JP4139406B2 - Semiconductor device - Google Patents

Description

  The present invention relates to a semiconductor device, and more particularly to a semiconductor device used for a power module such as an inverter mounted on a moving body such as in-vehicle use.

In a semiconductor module having a semiconductor element sealed with a resin used for a power module such as an inverter and having a hole for allowing a fixing screw to pass through a central portion, between the mounting screw and the semiconductor module In a conventional semiconductor device in which a plate spring for presser and a beam for reinforcement are laid and fixed to the cooling device, the semiconductor module is usually used as one set for three phases, so it is rotated by three fixing screws. Therefore, the rotation stopper is not necessary (see, for example, Patent Document 1).
In addition, a groove was provided in the case that accommodates the semiconductor module, a protrusion was provided on each of the holding spring and the reinforcing beam, and the groove and the protrusion were engaged with each other, thereby enabling easy positioning.

Japanese Patent Laying-Open No. 2005-235992

And power modules such as in-vehicle inverters are required to be modularized in a limited space, and downsizing of the inverter is inevitable.
One of the countermeasures is a caseless structure. However, if it is adopted, it will not be possible to provide a positioning groove in the case, the positioning of the presser spring and the reinforcing beam will not be possible, and the productivity will be remarkable. There is a problem that it decreases.
Further, when a structure in which a boost converter is built in the inverter is adopted, the semiconductor module for the inverter is used as one set of three phases as described in the conventional example, but one semiconductor module for the boost converter is used. Used only in. In this case, in addition to the reduction in productivity due to the absence of the positioning described above, since the fixing screw is provided at one place, the presser spring and the reinforcing beam rotate when the fixing screw is tightened, and the semiconductor module is appropriately mounted. Production itself becomes difficult due to problems such as inability to hold down.

  In order to solve the above problems, it is necessary to provide reliable positioning and rotation stopper without increasing the number of parts in a limited space.

  An object of the present invention is to obtain a semiconductor device capable of reliably positioning and preventing rotation between components without increasing the number of components.

The semiconductor device according to the present invention includes a semiconductor module having a semiconductor element sealed with a resin and provided with a hole for allowing a fixing mounting screw to pass through, and a plate spring member that overlaps the semiconductor module. The semiconductor module is fixed by the fixing mounting screw , and a bent portion is provided in the plate spring member, and the bent portion of the plate spring member is engaged with a protrusion provided in the semiconductor module. Thus, the plate spring member is positioned and prevented from rotating with respect to the semiconductor module.

  According to the present invention, it is possible to obtain a semiconductor device capable of reliably positioning and preventing rotation between components without increasing the number of components.

Embodiment 1 FIG.
A first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a perspective view showing a configuration in the first embodiment.

Referring to FIG. 1 showing the configuration of the first embodiment according to the present invention, the semiconductor module 1 formed of a semiconductor element sealed with resin has a fixing screw member (not shown) as a fixture at the center thereof. ) Is provided.
A plate-shaped presser spring member 2 is superposed on the upper surface of the semiconductor module 1. The plate-shaped presser spring member 2 is formed by an elastic member that is gently curved along its extending direction, and is provided at the center of the plate-shaped presser spring member 2 in correspondence with the hole 1 h of the semiconductor module 1. The semiconductor module 1 is brought into pressure contact with a heat sink (not shown) as a cooling heat radiating member with an elastic force by fastening with a fixing screw member (not shown) penetrating the portion 2h.
Mounting screw member head of a fixing mounting screw member (not shown) that is screwed into a heat sink (not shown) disposed below the semiconductor module 1 and provided in contact with the lower surface of the semiconductor module 1 The semiconductor module 1 is elastically pressed and fixed to a heat sink (not shown) via the plate-like holding spring member 2 by the pressure applied to the upper surface of the girder-like holding spring member 2.

Here, four ribs are provided as the ribs 1 a, 1 b, 1 c, and 1 d on both end faces of the semiconductor module 1, and two bent shapes are provided as the bent portions 2 a and 2 b at the both end edges of the presser spring member 2.
Thus, when the presser spring member 2 is set in the semiconductor module 1, the presser spring member 2 is inserted into the groove between the ribs 1a and 1b and the groove between the ribs 1c and 1d provided in the semiconductor module 1. By inserting the provided bent portions 2a and 2b, the presser spring member 2 can be easily positioned and stopped, and productivity similar to that of the conventional example can be maintained.

