JP4066104B2 - Polyamide resin film - Google Patents
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- JP4066104B2 JP4066104B2 JP14367198A JP14367198A JP4066104B2 JP 4066104 B2 JP4066104 B2 JP 4066104B2 JP 14367198 A JP14367198 A JP 14367198A JP 14367198 A JP14367198 A JP 14367198A JP 4066104 B2 JP4066104 B2 JP 4066104B2
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Description
【０００１】
【発明の属する技術分野】
本発明は、透明性、耐屈曲疲労性及び滑り性を同時に兼ね備えたポリアミド系樹脂フィルムに関し、特に高湿度下での易滑性に優れたポリアミド系樹脂フィルムに関するものである。
【０００２】
【従来の技術】
従来から、ポリアミド系樹脂フィルムは靭性や耐屈曲性等を含めた機械的特性、光学特性、熱的特性、ガスバリアー性等に優れているため、包装用途を始めとして様々な用途に広く用いられている。ところが上記従来のポリアミド系樹脂フィルムには、ポリアミド系樹脂自体の特性に由来する難点として吸湿性が高く、高湿度環境下で使用すると吸湿して接触面積が増大することにより滑り性が低下し、加工時の取扱い作業性を著しく害するという問題点があった。
こうした問題点を克服するための手段として、フィルム同士の摩擦面またはフィルムと接触する材料との摩擦面の摩擦係数を低下させる方法が検討され、具体的にはポリアミド系樹脂フィルム内にポリアミドに対して不活性な無機質の微粒子を含有させ、フィルム表面の摩擦係数を小さくする方法や有機系の表面潤滑剤を添加する方法などが採用されている。
【０００３】
【発明が解決しようとする課題】
しかしながら、上記従来の方法では摩擦係数を小さくするために無機質の微粒子の添加量を多くするとポリアミド系樹脂フィルムの透明性が低下するという問題点があった。上記摩擦係数とフィルムの透明性とは、二律背反の関係があり、易滑性と透明性の両特性を満たすポリアミド系樹脂フィルムを得ることは困難であった。特に透明性を満たし、かつ高湿度下での滑り性を満足するポリアミド系樹脂フィルムを得ることは困難であった。
また、有機系の表面潤滑剤を用いるとフィルムの表面エネルギーが低下し、滑り性が向上する反面フィルム表面に印刷やラミネートを施すときの接着性が低下するという問題があり、実用特性上、有機潤滑剤の添加量を増加させる方法は困難であった。
本発明は上記従来のポリアミド系樹脂フィルムの有する問題点を解決し、透明性、耐屈曲疲労性及び易滑性を兼ね備えたフィルムで、特に高湿度下での易滑性を同時に満足せしめるような易滑性ポリアミド系樹脂フィルムを提供することを目的とする。
【０００４】
【課題を解決するための手段】
本発明者らは上記目的を達成するために鋭意検討した結果、従来のポリアミド樹脂に低吸湿性ポリアミド樹脂と耐屈曲疲労性改良剤とを配合した樹脂組成物を使用してフィルムに成型すると透明性を保持しつつ、高湿度下における滑り性が改善され、また耐屈曲疲労性も良好であることを見い出し、本発明に至った。すなわち本発明の要旨は以下の通りである。フィルムの透明性がヘイズ値で５．０％以下で、フィルム同士を接触摩擦せしめたときの動摩擦係数（Ａ）が、湿度５０％雰囲気下で１．０以下であり、かつ上記の動摩擦係数（Ａ）と湿度６５％雰囲気における動摩擦係数（Ｂ）との比（Ｂ）／（Ａ）が１．５以下を満足することを特徴とするポリアミド系樹脂フィルムである。また、１０００回屈曲疲労性テスト後のフィルムに発生する穴の数が２０個以下である該ポリアミド系樹脂フィルムである。また、該ポリアミド系樹脂フィルムを最外層に配置した積層体である。
【０００５】
【発明の実施の形態】
次に本発明を更に詳細に説明する。本発明は、脂肪族ポリアミド系樹脂（Ｘ）０〜９５．８重量部と、芳香族ポリアミド樹脂（ａ）と脂肪族ポリアミド樹脂（ｂ）とを混合および／または共重合してなる樹脂組成物（Ｙ）９０〜４重量部、および耐屈曲疲労性改良剤を０．２〜１０重量部配合してなり、かつ該樹脂組成物（Ｙ）中に該芳香族ポリアミド樹脂（ａ）成分を１０モル％以上含有することを特徴とするポリアミド系樹脂フィルムである。
【０００６】
また、本発明のポリアミド系樹脂フィルムは、平均粒子径が０．５〜５．０μｍの無機微粒子、あるいは平均粒子径が０．５〜５．０μｍの無機および有機微粒子を、樹脂合計量に対し０．０５〜１．０重量部含有してなることを特徴とするポリアミド系樹脂フィルムである。使用する無機微粒子はシリカ粒子、アルミナ粒子や炭酸カルシウム粒子などが挙げられ、有機微粒子は架橋アクリル粒子、架橋ポリスチレン粒子などが挙げられる。微粒子はポリアミド系樹脂フィルム中に０．０５〜１．０重量部含有させる。好ましい含有量は０．１５〜０．７重量部である。含有量が０．０５重量部未満では易滑性が不十分であるので好ましくない。逆に含有量が１．０重量部を超えるとポリアミド系樹脂フィルムの透明性が悪化するので好ましくない。本発明においては、微粒子は１種類のものを用いてもよいし、２種以上のものを併用してもよい。また無機微粒子と有機微粒子を併用してよい。２種以上の微粒子を併用することは、透明性と易滑性のバランスをとる上で好ましい実施態様であって、推奨される微粒子の配合方法である。本発明においては、無機および／または有機系微粒子は平均粒子径が０．５〜５．０μｍのものを用いる。平均粒子径が１．０〜４．０μｍのものを用いるのがより好ましい。粒子径が０．５μｍ未満では充分な易滑性が付与できないので好ましくない。逆に５．０μｍを超えると透明性が悪化したり半調印刷性が低下するので好ましくない。
