリードフレームＷａは、剥離処理槽２内の電解剥離液６に浸かるように配設される。ローラー９が図示しない駆動装置によってリードフレームＷを巻き取る方向Ａに回転されることで、ローラー８が方向Ｂに回転して、ローラー８から巻き出されたリードフレームＷは、剥離処理槽２内の電解剥離液６中に進入し、ローラー９によって巻き取られる。剥離処理槽２は、長手方向がリードフレームＷの進行方向に沿うように細長に形成される。また、リードフレームＷは、電源装置９５の電極に接されて陽極に印加される。
【００１９】
図２に、剥離処理槽２の側断面図を示す。電極板４は、剥離処理槽２の、対向する長手の周壁のそれぞれに沿って、電解剥離液６に浸されるように鉛直に配設される。対向する電極板４の間は、リードフレームＷを、板面が水平の状態で進入させることができる間隔があけられる。これにより、リードフレームＷを捻ることなく、リードフレームＷを電極板４間に進入させることができる。
【００２０】
本発明に係るめっき剥離装置は、図２に示すように、剥離処理槽２内で電極板４とリードフレームＷとを隔てるように配設されたメッシュ部材１０を備える。メッシュ部材１０は、例えば樹脂で構成され、細かい網目をもつ板状に形成される。メッシュ部材１０は、上端が液面上に露出して、下端は剥離処理槽２の底面に当接し、剥離処理槽２を上下に縦断するように設けられる。メッシュ部材１０は、電極板４に沿って、電極板４の内側に設けられ、剥離処理槽２内を幅方向に分断して、剥離処理槽２内で電極板４とリードフレームＷとを隔てる。なお、メッシュ部材１０は、剥離処理槽２の長手方向に所定間隔をあけて、剥離処理槽２の底面に固定されて上方に延びる図示しない支持部材に支持されている。
【００２１】
また、図１および図２に示すように、剥離処理槽２の、電極板４が沿う周壁の下部には、電解剥離液６を排出する剥離液排出口２ａとしての開口部が複数設けられている。剥離処理槽２の外側の剥離液排出口２ａの下側には、剥離液排出口２ａから排出された電解剥離液６を受ける液受部１４ａが設けられる。液受部１４ａで受けられた電解剥離液６は、液受部１４ａの底面に接続するパイプ１４ｂを介してポンプ１４ｄによって吸われ、パイプ１４ｅを介して剥離処理槽２の底面に設けられた剥離液供給口２ｂから再供給される（剥離液供給手段）。なお、剥離液供給口２ｂは、メッシュ部材１０で隔てられた剥離処理槽２内の、リードフレームＷが位置する側の底面に設けられる。また、剥離液供給口２ｂに繋がるパイプ１４ｅは、電解剥離液６がリードフレームＷの下面に向かうよう上方に向かって設けられる。
また、パイプ１４ｂには、濾過手段としてのフィルタ１４ｃが設けられ、パイプ１４ｂ内を通過する電解剥離液６に含まれるめっきカスＳやごみ等が除去される。
【００２２】
また、本発明に係るめっき剥離装置は、図２に示すように、メッシュ部材１０のリードフレームＷ側の側面に、絶縁部材としての絶縁板１２が設けられる。絶縁板１２は、樹脂等の絶縁体で板状に形成される。絶縁板１２は、リードフレームＷと電極板４との間に、電極板４の長手方向に沿って設けられ、上端が電解剥離液６の液面上に露出して鉛直に配設され、下端部が、リードフレームＷ側、即ち内側、さらに言い換えると電極板４の反対側に折れ曲がって形成されている。
【００２３】
本実施の形態に係るめっき剥離装置によれば、図３に示す様に、電極板４上に析出して電解剥離液６中に浮遊するめっきカスＳは、メッシュ部材１０によって遮られて、リードフレームＷに達するのを妨げられる。
さらに、本めっき剥離装置においては、メッシュ部材１０で隔てられた剥離処理槽２内の、リードフレームＷが位置する側の剥離液供給口２ｂより電解剥離液６を供給すると共に、剥離処理槽２内の電極板４が位置する側の剥離液排出口２ａから電解剥離液６を排出している。このため、剥離処理槽２内の電解剥離液６には、メッシュ部材１０を挟んでリードフレームＷが位置する側と電極板４が位置する側とで水圧差が生じ、電解剥離液６はリードフレームＷが位置する側から電極板４が位置する側へ流れる（図３の矢印Ｃ）ため、電極板４が位置する側にあるめっきカスＳが、メッシュ部材１０を通過してリードフレームＷが位置する側に浮遊していくのを、より効果的に防ぐことができる。
【００２４】
