JP2000131342A - Contactor for electronic part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide sure electric connection between an electronic part and a contact electrode even with narrower inter-electrode pitch, in a contactor for an electronic part used for operation test of an electronic part such as LSI and LCD. SOLUTION: With an insulating substrate 11-1 and a contact electrode 12A provided, the contact electrode 12A contacts an electrode 15 of a device 14A to provide an electric connection. Here, a displacement part wherein the insulating substrate 11-1 is provided with an opening part 20-1 to allow displacement, and a non-displacement part 30-1 which is hard to be displaced relative to the displacement part, are provided. Thus, even with a variation in height of the contact electrode 12A, etc., a displacement part (a part of the insulating substrate 11-1 where the opening part 20-1 is formed) is displaced to absorb the variation in height.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contactor for electronic parts, and more particularly to a contactor for electronic parts used for an operation test of electronic parts such as LSI and LCD. In recent years, electronic components (eg, LSI devices, LCD devices, etc .; hereinafter, referred to as devices) have been remarkably increasing in the degree of integration and high density mounting, and the electrodes (external connection terminals) of the devices themselves have, of course, been miniaturized and multi-pinned. It tends to be.

[0002] It has become very difficult to supply a contactor for an electronic component that can collectively contact such a device having a large number of such fine electrodes, and an important contactor must be prepared at the same time as the development of the device. It is becoming a technology. Also, packaged devices, such as CSP (Chip Size Package) and the like, have a narrow terminal pitch, and the conventional socket technology has not been able to obtain stable contact properties at a low cost, which poses a serious problem.

[0003] However, what is more serious is a contact to a device in an unpackaged state (bare chip state or wafer state). For example, portable devices (cellular phones, portable terminals, television integrated videos, etc.) have been reduced in size and weight. For this reason, there is a tendency to mount the device as a bare chip on a substrate of the device. In recent years, with the development of MCM (Multi Chip Module), which is an LSI package incorporating a plurality of LSI chips, it is necessary to test LSIs in an unpackaged state, that is, in a bare chip or wafer state (KGD: K
nown Good Die)

[0004] However, these bare chip and wafer electrodes have a narrow pitch and require a large number of contacts, especially for the wafer. Therefore, mechanical individual springs are required as in conventional sockets and needle-type probe cards. A contactor that incorporates it cannot technically respond. Also, LC
The pitch of the terminals of D is also becoming narrower and the number of terminals is enormous. Therefore, it has been desired to provide a contactor for electronic components that can collectively contact these devices.

[0005]

2. Description of the Related Art A membrane type contactor has been proposed as a contactor for electronic parts capable of making a collective contact with a device (LSI, LCD, etc.) in a bare chip or wafer state. 1 and 2 show membrane type contactors 1A and 1B as an example of the related art.
A membrane type contactor 1A shown in FIG. 1 is a contactor for an electronic component corresponding to a device 3A (electronic component) having a flat electrode 2, and a membrane type contactor 1B shown in FIG. It is a contactor for electronic parts corresponding to (electronic parts).

[0006] The membrane type contactors 1A, 1B
Is formed on an electrically insulating substrate 5 such as polyimide (P1).
A pad (not shown) of a metal layer such as u is formed, and contact electrodes 6A and 6B are formed thereon. In the membrane type contactor 1A, since the device 3A has the flat electrode 2, the contact electrode 6A is a protruding electrode, and is formed by, for example, a plating method. In the membrane type contactor 1B, since the device 3B has the protruding electrode 4, the contact electrode 6B is a flat electrode.

For the contact electrodes 6A and 6B, copper (Cu) and nickel (Ni) are mainly used in many cases, but considering the performance as the contact electrodes 6A and 6B,
In general, gold (Au) plating is performed on the upper surface of Cu or Ni. Further, in order to exchange electric signals with a tester or the like for performing an operation test of the devices 3A and 3B, external connection terminals are provided on the outer peripheral portions of the membrane type contactors 1A and 1B. Further, a wiring layer (not shown) is provided on the electrically insulating substrate 5 in order to conduct the external connection terminals and the respective contact electrodes 6A and 6B.

[0008] These membrane type contactors 1A, 1
In the case of B, since the contact electrodes 6A and 6B are formed by using a plating technique, the pitch between the electrodes can be reduced, and the positional accuracy can be easily obtained. Further, since a large number of contact electrodes 6A and 6B can be formed at the same time and a wiring portion for fan-out is also provided, a narrow pitch device 3 is provided.
This is a very effective means for contacting and testing A and 3B.

[0009]

However, in the above-mentioned conventional membrane type contactors 1A and 1B, the individual contact electrodes 6A and 6A are affected by the rigidity of the electrically insulating substrate 5.
The movable range of 6B is narrow. This can be said for all the membrane type contactors, but the contact electrodes 6A, 6A
In the configuration in which B is formed on the electrically insulating substrate 5 having uniform rigidity, the individual contact electrodes 6A and 6B cannot move freely, and the adjacent contact electrodes 6A and 6B do not move.
It is easily affected by the positions of A and 6B.

That is, as shown in FIG. 1, when the height of the contact electrodes 6A on both sides adjacent to the contact electrode 6A-1 located at the center is high, or as shown in FIG. When the height of the protruding electrodes 4 on both sides adjacent to the protruding electrode 4-1 located at
A, 3B, the contact electrodes 6A on both sides or the protruding electrodes 4 are in contact with the central contact electrode 6A-1.
Alternatively, if it sinks below the protruding electrode 4-1, the central contact electrode 6A-1 and the protruding electrode 4-1 are forced to descend due to the bending of the electrically insulating substrate 5, and the contact electrode 6A-1 is lowered.
There is a possibility that electrical connection between the contact electrode 6A and the device 3A or between the bump electrode 4-1 and the contact electrode 6B may not be reliably established.

Further, since this problem becomes more pronounced as the electrode pitch becomes narrower, it is almost impossible to make stable contact with all the terminals unless some solution is taken into consideration, in order to further narrow the device pitch in the future. Become. On the other hand, when using the membrane type contactors 1A, 1B, the devices 3A,
Since the contact force with the 3B cannot be supported, it is generally backed up (reinforced) by an elastic reinforcing member such as rubber.

However, when the devices 3A and 3B contact the membrane type contactors 1A and 1B, the height of the protruding electrode 4 or the contact electrode 6A varies, and the electrically insulating substrate 5 is displaced unevenly as described above. In this case, the reinforcing member is also compressed and sinks, and a sufficient reinforcing effect cannot be obtained. That is, since the phenomenon of connection failure occurs twice in each of the electrically insulating substrate 5 and the reinforcing member, the reliability of electrical connection is extremely impaired.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and provides an electronic component contactor capable of reliably performing an electrical connection between an electronic component and a contact electrode even when the pitch between electrodes is reduced. With the goal.

[0014]

Means for Solving the Problems In order to solve the above problems, the present invention is characterized by taking the following means. The invention according to claim 1 includes an electrical insulating substrate, and a contact electrode provided at a position corresponding to a terminal forming position of the electronic component on the electrical insulating substrate, wherein the contact electrode is in contact with the terminal of the electronic component. Thus, in the electronic component contactor that obtains electrical connection, the electrical insulating substrate has a displacement portion configured to be easily displaceable, and a non-displacement portion configured to be hardly displaced with respect to the displacement portion. Is provided.

According to a second aspect of the present invention, in the contactor for an electronic component according to the first aspect, the displacement portion is displaced by providing an opening between the adjacent contact electrodes of the electrically insulating substrate. It is characterized in that it has a possible configuration. According to a third aspect of the present invention, in the contactor for an electronic component according to the first or second aspect, a wiring layer is formed on a surface of the electrically insulating substrate opposite to a surface on which the contact electrodes are provided. It is characterized by being done.

According to a fourth aspect of the present invention, in the contactor for an electronic component according to the third aspect, the opening is formed through the wiring layer together with the electrically insulating substrate. It is assumed that. According to a fifth aspect of the present invention, in the contactor for an electronic component according to any one of the second to fourth aspects, the opening is any one of a slit, an oblong hole, and a rectangular cut. It is characterized by having a configuration.

According to a sixth aspect of the present invention, in the electronic component contactor according to any one of the second to fourth aspects, the opening is formed along the outer periphery of the contact electrode. Is what you do. According to a seventh aspect of the present invention, in the electronic component contactor according to any one of the second to fourth aspects, the opening is constituted by a plurality of small openings provided for each of the contact electrodes. It is characterized by having.

According to an eighth aspect of the present invention, in the contactor for an electronic component according to the first aspect, the displacement portion has an opening at a position facing the contact electrode on the electrically insulating substrate. It is characterized by being configured to be displaceable.

According to a ninth aspect of the present invention, in the electronic component contactor according to the eighth aspect, a wiring layer is provided on a surface of the electrically insulating substrate opposite to a surface on which the contact electrodes are provided. It is characterized by being formed. According to a tenth aspect of the present invention, in the contactor for an electronic component according to the ninth aspect, the opening is formed through the wiring layer together with the electrically insulating substrate. It is.

According to an eleventh aspect of the present invention, in the contactor for an electronic component according to any one of the eighth to ninth aspects, the opening is provided across a plurality of the contact electrodes. It is a feature.
According to a twelfth aspect of the present invention, in the contactor for an electronic component according to the first aspect, the displacement portion can be displaced by providing a thin portion between the adjacent contact electrodes of the electrically insulating substrate. It is characterized by that.

According to a thirteenth aspect of the present invention, in the electronic component contactor according to the twelfth aspect, the thin portion includes a first concave portion provided on a surface of the electrically insulating substrate on which the contact electrode is provided. And a second concave portion provided on the opposite surface.

According to a fourteenth aspect of the present invention, in the contactor for an electronic component according to the twelfth aspect, the displacement portion is provided with a thin portion at a position facing the contact electrode on the electrically insulating substrate. It is characterized by being configured to be displaceable.

According to a fifteenth aspect of the present invention, in the contactor for an electronic component according to the first aspect, the displacement portion changes a physical characteristic between the adjacent contact electrodes of the electrically insulating substrate. Characterized in that it is configured to be displaceable.