【０００７】
また、本発明の脂肪族ポリアミド系樹脂（Ｘ）が、ナイロン６、ナイロン１２、ナイロン６６、ナイロン６１２、ナイロン６／６６共重合体、ナイロン６／１２共重合体から、少なくとも１種および／または２種以上の組み合わせから選ばれることを特徴とするポリアミド系樹脂フィルムである。
【０００８】
また、本発明で使用する樹脂組成物（Ｙ）の芳香族ポリアミド樹脂（ａ）がテレフタル酸またはイソフタル酸と脂肪族ジアミンが重縮合してなる重合体であることを特徴とするポリアミド系樹脂フィルムである。また、本発明で使用する樹脂組成物（Ｙ）の脂肪族ポリアミド樹脂（ｂ）がナイロン６またはナイロン６６であることを特徴とするポリアミド系樹脂フィルムである。
【０００９】
また、本発明で使用する耐屈曲疲労性改良剤は、ブロックポリエステルアミド、ブロックポリエーテルアミド、ポリエーテルエステルアミド系エラストマー、ポリエステル系エラストマー、変性エチレンプロピレンゴム、変性アクリルなどのエラストマーやエチレン／アクリレート共重合体であることを特徴とするポリアミド系樹脂フィルムである。
【００１０】
本発明のポリアミド系樹脂フィルムは目的、性能を損なわない限り、各種添加剤をさらに配合したものであってもよい。例えば、酸化防止剤、耐光剤、ゲル化防止剤、滑剤、有機系潤滑剤、顔料、帯電防止剤、界面活性剤等を配合することができる。
【００１１】
本発明のポリアミド系樹脂フィルムは、公知のフィルム製膜法によって形成することができる。フィルム製膜法としては、Ｔダイ法、インフレーション法などが適用される。
【００１２】
また、本発明のポリアミド系樹脂フィルムは単層であってもよいし、また共押出等の多層フィルムであってもよい。
【００１３】
また、本発明のポリアミド系樹脂フィルムは、印刷性や接着性を付与するためにフィルム表面にコロナ放電処理、プラズマ処理、紫外線照射処理、火焔処理などやコーティング等の手段によりポリマー層を塗布することができる。また、更にガスバリヤー性向上のために無機の薄膜を蒸着させても構わない。また、ポリエチレンなどの他種樹脂フィルムとラミネーションを行い包装袋として使用しても構わない。
【００１４】
【実施例】
以下、実施例を挙げて本発明をより具体的に説明するが、本発明はもとより下記実施例によって制限を受けるものではなく、本発明の趣旨に適合し得る範囲で適宣変更を加えて実施することも可能であり、それらはいずれも本発明の技術的範囲に含まれる。なお、本明細書中の特性値の測定は下記の方法に従った。
【００１５】
〔ヘイズ〕
ＪＩＳ−Ｋ６７１４に準拠して、東洋精機製作所へーズテスターにて測定した。
【００１６】
〔動摩擦係数〕
フィルムの非表面活性処理面同士の動摩擦係数をＡＳＴＭ−Ｄ−１８９４法に準じて、５０％ＲＨ又は６５％ＲＨの湿度雰囲気下で測定した。
【００１７】
〔耐屈曲疲労性〕
理化学工業（株）社製ゲルボフレックステスターを使用し、下記の方法により耐屈曲疲労性を測定した。直径３．５インチの固定ヘッド側に、他の端を可動ヘッド側に固定し、初期の把持間隔を７インチとした。ストロークの最初の３．５インチで４４０度のひねりを与え、その後２．５インチは直線水平運動で全ストロークを終えるような屈曲疲労を４０回／分の速さで、１０００回行い、フィルムに発生したピンホール個数を数えた。なお、測定は２５℃の環境下で行った。
【００１８】
（実施例１）
９０．６重量部のナイロン６、ナイロン６Ｔ／ナイロン６共重合体（共重合比５０／５０モル比）４重量部およびポリラウリンラクタム／ポリエーテル共重合体（ダイセル．ヒュルス社製、ダイアミド）５重量部、平均粒径１．６μｍの多孔質シリカ０．４重量部をＴダイから溶融押出しし、２０℃の回転ドラム上で冷却して厚さ１８０μｍの未延伸ポリアミドフィルムを得た。この未延伸フィルムを５０℃で３．０倍に縦延伸した。次いで１２５℃で横方向に４．０倍延伸し、２１５℃で熱固定を行い厚み１５μｍの２軸延伸フィルムを得た。
このフィルムは、易滑性、透明性、耐屈曲疲労性、印刷性および接着性のいずれも優れたものであった。易滑性、透明性、耐屈曲疲労性については、表１にその特性値を示した。
【００１９】
（実施例２）
実施例１の方法において、６９．８重量部のナイロン６、ナイロン６Ｔ／ナイロン６共重合体（共重合比５０／５０モル比）２５重量部およびポリラウリンラクタム／ポリエーテル共重合体５重量部、平均粒径１．６μｍの多孔質シリカ０．２重量部をＴダイから溶融押出しし、２０℃の回転ドラム上で冷却して厚さ１８０μｍの未延伸ポリアミドフィルムを得た。この未延伸フィルムを７０℃で３．０倍に縦延伸した。次いで１２５℃で横方向に４．０倍延伸し、２１５℃で熱固定を行ない厚み１５μｍの２軸延伸フィルムを得た。このフィルムは、易滑性、透明性、耐屈曲疲労性のいずれも優れたものであった。易滑性、透明性、耐屈曲疲労性については、表１にその特性値を示した。
【００２０】
（実施例３）
