JP4059414B2 - Non-contact IC card manufacturing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a non-contact IC card manufacturing apparatus having a function of simultaneously sucking and transferring a plurality of workpieces made of a thin plate such as an antenna coil and a COB chip of a non-contact IC card.
[0002]
[Prior art]
In the manufacturing process of the non-contact IC card, the lead wire including the winding start line and the winding end line of the antenna coil is joined to the COB chip. After that, there is a step of adsorbing and transferring the antenna coil and the COB chip to adhere to the adhesive core sheet. Since the antenna coil and the COB chip need to be attracted and transferred at the same time while maintaining the mutual positional relationship, a slider robot is used for the attracting and transferring process. The positional relationship between the antenna coil and the COB chip is maintained by the slider robot, and the tension of the lead wire is kept constant, and is affixed on the adhesive sheet.
[0003]
FIG. 4 is a diagram showing a carrier jig on which an antenna coil and a COB chip are mounted. The carrier jig 1 is a thin plate-like piece that simultaneously conveys the antenna coil 2 and the COB chip 3. The antenna coil 2 is positioned by the convex portion 5 at the center of the carrier jig 1. On the other hand, the COB chip 3 is positioned in the vicinity of the convex portion 5 on the basis of the outer shape, and the antenna coil 2 and the COB chip 3 are connected by the lead wire 4.
[0004]
FIG. 5 is an explanatory diagram centering on a suction unit in a conventional non-contact IC card manufacturing apparatus. In FIG. 5, a suction unit 14 is attached to the movable part of the slider robot 9 via a cylinder 8. The suction unit 14 includes an antenna coil suction pad 6 and a COB chip suction pad 7. The antenna coil adsorption pad 6 can adsorb the antenna coil 2, and the COB chip adsorption pad 7 can adsorb the COB chip 3, and can be transferred along the movable part of the slider robot 9.
[0005]
[Problems to be solved by the invention]
In order to satisfy the function of the non-contact IC card, it is required that the tension of the lead wire 4 connecting the antenna coil 2 and the COB chip 3 is changed and attached to the adhesive core sheet. However, in the conventional non-contact IC card manufacturing apparatus, since the positional relationship between the antenna coil suction pad 6 and the COB chip suction pad 7 of the suction unit 14 is fixed, the tension of the lead wire 4 cannot be changed. There wasn't.
[0006]
An object of the present invention is to provide a non-contact IC capable of transferring an antenna coil and a COB chip by controlling the tension of the lead wire of the antenna coil joined between them in the manufacture of a non-contact IC card. It is to provide a card manufacturing apparatus.
[0007]
The present invention has a slider robot, a suction unit attached to a movable part of the slider robot, and an antenna coil and a COB chip mounted on a non-contact IC card are sucked by a suction pad provided in the suction unit and transferred. The suction unit includes an antenna coil suction pad and a COB chip suction pad, and has a mechanism capable of adjusting a relative position between the antenna coil suction pad and the COB chip suction pad. This is a non-contact IC card manufacturing apparatus.
[0008]
The non-contact IC card manufacturing apparatus according to the present invention abuts on the suction unit moving along the movable part, defines the position of the moving end of the suction unit, and is positioned between the antenna coil suction pad and the COB chip suction pad. A stopper is provided that can release the restriction of the target position and change the relative position between the antenna coil and the COB chip.
[0009]
The non-contact IC card manufacturing apparatus of the present invention, among the antenna coil suction pad and COB chip suction pad, an antenna coil suction pad for sucking the antenna coil, the antenna mounted on a carrier jig having a projecting portion Even if play occurs in the coil mounting position, the antenna coil suction pad is within the range that is allowed to mount the antenna coil on the carrier jig, which is defined by the convex portion of the carrier jig. The antenna coil can be stably adsorbed by determining the position and adopting a mechanism for adsorbing and transferring the antenna coil.
[0010]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings.
[0011]
FIG. 1 is a block diagram of a non-contact IC card manufacturing apparatus according to the present invention. FIG. 2 is an explanatory diagram centering on a suction unit in the non-contact IC card manufacturing apparatus according to the present invention.
