JP4122908B2 - Dismantling method of plasma display device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for disassembling a plasma display device.
[0002]
[Prior art]
In recent years, the demand for plasma display devices is increasing because they are self-luminous and have good visibility, are thin, and can display large screens. On the other hand, recycling of home appliances has been regarded as important from the viewpoint of effective use of resources, and it is necessary to consider recycling of plasma display devices.
[0003]
By the way, the plasma display device accommodates a plasma display panel (PDP) which is an image display unit, a metal plate provided on the back side of the PDP so as to support the PDP, an electric circuit for driving and controlling the PDP, and these. For example. The PDP has a front panel and a back panel formed by forming electrodes on a glass substrate so as to face each other and the peripheral portion is sealed with a sealing material, and a discharge gas such as neon or xenon is enclosed inside. The phosphor layer is caused to emit light by applying a predetermined voltage to the electrode to generate discharge, thereby displaying an image.
[0004]
Conventionally, a method for separating a PDP into a front panel and a back panel in order to recycle the PDP has been disclosed (for example, see Patent Document 1).
[0005]
[Patent Document 1]
Japanese Patent Laid-Open No. 2000-106087
[Problems to be solved by the invention]
However, in order to recycle the PDP, it is necessary to first separate the PDP and the metal plate provided on the back side of the PDP, but there is no method for easily separating the PDP and the metal plate.
[0007]
The present invention has been made to solve such a problem, and an object thereof is to provide a method for easily disassembling a plasma display device.
[0008]
[Means for Solving the Problems]
To achieve the above object, the present invention provides a panel with a metal plate in which a metal plate is bonded to a non-display surface of a plasma display panel in which a discharge space is formed between glass substrates via an adhesive, and the metal plate In a method of disassembling a plasma display device having a circuit board fixed to a metal plate, a pretreatment process for removing the circuit board from the metal plate is performed, and then a metal plate separation process is performed without destroying the plasma display panel. In the metal plate separation step, after the metal plate is raised to a predetermined temperature by induction heating the panel with the metal plate in a state where the circuit board is removed , the plasma display panel and the metal plate Applying a force separating at least one of the plasma display panel and the metal plate to the plasma display panel and the front It is intended to separate the metal plate.
[0009]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, a method for disassembling a plasma display device according to an embodiment of the present invention will be described with reference to the drawings.
[0010]
First, a general plasma display device will be described with reference to FIG. FIG. 1B is an enlarged cross-sectional view showing a region A in FIG. 1A, and a housing, a circuit board, and the like are omitted.
[0011]
The PDP is composed of a front panel 1 and a back panel 2, and a metal plate 3 made of aluminum or the like is usually bonded to the back panel 2 side through a sheet material 4 and an adhesive (not shown). The sheet material 4, the metal plate 3, and the PDP are attached by an adhesive applied to both surfaces of the material 4. A circuit board or the like (not shown) is fixed to the metal plate 3, and the circuit board and the PDP are connected by a cable 5. The metal plate 3 may be a flat plate provided with fins as shown in FIG. 1, or may be simply a flat plate. If a material having good thermal conductivity is used as the sheet material 4, the heat generated by the discharge of the PDP is efficiently released from the metal plate 3 to the outside.
[0012]
In addition, the peripheral portions of the front panel 1 and the back panel 2 are bonded and sealed by a sealing material 6 made of low melting glass to form a discharge space, and are formed between the front panel 1 and the back panel 2. The sealed space 7 is filled with a rare gas (for example, a mixed gas of neon and xenon) at a pressure of about 300 Torr to 500 Torr. A glass tube 8 for enclosing the rare gas in the sealed space 7 is provided on the outer surface of the back panel 2 so as to be connected to the sealed space 7 through the through hole 9, and the rare gas is enclosed in the sealed space 7 from the glass tube 8. After that, the glass tube 8 is sealed.
[0013]
Further, FIG. 2 shows the PDP in detail. The front panel 1 has a display electrode pair made up of display electrodes 11a and 11b formed on the opposing surface of the glass front substrate 10 (the surface facing the back panel 2), and is made of dielectric glass so as to cover it. The dielectric layer 12 is formed, and the protective layer 13 made of magnesium oxide (MgO) is formed on the dielectric layer 12.
[0014]
On the other hand, in the back panel 2, the address electrode 15 is formed in a pattern on the facing surface of the glass back substrate 14 (the surface facing the front panel 1), and the back dielectric layer 16 is formed so as to cover it. Further, a partition wall 17 is formed thereon, and a phosphor layer 18 of R, G, and B is formed between the partition walls 17.
[0015]
A space section delimited by the partition walls 17 becomes a light emitting area. The partition wall 17 and the address electrode 15 are formed in parallel, and the display electrodes 11 a and 11 b are orthogonal to the address electrode 15. Then, discharge cells are formed at the intersections between the display electrodes 11 a and 11 b and the address electrodes 15.
