JP4079683B2 - Method for assembling solid-state imaging device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for assembling a solid-state imaging device that performs imaging using a solid-state imaging device.
[0002]
[Prior art]
In a conventional method of assembling a solid-state imaging device, first, a multi-piece original plate on which a plurality of camera circuit boards are arranged is prepared. A circuit pattern is formed on each camera circuit board of the multi-chip original plate, and a solid-state imaging device is mounted at a predetermined position of the circuit pattern. A lens assembly in which the lenses are separately stored is formed. This lens assembly is bonded onto each camera circuit board using a photo-curing adhesive so that an image can be formed on the solid-state imaging device. Thereafter, each camera circuit board is cut out to form a solid-state imaging device.
[0003]
[Problems to be solved by the invention]
In this way, in the prior art, since the lens assembly uses a photo-curing adhesive, the adhesive can be cured instantly and the time required for adhesion can be shortened, but there is a problem in the adhesive strength, and it is used. When a strong impact is applied to the solid-state imaging device due to dropping or the like, the lens assembly peels off. Therefore, even if an attempt is made to use a thermosetting adhesive to increase the adhesive force, the thermosetting adhesive requires a long time of several tens of minutes to several hours to be cured. There is a problem that it is difficult to hold the lens at a predetermined position for a long time without positional deviation.
Therefore, the present invention provides a method for assembling a solid-state imaging device that enables strong adhesion so that the lens assembly does not peel off.
[0004]
[Means for Solving the Problems]
A method for assembling a solid-state imaging device according to the present invention includes a plurality of camera circuit boards arranged regularly, a through hole portion positioned so as to surround each circuit board, each circuit board, and each through hole portion. And a solid-state image pickup device mounted on each circuit board, including a remaining part excluding a part, a bridge part that blocks a part of each through hole part and connects each circuit board to the remaining part integrally. And a lens assembly for forming an image on each of the solid-state imaging devices, and each lens assembly is provided with a leg portion that extends to the remaining portion across the through hole portion. The assembling step includes a step of mounting a solid-state imaging device on each circuit board of the original plate, and the lens assemblies are positioned so that the legs are positioned in the remaining portion and can be imaged on the solid-state imaging device. A step of mounting on the original plate, a step of fixing the lens assemblies to the circuit boards via a first adhesive, and a curing speed of the legs on the remaining portion higher than that of the first adhesive. The step of fixing via the second adhesive, and the first adhesive and the second adhesive are cured, the leg portion is cut from the lens assembly, and the bridge portion is the circuit board. It is characterized by comprising the step of excision from. Since the lens assembly is fixed to the original plate with its legs with the second adhesive having a faster curing speed than the first adhesive, the lens assembly can be manufactured even if it takes time to cure the first adhesive. There is no positional displacement, strong adhesion by the first adhesive is obtained, and the lens assembly does not peel off from the circuit board during use.
[0005]
Preferably, the first adhesive is a thermosetting adhesive, and the second adhesive is a photocurable adhesive. In addition, after application of the thermosetting adhesive and the photocurable adhesive, the photocurable adhesive is irradiated with light to cure the photocurable adhesive, and then the thermosetting adhesive is removed. It is preferable to cure the thermosetting adhesive by heating.
[0006]
Moreover, it is preferable that the bridge portion is provided in a pair in the diagonal direction around the circuit board, and can maintain a stable integrated state with respect to the remaining portion.
[0007]
Moreover, there is one pair of the bridge portions that block a part of the through-hole portion per one circuit board, and the through-hole portions are formed on two adjacent sides of one of the adjacent circuit boards. It is characterized by being crank-shaped so as to extend along two adjacent sides of the other circuit board. With this configuration, the circuit board can maintain a stable integrated state with respect to the remaining portion, and the area occupied by the through-hole portion in the original plate can be reduced to improve the area efficiency of the circuit board.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
An embodiment of the present invention will be described with reference to the drawings.
As shown in FIG. 1, the multi-chip original plate 10 is obtained by regularly arranging a plurality of camera circuit boards 1. Each circuit board 1 is surrounded and divided by through-hole portions 10a and 10b or through-hole portions 10b. The through-hole portions 10a are L-shaped, and the through-hole portions 10b are adjacent to each other. The circuit board 1 is formed in a crank shape so as to extend along two adjacent sides of one circuit board and to extend along two adjacent sides of the other circuit board 1.
