JP4109274B2 - Non-contact IC card communication adjustment plate and non-contact IC card case - Google Patents

Description

  The present invention relates to a non-contact IC (abbreviation of Integrated Circuit) card and a non-contact IC card case. More specifically, the communication status between the external device and the non-contact IC card can be communicated with each other by preventing or executing the communication between the external device and the non-contact IC card. The present invention relates to a non-contact IC card communication adjustment plate and a non-contact IC card case.

  Conventionally, an IC card (contact IC card) in which an IC chip in which a memory or a microcomputer is formed in a plastic card is widely known as a medium for inputting and outputting data and programs. The IC card terminal is brought into contact with the input / output terminal and the power supply terminal to input / output data and the like.

  On the other hand, in addition to such contact type IC cards, in recent years, non-contact type IC cards (non-contact IC cards) that perform communication using electromagnetic waves have been used. This non-contact IC card has an antenna inside the card and transmits / receives data using weak radio waves transmitted from an external input / output terminal. Unlike the contact IC card described above, the non-contact IC card contacts the input / output terminal. It is suitable for operation in an environment with a lot of vibration and dust because it can be processed without being used, and it is used for clearing processing of transportation such as buses and railways that require high-speed processing, Widely used in company employee ID cards.

  In addition, technology similar to this contactless IC card has also emerged, a technology called IC tag that assumes network connection, and, like the contactless IC card, transmits and receives data etc. by wireless communication with external devices. ing. Note that the contactless IC card used in this specification includes not only a card whose form is used but also a card that transmits and receives data by wireless communication between an IC chip typified by the IC tag and an external device. Shall be.

  FIG. 22 is a perspective view showing a non-contact IC card. In the non-contact IC card 60, an antenna 64 and an IC chip 66 are embedded in a card-type main body 62. With such a configuration, an external device such as a card reader / writer can be contacted non-contactly using radio waves. Data and programs are read and written between. Specifically, an induced electromagnetic wave is irradiated from the external device side, the induced electromagnetic wave is received by the antenna 64 built in the non-contact IC card 60, and the induced electromotive force generated by the antenna 64 is used as the driving power of the non-contact IC card 60. And the data stored in the IC chip 66 is read by the electromagnetic wave superimposed on the induced electromagnetic wave.

  FIG. 23 is a schematic view showing a usage state of the non-contact IC card 60. FIG. 23 shows a concept in which the non-contact IC card 60 transmits / receives data by being brought close to an external device 70 that transmits / receives data such as a card reader / writer. The contactless IC card 60 and the external device 70 transmit and receive data and the like by wireless communication. In particular, even if no operation is performed on the non-contact IC card 60, the external device 70 automatically starts transmission / reception with the adjacent non-contact IC card 60.

On the other hand, users of such contactless IC cards often carry using a card case for protection. As such a card case, a non-contact IC card is housed inside the case so that it will not be damaged due to external force when it is used, and it will not be damaged by external force or static electricity. Some are created for the purpose of protection (see, for example, Patent Document 1).
JP-A-1-198395

  By the way, since the contact type IC card employs a contact type communication means, it is difficult for anyone other than the IC card owner to access the IC card owned by the person without being noticed by the person. There was no problem with this point and safety. On the other hand, a non-contact IC card can be used without contact by communicating with a non-contact device from a position slightly away from an external device, but is included in the non-contact IC card without being noticed by the holder of the non-contact IC card. If this is misused, valuable data such as monetary value data and ID data of non-contact IC cards will be stolen. It was.

  Specifically, if the passenger has an external device for reading such as a card reader in a crowded train, the information on the non-contact IC card possessed by the passenger is read just by approaching the passenger. Could be possible. In addition, for bank cards and credit cards, there is a risk that personal information of the cards owned by each person will be easily stolen without the user's knowledge, and the automatic ticket gates currently used by railway companies. In the case of a non-contact IC card for passing through the machine, there is a risk that it may be charged that it is judged that the communication has occurred just by passing near the automatic ticket gate.

  On the other hand, if the non-contact IC card is unilaterally shielded from the outside, such a danger can be avoided. However, if such a shielded state is used, if it is used (communication is performed). In the case), the operability is deteriorated and the practicality is lacking.

  Therefore, the present invention enables communication only when the owner wants to communicate between the non-contact IC card and the external device, and blocks communication when there is no intention to use the non-contact IC card and the external device. An object of the present invention is to provide a non-contact IC card communication adjustment plate and a non-contact IC card case capable of appropriately adjusting communication with the apparatus.

  In order to achieve the above object, according to the present invention, an electromagnetic shield layer that blocks or attenuates electromagnetic waves between an external device with which a non-contact IC card communicates and the non-contact IC card, and the non-contact IC card in a magnetic field. This is solved by adopting a configuration having a highly permeable layer that transmits electromagnetic waves.

  Specifically, the non-contact IC card communication adjustment plate according to the first aspect of the present invention is disposed on at least one of both surfaces of the non-contact IC card that can communicate with the external device in a non-contact manner. A non-contact IC card communication adjustment plate for adjusting the communication state of the non-contact IC card, wherein the electromagnetic shield layer has a planar shape that blocks or attenuates electromagnetic waves between the external device and the non-contact IC card; A planar high-permeability layer disposed on one side of the electromagnetic shield layer and transmitting electromagnetic waves between the external device and the non-contact IC card.

  The contactless IC card communication adjustment plate of the present invention includes an electromagnetic shield layer that blocks or attenuates electromagnetic waves between an external device with which the contactless IC card communicates and the contactless IC card, and the contactless IC card in a magnetic field. Therefore, the communication between the non-contact IC card and the external device can be suitably adjusted.

  For example, the electromagnetic shield layer provided in the contactless IC card communication adjustment plate of the present invention shields when electromagnetic waves directly pass through the layer, and when arranged on the back surface of the contactless IC card. When the electromagnetic wave is to be received from the surface of the card, the electromagnetic wave can be attenuated. This prevents the card from receiving an electromagnetic wave (signal) from an external device or transmitting an electromagnetic wave from the card, thereby preventing communication with an external device.

  On the other hand, the highly permeable layer provided in the non-contact IC card communication adjustment plate can transmit electromagnetic waves at a higher density than the air layer. Accordingly, the non-contact IC card arranged on the electromagnetic shield layer side of the non-contact IC card communication adjustment plate blocks the electromagnetic wave from the non-contact IC card communication adjustment plate side, and is opposite to the non-contact IC card communication adjustment plate. The electromagnetic wave from the side is attenuated. The non-contact IC card arranged on the high permeability layer side of the non-contact IC card communication adjustment plate blocks electromagnetic waves from the non-contact IC card communication adjustment plate side. Electromagnetic waves from the opposite side can be received, or electromagnetic waves can be transmitted to the opposite side of the non-contact IC card communication adjustment plate.

  As described above, communication between the non-contact IC card and the external device can be performed by arbitrarily arranging the non-contact IC card with respect to the non-contact IC card communication adjustment plate having different characteristics with respect to the direction. Can be suitably adjusted.

