JP4123123B2 - Photoelectric composite parts - Google Patents

Description

  The present invention relates to a photoelectric composite component used for optical transmission and the like.

As an optical transmission module that performs optical transmission, for example, as described in Patent Document 1, an optical signal generated by a light emitting element is transmitted by an optical fiber, or an optical signal propagated through an optical fiber is received by a light receiving element. What is known to receive light.
JP-A-7-35958

  Such optical transmission modules include not only optical devices such as light emitting elements and light receiving elements but also electronic devices such as IC chips. In such an optical transmission module, downsizing is strongly desired due to restrictions such as a storage space in the module.

  An object of the present invention is to provide an optoelectric composite component that enables a compact module including an optical device and an electronic device.

The optoelectric composite component of the present invention includes a ferrule having a fiber hole for positioning and holding an optical fiber, and a metal plating portion formed on the outer surface of the ferrule for performing electrical wiring. The ferrule is made of polyphenylene sulfide resin. Or a material containing an epoxy resin and an inorganic filler made of fused quartz , the inorganic filler is exposed and formed on the outer surface , the ferrule has a linear expansion coefficient of 25 ppm / K or less, and the glass transition of the ferrule The temperature is 85 ° C. or higher.

When a module including an optical device and an electronic device is configured using such a photoelectric composite component, an optical fiber is inserted into a fiber hole of a ferrule and fixed. Different devices are electrically connected to each other through a metal plating part formed on the outer surface of the ferrule. Thus, by providing a fiber hole and a metal plating part in a ferrule, an optical wiring part and an electrical wiring part can be integrated into one ferrule. Therefore, the module can be made more compact than when the optical device storage area and the electronic device storage area are separated in the module.
Further, since the ferrule is formed of a material containing polyphenylene sulfide resin or epoxy resin, a ferrule having excellent mechanical strength can be obtained. In addition, when these resins are filled with fused quartz or the like, the shrinkage rate of the resin becomes small, and the dimensional accuracy of the ferrule is easily obtained.
Moreover, since the linear expansion coefficient of the ferrule is 25 ppm / K or less, it is possible to prevent a large stress from being applied to the optical fiber when the optical fiber is inserted into the fiber hole of the ferrule.
Since the glass transition temperature of the ferrule is 85 ° C. or more, the heat resistance of the ferrule is increased, and the ferrule is less likely to be thermally deformed, which is advantageous for the use of the photoelectric composite component in a high temperature environment.
Moreover, since the inorganic filler is exposed on the outer surface of the ferrule, the adhesion between the ferrule and the metal plating part can be improved.

  Preferably, the metal plating part is continuously formed on the plurality of surfaces of the ferrule. As a result, for example, in a state where the photoelectric composite component is placed on the electric substrate, different devices can be electrically connected to each other via the metal plating portion and the electric wiring pattern formed on the electric substrate. Become.

  Preferably, the ferrule is formed of a material containing a polyester resin. Thereby, the ferrule excellent in mechanical strength and heat resistance can be obtained.

  In this case, preferably, the ferrule is a polycondensate of a dicarboxylic acid component and a diol component, the polyester resin having a non-conjugated carbon-carbon double bond in the molecule, and 2 in the molecule. Melting from a resin composition containing 150 to 1500 parts by weight of an inorganic filler with respect to 100 parts by weight of a mixture containing 10 to 50% by weight of a polyfunctional compound having one or more carbon-carbon double bonds The ferrule has a fracture bending strength at 20 ° C. of 80 Mpa or more. Thereby, a ferrule having a high glass transition temperature and a small linear expansion coefficient can be obtained. In addition, by setting the blending ratio of the materials as described above, the degree of crosslinking by irradiation with ionizing radiation is sufficiently high, and the bending strength and bending elastic modulus of the ferrule are increased, so that the ferrule is easily deformed and broken. There is nothing.

  In this case, the polyester resin is based on the total dicarboxylic acid component, and the weight of the dicarboxylic acid component containing 10 to 60 mol% of the unsaturated dicarboxylic acid component having a non-conjugated carbon-carbon double bond in the molecule and the diol component. A condensate is preferred. As a result, the degree of crosslinking due to irradiation with ionizing radiation is further increased, and the impact strength of the ferrule is increased.

