JP4127391B2 - Processing unit storage shelf and substrate processing apparatus - Google Patents

Description

The present invention relates to a processing unit storage shelf and a substrate processing apparatus having a processing space separation wall for separating a processing space for substrates.

  Conventionally, a substrate processing apparatus including a semiconductor processing apparatus is equipped with a heat treatment unit (bake plate) for performing heat treatment on the substrate. The heat treatment unit includes a heating unit that raises the temperature to a predetermined temperature called a hot plate and a cooling unit that lowers the temperature to a predetermined temperature called a cool plate.

  Usually, the substrate after the heat treatment is subjected to a cooling treatment for cooling to a predetermined temperature. In addition, the substrate after the resist solution is applied and developed is subjected to a heat treatment for heating to a predetermined temperature. These cooling treatments and heat treatments require a certain heating time and cooling time, and these treatment times are very important in the process of forming a substrate.

  Further, in such a substrate processing apparatus, a transport apparatus for transporting the substrate to each processing unit is provided. The substrate is carried into the heat treatment unit by the transfer device. Then, a predetermined heat treatment is performed on the substrate in the heat treatment unit, and the substrate is unloaded from the heat treatment unit by the transfer device. A standing wall for preventing the circulation of the atmosphere is provided between the area where the transfer device is installed (hereinafter referred to as the transfer area) and the area where the heat treatment unit is installed (hereinafter referred to as the heat treatment area). It is done.

  The standing wall is provided with an opening for transferring the substrate. The opening is provided with a shutter. Normally, the shutter is opened at the time of loading / unloading the substrate and waiting for unloading. When the shutter is opened, the transfer area and the heat treatment area communicate with each other, and the substrate can be transferred by the transfer device.

  A downflow is formed in the transfer area and the heat treatment area of the substrate processing apparatus from the upper side to the lower side of the substrate processing apparatus to prevent particles. The downflow formed in the transfer area by the opening of the shutter flows into the heat treatment area. As a result, the heat treatment unit is affected by the downflow flowing into the heat treatment area.

  Further, the number of heat treatment units to be mounted on the substrate processing apparatus is determined according to the balance between the processing capabilities of the resist coating processing section and the development processing section. Accordingly, the number of heat treatment units to be mounted varies depending on the processing capabilities of the resist coating processing unit, the development processing unit, and the like, but usually a plurality of heat treatment units are mounted on one substrate processing apparatus.

  For example, Patent Document 1 discloses a heat treatment apparatus capable of shortening the heating / cooling processing time of an object to be processed, making the in-plane temperature distribution of the object to be processed uniform, and improving the product yield.

  In this heat treatment apparatus, a heat treatment unit in which a heating unit and a cooling unit are stacked is provided on one side of a transfer path of a main arm that conveys a substrate, and two developing devices (development units) are provided on the other side. They are arranged in parallel. In this case, three heating units are arranged on one cooling unit to form a heat treatment section. In addition, heat treatment units in which three heating units are stacked on one cooling unit are arranged in two rows on the side of the adhesion processing apparatus.

Thereby, the to-be-processed to-be-processed object is conveyed immediately to a cooling unit by the sub arm provided in the back of the heat processing apparatus. The to-be-processed object to which the heat processing was performed can be rapidly conveyed to a cooling unit, the thermal influence of a to-be-processed object can be reduced, and the improvement of a through-put can be aimed at.
Japanese Patent No. 3340383

  However, when the heat treatment units are stacked in the vertical direction, the amount of downflow flowing from the transfer area differs between the heat treatment unit installed in the upper part and the heat treatment unit installed in the lower part. As described above, since the amount of the downflow that flows in varies, the performance of the heat treatment on the substrate differs depending on the position of the heat treatment unit, and the processing of the substrate is not uniform.

  In order to correct this non-uniformity, there is also a method for reducing the inflowing downflow by making the heat treatment unit a closed space. However, when the heat treatment unit is in a closed space, heat is trapped in the heat treatment unit, making it difficult to accurately control the temperature of the heat treatment unit.

An object of the present invention is to provide a processing unit storage shelf and a substrate processing apparatus capable of reducing the amount of downflow flowing from the outer region into the processing unit storage space and ensuring the uniformity of substrate processing. That is.

A processing unit storage shelf according to a first invention is a processing unit storage shelf for storing processing units for performing predetermined processing on a substrate , and a plurality of partition members arranged substantially horizontally at intervals from each other; A support member that supports the plurality of partition members so as to form a plurality of storage spaces between the plurality of partition members, and a processing region separation wall provided on at least one side of the plurality of storage spaces. wall contact with the first wall portion provided on the outer side of the storage space so as to extend from the lower side of the partition member to the upper side of the partition member out of the plurality of partition members, the predetermined distance from the first wall portion There a second wall portion provided on the inner side of the first wall portion so as to extend from the lower side of the partition member to the upper side of the partition member, the first wall, and the inside of the plurality of processing spaces between the external A plurality of first openings for passing the plate, the second wall portion, have a second opening plurality of the respective opposed substantially to the plurality of first openings, the first An exhaust part for exhausting the space between the wall part and the second wall part is provided .