According to a sixteenth aspect of the present invention, in the contactor for an electronic component according to the first aspect, the physical characteristics are changed so that the position between the adjacent contact electrodes on the electrically insulating substrate is in a softened state. In this case, the displacement portion is formed, and the non-displacement portion is formed by changing physical characteristics so that a position facing the contact electrode is in a hardened state.

According to a seventeenth aspect of the present invention, in the contactor for an electronic component according to the fifteenth or sixteenth aspect, the displacement is achieved by selectively irradiating light with a photosensitive resin as the electrically insulating substrate. Only the portion is changed to a displaceable characteristic.

The invention according to claim 18 is the contactor for an electronic component according to any one of claims 1 to 17, wherein the electrical insulating substrate has the contactor on the side opposite to the contact electrode side. A reinforcing member for reinforcing the electrical insulating substrate with respect to a contact pressure at the time of mounting the electronic component is provided.

According to a nineteenth aspect of the present invention, in the contactor for an electronic component according to the eighteenth aspect, the reinforcing member is made of an elastic body.
According to a twentieth aspect of the present invention, in the electronic component contactor according to the eighteenth or nineteenth aspect, the reinforcing member forms a recess at a portion corresponding to the displacement portion formed on the electrically insulating substrate. In addition, a configuration is provided in which a convex portion that contacts the non-displaceable portion is formed at a portion facing the non-displaceable portion.

According to a twenty-first aspect of the present invention, in the contactor for an electronic component according to the eighteenth or nineteenth aspect, a large number of openings are formed in the reinforcing member, and the reinforcing member affects the movement of the contact electrode. Instead, the electrically insulating substrate is configured to be uniformly reinforced.

According to a twenty-second aspect of the present invention, in the contactor for an electronic component according to the eighteenth or nineteenth aspect, the reinforcing member is formed of an elastic thin-film tubular elastic body, and the inside of the tubular elastic body is formed. Wherein the fluid pressure is to reinforce the electrically insulating substrate.

According to a twenty-third aspect of the present invention, in the electronic component contactor according to any one of the first to seventeenth aspects, the electrical insulating substrate is provided on a side opposite to a contact side with the electronic component, A wiring board having a conductive pad is provided at a position corresponding to the position of the contact electrode.

According to a twenty-fourth aspect of the present invention, in the contactor for an electronic component according to the twenty-third aspect, an anisotropic conductive elastic body is provided as a reinforcing member between the electrically insulating substrate and the wiring substrate. It is characterized by having.
Each of the means described above operates as follows.

According to the first aspect of the present invention, a displacing portion configured to be easily displaceable on an electrical insulating substrate having a contact electrode provided at a terminal forming position of an electronic component; The provision of the non-displaceable portion, which is configured to be difficult to be displaced, makes it possible to partially change the rigidity of the insulating substrate, thereby facilitating displacement of the individual contact electrodes.

Therefore, even if the contact electrode or the terminal of the electronic component has a variation in height, the variation can be absorbed by displacing the electrically insulating substrate (displacement portion). The contact electrode can be connected in a uniform state. According to the second aspect of the present invention, the position between the contact electrodes is displaced with respect to the non-displacement portion by providing the opening between the adjacent contact electrodes of the electrically insulating substrate to form the displacement portion. It will be easier. That is, each contact electrode can be displaced without affecting adjacent contact electrodes.

Therefore, even if the contact electrode or the terminal of the electronic component has a variation in height and a specific contact electrode is largely displaced and the electrically insulating substrate is greatly displaced accordingly, the displacement located between the contact electrodes is displaced. This large displacement is absorbed in the portion, and it is possible to prevent adjacent contact electrodes from being displaced in conjunction with each other. Therefore,
Even if the height of the contact electrode or the terminal of the electronic component varies, the electronic component and each contact electrode can be stably connected in a uniform state, and the connection reliability can be improved. .

According to the third and ninth aspects of the present invention, the wiring layer is formed on the surface of the electrically insulating substrate opposite to the surface on which the contact electrodes are provided, so that the contact electrodes are narrowed. Even with the pitch, the pattern of the wiring layer can be configured with a degree of freedom. According to the fourth and tenth aspects of the present invention, since the opening is formed through the wiring layer together with the electrically insulating substrate, it is possible to prevent the wiring layer from hindering the displacement of the displacement portion. Therefore, the electrical connection between the electronic component and the contact electrode can be more reliably performed while maintaining the degree of freedom in the pattern design of the wiring layer.

According to the fifth aspect of the present invention, the displacement portion can be easily formed by using any one of a slit, an oval hole, and a rectangular notch. it can. Also, by appropriately adjusting the length of the slit, the major and minor diameters of the oblong hole, and the size of the rectangular cut, the displacement amount of the displacement portion can be arbitrarily adjusted.

According to the sixth aspect of the present invention, since the openings are formed along the outer periphery of the contact electrodes, the terminals of the electronic component are arranged in a matrix, and therefore, the terminals are adjacent to one contact electrode. Even if the contact electrodes are arranged so as to surround them, the one contact electrode can be freely displaced without being restricted by the adjacent contact electrodes. Thereby, the electrical connection between the contact electrode and the terminal of the electronic component is more reliably performed,
Reliability can be improved.

According to the seventh aspect of the present invention, since the openings are constituted by a plurality of small openings provided for each contact electrode, the displacement amount of the displacement portion can be arbitrarily determined according to the number of the small openings. It becomes possible to adjust to. Further, according to the invention described in claim 8, since the displacement section is configured to be displaceable by providing an opening at a position facing the contact electrode of the electrically insulating substrate, when the displacement section is displaced, Since the contact electrode is displaced together with the electrically insulating substrate, variations in the contact electrode or the terminal of the electronic component can be reliably absorbed. Therefore, the electrical connection between the contact electrode and the terminal of the electronic component can be reliably performed.

According to the eleventh aspect of the present invention, since the opening is provided so as to straddle the plurality of contact electrodes, the processing of the opening can be performed as compared with the case where the opening is formed for each contact electrode. This can be easily performed, and the electrical insulating substrate between adjacent contact electrodes is removed, so that the electrical insulating substrate can be more flexibly displaced.

According to the twelfth aspect of the present invention, the displacement portion is formed by providing the thin portion between the adjacent contact electrodes of the electrically insulating substrate, so that the height of the contact electrode or the terminal of the electronic component is increased. Even if there is such a variation, the variation can be absorbed by the displacement of the thinned displacement portion, so that the electronic component and each contact electrode can be connected in a uniform state.

When an opening is formed, a wiring layer cannot be formed at a position where a displacement portion is formed, but since a wiring layer can be formed on a thin portion, an area for forming a wiring layer can be formed. Degree of freedom can be improved. Further, the configuration of the present invention is effective when the pitch between the contact electrodes is narrow, and it is difficult to form an opening penetrating the electrically insulating substrate.

According to the thirteenth aspect of the present invention, the thin portion is formed by providing the first concave portion on the contact electrode disposing surface of the electrically insulating substrate and providing the second concave portion on the opposite side surface. This results in a configuration in which the portion other than the portion where the contact electrode is provided is recessed. For this reason, it is possible to prevent the electrically insulating substrate from coming into contact with a portion (circuit surface or the like) other than the electrode formation of the electronic component on the upper surface serving as the contact electrode disposition surface. On the lower surface, when the reinforcing member is provided on the electrically insulating substrate, the electrically insulating substrate and the reinforcing member are in partial contact, and the pressure can be efficiently transmitted to the contact electrode.

According to the fourteenth aspect of the present invention, the displacement portion is formed by providing the thin portion at a position facing the contact electrode of the electrically insulating substrate, so that the displacement portion is formed together with the electrically insulating substrate. The displacement of the contact electrode can absorb variations in the contact electrode or the terminal of the electronic component. Therefore, the electrical connection between the contact electrode and the terminal of the electronic component can be reliably performed. In addition, since the contact electrode can be formed on the thin portion, the degree of freedom in setting the size and arrangement position of the contact electrode can be increased as compared with the configuration in which the contact electrode is formed on the opening.

According to the fifteenth aspect of the present invention, the displacement portion is formed by changing physical characteristics between adjacent contact electrodes of the electrically insulating substrate.
The displacement portion can be displaced without forming an opening or a thin portion in the electrically insulating substrate, and therefore, the electrically insulating substrate having the displacement portion and the non-displacement portion can be easily formed.

Further, since there is no unevenness on both the upper surface and the lower surface of the electrically insulating substrate, the degree of freedom in forming a wiring layer pattern can be further improved. Furthermore, since the electrically insulating substrate has a uniform thickness over the whole, the handleability can be improved. Claim 1
According to the invention described in claim 6, physical properties are changed so that a position between adjacent contact electrodes of the electrically insulating substrate is in a softened state, a displacement portion is formed, and a position facing the contact electrode is in a hardened state. Even if the contact electrode or the terminal of the electronic component has a variation in height due to the formation of the non-displacement portion by changing the physical characteristics, the variation is absorbed by the displacement of the softened displacement portion. This makes it possible to connect the electronic component and each contact electrode in a uniform state. Also,
Since the non-displacement portion provided at a position facing the contact electrode is in a hardened state, the connection between the contact electrode and the electronic component can be reliably performed.

According to the seventeenth aspect of the present invention, a photosensitive resin is used as the electrically insulating substrate, and only the displacement portion is changed to a displaceable characteristic by selectively performing light irradiation. Accordingly, the photolithography technique can be used, and thus the displacement portion and the non-displacement portion can be easily and accurately formed.

According to the eighteenth and nineteenth aspects of the present invention, the electrically insulating substrate is provided on the side of the electrically insulating substrate opposite to the contact electrode side with respect to the contact pressure at the time of mounting the electronic component. By providing the reinforcing member for reinforcement, the electrical connection between the contact electrode and the electronic component can be more reliably performed. That is, in general, only the rigidity of the electrically insulating substrate does not have enough rigidity to receive a contact force with the electronic component, and thus there is a possibility that a reliable connection may not be performed. However, by arranging a reinforcing member made of an elastic material such as rubber on the back side of the electrically insulating substrate (the side opposite to the side where the contact electrodes are provided), it is possible to reliably receive the contact force with the electronic component. In addition, the electrical connectivity between the contact electrode and the electronic component can be improved.