  Preferably, the polyfunctional compound is at least one polyfunctional monomer selected from the group consisting of polyfunctional acrylic acid esters, polyfunctional isocyanuric acid esters, and polyfunctional cyanuric acid esters. As a result, the resin composition can be crosslinked without irradiating a considerably large amount of ionizing radiation, which is advantageous in terms of cost.

  Further preferably, the inorganic filler is fused quartz. Thereby, the mechanical strength of the ferrule can be further increased.

  In this case, the fused quartz preferably includes spherical quartz and crushed quartz. By including the crushed quartz in this way, the metal plating part becomes difficult to peel off from the ferrule, and the adhesion between the ferrule and the metal plating part is improved.

  In this case, the crushed quartz content is preferably 1/10 to 1/2. Accordingly, the ferrule and the metal plating portion are sufficiently adhered to each other and good resin flowability is ensured, so that the ferrule can be easily formed.

  Moreover, the structure formed by shape | molding the ferrule with the material containing polyphenylene sulfide resin or an epoxy resin may be sufficient. Also in this case, a ferrule excellent in mechanical strength can be obtained. In addition, when these resins are filled with fused quartz or the like, the shrinkage rate of the resin becomes small, and the dimensional accuracy of the ferrule is easily obtained.

  Preferably, the ferrule has a linear expansion coefficient of 25 ppm / K or less, and the glass transition temperature of the ferrule is 85 ° C. or more. Thereby, when an optical fiber is inserted into the fiber hole of the ferrule, it is possible to prevent a large stress from being applied to the optical fiber. In addition, the heat resistance of the ferrule is increased and the ferrule is less likely to be thermally deformed, which is advantageous for the use of the photoelectric composite component in a high temperature environment.

  Furthermore, preferably, the metal plating part has a Cu—Ni—Au hierarchical structure. Thereby, resistance as electrical wiring can be reduced while ensuring good adhesion between the ferrule and the metal plating portion.

  According to the present invention, since it includes a ferrule having a fiber hole for positioning and holding an optical fiber, and a metal plating portion formed on the outer surface of the ferrule for performing electrical wiring, it includes an optical device and an electronic device. The module can be made compact.

  DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of an optoelectric composite component according to the invention will be described with reference to the drawings.

  FIG. 1 is a perspective view showing an embodiment of a photoelectric composite component according to the present invention. In the figure, the photoelectric composite component 1 of the present embodiment has a rectangular parallelepiped ferrule 2. The ferrule 2 is formed with a plurality of fiber holes 3 for positioning and holding the optical fiber. Each fiber hole 3 extends at an equal pitch from one end surface (front surface) 2a of the ferrule 2 toward the other end surface (rear surface) 2b.

  On the outer surface of the ferrule 2, a plurality of metal plating portions 4 for performing electrical wiring are formed corresponding to each fiber hole 3. Each metal plating part 4 is continuously extended from the lower surface 2c of the ferrule 2 to the upper surface 2d through the front surface 2a. Moreover, each metal plating part 4 is formed so that the circumference | surroundings of opening of each fiber hole 3 may be included.

  In such an optoelectric composite component 1, the ferrule 2 has an inorganic filler (with respect to the mixture containing the polyester resin (A) and the polyfunctional compound (B) from the viewpoints of heat resistance and mechanical strength. The resin composition filled with C) is melt-molded and further formed by irradiation crosslinking with ionizing radiation.

  The polyester resin (A) used in the present embodiment is a polycondensate of a dicarboxylic acid component and a diol component, and is a thermoplastic resin having a non-conjugated carbon-carbon double bond in the molecule. Such a polyester resin (A) is irradiated with ionizing radiation in the presence of a polyfunctional compound (B) having two or more carbon-carbon double bonds in the molecule after molding a molded product having a predetermined shape. Therefore, it can be highly crosslinked.

  Examples of the dicarboxylic acid component include aromatic dicarboxylic acids such as terephthalic acid, isophthalic acid and naphthalenedicarboxylic acid, aliphatic dicarboxylic acids such as azelaic acid, and unsaturated aliphatic dicarboxylic acids such as fumaric acid, maleic acid and itaconic acid. It is done. The dicarboxylic acid component includes those obtained by converting a carboxyl group of a dicarboxylic acid into an alkyl ester (for example, ethyl ester) or a metal salt (for example, Na salt), or an acid anhydride group (for example, maleic anhydride).