[0009]
Because of such a configuration, each camera circuit board 1 is surrounded by independent through holes, and there are no two through holes between adjacent circuit boards. 10b1 can be a single through hole as a common through hole for adjacent circuit boards 1, and the area of the through hole can be reduced by that amount. Therefore, the circuit board for cameras is more efficient than the multi-chip original plate 10. 1 can be taken.
[0010]
The remaining portion excluding each circuit board 1 and each through-hole portion 10a, 10b of the multi-piece substrate 10 is a remaining portion 10c. Each circuit board 1 and the remaining portion 10c are connected together by a bridge portion 10d that closes a part of each through hole portion 10a, 10b. The bridge portions 10d are preferably provided around the circuit board 1 so as to form a pair in the diagonal direction, and the connection state with the remaining portion 10c can be stably obtained. Further, it is preferable that one pair of the bridge portions 10d is provided for each circuit board 1.
[0011]
A circuit pattern (not shown) is formed on the upper surface of each circuit board 1 or on the upper and lower surfaces. The circuit patterns on the upper and lower surfaces are made conductive. The solid-state imaging device 2 is mounted at a predetermined position of the circuit pattern on the upper surface side as shown in FIG. A lens assembly 3 for forming an image on the solid-state imaging device 2 is provided on each circuit board 1.
[0012]
The lens assembly 3 is manufactured separately in advance and holds a lens for forming an image on the solid-state imaging device 2. As shown in FIG. 2, the first lens holder 31 and the second lens holder 32 are connected by screwing. The first lens holder 31 stores and holds the first lens 4, and an internal thread 31b is formed on the inner peripheral surface of the cylindrical portion 31a. Further, a cylindrical portion 32a is provided on the upper portion of the second lens holder 32, and a male screw 32b is formed on the outer peripheral surface of the cylindrical portion 32a to be screwed with the female screw 31b. The first lens holder 31 is advanced and retracted in the axial direction with respect to the second lens holder 32 by rotating at this screwing portion, and the distance between the lens 4 and the imaging surface 2a of the solid-state imaging device 2 is adjusted. The focus can be adjusted. A square tube portion 32c is provided below the second lens holder 32, and the filter 5 is mounted in the square tube portion. The lower end surface of the rectangular tube portion 32 c is in contact with the upper surface of the camera circuit board 1. Further, the second lens 6 is disposed on the upper portion of the first lens holder 31 and is fixed by a lens presser 33.
[0013]
The square tube portion 32c of the second lens holder 32 is provided with leg portions 7a and 7b extending from the two outer peripheral surfaces to the remaining portion 10c across the through-hole portions 10a and 10b. The leg portions 7a and 7b are L-shaped, traverse the through-hole portions 10a and 10b, bend, and have their lower end surfaces abutted against the upper surface of the remaining portion 10c.
[0014]
Next, the assembly process will be described. The first step is a step of mounting each solid-state imaging device 2 on the upper surface of each circuit board 1 of the multi-piece original plate 10 described above. Next, the second step is a step of placing the lens assembly 3 on each circuit board 1 so that the legs 7a and 7b are positioned on the remaining portion 10c and an image can be formed on the solid-state imaging device 2. Position and place.
[0015]
The third and fourth steps are steps for fixing the lens assembly 3. That is, when the lens assembly 3 is placed, the first adhesive 8 is applied to the lower end surface of the rectangular tube portion 32c, and the second adhesive 9 is applied to the lower end surfaces of the leg portions 7a and 7b. As the second adhesive 9, an adhesive having a faster curing rate than the first adhesive is used. For example, a thermosetting adhesive is used as the first adhesive 8 and a photocurable adhesive is used as the second adhesive 9. As an example of the thermosetting adhesive 8, an epoxy thermosetting adhesive, an acrylic thermosetting adhesive, a silicone thermosetting adhesive, or the like can be used. Moreover, as an example of the photocurable adhesive 9, a UV (ultraviolet) curable adhesive, a visible light curable adhesive, or the like can be used.
[0016]
Therefore, an example in which the epoxy thermosetting adhesive 8 is applied to the lower end surface of the rectangular tube portion 32c and the UV curable adhesive 9 is applied to the lower end surfaces of the leg portions 7a and 7b will be described. After both the adhesives are applied and the lens assembly 3 is placed at a predetermined position, when UV rays are first irradiated, the UV curable adhesive 9 is instantaneously cured and the lower end surfaces of the legs 7a and 7b and the remaining portions. The upper surface of 10c is fixed. As a result, the lens assembly 3 is fixed to the remaining portion 10c, and the lens assembly 3 is maintained at a correct position where the image can be formed on the solid-state imaging device 2. Thereafter, it is heated to 90 ° C. and held for 2 hours. As a result, the epoxy thermosetting adhesive 8 is cured. Although the lens assembly 3 must remain in the same position without moving for a long time of 2 hours, it is fixed to the original plate 10 by the UV curable adhesive 9 through the legs 7a and 7b. Until the system thermosetting adhesive 8 is cured, it is stably held in the correct position.
