JP4107787B2 - Plasma display panel and manufacturing method thereof - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a plasma display panel (hereinafter referred to as “PDP”) and a method for manufacturing the same, and in particular, in order to connect an electrode on an FPC (flexible printed circuit board) via an ACF (anisotropic conductive film). The present invention relates to a connection electrode drawn from the display area to the peripheral portion of the glass substrate and a method for manufacturing the connection electrode.
[0002]
[Prior art]
Conventionally, Ag having a low resistance has been mainly used as a connection electrode of a PDP. However, this structure is a material that tends to cause migration under a high electric field, and preventing it was one of the problems.
[0003]
Japanese Patent Application Laid-Open No. 11-297218 discloses a technique of providing a wide transparent electrode under a metal electrode.
[0004]
Hereinafter, a method of manufacturing the electrode structure of the publication will be described with reference to FIG. First, a glass substrate 41 subjected to substrate cleaning is prepared (FIG. 4A), a transparent conductive film 42 is formed (FIG. 4B), and a photoresist 43 is applied thereon and dried (FIG. 4B). FIG. 4 (C)).
[0005]
After drying, the first glass mask 44 is used to irradiate the exposure light 45 (FIG. 4D), develop, and pattern the resist. After the post-baking, the transparent conductive film 42 is selectively etched using the resist pattern as a mask, and the resist pattern is peeled off to form a transparent conductive film 46 as a lower layer electrode from the transparent conductive film 42 (FIG. 4 (E)).
[0006]
Next, a silver film 47 is formed on the transparent conductive film 46 which is the lower electrode, a photoresist 48 is applied thereon and dried, and the exposure light 51 is irradiated using the second glass mask 49 (FIG. 4 (F)), developing and patterning the resist.
[0007]
After the post-baking, the silver film 47 is selectively etched using the resist pattern as a mask, and the resist pattern is peeled off so that the silver electrode 52, which is an upper layer electrode having a narrower width than the lower layer electrode, is formed on the lower layer electrode 46. The film 47 is formed (FIG. 4G). In this way, the electrode terminal portion on the PDP side is formed.
[0008]
On the other hand, the FPC to be assembled with the module is first temporarily crimped with the ACF and finally crimped together with the PDP side electrode terminal portion, so that the silver electrode 52 as the upper layer electrode on the PDP side and the electrode on the FPC are electrically connected. Connected to.
[0009]
[Problems to be solved by the invention]
However, the prior art as shown in FIG. 4 requires the alignment of the upper layer electrode with respect to the lower layer electrode, and is limited by the alignment accuracy for maintaining a highly reliable structure. There is a problem of not.
[0010]
Therefore, the objective of this invention is providing the manufacturing method of PDP which can manufacture the said PDP with high precision.
[0011]
Another object of the present invention is to provide a PDP capable of sufficiently suppressing migration.
[0012]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, the invention according to claim 1 is directed to plasma in which the terminal connection portion has a laminated structure of a lower layer electrode and an upper layer electrode, and the lower layer electrode is formed wider than the upper layer electrode . According to a display panel , the upper electrode is formed from a first conductive / negative photosensitive film, while the lower electrode is formed from a second conductive / negative photosensitive film , and The second conductive / negative type photosensitive film is characterized by being superior in photosensitivity to the first conductive / negative type photosensitive film .
[0013]
Here, the the first conductive-negative photosensitive film is contained in the first conductive powder, and the the second conductive-negative photosensitive layer and the second conductive powder It is preferably contained. In this case, the first conductive powder is Ag or Cu or a powder of both, and the second conductive powder is RuO ₂ , MoO ₂ , PdO ₃ , Mo, W, Ti, Au, Zn, Ni. , Ag-Pt, and Ag-Pd, one or a plurality of types of powders are preferable.
[0014]
In addition, the upper electrode of the terminal connection portion may be an electrode connected to an electrode on the FPC via an ACF.
[0015]
The invention described in claim 5 relates to a method of manufacturing a plasma display panel having a laminated electrode composed of a laminate of a lower layer electrode and an upper layer electrode, and has conductivity and negative photosensitivity in forming the laminated electrode. The paste for forming the upper layer electrode and the paste for forming the lower layer electrode having the same conductivity and negative photosensitivity and superior in photosensitivity than the paste for forming the upper layer electrode are used for forming the lower layer electrode. After applying and laminating on the substrate such that the paste is on the bottom and the paste for forming the upper layer electrode is on the top, the step shape of the wide lower electrode and the narrow upper layer electrode is performed by one PR process. The laminated electrode having a laminated structure is completed .