  Examples of the diol component include ethylene glycol, propylene glycol, 1,4-butanediol, 1,6-hexanediol, cyclohexanedimethanol, bisphenol A, bisphenol A-ethylene oxide adduct, bisphenol A-propylene oxide adduct, and the like. It is done.

  The polyester resin (A) used in the present embodiment can be synthesized by a known method such as a polycondensation method or a transesterification method. In the synthesized polyester resin, a dicarboxylic acid component (dicarboxylic acid unit) and a diol component (diol unit) are generally present in equimolar% (50 mol% / 50 mol%).

  In order to synthesize a polyester resin (A) which is a polycondensate of a dicarboxylic acid component and a diol component and has a non-conjugated carbon-carbon double bond in the molecule, as the dicarboxylic acid component, non-conjugated carbon in the molecule. It is preferable to use an unsaturated dicarboxylic acid component having a carbon double bond. Examples of such unsaturated dicarboxylic acid components include unsaturated aliphatic dicarboxylic acids such as fumaric acid, maleic acid and itaconic acid described above, and these include acid anhydrides such as alkyl esters and maleic anhydride. Etc. are also included.

  The “non-conjugated carbon-carbon double bond” is a carbon-carbon double bond (C═C) existing as an unsaturated group in the main chain of the polyester resin. The term “non-conjugated carbon-carbon double bond” is used to distinguish it from a carbon-carbon double bond in an aromatic dicarboxylic acid such as terephthalic acid.

  The polyester resin (A) is a mixture of a dicarboxylic acid component containing 10 to 60 mol% of an unsaturated dicarboxylic acid component having a non-conjugated carbon-carbon double bond in the molecule and a diol component based on the total dicarboxylic acid component. A condensate is preferred. The ratio of the unsaturated dicarboxylic acid component is more preferably 15 to 50 mol%, particularly preferably 20 to 40 mol%. Thereby, when ionizing radiation is irradiated to a molded product molded from a resin composition containing a large amount of the inorganic filler (C) described in detail later, a sufficient degree of crosslinking is obtained, and Impact strength increases. Moreover, physical properties such as glass transition temperature of the irradiated crosslinked product can be highly balanced.

  The polyfunctional compound (B) having two or more carbon-carbon double bonds in the molecule is preferably a polyfunctional compound having a polymerizable carbon-carbon double bond (C = C). As such a polyfunctional compound (B), polyfunctional (meth) acrylic acid esters such as ethylene glycol dimethacrylate, 1,4-butanediol diacrylate, 1,6-hexanediol diacrylate, trimethylolpropane trimethacrylate, etc. And polyfunctional monomers such as polyfunctional isocyanurates such as triallyl isocyanurate and polyfunctional cyanurates such as triallyl cyanurate. Moreover, as a polyfunctional compound, polyfunctional oligomers, such as polyester acrylate, urethane acrylate, epoxy acrylate, can be used.

  These polyfunctional compounds (B) can be used alone or in combination of two or more. Among these, polyfunctional monomers such as trimethylolpropane trimethacrylate and triallyl cyanurate are preferable. Thereby, since the reactivity with ionizing radiation becomes high, the crosslinking of the resin composition can be completed without irradiating with much ionizing radiation. Therefore, it is advantageous considering the total production cost.

  As the inorganic filler (C), it is preferable to use fused quartz containing spherical quartz and crushed quartz from the viewpoint of mechanical strength and the like. Thus, since not only spherical quartz but also crushed quartz is included, the anchor effect is exhibited, so that the metal plating part 4 is difficult to peel off from the ferrule 2, and the ferrule 2 and the metal plating part 4 are not separated. Adhesion is improved. At this time, the content of the crushed quartz is preferably 1/10 to 1/2 of the whole fused quartz. By setting it as such a ratio, since an anchor effect can fully be exhibited and the flowability of molten resin becomes good, it becomes easy to perform resin molding.

