JP4089726B2 - Multilayer electronic components - Google Patents

Multilayer electronic components Download PDF

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JP4089726B2
JP4089726B2 JP2005513253A JP2005513253A JP4089726B2 JP 4089726 B2 JP4089726 B2 JP 4089726B2 JP 2005513253 A JP2005513253 A JP 2005513253A JP 2005513253 A JP2005513253 A JP 2005513253A JP 4089726 B2 JP4089726 B2 JP 4089726B2
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JPWO2005020256A1 (en
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貴博 東
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Murata Manufacturing Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/35—Feed-through capacitors or anti-noise capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H01G4/232—Terminals electrically connecting two or more layers of a stacked or rolled capacitor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES OR LIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/30—Stacked capacitors

Description

この発明は、積層型電子部品に関するもので、特に、直流電源ライン用のノイズ対策用途に向けられる積層型電子部品に関するものである。  The present invention relates to a multilayer electronic component, and more particularly to a multilayer electronic component directed to noise countermeasure applications for DC power supply lines.

この発明にとって興味ある従来の積層型電子部品として、図１０に示すような構造を有するものがある（たとえば、特開２０００−１０６３２２号公報（特許文献１）参照）。図１０は、積層セラミックコンデンサ１を示す平面図であり、積層セラミックコンデンサ１の内部に設けられる要素を透視した状態で示している。  As a conventional multilayer electronic component that is of interest to the present invention, there is one having a structure as shown in FIG. 10 (see, for example, Japanese Patent Laid-Open No. 2000-106322 (Patent Document 1)). FIG. 10 is a plan view showing the multilayer ceramic capacitor 1 and shows a state in which elements provided inside the multilayer ceramic capacitor 1 are seen through.

積層セラミックコンデンサ１は、積層された複数の絶縁層としての誘電体層２をもって構成される積層体３を備えている。積層体３の内部には、破線で示す浮き電極４が誘電体層２間の特定の界面に沿って形成される。浮き電極４は、積層体３の外表面のいずれにも引き出されていない。  The multilayer ceramic capacitor 1 includes a multilayer body 3 having a dielectric layer 2 as a plurality of laminated insulating layers. Inside the multilayer body 3, floating electrodes 4 indicated by broken lines are formed along specific interfaces between the dielectric layers 2. The floating electrode 4 is not drawn out to any of the outer surfaces of the multilayer body 3.

また、積層体３の内部には、浮き電極４に対向することによって浮き電極４との間で静電容量をそれぞれ形成する第１および第２の内部電極５および６が誘電体層２間の特定の界面に沿って形成される。  Further, in the laminated body 3, first and second internal electrodes 5 and 6 that form a capacitance with the floating electrode 4 by facing the floating electrode 4 are provided between the dielectric layers 2. It is formed along a specific interface.

第１の内部電極５は、積層体３の第１の側面７にまで引き出され、ここで第１の外部電極８に電気的に接続される。他方、第２の内部電極６は、第１の側面７に対向する第２の側面９にまで引き出され、ここで第２の外部電極１０に電気的に接続される。  The first internal electrode 5 is drawn out to the first side surface 7 of the laminated body 3, and is electrically connected to the first external electrode 8 here. On the other hand, the second internal electrode 6 is led out to the second side face 9 opposite to the first side face 7 and is electrically connected to the second external electrode 10 here.

上述のような積層セラミックコンデンサ１が直流電源ライン用のノイズ対策部品として用いられるとき、たとえば、第１の内部電極５および外部電極９が信号側の電極として用いられ、第２の内部電極６および外部電極１０がグラウンド側に接続される。  When the multilayer ceramic capacitor 1 as described above is used as a noise countermeasure component for a DC power supply line, for example, the first internal electrode 5 and the external electrode 9 are used as signal-side electrodes, and the second internal electrode 6 and The external electrode 10 is connected to the ground side.

しかしながら、図１０に示した積層セラミックコンデンサ１をノイズ対策部品として用いる場合、等価直列インダクタンス（ＥＳＬ）が大きいため、高周波特性が悪いという問題に遭遇する。これは、内部電極５および６が貫通導体になっていないため、内部電極５および６自身に比較的大きなインダクタンス成分が発生するためである。  However, when the multilayer ceramic capacitor 1 shown in FIG. 10 is used as a noise countermeasure component, the equivalent series inductance (ESL) is large, so that the problem of poor high frequency characteristics is encountered. This is because the internal electrodes 5 and 6 are not through-conductors, and a relatively large inductance component is generated in the internal electrodes 5 and 6 themselves.

また、図１０に示したように、内部電極５および６が誘電体層２間の同じ界面に沿って形成されている場合には、内部電極５および６間での静電容量が発生し、内部電極５および６間の長さに比例するインダクタンス成分が発生する。このことも、ＥＳＬを大きくする原因となる。
特開２０００−１０６３２２号公報 Further, as shown in FIG. 10, when the internal electrodes 5 and 6 are formed along the same interface between the dielectric layers 2, capacitance between the internal electrodes 5 and 6 is generated. An inductance component proportional to the length between the internal electrodes 5 and 6 is generated. This also increases the ESL.
JP 2000-106322 A

そこで、この発明の目的は、上述のような問題を解決し得る積層型電子部品を提供しようとすることである。  Therefore, an object of the present invention is to provide a multilayer electronic component that can solve the above-described problems.