実施例１の方法において、４４．８重量部のナイロン６、ナイロン６Ｔ／ナイロン６共重合体（共重合比５０／５０モル比）５０重量部およびポリラウリンラクタム／ポリエーテル共重合体５重量部、平均粒径１．６μｍの多孔質シリカ０．２重量部をＴダイから溶融押出しし、２０℃の回転ドラム上で冷却して厚さ１８０μｍの未延伸ポリアミドフィルムを得た。この未延伸フィルムを９０℃で３．０倍に縦延伸した。次いで１３５℃で横方向に４．０倍延伸し、２１５℃で熱固定を行ない厚み１５μｍの２軸延伸フィルムを得た。このフィルムは、易滑性、透明性、耐屈曲疲労性のいずれも優れたものであった。易滑性、透明性、耐屈曲疲労性については、表１にその特性値を示した。
【００２１】
（比較例３）実施例１の方法において、ナイロン６Ｔ／ナイロン６共重合体（共重合比５０／５０モル比）９４．９重量部およびポリラウリンラクタム／ポリエーテル共重合体５重量部、平均粒径１．６μｍの多孔質シリカ０．１重量部をＴダイから溶融押出しし、２０℃の回転ドラム上で冷却して厚さ１８０μｍの未延伸ポリアミドフィルムを得た。この未延伸フィルムを１２０℃で３．０倍に縦延伸した。次いで１５０℃で横方向に４．０倍延伸し、２１５℃で熱固定を行ない厚み１５μｍの２軸延伸フィルムを得た。このフィルムは、易滑性、透明性のいずれも優れたものであったが、耐屈曲疲労性に劣るものであった。易滑性、透明性、耐屈曲疲労性については、表１にその特性値を示した。
【００２２】
（比較例１）
実施例１の方法において、９４．６重量部のナイロン６、ポリラウリンラクタム／ポリエーテル共重合体５重量部、平均粒径１．６μｍの多孔質シリカ０．４重量部とする以外は、実施例１と全く同様にしており、その特性は表１に示したとおりであり、比較例１のフィルムは透明性は良好であるが高湿度下の易滑性に劣るものであった。
【００２３】
（比較例２）
実施例１の方法において、９３．５重量部のナイロン６、ポリラウリンラクタム／ポリエーテル共重合体５重量部、平均粒径１．６μｍの多孔質シリカ１．５重量部とする以外は、実施例１と全く同様にしており、その特性は表１に示したとおりであり、比較例２のフィルムは易滑性は良好であるが透明性に劣るものであった。
【００２４】
【表１】
【発明の効果】
請求項１記載の易滑性ポリアミド系樹脂フィルムは、透明性と易滑性、特に高湿度下での透明性と易滑性とを同時に満足する。
請求項２記載の易滑性ポリアミド系樹脂フィルムは、透明性と易滑性、特に高湿度下での透明性と易滑性と耐屈曲疲労性を同時に満足する。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a polyamide-based resin film having transparency, bending fatigue resistance and slipperiness at the same time, and more particularly to a polyamide-based resin film having excellent slipperiness under high humidity.
[0002]
[Prior art]
Conventionally, polyamide-based resin films are excellent in mechanical properties including toughness and bending resistance, optical properties, thermal properties, gas barrier properties, etc., so they are widely used in various applications including packaging. ing. However, the conventional polyamide-based resin film has high hygroscopicity as a difficulty derived from the characteristics of the polyamide-based resin itself, and when used in a high-humidity environment, moisture absorption absorbs and the sliding area decreases due to an increase in contact area. There was a problem that the handling workability at the time of processing was remarkably impaired.
As a means for overcoming these problems, a method of reducing the friction coefficient between the friction surfaces of the films or the friction surfaces with the material in contact with the film has been studied. Inactive inorganic fine particles are contained to reduce the coefficient of friction on the film surface, or to add an organic surface lubricant.
[0003]
[Problems to be solved by the invention]