  Here, as a compounding ratio of the polyester resin (A) and the polyfunctional compound (B), the polyester resin (A) is 50 to 90% by weight and the polyfunctional compound (B) is 10 to 50% by weight. Preferably, the polyester resin (A) is 55 to 85% by weight, the polyfunctional compound (B) is more preferably 15 to 45% by weight, the polyester resin (A) is 60 to 80% by weight, and the polyfunctional compound (B ) Is particularly preferably 20 to 40% by weight. As a result, when the molded product obtained from the resin composition filled with the inorganic filler (C) is irradiated with ionizing radiation, the degree of crosslinking becomes sufficient, and the bending strength and flexural modulus of the molded product are high. Become.

  The inorganic filler (C) is preferably contained at a ratio of 150 to 1500 parts by weight with respect to 100 parts by weight of the mixture of the polyester resin (A) and the polyfunctional compound (B). The blending ratio of the inorganic filler (C) is more preferably 200 to 1000 parts by weight, and particularly preferably 250 to 800 parts by weight. Thereby, the linear expansion coefficient of a resin composition and by extension, a molded article can be made extremely small.

  In the above, the resin composition containing the polyester resin (A), the polyfunctional compound (B), and the inorganic filler (C) is melt-molded into a predetermined shape using an injection molding method or the like. And the ferrule 2 is formed by irradiating ionizing radiation to the obtained molded article, and bridge | crosslinking. At this time, the irradiation dose of ionizing radiation is preferably in the range of 50 to 500 kGy from the viewpoint of the balance between crosslinkability and mechanical properties.

  The crosslinking process by irradiation with ionizing radiation is generally a process that can be performed at room temperature, and is not a process that cures under heating conditions. Therefore, there is very little shrinkage and residual distortion of the molded product due to crosslinking (curing), and high dimensional accuracy. Ferrule 2 with is obtained.

  The breaking bending strength at 20 ° C. (normal temperature) of the ferrule 2 is preferably 80 Mpa or more, and more preferably 100 Mpa or more. Note that the upper limit of the fracture bending strength is usually about 150 MPa. Thereby, the mechanical strength of the molded product is increased, and the ferrule is less likely to be deformed or broken.

  The linear expansion coefficient of the ferrule 2 is preferably 25 ppm / K or less, more preferably 20 ppm / K or less. In addition, the minimum of a linear expansion coefficient is about 10 ppm / K normally. Thereby, it is possible to prevent a large stress from being applied to the optical fiber 5 in a state where the optical fiber 5 is inserted and fixed in the fiber hole 3 of the ferrule 2 (see FIG. 2).

  Further, the glass transition temperature of the ferrule 2 is preferably 85 ° C. or higher, more preferably 100 ° C. or higher, and particularly preferably 130 ° C. or higher. The upper limit of the glass transition temperature is usually 300 ° C., preferably about 200 ° C. Thereby, the heat resistance of the ferrule 2 is improved and the ferrule 2 is less likely to be thermally deformed, so that the photoelectric composite component 1 can be used reliably even in a high temperature environment.

  As the material of the ferrule 2, in addition to the material containing the polyester resin as described above, a material containing polyphenylene sulfide (PPS) resin or epoxy resin can also be used. Also in this case, the ferrule 2 with high mechanical strength can be obtained.

  The material containing the PPS resin is preferably a mixture containing 20 to 40% by weight of a PPS resin having a viscosity of 100 to 300 poise and 60 to 80% by weight of an inorganic filler. Moreover, as a material containing an epoxy resin, it is preferable that it is a mixture containing 5-30 weight% of epoxy resins and 70-95 weight% of inorganic fillers. In any case, as the inorganic filler, it is preferable to use fused quartz similar to the inorganic filler (C). In this way, since a large amount of fused quartz is filled in the PPS resin or the epoxy resin, the shrinkage rate of the resin is reduced. Thereby, the ferrule 2 with high dimensional accuracy can be obtained.

  The metal plating part 4 formed on the outer surface of the ferrule 2 as described above has a Cu—Ni—Au hierarchical structure from the lower side. Thereby, the resistance of the metal plating part 4 used as electrical wiring becomes small. Moreover, Au plating can be reliably performed on the ferrule 2.