In the processing unit storage shelf according to the first aspect of the present invention, a plurality of partition members arranged substantially horizontally at intervals are supported by the support member so as to form a plurality of storage spaces. A processing region separation wall is provided on at least one side of the plurality of storage spaces.
In this case, a plurality of processing units can be stored in a plurality of stages in a plurality of storage spaces. In addition, since at least one side surface of the plurality of storage spaces is closed by the processing region separation wall, the amount of downflow flowing into the plurality of storage spaces from the outer region via the first and second openings is reduced. Is done. Therefore, the uniformity of the substrate in the plurality of processing units stored in the plurality of storage spaces can be ensured.
The first wall portion of the processing region separation wall is provided outside the storage space so as to extend from the lower partition member to the upper partition member among the plurality of partition members, and the second wall portion includes the first wall portion It is provided inside the first wall portion so as to extend from the lower partition member to the upper partition member at a predetermined interval with respect to the wall portion. The first wall has a plurality of first openings for transferring the substrate between the inside and the outside of the plurality of processing spaces, and the second wall has a plurality of first openings. And a plurality of second openings that substantially face each other.

Since the second wall portion is provided on the inner side of the first wall portion so as to extend from the lower side of the partition member at a predetermined distance from the first wall portion to the upper partition member When the downflow flows from the outer region into the first opening of the first wall portion, most of the downflow is a predetermined distance between the first wall portion and the second wall portion. Flows into the space. Thereby, the amount of downflow flowing into the storage space from the second opening of the second wall is reduced. As a result, it is possible to ensure the uniformity of substrate processing in the processing unit within the storage space.
Moreover, since the exhaust part for exhausting the inside of the space between the 1st wall part and the 2nd wall part is provided, it is in the space between the 1st wall part and the 2nd wall part. The inflowing downflow can be discharged to the outside from the exhaust part. Thereby, it is possible to prevent a part of the downflow from flowing into the storage space from the space between the first wall portion and the second wall portion.

The other one side surface of the plurality of storage spaces may be opened. Moreover, the lower end of each 1st opening part may be located below the lower end of the 2nd opening part which opposes . In this case, since the downflow that flows into the lower side in the first opening is blocked by the second wall, the downflow that flows into the first opening is blocked by the first wall and the second wall. Can efficiently flow into the space between the two. As a result, the downflow can be prevented from flowing into the storage space from the first and second openings.

A plurality of closure members may be provided to freely open and close each of the first opening multiple and a plurality of second openings in the closed state between the first wall and the second wall portion.

In this case, when the substrate is carried in and out, the first opening and the second opening are opened, and in other cases, the first opening and the second opening are closed by the closing member. Put it in a state. Thereby , the atmosphere in the storage space can be separated from the outer region during the processing of the substrate. As a result, it is possible to ensure the uniformity of substrate processing in the processing units in the storage space, and it is possible to prevent the atmosphere in the storage space from leaking to the outer region.

A shielding portion may be provided that shields the space between the first wall portion and the second wall portion from above and below between the plurality of first and second openings.

In this case, since the shielding part which shields the space between the 1st wall part and the 2nd wall part up and down mutually is provided, the downflow which flowed in from each 1st opening part is the 1st wall part. From flowing into the storage space through the lower second opening through the space between the first wall and the second wall. Therefore, it is possible to ensure the uniformity of processing by the processing units arranged in a plurality of stages in a plurality of storage spaces .

  The interval between the first wall portion and the second wall portion may be set to 20 mm or more and 50 mm or less.

In this case, by setting the distance between the first wall portion and the second wall portion to be 20 mm or more, the down flow flowing from the first opening of the first wall portion is reduced to the first wall portion. Can efficiently flow into the space between the second wall portion and the second wall portion. In addition, by setting the distance between the first wall portion and the second wall portion to be 50 mm or less, the amount of downflow flowing into the storage space is sufficiently reduced, and the processing region separation wall is enlarged. Can be suppressed.

A second invention a substrate processing apparatus according to the a processing unit storage rack according to the first invention, located on any of a plurality of storage space of the processing unit storage rack, a processing unit that performs processing on a substrate, the processing unit It is arranged in a region outside the processing region separation wall of the storage shelf, and has a transport means for carrying the substrate into and out of the processing unit through the first and second openings of the processing region separation wall.

In the substrate processing apparatus according to the second invention, the processing unit storage rack process area substrate by conveying means arranged outside the region of the separation wall treatment through the first and second openings of the processing area separation wall unit It is carried into and out of the processing unit in the storage space of the storage shelf .

In this case, since the processing region separation wall of the processing unit storage shelf is disposed between the storage space and the transport region, the downflow that flows into the storage space from the outer region through the first and second openings. The amount of flow is reduced. Accordingly, it is possible to ensure the uniformity of substrate processing in the processing unit within the storage space .

  The interval between the second wall portion of the processing region separation wall and the processing unit may be set to 30 mm or more and 80 mm or less.