この発明は、積層された複数の絶縁層をもって構成される積層体を備える、積層型電子部品に向けられるものであって、上述した技術的課題を解決するため、次のような構成を備えることを特徴としている。  The present invention is directed to a multilayer electronic component including a multilayer structure including a plurality of stacked insulating layers, and includes the following configuration in order to solve the technical problem described above. It is characterized by.

積層体の内部には、浮き電極、および浮き電極に対向することによって浮き電極との間で静電容量をそれぞれ形成する少なくとも３種類の貫通内部電極が、絶縁層間の特定の界面に沿ってそれぞれ形成される。各種類の貫通内部電極は、積層体を貫通するように互いに平行に延び、積層体の相対向する側面の各々には、各種類の貫通内部電極にそれぞれ電気的に接続される少なくとも３種類の外部電極が形成される。他方、浮き電極は、外部電極のいずれにも電気的に接続されない状態で形成される。 In the laminated body, there are floating electrodes and at least three types of through internal electrodes that form capacitances with the floating electrodes by facing the floating electrodes, respectively, along specific interfaces between the insulating layers. It is formed. Each type of penetrating internal electrode extends in parallel with each other so as to penetrate the laminate, and each of the opposing side surfaces of the laminate has at least three types of electrically connected to each type of penetrating internal electrode. External electrodes are formed. On the other hand, the floating electrode is formed in a state where it is not electrically connected to any of the external electrodes.

この発明では、貫通内部電極のうち、少なくとも２種類のものが信号側貫通内部電極として用いられ、少なくとも１種類のものがグラウンド側貫通内部電極として用いられる。 This inventions, among the through the inner electrode, at least two kinds of is used as the signal-side through the internal electrodes, at least one of those is used as a ground side through the internal electrodes.

この発明において、貫通内部電極が、第１および第２の信号側貫通内部電極とグラウンド側貫通内部電極とを含む場合、第１の信号側貫通内部電極と第２の信号側貫通内部電極との間、第１の信号側貫通内部電極とグラウンド側貫通内部電極との間、および第２の信号側貫通内部電極とグラウンド側貫通内部電極との間には、それぞれ、浮き電極を通して直列接続されたコンデンサ素子が構成される。 In this invention , when the through internal electrode includes the first and second signal side through internal electrodes and the ground side through internal electrode, the first signal side through internal electrode and the second signal side through internal electrode Between the first signal side through internal electrode and the ground side through internal electrode, and between the second signal side through internal electrode and the ground side through internal electrode, respectively, connected in series through a floating electrode. A capacitor element is configured.

この発明において、信号側貫通内部電極とグラウンド側貫通内部電極とは、絶縁層間の同じ界面に沿って形成されていてもよいが、好ましくは、信号側貫通内部電極の少なくとも１種類のものとグラウンド側貫通内部電極の少なくとも１種類のものとは、浮き電極を挟んで互いに逆側に配置される。さらに好ましくは、すべての信号側貫通内部電極およびすべてのグラウンド側貫通内部電極について、信号側貫通内部電極とグラウンド側貫通内部電極とは、浮き電極を挟んで互いに逆側に配置される。  In the present invention, the signal side through internal electrode and the ground side through internal electrode may be formed along the same interface between the insulating layers, but preferably at least one type of the signal side through internal electrode and the ground At least one of the side through internal electrodes is disposed on the opposite side of the floating electrode. More preferably, with respect to all the signal side through internal electrodes and all the ground side through internal electrodes, the signal side through internal electrodes and the ground side through internal electrodes are arranged on opposite sides of the floating electrode.

この発明に係る積層型電子部品において、浮き電極と貫通内部電極との間に形成される静電容量をより大きくするため、積層体において、複数組の浮き電極および貫通内部電極の組み合わせが積層方向に配置されてもよい。  In the multilayer electronic component according to the present invention, in order to further increase the capacitance formed between the floating electrode and the penetrating internal electrode, in the multilayer body, a combination of a plurality of sets of floating electrodes and penetrating internal electrodes is a stacking direction. May be arranged.

この発明に係る積層型電子部品によれば、貫通内部電極が形成されているので、貫通内部電極のいずれかを信号側貫通内部電極として用いた場合、この信号側貫通内部電極において発生するインダクタンス成分を実質的になくすことができる。したがって、ＥＳＬを小さくすることができ、高周波特性に優れたノイズ対策部品として好適に用いられる、積層型電子部品を提供することができる。  According to the multilayer electronic component according to the present invention, since the through internal electrode is formed, when any of the through internal electrodes is used as the signal side through internal electrode, an inductance component generated in the signal side through internal electrode Can be substantially eliminated. Therefore, it is possible to provide a multilayer electronic component that can reduce ESL and is suitably used as a noise countermeasure component having excellent high frequency characteristics.

この発明において、信号側貫通内部電極の少なくとも１種類のものとグラウンド側貫通内部電極の少なくとも１種類のものとが、浮き電極を挟んで互いに逆側に配置されていると、これら浮き電極を挟んで配置される信号側貫通内部電極とグラウンド側貫通内部電極とについては、それらの間の長さに比例するインダクタンス成分をほとんどなくすことができ、その分、ＥＳＬを小さくでき、高周波特性をより向上させることができる。  In this invention, when at least one of the signal-side through internal electrodes and at least one of the ground-side through internal electrodes are arranged on opposite sides of the floating electrode, the floating electrode is sandwiched between them. As for the signal side through internal electrode and the ground side through internal electrode, the inductance component proportional to the length between them can be almost eliminated, so that the ESL can be reduced and the high frequency characteristics can be further improved. Can be made.

