JP2007161550A - Cutting unit of display panel and cutting method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of separating the front basal plate and the back basal plate of a display panel such as PDP, of which the plates are connected at their peripheral, without cracking the basal plate, at a low cost, and in a short time. <P>SOLUTION: This cutting unit is for cutting the panel peripheral part where a sealing member is formed when the panel 14 is made by bonding the peripheral part of two pieces of glass basal plate with a sealing member, and it has a scribe measure to scribe the panel 14 placed on a table 31, by moving the table 31 on which the panel 14 is placed and a cutting wheel having a point angle of 150-165° by pressing to the panel 14 with a load of 3-13 kg, and an impact application measure which gives impact on a side, where the scribe of the panel 14 placed on the table 31 is made, and both the scribe measure and the impact application measure are each placed at a specified position around the table 31 enabling to act simultaneously to the panel 14 placed on the table 31. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to a display panel cutting apparatus and a cutting method.

  A plasma display device is a plasma display in which a pair of glass substrates on which a plurality of electrodes and the like are formed are arranged to face each other so that a discharge space is formed between the glass substrates, and the periphery thereof is sealed with a sealing member. A display unit comprising a panel (PDP), a metal chassis attached to the PDP via a heat conductive sheet, and an electric circuit member attached to the back of the chassis for driving the PDP, It is comprised by arrange | positioning inside the housing comprised with a front cover and a back cover.

In recent years, the demand for plasma display devices is increasing because they are self-luminous and have good visibility and are thin and capable of large-screen display. In addition, recycling of home appliances has been regarded as important from the viewpoint of effective use of resources, and a recycling method of a plasma display device has also been studied (for example, see Patent Document 1).
JP 2003-112155 A

  The PDP is configured such that a front substrate made of a glass substrate and a rear substrate are bonded to each other using frit glass at a peripheral portion to ensure internal airtightness. In order to recycle the front substrate and the back substrate, the electrodes and dielectric layers formed on the front substrate and the surface of the back substrate are removed to make a glass substrate (elementary glass) on which nothing is formed. is required. For this purpose, the PDP must be separated into a front substrate and a rear substrate. As a method for this, a method in which the PDP is heated in an electric furnace to melt the frit glass and separated, and a high pressure gas is put inside the PDP to separate it. And a method of cutting an inner portion of a joint portion made of frit glass with a diamond cutter. The method of heating and separating the PDP requires an expensive electric furnace, requires a mechanism for peeling off the front substrate and the back substrate during heating, takes a long time for the heat treatment, and takes a long time. There were problems such as. A method of separating a front substrate and a rear substrate by putting a high-pressure gas inside a PDP rarely cleanly separates the bonded portion from the frit glass, and the front substrate and the rear substrate are often broken in a complicated manner. . The method of cutting with a diamond cutter often causes the glass substrate to crack and break during cutting, making it difficult to cut the front substrate and the back substrate in a predetermined shape so as not to break, and the cost of the diamond cutter There were also problems such as high.

  The present invention has been made to solve such problems, and in a display panel such as a PDP, the separation of the front substrate and the rear substrate formed by joining the peripheral portions can be achieved at low cost without causing the substrate to break. It is intended to be performed in a short time.

  In order to solve the above-described problems, a display panel cutting apparatus according to the present invention includes a panel peripheral portion in which the sealing member of a display panel formed by joining peripheral portions of two glass substrates with a sealing member is formed. A device for cutting, which is placed on a table on which a display panel is placed and a cutting wheel having a tip angle of 150 ° to 165 ° is moved in pressure contact with the display panel with a load of 3 kg to 13 kg. Scribing means for scribing the display panel, and impact applying means for applying an impact to the scribed side of the display panel placed on the table, wherein the scribing means and the impact applying means are In order to be able to simultaneously act on the display panel placed on the table, each is installed at a predetermined position around the table. And

  Further, the display panel cutting method of the present invention is a method of cutting a panel peripheral portion in which the sealing member of the display panel is formed by joining the peripheral portions of two glass substrates with a sealing member. Using a cutting device having a table on which the display panel is placed and scribing means and impact applying means respectively arranged at predetermined positions around the table, and after placing the display panel on the table, A crack is formed on one side of the display panel by the scribing means, and then the one side comes to the position of the impact applying means using the time for the crack to extend in the thickness direction of the display panel, and another side is The display panel is moved so as to be at the position of the scribing means, and then an impact is applied to the one side by the impact applying means to cut at the crack portion. In the further sides and forming cracks by said scribing means.