According to the twentieth and twenty-first aspects of the present invention, a recess or an opening is formed in a portion of the reinforcing member corresponding to the displacement portion, and a projection is formed in a portion facing the non-displacement portion. Thus, the reinforcing member can be displaced following the displacement of the electrically insulating substrate. That is, as described above, by forming the displacement portion and the non-displacement portion on the electrically insulating substrate, the displacement portion is displaced in accordance with the variation in the height of the contact electrode or the terminal of the electronic component. Reliable connection between the contact electrode and the electronic component can be achieved regardless of the variation. Therefore, when the reinforcing member is provided, if the reinforcing member inhibits the displacement of the displacement portion, the electrical connection between the contact electrode and the electronic component may not be properly established.

However, by forming a concave portion or an opening in a portion corresponding to the displacement portion of the reinforcing member and forming a convex portion in a portion facing the non-displacement portion, the reinforcing member follows the electrically insulating substrate. As a result, the electrically insulating substrate can be uniformly reinforced, and the electrical connection between the contact electrode and the electronic component can be reliably performed.

According to the twenty-second aspect of the present invention, the reinforcing member is formed of a thin film tubular elastic body having elasticity, and the electrically insulating substrate is reinforced by the fluid pressure inside the tubular elastic body. Thus, by adjusting the pressure of the internal fluid (including gas and liquid), the contact force acting between the contact electrode and the terminal of the electronic component can be adjusted. In addition, regarding the height variation of the contact electrode or the terminal of the electronic component,
Since it is absorbed by the elastic deformation of the tubular elastic body, electrical connection between the contact electrode and the electronic component can be reliably performed.

According to the twenty-third aspect of the present invention, a wiring board having a conductive pad at a position corresponding to a position of a contact electrode is provided on a side of an electrically insulating substrate opposite to a side of contact with an electronic component. With the provision, the wiring does not need to be routed on the electrically insulating substrate, and the contact electrodes can be arranged at a higher density.

When the wiring layer is routed on the electrically insulating substrate, the rigidity is increased by the thickness of the wiring layer, and the flexibility of the electrically insulating substrate is impaired. However, by providing the wiring substrate, it is not necessary to provide a wiring layer on the electrically insulating substrate, and the flexibility of the electrically insulating substrate can be secured. Further, since the wiring board is not provided with an opening or the like, the degree of freedom of wiring can be improved as compared with a configuration in which wiring is formed in an electrically insulating substrate.

According to the twenty-fourth aspect of the present invention, since the anisotropic conductive elastic body functioning as a reinforcing material is provided between the electrically insulating substrate and the wiring board, the wiring board has high warpage or the like. Even if there is a variation, the height variation can be absorbed by the elastic deformation of the anisotropic conductive elastic body. In addition, since the anisotropic conductive elastic body functions very much as a reinforcing member of the electrically insulating substrate, even if the contact electrode or the terminal of the electronic component has a variation in height,
This variation can be absorbed by the displacement of the anisotropic conductive elastic body, so that the electronic component and each contact electrode can be reliably connected.

[0054]

Next, embodiments of the present invention will be described with reference to the drawings. 3 and 4 show the first embodiment of the present invention.
1 illustrates an electronic component contactor 10-1 (hereinafter simply referred to as a contactor) according to an embodiment. FIG. 3 is a side sectional view of the contactor 10-1, and FIG. 4 is a contactor 10 with an electronic component 14A (hereinafter, referred to as a device) mounted thereon.
-1. Contactor 10-1 according to the present embodiment
Is roughly composed of an electrically insulating substrate 11-1 (hereinafter simply referred to as an insulating substrate) and a contact electrode 12A.

As shown, the contactor 10-1 has a semiconductor device 14A such as an LSI mounted thereon, and is used when an electrical operation test is performed on the device 14A in this mounted state. In the following description, an example in which the semiconductor devices 14A and 14B are used as electronic components will be described. However, the contactors described in the embodiments below have various types having flat or spherical connection terminals as external connection terminals. It can be applied to inspection of electronic components.

Hereinafter, a specific configuration of the semiconductor inspection apparatus 10A will be described. The insulating substrate 11-1 is a film-like member formed of an insulating resin material such as polyimide and has a slight flexibility. For example, copper (C) is provided on the surface of the insulating substrate 11-1 on the side on which the device 14A is mounted.
A pad 13 made of u) is formed, and a projecting contact electrode 12A is formed on the pad 13.

The contact electrode 12A is accurately formed at a position opposed to the formation position of the flat electrode 15 formed on the device 14 by using, for example, a plating method, a vapor deposition method, a sputtering method, or the like. The material of the contact electrode 12A is, for example, copper (C
u) and nickel (Ni) can be used, and in order to further improve the electrical connectivity, the surface of the base made of copper or nickel is plated with gold (Au).

On the other hand, a plurality of openings 20-1 are formed in the insulating substrate 11-1, and the formation position of the openings 20-1 is set at a position between the contact electrodes 12A. . As a specific method for forming the opening 20-1, a laser method, an etching method, a press punching method, or the like can be used. The use of the laser method is advantageous when the opening 20-1 having a narrow width and a small diameter is provided. This is because the cross section of the opening is tapered (pulled taper) in another forming method, whereas the cross section of the opening is a vertical surface when the laser method is used. However, in terms of processing cost, the laser method forms the individual openings 20-1 one by one, so the processing efficiency is poor, and is higher than other methods that can form a plurality of openings 20-1 collectively. There are disadvantages.

In the etching method, the opening 20-1 having a narrow pitch or a narrow width which cannot be handled by press working.
It is advantageous when forming. Also, unlike the laser method described above, a large number of openings 20 are provided between the contact electrodes 12A.
Since −1 can be collectively formed, it is possible to propose a processing cost. However, the cross section of the opening 20-1 provided by the etching method has a tapered shape in which the etching start direction is wide and the end surface is narrow, as in the contactor 10-3 shown in FIG. 7A. This is an example in which etching is started from the lower surface side of the substrate 11-2). For this reason, when the pitch between the contact electrodes 12A becomes a certain narrow pitch (specifically, when the pitch becomes close to the thickness of the insulating substrate 11-2), adjacent openings 20-2 are connected by the etching method. This impairs the function of the contactor 10-1. That is, the back surface of the contactor 10-1 is not a flat surface, but has only an uneven surface or a ridgeline.

To avoid this problem, FIG.
As shown in the contactor 10-4 shown in FIG. 8B, the opening 2 is formed by performing etching from both sides of the insulating substrate 11-3.
0-3 or a method of alternately changing the front and back sides of the insulating substrate 11-5 for each opening 20-4 as in a contactor 10-5 shown in FIG. 7C. Can be considered.

In the press punching method, the pitch between the contact electrodes 12A is wide and the width (diameter) of the opening 20-1 is large.
It can be applied when there is no problem even if is large. Since the processing cost is inexpensive, the pitch which can be used for this method is the most advantageous method. By providing the opening 20-1 as described above, the portion of the insulating substrate 11-1 where the opening 20-1 is formed, that is, the position between the contact electrodes 12A is easily displaced (deformable). Becomes That is, by providing the opening 20-1, the insulating substrate 11-1 is easily displaced by a displacement portion (this displacement portion corresponds to the position where the opening portion 20-1 is formed. Part 2
0-1) and the opening 2
0-1 which is hardly displaced with respect to 0-1 (in this embodiment, the position immediately below the contact electrode 12A is
0-1).

With the configuration of this embodiment, the flat electrode 1 of the contact electrode 12A or the device 14A can be formed.
Even if there is a variation in the height of the terminal 5 (terminal), the electrical connection between the contact electrode 12A and the device 14A can be reliably achieved. Hereinafter, this will be described. Here, an example in which the height of the contact electrode 12A formed on the insulating substrate 11-1 varies as shown in FIG. 3 will be described. In the example shown in FIG. 3, the height of the contact electrode 12A-1 located at the center is lower than that of the contact electrodes 12A located on both sides by Δh1. In such a case, when the contactor 1A of the conventional configuration (the configuration in which the opening 20-1 is not provided) shown in FIG.
As described above, -1 cannot be connected to the device 3A.

However, by providing the opening 20-1 functioning as a displacement portion between the contact electrodes 12A, as shown in FIG. 4, the specific contact electrode 12A (the contact electrode on both sides of the contact electrode 12A-1) is provided. ) Is greatly displaced and the insulating substrate 11-1 is greatly displaced accordingly, the large displacement is absorbed by the openings 20-1 (displacement portions) located between the contact electrodes 12A.

That is, the contact electrodes 12A-
1 are displaced more than the openings 20-1 in other portions (the amount of displacement is indicated by an arrow ΔH1 in the figure), and the adjacent contact electrodes 12 are displaced.
A-1 can be prevented from interlockingly displacing. Note that, in the above example, an example in which the height variation exists in the contact electrode 12A is shown, but the same applies when the height variation exists in the flat electrode 15 of the device 14A.

Therefore, even if the contact electrode 12A or the flat electrode 15 of the device 14A has a variation in height, the contactor 10-1 according to the configuration of the present embodiment is provided.
According to this, the individual contact electrodes 12A can be independently displaced by the openings 20-1. Therefore, the contact electrode 12A and the device 14A can be stably connected in a uniform state, and the connection reliability can be improved.

Next, a second embodiment will be described. FIG.
FIG. 6 shows a contactor 10-2 according to a second embodiment. FIG. 5 is a side sectional view of the contactor 10-2, and FIG. 6 shows the contactor 10-2 with the device 14B mounted. 5 and 6, the same components as those of the contactor 10-1 according to the first embodiment described with reference to FIGS. 3 and 4 are denoted by the same reference numerals, and description thereof will be omitted. The same applies to the embodiments described below.

In the first embodiment, the device 14A
Are formed by the flat electrode 15, and
Therefore, in order to improve the connectivity, the contactor 10-1 is formed with the protruding contact electrode 12A. On the other hand, the device 14B which is the object of this embodiment
Are configured to have protruding electrodes 16 (bumps) as connection terminals.