  The “adjustment of communication state” or “communication adjustment” in the present invention means that the electromagnetic wave between the external device and the non-contact IC card is blocked or attenuated to prevent communication between the two, or both of the electromagnetic wave are transmitted and transmitted. The communication is performed by selecting the arrangement of the non-contact IC card and the non-contact IC card communication adjustment plate in consideration of the direction in which the electromagnetic wave received by the non-contact IC card is emitted.

  The non-contact IC card communication adjusting plate according to the second aspect of the present invention is arranged on at least one of both surfaces of the non-contact IC card that can communicate with the external device in a non-contact manner, and the external device and the non-contact IC card. A non-contact IC card communication adjustment plate for adjusting the communication state of the plane, and a planar electromagnetic shield layer for blocking or attenuating electromagnetic waves between the external device and the non-contact IC card, and the electromagnetic shield layer And a planar high-permeability layer that transmits electromagnetic waves between the external device and the non-contact IC card.

  Since the present invention employs a configuration in which high permeability layers are arranged on both sides of the electromagnetic shield layer as compared with the first invention, the high permeability of the contactless IC card communication adjustment plate of the first invention is adopted. The action of the magnetic layer side is exerted on both surfaces of the non-contact IC card communication adjusting plate. That is, the non-contact IC card arranged on one side of the non-contact IC card communication adjustment plate blocks electromagnetic waves from the non-contact IC card communication adjustment plate side, but the non-contact IC card communication adjustment plate Electromagnetic waves from the opposite side can be received, or electromagnetic waves can be transmitted to the opposite side of the non-contact IC card communication adjustment plate.

  In the non-contact IC card communication adjustment plate of the present invention, it is preferable that the electromagnetic shield layer has a size exceeding an antenna built in the non-contact IC card.

  According to the present invention, since the electromagnetic shield layer is larger than the antenna built in the non-contact IC card, the electromagnetic waves between the external device and the non-contact IC card can be reliably blocked or attenuated.

  In the non-contact IC card communication adjusting plate of the present invention, it is preferable that the planar shape of the high magnetic permeability layer is included in the planar shape of the electromagnetic shield layer.

  According to the present invention, since the planar shape of the highly permeable layer is included in the planar shape of the electromagnetic shield layer, electromagnetic waves from the highly permeable layer side leak into the electromagnetic shield layer side, Electromagnetic waves from the layer side can be prevented from leaking into the highly permeable layer side.

  A non-contact IC card case according to the present invention includes the non-contact IC card communication adjustment plate described above and a card storage unit that stores the non-contact IC card.

  According to this non-contact IC card case of the present invention, since the non-contact IC card communication adjustment plate of the present invention described above is provided, the non-contact IC card that preferably enjoys the effect produced by the non-contact IC card communication adjustment plate described above. A card case can be provided.

  The non-contact IC card case of the present invention is a spread-type non-contact IC card case having a pair of spread surfaces, wherein the card storage portion is provided on one spread surface, and the non-contact IC is provided on the other spread surface. A card communication adjustment plate may be mounted, and the card storage unit may be provided on at least one of both surfaces of the non-contact IC card communication adjustment plate.

  Further, the non-contact IC card case of the present invention is a spread-type non-contact IC card case having a pair of spread surfaces, and the non-contact IC card communication adjustment plate is mounted on each of the pair of spread surfaces, And the said card | curd accommodating part may be made to be provided also in at least one of the both surfaces side of the said non-contact IC card communication adjustment board.

  Furthermore, the non-contact IC card case of the present invention is a spread-type non-contact IC card case having a pair of spread surfaces, and the non-contact IC card communication adjustment plate is mounted on one spread surface, A planar electromagnetic shielding layer for blocking or attenuating electromagnetic waves is mounted on the spread surface, and the card storage portion is provided at least on the side where the non-contact IC card communication adjustment plate and the electromagnetic shielding layer face each other. It may be made to be.

  These non-contact IC card cases of the present invention have a pair of facing surfaces, and the card storage formed in these card cases in consideration of the direction in which electromagnetic waves received by the non-contact IC card are emitted. The communication between the non-contact IC card and the external device can be efficiently adjusted by appropriately selecting the position of the part and the non-contact IC card communication adjustment plate to be employed.

  According to the present invention, an electromagnetic shield layer that blocks or attenuates electromagnetic waves between an external device that communicates with a non-contact IC card and the non-contact IC card, and the non-contact IC card is placed in an electromagnetic field to transmit the electromagnetic waves. A non-contact IC card communication adjustment plate and a non-contact IC card case that can suitably adjust communication between the non-contact IC card and an external device are provided. be able to.

  Hereinafter, an aspect of an embodiment of the present invention will be described with reference to the drawings.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings.
FIG. 1 is a perspective view showing a non-contact IC card communication adjusting plate of the present invention, and FIG. 2 is a sectional view taken along line XX ′ of FIG. Here, 1 is a non-contact IC card communication adjustment plate, 11 is an electromagnetic shield layer, and 12 is a highly permeable layer.

  The electromagnetic shield layer 11 constituting the non-contact IC card communication adjustment plate 1 is non-contact and communicates with an external device 70 (see FIG. 23; the same applies hereinafter) with a non-contact IC card 60 (see FIGS. 22 and 23; the same applies hereinafter). In order to prevent communication with the external device 70, the electromagnetic wave between the non-contact IC card 60 and the external device 70 is blocked or attenuated.

  The electromagnetic shield layer 11 preferably has a larger planar shape than the antenna 64 built in the non-contact IC card 60 (see FIG. 22; the same applies hereinafter). By making the planar shape of the electromagnetic shield layer 11 constituting the non-contact IC card communication adjustment plate 1 larger than that of the antenna built in the non-contact IC card 60, electromagnetic waves between the external device 70 and the non-contact IC card 60 can be reduced. It can be reliably cut off or attenuated.

  In recent years, the antenna 64 built in the non-contact IC card 60 is often an antenna that is used for both transmission and reception. However, the present invention is not limited to this, and the antenna 64 is divided for transmission and reception. The non-contact IC card communication adjusting plate 1 of the present invention can be applied even to the non-contact IC card 60 that is present. In addition, when the antennas 64 are separately provided for transmission and reception as described above, if any one of the antennas 64 can be shielded (shielded) by the electromagnetic shield layer 11, the non-contact IC card 60 is provided. Communication with the external device 70 can be prevented. The size of the antenna 64 is appropriately determined according to the system employed by the non-contact IC card 60.

  The metal that can be applied to the electromagnetic shield layer 11 is not particularly limited as long as it has conductivity. Examples of the metal include conductivity such as gold, silver, platinum, copper, aluminum, iron, and nickel. And known materials. In addition, as long as it is a substance which can obtain an electromagnetic shielding effect by showing electroconductivity, the substance which comprises the electromagnetic shielding layer 11 is not limited to an above-described metal, For example, you may make it use a conductive ceramic.