At this time, by adding shapes only to the semiconductor module 1 and the presser spring member 2, positioning and rotation prevention are possible, so there is no need to use separate parts such as a case as in the conventional example, and the power module Can contribute to downsizing
This is an effect obtained by adding the ribs 1 a, 1 b, 1 c, 1 d to the semiconductor module 1 and adding the bent portions 2 a, 2 b to the presser spring member 2.

  In addition, here, what fixes the semiconductor module 1 and the presser spring member 2 by pressing the upper surface of the plate-shaped presser spring member 2 by the mounting screw member head of the fixing screw member for fixing (not shown) is described. However, as shown in Embodiment 2 and later described below, the semiconductor module 1 or the plate-like presser is provided between the mounting screw member head of the fixing screw member (not shown) and the plate-like presser spring member 2. A reinforcing beam 3 that engages with the spring member 2 may be provided.

(1A) According to the first embodiment of the present invention, a hole 1h for allowing a fixture (not shown) made of a fixing mounting screw member to pass through a central portion of a semiconductor element sealed with resin. And fixing the semiconductor module 1 with a fixture made of the fixing screw member via a plate spring member 2 superposed on the semiconductor module 1, the plate spring member 2 are provided with bent portions 2a and 2b, and the bent portions 2a and 2b of the plate spring member 2 are provided with ribs 1a, 1b and 1c provided on the semiconductor module 1. Since the plate-like spring member 2 is engaged with the projecting portion 1d to position and prevent the plate-like spring member 2 from rotating relative to the semiconductor module 1, it is provided on the plate-like spring member. By the engagement between the projection provided in the bent portion and the semiconductor module, without increasing the number of parts, it is possible to obtain a semiconductor device which can be reliably performed positioning and detent parts mutually.

Embodiment 2. FIG.
A second embodiment of the present invention will be described with reference to FIGS. FIG. 2 is a perspective view showing a configuration in the second embodiment. FIG. 3 is an enlarged top view showing a partial configuration in the second embodiment.
In the second embodiment, the configuration other than the specific configuration described here has the same configuration as the configuration in the first embodiment described above, and has the same function. In the drawings, the same reference numerals indicate the same or corresponding parts.

In FIG. 2 which shows the structure in Embodiment 2 by this invention, the semiconductor module 1 comprised by the semiconductor element sealed with resin has the fixing screw member (not shown) as a fixture in the center part. ) Is provided.
A plate-like presser spring member 2 is superposed on the upper surface of the semiconductor module 1, and a reinforcing beam 3 is superposed on the upper surface of the plate-like presser spring member 2 across the upper surface of the plate-like presser spring member 2. The plate-shaped presser spring member 2 is formed by an elastic member that is gently curved along the extending direction, and the reinforcing beam 3 is formed by a groove-shaped material.
The plate-shaped presser spring member 2 and the reinforcing beam 3 are fixedly attached through the hole portions 2h and 3h provided in the center of the plate-shaped presser spring member 2 and the reinforcing beam 3 so as to correspond to the hole portions 1h of the semiconductor module 1. By fastening with a screw member (not shown), the semiconductor module 1 is brought into pressure contact with a heat sink (not shown) as a cooling heat radiating member with an elastic force.
Mounting screw member head of a fixing mounting screw member (not shown) that is screwed into a heat sink (not shown) disposed below the semiconductor module 1 and provided in contact with the lower surface of the semiconductor module 1 The semiconductor module 1 is elastically pressed and fixed to a heat sink (not shown) via the plate-like presser spring member 2 by the pressure applied to the upper surface of the plate-like presser spring member 2 via the reinforcing beam 3. is there.

As shown in detail in FIG. 3 showing an enlarged partial configuration of the second embodiment according to the present invention, two bending shapes are provided as bent portions 2c and 2d at both end edges of the holding spring member 2, and the reinforcing beam 3 Two notches are provided as notches 3a and 3b at both ends.
Thus, when the reinforcing beam 3 is set on the presser spring member 2, the reinforcing beam 3 is inserted into the bent portions 2 c and 2 d of the presser spring member 2 by inserting the notches 3 a and 3 b of the reinforcing beam 3. Is easily positioned and stopped, and the same productivity as the conventional example is maintained.

At this time, positioning and rotation prevention can be performed by adding a shape-changing portion only to the holding spring member 2 and the reinforcing beam 3, so that a separate part such as a case for housing a semiconductor module as in the conventional example can be provided. There is no need to use it, which can contribute to miniaturization of power modules.
This is an effect obtained by adding the bent portions 2 c and 2 d to the presser spring member 2 and adding the notches 3 a and 3 b to the reinforcing beam 3.

