JP2010250957A - Connector, electrically bonding structure, and method for bonding between connector and printed circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a connector capable of firmly and easily performing bonded fixing and electrical bonding between the connector and a printed circuit board with a wiring by effectively using heat based on heating, an electrically bonding structure made of the connector and the printed circuit board with the wiring, and to provide a method for bonding between the connector and the printed circuit board with a wiring. <P>SOLUTION: In the connector 200 wherein it is arranged on the wiring 120 of the printed circuit board 100 via a bonding material 300 and it is bonded and fixed on the printed circuit board 100 by receiving heating and pressure in order to complete electrical bonding with the wiring 120, a conductor 220 corresponding to the wiring 120 of the printed circuit board 100 is arranged on a bonding face 212 with the printed wiring 100 in the connector 200, and the conductor 220 is arranged by extending from the bonded face 212 to a heat receiving surface 214 receiving the heating. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a connector, an electrical joint structure including the connector and a printed wiring board provided with a wiring part, and a method for joining the connector and a printed wiring board provided with the wiring part.

Conventionally, in a module including an optical device and an electronic device, a conductor (ferrule) having a metal plating portion on the outer surface is disposed on a wiring portion of a substrate as a conductor portion for performing electrical wiring. Yes.
There exists following patent document 1 as such a thing.
Patent Document 1 listed below is an invention relating to an optoelectric composite component, and discloses an optoelectric composite component that enables a compact module including an optical device and an electronic device.

Japanese Patent Laying-Open No. 2005-115284

In such a module, solder is used as a method for joining the metal plating part of the connector (ferrule) and the wiring part of the substrate.
However, when solder is used as a method for joining the metal plating part of the connector (ferrule) and the wiring part of the substrate, the process becomes complicated and soldering is performed for the metal plating part having a small pitch width. There was a problem that I could not. Moreover, since the pitch width of the metal plating portion cannot be reduced, there has been a problem that the module cannot be reduced in size.

  Therefore, the present invention solves the above-mentioned problems in the prior art, and can effectively and securely join and fix the electrical connection between the connector and the printed wiring board provided with the wiring portion by effectively using the heat generated by heating. In addition, a connector capable of reducing the size of the module, an electrical joint structure including the connector and a printed wiring board provided with the wiring part, and a method for joining the connector and the printed wiring board provided with the wiring part The issue is to provide

  The connector of the present invention is arranged on the wiring portion of the printed wiring board via a bonding material, and is bonded and fixed on the printed wiring board by receiving heating and pressurization, whereby the wiring of the printed wiring board An electrical connection with the printed circuit board is also completed, wherein the connector is provided with a conductor portion corresponding to the wiring section of the printed wiring board on the bonding surface with the printed wiring board, and the conductor. The first feature is that the portion extends from the joint surface to the heat receiving surface that receives the heating.

  According to the first aspect of the present invention, the printed wiring board is disposed on the wiring portion of the printed wiring board via the connecting material, and is bonded and fixed on the printed wiring board by receiving heat and pressure, thereby An electrical connection with the wiring portion of the printed wiring board is also completed, and the connector includes a conductor portion corresponding to the wiring portion of the printed wiring board on a joint surface with the printed wiring board. And the conductor portion is arranged to extend from the joining surface to the heat receiving surface that receives the heating, so that the heat received by the heat receiving surface is reliably transferred to the joining surface via the conductor portion. Heat can be transferred. Therefore, the connector and the printed wiring board can be joined by effectively using the heat received on the heat receiving surface.

  In addition to the first feature of the present invention, the connector of the present invention has a second feature that the heat receiving surface is configured as a back surface corresponding to the joint surface with the printed wiring board.

  According to the second feature of the present invention, in addition to the function and effect of the first feature of the present invention, the heat receiving surface is configured as a back surface corresponding to the joint surface with the printed wiring board. Heat received on the back surface corresponding to the joint surface with the printed wiring board can be reliably transferred to the joint surface via the conductor.