In this case, when the down flow flows into the storage space from the second opening of the second wall by setting the distance between the second wall of the processing region separation wall and the processing unit to 30 mm or more. However, the inflowing downflow is prevented from affecting the processing unit. Further, by setting the distance between the second wall portion of the processing region separation wall and the processing unit to be 80 mm or less, the downflow that has flowed into the storage space from the second opening of the second wall portion is prevented from being processed. It is possible to reduce the area of the processing unit storage shelf while sufficiently preventing the influence of the processing unit .

  The processing unit includes substrate support means for supporting the substrate, and the lower end of the first opening of the processing region separation wall is positioned below the substrate supported by the substrate support means of the processing unit, and the processing region separation wall The lower end of the second opening may be positioned above the substrate supported by the substrate support means of the processing unit.

In this case, the lower end of the first opening of the processing region separation wall is positioned below the substrate supported by the substrate support means, and the lower end of the second opening of the processing region separation wall is supported by the substrate support means. Therefore, the downflow that flows into the lower side of the first opening is blocked by the second wall, and the first wall and the second wall do not flow into the storage space. Efficiently flows into and out of the wall. Thereby, the influence of the downflow is prevented from being exerted on the substrate supported by the substrate supporting means.

According to the present invention, it is possible to reduce the amount of downflow flowing from the outer region into the storage space of the processing unit storage shelf, and to ensure the uniformity of substrate processing.

  Hereinafter, a bake box having a processing region separation wall and a substrate processing apparatus according to an embodiment of the present invention will be described with reference to the drawings. The processing region separation wall according to the present embodiment is formed integrally with a bake box described later.

  Moreover, in the following description, a substrate means a semiconductor wafer, a glass substrate for a liquid crystal display device, a glass substrate for a PDP (plasma display panel), a glass substrate for a photomask, a substrate for an optical disk, or the like.

  FIG. 1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention.

  1 and the subsequent drawings are provided with arrows indicating the X direction, the Y direction, and the Z direction orthogonal to each other in order to clarify the positional relationship. The X direction and the Y direction are orthogonal to each other in the horizontal plane, and the Z direction corresponds to the vertical direction. In each direction, the direction in which the arrow points is the + direction, and the opposite direction is the-direction. Further, the rotation direction around the Z direction is defined as the θ direction.

  As shown in FIG. 1, the substrate processing apparatus 500 includes an indexer block 9, an antireflection film processing block 10, a resist film processing block 11, a development processing block 12, and an interface block 13. A stepper unit 14 is disposed adjacent to the interface block 13.

  The indexer block 9 includes a plurality of carrier platforms 60 and an indexer robot IR. The indexer robot IR has a hand IRH for delivering the substrate W. The antireflection film processing block 10 includes antireflection film heat treatment units 100 and 101, an antireflection film coating processing unit 70, and a first central robot CR1. The antireflection film coating processing unit 70 is provided opposite to the antireflection film heat treatment units 100 and 101 with the first central robot CR1 interposed therebetween. The first center robot CR1 has a hand CRH1 for delivering the substrate W.

  The resist film processing block 11 includes resist film heat treatment units 110 and 111, a resist film coating processing unit 80, and a second central robot CR2. The resist film application processing unit 80 is provided opposite to the resist film heat treatment units 110 and 111 with the second central robot CR2 interposed therebetween. The second center robot CR2 has a hand CRH2 for delivering the substrate W.

  The development processing block 12 includes development heat treatment units 120 and 121, a development processing unit 90, and a third center robot CR3. The development processing unit 90 is provided to face the development heat treatment units 120 and 121 with the third central robot CR3 interposed therebetween. The third central robot CR3 has a hand CRH3 for delivering the substrate W.

  The interface block 13 includes a fourth central robot CR4, a buffer SBF, an interface transport mechanism IFR, and an edge exposure unit EEW. The fourth central robot CR4 has a hand CRH4 for delivering the substrate W. The interface transport mechanism IFR delivers the substrate W between a substrate platform PASS8 and a stepper unit 14 which will be described later.

  In the substrate processing apparatus 500 according to the present embodiment, an indexer block 9, an antireflection film processing block 10, a resist film processing block 11, a development processing block 12, and an interface block 13 are arranged in parallel in the Y direction. Has been.

  Hereinafter, each of the indexer block 9, the antireflection film processing block 10, the resist film processing block 11, the development processing block 12, and the interface block 13 is referred to as a processing block.

  The substrate processing apparatus 500 is provided with a main controller (not shown) that controls the operation of each processing block.

  In addition, a partition is provided between the processing blocks. Each partition is provided with substrate platforms PASS1 to PASS6 adjacent to each other in the vertical direction for transferring the substrate W between the processing blocks.

  The development heat treatment section 121 of the development processing block 12 is provided with a substrate platform PASS7 as described later, and the edge exposure section EEW of the interface block 13 includes a substrate platform as described later. PASS8 is provided. The substrate platforms PASS1 to PASS8 are provided with a plurality of support pins fixedly installed. The substrate platforms PASS1 to PASS8 are provided with optical sensors (not shown) that detect the presence or absence of the substrate W. Thereby, it is possible to determine whether or not the substrate W is placed on the substrate platforms PASS1 to PASS8.