また、リードフレームＷは板面が水平になるように剥離処理槽２内に入れられ、リードフレームＷの下面に向かうよう設けられたパイプ１４ｅを介して剥離液供給口２ｂから供給された電解剥離液６は、リードフレームＷの下面に噴きつけられるため、リードフレーム下面に施されためっきをより効率的に剥離することができる。
【００２５】
また、本めっき剥離装置によれば、図３に示す様に、リードフレームＷの電極板４側（幅方向）の端部と、電極板４との間に、絶縁板１２があるために、リードフレームＷと電極板４との間の電流経路は、絶縁板１２を回り込む。これにより、電極板４から、リードフレームＷの電極板４側の端部までの電流経路ａと、リードフレームＷの中央部までの電流経路ｂとの差は、非常に小さいものとなる。従って、リードフレームＷの幅方向端部と中央部との電流密度の差を小さく抑えることができ、めっき剥離量の差を小さく抑えることができる。
【００２６】
なお、本発明に係るめっき剥離装置およびめっき剥離方法は、リードフレームに部分的に銀めっきを施す際の、銀めっきから露出している銅めっきを剥離する工程に用いられるものに限定されず、ワークの種類や形状、めっきの金属の種類、および工程の目的等によらず、めっきを電解剥離する際には広く用いることができるものである。
【００２７】
【発明の効果】
本発明に係るめっき剥離装置およびめっき剥離方法によれば、ワークにめっきカスが付きにくいと共に、ワークの電極板側の端部と中央部とで、めっき剥離量の差を小さく抑えることができるという効果を奏する。
【図面の簡単な説明】
【図１】本発明に係るめっき剥離装置の正面説明図である。
【図２】本発明に係るめっき剥離装置の側断面説明図である。
【図３】本発明に係るめっき剥離装置でめっきを剥離した際の側断面説明図である。
【図４】従来のめっき剥離装置の正面説明図である。
【図５】従来のめっき剥離装置の側断面説明図である。
【図６】従来のめっき剥離装置でめっきを剥離した際の側断面説明図である。
【符号の説明】
２剥離処理槽
２ａ剥離液排出口
２ｂ剥離液供給口
４電極板
５電源装置
６電解剥離液
８、９ローラー
１０メッシュ部材
１２絶縁板（絶縁部材）
１４ａ液受部
１４ｂパイプ
１４ｃフィルタ
１４ｄポンプ
１４ｅパイプ
Ｓめっきカス
Ｗリードフレーム
ａ、ｂ電流経路[0001]
BACKGROUND OF THE INVENTION
The present invention comprises a stripping treatment tank in which an electrolytic stripping solution is placed, and an electrode plate applied to the cathode disposed in the stripping processing bath so as to be immersed in the electrolytic stripping solution. The present invention relates to a plating stripping apparatus and a plating stripping method using the same, in which the workpiece is placed in an electrolytic stripping solution in the stripping treatment tank and the plating applied to the workpiece is electrolytically stripped.
[0002]
[Prior art]
2. Description of the Related Art Conventionally, silver plating is applied to a part of lead frames (mainly portions of stages and inner leads) that are mainly used for semiconductor devices. Since the lead frame containing iron as a main component is not easily subjected to silver plating, this process is performed by the following steps.