  In addition to the second feature of the present invention, the connector of the present invention has a third feature that the heat receiving surface is formed on the same surface as the pressure receiving surface that receives pressure.

  According to the third feature of the present invention, in addition to the function and effect of the second feature of the present invention, the heat receiving surface is configured to be the same surface as the pressure receiving surface that receives pressure. Pressure and heat can be applied simultaneously.

  The connector according to the present invention, in addition to any one of the first to third features of the present invention, is used for connecting an external wiring to a part of the conductor portion that is extended from the joint surface to the heat receiving surface. The fourth feature is that a connecting portion is provided.

  According to the fourth feature of the present invention, in addition to the function and effect of any one of the first to third features of the present invention, the conductor portion arranged to extend from the joint surface to the heat receiving surface. Since a connection part for external wiring connection is provided in a part of the connector, it is possible to provide a connector that can be easily connected to the external wiring.

  Further, in the connector of the present invention, in addition to any one of the first to fourth features of the present invention, the conductor portion is formed from a set of a plurality of conductors arranged in parallel with a predetermined interval. This is the fifth feature.

  According to the fifth aspect of the present invention, in addition to the function and effect of any one of the first to fourth aspects of the present invention, the conductor portions are arranged in parallel at a predetermined interval. Since it is configured as a set of a plurality of conductors, electrical connection with the wiring portion of the printed wiring board and electrical connection between different devices can be performed at a plurality of locations, and a functional connector can be obtained. .

  The connector of the present invention is an anisotropic conductive material including an anisotropic conductive film and an anisotropic conductive paste in addition to any one of the first to fifth features of the present invention. This is the sixth feature.

  According to the sixth aspect of the present invention, in addition to the function and effect of any one of the first to fifth aspects of the present invention, the bonding material includes an anisotropic conductive film and an anisotropic conductive paste. Since it is an anisotropic conductive material containing, it can be set as the joining material which has electroconductivity only to a pressurization direction, and has adhesiveness by the thermosetting accompanying a heating.

  Further, the connector of the present invention has a seventh feature that a connecting portion for an optical fiber is provided in addition to any one of the first to sixth features of the present invention.

  According to the seventh feature of the present invention, in addition to the function and effect of any one of the first to sixth features of the present invention, an optical fiber connecting portion is provided. It can be used as a connector.

  An electrical junction structure according to the present invention is an electrical junction structure comprising the connector according to any one of claims 1 to 7 and a printed wiring board provided with a wiring portion. The eighth feature is that the printed circuit board is bonded and fixed to the printed wiring board via a material, and electrical connection with the wiring portion of the printed wiring board is also completed.

  According to the eighth aspect of the present invention, there is provided an electrical junction structure comprising the connector according to any one of claims 1 to 7 and a printed wiring board provided with a wiring portion. Since it is configured to be bonded and fixed on the printed wiring board via a bonding material and to be electrically connected to the wiring portion of the printed wiring board, the heat received on the heat receiving surface is effectively used. Thus, the connector can be bonded and fixed on the printed wiring board provided with the wiring portion, and electrical connection with the wiring portion of the printed wiring board can be completed.

  Moreover, the joining method of the connector of this invention and the printed wiring board provided with the wiring part is a joining method of the connector of any one of Claims 1-7, and the printed wiring board provided with the wiring part. The connector is disposed on the printed wiring board via a bonding material, and in that state, the connector is pressed in the direction of the printed wiring board, and the heat received at the heat receiving surface is transferred to the bonding surface via the conductor portion. The ninth feature is that heat transfer is performed, whereby the connector is bonded and fixed onto the printed wiring board, and electrical connection with the wiring portion of the printed wiring board is also completed.

  According to a ninth aspect of the present invention, there is provided a method for joining the connector according to any one of claims 1 to 7 to a printed wiring board provided with a wiring portion, wherein the connector is the printed wiring. It arrange | positions through a joining material on a board, and it pressurizes the said connector toward the said printed wiring board in the state, and also heat-receives in the heat receiving surface to a joining surface via a conductor part, and, thereby, the said connector Is fixed to the printed wiring board and the electrical connection with the wiring portion of the printed wiring board is also completed. Therefore, the connector receives the wiring portion by effectively using the heat received on the heat receiving surface. It is possible to bond and fix the printed circuit board on the printed circuit board and to complete the electrical connection with the wiring part of the printed circuit board.