  In order to form the electromagnetic shielding layer 11, for example, the above-described metal or the like configured in a mesh shape, the lattice-shaped configuration, or the above-described metal or the like in a foil shape or a plate shape is appropriately used. Can do.

  Further, a predetermined medium may be used as the base (Base), and the shielding performance may be imparted by applying the above-described metal or the like to be used as the electromagnetic shield layer 11. For example, a material such as a sheet-like plastic, cloth, paper, etc. may be adopted as the substrate, and a powdery metal or the like may be applied thereto to form the electromagnetic shield layer 11. The powdery plastic may contain a metal powder. Alternatively, the electromagnetic shield layer 11 may be formed into a layer shape. Alternatively, the electromagnetic shield layer 11 may be configured by bonding or sewing metal or the like to the layered substrate.

  For example, when the base is configured as a plastic, any resin material such as polyethylene (PE), polypropylene (PP), polyethylene terephthalate (PET) can be used. And what is formed with plastic film in which conductive powder is mixed in the substrate, what is formed with plastic film with metal thin film deposited on the surface, and plastic film with metal foil attached on the surface Various forms such as those formed by plastic films with conductive resin coated on the surface, those formed by plastic films with metal wires or metal nets embedded inside, etc. These are considered, and any of these aspects is understood as the electromagnetic shielding layer 11 of the present invention.

  Next, the high-permeability layer 12 constituting the non-contact IC card communication adjustment plate 1 plays a role of guiding the non-contact IC card 60 that communicates with the external device 70 by non-contact to communicate with the external device 70. Therefore, the communication state of the non-contact IC card 60 is suitably adjusted by applying in combination with the electromagnetic shield layer 11 described above.

  As shown in FIGS. 1 and 2, the planar shape of the highly permeable layer 12 constituting the contactless IC card communication adjustment plate 1 of the present embodiment is included in the planar shape of the electromagnetic shield layer 11 described above. It is preferable to do. By including the planar shape of the highly permeable layer 12 in the planar shape of the electromagnetic shield layer 11, electromagnetic waves from the highly permeable layer 12 side leak into the electromagnetic shield layer 11 side, Electromagnetic waves from the side can be prevented from leaking into the highly permeable layer 12 side.

  As a material constituting the highly permeable layer 12, a material having excellent permeability μ (for example, the relative permeability is preferably 100 or more, more preferably 1000 or more at the frequency of the electromagnetic wave used). What is necessary is just to use well-known materials, such as permalloy, ferrite, sendust, directional silicon steel, for example.

  The highly permeable layer 12 may be formed by laminating the above-described material by a known method, and the highly permeable layer 12 may be formed by vapor-depositing the material on a plastic film or the like. Also good.

  Moreover, there is no restriction | limiting in particular as a method of laminating | stacking the electromagnetic shielding layer 11 and the highly permeable layer 12, A well-known method can be used, for example, the electromagnetic shielding layer 11 and the highly permeable respectively formed independently, for example. The magnetic layer 12 can be laminated and integrated by means such as bonding the magnetic layer 12 via an adhesive or a pressure-sensitive adhesive.

  FIG. 3 is a schematic view showing an example of an application method of the contactless IC card communication adjustment plate 1 of the present embodiment. Hereinafter, the communication state of the card A arranged on the electromagnetic shield layer 11 side of the non-contact IC card communication adjustment plate 1 and the card B arranged on the highly permeable layer 12 side will be described with reference to FIG. The following cards A, B, C and D are all non-contact IC cards).

  Here, in FIG. 3, solid arrows indicate electromagnetic waves (signals) for reading information on the card A, and dotted arrows indicate electromagnetic waves (signals) for reading information on the card B.

  Further, for each card, the surface opposite to the surface facing the non-contact IC card communication adjustment plate 1 is the front surface, and the surface facing the non-contact IC card communication adjustment plate 1 is the back surface. Then, “◯” below the arrow indicates that communication is normally performed, and “×” indicates that communication is not normally performed.

  As shown in FIG. 3, the card A has an electromagnetic shield layer 11 disposed on the back surface thereof. Since the electromagnetic wave for reading the card A transmitted from the (L) side (left side of FIG. 3; the same applies to the other figures hereinafter) is attenuated by the electromagnetic shield layer 11, reception by the card A is suitable. Communication will be hindered. In general, there is no electromagnetic wave inside the conductor (electromagnetic shield layer 11), and there is a property that electromagnetic waves are not sufficiently present even at the boundary surface between air and the conductor due to boundary conditions. Even if an electromagnetic wave for reading A is transmitted from the (L) side, the external device 70 that transmits the electromagnetic wave to the card A is attenuated due to the electromagnetic shield layer 11 disposed on the back surface of the card A. Communicating with is prevented.

  Moreover, the electromagnetic wave for reading the card | curd A transmitted from the (R) side (the right side of FIG. 3 and the following is the same also about another figure) is shielded by the electromagnetic shielding layer of the non-contact IC card communication adjustment board 1. For this reason, reception with the card A is not suitably performed, and communication is hindered. Here, since the electromagnetic wave generally proceeds linearly as the frequency of the electromagnetic wave used increases, the back side of the electromagnetic shield layer 11 (the side opposite to the surface facing the traveling electromagnetic wave. The card A side in FIG. 3). .) Has a shadow of electromagnetic waves. Due to this property, the electromagnetic shield layer 11 is arranged on the surface where the card A receives electromagnetic waves, whereby the electromagnetic waves for reading the card A are shielded by the electromagnetic shield layers 11, and the card A does not transmit the electromagnetic waves. This prevents communication with the originating external device 70.

  Next, the card B arranges the high magnetic permeability layer 12 and the electromagnetic shield layer 11 in this order on the back surface. The electromagnetic wave for reading the card B transmitted from the (L) side is shielded by the electromagnetic shield layer 11 in the same manner as the electromagnetic wave from the (R) side for the card A described above, and the card B and the outside transmitting the electromagnetic wave. Communication with the device 70 is prevented.

  On the other hand, the electromagnetic wave for reading the card B transmitted from the (R) side is reduced in the influence of the electromagnetic shield layer 11 by disposing the highly permeable layer 12 on the back surface of the card B. Electromagnetic waves from the outside can be received without problems, and electromagnetic waves can be transmitted from the card B. This is because the magnetic field tends to concentrate in the material with high magnetic permeability (high magnetic permeability layer 12). If there is a card B (non-contact IC card 60) on the high magnetic permeability layer 12 side, this card B is also This is because the card B is placed in a magnetic field. Therefore, the card B can receive an electromagnetic wave from the outside and can transmit the electromagnetic wave.

  According to the contactless IC card communication adjustment plate 1 of the present embodiment, the electromagnetic shield layer 11 that blocks or attenuates electromagnetic waves between the external device 70 and the contactless IC card 60 with which the contactless IC card 60 communicates, The contact IC card 60 is placed in a magnetic field, and the structure having the high magnetic permeability layer 12 that transmits the electromagnetic waves is adopted, and the non-contact IC card communication is performed in consideration of the direction in which the electromagnetic waves received by the non-contact IC card are emitted. By selecting the surface of the adjustment plate 1 that is disposed with respect to the non-contact IC card 60, communication between the non-contact IC card 60 and the external device 70 can be suitably adjusted.

