JP4079118B2 - Anisotropic conductive film - Google Patents

Anisotropic conductive film Download PDF

Info

Publication number
JP4079118B2
JP4079118B2 JP2004141278A JP2004141278A JP4079118B2 JP 4079118 B2 JP4079118 B2 JP 4079118B2 JP 2004141278 A JP2004141278 A JP 2004141278A JP 2004141278 A JP2004141278 A JP 2004141278A JP 4079118 B2 JP4079118 B2 JP 4079118B2
Authority
JP
Japan
Prior art keywords
conductive film
anisotropic conductive
film according
adhesive
contact
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP2004141278A
Other languages
Japanese (ja)
Other versions
JP2005322589A (en
Inventor
郁夫 竹ヶ原
晋一郎 川村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Omron Corp
Original Assignee
Omron Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Omron Corp filed Critical Omron Corp
Priority to JP2004141278A priority Critical patent/JP4079118B2/en
Priority to PCT/JP2005/008509 priority patent/WO2005109576A1/en
Priority to US11/596,329 priority patent/US7537459B2/en
Priority to CNB2005800153862A priority patent/CN100435418C/en
Publication of JP2005322589A publication Critical patent/JP2005322589A/en
Application granted granted Critical
Publication of JP4079118B2 publication Critical patent/JP4079118B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Images

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R4/00—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation
    • H01R4/04—Electrically-conductive connections between two or more conductive members in direct contact, i.e. touching one another; Means for effecting or maintaining such contact; Electrically-conductive connections having two or more spaced connecting locations for conductors and using contact members penetrating insulation using electrically conductive adhesives
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/59—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures
    • H01R12/62—Fixed connections for flexible printed circuits, flat or ribbon cables or like structures connecting to rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted
    • H01R13/2407—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means
    • H01R13/2414—Contacts for co-operating by abutting resilient; resiliently-mounted characterized by the resilient means conductive elastomers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02—Contact members
    • H01R13/22—Contacts for co-operating by abutting
    • H01R13/24—Contacts for co-operating by abutting resilient; resiliently-mounted

Landscapes

  • Non-Insulated Conductors (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Push-Button Switches (AREA)

Description

本発明は異方性導電フィルム、特に、厚さ方向にのみ導通する多数の導電ユニットを設けた異方性導電フィルムに関する。   The present invention relates to an anisotropic conductive film, and more particularly to an anisotropic conductive film provided with a large number of conductive units that conduct only in the thickness direction.

従来、異方性導電フィルムとしては、例えば、絶縁フィルムに微細な金属粒子を埋設するとともに、前記金属粒子の上下端部を前記絶縁フィルムの表裏面からそれぞれ突出させることにより、上下方向だけを導通させるものがある（特許文献１，２参照）。
特許３３６０７７２号 特許３３５２７０５号 Conventionally, as an anisotropic conductive film, for example, fine metal particles are embedded in an insulating film, and upper and lower ends of the metal particles are protruded from the front and back surfaces of the insulating film, respectively, so that only the vertical direction is conducted. (See Patent Documents 1 and 2).
Japanese Patent No. 3360772 Japanese Patent No. 3352705

しかしながら、前述の異方性導電フィルムでは、均一な接続性を確保しようとすると、微細な金属粒子に高い寸法精度が必要であるだけでなく、絶縁フィルム中に微細な金属粒子を高い位置決め精度で埋設する必要がある。このため、前述の異方性導電フィルムは製造が容易でなく、生産性が低く、歩留まりが悪いという問題点がある。   However, in the aforementioned anisotropic conductive film, in order to ensure uniform connectivity, not only high dimensional accuracy is required for the fine metal particles, but also the fine metal particles are highly positioned in the insulating film. It is necessary to bury it. For this reason, the above-mentioned anisotropic conductive film is not easy to manufacture, has a problem that productivity is low and yield is poor.

本発明は、前記問題点に鑑み、製造が容易で生産性が高く、歩留まりの良い異方性導電フィルムを提供することを課題とする。   In view of the above problems, an object of the present invention is to provide an anisotropic conductive film that is easy to manufacture, has high productivity, and has a high yield.

課題を解決するための手段および発明の効果Means for Solving the Problems and Effects of the Invention

本発明にかかる異方性導電フィルムは、前記課題を解決すべく、フレキシブルな絶縁フィルムからなるシート状基材に少なくとも１つのスリットを設けて切り出した弾性圧縮および弾性変位可能な支持体の上下面に、接点部をそれぞれ設けるとともに、上下面に配置した一対の前記接点部だけを相互に独立して導通させる導電膜を設けた多数の導電ユニットを並設した構成としてある。 An anisotropic conductive film according to the present invention is an elastic compressible and elastically displaceable upper and lower surfaces cut out by providing at least one slit in a sheet-like substrate made of a flexible insulating film in order to solve the above problems. In addition, each of the contact portions is provided, and a large number of conductive units provided with a conductive film that allows only the pair of contact portions disposed on the upper and lower surfaces to conduct independently of each other are provided side by side.

本発明によれば、厚さ方向にのみ導通する一対の接点部からなる多数の導電ユニットがシート状基材に設けられているので、同一平面上に位置する複数の外部接点を前記導電ユニットの接点部にそれぞれ接触させても短絡することがなく、簡単に電気接続できる。
さらに、本発明によれば、支持体がフレキシブルな絶縁フィルムにスリットを設けて切り出されているので、弾性変形が容易であり、寸法精度のバラツキを容易に吸収，緩和できる。このため、従来例のような高い寸法精度を必要としないので、製造が容易になり、生産性が向上するとともに、歩留まりが良くなる。 According to the present invention, since a plurality of conductive units composed of a pair of contact portions that are conductive only in the thickness direction are provided on the sheet-like base material, a plurality of external contacts located on the same plane are connected to the conductive unit. Even if they are brought into contact with the contact portions, they are not short-circuited and can be easily electrically connected.
Furthermore, according to the present invention, since the support is cut out by providing a slit in a flexible insulating film, elastic deformation is easy, and variations in dimensional accuracy can be easily absorbed and relaxed. For this reason, since high dimensional accuracy as in the conventional example is not required, manufacturing is facilitated, productivity is improved, and yield is improved.