(2A) According to the second embodiment of the present invention, a hole 1h for allowing a fixture (not shown) made of a fixing screw member to pass through a central portion, which is made of a semiconductor element sealed with resin. A reinforcing beam member comprising a reinforcing beam 3 abutting against a plate-like spring member comprising a presser spring member 2 superposed on the semiconductor module 1, and the reinforcing beam being provided by the fixture. 3, the semiconductor module 1 is fixed via the reinforcing beam member 3 and the plate spring member made of the presser spring member 2. In the plate spring member made of the presser spring member 2, the bent portions 2 c and 2 d The bent portions 2c and 2d of the plate spring member made of the presser spring member 2 are engaged with the notches 3a and 3b provided on the reinforcing beam material made of the reinforcing beam 3, and the reinforcing beam 3 Consist of Since the strong beam member and the plate spring member made of the presser spring member 2 are positioned and prevented from rotating, the bending member provided on the plate spring member and the reinforcing beam member are provided. By engaging with the notch, it is possible to obtain a semiconductor device that can reliably position and prevent rotation between components without increasing the number of components.

Embodiment 3 FIG.
A third embodiment of the present invention will be described with reference to FIGS. FIG. 4 is a perspective view showing a configuration in the third embodiment. FIG. 5 is an enlarged top view showing a partial configuration in the third embodiment.
In the third embodiment, the configuration other than the specific configuration described here has the same configuration contents as the configuration in the first embodiment or the second embodiment described above, and exhibits the same operation. It is. In the drawings, the same reference numerals indicate the same or corresponding parts.

In FIG. 4 which shows the structure in Embodiment 3 by this invention, in the semiconductor module 1 comprised by the semiconductor element sealed with resin, the fixing screw member for fixing (not shown) as a fixture in the center part. ) Is provided.
A plate-like presser spring member 2 is superposed on the upper surface of the semiconductor module 1, and a reinforcing beam 3 is superposed on the upper surface of the plate-like presser spring member 2 across the upper surface of the plate-like presser spring member 2. The plate-shaped presser spring member 2 is formed by an elastic member that is gently curved along the extending direction, and the reinforcing beam 3 is formed by a groove-shaped material. The plate-shaped presser spring member 2 and the reinforcing beam 3 are fixedly attached through the hole portions 2h and 3h provided in the center of the plate-shaped presser spring member 2 and the reinforcing beam 3 so as to correspond to the hole portions 1h of the semiconductor module 1. By fastening with a screw member (not shown), the semiconductor module 1 is brought into pressure contact with a heat sink (not shown) as a cooling heat radiating member with an elastic force.
Mounting screw member head of a fixing mounting screw member (not shown) that is screwed into a heat sink (not shown) disposed below the semiconductor module 1 and provided in contact with the lower surface of the semiconductor module 1 The semiconductor module 1 is elastically pressed and fixed to a heat sink (not shown) via the plate-like presser spring member 2 by the pressure applied to the upper surface of the plate-like presser spring member 2 via the reinforcing beam 3. is there.

As shown in detail in FIG. 5 showing an enlarged partial configuration according to the third embodiment of the present invention, four ribs 1a, 1b, 1c, 1d are provided at both ends of the semiconductor module 1, and the holding spring member 2 is Two bent shapes are provided as bent portions 2a and 2b at both ends, two bent shapes are provided as bent portions 2c and 2d at both ends of the presser spring member 2, and cutout portions 3a and 3b are provided at both ends of the reinforcing beam 3. Two notches are provided.
Thus, when the presser spring member 2 is set in the semiconductor module 1, the presser spring member 2 is inserted into the groove between the ribs 1a and 1b and the groove between the ribs 1c and 1d provided in the semiconductor module 1. By inserting the provided bent portions 2a and 2b, the presser spring member 2 can be easily positioned and stopped, and the presser spring member 2 is set when the reinforcing beam 3 is set on the presser spring member 2. By inserting the notches 3a and 3b of the reinforcing beam 3 into the bent portions 2c and 2d, the reinforcing beam 3 can be easily positioned and rotationally stopped, and the same productivity as the conventional example is maintained.