  According to the connector of the present invention, the electrical junction structure including the connector and the printed wiring board provided with the wiring portion, and the method for joining the connector and the printed wiring board provided with the wiring portion, heat generated by heating is effectively obtained. By using the connector and the printed wiring board provided with the wiring portion, the connector can be firmly and easily bonded and electrically connected, and the module can be reduced in size, the connector and the wiring portion. It can be set as the joining method of the electrical junction structure which consists of the provided printed wiring board, and the printed wiring board provided with the said connector and the said wiring part.

It is a perspective view which shows the electrical junction structure which concerns on embodiment of this invention. An electrical junction structure is shown, (a) is a part of sectional drawing in the AA line direction of FIG. 1, (b) is a part of sectional drawing in the BB line direction of FIG. It is a figure which simplifies and shows the formation method of the electrical-junction structure which concerns on embodiment of this invention. It is a perspective view which shows the modification of the connector which comprises the electrical junction structure which concerns on embodiment of this invention.

  With reference to the following drawings, an electrical junction structure according to an embodiment of the present invention and a method for forming the electrical junction structure will be described for the understanding of the present invention. However, the following description is an embodiment of the present invention, and does not limit the contents described in the claims.

  First, an electrical junction structure according to an embodiment of the present invention will be described with reference to FIGS.

  An electrical junction structure 1 according to an embodiment of the present invention is used as a photoelectric conversion module. As shown in FIGS. 1 and 2, a printed wiring board 100, a connector 200, and a joining material 300 are used. Composed. Specifically, as shown in FIG. 1B, the optical fiber 400 is inserted into the bonding hole 211 of the electrical bonding structure 1, and a VCSEL (Vertical Cavity Surface Emitting Laser), IC (not shown), IC ( It is used as a photoelectric conversion module by connecting with an integrated circuit (integrated circuit) or the like.

The printed wiring board 100 is a printed board having a wiring portion, and includes a substrate 110 and a wiring portion 120 as shown in FIGS.
As the printed wiring board 100, any flexible printed wiring board, printed circuit board, rigid wiring board, glass circuit board, or the like that is usually used as a printed wiring board may be used.

The connector 200 is disposed on the wiring portion 120 of the printed wiring board 100, positions the optical fiber 400, and electrically connects different devices such as an optical device and an electronic device, and these devices and the printed wiring board 100. It is a connector for joining.
As shown in FIGS. 1 and 2, the connector 200 includes a base material 210 and a conductor portion 220.

The base material 210 is a base body of the connector 200 and is formed of resin.
As the resin, any resin can be used as long as it is usually used as a resin for forming the connector. For example, a polyester resin, an epoxy resin, or a polyphenyllene sulfide resin can be used. By setting it as such a structure, it can be set as the connector 200 excellent in mechanical strength and heat resistance.
Further, as shown in FIGS. 1 and 2, the base material 210 is provided with a connection hole 211 as a connection portion for the optical fiber 400.

The conductor portion 220 is for electrically connecting the wiring portion 120 and the connector 200 and for electrically connecting different devices such as an optical device and an electronic device, and those devices and the printed wiring board 100.
As shown in FIGS. 1 and 2, the conductor portion 220 includes a conductor 221 and a connection hole 222.

As shown in FIG. 2B, the conductor 221 is provided on the joint surface 212 of the base material 210 with the printed wiring board 100 so as to correspond to the wiring part 120. By adopting such a configuration, the connector 200 and the printed wiring board 100 are bonded and fixed to the connector 200 and the printed wiring board 100 via the bonding material 300 in a state where the conductor 221 and the wiring portion 120 are positioned. The electrical connection with 100 can also be completed.
The conductor 221 may be any material as long as it is normally used as a conductor, such as a copper foil.