(Second Embodiment)
The second embodiment of the present invention will be described below with reference to the drawings.
In the non-contact IC card communication adjustment plate 1 shown in the first embodiment, the high-permeability layer 12 is disposed on one surface of the electromagnetic shield layer 11, but the non-contact IC card communication adjustment plate 2 of this embodiment. Is different from the first embodiment in that the high magnetic permeability layers 121 and 122 are arranged on both surfaces of the electromagnetic shield layer 11.

  In the following description, parts that are the same as or substantially the same as those already described in the first embodiment are denoted by the same reference numerals and description thereof is omitted.

  FIG. 4 shows a cross-sectional view of the non-contact IC card communication adjustment plate 2 according to the second embodiment. As shown in FIG. 4, in the contactless IC card communication adjustment plate 2 of the present embodiment, the high magnetic permeability layers 12 are arranged on both surfaces of the electromagnetic shield layer 11.

  FIG. 5 is a schematic view showing an example of an application method of the contactless IC card communication adjustment plate 2 of the present embodiment, as in FIG. 3 described above. Hereinafter, the communication state of the card A and the card B arranged on both sides of the non-contact IC card communication adjustment plate 1 will be described with reference to FIG.

  Here, in FIG. 5, solid arrows indicate electromagnetic waves (signals) for reading information on the card A, and dotted arrows indicate electromagnetic waves (signals) for reading information on the card B. As for the card, the surface opposite to the surface facing the non-contact IC card communication adjustment plate 2 is the front surface, and the surface facing the non-contact IC card communication adjustment plate 2 is the back surface, as in the first embodiment. It is.

  As shown in FIG. 5, the highly permeable layers 121 and 122 are arranged on the back surface of the card A and the card B. For this reason, as shown in the first embodiment, there is no influence of the electromagnetic shield layer 11, and therefore the card A and the card B can receive the electromagnetic waves from the front side without any problem. Therefore, the electromagnetic wave to the card A from the (L) side is received by the card A without any problem, and the card A can transmit the responding electromagnetic wave. Similarly, the electromagnetic wave to the card B from the (R) side. Is received without any problem by the card B, and the card B can transmit a responding electromagnetic wave.

  On the other hand, when an electromagnetic wave for reading the card B is emitted from the (L) side and when an electromagnetic wave for reading the card A is emitted from the (R) side, both of these electromagnetic waves are applied to the electromagnetic shield layer 11. Since it is shielded, it is prevented that these cards A and B communicate with the external device 70 that has transmitted electromagnetic waves.

(Third embodiment)
The third embodiment of the present invention will be described below with reference to the drawings.
FIG. 6 is a perspective view showing the non-contact IC card case 30 according to the present embodiment. The non-contact IC card case 30 shown in FIG. 6 is formed with a card storage portion 15 having a substantially rectangular cross section, and the non-contact IC card communication adjusting plate shown in the first and second embodiments described above. 1 and 2. Further, the non-contact IC card case 30 allows the non-contact IC card 60 to be taken in and out. The non-contact IC card 60 is one of both surfaces of the non-contact IC card communication adjustment plates 1 and 2 provided in the non-contact IC card case 30. What is necessary is just to accommodate in the card | curd accommodating part 15 so that it may arrange | position to at least either one.

  FIGS. 7 and 8 are schematic views showing other aspects of the non-contact IC card case according to the present embodiment, and show a spread-type non-contact IC card case having a pair of spread surfaces 17. Here, FIG. 7 shows a state where the case 31 is opened, and FIG. 8 shows a state where the case 31 is closed.

  The contactless IC card case 31 shown in FIGS. 7 and 8 is provided with a card storage portion 15 on one spread surface 171 (left side in FIG. 7), and an adjustment plate storage on the other spread surface 172. The contactless IC card communication adjustment plates 1 and 2 are mounted inside the unit 16.

  Moreover, the card storage part 15 is provided in the both surfaces (front surface and back surface) side of the non-contact IC card communication adjustment plates 1 and 2 mounted in the non-contact IC card case 31 shown in FIGS. A total of three non-contact IC cards 60 can be accommodated in the non-contact IC card case 31 according to the present embodiment.

  In the open state (FIG. 7), the non-contact IC card case 31 is in a state where the non-contact IC card 60 stored in the card storage unit 15 of the facing surface 171 and the non-contact IC card communication adjustment plates 1 and 2 are separated. On the other hand, in the closed state (FIG. 8), the non-contact IC card 60 and the non-contact IC card communication adjustment plates 1 and 2 are close to each other. In addition to the open state and the closed state, either the non-contact IC card communication adjustment plate 1 or the non-contact IC card communication adjustment plate 2 to be provided is provided, or the non-contact IC card is provided. When the communication adjustment plate 1 is provided, the adjustment of the communication state varies depending on the orientation.

  Hereinafter, some examples of application methods in the non-contact IC card case 31 shown in FIGS. 7 and 8 will be described with reference to the drawings.

  FIG. 9 includes the non-contact IC card communication adjustment plate 1 shown in the first embodiment as a non-contact IC card communication adjustment plate, and is seen from the inner side of the non-contact IC card communication adjustment plate 1 (the spread surface 17 side). The high magnetic permeability layer 12 is disposed on the outside (the opposite side of the spread surface 17; the same applies hereinafter), and the electromagnetic shield layer 11 is disposed on the outside. Then, the card B is stored in the card storage portion 15 of the spread surface 171, and the card C is stored in the card storage portion 15 on the inner side of the non-contact IC card communication adjustment plate 1 on the spread surface 172, and Each card D is stored.

  Here, in FIG. 9 to FIG. 11 and FIG. 13 to FIG. 20, hereinafter, solid line arrows read electromagnetic waves (signals) for reading information on the card A, and dotted line arrows read information on the card B. For the electromagnetic wave (signal), the dashed-dotted arrow indicates the electromagnetic wave (signal) for reading information on the card C, and the double-dotted arrow indicates the electromagnetic wave (signal) for reading information on the card D. . Further, similarly to the above-described embodiment, each card has a surface opposite to the surface facing the non-contact IC card communication adjustment plates 1 and 2 as a surface, and the contactless IC card communication adjustment plates 1 and 2 The opposite surface is the back surface, and “◯” below the arrow indicates that communication is normally performed, and “X” indicates that communication is not normally performed. In these drawings, the portions surrounded by dotted lines are the results when the non-contact IC card cases 31, 32, 33, 34 are opened. Otherwise, the card cases 31, 32, 33, 34 are closed. The results in each state are shown.