上述の場合において、すべての信号側貫通内部電極およびすべてのグラウンド側貫通内部電極について、信号側貫通内部電極とグラウンド側貫通内部電極とが、浮き電極を挟んで互いに逆側に配置されていると、すべての信号側貫通内部電極とすべてのグラウンド側貫通内部電極とについて、これらの間の長さに比例するインダクタンス成分をほとんどなくすことができるので、ＥＳＬを最も効果的に小さくすることができ、最も優れた高周波特性を与えることができる。  In the case described above, for all the signal side through internal electrodes and all the ground side through internal electrodes, the signal side through internal electrodes and the ground side through internal electrodes are arranged on opposite sides of the floating electrode. Since the inductance component proportional to the length between all the signal side through internal electrodes and all the ground side through internal electrodes can be almost eliminated, the ESL can be most effectively reduced. The most excellent high frequency characteristics can be provided.

また、この発明に係る積層型電子部品では、複数種類の貫通内部電極のうち、任意のものをグラウンド側貫通内部電極として用いることができるので、貫通内部電極に電気的に接続される外部電極のうち、任意のものをグラウンド側外部電極として用いることができる。したがって、この発明によれば、グラウンド側外部電極の配置を、積層体の側面の端部または中央部というように、所望に応じて、任意に選ぶことができる。  Further, in the multilayer electronic component according to the present invention, any of the plurality of types of through internal electrodes can be used as the ground side through internal electrode, so that the external electrode electrically connected to the through internal electrode can be used. Of these, any can be used as the ground-side external electrode. Therefore, according to the present invention, the arrangement of the ground-side external electrodes can be arbitrarily selected as desired, such as the end portion or the central portion of the side surface of the multilayer body.

図１は、この発明の第１の実施形態による積層型電子部品１１の外観を示す斜視図である。FIG. 1 is a perspective view showing an appearance of a multilayer electronic component 11 according to the first embodiment of the present invention. 図２は、図１に示した積層型電子部品１１を断面で示す正面図である。FIG. 2 is a front view showing the multilayer electronic component 11 shown in FIG. 1 in cross section. 図３は、図１に示した積層型電子部品１１の内部構造を示す平面図であり、（ａ）は、信号側貫通内部電極１５〜１７が通る断面を示し、（ｂ）は、浮き電極１４が通る断面を示している。3 is a plan view showing the internal structure of the multilayer electronic component 11 shown in FIG. 1. FIG. 3A shows a cross section through which the signal side through internal electrodes 15 to 17 pass, and FIG. 3B shows a floating electrode. 14 shows a cross section through which 14 passes. 図４は、図１に示した積層型電子部品１１が与える等価回路図である。FIG. 4 is an equivalent circuit diagram provided by the multilayer electronic component 11 shown in FIG. 図５は、この発明の第２の実施形態による積層型電子部品３１を断面で示す正面図である。FIG. 5 is a front view showing a cross-sectional view of the multilayer electronic component 31 according to the second embodiment of the present invention. 図６は、図５に示した積層型電子部品３１の内部構造を示す平面図であり、（ａ）は、第１の信号側貫通内部電極１５およびグラウンド側貫通内部電極１７が通る断面を示し、（ｂ）は、浮き電極１４が通る断面を示し、（ｃ）は、第２の信号側貫通内部電極１６が通る断面を示している。6 is a plan view showing the internal structure of the multilayer electronic component 31 shown in FIG. 5. FIG. 6A shows a cross section through which the first signal-side through internal electrode 15 and the ground-side through internal electrode 17 pass. (B) shows a cross section through which the floating electrode 14 passes, and (c) shows a cross section through which the second signal-side penetrating internal electrode 16 passes. 図７は、この発明の参考例となる積層型電子部品４１の外観を示す斜視図である。FIG. 7 is a perspective view showing an appearance of a multilayer electronic component 41 as a reference example of the present invention. 図８は、図７に示した積層型電子部品４１の内部構造を示す平面図であり、（ａ）は、第１および第２のグラウンド側貫通内部電極４３および４４が通る断面を示し、（ｂ）は、浮き電極１４が通る断面を示し、（ｃ）は、信号側貫通内部電極４２が通る断面を示している。FIG. 8 is a plan view showing the internal structure of the multilayer electronic component 41 shown in FIG. 7, wherein (a) shows a cross section through which the first and second ground side through internal electrodes 43 and 44 pass. b) shows a cross section through which the floating electrode 14 passes, and (c) shows a cross section through which the signal side penetrating internal electrode 42 passes. 図９は、図７に示した積層型電子部品４１が与える等価回路図である。FIG. 9 is an equivalent circuit diagram given by the multilayer electronic component 41 shown in FIG. 図１０は、この発明にとって興味ある従来の積層セラミックコンデンサ１を示す平面図であり、その内部に設けられる要素を透視して示している。FIG. 10 is a plan view showing a conventional monolithic ceramic capacitor 1 that is of interest to the present invention, and shows the elements provided therein transparently.