本発明にかかる実施形態としては、前記支持体が、両端支持梁形状、片持ち梁形状、あるいは、両端支持され、かつ、捩り作用を受ける形状であってもよい。
本実施形態によれば、必要に応じて支持体の形状を変えることができるので、選択の自由度が広がり、設計が容易になる。 As an embodiment according to the present invention, the support may have a double-end support beam shape, a cantilever beam shape, or a shape that is supported at both ends and that receives a twisting action.
According to the present embodiment, the shape of the support can be changed as necessary, so that the degree of freedom of selection is widened and the design is facilitated.

本発明にかかる他の実施形態としては、接点部が、導電膜の表面に設けた金属接点、有機導電物質、カーボン、導電性接着剤硬化物等の導電体であってもよく、また、支持体の表裏面にそれぞれ突設した突部の表面に導電膜を設けて形成したものであってもよい。
本実施形態によれば、必要に応じて接点部の形状を変えることができ、選択の自由度が広がり、設計が容易になる。特に、後者の接点部であれば、効率よく形成でき、生産性が高い。 As another embodiment according to the present invention, the contact portion may be a metal contact provided on the surface of the conductive film, an organic conductive material, carbon, a conductive material such as a cured conductive adhesive, or the like. It may be formed by providing a conductive film on the surface of the protrusions protruding from the front and back surfaces of the body.
According to the present embodiment, the shape of the contact portion can be changed as necessary, the degree of freedom of selection is widened, and the design is facilitated. In particular, the latter contact portion can be formed efficiently and has high productivity.

本発明にかかる別の実施形態としては、シート状基材の片面に各接点部に導通するリード線を印刷，エッチング等で設けておいてもよい。
本実施形態によれば、プリント基板のフレキシブルなコネクタとして使用できる。 As another embodiment according to the present invention, a lead wire conducting to each contact portion may be provided on one side of a sheet-like base material by printing, etching or the like.
According to this embodiment, it can be used as a flexible connector of a printed circuit board.

本発明にかかる新たな実施形態としては、スリット内に、接着剤を封入し、かつ、破砕可能なマイクロカプセルを充填してもよい。 As a new embodiment according to the present invention, an adhesive may be enclosed in a slit and a microcapsule that can be crushed may be filled.

本発明にかかる異なる実施形態としては、スリットの外周縁部に、接着剤を封入し、かつ、破砕可能なマイクロカプセルを配置してもよく、また、スリットの外周縁部に、加熱によって接着機能を発揮する粘着剤を設けておいてもよい。 As a different embodiment according to the present invention, a microcapsule that encloses an adhesive and can be crushed may be disposed at the outer peripheral edge of the slit, and the adhesive function may be provided by heating at the outer peripheral edge of the slit. You may provide the adhesive which exhibits.

前述の実施形態によれば、接着剤，粘着剤を介して異方性導電フィルムを他部材に接着一体化できるとともに、電気接続できるので、接続作業が簡単になり、組立作業性が向上するという効果がある。 According to the above-described embodiment, the anisotropic conductive film can be bonded and integrated with other members via an adhesive and a pressure-sensitive adhesive, and can be electrically connected, so that the connection work is simplified and the assembly workability is improved. effective.

本発明にかかる実施形態を図１ないし図１３の添付図面に従って説明する。
第１実施形態は、図１ないし図５に示すように、導電ユニット１１を格子状に配置した異方性導電フィルム１０である。前記導電ユニット１１は、フレキシブルな樹脂製フィルムからなるシート状基材１２に一対のスリット１３，１３を設けて両端支持された支持体１４を切り出す。そして、対向する前記支持体１４の上下面だけを相互に独立して導通させる導電膜１５を設けてある。さらに、前記支持体１４の上下面に接点部１６，１７をそれぞれ設けることにより、多数の導電ユニット１１が格子状に形成される。本実施形態では、図２Ａないし図２Ｃに示すように、支持体１４が圧縮して弾性変形するように使用してもよく、あるいは、図２Ｄないし図２Ｆに示すように、支持体１４の中央部が撓むように使用してもよい。なお、導電ユニット１１の大きさは必要に応じて変更可能であるが、例えば、外形寸法が５〜１０００μｍのものが考えられる。 An embodiment according to the present invention will be described with reference to the accompanying drawings of FIGS.
1st Embodiment is the anisotropic conductive film 10 which has arrange | positioned the electroconductive unit 11 in the grid | lattice form, as shown in FIG. 1 thru | or FIG. The conductive unit 11 cuts out a support 14 supported at both ends by providing a pair of slits 13 and 13 in a sheet-like base material 12 made of a flexible resin film. Then, a conductive film 15 is provided for electrically connecting only the upper and lower surfaces of the support 14 facing each other independently. Furthermore, by providing the contact portions 16 and 17 on the upper and lower surfaces of the support 14, a large number of conductive units 11 are formed in a lattice shape. In this embodiment, as shown in FIGS. 2A to 2C, the support body 14 may be used so as to be compressed and elastically deformed, or as shown in FIGS. 2D to 2F, the center of the support body 14 may be used. You may use so that a part may bend. In addition, although the magnitude | size of the electroconductive unit 11 can be changed as needed, the thing with an external dimension of 5-1000 micrometers can be considered, for example.