For this reason, the contactor 10 according to the present embodiment
No. -2 has a configuration in which a flat contact electrode 12B is formed on the insulating substrate 11-1. Further, the contactor 10-2 according to the present embodiment includes the opening 20-1 (displacement portion) and the non-displacement portion 3 in the insulating substrate 11-1 similarly to the first embodiment.
0-1. By the way, it is known that in the device 14B having the protruding electrodes 16, the height of the protruding electrodes 16 tends to vary (indicated by an arrow Δh2 in FIG. 5). However, by using the insulating substrate 11-1 having the opening 20-1 as in the present embodiment, as shown in FIG. 6, the specific projection electrode 16 (the projections on both sides of the projection electrode 16-1) can be formed. Electrode) to the insulating substrate 11
−1 is greatly displaced, the displacement is
The openings 20-1 (displacement portions) formed on both sides of the contact electrode 12B connected to the contact electrode 12B are absorbed by a large displacement (this displacement is indicated by an arrow ΔH2 in FIG. 6).

Therefore, even if the projection electrode 16 has a height variation, the contactor 10-2 according to the configuration of the present embodiment can be used.
According to this, the contact electrodes 12B are individually and independently displaced by the presence of the openings 20-1. Therefore, the contact electrode 12B and the device 14B (the protruding electrode 16) can be stably connected in a uniform state, and the connection reliability can be improved.

Next, a third embodiment will be described. FIG. 8 shows a contactor 10-6 according to the third embodiment. The contactor 10-6 according to the present embodiment includes an insulating substrate 1
The surface opposite to the surface on which the contact 1-5 and the electrode 12B are formed (hereinafter referred to as the upper surface) (hereinafter referred to as the lower surface)
In addition, a wiring layer 21A is formed. The wiring layer 21A and the contact electrode 12B are
1-5 are electrically connected to each other by a via 22 penetrating vertically.

The opening 20-1 functioning as a displacement portion is formed in the insulating substrate 11-5 as in the above-described embodiments. In this embodiment, the opening 20-1 of the wiring layer 21A is formed. The wiring layer opening 23 is also formed at a position opposing the wiring layer opening 1, so that the opening 20-1 and the wiring layer opening 23 are formed.
Form an opening vertically penetrating the insulating substrate 11-5 by being continuous.

Since the wiring layer 21A is formed on the lower surface of the insulating substrate 11-5 as in this embodiment, the contact electrode 12B does not exist on the lower surface, so that the pattern of the wiring layer 21A can be set arbitrarily. it can. An opening 20-1 is formed in the insulating substrate 11-5, and the wiring layer 2 is formed.
By forming the wiring layer opening 23 also in 1A, the wiring layer 23 is displaced (that is, the opening 20 of the insulating substrate 11-5).
(A part where −1 is formed) can be prevented. Therefore, the electrical connection between the device 14B and the contact electrode 12B can be performed more reliably while maintaining the degree of freedom in the pattern design of the wiring layer 21A.

FIG. 9 shows a contactor 10-7 according to a fourth embodiment. Contactor 10 according to the present embodiment
-7 is the contactor 10-6 of the third embodiment described above.
And the configuration is substantially the same. However, the contactor 10-6 according to the third embodiment also includes the wiring layer opening 2 in the wiring layer 21A.
3, the contactor 10-7 according to the present embodiment has a different configuration in that no opening is formed in the wiring layer 21B. That is, the contactor 10-7 of the present embodiment has the opening 20- through the wiring layer 21B.
1 has a closed bottom.

In the contactor 10-7 according to the present embodiment, since the formation position of the opening 20-1 is also used as the wiring area as described above, the degree of freedom of the arrangement pattern of the wiring layer 21B can be further improved. it can. However, the opening 20-
By forming the wiring layer 21B also in the first
The displacement of the insulating substrate 11-6 (displacement portion) in the vicinity of the position where the −1 is formed is inferior to that of the third embodiment. However, when the displacement amount required for the contactor 10-7 is small, this embodiment is not applicable. The example configuration is more advantageous. In addition, by setting the thickness of the wiring layer 21B to be smaller than the thickness of the insulating substrate 11-6, the displacement of the displacement portion can be secured.

Next, a fifth embodiment will be described. FIG. 10 shows a contactor 10-8 according to a fifth embodiment. FIG. 10A is an enlarged plan view showing a main part of the contactor 10-8, FIG. 10B is a sectional view taken along line Y1-Y1 in FIG. 10A, and FIG. )
FIG. 11 is a sectional view taken along line X1-X1 in FIG.

The contactor 10-8 according to the present embodiment is characterized in that the opening 20-5 is formed by a slit. Opening 20-5 consisting of this slit
Are formed at positions between the contact electrodes 12A so as to be substantially parallel to the extending direction of the wiring pattern 17 connected to the contact electrodes 12A. Therefore, the opening 20-5
Is not obstructed by the wiring pattern 17 even if it is formed long.

By the way, the opening 20-
5 is the length of the insulating substrate 11-
7, the longer the opening 20-5 (ie, the larger the opening area), the larger the displacement of the insulating substrate 11-7. However, the contact electrode 12A
As described above, the pitch between them tends to be narrow, and it is difficult to increase the width in the direction in which the contact electrodes 12A are arranged. This is particularly noticeable in the devices 14A and 14B whose terminal structures are peripherals.

However, by forming the opening 20-5 in a slit shape, the pitch between the adjacent contact electrodes 12A can be narrowed and the displacement amount of the displacement portion of the insulating substrate 11-7 can be increased. Also, by appropriately adjusting the length of the slit, the displacement amount of the displacement portion can be arbitrarily adjusted. Further, the opening 20
−5 There are various methods for forming the (slit) as described above.
5 can be easily and accurately formed.

Therefore, as in the present embodiment, the opening 20-5 is used.
Is constituted by slits, the insulating substrate 11
It is possible to reduce the pitch of the contact electrodes 12A while securing the displacement at the displacement portion (position near the opening 20-5) indicated by -7. The shape of the opening 20-5 is not limited to the slit, and the same effect can be achieved by using an oval hole or a rectangular cut.

Next, a sixth embodiment will be described. FIG. 11 shows a contactor 10-9 according to a sixth embodiment. FIG. 11A is a plan view of a main part of the contactor 10-9, and FIG. 11B is a sectional view taken along line X2-X in FIG.
It is sectional drawing which follows a 2 line. Contactor 1 according to the present embodiment
0-9, the opening 20-6 is formed along the outer periphery of the contact electrode 12A. The opening 20-6 is formed so as to surround the contact electrode 12A except for the position where the wiring pattern 17 is formed.

According to the structure of this embodiment, the device 14
In a structure in which the flat electrodes 15 or the protruding electrodes 16 of A and 14B are arranged in a matrix (for example, an area bump structure), the electrical connection between the flat electrodes 15 and the protruding electrodes 16 and the contact electrodes 12A and 12B is ensured. Connection can be established. That is, in a configuration in which a contact electrode 12A adjacent to one contact electrode 12A is disposed so as to surround (surround) the periphery thereof, as in an area bump structure, etc. In such an opening, it is difficult to independently displace each contact electrode 12A.

However, as in the present embodiment, the opening 20
-6 is formed for each contact electrode 12A so as to surround the contact electrode 12A.
Can be freely displaced without being constrained by the adjacent contact electrode 12A. Therefore, according to the present embodiment, the contact electrode 12A and the device 14
A and 14B can be more reliably electrically connected to each other, so that the reliability of the electrical connection can be improved.

Next, seventh to ninth embodiments will be described. FIG. 12 shows contactors 10-10 to 10-12 according to the seventh to ninth embodiments. The contactors 10-10 to 10-12 according to the respective embodiments have openings 20-7 to 2-7.
0-9 is constituted by a plurality of small openings provided for each of the contact electrodes 12A and 12B.

In the contactor 10-10 according to the seventh embodiment shown in FIG. 12A, a plurality of (four in this embodiment) small holes are arranged between the contact electrodes 12A to form an opening 20-. 7 is constructed. FIG. 12B
The contactors 10-11 according to the eighth embodiment shown in FIG.
) To form the opening 20.
−8.

Further, the contactor 10-12 according to the ninth embodiment shown in FIG. 12C has a plurality of (four in this embodiment) small holes formed so as to surround the contact electrode 12B. This constitutes the section 20-9. In particular, the small hole indicated by arrow A in FIG. 12C functions as a common opening 20-9 of the adjacent contact electrode 12B.

Contactor 10 according to the seventh to ninth embodiments
With the configuration of -10 to 10-12, the same operation and effect as the contactor 10-9 according to the sixth embodiment described above can be realized, and each of 20-7 to 20-9 has a small opening. The displacement amount generated in the displacement portion can be adjusted by appropriately selecting the size and the number of the displacement portions. Therefore, devices 14A, 14
When B is mounted, the contact electrodes 12A and 12B and the electrodes 15 and 16 can be connected with a uniform contact pressure.

Next, a tenth embodiment will be described.
FIG. 13 shows a contactor 10-13 according to the tenth embodiment. FIG. 13A is a sectional view showing the contactor 10-13 before the device 14B is mounted.
(B) is the contactor 1 after the device 14B is mounted.
It is sectional drawing which shows 0-13.

In each of the above-described embodiments, the openings 20-1 to 20-9 constituting the displacement portion are formed in the insulating substrates 11-1 to 11-.
11 near the contact electrodes 12A and 12B (that is,
(A position different from the arrangement position of the contact electrodes 12A and 12B). On the other hand, in the contactor 10-13 according to the present embodiment, as shown in FIG.
An opening 20-10 is provided on the insulating substrate 11-12 at a position facing the contact electrode 12B. Therefore, in the contactor 10-13 according to the present embodiment,
The lower part of the arrangement position of the contact electrode 12B is a displacement part. Further, the contact electrode 12A has a structure arranged so as to cover the upper part of the opening 20-10.

According to the contactor 10-13 having the above configuration, as shown in FIG.
Is mounted, the position immediately below the contact electrode 12B in which the opening 20-10 is formed is displaced as a displacement portion, and the contact made of a metal film is displaced with the displacement of the insulating substrate 11-12. The electrode 12B is also displaced.

As described above, the contactor 1 according to the present embodiment
In the case of 0-13, the portion pressed by the device 14B (that is, the formation position of the contact electrode 12B) is directly displaced. Further, since this displacement is a displacement in which the displacement of the insulating substrate 11-12 and the displacement of the contact electrode 12B are overlapped, the displacement of the insulating substrate 11
The substantial displacement can be increased as compared with the displacement of −12 alone. Therefore, the height variation of the contact electrode 12B or the protruding electrode 16 can be reliably absorbed, and the electrical connection between the contact electrode 12B and the device 14B can be reliably performed.