符号の説明Explanation of symbols

１１，３１，４１ 積層型電子部品
１２ 絶縁層
１３ 積層体
１４ 浮き電極
１５，１６，４２ 信号側貫通内部電極
１７，４３，４４ グラウンド側内部貫通電極
１８，１９ 側面
２０〜２３，４５，４６ 信号側外部電極
２４，２５，４７〜５０ グラウンド側外部電極
Ｃ１〜Ｃ１０ コンデンサ素子11, 31, 41 Laminated electronic component 12 Insulating layer 13 Laminated body 14 Floating electrode 15, 16, 42 Signal side through internal electrode 17, 43, 44 Ground side internal through electrode 18, 19 Side surface 20-23, 45, 46 Signal Side external electrode 24, 25, 47 to 50 Ground side external electrode C1 to C10 Capacitor element

図１ないし図４は、この発明の第１の実施形態を説明するためのものである。ここで、図１は、第１の実施形態による積層型電子部品１１の外観を示す斜視図であり、図２は、図１に示した積層型電子部品１１を断面で示す正面図である。図３は、積層型電子部品１１の内部構造を示すため、特定の断面をもって示した平面図である。図４は、積層型電子部品１１が与える等価回路図である。  1 to 4 are for explaining a first embodiment of the present invention. Here, FIG. 1 is a perspective view showing an appearance of the multilayer electronic component 11 according to the first embodiment, and FIG. 2 is a front view showing the multilayer electronic component 11 shown in FIG. FIG. 3 is a plan view showing a specific cross section in order to show the internal structure of the multilayer electronic component 11. FIG. 4 is an equivalent circuit diagram given by the multilayer electronic component 11.

積層型電子部品１１は、積層された複数の絶縁層１２をもって構成される積層体１３を備えている。絶縁層１２は、たとえば誘電体セラミックから構成される。積層体１３は、たとえば直方体状をなしている。  The multilayer electronic component 11 includes a multilayer body 13 including a plurality of laminated insulating layers 12. The insulating layer 12 is made of, for example, a dielectric ceramic. The laminated body 13 has a rectangular parallelepiped shape, for example.

積層体１３の内部には、図２および図３（ｂ）に示すように、浮き電極１４が絶縁層１２間の特定の界面に沿って形成される。図３（ｂ）は、浮き電極１４が通る断面を示したものである。  As shown in FIGS. 2 and 3B, the floating electrode 14 is formed along the specific interface between the insulating layers 12 in the stacked body 13. FIG. 3B shows a cross section through which the floating electrode 14 passes.

積層体１３の内部には、また、図２および図３（ａ）に示すように、浮き電極１４に対向することによって浮き電極１４との間で静電容量をそれぞれ形成する少なくとも３種類の貫通内部電極１５〜１７が絶縁層１２間の特定の界面に沿って形成される。この実施形態では、３種類の貫通内部電極１５〜１７が形成され、これら３種類の貫通内部電極１５〜１７は、絶縁層１２間の同じ界面に沿って形成される。図３（ａ）は、貫通内部電極１５〜１７が通る断面を示したものである。  As shown in FIG. 2 and FIG. 3A, at least three types of penetrations that form capacitances with the floating electrode 14 by facing the floating electrode 14, as shown in FIGS. Internal electrodes 15-17 are formed along specific interfaces between the insulating layers 12. In this embodiment, three types of through internal electrodes 15 to 17 are formed, and these three types of through internal electrodes 15 to 17 are formed along the same interface between the insulating layers 12. FIG. 3A shows a cross section through which the penetrating internal electrodes 15 to 17 pass.

貫通内部電極１５〜１７の各々は、図３（ａ）によく示されているように、長方形状であって互いに平行な長手方向に積層体１３を貫通するように延びている。そして、積層体１３の相対向する側面１８および１９の各々には、貫通内部電極１５に電気的に接続される外部電極２０および２１、貫通内部電極１６に電気的に接続される外部電極２２および２３、ならびに、貫通内部電極１７に電気的に接続される外部電極２４および２５がそれぞれ形成されている。  Each of the penetrating internal electrodes 15 to 17 is rectangular and extends so as to penetrate the laminated body 13 in the longitudinal direction parallel to each other, as well shown in FIG. Further, on each of the opposing side surfaces 18 and 19 of the laminated body 13, external electrodes 20 and 21 electrically connected to the through internal electrode 15, external electrodes 22 electrically connected to the through internal electrode 16, and 23, and external electrodes 24 and 25 electrically connected to the penetrating internal electrode 17 are formed.

他方、浮き電極１４は、図３（ｂ）によく示されているように、貫通内部電極１５〜１７のすべてと対向できるような広面積を有する長方形状であって外部電極２０〜２５のいずれにも電気的に接続されない状態で形成されている。  On the other hand, as shown in FIG. 3B, the floating electrode 14 has a rectangular shape having a wide area so as to be opposed to all of the through internal electrodes 15 to 17, and any of the external electrodes 20 to 25. Are formed in a state where they are not electrically connected.

また、この実施形態では、図２に示されるように、積層体１３において、複数組の浮き電極１４および貫通内部電極１５〜１７の組み合わせが積層方向に配置されている。  In this embodiment, as shown in FIG. 2, a combination of a plurality of sets of floating electrodes 14 and through internal electrodes 15 to 17 is arranged in the stacking direction in the stacked body 13.