  In the configuration of FIG. 9, when the non-contact IC card case 31 is closed, there is no obstacle in the electromagnetic waves for reading the card B when viewed from the (L) side. It will be done without problems. When an electromagnetic wave for reading the card C is transmitted from the (L) side, the card B carrying the conductor is transmitted, and reception by the card C is suitably performed.

  On the other hand, from the (R) side, electromagnetic waves for reading the card C are shielded by the electromagnetic shield layer 11, thereby preventing communication with the external device 70. Moreover, since the electromagnetic shielding layer 11 is arrange | positioned at the back surface of the card | curd D, the electromagnetic wave for reading the card | curd D attenuates electromagnetic waves and this also prevents communicating with the external device 70 which transmitted the signal.

  When the card case 31 is opened, the card B without any obstacle receives the electromagnetic wave for reading the card B, and the communication is performed without any problem. Therefore, the electromagnetic wave for reading the card C is satisfactorily received, and communication can be performed without any problem.

  FIG. 10 shows a configuration in which the electromagnetic shield layer 11 is arranged on the inner side and the highly permeable layer 12 is arranged on the outer side as viewed from the non-contact IC card communication adjusting plate 1 in FIG. .

  In the configuration of FIG. 10, when the non-contact IC card case 31 is closed, when an electromagnetic wave for reading the card B is transmitted from the (L) side, the electromagnetic shield layer 11 is disposed on the back surface of the card C. Therefore, electromagnetic waves around the card B are also attenuated, and communication with the external device 70 that has transmitted the signal is prevented. Similarly, for the card C, when an electromagnetic wave for reading the card C is transmitted from the (L) side, the electromagnetic shield layer 11 is disposed on the back surface of the card C, so that the electromagnetic wave is attenuated, and this also transmits a signal. Communication with the external device 70 is prevented.

  On the other hand, from the (R) side, electromagnetic waves for reading the card C are shielded by the electromagnetic shield layer 11, thereby preventing communication with the external device 70. On the other hand, since the highly permeable layer 12 is disposed on the back surface of the card D, the electromagnetic wave for reading the card D is received well by the card D, and communication is performed without any problem.

  When the card case 31 is opened, the card B without any obstacles receives the electromagnetic waves for reading the card B and the communication is performed without any problem as in the configuration of FIG. However, since the electromagnetic shield layer 11 is disposed on the back surface of the card C, the electromagnetic wave is attenuated and communication with the external device 70 that has transmitted the signal is prevented.

  Therefore, in the configuration of FIG. 10, compared with the configuration of FIG. 9, communication with the card D from the (R) side can be satisfactorily performed with the card case 31 closed, while the card from the (L) side Communication between B and card C is prevented. When the card case 31 is opened, communication with the card C is prevented.

  FIG. 11 employs the non-contact IC card communication adjustment plate 2 shown in the second embodiment in place of the non-contact IC card communication adjustment plate 1 as the non-contact IC card communication adjustment plate in FIGS. 9 and 10 described above. The configuration is shown.

  In the configuration of FIG. 11, when the non-contact IC card case 31 is closed, the electromagnetic wave for reading the card B is satisfactorily received from the (L) side, and the communication of the card B is performed without any problem. . When an electromagnetic wave for reading the card C is transmitted from the (L) side with respect to the card C, the card B is transmitted and the reception by the card C is suitably performed. This is the same as the configuration of FIG. 9 described above.

  Further, from the (R) side (the right side in FIG. 11), electromagnetic waves for reading the card C are shielded by the electromagnetic shield layer 11, thereby preventing communication with the external device 70. On the other hand, the electromagnetic waves for reading the card D are received by the card D satisfactorily by the high permeability layer 12 disposed on the back surface of the card D, and communication is performed without any problem.

  On the other hand, when the card case 31 is opened, the card B without any obstacle receives the electromagnetic wave for reading the card B. In addition, since the highly permeable layer 12 is disposed on the back surface of the card C, the electromagnetic waves for reading the card C are satisfactorily received, and communication is performed without any problem. In other words, when the card case 31 is opened, the communication adjustment in FIG. 11 is the same as that in FIG.

  Therefore, in the configuration of FIG. 11, when the card case 31 is opened, the communication state is the same as the configuration of FIG.

  Next, FIG. 12 is a schematic view showing another aspect of the non-contact IC card case according to the present embodiment. 12 is also a spread-type non-contact IC card case 32 having a pair of spread surfaces 17, and FIG. 12 shows a state in which the card case 32 is opened. The closed state of the card case 32 is the same as that shown in FIG.

  In the non-contact IC card case 32 shown in FIG. 12, the non-contact IC card communication adjustment plates 1 and 2 are mounted inside the adjustment plate storage portion 16 for both of the pair of spread surfaces 171 and 172. Moreover, the card storage part 15 is provided in the both surfaces side of this non-contact IC card communication adjustment plates 1 and 2, and the card storage part 15 is provided only in one spread surface 171 about this point. 7 is different from the configuration of the non-contact IC card case shown in FIG. In addition, although the card storage part 15 distribute | arranged to the back surface side of the non-contact IC card communication adjustment plates 1 and 2 has shown the state formed inside the facing surface 17, the said card storage part 15 is a facing surface. You may make it form in the outer side of 17. Further, a total of four non-contact IC cards 60 can be stored in the non-contact IC card case 32 according to the present embodiment.

  Similar to the non-contact IC card case 31 shown in FIGS. 7 and 8, some examples of application methods in the non-contact IC card case 32 shown in FIG. 12 will be described below with reference to the drawings.

  FIG. 13 shows a non-contact IC card communication adjustment plate in which the non-contact IC card communication adjustment plate 1 shown in the first embodiment is mounted on each of the pair of facing surfaces 171 and 172. 1, the electromagnetic shield layer 11 is disposed inside the card case 32 and the highly permeable layer 12 is disposed outside the card case 32 when viewed from the contactless IC card communication adjustment plate 1. Then, the card B is stored in the card storage portion 15 on the inner side (spreading surface 17 side) of the non-contact IC card communication adjustment plate 1 on one facing surface (for example, the facing surface 171), and the outer side (spreading surface 17 and The cards A are respectively stored in the card storage portions 15 on the opposite side. Further, on the other spread surface (for example, the spread surface 172), the card C is stored in the card storage portion 15 on the inner side of the non-contact IC card communication adjustment plate 1, and the card D is stored in the outer card storage portion 15. Yes.

  In the configuration of FIG. 13, when the non-contact IC card case 32 is closed, the highly permeable layer 12 is disposed on the back surface of the card A from the (L) side, so that the card A is read. The electromagnetic wave is received well, and communication is performed without any problem. On the other hand, even when an electromagnetic wave for reading the card B is transmitted from the (L) side, the electromagnetic wave is shielded by the electromagnetic shield layer 11, so that the reception by the card B is not performed.

  On the other hand, the electromagnetic wave for reading the card C from the (R) side is shielded by the electromagnetic shield layer 11 and is prevented from communicating with the external device 70. On the other hand, since the highly permeable layer 12 is disposed on the back surface of the card D, the electromagnetic wave for reading the card D is satisfactorily received by the card D, and communication is performed without any problem.