As shown in FIG. 2, the conductor 221 is disposed so as to extend from the joint surface 212 through the side surface 213 to the heat receiving surface 214.
By adopting such a configuration, different devices can be bonded to each other, or these devices and the printed wiring board 100 can be electrically bonded to each other by bonding different devices to the conductor 221 of the side surface 213 and the heat receiving surface 214. .

  In addition, as shown in FIGS. 1 and 2, four conductors 221 having a predetermined interval are arranged in parallel. That is, the conductor part 220 is composed of a set of a plurality of conductors 221 arranged in parallel at a predetermined interval. By setting it as such a structure, the electrical connection with the wiring part 120 of the printed wiring board 100 and the electrical connection of different devices can be performed in several places, and it can be set as the functional connector 200. FIG.

  Further, as shown in FIGS. 1 and 2, the conductor portion 220 is provided with a connection hole 222 as a connection portion for the optical fiber 400.

  The joining material 300 is used for joining and fixing the connector 200 on the printed wiring board 100 and for completing electrical joining between the connector 200 and the wiring portion 120 of the printed wiring board 100.

  As the bonding material 300, a conductive adhesive containing conductive particles or an anisotropic conductive material can be used. By adopting such a configuration, even when the pitch width of the conductor part 220 of the connector 200 and the wiring part 120 of the printed wiring board 100 is small, the connector 200 can be satisfactorily bonded and fixed onto the printed wiring board 100. As a result, electrical connection with the wiring part 120 of the printed wiring board 100 can be performed well. Therefore, it can be set as the electrical junction structure 1 which can achieve size reduction of a module.

As a conductive adhesive, an insulating thermosetting resin such as an epoxy resin as a main component and conductive particles dispersed in the resin can be used. For example, an epoxy resin in which conductive powder such as nickel, copper, silver, gold, or graphite is dispersed can be used.
Moreover, as a thermosetting resin, an epoxy resin, a phenol resin, a polyurethane resin, an unsaturated polyester resin, a urea resin, and a polyimide resin can be used, for example. By using these thermosetting resins, the heat resistance and adhesive strength of the bonding material 300 can be improved.

  An adhesive containing a latent curing agent can also be used as the conductive adhesive. This latent curing agent is a curing agent that is excellent in storage stability at a low temperature and hardly undergoes a curing reaction at room temperature, but rapidly undergoes a curing reaction by heat or light. As this latent curing agent, imidazole series, hydrazide series, boron trifluoride-amine complex, amine imide, polyamine series, tertiary amine, alkyl urea series and other amine series, dicyandiamide series, acid anhydride series, phenol series , And modified products thereof are exemplified, and these are used alone or as a mixture of two or more.

An anisotropic conductive film or anisotropic conductive paste can be used as the anisotropic conductive material. Thus, by using an anisotropic conductive material, it is possible to obtain a bonding material 300 having conductivity only in the pressurizing direction and having adhesiveness by thermosetting accompanying heating.
The anisotropic conductive film and the anisotropic conductive paste may be any one as long as it is normally used as an anisotropic conductive material such as an epoxy resin or an acrylic resin.
Further, the shape of the conductive particles may be any shape as long as it is usually used as the conductive particles, such as a columnar shape, a spherical shape, a disk shape, a plate shape, and a needle shape.

  Next, with reference to FIG. 2 and FIG. 3, a method for forming the electrical joint structure 1 and a method for joining the printed wiring board 100 including the wiring part 120 and the connector 200 will be described.

First, referring to FIG. 3A, the anisotropic conductive film 310 is placed on the wiring part 120 of the printed wiring board 100. Then, in a state where the anisotropic conductive film 310 is heated to 80 degrees, the anisotropic conductive film 310 is temporarily bonded to the printed wiring board 100 by applying pressure to the printed wiring board 100 with a pressure of 0.5 MPa.
The conditions such as the heating temperature and the applied pressure of the anisotropic conductive film 310 are not limited to those in the present embodiment, and can be changed as appropriate.