Next, the eleventh and twelfth embodiments will be described. FIG. 14 shows a contactor 10 according to an eleventh embodiment.
FIG. 15 is a sectional view showing -14, and FIG. 15 is a sectional view showing a contactor 10-15 according to the twelfth embodiment. Each drawing shows a state where the device 14B is mounted.
The configuration according to the present embodiment is different from the contactor 10-according to the third and fourth embodiments described above with reference to FIGS. 8 and 9.
The configuration is similar to that of 6, 10-7. That is, the third
In the contactors 10-6 and 10-7 according to the fourth embodiment, the wiring layers 21 are formed on the lower surfaces of the insulating substrates 11-5 and 11-6 in which the openings 20-1 are formed between the contact electrodes 12B.
A and 21B were formed.

On the other hand, the contactors 10-14 and 10-15 according to the eleventh and twelfth embodiments have the
It is characterized in that wiring layers 21A and 21B are formed on the lower surfaces of insulating substrates 11-13 and 11-14 having openings 20-10 formed at positions facing 2B. The contactor 10-14 according to the eleventh embodiment has the wiring layer 21B formed so as to cover the opening 20-10, and the contactor 10-15 according to the twelfth embodiment has the opening 20 formed in the wiring layer 21A.
A wiring layer opening 23 communicating with −10 is formed.

Therefore, according to the contactors 10-14 and 10-15 according to the eleventh and twelfth embodiments, the insulating substrate 11-
By forming the wiring layers 21A and 21B on the lower surfaces of the layers 13 and 11-14, the patterns of the wiring layers 21A and 21B can be set arbitrarily. According to the contactor 10-15 according to the twelfth embodiment, the opening 20-10 is formed in the insulating substrate 11-13, and the wiring layer opening 23 is formed in the wiring layer 21A. 23 can be prevented from hindering the displacement of the displacement portion (that is, the portion of the insulating substrate 11-13 where the opening 20-10 is formed).

As described above, even in the configuration in which the opening 20-10 is provided at a position facing the contact electrode 12B,
The wiring layers 23A, 23A are provided on the lower surfaces of the insulating substrates 11-13, 11-14.
3B can be formed, the degree of freedom of wiring can be improved, and the contact electrodes 12B can be formed.
It is possible to cope with high density of B. Then, the first
Three embodiments will be described.

FIG. 16 is an enlarged perspective view showing a main part of a contactor 10-16 according to the thirteenth embodiment. The contactor 10-16 according to the present embodiment is characterized in that the opening 20-11 is provided so as to straddle the plurality of contact electrodes 12A. In the example shown in FIG.
Is the insulating substrate 1 so as to straddle the two contact electrodes 12A.
1-15. Thus, the insulating substrate 11-
By forming the openings 20-11 so as to straddle the plurality of contact electrodes 12A in the opening 15, the openings 20-11 are formed as compared with forming the openings for each individual contact electrode 12A.
Can be easily processed.

Further, since the electrically insulating substrate between the adjacent contact electrodes 12A is removed, the insulating substrate 11-15 is removed.
Of the contact electrode 12A and the height variations of the electrodes 15 and 16 of the devices 14A and 14B can be reliably absorbed. Next, a fourteenth embodiment will be described.

FIG. 17 is a sectional view showing a contactor 10-17 according to a fourteenth embodiment. The contactor 10-17 according to the present embodiment is characterized in that a thin portion 25A is formed in the insulating substrate 11-16 by forming a concave portion 24A between adjacent contact electrodes 12A of the insulating substrate 11-16. It is. The concave portion 24A can be easily and accurately formed by using, for example, an etching method.

The thin portion 25A is configured to be easily displaced as compared with a thick portion where a concave portion is not formed (a position facing the contact electrode 12A). Therefore, the thin portion 25A constitutes a displacement portion. . Also, contact electrode 1
Since the thick portion opposed to 2A is hard to be displaced, it constitutes the non-displacement portion 30-13. Contactor 10 according to the present embodiment
According to -17, the contact electrode 12A or the device 1
Even if the electrodes 15 and 16 of the electrodes 4A and 14B have variations in height, the variations can be absorbed by the displacement of the thin portion 25A functioning as a displacement portion, and thus the devices 14A and 14B and the contact electrodes 12A can be absorbed. Can be connected in a uniform state.

Further, in the configuration in which the opening is formed in the insulating substrate as in each of the above-described embodiments, it is difficult to form the wiring layer at the position where the opening is formed, and even if the wiring layer is formed on the opening. Problems remain in terms of strength and the like. However, by using the thin portion 25A as a displacement portion as in this embodiment, a wiring layer can be formed on the thin portion 25A, and the degree of freedom of the wiring layer formation area can be improved.
The structure of the present embodiment is different from that of the adjacent contact electrode 12A.
This is effective when it is difficult to form an opening that penetrates the insulating substrate 11-16 because of the narrow pitch between them.

Next, a fifteenth embodiment will be described.
FIG. 18 is a sectional view showing a contactor 10-18 according to a fifteenth embodiment. Contactor 10-18 according to the present embodiment
Is formed by forming a first concave portion 26 on the surface of the electrically insulating substrate 11-17 on which the contact electrode 12A is provided, and by providing a second concave portion 27 on the opposite side.
B is formed. The first and second
The concave portions 26 and 27 can be easily and accurately formed by performing an etching process on both surfaces of the electrically insulating substrate 11-17 by using, for example, an etching method.

In the contactor 10-18 according to the present embodiment,
Except for the portion where the contact electrode 12A is provided, the configuration is concave. For this reason, on the upper surface on which the contact electrode 12A is provided, it is possible to prevent the insulating substrate 11-17 from coming into contact with a portion other than the electrode formation of the devices 14A and 14B (that is, a circuit surface or the like). Further, on the lower surface, as described in an embodiment to be described later, the insulating substrate 11-
When the reinforcing member is provided on 17 (see FIG. 21), the insulating substrate 11-17 and the reinforcing member are in partial contact, and the pressure can be efficiently transmitted to the contact electrode 12A. Therefore, the electrical connection between the devices 14A and 14B and the contact electrode 12A can be reliably performed. In this embodiment, the wiring layer (power supply,
This is effective in the case of having a GND layer).

Next, a sixteenth embodiment will be described.
FIG. 19 is a sectional view showing a contactor 10-19 according to a sixteenth embodiment. The present embodiment is characterized in that a concave portion 24C is formed at a position facing the contact electrode 12B of the insulating substrate 11-18, thereby forming a thin portion 25C serving as a displacement portion. The recess 24C can also be easily and accurately formed by etching or the like.

As in the present embodiment, the device 14B is mounted and the contact electrode 12B is pressed by the protruding electrode 16 by forming the thin portion 25C at a position facing the contact electrode 12B on the insulating substrate 11-18. Then, the contact electrode 12B is displaced together with the thin portion 25C, so that the height variation of the contact electrode 12B and the protruding electrode 16 can be absorbed.

Further, the contact electrode 1 is formed on the thin portion 25C.
2B can be formed, so that the first
Compared to the contactor 10-13 according to the zeroth embodiment, the degree of freedom in setting the size and arrangement position of the contact electrode 12B can be increased. In the configuration of the present embodiment, the area of the thin portion 25C can be set to be larger than the size (diameter) of the contact electrode 12B, and thus the displacement of the thin portion 25C functioning as a displacement portion is increased. It is possible. Therefore, the projection electrode 16 and the contact electrode 12
Variations in the height of B can be more reliably absorbed, and stable electrical connection can be achieved.

Next, a seventeenth embodiment will be described.
FIG. 20 shows a contactor 10-20 according to a seventeenth embodiment, and FIG. 20A is a cross-sectional view showing the contactor 10-20 with the device 14A mounted.
(B) is an enlarged perspective view showing a main part of the contactor 10-20. The contactor 10-20 according to the present embodiment uses TAB (Tape Automated Bonding) as the insulating substrate 11-19.
It is characterized by using a tape material. This T
The most typical TAB tape material composed of a polyimide (P1) film having a thickness of 50 μm and a wiring layer formed of a copper (Cu) film having a thickness of 18 μm is used as the AB tape material. Is possible.

Using this TAB tape material, a contactor 10-20 having an opening 20-1 as shown in FIG.
As a result, the effect of absorbing the variation in height of the contact electrode 12A and the like was confirmed. According to the present embodiment,
In order to use the TAB tape material of the above configuration that is easily available,
The contactors 10-20 can be manufactured at low cost. Next, an eighteenth embodiment will be described.

As shown in FIG. 21, the contactor 10-21 according to the present embodiment has a reinforcing member 31-1 on the surface (lower surface) of the insulating substrate 11-1 opposite to the upper surface on which the contact electrodes 12A are formed. Is provided.
The reinforcing member 31-1 is formed of an elastic material such as rubber, for example, and has a function of reinforcing the insulating substrate 11-1 against contact pressure when the devices 14A and 14B are mounted.

Generally, the stiffness of the insulating substrate 11-1 made of a resin such as polyimide alone is not enough for the devices 14A and 14A.
Since there is not enough rigidity to receive the contact force with B, reliable connection may not be performed. This tendency is particularly strong in the insulating substrate 11-1 in which the opening 21-1 is formed. However, the contactor 10 according to the present embodiment
As shown in -21, by arranging a reinforcing member 31-1 made of an elastic body on the lower surface of the insulating substrate 11-1, the device 1
The contact force applied when mounting 4A, 14B is reliably received by reinforcing member 31-1 via insulating substrate 11-1. For this reason, compared to a configuration in which the contact force is received only by the insulating substrate 11-1, the contactor 10-
21 The contact electrode 12
The electrical connection between A and the devices 14A and 14B can be improved.

Next, an eighteenth embodiment and a nineteenth embodiment will be described. FIG. 22 is a sectional view showing a contactor 10-22 according to the eighteenth embodiment, and FIG.
It is sectional drawing which shows the contactor 10-23 concerning an Example.
Contactors 10-22 and 10-23 according to the respective embodiments are also
The reinforcing members 31-2 and 31-3 are provided on the lower surface of the insulating substrate 11-1.
Are provided to improve the rigidity of the contactor as a whole.