However, the conventional method has a problem that the transparency of the polyamide-based resin film is lowered when the amount of inorganic fine particles added is increased in order to reduce the friction coefficient. The friction coefficient and the transparency of the film have a trade-off relationship, and it has been difficult to obtain a polyamide-based resin film that satisfies both the slipperiness and transparency characteristics. In particular, it has been difficult to obtain a polyamide-based resin film that satisfies transparency and satisfies slipperiness under high humidity.
In addition, the use of organic surface lubricants reduces the surface energy of the film and improves slipperiness, but there is a problem that adhesion when printing or laminating on the film surface is reduced. It has been difficult to increase the amount of lubricant added.
The present invention solves the problems of the above-mentioned conventional polyamide-based resin film, and is a film having transparency, bending fatigue resistance and slipperiness, and at the same time satisfying slipperiness particularly under high humidity. An object is to provide a slippery polyamide resin film.
[0004]
[Means for Solving the Problems]
As a result of diligent investigations to achieve the above object, the present inventors have found that a conventional polyamide resin blended with a low hygroscopic polyamide resin and a bending fatigue resistance improver is transparent when molded into a film. As a result, the present inventors have found that the slipperiness under high humidity is improved and the bending fatigue resistance is good while maintaining the properties. That is, the gist of the present invention is as follows. When the transparency of the film is 5.0% or less in terms of haze and the films are brought into contact friction with each other, the dynamic friction coefficient (A) is 1.0 or less in a 50% humidity atmosphere, and the above dynamic friction coefficient ( A polyamide-based resin film characterized in that the ratio (B) / (A) between A) and the coefficient of dynamic friction (B) in a 65% humidity atmosphere satisfies 1.5 or less. Further, the polyamide-based resin film has 20 or less holes generated in the film after the 1000-fold bending fatigue test. Moreover, it is the laminated body which has arrange | positioned this polyamide-type resin film in the outermost layer.
