JP4079080B2 - Electronic control unit - Google Patents

Electronic control unit Download PDF

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Publication number
JP4079080B2
JP4079080B2 JP2003404168A JP2003404168A JP4079080B2 JP 4079080 B2 JP4079080 B2 JP 4079080B2 JP 2003404168 A JP2003404168 A JP 2003404168A JP 2003404168 A JP2003404168 A JP 2003404168A JP 4079080 B2 JP4079080 B2 JP 4079080B2
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heat
conductor
generating component
electronic control
wiring board
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JP2005166981A (en
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祐二 谷
誠二 福井
洋平 鈴木
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
    • H05K7/20445—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing the coupling element being an additional piece, e.g. thermal standoff

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  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Description

本発明は、発熱部品をケース等で密閉する電子制御装置に関するものである。   The present invention relates to an electronic control device that seals a heat-generating component with a case or the like.

従来、この種の電子制御装置としては、例えば発熱部品を分割配置して放熱対策するものがあった（例えば、特許文献１参照）。図７（Ａ），（Ｂ）は、前記特許文献１に記載された電子制御装置を示すものであり、図７（Ｂ）は図７（Ａ）のｇ−ｇ線断面図である。図７において、ケース４内にプリント配線板２が配され、プリント配線板２上の２つの導電体１に対して発熱部品３が複数に分割されて配置されている。
特開２００３‐１１０２１６号公報 Conventionally, as this type of electronic control device, for example, there has been a device for dissipating heat by separately arranging heat generating components (see, for example, Patent Document 1). 7A and 7B show the electronic control device described in Patent Document 1, and FIG. 7B is a cross-sectional view taken along the line gg of FIG. 7A. In FIG. 7, the printed wiring board 2 is disposed in the case 4, and the heat generating component 3 is divided into a plurality of parts with respect to the two conductors 1 on the printed wiring board 2.
Japanese Patent Laid-Open No. 2003-110216

しかしながら、前記従来の構成では、発熱部品３はプリント配線板２とケース４によって密閉された空間に存在するために放熱性が悪く、発熱部品３を多数に分割しなければ発熱部品３の温度を下げることができなかった。また、発熱部品３を分割しているため、これらを収納する電子制御装置が大型化していた。   However, in the conventional configuration, since the heat generating component 3 is present in a space sealed by the printed wiring board 2 and the case 4, heat dissipation is poor, and the temperature of the heat generating component 3 is not increased unless the heat generating component 3 is divided into a large number. I could n’t lower it. In addition, since the heat generating component 3 is divided, the electronic control device for storing them is enlarged.

本発明は、上記従来の課題を解決するもので、発熱部品の放熱性を改善させ小型化された電子制御装置の提供を目的とするものである。   SUMMARY OF THE INVENTION The present invention solves the above-described conventional problems, and an object of the present invention is to provide an electronic control device that is miniaturized by improving heat dissipation of a heat-generating component.

前記従来の課題を解決するために、本発明の電子制御装置は、発熱部品が接続された導電体にプリント配線板の両面を貫通する熱伝導体を設けたものである。   In order to solve the above-described conventional problems, the electronic control device of the present invention is provided with a heat conductor penetrating both surfaces of a printed wiring board on a conductor to which a heat generating component is connected.

これによって、発熱部品から発生する熱をプリント配線板とケースにより密閉された空間と逆の空間に、熱伝導体により伝導させ放熱させることで発熱部品の温度上昇を抑制することとなる。   As a result, the heat generated from the heat generating component is conducted by the heat conductor to dissipate heat in a space opposite to the space sealed by the printed wiring board and the case, thereby suppressing the temperature rise of the heat generating component.

本発明の電子制御装置は、発熱部品から発生する熱をプリント配線板とケースにより密閉された空間と逆の空間に、熱伝導体により伝導させ放熱させることで発熱部品の温度上昇を抑制することができ、発熱部品の放熱性を改善させ小型化された電子制御装置を得ることができる。   The electronic control device of the present invention suppresses the temperature rise of the heat-generating component by conducting the heat generated by the heat-generating component to the space opposite to the space sealed by the printed wiring board and the case by the heat conductor to dissipate the heat. Therefore, it is possible to improve the heat dissipation of the heat generating component and obtain a miniaturized electronic control device.