  The substrate platforms PASS1, PASS3, and PASS5 are used when delivering an unprocessed substrate W, and the substrate platforms PASS2, PASS4, and PASS6 are used when delivering a processed substrate W.

  Next, the operation of the substrate processing apparatus 500 according to the present embodiment will be briefly described.

  On the carrier mounting table 60 of the indexer block 9, a carrier C that stores a plurality of substrates W in multiple stages is loaded. The indexer robot IR takes out the unprocessed substrate W stored in the carrier C by using the hand IRH for delivering the substrate W. Thereafter, the indexer robot IR rotates in the ± θ direction while moving in the ± X direction, and transfers the unprocessed substrate W to the substrate platform PASS1.

  In the present embodiment, a FOUP (front opening unified pod) is adopted as the carrier C. However, the present invention is not limited to this, and the OC (Standard Mechanical Inter Face) pod and the storage substrate W are exposed to the outside air. open cassette) or the like may be used. Further, the indexer robot IR, the first to fourth center robots CR1 to CR4, and the interface transport mechanism IFR are each provided with a direct-acting transport robot that slides linearly with respect to the substrate W and moves the hand back and forth. Although it is used, the present invention is not limited to this, and an articulated transfer robot that linearly moves the hand back and forth by moving the joint may be used.

The unprocessed substrate W transferred to the substrate platform PASS1 is received by the hand CRH1 of the first central robot CR1 of the antireflection film processing block 10. The first center robot CR1 carries the substrate W into the antireflection film coating processing unit 70. In the anti-reflection film coating processing section 70, an anti-reflection film is applied and formed below the photoresist film by a coating unit BARC, which will be described later, in order to reduce standing waves and halation generated during exposure.

  Thereafter, the first central robot CR1 takes out the substrate W from the antireflection film coating treatment unit 70 and carries it into the heat treatment units 100 and 101 for antireflection film. After predetermined processing is performed in the antireflection film heat treatment units 100 and 101, the first central robot CR1 takes out the substrate W from the antireflection film heat treatment units 100 and 101 and transfers it to the substrate platform PASS3. To do.

  The substrate W transferred to the substrate platform PASS3 is received by the hand CRH2 of the second central robot CR2 of the resist film processing block 11. The second center robot CR2 carries the substrate W into the resist film coating processing unit 80. In the resist film coating processing unit 80, a photoresist film is coated and formed on the substrate W on which the antireflection film is coated by a coating unit RES described later. Thereafter, the second central robot CR2 takes out the substrate W from the resist film coating processing unit 80 and carries it into the resist film heat treatment units 110 and 111. After predetermined processing is performed in the resist film heat treatment units 110 and 111, the second central robot CR2 takes out the substrate W from the resist film heat treatment units 110 and 111 and transfers it to the substrate platform PASS5.

  The substrate W transferred to the substrate platform PASS5 is received by the hand CRH3 of the third central robot CR3 of the development processing block 12. The third central robot CR3 transfers the substrate W to the substrate platform PASS7. The substrate W transferred to the substrate platform PASS7 is received by the hand CRH4 of the fourth central robot CR4 of the interface block 13. The fourth center robot CR4 carries the substrate W into the edge exposure unit EEW. After predetermined processing is performed in the edge exposure unit EEW, the fourth central robot CR4 takes out the substrate W from the edge exposure unit EEW and transfers it to the substrate platform PASS8 provided below the edge exposure unit EEW. To do.

  The substrate W transferred to the substrate platform PASS8 is received by the interface transport mechanism IFR. The interface transport mechanism IFR carries the substrate W into the stepper unit 14. A predetermined process is performed on the substrate W in the stepper unit 14. Thereafter, the interface transport mechanism IFR receives the substrate W from the stepper unit 14 and transfers it to the substrate platform PASS8 provided below the edge exposure unit EEW.

  The substrate W transferred to the substrate platform PASS8 is received by the hand CRH4 of the fourth central robot CR4 of the interface block 13. The fourth center robot CR4 carries the substrate W into the development heat treatment section 121. In the development heat treatment unit 121, heat treatment is performed on the substrate W. Thereafter, the fourth central robot CR4 takes out the substrate W from the development heat treatment unit 121 and transfers it to the substrate platform PASS7.

  The substrate W transferred to the substrate platform PASS7 is received by the hand CRH3 of the third central robot CR3 of the development processing block 12. The third center robot CR3 carries the substrate W into the development processing unit 90. In the development processing unit 90, development processing is performed on the exposed substrate W. Thereafter, the third central robot CR3 takes out the substrate W from the development processing unit 90 and carries it into the development heat treatment unit 120. After the predetermined processing is performed in the development heat treatment section 120, the third central robot CR3 takes out the substrate W from the development heat treatment section 120 and puts it on the substrate platform PASS6 provided in the resist film processing block 11. Transfer.