  According to the present invention, the panel peripheral portion of the display panel can be efficiently cut, and the front substrate and the back substrate can be separated at a low cost in a short time without breaking the substrate.

  Embodiments of the present invention will be described below with reference to the drawings, taking a plasma display device as an example.

  First, the structure of the plasma display panel in the plasma display device will be described with reference to FIG. As shown in FIG. 1, on a front substrate 1 made of a glass substrate, a plurality of stripe-shaped display electrodes 4 that are paired with a scan electrode 2 and a sustain electrode 3 are formed, and a dielectric is formed so as to cover the display electrode 4. A body layer 5 is formed, and a protective layer 6 is formed on the dielectric layer 5. Thus, the front panel 7 is formed by forming the surface layer composed of the display electrode 4, the dielectric layer 5 and the protective layer 6 on the front substrate 1.

  A plurality of striped address electrodes 9 are formed on a rear substrate 8 made of a glass substrate, and a dielectric layer 10 is formed so as to cover the address electrodes 9. On the dielectric layer 10 between the address electrodes 9, a plurality of partition walls 11 are arranged in parallel to the address electrodes 9, and a phosphor layer 12 is provided on the side surfaces of the partition walls 11 and on the surface of the dielectric layer 10. Thus, the back panel 13 is formed by forming the surface layer including the address electrodes 9, the dielectric layer 10, the partition walls 11, and the phosphor layers 12 on the back substrate 8.

  The front substrate 1 and the rear substrate 8 are arranged to face each other with a minute discharge space so that the display electrodes 4 and the address electrodes 9 are orthogonal to each other, and the peripheral portions are joined and sealed with a sealing member. The discharge space is filled with, for example, a mixed gas of neon and xenon as a discharge gas. In addition, discharge cells are formed at the positions where the display electrodes 4 and the address electrodes 9 cross each other, and the phosphor layers 12 are formed in the respective discharge cells so that the display electrodes 4 extend in the red, green, and blue directions. Are sequentially arranged one by one.

  In the plasma display panel having such a configuration, by applying a write pulse between the address electrode 9 and the scan electrode 2, an address discharge is performed between the address electrode 9 and the scan electrode 2, and a discharge to be displayed. After selecting a cell, a periodic sustain pulse that is alternately inverted is applied between the scan electrode 2 and the sustain electrode 3, whereby a sustain discharge is performed between the scan electrode 2 and the sustain electrode 3 to obtain a predetermined value. Is displayed.

  FIG. 2 shows an example of the overall configuration of a plasma display device incorporating the plasma display panel having the structure described above.

  As shown in FIG. 2, the housing that accommodates the panel (plasma display panel) 14 is composed of a front cover 15 and a metal back cover 16, and an optical filter and a panel 14 are formed in the opening of the front cover 15. A front plate 17 made of glass or the like that also serves as protection is disposed. The front plate 17 is subjected to, for example, silver deposition in order to suppress unnecessary radiation of electromagnetic waves. Further, the back cover 16 is provided with a plurality of vent holes 16a for releasing heat generated in the panel 14 and the like to the outside.

  A chassis 18 made of aluminum or the like that holds the panel 14 is disposed on the back side of the panel 14 via a heat conductive sheet 19, and a plurality of panels 18 for driving the panel 14 are displayed on the back side of the chassis 18. An electric circuit member 20 is attached, thereby constituting a display unit. The electric circuit member 20 includes an electric circuit for driving and controlling the display of the panel 14, and extends to the electrode lead-out portion that is drawn to the edge portion of the panel 14 beyond the four edge portions of the chassis 18. They are electrically connected by a plurality of flexible wiring boards (not shown). A boss portion 18a for attaching the electric circuit member 20 and fixing the back cover 16 is protruded from the rear surface of the chassis 18 by integral molding using die casting or the like. The chassis 18 may be configured by fixing a fixing pin to an aluminum flat plate. The heat conductive sheet 19 is for efficiently transferring the heat generated in the panel 14 to the chassis 18 to dissipate heat, and is bonded to each of the panel 14 and the chassis 18 with an adhesive. That is, the chassis 18 is bonded to the back substrate 8 via an adhesive.