第１の発明は、発熱部品に接続される導電体にプリント配線板の両面を貫通する熱伝導体としてのリード型抵抗器を設け、該リード型抵抗器は両方のリードが、前記発熱部品が接続されている同一の導電体に接続することにより、発熱部品から発生する熱をプリント配線板とケースにより密閉された空間と逆の空間に伝導させ放熱させることで発熱部品の温度上昇を抑制し、熱伝導体をリード型抵抗器とすることで発熱部品の温度上昇を安価に抑制することができる。   According to a first aspect of the present invention, a lead-type resistor as a heat conductor that penetrates both sides of a printed wiring board is provided in a conductor connected to a heat-generating component, and the lead-type resistor has both leads connected to the heat-generating component. By connecting to the same conductor that is connected, the heat generated from the heat-generating component is conducted to the space opposite to the space sealed by the printed wiring board and the case to dissipate heat, thereby suppressing the temperature rise of the heat-generating component. By using a lead-type resistor as the heat conductor, the temperature rise of the heat generating component can be suppressed at a low cost.

第２の発明は、リード型抵抗器を発熱部品の抵抗値よりも十分に大きい抵抗値とし発熱部品と電気的に並列に接続することで、発熱部品の温度上昇を効果的にかつ少ないスペースで抑制することができる。   In the second aspect of the invention, the resistance of the lead-type resistor is set to a resistance value sufficiently larger than the resistance value of the heat-generating component and is electrically connected in parallel with the heat-generating component, thereby effectively increasing the temperature of the heat-generating component in a small space. Can be suppressed.

第３の発明は、第１のまたは第２の発明のリード型抵抗器を本体がプリント配線板から浮くように取りつけることで、発熱部品の温度上昇を効果的に抑制することができる。   In the third aspect of the present invention, the temperature rise of the heat-generating component can be effectively suppressed by attaching the lead-type resistor of the first or second aspect of the invention so that the main body floats from the printed wiring board.

以下、本発明の実施の形態について、図面を参照しながら説明する。なお、本実施の形態によって本発明が限定されるものではない。   Hereinafter, embodiments of the present invention will be described with reference to the drawings. Note that the present invention is not limited to the present embodiment.

（参考例）
図１、図２は参考例における電子制御装置の上面からの透視図と断面図を示すものである。図１（Ｂ）は図１（Ａ）のａ−ａ線断面図であり、図２（Ｂ）は図２（Ａ）のｂ−ｂ線断面図である。図１において、導電体１が片面に形成されているプリント配線板２の導電体１と同じ面に発熱部品３の本体が配置されており、プリント配線板２の導電体１面側は導電体１面側の空間を囲むようにケース４により密閉されている。ここで、発熱部品３は導電体１に電気的に接続されている。また、発熱部品３が接続されている導電体１にプリント配線板２の両面を貫通するように熱伝導体５が接続されている。 ( Reference example )
1 and 2 are a perspective view and a cross-sectional view from the upper surface of an electronic control device according to a reference example . 1B is a cross-sectional view taken along the line aa in FIG. 1A, and FIG. 2B is a cross-sectional view taken along the line bb in FIG. 2A. In FIG. 1, the main body of the heat generating component 3 is arranged on the same surface as the conductor 1 of the printed wiring board 2 on which the conductor 1 is formed on one side, and the conductor 1 surface side of the printed wiring board 2 is the conductor. It is sealed with a case 4 so as to surround the space on the one surface side. Here, the heat generating component 3 is electrically connected to the conductor 1. A heat conductor 5 is connected to the conductor 1 to which the heat generating component 3 is connected so as to penetrate both sides of the printed wiring board 2.