  The substrate W transferred to the substrate platform PASS6 is transferred to the substrate platform PASS4 by the second central robot CR2 of the resist film processing block 11. The substrate W transferred to the substrate platform PASS4 is transferred to the substrate platform PASS2 by the first central robot CR1 of the processing block 10 for antireflection film.

  The substrate W transferred to the substrate platform PASS2 is stored in the carrier C by the indexer robot IR of the indexer block 9.

  Next, FIG. 2 is a side view of the substrate processing apparatus 500 of FIG. 1 viewed from the −X direction.

  A carrier C containing a substrate W is placed on the carrier placement table 60 of the indexer block 9. The hand IRH of the indexer robot IR receives the substrate W in the carrier C by rotating in the ± θ direction or moving back and forth in the ± Y direction.

  The antireflection film heat treatment section 100 of the antireflection film processing block 10 includes two heat treatment units PHP (hereinafter simply referred to as heat treatment units) with three delivery sections and three hot plates HP in a bake box to be described later. The antireflection film heat treatment unit 101 has two adhesion reinforcing agent application processing units AHL and four cooling plates CP stacked in a bake box, which will be described later. Further, in the heat treatment units 100 and 101 for the antireflection film, a local controller LC for controlling the operations of the heat treatment unit PHP, the hot plate HP, the adhesion reinforcing agent application treatment unit AHL, and the cooling plate CP is arranged at the top.

  In the resist film heat treatment section 110 of the resist film processing block 11, six heat treatment units PHP are vertically stacked in a bake box to be described later, and the resist film heat treatment section 111 has four cooling plates CP. Are stacked one above the other in a bake box to be described later. Further, in the resist film heat treatment units 110 and 111, local controllers LC for controlling the operations of the heat treatment unit PHP and the cooling plate CP are respectively arranged at the top.

  In the development heat treatment section 120 of the development processing block 12, four hot plates HP and four cooling plates CP are vertically stacked in a bake box to be described later. The part PASS7, the five heat treatment units PHP, and the cooling plate CP are vertically stacked in a bake box to be described later. Further, in the development heat treatment units 120 and 121, local controllers LC for controlling the operations of the heat treatment unit PHP, the hot plate HP, and the cooling plate CP are arranged at the top.

  In the interface block 13, two edge exposure units EEW, a buffer unit BF, and a substrate platform PASS8 are stacked one above the other, and a fourth center robot CR4 and an interface transport mechanism IFR (not shown) are disposed. Is done.

  FIG. 3 is a side view of the substrate processing apparatus 500 of FIG. 1 viewed from the + X direction.

  In the anti-reflection film coating processing unit 70, three anti-reflection film portions BARC are stacked in a vertical direction. In the resist film coating processing unit 80, three resist processing apparatuses RES are stacked in a vertical direction. In the development processing unit 90, five development processing devices DEV are vertically stacked.

  Next, the bake box 400 of the heat treatment part 100 for antireflection film will be described. Hereinafter, the appearance of the bake box 400 of the heat treatment part 100 for antireflection film viewed from the + X direction and the + Y direction is the front of the bake box 400, and the appearance viewed from the −X direction and the −Y direction is the back of the bake box 400. And

  FIG. 4 is an external perspective view of the bake box 400 of the antireflection film heat treatment unit 100 viewed from the front, and FIG. 5 is an external perspective view of the bake box 400 of the antireflection film heat treatment unit 100 viewed from the back. is there.

  Further, the region where the first center robot CR1, the second center robot CR2, and the third center robot CR3 in FIG. 1 are arranged is called a transfer area, and the antireflection film heat treatment units 100 and 101, the resist film heat treatment. A region where the portions 110 and 111 and the development heat treatment portions 120 and 121 are disposed is referred to as a heat treatment area.

  4 and FIG. 5 includes a bake box 400, two heat treatment units PHP, and three hot plates HP.

  The bake box 400 mainly includes an outer standing wall 401, an inner standing wall 402, two columns P1 and P2, a plurality of box partition plates 410, and an exhaust duct 460. The outer standing wall 401 and the inner standing wall 402 are formed in an L-shaped cross section. The outer standing wall 401 and the inner standing wall 402 constitute a processing region separation wall. The processing region separation wall separates the transfer area and the heat treatment area.

  The support posts P1 and P2 are provided vertically, and the plurality of box partition plates 410 are horizontally supported at predetermined intervals by the support posts P1 and P2. Thereby, a plurality of storage spaces are formed between the plurality of partition plates 410.

  An outer standing wall 401 and an inner standing wall 402 are provided on the side surface in the + X direction of the bake box 400 (the side surface on the second center robot CR2 side in FIG. 1) and the side surface in the + Y direction. A side wall in the −X direction of the bake box 400 is not provided with a side wall, and is open. A side wall (not shown) is provided on the side surface of the bake box 400 in the -Y direction.