前記シート状基材１２としては、例えば、ポリエチレン樹脂、ポリプロピレン樹脂、ポリスチレン樹脂、ＡＢＳ樹脂（アクリロニトリルブタジエンスチレン）、ＰＭＭＡ樹脂（ポリメチルメタアクリレート）、エポキシ樹脂、不飽和ポリエステル樹脂、フェノール樹脂などが挙げられる。また、エンジニアリングプラスチックであってもよく、より具体的には、ＰＩ（ポリイミド）、ＰＡＩ（ポリアミドイミド）、ＰＥＴ（ポリエチレンテレフタレート）、ＰＥＮ（ポリエチレンナフタレート）、ＰＥＥＫ（ポリエーテルエーテルケトン）、ＬＣＰ（液晶ポリマー）、ＰＢＴ（ポリブチレンテレフタレート）、ＰＣ（ポリカーボネート）、ＰＥＩ（ポリエーテルイミド）、ＰＡ（ポリアミド（ナイロン））、ＰＡＮ（ポリアクリロニトリル）、ＰＰＳ（ポリフェニレンサルファイド）、アラミドなどが挙げられる。そして、前記シート状基材１２の厚さ寸法としては、通常、厚さ２５０μｍ前後のものであってもよいが、支持体１４に所望の可撓性を確保するためには厚さ１００μｍ以下のものが好ましい。   Examples of the sheet-like substrate 12 include polyethylene resin, polypropylene resin, polystyrene resin, ABS resin (acrylonitrile butadiene styrene), PMMA resin (polymethyl methacrylate), epoxy resin, unsaturated polyester resin, and phenol resin. It is done. Further, it may be an engineering plastic. More specifically, PI (polyimide), PAI (polyamideimide), PET (polyethylene terephthalate), PEN (polyethylene naphthalate), PEEK (polyetheretherketone), LCP ( Examples thereof include liquid crystal polymer), PBT (polybutylene terephthalate), PC (polycarbonate), PEI (polyetherimide), PA (polyamide (nylon)), PAN (polyacrylonitrile), PPS (polyphenylene sulfide), and aramid. And as thickness dimension of the said sheet-like base material 12, although the thing of thickness around 250 micrometers may be usually, in order to ensure desired flexibility to the support body 14, thickness of 100 micrometers or less is sufficient. Those are preferred.

本実施形態にかかる異方性導電フィルム１０は、例えば、図３に示すように、コネクタとして使用できる。
すなわち、本実施形態にかかる異方性導電フィルム１０のスリット１３内に接着剤２１を封入したマイクロカプセル２０を充填する。ついで、前記導電ユニット１１の接点部１６，１７に、プリント配線したプリント基板３０，３２の接続パッド３１，３３を上下から位置決めする。そして、加圧または加熱して前記マイクロカプセル２０を破砕し、飛び出す前記接着剤２１で前記プリント基板３０，３２を異方性導電フィルム１０に接着一体化することにより、前記プリント基板３０，３２が電気接続される。
特に、前記導電ユニット１１それ自身をより小さくし、かつ、ピッチを小さくすることにより、接続パッド３１，３３の１個当たりに当接する導電ユニット１１の数を増大させれば、接続パッド３１，３３が前記導電ユニット１１に必然的に接触することになる。このため、前記接続パッド３１，３３を相互に位置合わせするだけで電気接続でき、組立作業性が向上するという利点がある。 The anisotropic conductive film 10 concerning this embodiment can be used as a connector, for example, as shown in FIG.
That is, the microcapsule 20 in which the adhesive 21 is sealed is filled in the slit 13 of the anisotropic conductive film 10 according to the present embodiment. Next, the connection pads 31 and 33 of the printed circuit boards 30 and 32 that are printed and wired are positioned from above and below to the contact portions 16 and 17 of the conductive unit 11. Then, the printed circuit boards 30 and 32 are bonded to and integrated with the anisotropic conductive film 10 with the adhesive 21 that is pressed or heated to crush the microcapsules 20 and jump out. Electrically connected.
In particular, if the number of the conductive units 11 that contact each of the connection pads 31 and 33 is increased by making the conductive unit 11 itself smaller and reducing the pitch, the connection pads 31 and 33 are used. Inevitably comes into contact with the conductive unit 11. For this reason, electrical connection can be achieved simply by aligning the connection pads 31 and 33 with each other, and there is an advantage that assembly workability is improved.

また、他の使用方法としては、図４に示すように、本実施形態にかかる異方性導電フィルム１０の導電ユニット１１の間に図示しない凹部を形成する。そして、前記凹部に接着剤２１を封入し、かつ、破砕可能なマイクロカプセル２０を配置する。ついで、前記導電ユニット１１の接点部１６，１７に、プリント配線したフレキシブルなプリント基板３０，３２の接続パッド３１，３３を上下から位置決めする。そして、加圧または加熱して前記マイクロカプセル２０を破砕し、飛び出す前記接着剤２１で前記プリント基板３０，３２を異方性導電フィルム１０に接着一体化することにより、前記プリント基板３０，３２が電気接続される。   Moreover, as another usage method, as shown in FIG. 4, the recessed part which is not shown in figure is formed between the conductive units 11 of the anisotropic conductive film 10 concerning this embodiment. And the adhesive 21 is enclosed in the said recessed part, and the microcapsule 20 which can be crushed is arrange | positioned. Next, the connection pads 31 and 33 of the flexible printed boards 30 and 32 that are printed and wired are positioned on the contact portions 16 and 17 of the conductive unit 11 from above and below. Then, the printed circuit boards 30 and 32 are bonded to and integrated with the anisotropic conductive film 10 with the adhesive 21 that is pressed or heated to crush the microcapsules 20 and jump out. Electrically connected.