A contactor 10-22 according to the eighteenth embodiment
As shown in FIG. 22, a recess 32 was formed at a portion corresponding to the opening 20-1 of the reinforcing member 31-2, and a projection 33 was formed at a portion facing the non-displacement portion 30-1. It is characterized by the following. In this manner, by forming the concave portion 32 in a portion corresponding to the opening 20-1, the reinforcing member 31-2 can be displaced following the displacement of the insulating substrate 11-1.

That is, as described above, the displacement portion (opening portion 20-1) and the non-displacement portion 30-1 are formed in the insulating substrate 11-1 so that the contact electrode 12A and the like may have a height variation. Insulating substrate 1 with opening 20-1 formed
1-1 is displaced, whereby reliable electrical connection between the contact electrode 12A and the device 14A can be achieved regardless of the height variation. However, the reinforcing member 31-2
When this is provided, the reinforcing member 31-2 is attached to the insulating substrate 11-1.
In a configuration in which the displacement of the (particularly, the displacement portion) is inhibited, there is a possibility that the contact electrode 12A and the device 14A cannot be reliably connected.

However, the opening 20 of the reinforcing member 31-2
By forming the concave portion 32 at a portion corresponding to -1 (displacement portion) and forming the convex portion 33 at a portion facing the non-displacement portion 30-1, the reinforcing member 31-2 is attached to the insulating substrate 11-1. It becomes the structure which can be displaced following. Thereby, the insulating substrate 1
1-1 can be uniformly reinforced, so that the electrical connection between the contact electrode 12A and the device 14A can be reliably performed.

Further, the contactor 10 according to the nineteenth embodiment
23, as shown in FIG. 23, a reinforcing member side opening 34 is formed in a portion corresponding to the opening 20-1 of the reinforcing member 31-3.
A is formed. Therefore, only the non-displacement portion 30-1 comes into contact with the reinforcing member 31-3. According to the configuration of this embodiment, similarly to the eighteenth embodiment, the reinforcing member 31-3 can be displaced following the displacement of the insulating substrate 11-1, and the contact electrode 12A and the device 14A can be displaced. Electrical connection can be reliably performed.

FIGS. 23B to 23D show the reinforcing members 31-.
3 shows various aspects of the reinforcing member side opening 34A formed in FIG. FIG. 23B shows a structure in which a hole is formed in the reinforcing member 31-4 to form the reinforcing member side opening 34B. FIG. 23C shows that the reinforcing member side opening 34C is formed by forming a slit in the reinforcing member 31-5.
It is what constituted.

FIG. 23 (D) shows the reinforcing member 31-6.
In this case, a net-like elastomer is used, and the mesh is used as a reinforcing member side opening. Note that the configuration of the reinforcing member side opening is not limited to the above-described configuration, and other configurations are also possible. Subsequently, a twenty-first embodiment will be described.

FIG. 24 is a sectional view showing a contactor 10-24 according to a twenty-first embodiment. In the contactors 10-21 to 10-23 according to the eighteenth to twentieth embodiments described above with reference to FIGS. 21 to 23, examples in which block-shaped reinforcing members 31-1 to 31-3 made of rubber or the like are used. showed that. On the other hand, the contactor 10-24 according to the present embodiment is characterized in that the reinforcing member 31-7 is formed of a tubular elastic body made of an elastic thin film. A fluid (air in this embodiment) supply device (not shown) is connected to the tubular elastic body constituting the reinforcing member 31-7, and the fluid can be supplied to and discharged from the reinforcing member 31-7. It has become. The reinforcing member 31-7 having the above-described configuration is similar to the reinforcing members 31-1 to 31 according to the other embodiments.
Similarly to -3, it is provided so as to be in contact with the lower surface of the insulating substrate 11-1.

Therefore, the contactor 10-
Reference numeral 24 denotes a configuration in which the insulating substrate 11-1 is reinforced by the fluid pressure of the reinforcing member 31-7 made of a tubular elastic body. According to this configuration, the drive of the fluid supply device is controlled and the reinforcing member 31 is controlled.
By adjusting the internal fluid pressure in −7, the contact pressure acting between the contact electrode 12A and the device 14A can be adjusted. In addition, the variation in height between the contact electrode 12A and the flat electrode 15 is absorbed by the elastic deformation of the reinforcing member 31-7 made of a tubular elastic body, so that the electrical connection between the contact electrode 12A and the device 14A is ensured. Can do it.

Subsequently, a twenty-fifth embodiment will be described.
FIG. 25 is an enlarged perspective view of a main part of a contactor 10-25 according to the twenty-fifth embodiment. The contactor 10-25 according to the present embodiment is provided with an external connection terminal 35 that is electrically connected to the contact electrode 12A via the wiring pattern 17 on the outer peripheral portion of the insulating substrate 11-1.

As described above, the arrangement pitch of the contact electrodes 12A is narrow because it is restricted by the electrode pitch of the device 14A. However, by arranging the wiring patterns 17 from the contact electrodes 12A to the external connection terminals 35 arranged at a narrow pitch as in the present embodiment, the arrangement pitch of the external connection terminals 35 is made wider than the arrangement pitch of the contact electrodes 12A. Can contactor 10
Connection with a tester (for performing an operation test of a device) to which −25 is connected can be easily performed.

Next, a twenty-third embodiment will be described.
FIG. 26 is a sectional view showing a contactor 10-26 according to the twenty-third embodiment. Contactor 10-26 according to the present embodiment
Is characterized in that a wiring substrate 37A is provided on the lower surface of the insulating substrate 11-20 (the side opposite to the contact side with the device 14A).

The wiring board 37A has a structure in which an internal wiring 38 is formed inside a flexible insulating substrate. One end of the internal wiring 38 is connected to a connection pad 39 formed on the upper surface of the substrate. The other end is connected to an external terminal 40 formed on the lower surface of the substrate. The contactor electrode 12A and the via 2 are provided on the lower surface of the insulating substrate 11-20.
A substrate connection electrode 36A connected through the second electrode 2 is formed. The formation position of the connection pad 39 is configured to correspond to the formation position of the substrate connection electrode 36A. Therefore, the insulating substrate 11-20 is placed on the wiring board 37A.
Is attached, the contact electrode 12A is electrically connected to the external terminal 40 via the via 22, the substrate connection electrode 36A, the connection pad 39, and the internal wiring 38.

By providing the wiring board 37A on the lower surface of the insulating substrate 11-20 as in the present embodiment, the insulating substrate 11-20 is provided.
At -20, it is not necessary to route the wiring, and it is possible to arrange the contact electrodes 12A at a higher density.
Also, as described above, when the wiring layer is routed on the insulating substrate, the rigidity is increased by the thickness of the wiring layer and the flexibility of the insulating substrate is impaired, as described above. This eliminates the need to provide a wiring layer on the insulating substrate 11-20.
Flexibility can be ensured.

Further, since the wiring board 27A is not provided with an opening or the like, the degree of freedom of wiring can be improved as compared with the configuration in which wiring is formed on the insulating substrate 11-20. Therefore, according to the present embodiment, it is possible to reliably connect the contact electrode 12A and the device 14A while increasing the density of the contact electrode 12A.
Note that the wiring board 27A needs to have flexibility such that it can be displaced at least following the displacement of the insulating substrate 11-20.

Next, a twenty-fourth embodiment will be described.
FIG. 27 is a sectional view of a contactor 10-27 according to a twenty-fourth embodiment. The contactor 10-27 according to the present embodiment is characterized in that a reinforcing member 31-8 made of an anisotropic conductive elastic body is provided between an insulating substrate 11-21 and a wiring board 37B. The reinforcing member 31-8 has a configuration in which a plurality of wires 41 are embedded in an elastic body such as rubber. Further, the arrangement position of the wire 41 is set to correspond to the formation position of the contactor electrode 12A.

The wiring board 37B has an internal wiring 38 formed therein. One end of the internal wiring 38 is connected to a connection pad 39 formed on the upper surface of the substrate, and the other end is connected to the substrate. It is connected to an external terminal 40 formed on the lower surface. On the lower surface of the insulating substrate 11-21, a substrate connection electrode 36B connected to the contactor electrode 12A via the via 22 is formed. Connection pad 3 described above
9 and the substrate connection electrode 36B are formed at the wire 41
Are arranged so as to correspond to the disposition position.

Therefore, the reinforcing member 31 is placed on the wiring board 37B.
-8 and the insulating substrate 11-21, the contact electrode 12A becomes the via 22 and the substrate connecting electrode 36.
B, wires 41, connection pads 39, and internal wiring 38 are electrically connected to external terminals 40. As described above, also in the present embodiment, the wiring board 37B is provided on the lower surface of the insulating substrate 11-21 via the reinforcing member 31-8 having the wire 41, so that it is not necessary to route the wiring on the insulating substrate 11-21. Further, it is possible to further arrange the contact electrodes 12A at a high density.

Further, even if the wiring board 37B has a height variation such as warpage, the height variation is absorbed by the elastic deformation of the reinforcing member 31-8 made of an anisotropic conductive elastic body. be able to. In addition, even if the contact electrode 12A or the flat electrode 15 of the device 14A has a height variation, the height variation can be absorbed by the displacement of the reinforcing member 31-8, which is an anisotropic conductive elastic body. Therefore, the contact electrode 12A and the device 14A can be reliably connected.

Next, a twenty-fifth embodiment will be described.
28 and 29 show a contactor 20 according to a twenty-fifth embodiment.
FIG. 28 is a cross-sectional view showing −28. FIG. 28 shows the contactor 20-28 before the device 14A is mounted, and FIG. 29 shows the contactor 20-28 after the device 14A is mounted. The contactor 20-28 according to the present embodiment is characterized in that the displacement part 42 and the non-displacement part 30-16 are formed on the insulating substrate 11-22 by changing the physical characteristics of the insulating substrate 11-22. Things. The formation position of the displacement portion 42 is set to a position between the adjacent contactor electrodes 12A, similarly to the opening 20-1 formed in the contactor 10-1 according to the first embodiment described above with reference to FIG. ing.