First, copper plating is performed on the entire surface of the lead frame W formed of a long metal plate. Next, silver plating is partially plated on the portion of the lead frame W where the silver plating is desired, such as the stage and inner leads. By applying silver plating to the upper layer of copper plating, silver plating can be suitably deposited. Then, by exposing the lead frame W to a copper plating electrolytic stripping solution and performing the copper plating electrolytic stripping, the exposed copper plating other than the silver plated portion can be stripped, and only partly A lead frame W on which silver plating is applied is obtained.
[0003]
4-6 is a figure which shows the example of the conventional plating peeling apparatus which carries out the electrolytic peeling of the copper plating given to the flat lead frame W as a workpiece | work in the said process. The conventional plating stripping apparatus is disposed in a stripping treatment tank 92 in which an electrolytic stripping solution 96 for copper plating is placed, and in the stripping processing tank 92 so as to be immersed in the electrolytic stripping solution 96, and is used as an electrode of the power supply device 95. And an electrode plate 94 connected and applied to the cathode. The lead frame W is formed of a long metal plate, wound around the roller 98 and the roller 99, and the lead frame Wa in the middle of the roller 98 and the roller 99 is used as an electrolytic stripping solution in the stripping treatment tank 92. It is arranged to be immersed. When the roller 99 is rotated in the direction A in which the lead frame W is wound up by a driving device (not shown), the roller 98 is rotated in the direction B, and the lead frame W unwound from the roller 98 is in the peeling treatment tank 92. Enters the electrolytic stripping solution 96 and is wound up by a roller 99. The peeling treatment tank 92 is formed in an elongated shape so that the longitudinal direction is along the traveling direction of the lead frame W. The lead frame W is in contact with the electrode of the power supply device 95 and is applied to the anode.
[0004]
FIG. 5 shows a side sectional view of the peeling treatment tank 92. The electrode plate 94 is disposed so as to be immersed in the electrolytic stripping solution 96 along each of the opposing longitudinal peripheral walls of the stripping treatment tank 92. Between the electrode plates 94 facing each other, the lead frame W is spaced at an interval that allows the lead frame W to enter the plate surface in a horizontal state. Thereby, the lead frame W can be inserted between the electrode plates 94 without twisting the lead frame W.
[0005]
In the electrolytic stripping solution 96, the electrode plate 94 is applied to the cathode and the lead frame W is applied to the anode. Therefore, the copper plating applied to the lead frame W is electrolytically stripped, and the copper in the electrolytic stripping solution 96 is copper. Dissolves as ions.
[0006]
A plating stripping device is also disclosed in which a cathode plate is disposed above a horizontally disposed lead frame so as to be parallel to the lead frame (see Patent Document 1).
However, according to the unnecessary plating electrolytic stripping apparatus disclosed in Patent Document 1, a flat belt conveyor for transporting the lead frame is arranged in the electrolytic stripping layer, and a slit through which the lead frame passes is provided on the side surface of the electrolytic stripping layer. The structure of the apparatus becomes complicated, for example, it is necessary to seal so that the electrolytic stripping solution does not leak from the slit.
[0007]
[Patent Document 1]
Japanese Patent Laid-Open No. 11-12793 (FIG. 1)
[0008]
[Problems to be solved by the invention]
According to the conventional plating stripping apparatus and plating stripping method shown in FIGS. 4 to 6, as shown in FIG. 5, a part of the copper ions dissolved in the electrolytic stripping solution 96 is applied to the cathode. Deposited on the plate 94, the plating residue S is formed on the electrode plate 94. When the plating residue S grows to a certain size, the electrolytic stripping solution 96 may float away from the electrode plate 94 as shown in FIG. 6, and a part thereof may adhere to the lead frame W. In particular, when the flat lead frame W is subjected to plating peeling with the plate surface horizontal, the plating residue S is likely to be placed on the upper surface of the lead frame W. In particular, when the plating stripping is performed while stirring the electrolytic stripping solution 96 in order to increase the plating stripping efficiency, the plating residue S deposited on the electrode plate 94 leaves the electrode plate 94 in the electrolytic stripping solution 96. It tends to float on the lead frame W and easily adheres to the lead frame W.
For this reason, in the above conventional plating stripping apparatus and plating stripping method, the plating residue S adheres to the lead frame W, thereby causing defects in the lead frame W, such as a lead short due to the plating residue S being sandwiched between the leads. There is a problem of inviting.