[0016]
In this PDP, an address pulse is applied between the address electrode 15 and the display electrode 11a based on image data to be displayed, and then a sustain pulse is applied between the paired display electrode 11a and the display electrode 11b. A sustain discharge is selectively generated in the discharge cell. As a result, ultraviolet rays are generated in the discharge cells in which the sustain discharge has occurred, visible light is emitted from the phosphor layers 18 of the respective colors (R, G, B) excited by the ultraviolet rays, and an image is displayed. The front panel 1 is a display surface, and the back panel 2 is a non-display surface.
[0017]
Next, a method for disassembling such a plasma display device will be described with reference to the drawings.
[0018]
FIG. 3 is a flowchart (flow chart) showing an overall configuration relating to a method for disassembling the plasma display device according to one embodiment of the present invention. In FIG. 3, 21 is a pretreatment process for separating a plasma display device (discard display) to be discarded into a panel with a metal plate and other circuit boards, metal, glass, and the like, and 22 is a metal plate with a metal plate. This is a metal plate separation step for separating a plate and a panel (PDP). Next, these steps will be described.
[0019]
The discarded plasma display device is first sent to the pretreatment step 21. Here, the PDP portion is taken out from the casing of the plasma display device, the accompanying wiring, circuit board, metal, glass, etc. are removed, and the panel 31 with metal plate is taken out. Note that the glass, metal, circuit board, or the like constituting the separated casing is sent to the regeneration process after simple processing such as cleaning.
[0020]
The panel 31 with a metal plate taken out in the pretreatment step 21 is sent to the metal plate separation step 22 and separated into the panel 32 and the metal plate 3. That is, the panel 31 with a metal plate is in a state in which the panel 32 and the metal plate 3 are attached with the adhesive sheet material 4 having a thickness of about 1 to 2 mm interposed therebetween. The metal plate 3 is separated.
[0021]
FIG. 4 is a schematic view for explaining a method of separating the panel 31 with a metal plate into the panel 32 and the metal plate 3. In the present embodiment, as shown in FIG. 4, a high frequency heating device including an induction coil 33 and a high frequency power source 34 connected to the induction coil 33 is used. The induction coil 33 is made of a low resistance metal such as iron or copper.
[0022]
First, when the panel 31 with a metal plate is arranged inside the induction coil 33 and a predetermined high frequency voltage is applied to the induction coil 33 using the high frequency power supply 34, the metal plate 3 of the panel 31 with the metal plate is heated by the induction current. (Induction heating). When the metal plate 3 is heated and the temperature rises, the temperatures of the adhesive and the sheet material 4 that are in contact with the metal plate 3 also rise. A state in which most of the sheet material 4 is adhered to the panel 32 by applying a shear stress between the panel 32 and the metal plate 3 when a predetermined time has elapsed since the start of applying the high frequency voltage to the induction coil 33. Thus, the panel 32 and the metal plate 3 can be separated. The most part of the sheet material 4 is attached to the panel 32 because the metal plate 3 is heated by induction heating and reaches a predetermined temperature, so that the sheet material 4 and the panel 32 are attached. It is considered that the adhesive strength with which the sheet material 4 and the metal plate 3 are bonded is weaker than the adhesive strength. The sheet material 4 attached to the panel 32 can be easily peeled off from the panel 32 by turning from the end of the sheet material 4.
[0023]
Further, instead of applying a shear stress between the panel 32 and the metal plate 3, a sufficiently thin flat jig is inserted into the sheet material 4 between the panel 32 and the metal plate 3, and the panel 32 is inserted into the jig. By applying a force in the normal direction, a force that separates the panel 32 and the metal plate 3 may be applied to the panel 32 or the metal plate 3 to separate the panel 32 and the metal plate 3. Alternatively, the panel 32 and the metal plate 3 may be separated while the heated panel 31 with the metal plate is disposed inside the induction coil 33, or the heated panel 31 with the metal plate may be separated from the induction coil. The panel 32 and the metal plate 3 may be separated from the outside of the 33.
[0024]
In this way, the panel 32 and the metal plate 3 are separated from at least one of the panel 32 and the metal plate 3 in a state where the metal plate 3 reaches a predetermined temperature by induction heating the panel 31 with the metal plate. The panel 32 and the metal plate 3 can be separated by applying a predetermined force.
[0025]
As an example when performing induction heating, when a high frequency voltage having a frequency of 10 kHz and a voltage of 200 V is applied to the induction coil 33 for 10 minutes and the temperature of the metal plate 3 reaches about 200 ° C., the gap between the panel 32 and the metal plate 3 is reached. By applying a shear stress, the panel 32 and the metal plate 3 could be easily separated. At this time, no breakage was found in the separated panel 32 and metal plate 3. Moreover, if the frequency of the high frequency voltage was 1 kHz to 100 kHz, the panel 32 and the metal plate 3 could be easily separated. When the frequency of the high-frequency voltage is less than 1 kHz, heating at a sufficient speed cannot be performed, and it takes time to separate the panel 32 and the metal plate 3 and is not practical. Moreover, when the frequency of the high frequency voltage exceeds 100 kHz, the metal plate 3 is hardly heated.
