JP4125455B2 - Electronic component mounting apparatus and management system thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an electronic component mounting apparatus for mounting an electronic component taken out from a component supply unit on a printed board, and a management system thereof.
[0002]
[Prior art]
Japanese Patent Application Laid-Open No. 6-37497 discloses that various kinds of information is processed and displayed on an electronic component mounting apparatus that mounts an electronic component taken out from the component supply apparatus on a printed circuit board.
[0003]
According to the above publication, it is described that the suction rate of electronic components is totalized and displayed for each suction nozzle or the like.
[0004]
[Problems to be solved by the invention]
However, in the above prior art, quality information about the electronic component mounting apparatus itself can be grasped, but information about the electronic component cannot be grasped.
[0005]
In addition, although not described in the above publication, there is a multi-pin leaded component as one of the types of electronic components, and the lead floating due to the bending of the lead in the vertical direction is caused by poor soldering in this reflow process. May occur. In order to prevent the occurrence of the lead floating, the lead floating inspection is performed before mounting the components, and the lead floating inspection unit is installed in the mounting device so that the one that does not exceed the allowable bending value is not mounted. The total data of the inspection results was such that “OK / NG” management was performed as to whether or not the value was within the allowable value, and the total number of NG parts (total number of suction, NG number, defect rate) was calculated for each part. Therefore, in this case as well, the quality status of electronic parts including good products could not be grasped.
[0006]
Therefore, an object of the present invention is to make it possible to accurately grasp the quality status of electronic components handled by the electronic component mounting apparatus.
[0007]
[Means for Solving the Problems]
Thus the present invention, the electronic component by measuring the electronic component including fraud and mitigating risk leads taken out from the component supply unit to the electronic component mounting apparatus for mounting an electronic component is taken out from the component supply unit on a printed circuit board It has a detecting means for detecting the floating amount of the lead and a statistical processing means capable of statistically processing the floating amount of the lead detected by the detecting means for each type of the electronic component.
[0008]
By doing so, since the statistical processing unit is detected by the detecting means floating amount of the electronic component leads by measuring the electronic component taken out from the component supply device is statistical processing for each type of electronic component, electronic It is possible to know the amount of floating of the lead, which is the quality status of the component, for each type of electronic component.
[0009]
The statistical processing means is capable of performing histogram totaling processing on numerical information relating to electronic components.
[0010]
Since it did in this way, the dispersion | variation in the numerical information regarding an electronic component can be grasped | ascertained.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of an electronic component mounting apparatus according to the present invention will be described in detail with reference to the accompanying drawings.
[0014]
In FIG. 2, a pair of rails 5 for guiding the movement of the A beam 3 and the B beam 4 in the Y direction are disposed on the base 2 of the electronic component mounting apparatus 1. The A beam 3 and the B beam 4 are long in the X direction, and the mounting heads 7 and 8 are arranged to be movable along the longitudinal direction. Accordingly, the mounting heads 7 and 8 are movable in the XY directions. A ball screw shaft 11 rotated by the A side Y-axis motor 10 is screwed into a nut (not shown) fixed to the A beam 3, and the A beam 3 moves along the rail 5 by the rotation of the ball screw shaft 11. Is possible. Further, the B beam 4 moves along the rail 5 when the ball screw shaft 12 having the same structure is rotated by the B side Y axis motor 14. A component supply unit is formed at each of the upper and lower positions in FIG. 2 of the base 2, and component supply devices 16 that supply various electronic components 15 are arranged in parallel in the X direction in the component supply unit. The mounting head 7 transports and mounts the electronic component 15 taken out from the component supply device 16 by vacuum suction to a desired position on the printed circuit board 18.
[0015]
The printed circuit board 18 is transported by a transport conveyor 20 installed on the base 2 and positioned and fixed by a fixing mechanism (not shown) at a predetermined position.
[0016]
The electronic component 15 taken out from the component supply device 16 is recognized by the component recognition camera 21 for its positional deviation with respect to the mounting head 8.
[0017]
In addition, a lead float inspection unit 33 is installed on the base 2, and the amount of float (bending in the vertical direction) of a lead terminal 32 (see FIG. 1, hereinafter simply referred to as a lead) protruding from the electronic component 15 is large. Measured.
[0018]
The lead float inspection unit 33 will be described in detail.
[0019]
The electronic component 15 supplied by the component supply device 16 has a type in which a lead 32 is projected as shown in FIG. 1 (referred to as QFP or the like). Must be on the same plane. If they are not on the same plane, when they are mounted on the printed circuit board 18, leads 32 that float away from the board surface are generated, and such floating leads 32 are not soldered to the lands of the board 18. Because it ends up. In the case of FIG. 1, the lead 32 of (4) is bent upward from the other leads 32.
