JP4118829B2 - 超平滑研削方法 - Google Patents

超平滑研削方法 Download PDF

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Publication number
JP4118829B2
JP4118829B2 JP2004077299A JP2004077299A JP4118829B2 JP 4118829 B2 JP4118829 B2 JP 4118829B2 JP 2004077299 A JP2004077299 A JP 2004077299A JP 2004077299 A JP2004077299 A JP 2004077299A JP 4118829 B2 JP4118829 B2 JP 4118829B2
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Japan
Prior art keywords
grinding
grindstone
grinding wheel
workpiece
max
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Expired - Fee Related
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Japanese (ja)
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JP2005262363A (ja
JP2005262363A5 (enExample
Inventor
平司 安井
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Japan Science and Technology Agency
National Institute of Japan Science and Technology Agency
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Japan Science and Technology Agency
National Institute of Japan Science and Technology Agency
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  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
JP2004077299A 2004-03-17 2004-03-17 超平滑研削方法 Expired - Fee Related JP4118829B2 (ja)

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JP2004077299A JP4118829B2 (ja) 2004-03-17 2004-03-17 超平滑研削方法

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Application Number Priority Date Filing Date Title
JP2004077299A JP4118829B2 (ja) 2004-03-17 2004-03-17 超平滑研削方法

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JP2005262363A JP2005262363A (ja) 2005-09-29
JP2005262363A5 JP2005262363A5 (enExample) 2006-03-16
JP4118829B2 true JP4118829B2 (ja) 2008-07-16

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JP2004077299A Expired - Fee Related JP4118829B2 (ja) 2004-03-17 2004-03-17 超平滑研削方法

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Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8434340B2 (en) * 2008-12-23 2013-05-07 Barnes Group, Inc. Method for forming a stamped metal part
US8576561B2 (en) 2010-02-02 2013-11-05 Apple Inc. Handheld device enclosure
CN110188501B (zh) * 2019-06-06 2022-10-11 厦门理工学院 一种横磨外圆周向表面粗糙度确定方法
CN118204910B (zh) * 2024-04-02 2025-09-30 华南理工大学 一种基于加工表面特征数据聚类的切深切速控制方法

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JP2005262363A (ja) 2005-09-29

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