At this time, since a shape change portion is added only to the semiconductor module 1, the holding spring member 2 and the reinforcing beam 3, positioning and rotation prevention are possible. It is no longer necessary to use separate parts such as this, which can contribute to the miniaturization of power modules.
This is because ribs 1a, 1b, 1c, 1d are added to the semiconductor module 1, bent portions 2a, 2b are added to the holding spring member 24, and bent portions 2c, 2d are added to the holding spring member 2. This is an effect obtained by adding the notches 3a and 3b to the reinforcing beam 3.

  As described above, the third embodiment according to the present invention is a combination of the first embodiment and the second embodiment, whereby the positioning and rotation of both the presser spring member 2 and the reinforcing beam 3 are performed. It can be stopped. This is effective when the presser spring member 2 and the reinforcing beam 3 cannot be positioned and rotated using other components such as a case for housing the semiconductor module 1.

(3A) According to the third embodiment of the present invention, in the configuration according to the item (2A) of the second embodiment, the bent portion is used as the first bent portion in the plate spring member made of the presser spring member 2. 2a and 2b are provided, bent portions 2c and 2d are provided as second bent portions, and bent portions 2a and 2b of a plate spring member made of the pressing spring member 2 are provided in the semiconductor module 1. The ribs 1a, 1b, 1c, and 1d are engaged with the protrusions, and the bent portions 2c and 2d of the plate spring member made of the presser spring member 2 are provided on the reinforcing beam member made of the reinforcement beam 3. In order to engage the notches 3a and 3b, the semiconductor module 1 and the reinforcing beam member made of the reinforcing beam 3 and the plate spring member made of the holding spring member 2 are positioned and prevented from rotating. So, plate spring member The number of parts is increased by engaging the bent portion provided with the protrusion provided in the semiconductor module and engaging the bent portion provided in the plate-like spring member with the notch provided in the reinforcing beam member. Thus, it is possible to obtain a semiconductor device that can reliably position and prevent rotation of components without increasing the number of components.

Embodiment 4 FIG.
A fourth embodiment of the present invention will be described with reference to FIG. FIG. 6 is a perspective view showing a configuration in the fourth embodiment.
In the fourth embodiment, the configuration other than the specific configuration described here has the same configuration contents as the configuration in any of the first to third embodiments described above, and is similar. It has an effect. In the drawings, the same reference numerals indicate the same or corresponding parts.

In FIG. 6 which shows the structure in Embodiment 4 by this invention, in the semiconductor module 1 comprised by the semiconductor element sealed with resin, the fixing screw member (not shown) as a fixture is provided in the center part. ) Is provided.
A plate-like presser spring member 2 is superposed on the upper surface of the semiconductor module 1, and a reinforcing beam 3 is superposed on the upper surface of the plate-like presser spring member 2 across the upper surface of the plate-like presser spring member 2. The plate-shaped presser spring member 2 is formed by an elastic member that is gently curved along the extending direction, and the reinforcing beam 3 is formed by a groove-shaped material.
The plate-shaped presser spring member 2 and the reinforcing beam 3 are fixedly attached through the hole portions 2h and 3h provided in the center of the plate-shaped presser spring member 2 and the reinforcing beam 3 so as to correspond to the hole portions 1h of the semiconductor module 1. By fastening with a screw member (not shown), the semiconductor module 1 is brought into pressure contact with a heat sink (not shown) as a cooling heat radiating member with an elastic force.
Mounting screw member head of a fixing mounting screw member (not shown) that is screwed into a heat sink (not shown) disposed below the semiconductor module 1 and provided in contact with the lower surface of the semiconductor module 1 The semiconductor module 1 is elastically pressed and fixed to a heat sink (not shown) via the plate-like presser spring member 2 by the pressure applied to the upper surface of the plate-like presser spring member 2 via the reinforcing beam 3. is there.

At both ends of the semiconductor module 1, rod-like protrusions 1 e and 1 f having a long and narrow cylindrical shape forming a pair planted on the upper surface of the semiconductor module 1 are provided. A pair of holes 2 ha and 2 hb are provided at both ends of the presser spring member 2, and holes 3 ha and 3 hb are provided at both ends of the reinforcing beam 3.
When the presser spring member 2 is set in the semiconductor module 1, the presser spring member 2 is mounted in a state in which the holes 2 ha and 2 hb provided in the presser spring member 2 are inserted into the protrusions 1 e and 1 f provided in the semiconductor module 1.
Next, when the reinforcing beam 3 is set, the protruding portions 1e and 1f are mounted with holes 3ha and 3hb provided in the reinforcing beam 3 being inserted.
As a result, both the presser spring member 2 and the reinforcing beam 3 are easily positioned and rotated, and the same productivity as in the conventional example is maintained.
Similar to the third embodiment, this configuration is effective when positioning and rotation stoppers using other components such as a case for housing the semiconductor module 1 cannot be added, and is configured with the smallest space. Therefore, it is possible to contribute to downsizing of the power module.
This is an effect obtained by adding the protruding portions 1e and 1f to the semiconductor module 1 and adding the holes 2ha and 2hb and the holes 3ha and 3hb to the holding spring member 2 and the reinforcing beam 3.