  Next, a method for disassembling such a plasma display device will be described with reference to the process flow diagram of FIG.

  For the PDP TV to be discarded (discarded PDP TV), first, the back cover 16 is first removed manually and then the front cover 15 is removed in the housing removal step 21. In the next electric circuit member disassembly step 22, a fixing screw (not shown) is removed, and the electric circuit member 20 is sequentially removed from the chassis 18. Further, the flexible wiring board is removed from the panel 14. At this stage, the panel 14, the heat conductive sheet 19, and the chassis 18 are in a state of a module fixed integrally.

  In the next chassis separation step 23, the module is heated in an electric furnace at a temperature at which the adhesive strength of the heat conductive sheet adhesive is reduced, whereby the adhesive strength of the heat conductive sheet 19 is reduced. The panel 14, the chassis 18, and the heat conductive sheet 19 are separated by applying a peeling force by a mechanical method.

  In the next substrate separation step 24, the front panel 7 and the rear panel 13 are separated by cutting a portion of the separated panel 14 joined by the sealing member. Thereafter, the front panel 7 is removed from the surface layer on the front substrate 1 by a method such as polishing in a surface layer removing step 25 to be a bare glass substrate, and the back panel 13 is formed on the back substrate 8 in the surface layer removing step 26. The surface layer is removed by a method such as polishing to form a bare glass substrate. This raw glass substrate is culleted, and the cullet glass obtained by cullet melting is melted to enable glass recycling.

  As described above, the panel 14 is taken out by performing the housing removing step 21, the electric circuit member disassembling step 22, and the chassis separating step 23 for the discarded PDP television. As shown in FIG. 4, the panel 14 is configured by joining the peripheral portions of the front panel 7 and the back panel 13 with a sealing member (frit glass) 30. 4A is a plan view, and FIG. 4B is a cross-sectional view showing the peripheral portion of the panel. If the panel peripheral part which is the part in which the sealing member 30 was formed is cut | disconnected, it has the structure where the part inside a cut location will be divided into the front panel 7 and the back panel 13. FIG. An example of a place where the panel 14 is cut with respect to one side of the panel 14 is indicated by a one-dot chain line 60 in FIG. 4, and the cutting place is inside the sealing member 30. As an example, the thickness of the front substrate 1 and the back substrate 8 is about 2.8 mm, the thickness of the front panel 7 is about 2.85 mm, and the thickness of the back panel 13 is about 2.95 mm.

  In the substrate separation step 24, the joining portion is removed by cutting in parallel with the side of the panel 14 inside the portion (joining portion) joined by the adhesive member 30 of the panel 14, and the inside of the joining portion is connected to the front panel 7. Separated from the back panel 13. For example, it cut | disconnects in the position of the dashed-dotted line 60 shown in FIG. 4, and cut | disconnects in the same position (position inside a junction part) also on other 3 sides. As described above, in the substrate separation step 24, the peripheral portion of the panel, which is the portion where the sealing member 30 is formed, is cut and separated from the panel 14. Next, a method for carrying out the substrate separation step 24 will be described with reference to the drawings.

  A cutting apparatus used for cutting in the substrate separation step 24 will be described with reference to FIGS. 5 is a plan view of the cutting device, FIG. 6 is an enlarged view of the cutting device shown in FIG. 5 viewed from the direction A, FIG. 7 is an enlarged view of the cutting wheel, and FIG. 8 is a cutting view shown in FIG. It is the enlarged view which looked at the apparatus from the B direction.