[0009]
In the conventional plating stripping apparatus and plating stripping method, as shown in FIG. 6, the electrode plate 94 is disposed vertically along each of the opposing peripheral walls of the stripping treatment tank 92, and a flat lead The frame W enters between the electrode plates 94 opposed in the horizontal direction in a state where the plate surface is horizontal.
Therefore, the current path c between the electrode plate 94 and the end portion (edge) in the width direction of the lead frame W is very close to the current path d between the width direction center portion. For this reason, at the end portion (edge portion) in the width direction of the lead frame, the current flows more easily, the current density increases, and the amount of peeling of the plating increases.
For this reason, in the said conventional plating peeling apparatus and plating peeling method, the subject that the plating thickness (plating peeling amount) after plating peeling arises in the edge part and center part of the width direction of the lead frame W arises. is there.
[0010]
The present invention is made to solve the above-mentioned problems, and the object of the present invention is to prevent plating residue from being attached to the workpiece and to suppress the difference in the amount of plating peeling between the end portion and the center portion on the electrode plate side of the workpiece. An object of the present invention is to provide a plating stripping apparatus and a plating stripping method.
[0011]
[Means for Solving the Problems]
The plating peeling apparatus according to the present invention has the following configuration in order to solve the above problems. That includes a stripping treatment bath electrolytic stripping liquid is placed, is disposed along the inner peripheral wall of said stripping processing tank as immersed in electrolytic stripping solution, and an electrode plate which is applied to the cathode A plate peeling device for entering a plate-like workpiece applied to the anode into the electrolytic stripping solution in the stripping treatment tank at a right angle to the electrode plate and electrolytically stripping the plating applied to the workpiece. there are the so workpiece from the electrolyte peeled plating does not adhere to the plated dregs side over click formed by deposition on the electrode plate, mesh separating the said electrode plate and said workpiece in said stripping processing bath A member is disposed so as to cut through the inside of the peeling treatment tank, and the lower part of the inner peripheral wall of the peeling treatment tank so that the peeling treatment liquid flows from the workpiece side to the electrode plate through the mesh member or The electrode plate side separated by the mesh member A stripping solution discharge port for discharging a stripping treatment liquid containing plating residue near the electrode plate formed on the wall; and a filtering means for filtering the plating residue in the electrolytic stripping solution discharged from the stripping solution discharge port; A stripping solution supply means is provided that includes a stripping solution supply port that re-feeds the electrolytic stripping solution filtered by the filtering means into the workpiece side stripping treatment tank separated by the mesh member. .
According to this, since the electrode plate and the workpiece are separated by the mesh member, the plating residue deposited on the electrode plate can be prevented from floating and adhering to the workpiece.
Furthermore, the electrode plate and the mesh member can be provided in a compact manner along the peripheral wall of the peeling treatment tank, and the electrode plate can be suitably opposed to the workpiece placed in the peeling treatment tank.
In addition, the electrolytic stripping solution in the stripping treatment tank can be filtered at any time to remove plating residue and the like, and the electrode plate is located from the side in the stripping treatment tank separated by the mesh member where the workpiece is located. A flow of electrolytic stripping solution can be generated on the side to prevent the plating residue deposited on the electrode plate from flowing toward the workpiece.
[0012]
Furthermore, the plating applied to the lower surface side of the workpiece can be efficiently peeled by providing the stripping solution supply port so that the stripping solution can be sprayed onto the lower surface side of the workpiece that has entered the strip processing tank horizontally. it can.
[0013]
A long workpiece can be efficiently processed by using a long metal plate workpiece as the workpiece and forming the stripping tank in an elongated shape along the traveling direction of the workpiece.
[0014]
By using a lead frame as such work, by disposing a peeling treatment tank so that the lead frame wound up from the roller on one side of the two rollers to the roller on the other side is immersed in the peeling treatment liquid, The lead frame can be entered without twisting the lead frame.