  The inner standing wall 402 has a plurality of openings 412 corresponding to a plurality of storage spaces. The outer standing wall 401 has a plurality of openings 411 corresponding to the openings 412 of the inner standing wall 402. Through the openings 411 and 412, the substrate W is carried in and out between the heat treatment unit PHP and the hot plate HP and the second central robot CR2.

  A plurality of shielding plates 450 are horizontally provided between the outer standing wall 401 and the inner standing wall 402. Further, an exhaust duct 460 is formed at a side end portion on the −Y direction side between the outer standing wall 401 and the inner standing wall 402 of the bake box 400. The exhaust duct 460 is formed in a rectangular tube shape extending in the ± Z direction of the bake box 400. An opening is provided on the side surface of the exhaust duct 460 as will be described later. The relationship between the double standing walls 401 and 402, the openings 411 and 412 and the exhaust duct 460 will be described later.

  The plurality of heat treatment units PHP and the plurality of hot plates HP are respectively stored in a plurality of storage spaces formed vertically by the box partition plate 410 of the bake box 400.

  Each heat treatment unit PHP includes a delivery unit 201, a heating unit 202, and a local transport mechanism 300. The local transport mechanism 300 transports the substrate W between the transfer unit 201 and the heating unit 202. Hot plate HP includes a heating unit 202.

  FIG. 6 is a cross-sectional view of a part of the bake box 400, and FIG. 7 is a vertical cross-sectional view of a part of the bake box 400.

  As shown in FIGS. 6 and 7, a shutter opening / closing cylinder 420, a shutter opening / closing piston 421, a shutter 422, and an exhaust duct 460 are provided between the outer standing wall 401 and the inner standing wall 402.

  As shown in FIG. 7, the hot plate HP includes an upper lid 211, a heating plate 213, and a plurality of movable support pins 214.

  The heating plate 213 of the heating unit 202 is provided with a plurality of through holes, and a plurality of movable support pins 214 are provided in the plurality of through holes. The substrate W is supported by the plurality of movable support pins 214. An upper lid 211 is provided so as to cover the heating plate 213. The upper lid 211 and the movable support pin 214 simultaneously move up and down in the ± Z directions by the action of an upper lid opening / closing drive device (not shown).

  As shown in FIG. 7, the length L11 in the Z direction of the opening 411 of the outer standing wall 401 is longer than the length L12 of the opening 412 in the inner standing wall 402 in the Z direction. The length L12 of the opening 412 is set to a length necessary for carrying in and carrying out the substrate W carried into the hot plate HP. The upper end (end position in the + Z direction) of the opening 411 is set to substantially the same height as the upper end (end position in the + Z direction) of the opening 412, and the lower end (−Z direction in the −Z direction) of the opening 411. The end position is set below the lower end of the opening 412 (end position in the -Z direction).

  Further, the lower end of the opening 411 is provided so as to be positioned below the upper surface of the heating plate 213. That is, the lower end of the opening 411 is provided so as to be positioned below the substrate W supported by the heating plate 213.

  Further, the length L11 of the opening 411 of each step is set so that the length L11 of the opening 411 of the upper outer standing wall 401 is longer than the length L11 of the opening 411 of the lower outer standing wall 401. Is set.

  The width of the opening 412 is set to a width necessary for carrying in and carrying out the substrate W carried into the hot plate HP. The width of the opening 411 is set larger than the width of the opening 412.

  As shown in FIGS. 6 and 7, the outer standing wall 401 of the bake box 400 is provided in parallel to the inner standing wall 402 with a predetermined interval L1. The predetermined distance L1 is preferably 20 mm or greater and 50 mm or less, and more preferably 20 mm or greater and 30 mm or less. In the present embodiment, the predetermined interval L1 is, for example, 27.5 mm. As a result, a downflow described later can flow into a space having a predetermined interval L1 formed between the outer standing wall 401 and the inner standing wall 402.

  Further, the heating plate 213 is provided at a predetermined distance L13 from the inner standing wall 402 of the bake box 400. The predetermined distance L13 is preferably 30 mm or greater and 80 mm or less. In the present embodiment, the predetermined interval L13 is, for example, 40 mm. Thereby, even when a downflow described later flows into the storage space in which the hot plate HP is stored, the influence of the downflow exerted on the hot plate HP by the predetermined interval L13 can be reduced.

  Next, as shown in FIG. 7, the shutter 422 opens and closes the opening 411 of the outer standing wall 401 as the shutter opening / closing piston 421 moves up and down in the ± Z direction.

  Here, in FIG. 7, the shutter 422 positioned at the uppermost stage shows a case where the shutter opening / closing piston 421 moves upward and the opening 411 is closed, and the shutter 422 positioned at the lower stage is the shutter 422. The case where the opening / closing piston 421 moves downward and the opening 411 is in an open state is shown.

  When the shutter opening / closing piston 421 moves upward and the opening 411 is closed by the shutter 422, the downflow FL1 is a space having an interval L1 between the outer standing wall 401 and the inner standing wall 402 from the opening 411. Does not flow into.