  Reference numeral 31 denotes a table on which the panel 14 is placed, and a plurality of roller bearings 32 are arranged on the table 31. The panel 14 is placed on the roller bearing 32. A support base 33 is provided along one side of the table 31, and the support base 33 has a height that can just support the end of the panel 14 placed on the roller bearing 32. A panel pressing member 34 is provided above the support base 33, and the air cylinder 35 is a vertical driving means for moving the panel pressing member 34 up and down. The air cylinder 35 is configured to be able to take out a load of about 10 kg as a single unit.

  A scribing unit (scribing means) 36 for scribing the panel 14 is provided at a position corresponding to one side of the table 31 where the support 33 is provided. The scribe unit 36 includes a cutting wheel 37 for forming a scribe on the panel 14, a holder 38 that supports the cutting wheel 37, an air cylinder 39 that is a vertical driving means for moving the holder 38 up and down, and an air cylinder 39. Are attached to the cylinder mounting bracket 40, a fixed block 41 to which the cylinder mounting bracket 40 is attached, and a drive means 42 including a ball screw that moves the fixed block 41 in the x direction. The cutting wheel 37 is rotatably supported, and the tip angle θ (see FIG. 7) of the cutting wheel 37 is set to 150 ° to 165 °. The air cylinder 39 is configured so that the cutting wheel 37 can be pressed against the panel 14 with a load of 3 kg to 13 kg when a scribe is formed on the panel 14.

  Further, a support base 43 is provided along one side of the table 31, and the support base 43 has the same height as the support base 33. The side where the support base 43 of the table 31 is provided is the side adjacent to the side where the support base 33 of the table 31 is provided. A panel pressing member 44 is provided above the support base 43, and the air cylinder 45 is a vertical driving means for moving the panel pressing member 44 up and down. The air cylinder 45 is a single unit that can output a load up to about 10 kg. Here, reference numeral 50 denotes a scribe forming portion in which a scribe is formed on the panel 14 by the scribe unit 36, and the position of the scribe forming portion 50 is the position of the alternate long and short dash line 60 shown in FIG. The panel 14 is placed on the roller bearing 32 so that the scribe forming portion 50 is located slightly outside the end of the support base 43.

  An impact applying means 46 is provided at a position corresponding to one side where the support base 43 of the table 31 is provided. The impact applying means 46 includes a weight 47, a cylinder 48 to which the weight 47 is fixed, and a holding means 49 to which the cylinder 48 is fixed. The weight 48 fixed to the cylinder 48 and its tip is provided on the table 31. Two are installed along the side. The weight 47 is moved up and down by the cylinder 48, and when the weight 47 moves downward, the tip of the weight 47 is disposed so as to collide with the end portion of the panel 14 (outside the scribe forming portion 50). The weight 47 is about 600 g, for example, and is configured such that when the weight 47 is moved downward, the weight 47 falls by its own weight. Further, although the weight 47 is separated at the scribe forming portion 50 by colliding with the end portion of the panel 14, a debris storage box 51 for storing the outer portion of the separated scribe forming portion 50 is provided. Note that the weight of the weight 47 and the height of the weight 47 when it is dropped may be set so that the peripheral portion of the panel can be separated by the collision of the weight 47.

  Next, the cutting method by the cutting device of this Embodiment is demonstrated.

  FIG. 9 is a view showing a state when the panel 14 is scribed using the scribe unit 36, and is a cross-sectional view showing the back panel 13. The back panel 13 has a surface layer formed on the back substrate 8, but FIG. 9 shows the back substrate 8, and the surface layer is not shown. In FIG. 9, a surface layer is formed on the lower surface of the back substrate 8.

  When the cutting wheel 37 of the scribe unit 36 is moved along the surface of the rear substrate 8 while being pressed against the surface of the back substrate 8 with a weight of about 6 kg, a vertical crack 52a is formed as shown in FIG. The moving speed of the cutting wheel 37 is, for example, about 20 cm / sec. FIG. 9A is a cross-sectional view of the back substrate 8 immediately after being cut by scribing, and the vertical crack 52 a generated by scribing is formed extremely shallow in the surface layer of the back substrate 8.

