JP2012083581A - Disassembly method of plasma display device and disassembly device thereof - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a disassembly method of a plasma display device and a disassembly device thereof which allow easy separation of a PDP (plasma display panel) and a metal support plate.SOLUTION: A disassembly device 50 for a plasma display device is to disassemble a plasma display device having a PDP unit 19 including a PDP 11 and a metal support plate 14 adhered via an adhesive member 16. The disassembly device includes a heating member 31 which is brought into contact with the PDP 11 via a buffer member 32 having thermal conductivity and flexibility and heats the adhesive member 16 via the PDP 11.

Description

  The technology disclosed herein relates to a method for disassembling a plasma display device and the dismantling device thereof.

  In recent years, plasma display devices using a plasma display panel (hereinafter referred to as PDP) have been attracting attention and mass-produced as display devices suitable for thinning and large size.

  A PDP is attached to the display unit of the plasma display device. The PDP is composed of a front plate in which display electrodes, dielectric layers, protective layers, etc. are formed on a glass substrate, and a back plate in which address electrodes, barrier ribs, phosphor layers, etc. are formed on the glass substrate. . The front plate and the back plate are arranged to face each other so that a minute discharge space is formed between both substrates, and the peripheral portions of both substrates are sealed with frit glass. A discharge gas formed by mixing an inert gas such as neon gas (Ne) and xenon gas (Xe) is sealed in the discharge space.

  A metal support plate, which is a chassis member, is attached to the back surface of the back plate of the PDP via an adhesive member such as a heat conductive sheet. The metal support plate has a function as a chassis member for attaching a circuit board for driving the PDP, and a function as a heat dissipation plate for efficiently radiating heat generated by driving the PDP. Further, the plasma display device is provided with a front frame and a back cover for protecting the PDP and the circuit board.

  By the way, with the rapid spread of plasma display devices, the number of used waste plasma display devices is rapidly increasing. Further, as the production amount of plasma display devices increases, the absolute number of defective PDP units in the manufacturing process also increases. Therefore, from the viewpoint of environmental issues and resource saving, social needs for technologies to dismantle used plasma display devices and defective plasma display devices generated in the manufacturing process, and to reuse parts and recycle them as raw materials Is growing.

  In order to disassemble the plasma display device into a reusable form, it is necessary to separate the PDP, the metal support plate, and the circuit board without damaging them. Therefore, various methods for separating the PDP unit have been proposed. For example, as a method of separating the PDP and the metal support plate, the surface of the PDP is heated with a hot plate, and the adhesive force of the adhesive member that bonds the PDP and the metal support plate is weakened. Has been proposed (see, for example, Patent Document 1).

JP 2005-116346 A

  Used plasma display devices and defective products generated in the manufacturing process are collected for dismantling and transported to a dismantling factory. At that time, the glass substrate of the front plate of the PDP may be carried into the dismantling factory in a state of being broken by an impact during transportation or a load caused by loading. Since the front plate and the back plate are fixed only by the sealing member, for example, when the glass substrate is broken, a crack occurs in the broken portion. That is, the crow substrate bonded to the adhesive member is broken to form a gap.

  When a PDP with a broken glass substrate is heated using a hot plate having a smooth surface as in the prior art, heat from the hot plate is difficult to be transmitted to the adhesive member where the crack has occurred. The amount of heat transfer per unit time for heat transfer is reduced. As a result, it takes a long time until the adhesive force of the adhesive member is weakened, and there is a problem that the disassembly efficiency of peeling the PDP and the metal support plate from the adhesive member is lowered.

  Further, when the glass substrate of the large-screen PDP is broken, uneven heat transfer to the adhesive member occurs depending on the location. Therefore, the adhesive force of the adhesive member also varies depending on the location, and in the worst case, the PDP and the metal support plate cannot be peeled from the adhesive member.

  An object of the technology disclosed herein is to provide a method for disassembling a plasma display apparatus and a disassembling apparatus that can easily separate a PDP and a metal support plate.