  And in the state which opened the card case 32, since the electromagnetic waves for reading the card | curd A and the card | curd D are shielded by the electromagnetic shielding layer 11, reception with the card | curd A and the card | curd D is not performed. Further, since the electromagnetic shield layer 11 is disposed on the back surfaces of the card B and the card C, the electromagnetic wave is attenuated, so that the card B and the card C also communicate with the external device 70 that has transmitted the electromagnetic wave for reading the card. It is prevented.

  Therefore, in the configuration of FIG. 13, the card (card A, card D) arranged on the outer side (opposite to the spread surface 17) when viewed from the non-contact IC card communication adjustment plate 1 with the card case 32 closed. In a state where communication is performed and the card case 32 is opened, it is suitable for the case where it is desired to prevent communication of all cards in the opened direction.

  FIG. 14 shows a configuration in which the non-contact IC card communication adjusting plate 1 in FIG. 13 is arranged such that the high magnetic permeability layer 12 is arranged inside the card case 32 and the electromagnetic shield layer 11 is arranged outside. ing.

  In the configuration of FIG. 14, when the non-contact IC card case 32 is in a closed state, even if an electromagnetic wave for reading the card A is transmitted from the (L) side, the electromagnetic shield layer 11 is formed on the back surface of the card A. Therefore, electromagnetic waves are attenuated, and communication with the external device 70 is prevented. Further, even when the card B transmits an electromagnetic wave for reading the card B from the (L) side, the card B is not received by the card B because it is shielded by the electromagnetic shield layer 11.

  Similarly, even when an electromagnetic wave for reading the card C is transmitted from the (R) side, the electromagnetic shield layer 11 is disposed on the back surface of the card C, so that the electromagnetic wave is shielded. Even if an electromagnetic wave for reading the card D is transmitted from the R) side, since it is attenuated by the electromagnetic shield layer 11, both of them interfere with communication with the external device 70.

  And in the state which opened the card case 32, since the electromagnetic waves for reading the card | curd A and the card | curd D are shielded by the electromagnetic shielding layer 11, reception with the card | curd A and the card | curd D is not performed, Since the highly permeable layer 12 is disposed on the back surfaces of the card B and the card C, the electromagnetic waves for reading the card B and the card C are satisfactorily received by the respective cards, and communication is performed without any problem.

  Therefore, the configuration of FIG. 14 prevents communication of all cards when the card case 32 is closed, and the card disposed on the facing surface 17 side when the card case 32 is opened. This is suitable when communication of (Card B, Card C) is desired.

  FIG. 15 shows the contactless IC card communication adjustment plate 1 mounted on one spread surface (for example, the spread surface 171) in FIG. 13 and FIG. 14, and the highly permeable layer 12 is placed inside the card case 32. In addition, the electromagnetic shield layer 11 is disposed on the outer side, the non-contact IC card communication adjustment plate 1 mounted on the other spread surface (for example, the spread surface 172), the electromagnetic shield layer 11 on the inner side of the card case 32, In addition, a configuration in which the high magnetic permeability layer 12 is disposed outside is shown.

  In the configuration of FIG. 15, when the non-contact IC card case 32 is closed, even if an electromagnetic wave for reading the card A is transmitted from the (L) side, the electromagnetic shield layer 11 is formed on the back surface of the card A. Therefore, even if the card B emits an electromagnetic wave for reading the card B from the (L) side, it is shielded by the electromagnetic shield layer 11, so that the reception by the card B is performed. Accordingly, communication with the external device 70 is hindered. This is the same as the configuration shown in FIG.

  Further, even when an electromagnetic wave for reading the card C is transmitted from the (R) side, it is shielded by the electromagnetic shield layer 11, while the highly permeable layer 12 is disposed on the back surface of the card D. The electromagnetic wave for reading the card D is satisfactorily received by the card D, and communication is performed without any problem. This is the same as the configuration shown in FIG.

  And in the state which opened the card case 32, since the electromagnetic waves for reading the card | curd A and the card | curd D are shielded by the electromagnetic shielding layer 11, reception by the card | curd A and the card | curd D is not performed. Become.

  Further, since the highly permeable layer 12 is disposed on the back surface of the card B, the electromagnetic wave for reading the card B is satisfactorily received by the card B, and communication is performed without any problem. On the other hand, since the electromagnetic shield layer 11 is disposed on the back surface of the card C, the electromagnetic wave is attenuated.

  Therefore, in the configuration of FIG. 15, when the card case 32 is closed, communication of only one of the cards (here, the card D) arranged on the outside as viewed from the non-contact IC card communication adjustment plate 1 is performed. When the card case 32 is opened, it is suitable for communication of one card (here, the card B) arranged on the facing surface 17 side.

  FIG. 16 is a non-contact IC card communication adjustment plate shown in the second embodiment in place of the non-contact IC card communication adjustment plate 1 as a non-contact IC card communication adjustment plate mounted on one spread surface in FIG. The structure which employ | adopted the board 2 is shown.

  In the configuration of FIG. 16, when the non-contact IC card case 32 is in a closed state, when an electromagnetic wave for reading the card A is transmitted from the (L) side, the highly permeable layer 12 is disposed on the back surface of the card A. Therefore, the electromagnetic wave for reading the card A is received well. On the other hand, for the card B, even if an electromagnetic wave for reading the card B is transmitted from the (L) side, the card B is shielded by the electromagnetic shield layer 11, so that the reception by the card B is not performed.

  Further, even when an electromagnetic wave for reading the card C is transmitted from the (R) side, the electromagnetic wave is shielded because the electromagnetic shield layer 11 is disposed on the back surface of the card C. Even if an electromagnetic wave for reading the card D is transmitted from the) side, it is attenuated by the electromagnetic shield layer 11.

  And in the state which opened the card case 32, since the electromagnetic waves for reading the card | curd A and the card | curd D are shielded by the electromagnetic shielding layer 11, reception with the card | curd A and the card | curd D is not performed. On the other hand, since the high magnetic permeability layer 12 is disposed on the back surfaces of the card B and the card C, the electromagnetic waves for reading the card B and the card C are satisfactorily received by the respective cards, and communication is performed without any problem. This is also the same as that shown in FIG.

  Therefore, in the configuration of FIG. 16, in addition to the configuration of FIG. 14, in the state where the card case 32 is closed, one of the cards (here, the card A) arranged outside the contactless IC card communication adjustment plate 2 is used. This is suitable when you want to carry out communication.

  FIG. 17 shows that in FIG. 16, the electromagnetic shield layer 11 is arranged on the inner side and the highly permeable layer 12 is arranged on the outer side as viewed from the non-contact IC card communication adjusting plate 1 mounted on the other spread surface. Shows the configuration.