A method of forming the displacement portion 42 and the non-displacement portion 30-16 on the insulating substrate 11-22 by changing the physical characteristics of the insulating substrate 11-22 as in this embodiment will be described. In this embodiment, a photosensitive resin is used as the material of the insulating substrate 11-22. Desirably, the photosensitive resin has a property of being cured by irradiation with light (for example, UV light) and maintaining a predetermined elasticity when light irradiation is not performed.

In order to form the contactor 10-28, first, a photosensitive resin having the above characteristics is formed into a flat plate. Then, a contact electrode 12A is provided on the plate-shaped photosensitive resin, and a mask 43 is provided on a surface of the plate-shaped photosensitive resin which is different from the side on which the contact electrode is provided. An opening is formed in the mask 43 in advance at a position corresponding to the arrangement position of the contact electrode 12A. Then, as shown in FIG. 30, the flat photosensitive resin is irradiated with light through the mask 43. As a result, light is irradiated to the position where the contact electrode 12A of the plate-shaped photosensitive resin is provided, and the irradiated position is light-cured to form the non-displaceable portion 30-16. In addition, a portion not irradiated with light serves as a displacement portion 42 for maintaining the above-described predetermined elasticity.

As described above, by adopting the manufacturing method of this embodiment, the displacement portion 42 is selectively irradiated with light on the photosensitive resin using the photolithography technique.
In addition, since the non-displacement portion 30-16 is formed, the insulating substrate 11-22 can be easily and accurately formed. In the above-described embodiment, the displacement portion 42 and the non-displacement portion 30-16 are formed by selectively performing light irradiation using a photosensitive resin, but the method of forming the insulating substrate 11-22 is not limited thereto. Instead, for example, a thermosetting resin may be used, and the heat treatment may be selectively performed to change the physical properties of the resin to form the displacement portion 42 and the non-displacement portion 30-16.
By selectively irradiating X-rays with the use of a radiation-curable resin, the physical properties of the resin are changed, and the displacement portion 42 and the non-displacement portion 3 are changed.
0-16 may be formed. Furthermore, any other method may be used as long as the displacement portion 42 and the non-displacement portion 30-16 can be formed by changing the physical properties of the resin.

In the contactor 10-28 according to the present embodiment, since the displacement portion 42 having a large amount of deformation is formed between the adjacent contact electrodes 12A as described above, the height of the contact portion 10A or the flat electrode 15 is increased. Even if there is a variation, the displacement can be absorbed by the displacement of the displacement portion 42 as in the first embodiment, so that the contact electrode 12A and the device 14A can be stably connected in a uniform state. And connection reliability can be improved.

Next, a twenty-sixth embodiment will be described.
FIGS. 31 and 32 show a contactor 1 according to a twenty-sixth embodiment.
FIG. 31 is a cross-sectional view showing the contactor 10-29 before mounting the device 14B, and FIG. 32 shows the contactor 10-29 after mounting the device 14B. In the above-described twenty-fifth embodiment, the connection terminal of the device 14A is formed by the flat electrode 15, so that the contactor 10-28 is formed with the protruding contact electrode 12A from the viewpoint of improving the connectivity.
In contrast, the device 14B according to the present embodiment is:
It has a configuration having protruding electrodes 16 (bumps) as connection terminals.

Therefore, the contactor 10 according to the present embodiment is
No. -29 has a configuration in which a flat contact electrode 12B is formed on an insulating substrate 11-22. Further, the contactor 10-29 according to the present embodiment also changes the physical characteristics of the insulating substrate 11-22 as in the twenty-fifth embodiment, thereby
The displacement part 42 and the non-displacement part 30-16 are formed on the insulating substrate 11-22.

Therefore, even if the bump electrode 16 or the contact electrode 12B has a height variation, according to the contactor 10-29 according to the configuration of the present embodiment, the contact electrode 12B is individually and independently formed by the displacement portion 42. Displace. Therefore, the contact electrode 12B and the device 14B (the protruding electrode 16) can be stably connected in a uniform state, and the connection reliability can be improved.

Next, a description will be given of a twenty-seventh embodiment.
FIG. 33 is a sectional view showing a contactor 10-30 according to the twenty-seventh embodiment. Contactor 10-30 according to the present embodiment
Is a configuration in which the insulating substrate 11-22 on which the displacement portion 42 and the non-displacement portion 30-16 are formed by changing the physical characteristics is disposed on a reinforcing member 31-1 made of an elastic material such as rubber. It is characterized by the following.

The insulating substrate 11-22 used in this embodiment is
As with the insulating substrate made of a resin such as polyimide described above, the stiffness of the simple substance alone is not sufficient for the devices 14A and 14A.
There is no rigidity enough to receive the contact force with B, and there is a possibility that reliable connection may not be made. Therefore, in the present embodiment, the eighteenth embodiment described with reference to FIGS.
As in the twentieth to twentieth embodiments, a reinforcing member 31-1 made of an elastic body is provided on the lower surface of the insulating substrate 11-22. With this configuration, the contact force applied when mounting the device 14A is reduced
Since it is reliably received by the reinforcing member 31-1 via the contact 22, the rigidity of the contactor 10-30 as a whole can be improved as compared with a configuration in which the contact force is received only by the insulating substrate 11-22. Therefore, the electrical connectivity between the contact electrode 12A and the devices 14A and 14B can be improved.

In the description of each embodiment described above, for convenience of description and illustration, one of the protruding contact electrode 12A and the plate-shaped contact electrode 12B has been described. Is not limited to the illustrated contactor electrode structure, but includes a protruding contact electrode 12A and a flat contact electrode 12A.
B can be applied to any of B.

[0139]

According to the present invention as described above, the following various effects can be realized. According to the first and second aspects of the invention, the rigidity of the insulating substrate can be partially changed, and the individual contact electrodes can be easily displaced. Therefore, even if the contact electrode or the terminal of the electronic component has a variation in height, the variation can be absorbed by the displacement of the electrically insulating substrate (displacement portion). Can be connected in a uniform state.

According to the third and ninth aspects of the present invention, the pattern of the wiring layer can be configured with a high degree of freedom even if the pitch of the contact electrodes is reduced. According to the fourth and tenth aspects of the present invention, it is possible to prevent the wiring layer from hindering the displacement of the displacement portion,
Therefore, the electrical connection between the electronic component and the contact electrode can be more reliably performed while maintaining the degree of freedom in the pattern design of the wiring layer.

According to the fifth aspect of the present invention, the displacement portion can be easily formed, and the displacement amount of the displacement portion can be arbitrarily adjusted. According to the sixth aspect of the invention, even when the terminals of the electronic component are arranged in a matrix, one contact electrode can be freely displaced without being restricted by the adjacent contact electrode. Therefore, the electrical connection between the contact electrode and the terminal of the electronic component can be more reliably performed.

According to the seventh aspect of the present invention, since the openings are constituted by a plurality of small openings provided for each contact electrode, the amount of displacement of the displacement portion can be arbitrarily determined according to the number of small openings. It becomes possible to adjust to. According to the invention of claim 8, when the displacement portion is displaced, the contact electrode is also displaced together with the electrically insulating substrate, so that the variation in the contact electrode or the terminal of the electronic component can be reliably absorbed.

According to the eleventh aspect of the present invention, since the opening is provided so as to straddle the plurality of contact electrodes, the processing of the opening can be performed as compared with the case where the opening is formed for each contact electrode. It can be done easily. Further, since the electrically insulating substrate between the adjacent contact electrodes is removed, the displacement of the electrically insulating substrate can be performed more flexibly.

According to the twelfth aspect of the present invention, even if the contact electrode or the terminal of the electronic component has a variation in height, the variation can be absorbed by the displacement of the thinned displacement portion. As a result, the electronic component and each contact electrode can be connected in a uniform state.
In addition, since a wiring layer can be formed on the thin portion, the degree of freedom of the formation area of the wiring layer can be improved.

According to the thirteenth aspect of the present invention, on the upper surface serving as the contact electrode disposing surface, it is possible to prevent the electrically insulating substrate from coming into contact with a portion (circuit surface or the like) other than the electrode formation of the electronic component. can do. On the lower surface, when the reinforcing member is provided on the electrically insulating substrate, the electrically insulating substrate and the reinforcing member are in partial contact, and the pressure can be efficiently transmitted to the contact electrode.

According to the fourteenth aspect of the present invention, since the contact electrode is displaced together with the electrically insulating substrate in the displaced portion, the variation in the contact electrode or the terminal of the electronic component can be absorbed. Electrical connection with the terminal of the electronic component can be reliably performed. In addition, since the contact electrode can be formed on the thin portion, the degree of freedom in setting the size and arrangement position of the contact electrode can be increased as compared with the configuration in which the contact electrode is formed on the opening.

According to the fifteenth aspect of the present invention, the displacement portion can be displaced without forming an opening or a thin portion in the electrically insulating substrate. An insulating substrate can be easily formed. Further, since there is no unevenness on both the upper surface and the lower surface of the electrically insulating substrate, the degree of freedom in forming a pattern of the wiring layer can be further improved. Furthermore, since the electrically insulating substrate has a uniform thickness over the whole, the handleability can be improved.

According to the sixteenth aspect of the present invention, even if the contact electrode or the terminal of the electronic component has a variation in height, the variation is absorbed by the displacement of the softened displacement portion. This makes it possible to connect the electronic component and each contact electrode in a uniform state. Further, since the non-displacement portion provided at the position facing the contact electrode is in a hardened state, the connection between the contact electrode and the electronic component can be reliably performed.

According to the seventeenth aspect of the present invention, the displacement portion and the non-displacement portion can be formed by utilizing the photolithography technology, and therefore, the displacement portion and the non-displacement portion can be formed easily and accurately. can do. Further, according to the inventions of claims 18 and 19, the reinforcing member made of an elastic body such as rubber is provided on the back side of the electrically insulating substrate (the side opposite to the side where the contact electrodes are provided). The contact force with the electronic component can be reliably received, and the electrical connection between the contact electrode and the electronic component can be improved.