[0015]
Further, by providing an insulating member that is disposed between the electrode plate and the workpiece and bypasses the current path between the electrode plate and the workpiece, the current path connecting the electrode plate and the workpiece passes around the insulating member. I will detour. For this reason, the difference in the length of the current path from the electrode plate can be reduced between the end portion and the center portion on the electrode plate side of the workpiece, and the current density becomes more uniform. Can be suppressed.
[0016]
Such As the insulating member, which is a plate surface disposed vertically formed in a plate shape, it is possible to lower end portion suitably used those formed bent on the workpiece side.
According to this, the current path connecting the electrode plate and the end portion on the electrode plate side of the workpiece becomes longer because it wraps around the bent portion of the lower end portion of the insulating member. The difference in the length of the current path from the electrode plate to the part can be further reduced.
[0017]
Moreover, in order to solve the said subject, the plating peeling method which concerns on this invention is equipped with the following structures. That is, using the plating stripping device described above, with the electrode plate applied to the cathode and the workpiece applied to the anode, the workpiece is placed in the electrolytic stripping solution in the stripping treatment tank and applied to the workpiece. The plated plating is electrolytically stripped.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, preferred embodiments of a plating stripping apparatus and a plating stripping method according to the present invention will be described in detail with reference to the drawings.
FIG. 1 is an explanatory front view of an embodiment of a plating stripping apparatus according to the present invention. The plating stripping apparatus according to the present embodiment is an apparatus that electrolytically strips plating applied to a flat lead frame W as a workpiece. The plating stripping device is disposed in the stripping treatment tank 2 in which the electrolytic stripping solution 6 is put, and in the stripping processing bath 2 so as to be immersed in the electrolytic stripping solution 6, and is connected to the electrode of the power supply device 5 to be a cathode. And an electrode plate 4 to be applied. The lead frame W is formed of a long metal plate and is wound around the roller 8 and the roller 9. The lead frame Wa in the middle of the roller 8 and the roller 9 is the electrolytic stripping solution 6 in the stripping treatment tank 2. It is arrange | positioned so that it may be immersed in. When the roller 9 is rotated in the direction A in which the lead frame W is wound up by a driving device (not shown), the roller 8 rotates in the direction B, and the lead frame W unwound from the roller 8 is in the peeling treatment tank 2. The electrolytic stripping solution 6 enters and is wound up by a roller 9. The stripping treatment tank 2 is formed in an elongated shape so that the longitudinal direction is along the traveling direction of the lead frame W. The lead frame W is in contact with the electrode of the power supply device 95 and is applied to the anode.
[0019]
In FIG. 2, the sectional side view of the peeling process tank 2 is shown. The electrode plate 4 is vertically disposed so as to be immersed in the electrolytic stripping solution 6 along each of the opposing longitudinal peripheral walls of the stripping treatment tank 2. A space is provided between the opposing electrode plates 4 so that the lead frame W can enter with the plate surface horizontal. Thereby, the lead frame W can be inserted between the electrode plates 4 without twisting the lead frame W.
[0020]
As shown in FIG. 2, the plating stripping apparatus according to the present invention includes a mesh member 10 disposed so as to separate the electrode plate 4 and the lead frame W in the stripping treatment tank 2. The mesh member 10 is made of a resin, for example, and is formed in a plate shape having a fine mesh. The mesh member 10 is provided so that the upper end is exposed on the liquid surface, the lower end is in contact with the bottom surface of the peeling treatment tank 2, and the peeling treatment tank 2 is vertically cut. The mesh member 10 is provided inside the electrode plate 4 along the electrode plate 4, divides the inside of the peeling treatment tank 2 in the width direction, and separates the electrode plate 4 and the lead frame W in the peeling treatment tank 2. . The mesh member 10 is supported by a support member (not shown) that is fixed to the bottom surface of the peeling treatment tank 2 and extends upward at a predetermined interval in the longitudinal direction of the peeling treatment tank 2.