[0016]
Here, said paste for the upper electrode formation is contained in the first conductive powder, preferably in the paste for the lower electrode forming are contained in the second conductive powder.
In this case, the first conductive powder is Ag or Cu or a powder of both, and the second conductive powder is RuO ₂ , MoO ₂ , PdO ₃ , Mo, W, Ti, Au, Zn, Ni. , Ag-Pt, and Ag-Pd, one or a plurality of types of powders are preferable.
[0017]
DETAILED DESCRIPTION OF THE INVENTION
The present invention will be described below with reference to the drawings. FIG. 1 is a sectional view showing an embodiment of the present invention in the order of steps.
[0018]
First, in FIG. 1A, a glass substrate 11 subjected to substrate cleaning is prepared.
[0019]
Next, in FIG. 1 (B), a negative conductive / photosensitive lower layer paste 12 and a negative conductive / photosensitive upper layer paste 13 are laminated on the substrate 11 and dried. Here, the negative type conductive / photosensitive lower layer paste 12 has higher photosensitivity than the negative type conductive / photosensitive upper layer paste 13.
[0020]
Next, in FIG. 1C, a glass mask 14 is placed above the laminated paste and irradiated with exposure light 15. Since the negative conductive / photosensitive lower layer paste 12 has a strong photosensitivity, the negative conductive / photosensitive lower layer paste 12 wraps around the light shielding pattern of the mask 14 greatly. That is, the negative type conductive / photosensitive lower layer paste 12 has a larger oozing than the negative type conductive / photosensitive upper layer paste 13.
[0021]
Next, in FIG. 1D, development and drying are performed. In the process of FIG. 1C, the negative conductive / photosensitive lower layer paste 12 is exposed to a larger size than the negative conductive / photosensitive upper layer paste 13, so that it is wider than the upper layer electrode 17 and the upper layer electrode 17. A stepped laminated electrode having a lower layer electrode 16 is formed from a negative type conductive / photosensitive upper layer paste 13 and a negative type conductive / photosensitive lower layer paste 12.
[0022]
In this way, the electrode terminal portion on the PDP side is formed by one PR process according to (C) and (D). That is, both pastes are patterned at once.
[0023]
The upper electrode 17 has a thickness of 3 to 10 μm and a width W1 of 80 to 90 μm. The lower electrode 16 has a thickness of 3 to 10 μm and a width W2 of 90 to 100 μm, and protrudes by about 5 μm on one side from the upper electrode.
[0024]
Next, in FIG. 1 (E), the FPC to be assembled with the module on which the ACF is temporarily pressure-bonded is finally pressure-bonded together with the PDP side electrode terminal portion via the ACF 23, so that the PDP side upper layer electrode 17 and the FPC 21 are plated with gold. The copper electrode 22 is electrically connected.
[0025]
Here, the preparation and composition of the negative conductive / photosensitive upper layer paste 13 for forming the upper layer electrode 17 will be exemplified.
[0026]
Gamma-butyrolactone and polymer binder are mixed and dissolved evenly. There, aminoacetophenone is added and dissolved evenly. It is filtered through a 400 mesh filter to produce an organic vehicle.
[0027]
Here, 70% methacrylic acid and 30% methyl methacrylate are used as the polymer binder.
[0028]
Moreover, 1,2,3-benzotriazole is dissolved in methyl acetate as a stabilizer for the conductive powder, and the conductive powder is added thereto, immersed for 12 hours, and then dried in a draft at 20 to 25 ° C. By conducting a triazole treatment by evaporating the solvent, a conductive powder surrounded by a stabilizer (stabilized) is produced.
[0029]
Here, a single metal Ag powder or Cu powder having low electric resistance is used as the conductive powder. Or both can be mixed and used.
[0030]
These conductive powders are characterized by an average particle size of 0.5-4 μm, a tap strength of 3-6 g / cm ² , a spherical shape, a sphericity of 90% or more, and a non-area of 0.3-2. 5 m ² / g.
[0031]
A glass frit is also prepared. This glass frit consists of 39 mol% zirconium oxide, 24 mol% boron oxide, 21 mol% silicon dioxide, 10 mol% lithium oxide, 3 mol% alumina, 3 mol% other oxides. Yes.