以上のような構成を有する積層型電子部品１１がノイズ対策部品として用いられるとき、貫通内部電極１５〜１７のうち、たとえば、貫通内部電極１５および１６が、それぞれ、第１および第２の信号側貫通内部電極として用いられ、貫通内部電極１７がグラウンド側貫通内部電極として用いられる。したがって、外部電極２０〜２５のうち、外部電極２０および２１は第１の信号側外部電極として用いられ、外部電極２２および２３は第２の信号側外部電極として用いられ、外部電極２４および２５はグラウンド側外部電極として用いられる。  When the multilayer electronic component 11 having the above configuration is used as a noise countermeasure component, among the through internal electrodes 15 to 17, for example, the through internal electrodes 15 and 16 are respectively connected to the first and second signal sides. The through internal electrode 17 is used as a ground side through internal electrode. Therefore, of the external electrodes 20 to 25, the external electrodes 20 and 21 are used as the first signal side external electrodes, the external electrodes 22 and 23 are used as the second signal side external electrodes, and the external electrodes 24 and 25 are Used as ground side external electrode.

上述のような使用状態において、積層型電子部品１１は、図４に示すような等価回路を実現する。図４において、図１ないし図３に示した要素に相当する要素には同様の参照符号を付すことによって、図１ないし図３に示した積層型電子部品１１に備える要素とこの等価回路に備える要素との対応関係が明らかにされている。  In the use state as described above, the multilayer electronic component 11 realizes an equivalent circuit as shown in FIG. 4, elements corresponding to the elements shown in FIGS. 1 to 3 are denoted by the same reference numerals, so that the elements included in the multilayer electronic component 11 shown in FIGS. 1 to 3 and this equivalent circuit are provided. Correspondence with elements is clarified.

図４を参照して、第１の信号側外部電極２０および２１に電気的に接続される第１の信号側貫通内部電極１５と第２の信号側外部電極２２および２３に電気的に接続される第２の信号側貫通内部電極１６との間には、浮き電極１４を通して直列接続されたコンデンサ素子Ｃ１およびＣ２が構成される。また、第１の信号側外部電極２０および２１に電気的に接続された第１の信号側貫通内部電極１５とグラウンド側外部電極２４および２５に電気的に接続されたグラウンド側貫通内部電極１７との間には、浮き電極１４を通して直列接続されたコンデンサ素子Ｃ３およびＣ４が構成される。さらに、第２の信号側外部電極２２および２３に電気的に接続された第２の信号側貫通内部電極１６とグラウンド側外部電極２４および２５に電気的に接続されたグラウンド側貫通内部電極１７との間には、浮き電極１４を通して直列接続されたコンデンサ素子Ｃ５およびＣ６が構成される。  Referring to FIG. 4, the first signal-side penetrating internal electrode 15 and the second signal-side external electrodes 22 and 23 that are electrically connected to the first signal-side external electrodes 20 and 21 are electrically connected. Capacitor elements C <b> 1 and C <b> 2 connected in series through the floating electrode 14 are formed between the second signal-side through internal electrode 16. In addition, the first signal side through internal electrode 15 electrically connected to the first signal side external electrodes 20 and 21 and the ground side through internal electrode 17 electrically connected to the ground side external electrodes 24 and 25 In between, capacitor elements C3 and C4 connected in series through the floating electrode 14 are formed. Furthermore, the second signal side through internal electrode 16 electrically connected to the second signal side external electrodes 22 and 23 and the ground side through internal electrode 17 electrically connected to the ground side external electrodes 24 and 25; In between, capacitor elements C5 and C6 connected in series through the floating electrode 14 are formed.

このように、積層型電子部品１１は、貫通する信号側貫通内部電極１５および１６を有しているので、これら信号側貫通内部電極１５および１６において発生するインダクタンス成分を実質的になくすことができ、したがって、ＥＳＬを小さくすることができ、高周波特性に優れたノイズ対策部品とすることができる。  Thus, since the multilayer electronic component 11 has the signal side through internal electrodes 15 and 16 that penetrate therethrough, the inductance component generated in the signal side through internal electrodes 15 and 16 can be substantially eliminated. Therefore, ESL can be reduced, and a noise countermeasure component having excellent high frequency characteristics can be obtained.

図５および図６は、この発明の第２の実施形態を説明するためのものである。ここで、図５は図２に対応する図であり、図６は図３に対応する図である。図５および図６において、図２および図３に示した要素に相当する要素には同様の参照符号を付し、重複する説明は省略する。  5 and 6 are for explaining a second embodiment of the present invention. Here, FIG. 5 corresponds to FIG. 2, and FIG. 6 corresponds to FIG. 5 and 6, elements corresponding to those shown in FIGS. 2 and 3 are denoted by the same reference numerals, and redundant description is omitted.

図５および図６に示した積層型電子部品３１は、図１に示した積層型電子部品１１と実質的に同様の外観を有していて、積層体１３を備え、積層体１３の相対向する側面１８および１９の各々には、外部電極２０〜２５が形成されている。  The multilayer electronic component 31 shown in FIGS. 5 and 6 has substantially the same appearance as the multilayer electronic component 11 shown in FIG. 1, includes the multilayer body 13, and is opposed to the multilayer body 13. External electrodes 20 to 25 are formed on each of the side surfaces 18 and 19.

また、第１の実施形態による積層型電子部品１１の場合と同様、積層体１３の内部には、浮き電極１４が形成され、さらに、浮き電極１４に対向することによって浮き電極１４との間で静電容量をそれぞれ形成する３種類の貫通内部電極１５〜１７が形成される。  Further, as in the case of the multilayer electronic component 11 according to the first embodiment, the floating electrode 14 is formed inside the multilayer body 13, and the floating electrode 14 is opposed to the floating electrode 14 by facing the floating electrode 14. Three types of through internal electrodes 15 to 17 each forming a capacitance are formed.