さらに、別の使用方法としては、図５に示すように、本実施形態にかかる異方性導電フィルム１０の導電ユニット１１の間に粘着剤２２を配置する。ついで、前記導電ユニット１１の接点部１６，１７に、プリント配線したフレキシブルなプリント基板３０，３２の接続パッド３１，３３を上下から位置決めする。そして、加圧して前記粘着剤２２で前記プリント基板３０，３２を異方性導電フィルム１０に剥離可能に接着一体化することにより、前記プリント基板３０，３２が電気接続される。   Furthermore, as another use method, as shown in FIG. 5, the adhesive 22 is arrange | positioned between the electroconductive units 11 of the anisotropic conductive film 10 concerning this embodiment. Next, the connection pads 31 and 33 of the flexible printed boards 30 and 32 that are printed and wired are positioned on the contact portions 16 and 17 of the conductive unit 11 from above and below. Then, the printed circuit boards 30 and 32 are electrically connected to the anisotropic conductive film 10 by being pressurized and adhesively integrated with the anisotropic conductive film 10 so as to be peeled off.

なお、接着剤２１を封入したマイクロカプセル２０および粘着剤２２を併用することにより、前記粘着剤２２でプリント基板３０，３２仮止めした後、加圧あるいは加熱してマイクロカプセル２０を破砕し、接着剤２２で接着一体化してもよい。また、前記粘着剤２２は、それ自身を加熱することにより、接着剤として機能するものであってもよい。   In addition, by using the microcapsule 20 enclosing the adhesive 21 and the pressure-sensitive adhesive 22 together, the printed circuit boards 30 and 32 are temporarily fixed with the pressure-sensitive adhesive 22, and then the microcapsule 20 is crushed by pressing or heating to be bonded. The agent 22 may be bonded and integrated. The pressure-sensitive adhesive 22 may function as an adhesive by heating itself.

第２実施形態は、図６に示すように、前述の第１実施形態が格子状に導電ユニット１１を設けた場合であるのに対し、導電ユニット１１を千鳥状に設けた場合である。本実施形態によれば、導電ユニット１１が千鳥状であるので、外部接点との接触性が良くなるという利点がある。   As shown in FIG. 6, the second embodiment is a case where the conductive units 11 are provided in a staggered manner, whereas the first embodiment described above is provided with the conductive units 11 in a lattice shape. According to this embodiment, since the conductive units 11 are staggered, there is an advantage that the contact property with the external contact is improved.

なお、導電ユニット１１の支持体１４は、前述の両端支持構造だけでなく、例えば、片持ち梁形状を有する第３実施形態であってもよく（図７Ａないし図７Ｃ）、あるいは、両端支持し、かつ、捩りモーメントが作用する形状を有する第４実施形態であってもよい（図７Ｄないし７Ｆ）。   Note that the support 14 of the conductive unit 11 is not limited to the above-described both-end support structure, and may be, for example, a third embodiment having a cantilever shape (FIGS. 7A to 7C), or may be supported at both ends. Further, the fourth embodiment may have a shape in which a torsional moment acts (FIGS. 7D to 7F).

第５実施形態は、図８に示すように、本実施形態にかかる異方性導電フィルム１０を、感圧位置センサに適用した場合である。
本実施形態にかかる前記感圧位置センサは、複数本の固定電極３４を平行に並設した下部電極板３５と、異方性導電フィルム１０と、保護フィルム３６とからなるものである。前記異方性導電フィルム１０は、第１実施形態と同様、シート状基材１２に多数の導電ユニット１１を格子状に並設するとともに、前記シート状基材１２の上面全面に共通導電膜１８を形成してすべての接続部１６を電気接続する一方、前記シート状基材１２の下面に脚部１９を格子状に突設した場合である。なお、第１実施形態と同一部分には同一番号を附して説明を省略する。 In the fifth embodiment, as shown in FIG. 8, the anisotropic conductive film 10 according to the present embodiment is applied to a pressure-sensitive position sensor.
The pressure-sensitive position sensor according to this embodiment includes a lower electrode plate 35 in which a plurality of fixed electrodes 34 are arranged in parallel, the anisotropic conductive film 10, and a protective film 36. Similar to the first embodiment, the anisotropic conductive film 10 has a large number of conductive units 11 arranged in a lattice pattern on the sheet-like base material 12 and a common conductive film 18 on the entire upper surface of the sheet-like base material 12. In this case, all the connecting portions 16 are electrically connected to each other, and the leg portions 19 are projected in a lattice shape on the lower surface of the sheet-like base material 12. In addition, the same number is attached | subjected to the same part as 1st Embodiment, and description is abbreviate | omitted.

本実施形態によれば、保護シート３６の任意の位置を押圧することにより、支持体１４が撓み、その直下に位置する複数の接点部１７が複数本の前記固定電極３６に接触するとともに、シート状基材１２の上面に形成された導電膜１８を介して固定電極３４が導通するため、押圧位置を特定できる。なお、本実施形態における接点部１６は必要に応じて設ければよく、また、必ずしも突出した形状である必要はない。   According to the present embodiment, by pressing an arbitrary position of the protective sheet 36, the support body 14 bends, and the plurality of contact portions 17 positioned immediately below the contact sheet 17 are in contact with the plurality of fixed electrodes 36 and the sheet. Since the fixed electrode 34 conducts through the conductive film 18 formed on the upper surface of the substrate 12, the pressing position can be specified. In addition, the contact part 16 in this embodiment should just be provided as needed, and does not necessarily need to be the shape which protruded.