[0032]
Then, the above-mentioned stabilization treatment conductive powder, trimethylol / propane / triacrylate, CuO and the glass frit as a photoreactive compound are added to the organic vehicle so as to have a predetermined composition, and three rolls are added. The upper layer paste 13 for forming the upper layer electrode is prepared by mixing and dispersing.
[0033]
The composition of the upper layer paste 13 for forming the upper layer electrode is as follows: conductive powder is 70 wt%, polymer binder is 5 wt%, photoreactive compound is 5 wt%, glass frit is 2 wt%, photoinitiator is 1 wt%, stabilizer Is 1 wt% and thinner is 16 wt%.
[0034]
Next, the preparation and composition of the negative conductive / photosensitive lower layer paste 12 for forming the lower layer electrode 16 will be illustrated.
[0035]
Gamma-butyrolactone and polymer binder are mixed and dissolved evenly. There, aminoacetophenone is added and dissolved evenly. It is filtered through a 400 mesh filter to produce an organic vehicle.
[0036]
Here, 70% methacrylic acid and 30% methyl methacrylate are used as the polymer binder.
[0037]
Moreover, 1,2,3-benzotriazole is dissolved in methyl acetate as a stabilizer for the conductive powder, and the conductive powder is added thereto, immersed for 12 hours, and then dried in a draft at 20 to 25 ° C. By conducting a triazole treatment by evaporating the solvent, a conductive powder surrounded by a stabilizer (stabilized) is produced.
[0038]
Here, conductive oxides such as RuO ₂ , MoO ₂ , PdO ₃ , single metals Mo, W, Ti, Au, Zn, Ni, composite metals Ag—Pt, Ag—Pd, which have strong migration resistance as conductive powders. Of these powders, one kind or plural kinds of powders are used.
[0039]
These conductive powders are characterized by an average particle size of 0.5-4 μm, a tap strength of 3-6 g / cm ² , a spherical shape, a sphericity of 90% or more, and a non-area of 0.3-2. 5 m ² / g.
[0040]
A glass frit is also prepared. This glass frit consists of 39 mol% zirconium oxide, 24 mol% boron oxide, 21 mol% silicon dioxide, 10 mol% lithium oxide, 3 mol% alumina, 3 mol% other oxides. Yes.
[0041]
Then, the above-mentioned stabilization treatment conductive powder, trimethylol / propane / triacrylate, CuO and the glass frit as a photoreactive compound are added to the organic vehicle so as to have a predetermined composition, and three rolls are added. The upper layer paste 12 for forming the lower layer electrode is prepared by mixing and dispersing.
[0042]
The composition of the paste 12 for forming the lower layer electrode is that the conductive powder is 70 wt%, the polymer binder is 5 wt%, the photoreactive compound is 15 wt%, the glass frit is 2 wt%, the photoassembly initiator is 2 wt%, and the stabilizer is 1 wt% and thinner are 5 wt%.
[0043]
The first difference between the upper layer paste 13 for forming the upper layer electrode and the lower layer paste 12 for forming the lower layer electrode is that the upper layer paste 13 for forming the upper layer electrode has Ag and Cu as conductive powders in order to reduce electric resistance. In contrast, in the lower layer paste 12 for forming the lower layer electrode, in order to increase the migration resistance, RuO ₂ , MoO ₂ , PdO ₃ , Mo, W, Ti, Au, Zn, Ni, Ag are used as the conductive powder. -Pt and Ag-Pd are used.
[0044]
The second difference between the upper layer paste 13 for forming the upper layer electrode and the lower layer paste 12 for forming the lower layer electrode is that the electrode structure in which the narrow upper layer electrode is provided on the wide lower layer electrode is formed by one PR process. Therefore, the photoreactive compound of the upper layer paste 13 for forming the upper layer electrode is 5 wt% and the photoinitiator is 1 wt%, whereas the lower layer of the negative resist for forming the lower layer electrode is 1 wt%. In the paste 12, the photoreactive compound is increased to 15 wt% and the photo-assembly initiator is increased to 2 wt%, thereby increasing the exposure light to the lower layer paste 12.
[0045]
FIG. 2 is a plan view showing the PDP 30 according to the embodiment, in which the laminated electrodes shown in FIG. 1 are formed in the peripheral connection terminal forming region 32 surrounding the central display region 31.