  In the configuration of FIG. 17, when the non-contact IC card case 32 is in a closed state, when an electromagnetic wave for reading the card A is transmitted from the (L) side, the card is similar to that shown in FIG. Since the highly permeable layer 12 is arranged on the back surface of A, the electromagnetic wave for reading the card A is well received. On the other hand, for the card B, the electromagnetic wave for reading the card B is transmitted from the (L) side. However, it is shielded by the electromagnetic shield layer 11.

  When an electromagnetic wave for reading the card C is transmitted from the (R) side, the electromagnetic wave is shielded by the electromagnetic shield layer 11, while the highly permeable layer 12 is disposed on the back surface of the card D. Therefore, the electromagnetic wave for reading the card D is received well.

  And in the state which opened the card case 32, since the electromagnetic waves for reading the card | curd A and the card | curd D are shielded by the electromagnetic shielding layer 11, reception with the card | curd A and the card | curd D is not performed. Further, since the highly permeable layer 12 is disposed on the back surface of the card B, the electromagnetic wave for reading the card B is satisfactorily received by the card B, and the communication is performed without any problem. Since the electromagnetic shield layer 11 is disposed on the back surface of the card, communication with an external device that transmits an electromagnetic wave for reading the card C is prevented.

  Accordingly, in the configuration of FIG. 17, the card (card A, card D) arranged on the outer side (opposite to the facing surface 17) when viewed from the non-contact IC card communication adjustment plates 1 and 2 with the card case 32 closed. ), And when the card case 32 is closed, it is suitable for communication of one card (here, card B) arranged on the facing surface 17 side. For example, the configuration of FIG. This corresponds to the case where communication of the card B is desired with the card opened.

  FIG. 18 shows a configuration in which the non-contact IC card communication adjustment plate 2 shown in the second embodiment is mounted on each of the spread surfaces 171 and 172 as the non-contact IC card communication adjustment plate.

  In the configuration of FIG. 18, when the non-contact IC card case 32 is in the closed state, as shown in the configurations of FIGS. 16 and 17, when an electromagnetic wave for reading the card A is transmitted from the (L) side, By arranging the highly permeable layer 12 on the back surface of the card A, the electromagnetic wave for reading the card A is received well. On the other hand, for the card B, the electromagnetic wave for reading the card B from the (L) side is received. Even if it transmits, since it is shielded by the electromagnetic shielding layer 11, reception with the card | curd B will not be performed.

  Further, when an electromagnetic wave for reading the card C is transmitted from the (R) side, the electromagnetic wave for reading the card C is shielded by the electromagnetic shield layer 11. On the other hand, since the highly permeable layer 12 is disposed on the back surface of the card D, electromagnetic waves for reading the card D are received well. This is the same as the configuration of FIG.

  And in the state which opened the card case 32, since the electromagnetic waves for reading the card | curd A and the card | curd D are shielded by the electromagnetic shielding layer 11, reception with the card | curd A and the card | curd D is not performed, Since the highly permeable layer 12 is disposed on the back surfaces of the cards B and C, the electromagnetic waves for reading the cards B and the like are satisfactorily received by the respective cards, and communication is performed without any problem.

  Accordingly, in the configuration of FIG. 18, in addition to the configuration of FIG. 17, both the cards (card B, card C) on the side of the facing surface 17 with respect to the opened direction are in a state where the card case is opened. Suitable for communication.

(Other embodiments)
The aspect described above shows one aspect of the present invention, and the present invention is not limited to the above-described embodiment, and has the configuration of the present invention and can achieve the objects and effects. It goes without saying that modifications and improvements within the scope are included in the content of the present invention. Further, the specific structure, shape, and the like in carrying out the present invention are not problematic as other structures, shapes, and the like as long as the objects and effects of the present invention can be achieved.

  For example, in the non-contact IC card case 32 shown in the third embodiment, the example in which the non-contact IC card communication adjustment plates 1 and 2 are mounted on each of the pair of facing surfaces 171 and 172 is shown. One of the contactless IC card communication adjustment plates 1 and 2 may be used as the electromagnetic shield layer 11 constituting the contactless IC card communication adjustment plates 1 and 2.

  In the following description, parts that are the same as or substantially the same as those already described in the above embodiment are given the same reference numerals and description thereof is omitted.

  FIG. 19 is a schematic view showing another aspect of the non-contact IC card case, and shows a state in which a spread-type case is opened. The state in which the card case 33 is closed is the same as in FIG.

  The non-contact IC card case 33 shown in FIG. 19 has the electromagnetic shield layer 111 mounted on the inside of the shield layer accommodating portion 161 with respect to one spread surface 171, and the adjustment plate accommodating portion 16 on the other facing spread surface 172. The non-contact IC card communication adjustment plates 1 and 2 are mounted in the inside. In addition, card storage portions 15 are provided on both sides of the electromagnetic shield layer 111 and the non-contact IC card communication adjustment plates 1 and 2.

  Hereinafter, some examples of application methods in the non-contact IC card case 33 shown in FIG. 19 will be described with reference to the drawings.

  FIG. 20 is equipped with the non-contact IC card communication adjustment plate 1 shown in the first embodiment as a non-contact IC card communication adjustment plate. The high magnetic permeability layer 12 is disposed on the inner side (spreading surface 17 side) as viewed from the plate 1, and the electromagnetic shield layer 11 is disposed on the outer side (opposite side of the facing surface 17). The card B is stored in the card storage unit 15 inside the electromagnetic shield layer 111 on the spread surface (for example, the spread surface 171) on which the electromagnetic shield layer 111 is mounted, and the card A is stored in the outer card storage unit 15. Are stored. Further, the card C is stored in the card storage portion 15 on the inner side of the non-contact IC card communication adjustment plate 1 on the spread surface (for example, the spread surface 172) on which the non-contact IC card communication adjustment plate 1 is mounted. Cards D are respectively stored in the portions 15.

  In the configuration of FIG. 20, when the non-contact IC card case 33 is closed, the electromagnetic shield layer 111 is disposed on the back surface of the card A from the (L) side. It is possible to prevent communication with the external device 70 that has transmitted an electromagnetic wave for reading A. Further, even when an electromagnetic wave for reading the card B is transmitted from the (L) side, the electromagnetic wave is shielded by the electromagnetic shield layer 111, so that the reception by the card B is not performed.

  On the other hand, from the (R) side, the electromagnetic wave for reading the card C is shielded by the electromagnetic shield layer 11 of the non-contact IC card communication adjustment plate 1, and the non-contact IC card communication adjustment plate is placed on the back surface of the card D. Since one electromagnetic shield layer 11 is arranged, similarly to the card A described above, the card D is prevented from communicating with the external device 70 that has transmitted an electromagnetic wave for reading the card D.

  Even when the card case 31 is in an open state, the electromagnetic waves for reading the card A and the card D are shielded by the electromagnetic shield layers 11 and 111, so that the reception by the card A and the card D is not performed. Further, since the electromagnetic shield layer 111 is disposed on the back surface of the card B, reception by the card B is not performed. On the other hand, since the highly permeable layer 12 is disposed on the back surface of the card C, the electromagnetic wave for reading the card C is received well, and communication is performed without any problem.