第６実施形態は、図１０に示すように、下部電極板３５に設けた固定電極３６間のピッチを導電ユニット１１のピッチよりも広くした場合である。この場合であっても、シート状基材１２の上面に形成された共通導電膜１８を介してすべての接点部１６が導通し、押圧位置を特定できる。他は第５実施形態と同様であるので、同一部分には同一番号を附して説明を省略する。なお、前述の実施形態における脚部１９は連続する格子状の突条からなるものである必要はなく、不連続な突部からなるものであってもよい。   In the sixth embodiment, as shown in FIG. 10, the pitch between the fixed electrodes 36 provided on the lower electrode plate 35 is wider than the pitch of the conductive units 11. Even in this case, all the contact portions 16 are conducted through the common conductive film 18 formed on the upper surface of the sheet-like substrate 12, and the pressing position can be specified. Since others are the same as those of the fifth embodiment, the same parts are denoted by the same reference numerals and description thereof is omitted. In addition, the leg part 19 in above-mentioned embodiment does not need to consist of a continuous grid-like protrusion, and may consist of a discontinuous protrusion.

第７実施形態は、図１１に示すように、少なくとも一端側に複数の前記導電ユニット１１を並設するとともに、接点部１６に導通するリード線１５ａをプリントした異方性導電フィルム１０である。そして、剥離可能あるいは永久的に接続一体化するため、裏面側の前記導電ユニット１１の間に粘着剤２２および／または接着剤２１を塗布してある。このため、プリントした接続パッド３８からリード線３８ａを延在するフレキシブルなプリント基板３７のうち、前記接続パッド３８に本実施形態にかかる異方性導電フィルム１０の導電ユニット１１を重ね合わせて接続一体化することにより、電気接続できる。   As shown in FIG. 11, the seventh embodiment is an anisotropic conductive film 10 in which a plurality of the conductive units 11 are arranged in parallel on at least one end side and a lead wire 15 a that is electrically connected to the contact portion 16 is printed. And in order to be able to peel or permanently connect and integrate, the adhesive 22 and / or the adhesive 21 is applied between the conductive units 11 on the back surface side. For this reason, among the flexible printed circuit board 37 extending from the printed connection pad 38 to the lead wire 38a, the conductive unit 11 of the anisotropic conductive film 10 according to the present embodiment is overlapped on the connection pad 38 to be connected integrally. By making it, electrical connection can be made.

第８実施形態は、図１２に示すように、直線状エンコーダに適用した場合であり、保護フィルム４０、中間電極板である異方性導電フィルム１０、および、固定電極４２，４３を設けた下部極板４１からなる。前記異方性導電フィルム１０は、２列に並べた導電ユニット１１を千鳥状となるように配列してある。さらに、前述の第６実施形態と同様、前記異方性導電フィルム１０の上面全面に導電膜１８を形成し、すべての接点部１６を電気接続してある。一方、下部電極板４１は、その上面に等間隔で平行に並設した２列の固定電極４２，４３を千鳥状に配置してある。このため、所定の前記導電ユニット１１上に保護フィルム４０を介して外力が負荷されると、直下に位置する導電ユニット１１の接点部１６が前記固定電極４２，４３の一端にそれぞれ接触する。この結果、前記導電膜１８を介して導通することにより、外力の変位を検出できる。他は前述の実施形態と同様であるので、同一部分に同一番号を附して説明を省略する。
本実施形態によれば、導電ユニット１１を千鳥状に配列し、対向する導電ユニット１１同士を半ピッチずつずらしてあるので、導電ユニット１１が固定電極４２，４３に接触しやすくなり、倍精度になるという利点がある。 As shown in FIG. 12, the eighth embodiment is applied to a linear encoder, and is a lower part provided with a protective film 40, an anisotropic conductive film 10 as an intermediate electrode plate, and fixed electrodes 42 and 43. It consists of an electrode plate 41. The anisotropic conductive film 10 has conductive units 11 arranged in two rows arranged in a staggered pattern. Furthermore, like the above-described sixth embodiment, a conductive film 18 is formed on the entire upper surface of the anisotropic conductive film 10 and all contact portions 16 are electrically connected. On the other hand, the lower electrode plate 41 has two rows of fixed electrodes 42 and 43 arranged in parallel at equal intervals on the upper surface thereof in a staggered manner. For this reason, when an external force is applied to the predetermined conductive unit 11 via the protective film 40, the contact portion 16 of the conductive unit 11 positioned immediately below contacts one end of the fixed electrodes 42 and 43. As a result, the displacement of the external force can be detected by conducting through the conductive film 18. Others are the same as those in the above-described embodiment, and thus the same parts are denoted by the same reference numerals and description thereof is omitted.
According to this embodiment, since the conductive units 11 are arranged in a staggered manner and the conductive units 11 facing each other are shifted by a half pitch, the conductive units 11 can easily come into contact with the fixed electrodes 42 and 43, and double precision. There is an advantage of becoming.

第９実施形態は、図１３に示すように、環状エンコーダに適用した場合であり、保護フィルム４０、中間電極板である異方性導電フィルム１０、および、長短の固定電極４４，４５を放射状に配置した下部極板４１からなる。そして、前記下部電極板４１に設けた中心孔４６を中心として移動する外力が保護フィルム４０を介して導電ユニット１１に負荷されると、導電ユニット１１の接点部１６が長短の固定電極４４，４５に接触し、導電膜１８を介して導通することにより、外力の変位を検出できる。他は前述の第８実施形態と同様であるので、説明を省略する。   As shown in FIG. 13, the ninth embodiment is applied to an annular encoder. The protective film 40, the anisotropic conductive film 10 that is an intermediate electrode plate, and long and short fixed electrodes 44 and 45 are radially formed. The lower electrode plate 41 is arranged. When an external force that moves around the central hole 46 provided in the lower electrode plate 41 is applied to the conductive unit 11 through the protective film 40, the contact portion 16 of the conductive unit 11 is fixed to the long and short fixed electrodes 44 and 45. The displacement of the external force can be detected by making contact with and conducting through the conductive film 18. The rest is the same as in the eighth embodiment described above, and a description thereof will be omitted.