  At this time, in order to improve the adhesion between the ferrule 2 and the metal plating part 4, a ground treatment is performed on the lowermost Cu layer so that the quartz contained in the ferrule 2 is put out on the surface of the ferrule 2. Is desirable. Examples of such a base treatment include sand blast treatment for modifying the surface of the ferrule 2 by applying sand, plasma treatment for baking the surface of the ferrule 2, and alkali etching treatment for etching the surface of the ferrule 2.

  The metal plating part 4 is formed using, for example, injection molding. Specifically, resin is applied to an area other than the plating formation area on the outer surface of the ferrule 2 by injection molding. And the ferrule 2 with resin is put into a plating tank, and the metal plating part 4 is formed in the plating formation area in the outer surface of the ferrule 2. Finally, the resin on the outer surface of the ferrule 2 is melted by etching.

  FIG. 2 shows an example of use of the photoelectric composite component 1 described above. In the figure, for example, an optical fiber 5 exposed from a coating portion of a multi-core tape core wire (not shown) is inserted and fixed in the fiber hole 3 of the photoelectric composite component 1. Such an optoelectric composite component 1 is placed on a substrate 6 accommodated in a module (not shown). At this time, the metal plating part 4 of the photoelectric composite component 1 is in contact with the electrical wiring pattern 7 formed on the substrate 6.

  On the front side of the ferrule 2 on the substrate 6, a plurality of light emitting elements (optical devices) 8 are arranged so as to face the front end surfaces of the optical fibers 5. The optical signal generated in each light emitting element 8 is incident on each optical fiber 5 and is optically transmitted. On the substrate 6, an electronic device 9A such as an IC chip electrically connected to the electric wiring pattern 7 is mounted. Further, another electronic device 9 </ b> B is placed on the upper surface of the ferrule 2 so as to be in contact with the metal plating part 4. Thus, the electronic devices 9A and 9B are electrically connected to each other via the electric wiring pattern 7 on the substrate 6 and the metal plating part 4 of the optoelectric composite component 1.

  As described above, in the present embodiment, since the metal plating part 4 is formed on the outer surface of the ferrule 2 having the fiber hole 3, the ferrule 2 not only holds the optical fiber 5, but also electrically connects different devices to each other. It also has a function of making connection. Thus, when one ferrule 2 is effectively used as having an optical wiring portion and an electric wiring portion, the optical device storage region and the electronic device storage region are separated separately inside the module. In comparison, the module can be made more compact. Thereby, it becomes possible to reduce the influence of the storage space etc. in a module.

  In addition, the wiring form of the metal plating part 4 is not limited to the said embodiment, What is necessary is just to set suitably according to the usage of the photoelectric composite component 1. FIG. For example, as shown in FIG. 3, a part of the plurality of metal plating portions 4 is formed so as to continuously extend from the lower surface 2c of the ferrule 2 to the front surface 2a, and the remaining metal plating portions 4 are formed on the upper surface 2d of the ferrule 2. It is good also as a structure formed so that it might extend continuously from the front surface 2a.

  Needless to say, the optoelectric composite component of the present invention can also be applied to a ferrule having one fiber hole.

1 is a perspective view showing an embodiment of a photoelectric composite component according to the present invention. It is a figure which shows the usage example of the photoelectric composite component shown in FIG. It is a perspective view which shows other embodiment of the photoelectric composite component concerning this invention.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 ... Photoelectric composite component, 2 ... Ferrule, 3 ... Fiber hole, 4 ... Metal plating part, 5 ... Optical fiber.

Claims (2)

A ferrule having a fiber hole for positioning and holding the optical fiber;
Formed on the outer surface of the ferrule, comprising a metal plating portion for performing electrical wiring,
The ferrule is a material containing a polyphenylene sulfide resin or an epoxy resin and an inorganic filler made of fused quartz , and the inorganic filler is exposed on the outer surface, and is molded.
The ferrule has a linear expansion coefficient of 25 ppm / K or less,
An optoelectric composite part, wherein the ferrule has a glass transition temperature of 85 ° C. or higher. The optoelectric composite component according to claim 1, wherein the metal plating portion has a Cu—Ni—Au hierarchical structure.

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