  When about 5 to 10 seconds elapse from the state of FIG. 9A, the vertical crack 52 a extends in the thickness direction of the back substrate 8. And it will be in the state which reached near the lower surface of the back substrate 8 like the vertical crack 52b shown in FIG.9 (b). Thus, the phenomenon that the vertical crack 52a extends in the thickness direction of the back substrate 8 to become the vertical crack 52b is that the cutting wheel 37 has a tip angle θ of 150 ° to 165 ° and the cutting wheel 37 is connected to the back substrate. It was found that this occurs when the load applied to the surface of 8 is 3 kg to 13 kg. When the vertical crack 52a extends and is formed close to the lower surface of the back substrate 8, a small force is applied to the position outside the scribed portion (the position on the right side of the vertical crack 52b in FIG. 9B). Thus, the outer portion of the scribed portion can be easily separated. The amount (length) by which the vertical crack 52 a extends in the thickness direction of the back substrate 8 depends on the value of the tip angle θ of the cutting wheel 37 and the magnitude of the weight when pressing the cutting wheel 37 against the surface of the back substrate 8. Can be adjusted.

  9 is the case where the cutting wheel 37 is abutted from the upper side of the panel 14 in FIG. 6, but the same phenomenon occurs when the cutting wheel 37 is abutted from the lower side of the panel 14. Will occur. Therefore, after about 5 seconds to 10 seconds have passed since the end of the panel 14 is scribed by the scribe unit 36, the end of the panel 14 is applied by applying an impact to the position outside the portion scribed by the impact applying means 46. Can be cut and separated.

  Next, a procedure for cutting the peripheral portion of the panel 14 using the cutting apparatus of the present embodiment will be described.

  First, as shown in FIG. 5, the panel 14 is placed at a predetermined position on the table 31. Then, the air cylinder 35 is driven to move the panel pressing member 34 downward, and an end portion of one side of the panel 14 is sandwiched and fixed between the support base 33 and the panel pressing member 34. Next, the air cylinder 39 is driven to bring the cutting wheel 37 closer to the panel 14 from above and below the panel 14 and press against the surface of the panel 14. Then, scribing is performed by moving the fixed block 41 in the x direction by the driving means 42 from the end of the panel 14 to the other end while the cutting wheel 37 is pressed against the panel 14. The moving speed of the fixed block 41 is about 20 cm / sec. As a result, the vertical crack 52a shown in FIG. 9A is formed at the position indicated by the alternate long and short dash line 60 in FIG. Here, the vertical crack 52 a is formed in the front panel 7 and the back panel 13.

  Next, the air cylinder 35 is driven and the panel pressing member 34 is moved upward to release the panel 14 from being fixed. After that, the panel 14 is moved so that the scribed side comes to the position of the impact applying means 46, the air cylinder 45 is driven, and the panel pressing member 44 is moved downward to support the end of the scribed side. It fixes between the base 43 and the panel pressing member 44. The state at this time is shown in FIG. Further, the position sandwiched between the support base 43 and the panel pressing member 44 is inside the scribe forming portion 50.

  As described above, after the vertical crack 52 a is formed by scribing on one side of the panel 14, the panel 14 is moved so that the side on which scribing is located at the position of the impact applying means 46. The crack 52a extends in the thickness direction of the substrate. When about 5 to 10 seconds elapse after the vertical crack 52a is formed, the vertical crack 52b shown in FIG. 9B is obtained, and the end of the panel 14 can be easily separated at the vertical crack 52b. It becomes a state.

  Next, an impact is applied to the side where the scribing is performed by the impact applying means 46. That is, as shown in FIG. 11, when the weight 47 is dropped by its own weight by releasing the lock by the cylinder 48 and collides with the end portion of the panel 14, it is cut at the vertical crack 52 b, and from the scribe forming portion 50. The outer portion is separated from the panel 14 and stored in the debris storage box 51. Here, assuming that the time from when the scribe is performed on one side of the panel 14 until the impact is applied to the side is about 10 seconds, the vertical crack 52a is after extending in the thickness direction of the substrate. It can be carried out.

  As described above, in the present embodiment, the side on which the scribing is performed is positioned at the position of the impact applying means 46 by using the time that the vertical crack 52a formed by scribing on one side of the panel 14 extends. The panel 14 is moved. For this reason, the time for separating the peripheral portion of the panel 14 can be shortened, and the plasma display device can be efficiently disassembled.