第２の実施形態では、貫通内部電極１５〜１７のうち、第１の信号側貫通内部電極１５およびグラウンド側貫通内部電極１７が、図５および図６（ａ）に示すように、絶縁層１２間の同じ界面に沿って形成される。他方、第２の信号側貫通内部電極１６は、図５および図６（ｃ）に示すように、第１の信号側貫通内部電極１５およびグラウンド側貫通内部電極１７が形成された絶縁層１２間の界面とは異なる絶縁層１２間の界面に沿って形成されるとともに、浮き電極１４を挟んで第１の信号側貫通内部電極１５およびグラウンド側貫通内部電極１７とは互いに逆側に配置される。  In the second embodiment, among the through internal electrodes 15 to 17, the first signal side through internal electrode 15 and the ground side through internal electrode 17 are, as shown in FIGS. 5 and 6A, the insulating layer 12. Formed along the same interface between. On the other hand, as shown in FIG. 5 and FIG. 6C, the second signal side through internal electrode 16 is formed between the insulating layers 12 in which the first signal side through internal electrode 15 and the ground side through internal electrode 17 are formed. The first signal side through internal electrode 15 and the ground side through internal electrode 17 are arranged on opposite sides of the floating electrode 14 with the floating electrode 14 interposed therebetween. .

また、積層型電子部品３１にあっても、積層型電子部品１１と同様、積層体１３において、複数組の浮き電極１４および貫通内部電極１５〜１７の組み合わせが積層方向に配置される。  Also in the multilayer electronic component 31, similarly to the multilayer electronic component 11, in the multilayer body 13, a combination of a plurality of sets of floating electrodes 14 and through internal electrodes 15 to 17 are arranged in the stacking direction.

この第２の実施形態による積層型電子部品３１によっても、図４に示した等価回路が実現される。  The multilayer electronic component 31 according to the second embodiment also realizes the equivalent circuit shown in FIG.

第２の実施形態によれば、第２の信号側貫通内部電極１６とグラウンド側貫通内部電極１７との位置関係に関して、第２の信号側貫通内部電極１６とグラウンド側貫通内部電極１７とが浮き電極１４を挟んで互いに逆側に配置されているので、これら第２の信号側貫通内部電極１６とグラウンド側貫通内部電極１７との間の長さに比例するインダクタンス成分をほとんどなくすことができ、その分、ＥＳＬを小さくできるため、第１の実施形態の場合より高周波特性を向上させることができる。  According to the second embodiment, with respect to the positional relationship between the second signal side penetrating internal electrode 16 and the ground side penetrating internal electrode 17, the second signal side penetrating internal electrode 16 and the ground side penetrating internal electrode 17 float. Since the electrodes 14 are disposed on opposite sides of each other, the inductance component proportional to the length between the second signal side through internal electrode 16 and the ground side through internal electrode 17 can be almost eliminated. Accordingly, since the ESL can be reduced, the high frequency characteristics can be improved as compared with the case of the first embodiment.

また、貫通内部電極１５〜１７の形状の自由度が大きく、たとえば図６（ａ）に示すように、第１の信号側貫通内部電極１５とグラウンド側貫通内部電極１７との互いに向かい合う方向に凸状となるような形状も可能である。第２の信号側貫通内部電極１６の形状も、図６（ｃ）に示すような長方形状に限らず、対向部分を幅広にしてもよい。  Further, the through-hole internal electrodes 15 to 17 have a large degree of freedom. For example, as shown in FIG. 6A, the first signal-side through-electrode 15 and the ground-side through-electrode 17 project in the direction facing each other. It is also possible to have a shape such as The shape of the second signal-side penetrating internal electrode 16 is not limited to the rectangular shape as shown in FIG. 6C, and the opposing portion may be wide.

図７ないし図９は、この発明の参考例を説明するためのものである。ここで、図７は、この参考例となる積層型電子部品４１の外観を示す斜視図である。図８は、積層型電子部品４１の内部構造を示すため、特定の断面をもって示す平面図である。図９は、積層型電子部品４１によって与えられる等価回路図である。 7 to 9 are for explaining a reference example of the present invention. Here, FIG. 7 is a perspective view showing an appearance of the multilayer electronic component 41 as the reference example . FIG. 8 is a plan view showing a specific cross section in order to show the internal structure of the multilayer electronic component 41. FIG. 9 is an equivalent circuit diagram given by the multilayer electronic component 41.

図７および図８を参照して、積層型電子部品４１の構造について説明する。なお、図７および図８において、前述の図１ないし図３に示した要素に相当する要素には同様の参照符号を付し、重複する説明は省略する。  The structure of the multilayer electronic component 41 will be described with reference to FIGS. 7 and 8, elements corresponding to those shown in FIGS. 1 to 3 described above are denoted by the same reference numerals, and redundant description is omitted.

積層体１３の内部には、図８（ｂ）に示すように、浮き電極１４が形成され、さらに、浮き電極１４に対向することによって浮き電極１４との間で静電容量をそれぞれ形成する３種類の貫通内部電極４２〜４４が形成される。これら貫通内部電極４２〜４４のうち、貫通内部電極４２と貫通内部電極４３および４４とは、浮き電極１４を挟んで互いに逆側に配置され、また、貫通内部電極４３および４４は、絶縁層１２間の同じ界面に沿って形成される。  As shown in FIG. 8B, the floating electrode 14 is formed inside the stacked body 13, and further, a capacitance is formed between the floating electrode 14 and the floating electrode 14 by facing the floating electrode 14. Kinds of through internal electrodes 42 to 44 are formed. Among the through internal electrodes 42 to 44, the through internal electrode 42 and the through internal electrodes 43 and 44 are arranged on opposite sides of the floating electrode 14, and the through internal electrodes 43 and 44 are connected to the insulating layer 12. Formed along the same interface between.