[0021]
As shown in FIGS. 1 and 2, a plurality of openings as a stripping solution discharge port 2 a for discharging the electrolytic stripping solution 6 are provided in the lower portion of the peripheral wall along the electrode plate 4 of the stripping treatment tank 2. Yes. A liquid receiving portion 14 a that receives the electrolytic stripping solution 6 discharged from the stripping solution discharge port 2 a is provided below the stripping solution discharge port 2 a outside the stripping treatment tank 2. The electrolytic stripping solution 6 received by the liquid receiving portion 14a is sucked by the pump 14d through the pipe 14b connected to the bottom surface of the liquid receiving portion 14a, and stripped provided on the bottom surface of the stripping treatment tank 2 through the pipe 14e. Re-supplied from the liquid supply port 2b (peeling liquid supply means). The stripping liquid supply port 2b is provided on the bottom surface of the stripping treatment tank 2 separated by the mesh member 10 on the side where the lead frame W is located. The pipe 14 e connected to the stripping solution supply port 2 b is provided upward so that the electrolytic stripping solution 6 is directed to the lower surface of the lead frame W.
The pipe 14b is provided with a filter 14c as a filtering means, and the plating residue S and dust contained in the electrolytic stripping solution 6 passing through the pipe 14b are removed.
[0022]
In addition, as shown in FIG. 2, the plating stripping apparatus according to the present invention is provided with an insulating plate 12 as an insulating member on the side surface of the mesh member 10 on the lead frame W side. The insulating plate 12 is formed in a plate shape with an insulator such as resin. The insulating plate 12 is provided along the longitudinal direction of the electrode plate 4 between the lead frame W and the electrode plate 4, the upper end is exposed vertically on the surface of the electrolytic stripping solution 6, and the lower end is disposed. The portion is formed to be bent on the lead frame W side, that is, on the inner side, in other words, on the opposite side of the electrode plate 4.
[0023]
According to the plating stripping apparatus according to the present embodiment, as shown in FIG. 3, the plating residue S deposited on the electrode plate 4 and floating in the electrolytic stripping solution 6 is blocked by the mesh member 10 and leads to the lead. The frame W is prevented from reaching.
Furthermore, in this plating stripping apparatus, the electrolytic stripping solution 6 is supplied from the stripping solution supply port 2 b on the side where the lead frame W is located in the stripping processing bath 2 separated by the mesh member 10, and the stripping processing bath 2. The electrolytic stripping solution 6 is discharged from the stripping solution discharge port 2a on the side where the inner electrode plate 4 is located. For this reason, the electrolytic stripping solution 6 in the stripping treatment tank 2 has a water pressure difference between the side on which the lead frame W is positioned and the side on which the electrode plate 4 is positioned with the mesh member 10 interposed therebetween. Since the flow from the side where the frame W is located to the side where the electrode plate 4 is located (arrow C in FIG. 3), the plating residue S on the side where the electrode plate 4 is located passes through the mesh member 10 and the lead frame W It is possible to more effectively prevent floating on the side where it is located.
[0024]
The lead frame W is placed in the stripping treatment tank 2 so that the plate surface is horizontal, and the electrolytic stripping supplied from the stripping solution supply port 2b through the pipe 14e provided to face the lower surface of the lead frame W. Since the liquid 6 is sprayed onto the lower surface of the lead frame W, the plating applied to the lower surface of the lead frame can be more efficiently peeled off.
[0025]
Further, according to the present plating stripping apparatus, as shown in FIG. 3, the insulating plate 12 exists between the electrode plate 4 side (width direction) end of the lead frame W and the electrode plate 4. The current path between the lead frame W and the electrode plate 4 goes around the insulating plate 12. Thereby, the difference between the current path a from the electrode plate 4 to the end of the lead frame W on the electrode plate 4 side and the current path b to the center of the lead frame W is very small. Therefore, the difference in current density between the width direction end portion and the center portion of the lead frame W can be suppressed to be small, and the difference in the amount of plating peeling can be suppressed to be small.
[0026]
In addition, the plating stripping apparatus and the plating stripping method according to the present invention are not limited to those used in the step of stripping the copper plating exposed from the silver plating when the lead frame is partially subjected to silver plating, Regardless of the type and shape of the workpiece, the type of plating metal, the purpose of the process, etc., it can be widely used when electrolytically peeling the plating.