以上のように構成された電子制御装置において、発熱部品３によって発生した熱は導電体１に伝導し、さらに熱伝導体５によりプリント配線板２とケース４により密閉された空間Ｓ１から密閉された空間Ｓ１の外側の空間Ｓ２に伝導し放熱されるので発熱部品３の温度上昇を抑制することができる。   In the electronic control device configured as described above, the heat generated by the heat generating component 3 is conducted to the conductor 1 and further sealed from the space S1 sealed by the printed wiring board 2 and the case 4 by the heat conductor 5. Since the heat is conducted to the space S2 outside the space S1 and radiated, the temperature rise of the heat generating component 3 can be suppressed.

また、図２は図１の構成と比較して、熱伝導体５を発熱部品３の近傍に配置したものであり、発熱部品３から熱伝導体５へと熱伝導する導電体１の経路が短くより効果的に発熱部品３の温度上昇を抑制することができる。   Further, FIG. 2 shows that the heat conductor 5 is arranged in the vicinity of the heat generating component 3 as compared with the configuration of FIG. 1, and the path of the conductor 1 that conducts heat from the heat generating component 3 to the heat conductor 5 is Short and more effective temperature rise of the heat generating component 3 can be suppressed.

（実施の形態１）
図３、図４、図５は本発明の実施の形態１における電子制御装置の上面からの透視図と断面図を示すものである。図３（Ｂ）は図３（Ａ）のｃ−ｃ線断面図であり、図４（Ｂ）は図４（Ａ）のｄ−ｄ線断面図、図５（Ｂ）は図５（Ａ）のｅ−ｅ線断面図である。図３において、実施の形態１における熱伝導体５をリード型抵抗器６に置き換えたものである。リード型抵抗器６は空間Ｓ２側からプリント配線板２にリード６Ａ，６Ｂが挿入されており、リード型抵抗器６の本体はプリント配線板２の空間Ｓ２側の面と接している。そし
て、リード６Ａ，６Ｂは発熱部品３が接続されている同一の導電体１に接続されている。上記以外の構成要素は参考例と基本的に同じ構成要素であるため説明を省略する。 (Embodiment 1 )
3, 4, and 5 show a perspective view and a cross-sectional view from the top surface of the electronic control unit according to Embodiment 1 of the present invention. 3B is a cross-sectional view taken along line cc of FIG. 3A, FIG. 4B is a cross-sectional view taken along line dd of FIG. 4A, and FIG. 5B is FIG. It is an ee sectional view taken on the line of FIG. In FIG. 3, the heat conductor 5 in the first embodiment is replaced with a lead resistor 6. The lead type resistor 6 has leads 6A and 6B inserted into the printed wiring board 2 from the space S2 side, and the main body of the lead type resistor 6 is in contact with the surface of the printed wiring board 2 on the space S2 side. The leads 6A and 6B are connected to the same conductor 1 to which the heat generating component 3 is connected. Components other than those described above are basically the same as those in the reference example, and thus description thereof is omitted.

以上のように構成された電子制御装置において、発熱部品３により発生した熱は導電体１に伝導し、さらにリード型抵抗器６によりプリント配線板２とケース４により密閉された空間Ｓ１より密閉された空間Ｓ１の外側の空間Ｓ２に放熱されるので、発熱部品３の温度上昇を抑制することができ、かつ、リード型抵抗器６は両方のリード６Ａ，６Ｂが同一の導電体１に接続されているので電気回路としては意味を持たず任意の抵抗値でよいため、電子制御装置の他の回路で使用される抵抗を流用することで特別に熱伝導体５を準備する必要がなく、電子制御装置を安価に形成することができる。   In the electronic control device configured as described above, the heat generated by the heat generating component 3 is conducted to the conductor 1 and further sealed from the space S1 sealed by the printed wiring board 2 and the case 4 by the lead type resistor 6. Since the heat is radiated to the space S2 outside the space S1, the temperature rise of the heat generating component 3 can be suppressed, and the lead type resistor 6 has both leads 6A and 6B connected to the same conductor 1. Therefore, there is no meaning as an electric circuit, and an arbitrary resistance value may be used. Therefore, it is not necessary to prepare the heat conductor 5 specially by diverting a resistor used in another circuit of the electronic control device, and the electronic circuit The control device can be formed at low cost.