According to the twentieth and twenty-first aspects of the present invention, the reinforcing member can be displaced following the electrically insulating substrate, so that the electrically insulating substrate can be uniformly reinforced. Therefore, the electrical connection between the contact electrode and the electronic component can be reliably performed. Further, according to the invention of claim 22, by adjusting the pressure of the internal fluid, it is possible to adjust the contact force acting between the contact electrode and the terminal of the electronic component. In addition, the variation in height of the contact electrode or the terminal of the electronic component is absorbed by the elastic deformation of the tubular elastic body, so that the electrical connection between the contact electrode and the electronic component can be reliably performed.

According to the twenty-third aspect of the present invention, it is not necessary to route wiring on the electrically insulating substrate, and it is possible to arrange contact electrodes at a higher density. Further, it is not necessary to provide a wiring layer on the electrically insulating substrate, and the flexibility of the electrically insulating substrate can be secured. Further, since an opening or the like is not provided in the wiring substrate, the degree of freedom of wiring can be improved as compared with a configuration in which wiring is formed in an electrically insulating substrate.

Further, according to the present invention, even if the wiring board has a height variation such as warpage, the height variation is absorbed by the anisotropic conductive elastic body being elastically deformed. can do. In addition, since the anisotropic conductive elastic body functions as a reinforcing member of the electrically insulating substrate, even if the contact electrode or the terminal of the electronic component has a variation in height, the anisotropic conductive elastic body is displaced. Variations can be absorbed, so that the electronic component and each contact electrode can be reliably connected.

[Brief description of the drawings]

FIG. 1 is a view showing an example of a conventional electronic component contactor (part 1).

FIG. 2 is a view showing an example of a conventional contactor for electronic components (part 2).

FIG. 3 is a view for explaining a contactor (electronic component contactor) according to a first embodiment of the present invention (part 1);

FIG. 4 is a view for explaining a contactor according to the first embodiment of the present invention (part 2).

FIG. 5 is a view for explaining a contactor according to a second embodiment of the present invention (part 1).

FIG. 6 is a view for explaining a contactor according to a second embodiment of the present invention (part 2).

FIG. 7 is a view for explaining a modification of the opening.

FIG. 8 is a diagram for explaining a contactor according to a third embodiment of the present invention.

FIG. 9 is a view for explaining a contactor according to a fourth embodiment of the present invention.

FIG. 10 is a view for explaining a contactor according to a fifth embodiment of the present invention.

FIG. 11 is a view for explaining a contactor according to a sixth embodiment of the present invention.

FIG. 12 is a view for explaining contactors according to seventh to ninth embodiments of the present invention.

FIG. 13 is a view for explaining a contactor according to a tenth embodiment of the present invention.

FIG. 14 is a view for explaining a contactor according to an eleventh embodiment of the present invention.

FIG. 15 is a view for explaining a contactor according to a twelfth embodiment of the present invention.

FIG. 16 is a view for explaining a contactor according to a thirteenth embodiment of the present invention.

FIG. 17 is a view for explaining a contactor according to a fourteenth embodiment of the present invention.

FIG. 18 is a view for explaining a contactor according to a fifteenth embodiment of the present invention.

FIG. 19 is a view for explaining a contactor according to a sixteenth embodiment of the present invention.

FIG. 20 is a view for explaining a contactor according to a seventeenth embodiment of the present invention.

FIG. 21 is a view for explaining a contactor according to an eighteenth embodiment of the present invention.

FIG. 22 is a diagram illustrating a contactor according to a nineteenth embodiment of the present invention.

FIG. 23A is a view for explaining a contactor according to a twentieth embodiment of the present invention, and FIGS. 23B to 23D are views showing modified examples of a reinforcing member.

FIG. 24 is a diagram illustrating a contactor according to a twenty-first embodiment of the present invention.

FIG. 25 is a view for explaining a contactor according to a twenty-second embodiment of the present invention.

FIG. 26 is a view for explaining a contactor according to a twenty-third embodiment of the present invention.

FIG. 27 is a diagram illustrating a contactor according to a twenty-fourth embodiment of the present invention.

FIG. 28 is a view for explaining a contactor according to a twenty-fifth embodiment of the present invention (part 1).

FIG. 29 is a view for explaining a contactor according to a twenty-fifth embodiment of the present invention (part 2).

FIG. 30 is a diagram for explaining a method of forming a displacement portion and a non-displacement portion.

FIG. 31 is a view for explaining a contactor according to a twenty-sixth embodiment of the present invention (part 1).

FIG. 32 is a view for explaining a contactor according to a twenty-sixth embodiment of the present invention (part 2).

FIG. 33 is a diagram illustrating a contactor according to a twenty-seventh embodiment of the present invention.

[Explanation of symbols]

 10-1 to 10-30 Contactor 11-1 to 11-22 Insulating substrate 12A, 12B Contact electrode 14A, 14B Device 15 Flat electrode 16 Protruding electrode 17 Wiring pattern 20-1 to 20-11 Opening 21A, 21B Wiring layer 22 Via 23 Wiring layer opening 24A, 24B, 24C, 32 Concave part 25A, 25B, 25C Thin part 26 First concave part 27 Second concave part 30-1 to 30-16 Non-displacement part 31-1 to 31-8 Reinforcement member 33 Convex part 34A, 34B, 34C Reinforcement member side opening 35 External connection terminal 37A, 37B Wiring board 41 Wire 42 Displacement part 43 Mask

Claims (24)

[Claims] An electric insulating substrate, comprising: a contact electrode provided at a position corresponding to a terminal forming position of an electronic component on the electric insulating substrate; In the electronic component contactor for obtaining an effective connection, the electrical insulating substrate is provided with a displacement portion configured to be easily displaceable and a non-displacement portion configured to be hardly displaced with respect to the displacement portion. A contactor for electronic components, characterized in that: 2. The contactor for an electronic component according to claim 1, wherein the displacement portion is configured to be displaceable by providing an opening between the adjacent contact electrodes of the electrically insulating substrate. Characterized contactors for electronic components. 3. The electronic component contactor according to claim 1, wherein a wiring layer is formed on a surface of the electrically insulating substrate opposite to a surface on which the contact electrodes are provided. Contactor for electronic components. 4. The electronic component contactor according to claim 3, wherein the opening is formed through the wiring layer together with the electrically insulating substrate. 5. The contactor for an electronic component according to claim 2, wherein the opening has one of a slit, an oblong hole, and a rectangular cut. Contactor for electronic components. 6. The contactor for an electronic component according to claim 2, wherein the opening is formed along an outer periphery of the contact electrode. 7. The electronic component contactor according to claim 2, wherein the opening is formed by a plurality of small openings provided for each of the contact electrodes. Contactors for electronic components. 8. The contactor for an electronic component according to claim 1, wherein the displacement portion is configured to be displaceable by providing an opening at a position facing the contact electrode on the electrically insulating substrate. Contactor for electronic parts characterized by the above-mentioned. 9. The electronic component contactor according to claim 8, wherein a wiring layer is formed on a surface of the electrically insulating substrate opposite to a surface on which the contact electrodes are provided. Contactor for electronic components. 10. The contactor for an electronic component according to claim 9, wherein the opening is formed through the wiring layer together with the electrically insulating substrate. 11. The contactor for an electronic component according to claim 8, wherein the opening is provided across a plurality of the contact electrodes. 12. The electronic component contactor according to claim 1, wherein the displacement portion is configured to be displaceable by providing a thin portion between adjacent contact electrodes of the electrically insulating substrate. Characterized contactors for electronic components. 13. The contactor for an electronic component according to claim 12, wherein the thin portion has a first concave portion on a surface of the electrically insulating substrate on which the contact electrode is provided, and a surface on the opposite side. A contactor for an electronic component, wherein the contactor is formed by providing a second concave portion in the contactor. 14. The electronic component contactor according to claim 12, wherein the displacement portion is configured to be displaceable by providing a thin portion at a position facing the contact electrode on the electrically insulating substrate. Contactor for electronic parts characterized by the above-mentioned. 15. The electronic component contactor according to claim 1, wherein the displacement portion is configured to be displaceable by changing physical characteristics between adjacent contact electrodes of the electrical insulating substrate. A contactor for electronic components, characterized in that: 16. The electronic component contactor according to claim 1, wherein the displacement portion is formed by changing physical characteristics so that a position between the adjacent contact electrodes of the electrically insulating substrate is in a softened state. A contactor for an electronic component, wherein the non-displacement portion is formed by changing physical characteristics so that a position facing the contact electrode is in a hardened state. 17. The contactor for an electronic component according to claim 15, wherein the electrically insulating substrate is made of a photosensitive resin, and selectively illuminated with light to change the characteristic so that only the displacement portion can be displaced. A contactor for electronic components, wherein 18. The contactor for an electronic component according to claim 1, wherein a contact pressure at the time of mounting the electronic component on a side of the electrically insulating substrate opposite to a side on which the contact electrode is provided. A contactor for an electronic component, further comprising a reinforcing member for reinforcing the electrically insulating substrate. 19. The contactor for an electronic component according to claim 18, wherein the reinforcing member is made of an elastic body. 20. The contactor for an electronic component according to claim 18, wherein the reinforcing member forms a concave portion at a portion corresponding to the displacement portion formed on the electrically insulating substrate, and the non-displacement portion. A contactor for an electronic component, characterized in that a convex portion that contacts the non-displaceable portion is formed in a portion facing the non-displaceable portion. 21. The electronic component contactor according to claim 18 or 19, wherein a number of openings are formed in the reinforcing member, and the reinforcing member forms the electrically insulating substrate without being affected by the movement of the contact electrode. A contactor for an electronic component, wherein the contactor is configured to be uniformly reinforced. 22. The contactor for an electronic component according to claim 18, wherein the reinforcing member is formed of a thin-film tubular elastic body having elasticity, and the electrical insulating substrate is formed by a fluid pressure inside the tubular elastic body. A contactor for electronic components, characterized in that the contactor is configured to reinforce the electronic component. 23. The contactor for an electronic component according to claim 1, wherein a position corresponding to a position of said contact electrode is provided on a side of said electrically insulating substrate opposite to a side of contact with said electronic component. A contactor for electronic parts, wherein a wiring board having conductive pads is provided on the contactor. 24. The electronic component contactor according to claim 23, wherein an anisotropic conductive elastic body is provided as a reinforcing member between the electrically insulating substrate and the wiring substrate. Contactor.