[0005]
DETAILED DESCRIPTION OF THE INVENTION
Next, the present invention will be described in more detail. The present invention relates to a resin composition obtained by mixing and / or copolymerizing an aliphatic polyamide resin (X) 0 to 95.8 parts by weight, an aromatic polyamide resin (a) and an aliphatic polyamide resin (b). (Y) 90 to 4 parts by weight, and 0.2 to 10 parts by weight of a bending fatigue resistance improver are blended, and 10 components of the aromatic polyamide resin (a) component are contained in the resin composition (Y). It is a polyamide-type resin film characterized by containing more than mol%.
[0006]
Further, the polyamide-based resin film of the present invention contains inorganic fine particles having an average particle size of 0.5 to 5.0 μm, or inorganic and organic fine particles having an average particle size of 0.5 to 5.0 μm with respect to the total amount of the resin. A polyamide-based resin film comprising 0.05 to 1.0 part by weight. Examples of the inorganic fine particles used include silica particles, alumina particles, and calcium carbonate particles, and examples of the organic fine particles include crosslinked acrylic particles and crosslinked polystyrene particles. The fine particles are contained in the polyamide resin film in an amount of 0.05 to 1.0 parts by weight. A preferred content is 0.15 to 0.7 parts by weight. If the content is less than 0.05 parts by weight, the slipperiness is insufficient, which is not preferable. Conversely, if the content exceeds 1.0 part by weight, the transparency of the polyamide-based resin film is deteriorated, which is not preferable. In the present invention, one kind of fine particles may be used, or two or more kinds of fine particles may be used in combination. In addition, inorganic fine particles and organic fine particles may be used in combination. Use of two or more kinds of fine particles in combination is a preferred embodiment for achieving a balance between transparency and slipperiness, and is a recommended fine particle blending method. In the present invention, inorganic and / or organic fine particles having an average particle size of 0.5 to 5.0 μm are used. It is more preferable to use one having an average particle diameter of 1.0 to 4.0 μm. A particle diameter of less than 0.5 μm is not preferable because sufficient slipperiness cannot be imparted. On the other hand, if it exceeds 5.0 μm, the transparency is deteriorated or the halftone printability is lowered.
[0007]
The aliphatic polyamide-based resin (X) of the present invention is at least one selected from nylon 6, nylon 12, nylon 66, nylon 612, nylon 6/66 copolymer, nylon 6/12 copolymer, and / or The polyamide resin film is selected from a combination of two or more.
[0008]
Further, the polyamide resin film, wherein the aromatic polyamide resin (a) of the resin composition (Y) used in the present invention is a polymer obtained by polycondensation of terephthalic acid or isophthalic acid and an aliphatic diamine. It is. In addition, the polyamide resin film is characterized in that the aliphatic polyamide resin (b) of the resin composition (Y) used in the present invention is nylon 6 or nylon 66.
[0009]
In addition, the bending fatigue resistance improver used in the present invention is an elastomer such as block polyesteramide, block polyetheramide, polyetheresteramide elastomer, polyester elastomer, modified ethylene propylene rubber, modified acrylic, or an ethylene / acrylate copolymer. A polyamide-based resin film characterized by being a polymer.
[0010]
The polyamide resin film of the present invention may further contain various additives as long as the purpose and performance are not impaired. For example, an antioxidant, a light resistance agent, an antigelling agent, a lubricant, an organic lubricant, a pigment, an antistatic agent, a surfactant, and the like can be blended.
[0011]
The polyamide resin film of the present invention can be formed by a known film forming method. As the film forming method, a T-die method, an inflation method, or the like is applied.
[0012]
The polyamide resin film of the present invention may be a single layer or a multilayer film such as coextrusion.
[0013]
In addition, the polyamide resin film of the present invention has a polymer layer applied to the film surface by means such as corona discharge treatment, plasma treatment, ultraviolet irradiation treatment, flame treatment, coating, etc., in order to impart printability and adhesion. Can do. Further, an inorganic thin film may be deposited to further improve gas barrier properties. Further, it may be laminated with other types of resin films such as polyethylene and used as a packaging bag.
[0014]
【Example】
EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples. However, the present invention is not limited by the following examples, but may be implemented with appropriate modifications within a scope that can meet the gist of the present invention. These are all included in the technical scope of the present invention. In addition, the measurement of the characteristic value in this specification followed the following method.