なお、接点部１６は、導電膜の表面に別体の接点を設けて形成してもよく、あるいは、支持体１４の表裏面に突部を設け、かつ、導電膜で被覆して形成してもよい。
また、本実施形態では、粘着剤あるいは接着剤を介して接続一体化する場合について説明をしたが、必ずしもこれに限らず、異方性導電フィルムを外部接続パッド等に機械的機構を介して接続一体化してもよい。
さらに、外部回路に接続された接続パッド等が突出した形状であれば、本発明にかかる異方性導電フィルムの接点部は、前述の実施形態のように突出した形状である必要はなく、支持体と面一であってもよい。 The contact portion 16 may be formed by providing a separate contact on the surface of the conductive film, or may be formed by providing protrusions on the front and back surfaces of the support 14 and covering with the conductive film. Also good.
In the present embodiment, the case of connecting and integrating via an adhesive or an adhesive has been described. However, the present invention is not limited to this, and an anisotropic conductive film is connected to an external connection pad or the like via a mechanical mechanism. It may be integrated.
Furthermore, as long as the connection pad connected to the external circuit protrudes, the contact part of the anisotropic conductive film according to the present invention does not need to be protruded as in the above-described embodiment, and is supported. It may be flush with the body.

本発明にかかる異方性導電フィルムは前述のコネクタ、スイッチ、感圧センサ、エンコーダに限らず、他のコネクタ等にも適用できる。   The anisotropic conductive film according to the present invention is not limited to the connector, switch, pressure sensor, and encoder described above, and can be applied to other connectors.

図１Ａ、１Ｂおよび１Ｃは本発明にかかる第１実施形態を示す平面図、断面図および部分断面斜視図である。1A, 1B and 1C are a plan view, a sectional view and a partial sectional perspective view showing a first embodiment according to the present invention. 図２Ａ、２Ｂおよび２Ｃは第１実施形態にかかる部分平面図、部分断面図、および、変形後を示す部分断面図であり、図２Ｄ、２Ｅおよび２Ｆは応用例にかかる部分平面図、部分断面図、および、変形後を示す部分断面図である。2A, 2B, and 2C are a partial plan view, a partial cross-sectional view, and a partial cross-sectional view showing a modified embodiment according to the first embodiment, and FIGS. 2D, 2E, and 2F are a partial plan view and a partial cross-section according to an application example. It is a fragmentary sectional view which shows a figure and a deformation | transformation. 図３Ａおよび３Ｂは本発明にかかる第１実施形態の接続方法における接続前、接続後を示す断面図である。3A and 3B are cross-sectional views showing before and after connection in the connection method according to the first embodiment of the present invention. 図４Ａおよび４Ｂは本発明にかかる他の接続方法における接続前、接続後を示す断面図である。4A and 4B are cross-sectional views showing before and after connection in another connection method according to the present invention. 図５Ａおよび５Ｂは本発明にかかる別の接続方法示す接続前、接続後の断面図である。5A and 5B are sectional views before and after connection showing another connection method according to the present invention. 図６Ａおよび６Ｂは本発明にかかる第２実施形態を示す平面図および断面図である。6A and 6B are a plan view and a sectional view showing a second embodiment according to the present invention. 図７Ａ、７Ｂおよび７Ｃは第３実施形態にかかる部分平面図、部分断面図、および、変形後を示す部分断面図であり、図７Ｄ、７Ｅおよび７Ｆは第４実施形態にかかる部分平面図、部分断面図、および、変形後を示す部分断面図である。7A, 7B, and 7C are a partial plan view, a partial cross-sectional view, and a partial cross-sectional view showing a state after deformation according to the third embodiment, and FIGS. 7D, 7E, and 7F are partial plan views according to the fourth embodiment. It is a fragmentary sectional view and the fragmentary sectional view which shows after a deformation | transformation. 図８Ａおよび８Ｂは、第５実施形態を示す分解斜視図および分解正面図である。8A and 8B are an exploded perspective view and an exploded front view showing the fifth embodiment. 図９Ａ、９Ｂ、９Ｃおよび９Ｄは本発明にかかる第５実施形態の異方性導電フィルムを示す平面図、正面断面図、底面図および右側面断面図である。9A, 9B, 9C, and 9D are a plan view, a front sectional view, a bottom view, and a right side sectional view showing an anisotropic conductive film according to a fifth embodiment of the present invention. 本発明にかかる第６実施形態を示す分解斜視図である。It is a disassembled perspective view which shows 6th Embodiment concerning this invention. 図１１Ａ、１１Ｂ、１１Ｃおよび１１Ｄは第７実施形態にかかる異方性導電フィルムの部分平面図、部分底面図、接続状態を示す断面図、接続一体化されるプリント基板を示す部分平面図である。11A, 11B, 11C, and 11D are a partial plan view, a partial bottom view, a sectional view showing a connection state, and a partial plan view showing a printed circuit board to be connected and integrated, of an anisotropic conductive film according to a seventh embodiment. . 図１２Ａ、１２Ｂおよび１２Ｃは本発明にかかる第８実施形態にかかる直線状エンコーダの構成部品を示す部分平面図である。12A, 12B and 12C are partial plan views showing components of the linear encoder according to the eighth embodiment of the present invention. 図１３Ａ、１３Ｂおよび１３Ｃは本発明にかかる第９実施形態にかかる環状エンコーダの構成部品を示す部分平面図である。13A, 13B and 13C are partial plan views showing components of the annular encoder according to the ninth embodiment of the present invention.