[0027]
【The invention's effect】
According to the plating stripping apparatus and the plating stripping method according to the present invention, it is difficult to deposit plating on the workpiece, and the difference in the amount of plating stripping can be suppressed small between the end portion and the center portion of the workpiece on the electrode plate side. There is an effect.
[Brief description of the drawings]
FIG. 1 is an explanatory front view of a plating stripping apparatus according to the present invention.
FIG. 2 is an explanatory side sectional view of a plating stripping apparatus according to the present invention.
FIG. 3 is an explanatory side sectional view when the plating is peeled off by the plating peeling apparatus according to the present invention.
FIG. 4 is an explanatory front view of a conventional plating peeling apparatus.
FIG. 5 is an explanatory side sectional view of a conventional plating peeling apparatus.
FIG. 6 is a side cross-sectional explanatory diagram when plating is stripped by a conventional plating stripping apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 2 Stripping treatment tank 2a Stripping solution discharge port 2b Stripping solution supply port 4 Electrode plate 5 Power supply device 6 Electrolytic stripping solution 8, 9 Roller 10 Mesh member 12 Insulating plate (insulating member)
14a Liquid receiver 14b Pipe 14c Filter 14d Pump 14e Pipe S Plating waste W Lead frame a, b Current path

Claims

Comprising a stripping treatment bath electrolytic stripping liquid is placed, is disposed along the inner peripheral wall of said stripping processing tank as immersed in electrolytic stripping solution, and an electrode plate which is applied to the cathode, an anode A plating stripping device that enters a plate-like workpiece applied to the electrolytic stripping solution in the stripping treatment tank in a state perpendicular to the electrode plate and electrolytically strips the plating applied to the workpiece. ,
Wherein As workpiece from the electrolyte peeled plating does not adhere to the plated dregs side over click formed by deposition on the electrode plate, the mesh member separating the said electrode plate and said workpiece in said stripping processing bath is, It is arranged so as to cut the inside of the peeling treatment tank,
And it was formed in the bottom wall of the electrode plate side separated by the lower part of the inner peripheral wall of the exfoliation processing tank, or the mesh member so that the exfoliation processing solution may flow from the workpiece side through the mesh member to the electrode plate side. A stripping solution discharge port for discharging a stripping treatment liquid containing plating residue in the vicinity of the electrode plate, a filtering means for filtering the plating residue in the electrolytic stripping solution discharged from the stripping solution discharge port, and filtering by the filtering unit A plating stripping apparatus , comprising: a stripping solution supply means that includes a stripping solution supply port that re-feeds the electrolytic stripping solution that has been separated by the mesh member into the stripping treatment tank on the workpiece side .

The plating stripping apparatus according to claim 1, wherein the stripping solution supply port is provided so that the stripping solution is sprayed onto a lower surface side of the workpiece that has been horizontally entered into the stripping treatment tank .

The plating stripping apparatus according to claim 1 or 2 , wherein the workpiece is a long metal plate, and the stripping treatment tank is formed in an elongated shape along the traveling direction of the metal plate .

The work piece is a lead frame, and the peeling treatment tank is disposed so that the lead frame wound up from one roller of the two rollers to the other roller is immersed in the peeling treatment liquid. plating peeling apparatus according to any one of claims 1-3 being.

The plating peeling apparatus as described in any one of Claims 1-4 with which the insulating member which is arrange | positioned between the said electrode plate and a workpiece | work, and detours the electric current path between this electrode plate and a workpiece | work is provided .

Said insulating member is formed in a plate shape is disposed vertically the plate surface, plating peeling apparatus 請 Motomeko 5, wherein a lower end portion that is formed bent on the workpiece side.

Using the plating peeling apparatus according to claim 1, 2, 3, 4, 5 or 6,
In a state where the electrode plate is applied to the cathode and the workpiece is applied to the anode, the workpiece is placed in an electrolytic stripping solution in the stripping treatment tank, and the plating applied to the workpiece is electrolytically stripped. The plating peeling method.