(4A) According to the fourth embodiment of the present invention, a hole 1h for allowing a fixture (not shown) made of a fixing mounting screw member to pass through the center portion of the semiconductor element sealed with resin. A reinforcing beam member comprising a reinforcing beam 3 abutting against a plate-like spring member comprising a presser spring member 2 superposed on the semiconductor module 1, and the reinforcing beam being provided by the fixture. 3, and a plate-like spring member made of the presser spring member 2, and a pair of projecting portions 1 e and 1 f that are implanted in the semiconductor module 1. Protruding portions 1e and 1f of the semiconductor module 1 are provided in pairs of holes provided in a plate-like spring member made of the pressing spring member 2 and a reinforcing beam member made of the reinforcing beam 3, respectively. 2ha, 2hb and holes 3ha, 3hb are inserted into the plate-like spring member made up of the semiconductor module 1 and the holding spring member 2 and the reinforcing beam material made up of the reinforcing beam 3, and the anti-rotation action is performed. By engaging the protrusions of the semiconductor module with the holes provided in the plate spring member and the reinforcing beam member, positioning and detent of each other can be ensured without increasing the number of parts. Thus, a semiconductor device that can be performed easily can be obtained.

As described above, in the embodiment according to the present invention, positioning and rotation prevention can be performed without using other components by adding shape change portions to the semiconductor module 1, the presser spring member 2 and the reinforcing beam 2. It becomes possible.
As a result, it is possible to make a module in a smaller space than in the past. Further, a structure in which a boost converter is built in an inverter, that is, a structure in which only one semiconductor module 1 is used can be supported.

It is a perspective view which shows the structure in Embodiment 1 by this invention. It is a perspective view which shows the structure in Embodiment 2 by this invention. It is a top view which expands and shows the partial structure in Embodiment 2 by this invention. It is a perspective view which shows the structure in Embodiment 3 by this invention. It is a top view which expands and shows the partial structure in Embodiment 3 by this invention. It is a perspective view which shows the structure in Embodiment 4 by this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Semiconductor module, 1a, 1b, 1c, 1d Rib, 1e, 1f Protruding part, 2 Pressing spring member, 2a, 2b, 2c, 2d Bending part, 2h, 2ha, 2hb Hole part, 3 Reinforcement beam, 3a, 3b Notch, 3h, 3ha, 3hb Hole.

Claims (3)

Has a semiconductor element sealed with a resin, comprising a semiconductor module provided with a hole for passing the fixing attachment screw, by said fixed mounting screws through the plate-shaped spring member which polymerize the semiconductor module In fixing the semiconductor module, the plate spring member is provided with a bent portion, the bent portion of the plate spring member is engaged with a protrusion provided in the semiconductor module, and the semiconductor module and the semiconductor module A semiconductor device characterized in that positioning with a plate-like spring member and rotation prevention are performed. A reinforcing beam member comprising a semiconductor module having a semiconductor element sealed with a resin and provided with a hole for allowing a fixing mounting screw to pass therethrough, and abutting against a plate spring member superimposed on the semiconductor module And fixing the semiconductor module via the reinforcing beam member and the plate spring member with the fixing mounting screw , a bent portion is provided on the plate spring member, and the plate spring member A semiconductor device characterized in that a bent portion is engaged with a notch portion provided in the reinforcing beam member to position and prevent rotation of the reinforcing beam member and the plate spring member. apparatus.   The plate spring member is provided with a first bent portion and a second bent portion, and the first bent portion of the plate spring member is engaged with a protrusion provided in the semiconductor module, Positioning and detent between the semiconductor module, the reinforcing beam member, and the plate spring member by engaging the second bent portion of the plate spring member with a notch provided in the reinforcing beam member 3. The semiconductor device according to claim 2, wherein an action is performed.

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