ここまで説明した構成によれば、第２の実施形態による積層型電子部品３１の場合と実質的に同様または類似の構成が与えられている。  According to the configuration described so far, a configuration substantially similar to or similar to that of the multilayer electronic component 31 according to the second embodiment is provided.

この参考例としての積層型電子部品４１では、貫通内部電極４２〜４４のうち、貫通内部電極４２が信号側貫通内部電極として用いられ、貫通内部電極４３および４４が、それぞれ、第１および第２のグラウンド側貫通内部電極として用いられる。 In the multilayer electronic component 41 as the reference example , among the through internal electrodes 42 to 44, the through internal electrode 42 is used as the signal side through internal electrode, and the through internal electrodes 43 and 44 are respectively the first and second through electrodes. It is used as a ground side through internal electrode.

したがって、信号側貫通内部電極４２に電気的に接続される外部電極４５および４６が信号側外部電極として用いられ、第１のグラウンド側内部貫通電極４３に電気的に接続される外部電極４７および４８が第１のグラウンド側外部電極として用いられ、第２のグラウンド側貫通内部電極４４に電気的に接続される外部電極４９および５０が第２のグラウンド側外部電極として用いられる。  Accordingly, the external electrodes 45 and 46 that are electrically connected to the signal-side through internal electrode 42 are used as signal-side external electrodes, and the external electrodes 47 and 48 that are electrically connected to the first ground-side internal through-electrode 43. Are used as the first ground side external electrode, and the external electrodes 49 and 50 electrically connected to the second ground side through internal electrode 44 are used as the second ground side external electrode.

その結果、図９に示した等価回路図において、信号側外部電極４５および４６に電気的に接続される信号側貫通内部電極４２と第１のグラウンド側外部電極４７および４８に電気的に接続される第１のグラウンド側貫通内部電極４３との間には、浮き電極１４を通して直列接続されたコンデンサ素子Ｃ７およびＣ８が構成される。また、信号側外部電極４５および４６に電気的に接続された信号側貫通内部電極４２と第２のグラウンド側外部電極４９および５０に電気的に接続された第２のグラウンド側貫通内部電極４４との間には、浮き電極１４を通して直列接続されたコンデンサ素子Ｃ９およびＣ１０が構成される。  As a result, in the equivalent circuit diagram shown in FIG. 9, the signal side internal electrode 42 and the first ground side external electrodes 47 and 48 that are electrically connected to the signal side external electrodes 45 and 46 are electrically connected. Capacitor elements C7 and C8 connected in series through the floating electrode 14 are formed between the first ground side through internal electrode 43. Further, the signal side through internal electrode 42 electrically connected to the signal side external electrodes 45 and 46 and the second ground side through internal electrode 44 electrically connected to the second ground side external electrodes 49 and 50 In between, capacitor elements C9 and C10 connected in series through the floating electrode 14 are formed.

この参考例によれば、信号側貫通内部電極４２とグラウンド側貫通内部電極４３および４４とが、浮き電極１４を挟んで互いに逆側に配置されているので、信号側貫通内部電極４２とグラウンド側貫通内部電極４３および４４の双方とについて、これらの間の長さに比例するインダクタンス成分をほとんどなくすことができるので、第２の実施形態の場合に比べて、ＥＳＬをさらに小さくすることができ、その結果、さらに優れた高周波特性を与えることができる。 According to this reference example , since the signal side through internal electrode 42 and the ground side through internal electrodes 43 and 44 are arranged on the opposite sides of the floating electrode 14, the signal side through internal electrode 42 and the ground side Since the inductance component proportional to the length between them can be almost eliminated for both of the through internal electrodes 43 and 44, the ESL can be further reduced compared to the case of the second embodiment, As a result, further excellent high frequency characteristics can be provided.

なお、この参考例としての積層型電子部品４１にあっても、図示しないが、積層型電子部品１１と同様、積層体１３において、複数組の浮き電極１４および貫通内部電極４２〜４４の組み合わせが積層方向に配置される。 Even in the multilayer electronic component 41 as the reference example , although not shown, in the multilayer body 13, a combination of a plurality of sets of floating electrodes 14 and penetrating internal electrodes 42 to 44 is provided as in the multilayer electronic component 11. Arranged in the stacking direction.

以上、この発明を図示した実施形態に関連して説明したが、この発明の範囲内において、その他、種々の変形例が可能である。  While the present invention has been described with reference to the illustrated embodiment, various other modifications are possible within the scope of the present invention.

たとえば、図示した実施形態の各々においては、３種類の貫通内部電極が設けられたが、信号側貫通内部電極およびグラウンド側貫通内部電極のいずれについても、さらに多くの種類の貫通内部電極が設けられてもよい。  For example, in each of the illustrated embodiments, three types of through internal electrodes are provided, but more types of through internal electrodes are provided for both the signal side through internal electrode and the ground side through internal electrode. May be.