図４は、図３におけるリード型抵抗器６を発熱部品３と電気的に直列に接続したもので、リード型抵抗器６のリード６Ａ，６Ｂ間に別の回路の導電体１Ａを配置することが可能となり、発熱部品３の温度上昇を抑制することができるとともに、電子制御装置の小型化が可能となる。なお、リード型抵抗器６の発熱部品３に接続されていない側の一端は別の電気回路に接続することも可能である。   FIG. 4 shows the lead-type resistor 6 in FIG. 3 electrically connected in series with the heat-generating component 3, and the conductor 1A of another circuit is arranged between the leads 6A and 6B of the lead-type resistor 6. As a result, the temperature rise of the heat generating component 3 can be suppressed, and the electronic control device can be downsized. Note that one end of the lead-type resistor 6 on the side not connected to the heat generating component 3 can be connected to another electric circuit.

図５は、図３におけるリード型抵抗器６を発熱部品３の抵抗値に対して十分に大きい抵抗値をもつリード型抵抗器７として発熱部品３と並列接続したもので、リード型抵抗器７の両方のリード７Ａ，７Ｂが発熱部品３に最短に配置できるので効果的にかつ小さなスペースで発熱部品３の温度上昇を抑制することができる。   FIG. 5 shows the lead type resistor 6 in FIG. 3 connected in parallel with the heat generating component 3 as a lead type resistor 7 having a resistance value sufficiently larger than the resistance value of the heat generating component 3. Since both the leads 7A and 7B can be arranged in the heat generating component 3 as short as possible, the temperature rise of the heat generating component 3 can be suppressed effectively and in a small space.

なお、リード型抵抗器７の抵抗値の選定例としては、例えば、発熱部品３の抵抗値が１ｋΩ、公差５％の場合、リード型抵抗器７の抵抗値を５００ｋΩとすれば発熱部品３とリード型抵抗器７の合成抵抗値は０．９９８ｋΩとなり、発熱部品３の抵抗値公差５％を５．２％と考えればよく、回路全体にあたえる影響を小さくできる。   As an example of selecting the resistance value of the lead-type resistor 7, for example, when the resistance value of the heat-generating component 3 is 1 kΩ and the tolerance is 5%, the resistance value of the lead-type resistor 7 is 500 kΩ, The combined resistance value of the lead-type resistor 7 is 0.998 kΩ, and the resistance value tolerance 5% of the heat generating component 3 may be considered as 5.2%, and the influence on the entire circuit can be reduced.

（実施の形態２）
図６は本発明の実施の形態２における電子制御装置の上面からの透視図と断面図を示すものであるである。図６（Ｂ）は図６（Ａ）のｆ−ｆ線断面図である。図６において、図５におけるリード型抵抗器７の本体をプリント配線板２から浮くように（離れるように）取りつけられたリード型抵抗器８に置き換えたものである。 (Embodiment 2 )
FIG. 6 shows a perspective view and a sectional view from the top surface of the electronic control unit according to Embodiment 2 of the present invention. FIG. 6B is a cross-sectional view taken along the line ff of FIG. In FIG. 6, the main body of the lead-type resistor 7 in FIG. 5 is replaced with a lead-type resistor 8 attached so as to float (be separated) from the printed wiring board 2.

以上のように構成された電子制御装置においては、リード型抵抗器８の放熱面積がリード型抵抗器８の本体の全表面積となり、放熱面積が大きくなり、効果的に発熱部品３の温度上昇を抑制することができる。   In the electronic control unit configured as described above, the heat radiation area of the lead resistor 8 becomes the total surface area of the main body of the lead resistor 8, the heat radiation area is increased, and the temperature of the heat generating component 3 is effectively increased. Can be suppressed.

本発明の電子制御装置は、放熱が制限された発熱部品の温度上昇抑制が可能となるので、導電体面がシリコンによって覆われている電子制御装置においても利用可能である。   Since the electronic control device of the present invention can suppress the temperature rise of the heat-generating component whose heat dissipation is restricted, it can also be used in an electronic control device in which the conductor surface is covered with silicon.