  That is, the non-contact IC card case 33 configured as described above prevents communication for any card in the closed state, and in the open state, only the card C communicates in the opened direction. Suitable when you want to.

  FIG. 21 shows a second embodiment instead of the non-contact IC card communication adjustment plate 1 as a non-contact IC card communication adjustment plate mounted on one spread surface (for example, the spread surface 172) in FIG. The structure which employ | adopted the non-contact IC card communication adjustment board 2 shown by is shown.

  In the configuration of FIG. 21, since the high magnetic permeability layer 12 is disposed on the back surface of the card D, the card D is read from the (R) side in a state where the non-contact IC card case 33 is closed. When the electromagnetic wave is transmitted, the electromagnetic wave for reading the card D is well received by the card D, and communication is performed without any problem. On the other hand, other communication adjustments are common to the configuration of FIG.

  That is, the non-contact IC card case 33 having such a configuration is suitable for performing communication only for the card D in the closed state and for performing communication only for the card C in the open state.

  The non-contact IC card communication adjustment plates 1 and 2 in the above-described embodiment have shown the aspect in which the electromagnetic shield layer 11 and the high magnetic permeability layer 12 are laminated. The magnetically permeable layers 12 may be formed individually, and may be applied as the non-contact IC card communication adjusting plates 1 and 2 without being brought into close contact with each other.

  In the non-contact IC card communication adjustment plates 1 and 2 in the above-described embodiment, the planar shape of the high magnetic permeability layer 12 is included in the planar shape of the electromagnetic shield layer 11, but this is not limitative. Instead, the size of the planar shape of the high magnetic permeability layer 12 and the size of the planar shape of the electromagnetic shield layer 11 may be substantially the same.

  In addition, the specific structure, shape, and the like in the implementation of the present invention may be other structures as long as the object of the present invention can be achieved.

  The non-contact IC card communication adjusting plate and non-contact IC card case of the present invention are, for example, media for preventing or implementing communication between a non-contact IC card used as a train commuter pass or an employee ID card and an external device. Can be advantageously used.

It is a perspective view which shows the non-contact IC card communication adjustment board which concerns on 1st Embodiment. It is X-X 'sectional drawing of FIG. It is the schematic which showed an example of the application method of the non-contact IC card communication adjustment board which concerns on 1st Embodiment. It is sectional drawing which shows the non-contact IC card communication adjustment board which concerns on 2nd Embodiment. It is the schematic which showed an example of the application method of the non-contact IC card communication adjustment board which concerns on 2nd Embodiment. It is a perspective view which shows the non-contact IC card case which concerns on 3rd Embodiment. It is the schematic (state which opened the case) which showed the other aspect of the non-contact IC card case which concerns on 3rd Embodiment. It is the schematic (state which closed the case) which showed the other aspect of the non-contact IC card case which concerns on 3rd Embodiment. It is the schematic which showed an example of the application method of the non-contact IC card case shown in FIG. It is the schematic which showed an example of the application method of the non-contact IC card case shown in FIG. It is the schematic which showed an example of the application method of the non-contact IC card case shown in FIG. It is the schematic (state which opened the case) which showed another aspect of the non-contact IC card case which concerns on 3rd Embodiment. It is the schematic which showed an example of the application method of the non-contact IC card case shown in FIG. It is the schematic which showed an example of the application method of the non-contact IC card case shown in FIG. It is the schematic which showed an example of the application method of the non-contact IC card case shown in FIG. It is the schematic which showed an example of the application method of the non-contact IC card case shown in FIG. It is the schematic which showed an example of the application method of the non-contact IC card case shown in FIG. It is the schematic which showed an example of the application method of the non-contact IC card case shown in FIG. It is the schematic (state which opened the case) which showed another aspect of the non-contact IC card case. It is the schematic which showed an example of the application method of the non-contact IC card case shown in FIG. It is the schematic which showed an example of the application method of the non-contact IC card case shown in FIG. It is a perspective view which shows a non-contact IC card. It is the schematic which shows the use condition of a non-contact IC card.

Explanation of symbols

1, 2 Contactless IC card communication adjustment plate 11, 111 Electromagnetic shield layer 12, 121, 122 Highly permeable layer 15 Card storage portion 16 Adjustment plate storage portion 161 Shield layer storage portion 17, 171, 172 Spreading surface 30, 31, 32, 33 Non-contact IC card case 60 Non-contact IC card 62 Main body 64 Antenna 66 IC chip 70 External device

Claims (7)

A non-contact IC card communication adjustment plate arranged on at least one of both surfaces of a non-contact IC card capable of non-contact communication with an external device, and for adjusting a communication state between the external device and the non-contact IC card. There,
A planar electromagnetic shield layer that blocks or attenuates electromagnetic waves between the external device and the non-contact IC card;
A planar magnetically permeable layer disposed on one side of the electromagnetic shield layer and transmitting electromagnetic waves between the external device and the non-contact IC card,
The non-contact IC card communication adjusting plate , wherein the planar shape of the high magnetic permeability layer is included in the planar shape of the electromagnetic shield layer . A non-contact IC card communication adjustment plate arranged on at least one of both surfaces of a non-contact IC card capable of non-contact communication with an external device, and for adjusting a communication state between the external device and the non-contact IC card. There,
A planar electromagnetic shield layer that blocks or attenuates electromagnetic waves between the external device and the non-contact IC card;
A planar high-permeability layer disposed on both surfaces of the electromagnetic shield layer and transmitting electromagnetic waves between the external device and the non-contact IC card,
The non-contact IC card communication adjusting plate , wherein the planar shape of the high magnetic permeability layer is included in the planar shape of the electromagnetic shield layer .   The contactless IC card communication adjustment plate according to claim 1 or 2, wherein the electromagnetic shield layer is larger than an antenna built in the contactless IC card. The non-contact IC card communication adjustment plate according to any one of claims 1 to 3 ,
A non-contact IC card case comprising: a card storage unit for storing the non-contact IC card. A spread-type non-contact IC card case having a pair of spread surfaces,
The card storage portion is provided on one facing surface,
The contactless IC card communication adjustment plate is mounted on the other facing surface,
5. The non-contact IC card case according to claim 4 , wherein the card storage portion is also provided on at least one of both surfaces of the non-contact IC card communication adjustment plate. A spread-type non-contact IC card case having a pair of spread surfaces,
The contactless IC card communication adjustment plate is mounted on each of the pair of facing surfaces,
5. The non-contact IC card case according to claim 4 , wherein the card storage portion is also provided on at least one of both surfaces of the non-contact IC card communication adjustment plate. A spread-type non-contact IC card case having a pair of spread surfaces,
The contactless IC card communication adjustment plate is mounted on one facing surface,
A planar electromagnetic shield layer that blocks or attenuates electromagnetic waves is mounted on the other facing surface,
5. The non-contact IC card case according to claim 4 , wherein the card storage portion is provided at least on either side of the non-contact IC card communication adjustment plate and the electromagnetic shield layer facing each other. .

Images