[0046]
FIG. 3 is a plan view showing a state in which the connection terminal formation region 32 of the PDP 30 is enlarged and the electrode 22 on the FPC 21 is connected to the stacked electrodes 16 and 17 according to the embodiment of the present invention. A cross section of the A portion corresponds to FIG.
[0047]
【The invention's effect】
As described above, according to the present invention, a stacked structure electrode is formed by the upper layer electrode and the lower layer electrode wider than the upper layer electrode by one PR process, that is, by patterning all at once. Therefore, alignment of the upper layer electrode with respect to the lower layer electrode is unnecessary, and an electrode structure with high insulation reliability can be manufactured with high accuracy, and the number of manufacturing steps can be reduced.
[0048]
Further, the upper layer electrode can contain a conductive powder having a low electrical resistance, and the lower layer electrode can contain a conductive powder resistant to migration. Therefore, it is possible to obtain a PDP having an electrode structure with reduced electrical resistance and increased migration resistance.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an embodiment of the present invention in the order of manufacturing steps.
FIG. 2 is a plan view showing a PDP to which FIG. 1 is applied.
FIG. 3 is a plan view showing a state in which an FPC electrode is connected to the laminated electrode according to the embodiment of the present invention.
FIG. 4 is a cross-sectional view showing a conventional technique in the order of manufacturing steps.
[Explanation of symbols]
11 Glass substrate 12 Negative conductive / photosensitive lower layer paste 13 Negative conductive / photosensitive upper layer paste 14 Glass mask 15 Exposure light 16 Lower layer electrode 17 Upper layer electrode 21 FPC
22 Copper electrode 23 ACF
30 PDP
31 Display region 32 Connection terminal formation region 41 Glass substrate 42 Transparent conductive film 43 Photoresist 44 First glass mask 45 Exposure light 46 Transparent conductive film (lower layer electrode)
47 Silver film 48 Photoresist 49 Second glass mask 51 Exposure light 52 Silver electrode (upper layer electrode)

Claims (7)

The terminal connection portion is a plasma display panel having a laminated configuration of a lower layer electrode and an upper layer electrode, wherein the lower layer electrode is formed wider than the upper layer electrode ,
The upper electrode is formed from a first conductive / negative photosensitive film, while the lower electrode is formed from a second conductive / negative photosensitive film , and the second conductive A plasma display panel characterized in that the negative photosensitive film has higher photosensitivity than the first conductive / negative photosensitive film . Wherein the first conductive-negative photosensitive film is contained in the first conductive powder, said the second conductive-negative photosensitive layer and the second conductive powder is contained The plasma display panel according to claim 1. The first conductive powder is Ag or Cu, or a powder of both, and the second conductive powder is RuO ₂ , MoO ₂ , PdO ₃ , Mo, W, Ti, Au, Zn, Ni, Ag— 3. The plasma display panel according to claim 2, wherein the powder is one kind or plural kinds of powders of Pt and Ag-Pd. In the terminal connecting portion, the plasma display panel of claim 1, wherein the pre-SL upper electrode is characterized in that the electrode that will be connected through the electrodes and the anisotropic conductive film on the flexible printed circuit board. A method for producing a plasma display panel having a laminated electrode comprising a laminate of a lower layer electrode and an upper layer electrode,
In forming the laminated electrode,
Paste for forming upper layer electrode having conductivity / negative type photosensitivity, and paste for forming lower layer electrode having same conductivity / negative type photosensitivity and superior in photosensitivity than paste for forming upper layer electrode And
After applying and laminating on the substrate so that the paste for forming the lower layer electrode is below and the paste for forming the upper layer electrode is on top,
A method of manufacturing a plasma display panel, comprising: completing a laminated electrode having a stepped laminated structure of a wide lower layer electrode and a narrow upper layer electrode by one PR process . Wherein the paste for the upper electrode formation is contained in the first conductive powder, plasma according to claim 5, wherein the paste for the lower electrode forming is characterized in that the second conductive powder is contained Display panel manufacturing method. The first conductive powder is Ag or Cu, or a powder of both, and the second conductive powder is RuO ₂ , MoO ₂ , PdO ₃ , Mo, W, Ti, Au, Zn, Ni, Ag— 7. The method of manufacturing a plasma display panel according to claim 6 , wherein one or a plurality of types of powders of Pt and Ag-Pd are used.

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