参考例における電子制御装置の上面からの透視図と断面図A perspective view and a sectional view from the top surface of the electronic control device in the reference example 参考例における他の電子制御装置の上面からの透視図と断面図Perspective view and cross-sectional view from the top of another electronic control unit in the reference example 本発明の実施の形態１における電子制御装置の上面からの透視図と断面図The perspective view and sectional drawing from the upper surface of the electronic controller in Embodiment 1 of this invention 本発明の実施の形態１における他の電子制御装置の上面からの透視図と断面図The perspective view and sectional drawing from the upper surface of the other electronic control unit in Embodiment 1 of this invention 本発明の実施の形態１における他の電子制御装置の上面からの透視図と断面図The perspective view and sectional drawing from the upper surface of the other electronic control unit in Embodiment 1 of this invention 本発明の実施の形態２における電子制御装置の上面からの透視図と断面図The perspective view and sectional drawing from the upper surface of the electronic controller in Embodiment 2 of this invention 従来の電子制御装置の上面からの透視図と断面図Perspective view and cross-sectional view from the top of a conventional electronic control unit

符号の説明Explanation of symbols

１ 導電体
２ プリント配線板
３ 発熱部品
４ ケース
５ 熱伝導体
６，７，８ リード型抵抗器
1 Conductor 2 Printed Wiring Board 3 Heating Component 4 Case 5 Thermal Conductor 6, 7, 8 Lead Resistor

Claims (3)

導電体が片面に形成されているプリント配線板と、前記導電体に電気的に接続され本体が前記導電体面に存在する発熱部品と、前記プリント配線板の前記導電体面側の空間を囲むケースと、前記発熱部品が接続されている前記導電体に接続され前記プリント配線板の両面を貫通する熱伝導体としてのリード型抵抗器から構成され、該リード型抵抗器は両方のリードが、前記発熱部品が接続されている同一の導電体に接続されている電子制御装置。 A printed wiring board in which a conductor is formed on one side; a heat generating component electrically connected to the conductor and having a main body on the conductor surface; and a case surrounding a space on the conductor surface side of the printed wiring board; the heat generating component is composed of lead type resistor as a heat conductor that penetrates both sides of which is connected to the conductor which is connected the printed circuit board, the lead-type resistors both leads, the heating an electronic control unit that is connected to the same conductor parts are connected. 導電体が片面に形成されているプリント配線板と、前記導電体に電気的に接続され本体が前記導電体面に存在する発熱部品と、前記プリント配線板の前記導電体面側の空間を囲むケースと、前記発熱部品が接続されている前記導電体に接続され前記プリント配線板の両面を貫通する熱伝導体としてのリード型抵抗器から構成され、該リード型抵抗器は前記発熱部品と電気的に並列に接続され、発熱部品の抵抗値の５００倍以上大きさの抵抗値とした電子制御装置。 A printed wiring board in which a conductor is formed on one side; a heat generating component electrically connected to the conductor and having a main body on the conductor surface; and a case surrounding a space on the conductor surface side of the printed wiring board; A lead-type resistor as a heat conductor connected to the conductor to which the heat-generating component is connected and penetrating both sides of the printed wiring board, the lead-type resistor being electrically connected to the heat-generating component An electronic control device that is connected in parallel and has a resistance value that is at least 500 times the resistance value of the heat-generating component . リード型抵抗器の本体がプリント配線板から浮くように取りつけた請求項１または請求項２に記載の電子制御装置。 3. The electronic control device according to claim 1 , wherein the main body of the lead type resistor is mounted so as to float from the printed wiring board.
JP2003404168A 2003-12-03 2003-12-03 Electronic control unit Expired - Lifetime JP4079080B2 (en)

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JP2007173631A (en) * 2005-12-22 2007-07-05 Matsushita Electric Works Ltd Mounting structure of printed-wiring board, discharge-lamp lighting device, and projector
JP2007325344A (en) * 2006-05-30 2007-12-13 Yazaki Corp Electrical junction box
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JP2003188565A (en) * 2001-12-18 2003-07-04 Nec Corp Heat dissipation structure of surface mount electronic component
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