[0020]
The lead floating inspection unit 33 detects the degree of floating of the lead 32, and a pair of line CCDs are arranged on the same straight line. The unit 33 is provided with a light source such as an LED (not shown). Light emitted from the light source is irradiated from two directions onto a group of leads arranged in the same direction as the line CCD, and reflected from each lead 32. Is projected onto the line CCD, and the difference in projection position detected by the pair of line CCDs for each lead 32 appears as the floating amount of the lead 32. That is, when only the lead 32 of (4) is bent upward and its lower end position is above the other lead 32, how far the lower end position is from the reference plane formed by the lower end position of the other lead 32 Is detected as a floating amount. In the left CCD, the lead 32 of (4) appears on the left side, and on the right CCD, it appears on the opposite side. Since the floating amount and the projected position of the CCD are in a proportional relationship, the floating amount can be calculated.
[0021]
In this embodiment, the amount of floating due to the upward bending from the reference plane is set as plus, and the amount of floating due to the downward bending is calculated as negative. A difference between the maximum floating amount and the minimum floating amount in one component 15 calculated in this way is calculated, and a product that does not exceed a predetermined allowable value is defined as a non-defective product (OK). If either value exceeds the allowable value, it is determined as NG and is not mounted on the printed circuit board 18.
[0022]
This calculation and determination of OK / NG are performed in cooperation with both the lead float inspection unit 33 and the CPU 25 described later, and the lead float inspection unit 33 plays a role as a detection means for detecting numerical information related to electronic components. Plays.
[0023]
Next, the configuration of the control system of the electronic component mounting apparatus 1 will be described with reference to FIG.
[0024]
Each element of the electronic component mounting apparatus 1 is centrally controlled by the CPU 23, and a ROM 24 that stores a control program and a RAM 25 that stores various programs and various data are connected via a bus line 26. The CPU 23 also has a role as statistical processing means for performing statistical processing described later.
[0025]
Further, a CRT 27 for displaying an operation screen and the like and a touch panel 28 formed on the display screen of the CRT 27 are connected to the CPU 23 via an interface 30. The touch panel 28 arbitrarily displays a switch on the screen of the CRT 27. Further, the floating amount inspection unit 33 and the component recognition camera 21 are connected to the CPU 23 via the interface 30.
[0026]
Next, the production operation operation of the electronic component mounting apparatus 1 will be described.
[0027]
When the mounting head 7 takes out the electronic component 15 from the component supply device 16, it is transported onto the component recognition camera 21.
[0028]
Next, the camera 21 images the electronic component 15, and based on the image, the positional displacement of the electronic component 15 with respect to the mounting head 7 and the bending of each lead 32 in the horizontal plane are recognized.
[0029]
Next, the mounting head 7 conveys the electronic component 15 onto the lead float inspection unit 33, and the unit 33 detects the lead float amount of the lead row on each side as described above.
[0030]
The CPU 23 calculates the difference between the maximum floating amount and the minimum floating amount in the one component 15. That is, if the maximum floating amount is a positive value and the minimum floating amount is negative, the sum of the absolute values of both is calculated as a difference value.
[0031]
Next, the CPU 23 adds 1 to the counter provided in the RAM 25 for each section of the electronic component type (indicated by the component ID) corresponding to the difference value of the floating amount and the floating amount difference value. That is, the RAM 25 is provided with a counter that counts the frequency for each section of the floating amount difference value with a width of 0.01 mm for each component ID. By adding this counter, the floating amount difference value is obtained. It is counted for each part type and section.
[0032]
Next, when the difference value of the floating amount is within the allowable value, the mounting head 7 conveys the electronic component 15 onto the printed board 18. Then, the calculated position deviation amount with respect to the mounting head 7 is corrected so as to be positioned at the mounting position at an angle to be mounted. That is, the positioning in the XY directions is performed by correcting the positional deviation by the movement of the A beam 3 and the head 7 on the beam 3, and the angular positioning is performed by the mounting head itself rotating around the vertical axis in consideration of the correction amount. Made.
[0033]
Further, when the detected floating amount difference value exceeds the allowable value, the electronic component 15 is mounted on a predetermined disposal station (not shown) without being mounted on the substrate 18. The electronic component having the lead 32 placed in the disposal station is used again after the lead 32 is corrected.
[0034]
In this way, the electronic component 15 is mounted on the printed circuit board 18 and is transported to the transport conveyor 20 each time one printed circuit board 18 is completed, and mounting of the electronic component 15 is continued on the next circuit board 18 in the same manner. The
[0035]
In this way, the frequency is totaled in the counter that counts the frequency for each section of the floating amount difference value with a width of 0.01 mm for each component ID in the RAM 25 as the statistical processing means. Note that this total is calculated for all the electronic components 15 inspected by the lead float inspection unit 33 for the corresponding component type regardless of whether the floating amount difference value is within the allowable value or not. Done. This aggregation, that is, statistical processing is performed by the CPU 23 as statistical processing means.