  On the other hand, when the shutter opening / closing piston 421 moves downward and the opening 411 is opened by the shutter 422, the downflow FL2 is caused by the interval L1 between the outer standing wall 401 and the inner standing wall 402 from the opening 411. Flows into the space.

  Next, FIG. 8 is a diagram for explaining the flow of the downflow FL2 that has flowed from the opening 411 of the outer standing wall 401.

  As shown in FIG. 8, the exhaust duct 460 has an opening 470 above the intersection with the shielding plate 450.

  The downflow FL2 that has flowed in from the opening 411 flows in the space of the interval L1 between the outer standing wall 401 and the inner standing wall 402 and moves downward. The downward flow FL2 that moves downward is prevented from moving downward by the shielding plate 450, moves laterally, and is exhausted to the outside of the bake box 400 through the opening 470 of the exhaust duct 460. Thereby, it is possible to prevent the downflow FL2 from flowing into the storage space in which the hot plate HP is stored.

  Further, the flow rate of the down flow formed on the back side of the hot plate HP (on the local transport mechanism 300 side) is set larger than the flow rate of the down flow FL2 formed in the transport area. Thereby, the pressure in each storage space of the bake box 400 is higher than the pressure on the center robot CR2 side. Therefore, even when the shutter SH is opened, the downflow FL2 is prevented from flowing into the bake box 400.

  In the present embodiment, the case where the heat treatment unit PHP having the local transport mechanism 300 and the hot plate HP not having the local transport mechanism 300 are stored in the storage space of the bake box 400 has been described, but the present invention is not limited thereto. Instead, the heat treatment unit PHP having the local transfer mechanism 300 may be provided instead of the hot plate HP, and the hot plate HP not having the local transfer mechanism 300 may be provided instead of the heat treatment unit PHP.

  The configuration of the bake box used for the antireflection film heat treatment unit 101, the resist film heat treatment units 110 and 111, or the development heat treatment unit 120 is the same as the configuration of the bake box 400 used for the resist film heat treatment unit 110.

  Further, in the bake box used for the development heat treatment section 121, an opening is provided on the side wall in the + Y direction in addition to the side wall in the + X direction and the −Y direction so that the fourth central robot CR4 can access. Yes. In addition, the side wall is not provided in the −X direction and is in an open state. In the baking box corresponding to the substrate platform PASS7 of the development heat treatment unit 121, openings are provided in the + X direction and the + Y direction so that the third central robot CR3 and the fourth central robot CR4 can access. It has been.

  As described above, in the bake box 400 according to the present embodiment, it is possible to prevent the downflows FL1, FL2 from flowing into the storage space in which the hot plate HP is stored. As a result, the downflows FL1 and FL2 can prevent the heat treatment apparatus for the hot plate HP from becoming uneven.

  Further, the length L11 of the opening 411 of each step is set so that the length L11 of the opening 411 of the upper outer standing wall 401 is longer than the length L11 of the opening 411 of the lower outer standing wall 401. Therefore, even when the downflow FL2 slightly flows into the plurality of storage spaces, the amount of downflow flowing into the upper hot plate HP and the lower hot plate HP can be made uniform. As a result, it is possible to eliminate variations in the heat treatment performance of the hot plate HP caused by the difference in installation height of the multi-stage bake box 400. As a result, the processing uniformity of the substrate W can be maintained.

  Therefore, in order to maintain the processing uniformity of the substrate W, it is not necessary to make the plurality of storage spaces closed spaces, and the heat of the hot plate HP is not trapped in the storage space. Further, since the storage space does not need to be a closed space, it is low cost and easy to assemble.

  Furthermore, since the downflow FL2 hardly flows into the storage space, the downflow FL2 is not affected on the substrate W even if the upper lid 211 and the movable support pin 214 are moved up and down simultaneously. As a result, the vertical movement of the upper lid 211 and the movable support pin 214 can be controlled using the same mechanism, so that the installation space for providing another mechanism can be reduced and the cost can be reduced.

  Further, a downflow (not shown) formed on the hot plate HP side flows into the storage spaces of the bake box 400 from the space between the columns P1 and P2 of the bake box 400. The down flow formed on the hot plate HP side takes heat from the hot plate HP in each storage space of the bake box 400 and flows out from each storage space of the bake box 400 to the outside.

  Thereby, it is possible to prevent a thermal atmosphere from being accumulated in each storage space of the bake box 400. As a result, it is possible to prevent the thermal influence between the hot plates HP.

  Further, particles that can be generated in each storage space of the bake box 400 are drawn out of the storage space by a downflow flowing into the storage spaces from the open surface, and exhausted and discharged simultaneously with the downflow from above. As a result, the influence of particles on the substrate W can be minimized.

  Furthermore, since the back side of the bake box 400 is opened, it is possible to reduce the time spent for maintenance work and assembly time for the hot plate HP.

  In this embodiment, the processing region separation wall is provided integrally with the bake box 400. However, the present invention is not limited to this, and the processing region separation wall may be provided separately from the bake box 400. . Further, a processing region separation wall may be provided between the antireflection film coating processing unit 70, the resist film coating processing unit 80 or the development processing unit 90, and the transport area.