  And as shown in FIG.3 (b), mounting the connector 200 on the anisotropic conductive film 310, aligning the wiring part 120 of the printed wiring board 100, and the conductor part 220 of the connector 200. FIG. Thus, the anisotropic conductive film 310 is interposed between the printed wiring board 100 and the connector 200.

Then, the heat receiving surface 214 of the connector 200 is heated to 180 degrees.
Here, as shown in FIG. 2A, the conductor portion 220 is disposed so as to extend from the joint surface 212 to the heat receiving surface 214 that receives heat through the side surface 213. Therefore, the heat applied to the heat receiving surface 214 is transferred from the conductor portion 220 disposed on the heat receiving surface 214 to the conductor portion 220 disposed on the joining surface 212 via the conductor portion 220 disposed on the side surface 213. heat. Therefore, the anisotropic conductive film 310 can be melted by this heat transfer.

At the same time, the pressure receiving surface 215 of the connector 200 is pressed in the direction of the printed wiring board 100 with a pressure of 2 MPa for 10 seconds. More specifically, the conductor portion 220 disposed on the pressure receiving surface 215 is pressed toward the printed wiring board 100.
Here, the pressure receiving surface 215 is flush with the heat receiving surface 214 as shown in FIG. Further, the heat receiving surface 214 is configured as a back surface corresponding to the bonding surface 212 with the printed wiring board 100 as shown in FIG. Therefore, the pressure receiving surface 215 that is the same surface as the heat receiving surface 214 is also a back surface corresponding to the bonding surface 212.
Further, as shown in FIG. 2B, the conductor portion 220 disposed on the pressure receiving surface 215 is provided at a position corresponding to the conductor portion 220 disposed on the bonding surface 212 which is the back surface of the pressure receiving surface 215. It is.

Therefore, by pressing the conductor portion 220 disposed on the pressure receiving surface 215 in the direction of the printed wiring board 100, the wiring portion 120 and the bonding surface are formed in the anisotropic conductive film 310 as shown in FIG. It is possible to pressurize only the L portion between the conductor portion 220 arranged at 212. Accordingly, only the L portion can be a conductive path.
In addition, the M portion other than the L portion in the anisotropic conductive film 310 is thermally cured, so that the connector 200 can be bonded and fixed onto the printed wiring board 100.

By passing through the above process, joining of the printed wiring board 100 provided with the wiring part 120 and the connector 200 is completed, and the electrical junction structure 1 is formed.
The conditions such as the heating temperature and the applied pressure of the connector 200 are not limited to those in the present embodiment, and can be changed as appropriate.

In this way, the anisotropic conductive film 310 is interposed between the wiring part 120 of the printed wiring board 100 and the conductor part 220 of the connector 200, so that the pressure applied to the pressure receiving surface 215 and the heating to the heat receiving surface 214 are performed. By carrying out simultaneously, the connector 200 can be firmly and easily joined and fixed on the printed wiring board 100 by effectively utilizing the heat generated by heating. This also makes it possible to easily complete the electrical connection with the wiring portion 120 of the printed wiring board 100.
Therefore, the process can be simplified, and the joining method between the connector 200 and the printed wiring board 100 including the electrical joint structure 1 and the wiring portion 120 can be reduced.

  Further, even when the pitch width of the conductor portion 220 of the connector 200 and the wiring portion 120 of the printed wiring board 100 is small, the connector 200 can be satisfactorily bonded and fixed on the printed wiring board 100, thereby Electrical connection with 100 wiring portions 120 can also be performed satisfactorily. Therefore, it can be set as the joining method of the printed wiring board 100 provided with the electrical junction structure 1 and the wiring part 120 which can achieve size reduction of the module, and the connector 200.

In addition, as a formation method of the conductor part 220 in the connector 200, injection molding, plating, conductive paste printing, adhesion of a conductive thin film, or the like can be used.
Further, the thickness of the conductor 221 constituting the conductor 220 is preferably 50 μm to 200 μm, and the width is preferably substantially the same as the width of the wiring part 120. The pitch width of the adjacent conductors 221 is preferably about 100 μm.
Further, it is desirable that the anisotropic conductive film 310 has a size approximately the same as the joining surface 212 of the connector 200 as shown in FIG.