[0017]
Next, a fifth step is a step of cutting the leg portions 7a and 7b from the lens assembly 3 and further cutting the bridge portion 10d from the circuit board 1 with the epoxy thermosetting adhesive 8 sufficiently cured. It is. This excision can be easily excised by one cutter operation as the cutter passes through the through holes 10a and 10b. In this way, a solid-state imaging device including the camera circuit boards 1, the solid-state imaging elements 2, and the lens assemblies 3 is assembled.
[0018]
In this embodiment, the photo-curing adhesive is applied to the legs 7a and 7b. However, the present invention is not limited to this, and an instantaneous adhesive having a short curing time may be used. Further, although the bridge portions 10d are also provided in pairs in the diagonal direction, the present invention is not limited to this, and the bridge portions may be provided at a plurality of three or more locations.
[0019]
【The invention's effect】
Thus, in the present invention, the second adhesive having a faster curing speed than the first adhesive is used to fix the lens assembly to the original plate through its legs, so that the first adhesive can be cured. Even if time is required, the lens assembly is not displaced, and the first adhesive can provide strong adhesion, and the lens assembly does not peel from the circuit board during use. . In addition, since the bridge portions are provided in a pair in the diagonal direction around the circuit board, a stable integrated state can be maintained with respect to the remaining portions. In addition, since the through-hole portion is extended in a crank shape along two adjacent sides of the adjacent circuit board, the area occupied by the through-hole portion in the original plate can be reduced, and the area efficiency of the circuit board can be improved.
[Brief description of the drawings]
FIG. 1 is a front view of a state before cutting into individual solid-state imaging devices in an embodiment of the present invention.
FIG. 2 is an enlarged sectional view of the main part of the above.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Camera circuit board 2 Solid-state image sensor 3 Lens assembly 7a, 7b Leg part 8 Thermosetting adhesive material 9 Photocurable adhesive material 10 Multi-piece original board 10a, 10b Through-hole part 10c Remaining part 10d Bridge part

Claims (5)

A plurality of camera circuit boards regularly arranged; a through-hole portion positioned so as to surround each of the circuit boards; a remaining portion excluding the circuit boards and the through-hole portions; A plurality of original master plates each provided with a bridge portion that covers a part of the circuit board and is integrally connected to the remaining part, a solid-state image sensor mounted on the circuit board, and an image formed on each solid-state image sensor Each of the lens assemblies is provided with a leg portion extending across the through hole portion and extending to the remaining portion.
Mounting a solid-state imaging device on each circuit board of the original plate;
Placing each lens assembly on the original plate so that the leg is positioned on the remaining part and imageable on each solid-state imaging device; and
Fixing each lens assembly to each circuit board via a first adhesive, and fixing the legs to the remaining part via a second adhesive having a faster curing speed than the first adhesive. Process,
A step of cutting the leg portion from each lens assembly and cutting the bridge portion from each circuit board in a state where the first adhesive and the second adhesive are cured. A method for assembling a solid-state imaging device. 2. The method of assembling a solid-state imaging device according to claim 1, wherein the first adhesive is a thermosetting adhesive, and the second adhesive is a photocurable adhesive. 3. The photocurable adhesive according to claim 2, after the thermosetting adhesive and the photocurable adhesive are applied, the photocurable adhesive is irradiated with light to cure the photocurable adhesive, and then the thermosetting type is used. A method of assembling a solid-state imaging device, wherein the adhesive is heated to cure the thermosetting adhesive. 2. The method of assembling a solid-state imaging device according to claim 1, wherein the bridge portions are provided in a pair in a diagonal direction around the circuit board. 2. The bridge portion that blocks a part of the through hole portion according to claim 1, wherein there is one pair for each circuit board, and the through hole portion is adjacent to one of the adjacent circuit boards. A method of assembling a solid-state imaging device, wherein the solid-state imaging device has a crank shape extending along two sides and extending along two adjacent sides of the other circuit board.

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