  In the embodiment of the present invention, the heat treatment area corresponds to the processing area of the substrate, the transfer area corresponds to the other area, the outer standing wall 401 and the inner standing wall 402 correspond to the processing area separation wall, and the outer standing area. The wall 401 corresponds to the first wall portion, the interval L1 corresponds to the predetermined interval, the inner standing wall 402 corresponds to the second wall portion, the substrate W corresponds to the substrate, and the opening 411 corresponds to the first wall portion. The opening 412 corresponds to the second opening, the partition plate 410 corresponds to the plurality of partition members, the shutter opening / closing cylinder 420, the shutter opening / closing piston 421, and the shutter 422 correspond to the closing member, The shielding plate 450 corresponds to the shielding part, the exhaust duct 460 corresponds to the exhaust part, the resist film heat treatment part 110 corresponds to the processing unit, the bake box 400 corresponds to the processing unit storage shelf, and the columns P1, 2 corresponds to the support member, the second central robot CR2 corresponds to the transport means, the interval L13 corresponds to the interval between the second wall portion of the processing region separation wall and the processing unit, and a plurality of movable support pins 214 are provided. Corresponds to the substrate support means.

  The processing space separation wall, the processing unit storage shelf, and the substrate processing apparatus according to the present invention can be used when performing various processing on a substrate.

1 is a plan view of a substrate processing apparatus according to an embodiment of the present invention. It is the side view which looked at the substrate processing apparatus of Drawing 1 from the -X direction. It is the side view which looked at the substrate processing apparatus of Drawing 1 from the + X direction. It is the external appearance perspective view which looked at the bake box of the heat processing part for anti-reflective films from the front. It is the external appearance perspective view which looked at the bake box of the heat treatment part for antireflection films from the back. It is a cross-sectional view of a part of the bake box. It is a longitudinal cross-sectional view of a part of the bake box. It is a figure for demonstrating the flow of the downflow which flowed in from the opening part of an outer side standing wall.

Explanation of symbols

DESCRIPTION OF SYMBOLS 110 Resist film heat treatment part 214 Several movable support pin 400 Bake box 401 Outer standing wall 402 Inner standing wall 410 Partition plate 411 Opening part 412 Opening part 450 Shielding board 460 Exhaust duct P1, P2 Support | pillar CR2 2nd center robot W board

Claims (9)

A processing unit storage shelf for storing processing units for performing predetermined processing on a substrate ,
A plurality of partition members disposed substantially horizontally at intervals from each other;
A support member that supports the plurality of partition members so as to form a plurality of storage spaces between the plurality of partition members;
A treatment region separation wall provided on at least one side of the plurality of storage spaces,
The processing region separation wall is
A first wall portion disposed on the outer side of the storage space so as to extend from the lower side of the partition member to the upper side of the partition member of said plurality of partition members,
A second wall portion provided on the inner side of the first wall portion to extend from the lower side of the partition member at a predetermined interval to the partition member of the upper relative to the first wall portion Prepared,
The first wall has a plurality of first openings for transferring the substrate between the inside and the outside of the plurality of processing spaces ,
It said second wall portion is to have a second opening plurality of the respective opposed substantially to the plurality of first openings,
A processing unit storage shelf , characterized in that an exhaust part for exhausting the space between the first wall part and the second wall part is provided . The processing unit storage shelf according to claim 1, wherein the other side surface of the plurality of storage spaces is open. Each lower end of the first opening, the processing unit storage rack according to claim 1 or 2, wherein the positioned lower than the lower end of the second opening opposite. A plurality of closure members for the plurality of the first openings and the plurality of second openings in the closed state is provided to be freely opened and closed between the second wall portion and the first wall portion The processing unit storage shelf according to any one of claims 1 to 3, wherein The shielding part which shields mutually the space between the 1st wall part and the 2nd wall part up and down between the plurality of 1st and 2nd opening parts is provided. The processing unit storage shelf in any one of 1-4 . The processing unit storage shelf according to any one of claims 1 to 5, wherein an interval between the first wall portion and the second wall portion is set to 20 mm or more and 50 mm or less. A processing unit storage rack according to any one of 請 Motomeko 1-6,
A processing unit that is disposed in any of the plurality of storage spaces of the processing unit storage shelf and processes the substrate;
A transport unit disposed in a region outside the processing region separation wall of the processing unit storage shelf and configured to carry a substrate into and out of the processing unit through the first and second openings of the processing region separation wall. A substrate processing apparatus. The substrate processing apparatus according to claim 7 , wherein a distance between the second wall portion of the processing region separation wall and the processing unit is set to 30 mm or more and 80 mm or less. The processing unit includes substrate support means for supporting a substrate,
The lower end of the first opening of the processing region separation wall is positioned below the substrate supported by the substrate support means of the processing unit, and the lower end of the second opening of the processing region separation wall is 9. The substrate processing apparatus according to claim 7 , wherein the substrate processing apparatus is positioned above a substrate supported by the substrate support means of the processing unit.

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