[0015]
[Haze]
Based on JIS-K6714, it measured with the Toyo Seiki Seisakusho haze tester.
[0016]
(Dynamic friction coefficient)
The dynamic friction coefficient between the non-surface active treated surfaces of the film was measured in a humidity atmosphere of 50% RH or 65% RH according to ASTM-D-1894 method.
[0017]
[Bend fatigue resistance]
Using a gelbo flex tester manufactured by Riken Corporation, the bending fatigue resistance was measured by the following method. The other end was fixed to the movable head side on the 3.5-inch diameter fixed head side, and the initial gripping interval was 7 inches. Give the film a twist of 440 degrees in the first 3.5 inches of the stroke, and then apply 1000 times of bending fatigue at a speed of 40 times / min. The number of generated pinholes was counted. The measurement was performed in an environment at 25 ° C.
[0018]
Example 1
90.6 parts by weight of nylon 6, 4 parts by weight of nylon 6T / nylon 6 copolymer (copolymerization ratio 50/50 molar ratio) and polylaurin lactam / polyether copolymer (Daicel, manufactured by Huls, Daiamide) 5 0.4 parts by weight of porous silica having an average particle diameter of 1.6 μm was melt-extruded from a T die and cooled on a rotary drum at 20 ° C. to obtain an unstretched polyamide film having a thickness of 180 μm. This unstretched film was longitudinally stretched 3.0 times at 50 ° C. Next, the film was stretched 4.0 times in the transverse direction at 125 ° C. and heat-set at 215 ° C. to obtain a biaxially stretched film having a thickness of 15 μm.
This film was excellent in all of slipperiness, transparency, bending fatigue resistance, printability and adhesiveness. Table 1 shows the characteristic values of slipperiness, transparency, and bending fatigue resistance.
[0019]
(Example 2)
In the method of Example 1, 69.8 parts by weight of nylon 6, 25 parts by weight of nylon 6T / nylon 6 copolymer (copolymerization ratio 50/50 molar ratio) and 5 parts by weight of polylaurin lactam / polyether copolymer Then, 0.2 parts by weight of porous silica having an average particle diameter of 1.6 μm was melt-extruded from a T die and cooled on a rotating drum at 20 ° C. to obtain an unstretched polyamide film having a thickness of 180 μm. This unstretched film was longitudinally stretched 3.0 times at 70 ° C. Subsequently, the film was stretched 4.0 times in the transverse direction at 125 ° C., and heat-fixed at 215 ° C. to obtain a biaxially stretched film having a thickness of 15 μm. This film was excellent in all of slipperiness, transparency, and bending fatigue resistance. Table 1 shows the characteristic values of slipperiness, transparency, and bending fatigue resistance.
[0020]
(Example 3)
In the method of Example 1, 44.8 parts by weight of nylon 6, nylon 6T / nylon 6 copolymer (copolymerization ratio 50/50 molar ratio) 50 parts by weight, and polylaurin lactam / polyether copolymer 5 parts by weight Then, 0.2 parts by weight of porous silica having an average particle diameter of 1.6 μm was melt-extruded from a T die and cooled on a rotating drum at 20 ° C. to obtain an unstretched polyamide film having a thickness of 180 μm. This unstretched film was longitudinally stretched 3.0 times at 90 ° C. Subsequently, the film was stretched 4.0 times in the transverse direction at 135 ° C., and heat-fixed at 215 ° C. to obtain a biaxially stretched film having a thickness of 15 μm. This film was excellent in all of slipperiness, transparency, and bending fatigue resistance. Table 1 shows the characteristic values of slipperiness, transparency, and bending fatigue resistance.
[0021]
( Comparative Example 3 ) In the method of Example 1, 94.9 parts by weight of nylon 6T / nylon 6 copolymer (copolymerization ratio 50/50 molar ratio) and 5 parts by weight of polylaurin lactam / polyether copolymer, average 0.1 parts by weight of porous silica having a particle size of 1.6 μm was melt-extruded from a T die and cooled on a rotating drum at 20 ° C. to obtain an unstretched polyamide film having a thickness of 180 μm. This unstretched film was longitudinally stretched 3.0 times at 120 ° C. Subsequently, the film was stretched 4.0 times in the transverse direction at 150 ° C., and heat-fixed at 215 ° C. to obtain a biaxially stretched film having a thickness of 15 μm. This film was excellent in both slipperiness and transparency, but inferior in bending fatigue resistance . Table 1 shows the characteristic values of slipperiness, transparency, and bending fatigue resistance.