  As shown in FIGS. 5 and 10, the scribing unit 36 is installed at a position corresponding to one side of the table 31, and the impact applying means 46 is installed at a position corresponding to one side adjacent to the one side of the table 31. is there. Therefore, the scribe unit 36 and the impact applying means 46 can be simultaneously applied to the panel 14. That is, scribing can be performed on one side of the panel 14 and, at the same time, an impact can be applied to the other side. By doing so, the time for separating the peripheral portion of the panel 14 can be further shortened, and the cost performance of the cutting device is improved.

  Moreover, since the roller bearing 32 is installed on the table 31 so that the panel 14 can be rotated on the table 31, the panel 14 can be smoothly rotated and the workability is good.

  Moreover, as shown in FIG. 5, the weight 47 is arrange | positioned in the cutting device of this Embodiment. In this way, by configuring the impact applying means 46 so as to apply impact to a plurality of locations on one side of the panel 14, the reliability when separating the periphery of a large-sized panel is improved, and the separation is performed. The glass separation line of the part is not disturbed, and a scribe cross section with very few irregularities is obtained. For this reason, the glass substrate after separation can be handled more safely.

  The present invention can also be applied to flat display panels such as a surface-conduction electron-emitter display (SED), a liquid crystal display (LCD), and an electroluminescence (EL) display.

  As described above, according to the present invention, the peripheral portion of the display panel can be efficiently cut, which is useful when recycling a flat display panel.

Perspective view showing structure of plasma display panel The figure which shows an example of the whole structure of a plasma display apparatus Flow diagram showing disassembly process of plasma display device (A), (b) is the top view of a plasma display panel, and sectional drawing which shows a panel peripheral part The top view of the cutting device in one embodiment of the present invention The enlarged view which looked at the cutting device shown in FIG. 5 from the A direction Enlarged view of the cutting wheel The enlarged view which looked at the cutting device shown in FIG. 5 from the B direction (A), (b) is a figure which shows a mode when a plasma display panel is scribed. The figure for demonstrating the cutting method using the cutting device The figure for demonstrating the cutting method using the cutting device

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Front substrate 8 Back substrate 14 Panel 31 Table 32 Roller bearing 36 Scribe unit (scribe means)
37 Cutting wheel 46 Impact applying means 47 Weight

Claims (5)

A device for cutting a peripheral portion of a display panel formed by joining the peripheral portions of two glass substrates with a sealing member, the table on which the display panel is placed, and a tip angle A scribing means for scribing the display panel placed on the table by moving the cutting wheel of 150 ° to 165 ° against the display panel with a load of 3 kg to 13 kg, and the scribing means placed on the table An impact applying means for applying an impact to the side of the display panel on which the scribing is performed, and the scribing means and the impact applying means can simultaneously act on the display panel placed on the table. Preferably, the display panel cutting device is installed at a predetermined position around the table. 2. The display panel cutting device according to claim 1, wherein the scribing means is installed at a position corresponding to one side of the table, and impact applying means is installed at a position corresponding to one side adjacent to the one side of the table. 2. The display panel cutting device according to claim 1, wherein a plurality of roller bearings are installed on the surface of the table, and the display panel is rotated on the table. 2. The display panel cutting device according to claim 1, wherein the impact applying means is configured to apply impact to a plurality of locations on one side of the display panel. A method for cutting a peripheral portion of a display panel formed by joining the peripheral portions of two glass substrates with a sealing member, the table on which the display panel is placed, and the table After using the cutting device having scribing means and impact applying means respectively arranged at predetermined positions around the display panel, after placing the display panel on the table, the scribing means forms a crack on one side of the display panel Then, using the time for the crack to extend in the thickness direction of the display panel, the display panel is arranged so that the one side is at the position of the impact applying means and the other side is at the position of the scribe means. Then, an impact is applied to the one side by the impact applying means to cut at the crack portion, and the scribe means is applied to the other side. Cutting method of a display panel, characterized by forming a crack me.

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