また、第１および第２の実施形態では、積層体１３の側面１８および１９の各々の一方の端部にグラウンド側外部電極２４および２５が配置され、参考例では、側面１８よび１９の各々の両端にグラウンド側外部電極４７および５０が配置されている。しかしながら、このようなグラウンド側外部電極の配置は、たとえば、側面１８および１９の中央部であってもよい。このことから、この発明によれば、グラウンド側外部電極の配置を、所望に応じて、任意に選ぶことが可能であることがわかる。 In the first and second embodiments, the ground-side external electrodes 24 and 25 are disposed at one end of each of the side surfaces 18 and 19 of the multilayer body 13. In the reference example , each of the side surfaces 18 and 19 is provided. Ground-side external electrodes 47 and 50 are disposed at both ends. However, the arrangement of the ground-side external electrode may be, for example, the central portion of the side surfaces 18 and 19. From this, it can be seen that according to the present invention, the arrangement of the ground-side external electrodes can be arbitrarily selected as desired.

この発明に係る積層型電子部品は、等価直列抵抗を小さくすることができるので、高周波特性に優れた、直流電源ライン用のノイズ対策部品として好適に用いることができる。  Since the multilayer electronic component according to the present invention can reduce the equivalent series resistance, it can be suitably used as a noise countermeasure component for a DC power supply line having excellent high frequency characteristics.

Claims (6)

積層された複数の絶縁層をもって構成される積層体を備え、
前記積層体の内部には、浮き電極、および前記浮き電極に対向することによって前記浮き電極との間で静電容量をそれぞれ形成する少なくとも３種類の貫通内部電極が、前記絶縁層間の特定の界面に沿ってそれぞれ形成され、
各種類の前記貫通内部電極は、前記積層体を貫通するように互いに平行に延び、前記積層体の相対向する側面の各々には、各種類の前記貫通内部電極にそれぞれ電気的に接続される少なくとも３種類の外部電極が形成され、
前記浮き電極は、前記外部電極のいずれにも電気的に接続されない状態で形成され、
前記貫通内部電極のうち、少なくとも２種類のものが信号側貫通内部電極として用いられ、少なくとも１種類のものがグラウンド側貫通内部電極として用いられる、
積層型電子部品。Comprising a laminate comprising a plurality of laminated insulating layers;
Inside the laminate, there are floating electrodes, and at least three types of penetrating internal electrodes that form a capacitance with the floating electrodes by facing the floating electrodes, and a specific interface between the insulating layers. Each formed along
Each kind of the through internal electrode extends in parallel with each other so as to penetrate the multilayer body, and each of the opposing side surfaces of the multilayer body is electrically connected to each kind of the through internal electrode. At least three types of external electrodes are formed,
The floating electrode is formed in a state where it is not electrically connected to any of the external electrodes ,
Among the through internal electrodes, at least two types are used as signal side through internal electrodes, and at least one type is used as ground side through internal electrodes .
Multilayer electronic components. 前記貫通内部電極は、第１および第２の前記信号側貫通内部電極と前記グラウンド側貫通内部電極とを含み、前記第１の信号側貫通内部電極と前記第２の信号側貫通内部電極との間、前記第１の信号側貫通内部電極と前記グラウンド側貫通内部電極との間、および前記第２の信号側貫通内部電極と前記グラウンド側貫通内部電極との間には、それぞれ、前記浮き電極を通して直列接続されたコンデンサ素子が構成される、請求項１に記載の積層型電子部品。The penetrating internal electrode includes first and second signal-side penetrating internal electrodes and the ground-side penetrating internal electrode, and includes the first signal-side penetrating internal electrode and the second signal-side penetrating internal electrode. Between the first signal side through internal electrode and the ground side through internal electrode and between the second signal side through internal electrode and the ground side through internal electrode, respectively, series-connected capacitor elements through is configured, the multilayer electronic component according to claim 1. 前記信号側貫通内部電極と前記グラウンド側貫通内部電極とは、前記絶縁層間の同じ界面に沿って形成されている、請求項１または２に記載の積層型電子部品。Wherein the signal-side through the internal electrode and the ground side through the internal electrodes, the formed along the same surface of the insulating interlayer, the multilayer electronic component according to claim 1 or 2. 前記信号側貫通内部電極の少なくとも１種類のものと前記グラウンド側貫通内部電極の少なくとも１種類のものとは、前記浮き電極を挟んで互いに逆側に配置される、請求項１または２に記載の積層型電子部品。At least one thing with the at least one of those of the ground side through the internal electrodes of the signal-side through the internal electrodes, across the floating electrode is arranged on the opposite side to each other, according to claim 1 or 2 Multilayer electronic components. すべての前記信号側貫通内部電極およびすべての前記グラウンド側貫通内部電極について、前記信号側貫通内部電極と前記グラウンド側貫通内部電極とは、前記浮き電極を挟んで互いに逆側に配置される、請求項４に記載の積層型電子部品。The signal-side through internal electrode and the ground-side through internal electrode are arranged on opposite sides of the floating electrode with respect to all the signal-side through internal electrodes and all the ground-side through internal electrodes. Item 5. The multilayer electronic component according to Item 4 . 前記積層体において、複数組の前記浮き電極および前記貫通内部電極の組合せが積層方向に配置される、請求項１ないし５のいずれかに記載の積層型電子部品。The multilayer electronic component according to any one of claims 1 to 5 , wherein in the multilayer body, a combination of a plurality of sets of the floating electrodes and the through internal electrodes is arranged in a lamination direction.
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JPH0625109U (en) * 1992-08-28 1994-04-05 日本紙業株式会社 Assembly paper container
KR20150070362A (en) 2012-11-20 2015-06-24 제이에프이미네라르 가부시키가이샤 Nickel powder, conductive paste, and laminated ceramic electronic component

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