符号の説明Explanation of symbols

１０：異方性導電フィルム
１１：導電ユニット
１２：絶縁フィルム
１３：スリット
１４：支持体
１５：導電膜
１５ａ：リード線
１６，１７：接点部
１８：共通導電膜
１９：脚部
２０：マイクロカプセル
２１：接着剤
２２：粘着剤
３０，３２：プリント基板
３１，３３：接続パッド
３４，３６：固定極板
３５：下部電極板
３７：プリント基板
３８：接続パッド
３８ａ：リード線
４０：保護フィルム
４１：下部電極板
４２，４３：固定電極
４４，４５：固定電極 DESCRIPTION OF SYMBOLS 10: Anisotropic conductive film 11: Conductive unit 12: Insulating film 13: Slit 14: Support body 15: Conductive film 15a: Lead wire 16, 17: Contact part 18: Common conductive film 19: Leg part 20: Microcapsule 21 : Adhesive 22: Adhesive 30, 32: Printed circuit board 31, 33: Connection pad 34, 36: Fixed electrode plate 35: Lower electrode plate 37: Printed circuit board 38: Connection pad 38a: Lead wire 40: Protective film 41: Lower part Electrode plate 42, 43: Fixed electrode 44, 45: Fixed electrode

Claims (10)

フレキシブルな絶縁フィルムからなるシート状基材に少なくとも１つのスリットを設けて切り出した弾性圧縮および弾性変位可能な支持体の上下面に、接点部をそれぞれ設けるとともに、上下面に配置した一対の前記接点部だけを相互に独立して導通させる導電膜を設けた多数の導電ユニットを並設したことを特徴とする異方性導電フィルム。 The upper and lower surfaces of the elastically compressible and elastically displaceable supports cut provided with at least one slit in the sheet-like substrate made of a flexible insulating film, provided with a contact portion, respectively, a pair of the contact disposed on the upper and lower surfaces An anisotropic conductive film characterized in that a large number of conductive units provided with a conductive film that conducts only the portions independently of each other are arranged side by side. 支持体が、両端支持梁形状であることを特徴とする請求項１に記載の異方性導電フィルム。   The anisotropic conductive film according to claim 1, wherein the support has a shape of a beam supported at both ends. 支持体が、片持ち梁形状であることを特徴とする請求項１に記載の異方性導電フィルム。   The anisotropic conductive film according to claim 1, wherein the support has a cantilever shape. 支持体が、両端支持され、かつ、捩り作用を受ける形状であることを特徴とする請求項１に記載の異方性導電フィルム。   The anisotropic conductive film according to claim 1, wherein the support is shaped to be supported at both ends and to receive a twisting action. 接点部が、導電膜の表面に設けた金属接点からなることを特徴とする請求項１ないし４のいずれか１項に記載の異方性導電フィルム。   The anisotropic conductive film according to any one of claims 1 to 4, wherein the contact portion comprises a metal contact provided on the surface of the conductive film. 接点部が、支持体の表裏面にそれぞれ突設した突部の表面に導電膜を設けて形成したものであることを特徴とする請求項１ないし５のいずれか１項に記載の異方性導電フィルム。   6. The anisotropy according to any one of claims 1 to 5, wherein the contact portions are formed by providing a conductive film on the surfaces of the protrusions respectively protruding from the front and back surfaces of the support. Conductive film. シート状基材の片面に各接点部に導通するリード線を設けたことを特徴とする請求項１ないし６のいずれか１項に記載の異方性導電フィルム。   The anisotropic conductive film according to any one of claims 1 to 6, wherein a lead wire conducting to each contact portion is provided on one side of the sheet-like substrate. スリット内に、接着剤を封入し、かつ、圧力で破砕可能なマイクロカプセルを充填したことを特徴とする請求項１ないし７のいずれか１項に記載の異方性導電フィルム。 The anisotropic conductive film according to any one of claims 1 to 7 , wherein the slit is filled with an adhesive and filled with microcapsules that can be crushed by pressure. スリットの外周縁部に、接着剤を封入し、かつ、圧力で破砕可能なマイクロカプセルを配置したことを特徴とする請求項１ないし７のいずれか１項に記載の異方性導電フィルム。 The anisotropic conductive film according to any one of claims 1 to 7 , wherein a microcapsule encapsulating an adhesive and capable of being crushed by pressure is disposed at an outer peripheral edge of the slit. スリットの外周縁部に、加熱によって接着機能を発揮する粘着剤を設けたことを特徴とする請求項１ないし７のいずれか１項に記載の異方性導電フィルム。 The outer peripheral edge of the slit, the anisotropic conductive film according to any one of claims 1 to 7, characterized in that a pressure-sensitive adhesive which exhibits an adhesive function by heat.
JP2004141278A 2004-05-11 2004-05-11 Anisotropic conductive film Expired - Fee Related JP4079118B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP2004141278A JP4079118B2 (en) 2004-05-11 2004-05-11 Anisotropic conductive film
PCT/JP2005/008509 WO2005109576A1 (en) 2004-05-11 2005-05-10 Anisotropic electrically conductive film
US11/596,329 US7537459B2 (en) 2004-05-11 2005-05-10 Anisotropic conductive film
CNB2005800153862A CN100435418C (en) 2004-05-11 2005-05-10 Anisotropic electrically conductive film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2004141278A JP4079118B2 (en) 2004-05-11 2004-05-11 Anisotropic conductive film

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP2007287221A Division JP4400671B2 (en) 2007-11-05 2007-11-05 Anisotropic conductive film

Publications (2)

Publication Number Publication Date
JP2005322589A JP2005322589A (en) 2005-11-17
JP4079118B2 true JP4079118B2 (en) 2008-04-23

Family

ID=35320499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2004141278A Expired - Fee Related JP4079118B2 (en) 2004-05-11 2004-05-11 Anisotropic conductive film

Country Status (4)