  In order to achieve the above object, a technique disclosed herein is a method for disassembling a plasma display device that disassembles a plasma display panel device including a plasma display unit, wherein the plasma display unit is bonded via an adhesive member. The plasma display panel and a metal support plate, the plasma display panel is brought into contact with a heating member through a buffer member having thermal conductivity and flexibility, and the adhesive member is heated through the plasma display panel The plasma display panel and the metal support plate are separated from each other.

  In order to achieve the above object, a technique disclosed herein discloses disassembling a plasma display device including a plasma display unit including a plasma display panel and a metal support plate bonded via an adhesive member. The apparatus includes a heating member that is brought into contact with the plasma display panel through a buffer member having thermal conductivity and flexibility and heats the adhesive member through the plasma display panel.

  According to the technique disclosed herein, the PDP and the metal support plate can be easily separated.

1 is an exploded perspective view of a plasma display device according to an embodiment. Sectional drawing of the PDP unit in one embodiment Flowchart explaining disassembly of plasma display device in one embodiment Sectional drawing which shows the use condition of the dismantling apparatus in one embodiment

  Hereinafter, an embodiment will be described with reference to the drawings.

  In FIG. 1, the plasma display device 10 includes a PDP 11, a front frame 12 that accommodates the PDP 11, and a back cover 13 that closes the back side of the front frame 12.

  Between the front frame 12 and the back cover 13, a metal support plate 14 made of a metal plate such as aluminum, a circuit board 15 attached to the metal support plate 14 and driving the PDP 11, and the metal support plate 14. Is fixed to the circuit board 15 by being fitted to the adhesive member 16 for transferring the heat generated from the PDP 11 to the metal support plate 14 and the mounting surface 17 of the metal support plate 14 facing the back cover 13. A stopper 18 such as a pin is disposed.

  As described above, the plasma display device 10 is provided with the PDP unit 19 including the PDP 11 and the metal support plate 14 bonded via the bonding member 16.

  In FIG. 2, the peripheral edges of the front plate 20 and the back plate 21 are bonded by a sealing material 22. The back plate 21 and the metal support plate 14 are bonded via a double-sided adhesive type adhesive member 16. The adhesive member 16 has a function of transferring heat generated when the PDP 11 is driven to the metal support plate 14 to prevent a deterioration in image quality due to a temperature rise of the PDP 11 and a function of preventing a glass substrate constituting the front plate 20 from cracking. Have. The adhesive member 16 is bonded to almost the entire surface of the back plate 21 and the metal support plate 14.

  Next, a method for disassembling the plasma display device 10 will be described.

  In FIG. 3, first, the front frame 12 is removed from the plasma display device 10 (S1).

  Next, the back cover 13 is separated (S2).

  Next, the adhesive member 16 is heated to weaken the adhesive force, and the metal support plate 14 with the circuit board 15 and the PDP 11 are separated from the adhesive member 16 (S3).

  Next, the front plate 20 and the back plate 21 constituting the PDP 11 are separated (S4).

  Next, the metal support plate 14 and the circuit board 15 are separated by removing or cutting the stopper 18 (S5).

  In addition, the glass substrate which comprises the front plate 20 and the back plate 21 separated in (S4) is subjected to a dissolution treatment after removing components such as electrodes and dielectrics formed on the respective glass substrates. And reused as glass material.

  Next, a dismantling device for the plasma display device will be described.

  In FIG. 4, the disassembling apparatus 50 includes a heating member 31 such as a hot plate, and a buffer member 32 placed in close contact with the heating portion of the heating member 31.

  The buffer member 32 is composed of a structure having thermal conductivity and flexibility. As such a buffer member 32, a material obtained by adding 5% or more of a heat conductive filler such as carbon fiber, carbon particles, alumina, or silica to a matrix resin made of a heat resistant resin such as a fluororesin or a silicon resin is desirable. In this embodiment, about 10% of a carbon fiber thermally conductive filler is added to a fluororesin, and the cushioning member 32 is provided with flexibility by firing.