[0022]
(Comparative Example 1)
In the method of Example 1, except that 94.6 parts by weight of nylon 6, 5 parts by weight of polylaurin lactam / polyether copolymer, and 0.4 parts by weight of porous silica having an average particle diameter of 1.6 μm were carried out. The properties were exactly the same as in Example 1. The properties were as shown in Table 1. The film of Comparative Example 1 had good transparency but poor slipperiness under high humidity.
[0023]
(Comparative Example 2)
In the method of Example 1, except that 93.5 parts by weight of nylon 6, 5 parts by weight of polylaurin lactam / polyether copolymer, and 1.5 parts by weight of porous silica having an average particle size of 1.6 μm were carried out. The characteristics were exactly the same as in Example 1. The properties were as shown in Table 1. The film of Comparative Example 2 had good slipperiness but was inferior in transparency.
[0024]
[Table 1]
【The invention's effect】
The slippery polyamide resin film according to claim 1 satisfies both transparency and slipperiness, in particular, transparency and slipperiness under high humidity at the same time.
The slippery polyamide resin film according to claim 2 satisfies both transparency and slipperiness, particularly transparency, slipperiness and bending fatigue resistance under high humidity.
Claims (3)
Priority Applications (13)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14367198A JP4066104B2 (en) | 1998-05-26 | 1998-05-26 | Polyamide resin film |
| US09/317,002 US6376093B1 (en) | 1998-05-26 | 1999-05-24 | Polyamide film and polyamide laminate film |
| KR1019990018797A KR100612626B1 (en) | 1998-05-26 | 1999-05-25 | Polyamide film and laminated polyamide film |
| AT04004033T ATE401366T1 (en) | 1998-05-26 | 1999-05-26 | POLYAMIDE FILM AND POLYAMIDE LAMINATE FILM |
| CNB991075293A CN1137187C (en) | 1998-05-26 | 1999-05-26 | Polyamide film and laminated polyamide film |
| EP20040004033 EP1439202B1 (en) | 1998-05-26 | 1999-05-26 | Polyamide film and polyamide laminate film |
| AT99109257T ATE286522T1 (en) | 1998-05-26 | 1999-05-26 | POLYAMIDE FILM AND POLYAMIDE COMPOSITE FILM |
| DE69939131T DE69939131D1 (en) | 1998-05-26 | 1999-05-26 | Polyamide film and polyamide laminate film |
| DE1999623031 DE69923031T2 (en) | 1998-05-26 | 1999-05-26 | Polyamide film and polyamide composite film |
| CNB031461417A CN100493902C (en) | 1998-05-26 | 1999-05-26 | Double-shaft oriented polyamide thin film and laminated double-shaft oriented polyamide thin film |
| EP19990109257 EP0960903B1 (en) | 1998-05-26 | 1999-05-26 | Polyamide film and polyamide laminate film |
| HK00101377A HK1023134A1 (en) | 1998-05-26 | 2000-03-03 | Polyamide film and laminated polyamide film |
| KR1020060027893A KR100660775B1 (en) | 1998-05-26 | 2006-03-28 | Polyamide film and laminated polyamide film |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14367198A JP4066104B2 (en) | 1998-05-26 | 1998-05-26 | Polyamide resin film |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2006001176A Division JP2006117955A (en) | 2006-01-06 | 2006-01-06 | Polyamide-based resin film |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11335470A JPH11335470A (en) | 1999-12-07 |
| JP4066104B2 true JP4066104B2 (en) | 2008-03-26 |
Family
ID=15344239
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14367198A Expired - Lifetime JP4066104B2 (en) | 1998-05-26 | 1998-05-26 | Polyamide resin film |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4066104B2 (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2020170714A1 (en) * | 2019-02-18 | 2020-08-27 | 東洋紡株式会社 | Biaxially stretched polyamide film and laminate film |
| JP7322458B2 (en) * | 2019-03-28 | 2023-08-08 | 東洋紡株式会社 | Easy adhesion polyamide film |
-
1998
- 1998-05-26 JP JP14367198A patent/JP4066104B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH11335470A (en) | 1999-12-07 |
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