Country Link
US (1) US7537459B2 (en)
JP (1) JP4079118B2 (en)
CN (1) CN100435418C (en)
WO (1) WO2005109576A1 (en)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US8518304B1 (en) 2003-03-31 2013-08-27 The Research Foundation Of State University Of New York Nano-structure enhancements for anisotropic conductive material and thermal interposers
JP4825043B2 (en) * 2006-04-21 2011-11-30 ポリマテック株式会社 Anisotropic conductive sheet
JP2009259494A (en) * 2008-04-14 2009-11-05 Nec Infrontia Corp Connector mounting structure
WO2010101125A1 (en) * 2009-03-05 2010-09-10 ポリマテック株式会社 Elastic connector and method of manufacturing same and conductive connector
CN102422726B (en) 2009-03-10 2015-07-01 约翰国际有限公司 Electrically conductive pins for microcircuit tester
JP5453604B2 (en) * 2009-04-09 2014-03-26 ポリマテック・ジャパン株式会社 Elastic connector and method of manufacturing elastic connector
US20130002285A1 (en) 2010-03-10 2013-01-03 Johnstech International Corporation Electrically Conductive Pins For Microcircuit Tester
JP4863130B2 (en) * 2009-05-22 2012-01-25 山一電機株式会社 Board connector, semiconductor device socket including the same, cable connector, and board-to-board connector
US8872038B2 (en) * 2009-09-02 2014-10-28 Polymatech Co., Ltd. Anisotropic conductor, method of producing the same, and anisotropic conductor-arranged sheet
US9007082B2 (en) 2010-09-07 2015-04-14 Johnstech International Corporation Electrically conductive pins for microcircuit tester
TWI534432B (en) 2010-09-07 2016-05-21 瓊斯科技國際公司 Electrically conductive pins for microcircuit tester
US8641428B2 (en) * 2011-12-02 2014-02-04 Neoconix, Inc. Electrical connector and method of making it
KR20140000084A (en) * 2012-06-22 2014-01-02 삼성전기주식회사 Touch panel
JP2015207433A (en) * 2014-04-18 2015-11-19 矢崎総業株式会社 Conductive elastic member and connector

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE69216658T2 (en) * 1991-02-25 1997-08-07 Canon Kk Device and method for connecting electrical components
JP3352705B2 (en) 1991-06-07 2002-12-03 日東電工株式会社 Mounting structure using anisotropic conductive adhesive film
JP3360772B2 (en) 1994-09-02 2002-12-24 日立化成工業株式会社 Connection structure of fine electrode and inspection method of electronic component having fine electrode
AU3141297A (en) * 1996-05-24 1997-12-09 Tessera, Inc. Connectors for microelectronic elements
JP4085186B2 (en) 1997-10-17 2008-05-14 モレックス インコーポレーテッド BGA socket
JP2000131342A (en) 1998-10-20 2000-05-12 Fujitsu Ltd Contactor for electronic part
US6019610A (en) * 1998-11-23 2000-02-01 Glatts, Iii; George F. Elastomeric connector
JP3162677B2 (en) 1998-12-10 2001-05-08 株式会社双晶テック Multi-point conductive sheet
JP2001228975A (en) 2000-02-16 2001-08-24 Fujikura Ltd Pressure sensitive element, touch panel and liquid crystal display using the same
JP2001332323A (en) * 2000-05-24 2001-11-30 Anritsu Corp Silicon electrode and high frequency contact point sheet as well as manufacturing method of silicon electrode

Also Published As

Publication number Publication date
JP2005322589A (en) 2005-11-17
CN1954464A (en) 2007-04-25
US20080014796A1 (en) 2008-01-17
WO2005109576A1 (en) 2005-11-17
US7537459B2 (en) 2009-05-26
CN100435418C (en) 2008-11-19

Similar Documents

Publication Publication Date Title
US7537459B2 (en) Anisotropic conductive film
TWI311836B (en) Electrical connecting member capable of achieving stable connection with a simple structure and connector using the same
US7341476B2 (en) Inter-member connection structure, method of manufacturing the same, and electronic apparatus including inter-member connection structure
JP5206630B2 (en) Electrical connection component and electrical connection method using flexible harness
KR100856704B1 (en) Electrical connection member for connection between objects to be connected
KR101539212B1 (en) Electric circuit arrangement having an MID-circuit mount and a connection interface connected thereto
KR200404628Y1 (en) Board connecting apparatus
EP2798702A1 (en) A method and an electrical interconnect mechanism
JP5142386B2 (en) connector
US8777115B2 (en) Card switch
WO2009116364A1 (en) Slide operation type switch
KR200394223Y1 (en) Press-contact typed electric connector
WO2006114885A1 (en) Electrically connecting device
JP4400671B2 (en) Anisotropic conductive film
JP5590109B2 (en) Flexible harness, electrical connection component using the same, and electrical connection method
JP2509656B2 (en) Flexible printed wiring board connection structure
JP5438455B2 (en) connector
JP2007179923A (en) Metal dome holding sheet, and metal dome switch
WO2007088631A1 (en) Connection portion of circuit board and connection structure of circuit board
JP2003158349A (en) Seal for reinforcing printed wiring board and printed wiring board
JP2007122919A (en) Connecting member
JP2007220339A (en) Connecting element
JP2006313692A (en) Anisotropic connector device
JPH0536454A (en) Connector
JP2007012339A (en) Electric connection member and its manufacturing method

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20060927

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20070508

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20070706

A02 Decision of refusal

Free format text: JAPANESE INTERMEDIATE CODE: A02

Effective date: 20070911

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20071105

A911 Transfer to examiner for re-examination before appeal (zenchi)

Free format text: JAPANESE INTERMEDIATE CODE: A911

Effective date: 20071116

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20080115

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20080128

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20110215

Year of fee payment: 3

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

LAPS Cancellation because of no payment of annual fees