  Moreover, in this embodiment, PDP11 whose thickness of the front plate 20 is 1.8 mm-2.8 mm was used. In order that the front plate 20 having such a thickness is buried in the buffer member 32 and brought into contact with the back plate 21 as described later, it is desirable that the thickness of the buffer member is 4 mm or more.

  Next, a disassembly method for separating the PDP 11 and the metal support plate 14 will be described in detail.

  First, a heater (not shown) of the heating member 31 is energized to heat the surface of the heating member 31 to about 300 ° C. At this time, the buffer member 32 is heated to about 280 ° C. by heat transfer from the heating member 31.

  Next, the front plate 20 is placed on the heated buffer member 32. Since the buffer member 32 has flexibility, even if the chipped portion 41 exists in the glass substrate of the front plate 20, the front plate 20 is buried in the buffer member 32 by the weight of the front plate 20, and the back plate 21 contacts the buffer member 32. Therefore, since the back plate 21 is overheated via the buffer member 32, heat is transferred from the back plate 21 and the adhesive member 16 is heated. That is, since the heat from the heating member 31 can be efficiently transferred to the defective portion 41 of the front plate 20, the adhesive force of the adhesive member 16 is weakened in a short time to separate the PDP 11 and the metal support plate 14. It becomes possible.

  About the effect of the buffer member 32, it verified using PDP11 which has the 20% defect | deletion part 41 in the glass substrate of the front plate 20 as a sample. When the buffer member 32 was placed on the heating member 31 and when it was not placed, the time during which the adhesive force of the adhesive member 16 was weakened and the PDP 11 and the metal support plate 14 could be separated was measured. As a result, when the buffer member 32 was placed, the separation time was 32 minutes, whereas when the buffer member 32 was not placed, it was 48 minutes. Therefore, it was confirmed that the disassembly time was improved by 33% when this disassembly apparatus was used.

  As described above, according to the present embodiment, even if the glass substrate of the front plate 20 is lost and heat from the heating member 31 is not easily transmitted to the adhesive member 16, the heat applied to the adhesive member 16 by the buffer member 32. Transmission can be performed uniformly. Therefore, the PDP 11 and the metal support plate 14 can be easily separated.

  The technology disclosed herein is useful as a disassembling method or dismantling apparatus for efficiently disassembling a used plasma display device or a defective plasma display device generated in a manufacturing process.

10 Plasma display device 11 PDP
DESCRIPTION OF SYMBOLS 12 Front frame 13 Back cover 14 Metal support plate 15 Circuit board 16 Adhesive member 17 Mounting surface 18 Stopper 19 PDP unit 20 Front plate 21 Back plate 31 Heating member 32 Buffer member 41 Defect part 50 Demolition device

Claims (4)

A method for disassembling a plasma display device for disassembling a plasma display panel device including a plasma display unit,
The plasma display unit includes a plasma display panel and a metal support plate bonded via an adhesive member,
The plasma display panel is brought into contact with a heating member through a buffer member having thermal conductivity and flexibility, the adhesive member is heated through the plasma display panel, and the plasma display panel and the metal support plate are A method for disassembling a plasma display device to be separated. The method for disassembling a plasma display device according to claim 1, wherein the buffer member includes any one of metal oxide, carbon fiber, and carbon powder, and a resin containing fluorine or silicon. A dismantling device for a plasma display device for disassembling a plasma display device having a plasma display unit including a plasma display panel and a metal support plate bonded via an adhesive member,
An apparatus for disassembling a plasma display device, comprising: a heating member that is brought into contact with the plasma display panel through a buffer member having thermal conductivity and flexibility and heats the adhesive member through the plasma display panel. The dismantling device for a plasma display device according to claim 3, wherein the buffer member includes any one of metal oxide, carbon fiber, or carbon powder and a resin containing fluorine or silicon.

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