Next, with reference to FIG. 4, the modification of the connector which comprises the electrical-junction structure which concerns on embodiment of this invention is demonstrated.
Compared to the connector constituting the electrical joint structure 1 according to the embodiment of the present invention described above, the connector 200 is formed on a part of the conductor 220 that is extended from the joint surface 212 to the heat receiving surface 214. A connection portion 230 for connecting external wiring is provided. Other configurations are the same as those of the connector constituting the electrical junction structure according to the embodiment of the present invention described above. The same member and the same function are designated by the same symbol, and the following description is omitted.

In this way, the connection portion 230 corresponding to the connection portion 230 is provided by providing the connection portion 230 for connecting the external wiring to a part of the conductor portion 220 arranged to extend from the joining surface 212 to the heat receiving surface 214. By simply connecting an optical device, an electronic device, or the like having a connection to the connection unit 230, mutual connection and electrical connection can be performed. Therefore, the electrical junction structure 1 can be easily connected to the external wiring.
Note that the shape, size, etc. of the connecting portion 230 are not limited to those of this modified example, and any protrusions, grooves, etc. can be used as long as they can be connected to external wiring. Also good.

  The present invention can be used as a connector in a module including an optical device and an electronic device.

DESCRIPTION OF SYMBOLS 1 Electrical junction structure 100 Printed wiring board 110 Board | substrate 120 Wiring part 200 Connector 210 Base material 211 Connection hole 212 Joint surface 213 Side surface 214 Heat receiving surface 215 Pressure receiving surface 220 Conductor part 221 Conductor body 222 Connection hole 230 Connection part 300 Joining material 310 anisotropic conductive film 400 optical fiber

Claims (9)

  It is arranged on the wiring part of the printed wiring board via a bonding material, and is bonded and fixed on the printed wiring board by receiving heating and pressurization, and thereby the electric bonding with the wiring part of the printed wiring board is also performed. The connector is completed, wherein the connector is provided with a conductor portion corresponding to the wiring portion of the printed wiring board on the joint surface with the printed wiring board, and the conductor portion is connected to the joint surface from the joint surface. A connector extended to the heat receiving surface that receives the heating.   The connector according to claim 1, wherein the heat receiving surface is configured as a back surface corresponding to a bonding surface with the printed wiring board.   The connector according to claim 2, wherein the heat receiving surface is formed on the same surface as the pressure receiving surface that receives pressure.   The connector according to any one of claims 1 to 3, wherein a connection portion for connecting external wiring is provided on a part of the conductor portion that is extended from the joint surface to the heat receiving surface. .   The connector according to any one of claims 1 to 4, wherein the conductor portion is a set of a plurality of conductors arranged in parallel with a predetermined interval.   The connector according to claim 1, wherein the joining material is an anisotropic conductive material including an anisotropic conductive film and an anisotropic conductive paste.   The connector according to any one of claims 1 to 6, wherein a connection portion for an optical fiber is provided.   An electrical joint structure comprising the connector according to any one of claims 1 to 7 and a printed wiring board provided with a wiring portion, wherein the connector is placed on the printed wiring board via a joining material. An electrical junction structure, wherein the electrical junction structure is joined and fixed, and electrical junction with the wiring portion of the printed wiring board is also completed.   It is a joining method of the connector of any one of Claims 1-7, and the printed wiring board provided with the wiring part, Comprising: The said connector is arrange | positioned via the joining material on the said printed wiring board, The While pressing the connector in the state of the printed wiring board in a state, heat received by the heat receiving surface is transferred to the bonding surface through the conductor portion, thereby fixing the connector on the printed wiring board, Electrical joining with the wiring part of the said printed wiring board is also completed, The joining method of the printed wiring board provided with the connector and wiring part characterized by the above-mentioned.

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