[0026]
The temperature of the metal plate 3 when separating the panel 32 and the metal plate 3 is preferably equal to or higher than the softening point of the adhesive. Considered temperature of the adhesive are combined Ri bonded to the metal plate 3 and the sheet 4 is almost the same as the temperature of the metal plate 3, when the temperature of the metal plate 3 is not less than the softening point of the adhesive Since the adhesive is softened and the adhesive force is reduced, the panel 32 and the metal plate 3 can be easily separated. Furthermore, it is desirable that the temperature of the metal plate 3 when separating the panel 32 and the metal plate 3 is lower than the temperature at which the adhesive decomposes. If the panel 32 and the metal plate 3 are separated at a temperature at which the adhesive decomposes or more, the decomposition product (organic matter, etc.) of the adhesive adheres to the panel 32 and the metal plate 3, and the panel 32 and the metal plate 3 are recycled. This is because it is necessary to remove the attached organic matter and the like.
[0027]
Since the metal plate 3 obtained by separating from the metal plate-equipped panel 31 by the method described above is hardly distorted, it can be used again as a metal plate by performing a simple treatment such as washing. . Further, even if it is difficult to reuse as it is due to some trouble, the metal plate 3 can be regenerated as a metal material by a method such as melting and decomposition.
[0028]
Further, the separated panel 32 is subjected to, for example, a glass pulverizer to form a glass cullet (film-coated glass cullet) to which materials such as dielectrics, electrodes, partition walls, and phosphors that are constituent members of the plasma display panel are fixed. Glass cullet with film can be recycled as raw materials such as glass by putting it in a glass kiln as it is, but in order to further improve the quality of glass, the film cullet is used with a general blast washing machine. May be removed.
[0029]
In the present embodiment, when the panel 32 and the metal plate 3 are separated from each other in the metal plate separation step 22, the metal plate-equipped panel 31 is induction-heated. The temperature can be raised. Moreover, since the induction coil 33 should just be a magnitude | size which can arrange | position the panel 31 with a metal plate inside, the apparatus used at the metal plate isolation | separation process 22 can be made compact. For this reason, particularly when a large display panel is disassembled like a plasma display device, a necessary space can be saved.
[0030]
In addition, the metal plate 3 is directly heated by induction heating, and the panel 32 is not directly heated, so the panel 32 is hardly damaged by heat. For this reason, for example, when a defect is found in a part other than the panel 32 after the plasma display apparatus is assembled in the manufacturing process of the plasma display apparatus, the panel 32 and the metal plate 3 are separated by using the method of the present invention. The separated panel 32 can be used as it is without being destroyed. Since the panel 32 has a fine structure and is manufactured through complicated processes, it is very effective that the panel 32 can be used as it is.
[0031]
In addition, by applying the method of the present invention to a plasma display device having a panel with a metal plate in which the metal plate 3 is bonded to the non-display surface of the panel 32 via an adhesive without using the sheet material 4. The same effects as those in the above embodiment can be obtained, and the panel 32 and the metal plate 3 can be easily separated.
[0032]
【The invention's effect】
As described above, according to the disassembling method of the present invention, the panel and the metal plate can be easily separated. As a result, the recycling rate is improved, which contributes to environmental protection and effective use of resources, and can greatly contribute to the protection of the global environment.
[Brief description of the drawings]
FIG. 1A is a schematic configuration diagram showing a general plasma display device. FIG. 1B is an enlarged cross-sectional view showing a region A. FIG. 2 is a perspective view showing a main part of a plasma display panel. The flowchart which shows the whole structure regarding the disassembly method of the plasma display apparatus in one embodiment of invention. FIG. 4 is the block diagram for demonstrating the disassembly method of the plasma display apparatus.
DESCRIPTION OF SYMBOLS 1 Front panel 2 Back panel 3 Metal plate 4 Sheet material 6 Seal material 7 Sealed space 21 Pretreatment process 22 Metal plate separation process 31 Panel with metal plate 32 Panel 33 Inductive coil 34 High frequency power supply

Claims (4)

A plasma display having a panel with a metal plate in which a metal plate is bonded to a non-display surface of a plasma display panel in which a discharge space is formed between glass substrates via an adhesive, and a circuit substrate fixed to the metal plate In the dismantling method of the apparatus, after performing the pretreatment step of removing the circuit board from the metal plate, the process proceeds to the metal plate separation step without destroying the plasma display panel. In the metal plate separation step, the circuit board After the metal plate is heated to a predetermined temperature by induction heating the panel with the metal plate in a state where the metal plate is removed , the plasma display panel and the metal plate are placed on at least one of the plasma display panel and the metal plate. The plasma display panel and the metal plate are separated by applying a force to separate them. Dismantling method of a plasma display device.   The panel with a metal plate is induction-heated by disposing the panel with the metal plate inside the induction coil and applying a high frequency voltage of 1 kHz to 100 kHz to the induction coil. A method for disassembling a plasma display device.   The method for disassembling a plasma display device according to claim 1, wherein the predetermined temperature is set to be equal to or higher than a softening point of the adhesive.   The method for disassembling a plasma display device according to claim 1, wherein the predetermined temperature is set to be equal to or higher than a softening point of the adhesive and lower than a decomposition temperature of the adhesive.

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