[0036]
As described above, after the floating amount difference values, which are numerical information, are aggregated to some extent, when the screen shown in FIG. 5 is displayed on the CRT 27, the operator displayed the lead floating amount histogram by operating the touch panel switch 28. By pressing the inside of the frame, the CPU 23 as the display means displays the histogram of FIG. 1 on the CRT 27 as a graphed statistical processing result. This component ID is displayed for other items by pressing page feed and page return.
[0037]
The operator, for example, from the histogram of FIG. 1 shows that the electronic component of this component ID has a lead floating amount difference value within the allowable value of 0.10 mm, but is worse than the normal quality, and further increases the allowable value. It can be grasped that many things that become defective will occur if it is severe. This is because most of the normal quality seems to be concentrated at a frequency close to 0 mm.
[0038]
In this histogram, the vertical axis indicates the percentage of the total frequency (“detection frequency” in FIG. 1) for the component ID, but the frequency itself can also be displayed. However, FIG. 1 also shows the frequency (number of detections for each section) in the information for each section.
[0039]
By pressing a switch formed on the erasing execution touch panel on the screen of FIG. 6, all counter values can be erased to “0” for each component ID. The erased date and time can be known from the update date and time (FIGS. 1 and 6), so that it can be seen from when the current counting result is from.
Not only this histogram but CPU23 can calculate and display values, such as an average value, a deviation, and 3 sigma, for every kind of parts as other statistical processing.
[0040]
In this way, if the component ID is changed for each lot and maker and aggregated, the status of the lead floating amount (that is, the quality status of the electronic component) can be known for each maker of the lot or electronic component.
[0041]
Further, it is possible to know how non-defective products and defective products are distributed when the allowable value of the lead floating amount is changed based on the aggregated histogram results.
[0042]
Further, in the present embodiment, the counter for each section of the RAM 25 counts the frequency of the difference value between the maximum value and the minimum value of the read float amount, but the section counter is provided for the maximum value and minimum value of the read float amount. It may be counted for each component 15.
[0043]
In this embodiment, an example of the lead float inspection unit is described as the detection means. However, the numerical information of the electronic component detected by the component recognition apparatus that recognizes the position of the electronic component may be statistically processed and displayed. For example, statistical processing can be performed on the amount of bending of the lead in the horizontal direction, the value of the component dimension in the horizontal direction, and the like.
[0044]
In this embodiment, the electronic component mounting apparatus has a function of performing statistical processing. However, various numerical information detected by the electronic component mounting apparatus is statistically processed by a personal computer or the like to form an electronic component mounting apparatus management system. Also good.
[0045]
【The invention's effect】
As described above, according to the present invention, the lead floating amount of the lead of the electronic component detected by measuring the electronic component can be statistically processed for each type of electronic component. Can be accurately grasped for each type of electronic component.
[0046]
Further, the statistical processing unit since a histogram aggregatable process for each type of numeric information electronic components to an electronic component, the variation of the numerical information relates to an electronic component can be grasped, it can accurately grasp the quality conditions.
[Brief description of the drawings]
FIG. 1 is a diagram showing a lead floating amount in a histogram.
FIG. 2 is a plan view of the electronic component mounting apparatus.
FIG. 3 is a control block diagram of the electronic component mounting apparatus.
FIG. 4 is a side view showing a lead float inspection unit.
FIG. 5 is a diagram showing a CRT operation screen for displaying a lead floating histogram.
FIG. 6 is a CRT operation screen for erasing a lead floating histogram.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Electronic component mounting apparatus 15 Electronic component 16 Component supply apparatus 18 Printed circuit board 23 CPU (statistical processing means)
25 RAM (statistical processing means)
27 CRT (display means)
33 Lead float inspection unit (detection means)

Claims (2)

In an electronic component mounting apparatus for mounting an electronic component taken out from a component supply unit on a printed circuit board,
Detecting means for detecting a floating amount of the electronic component leads by measuring the components taken from the supply unit electronic component having a lead, a floating amount of lead is detecting means detects for each type of the electronic component An electronic component mounting apparatus comprising statistical processing means capable of statistical processing. In an electronic component mounting apparatus for mounting an electronic component taken out from a component supply unit on a printed circuit board,
Detection means for detecting numerical information about the electronic component by measuring the dimensions of the electronic component taken out from the component supply unit, and numerical information detected by the detection means can be aggregated for each type of electronic component An electronic component mounting device comprising statistical processing means .

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