[0012]
The antenna coil suction pad 6 sucks the antenna coil 2, and the COB chip suction pad 7 sucks the COB chip 3. A plurality of antenna coil suction pads 6 are arranged in accordance with the coil shape. The suction unit 14 is attached to the movable portion of the slider robot 9 via the cylinder 8 and can move in the horizontal direction and the vertical direction. The suction unit 14 includes an antenna coil suction pad 6 and a COB chip suction pad 7. When the carrier jig 1 carrying the antenna coil 2 and the COB chip 3 soldered to each other is sent to the slider robot 9, the suction unit 14 is lowered by the cylinder 8 and the antenna coil 2 and the COB chip. 3 is adsorbed and rises. The COB chip suction pad 7 is attached to the slider 10 provided in the suction unit 14 and moves individually in parallel with the moving direction of the slider robot 9. However, the position of the COB chip suction pad 7 is normally restricted by the spring 11.
[0013]
The adsorption unit 14 that adsorbs the antenna coil 2 and the COB chip 3 is moved by the slider robot 9. When the standby stopper 12 comes into contact with the suction unit 14 at the end position of the movement, the restraint by the spring 11 is released, and the COB chip suction pad 7 slides with the slider 10 to be connected to the antenna coil suction pad 6. The distance between changes. Further, by adjusting the contact position of the stopper 12, the position of the COB chip suction pad 7 with respect to the antenna coil suction pad 6 can be finely adjusted.
[0014]
On the other hand, an adhesive core sheet 13 pre-applied with an adhesive is prepared under the position of the movement end of the slider robot 9. In a state where the relative position of the antenna coil suction pad 6 and the COB chip suction pad 7 is adjusted, that is, in a state where the relative position of the antenna coil 2 and the COB chip 3 is adjusted, the adhesive core is lowered by the lowering of the cylinder 8. Affixed on the sheet 13.
[0015]
FIG. 3 is a diagram showing a range where the antenna coil exists on the carrier jig. The antenna coil 2 is positioned by a convex portion 5 having substantially the same diameter as the inner diameter portion of the antenna coil 2. However, since the diameter of the convex portion 5 is slightly smaller than the inner diameter portion of the antenna coil 2, the antenna coil 2 is not firmly fixed on the carrier jig 1, and play occurs.
[0016]
Even if the antenna coil 2 is mounted with a maximum deviation within the range of play of the antenna coil 2 defined by the convex portion 5 of the carrier jig, it is easy to determine the position where the antenna coil 2 always exists. By fixing the position where the antenna coil 2 is attracted by the antenna coil suction pad within the range where the antenna coil 2 is always present, even in the case of the antenna coil 2 having a small number of turns and a narrow width, the suction and transfer can be stabilized. Can be done.
[0017]
【The invention's effect】
As described above, according to the non-contact IC card manufacturing apparatus of the present invention, in the manufacture of the non-contact IC card, the antenna coil and the COB chip are controlled, and the tension of the lead wire of the antenna coil joined between them is controlled. Can be transferred.
[Brief description of the drawings]
FIG. 1 is a configuration diagram of a non-contact IC card manufacturing apparatus according to the present invention.
FIG. 2 is an explanatory view centering on a suction unit in a non-contact IC card manufacturing apparatus according to the present invention.
FIG. 3 is a view showing a range where an antenna coil exists on a carrier jig;
FIG. 4 is a diagram showing a carrier jig on which an antenna coil and a COB chip are mounted.
FIG. 5 is an explanatory diagram centering on a suction unit in a conventional non-contact IC card manufacturing apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Carrier jig 2 Antenna coil 3 COB chip 4 Lead wire 5 Convex part 6 Antenna coil adsorption pad 7 COB chip adsorption pad 8 Cylinder 9 Slider robot 10 Slider 11 Spring 12 Stopper 13 Adhesive sheet 14 Adsorption unit

Claims (4)

The slider robot has a suction unit attached to the movable part of the slider robot, and the antenna coil and COB chip mounted on the non-contact IC card are sucked by the antenna coil suction pad and the COB chip suction pad constituting the suction unit. The non-contact IC card manufacturing apparatus to be transferred, wherein the antenna coil suction pad sucks the antenna coil, the COB chip suction pad sucks the COB chip, and the COB chip suction pad slides, A non-contact IC card manufacturing apparatus having a mechanism for changing a distance from an antenna coil suction pad .   The non-contact IC card manufacturing apparatus according to claim 1, further comprising a stopper that abuts the suction unit moving along the movable portion and defines a position of a moving end of the suction unit. The non-coefficient of claim 2, wherein the COB chip suction pad is restrained in position by a spring, and the stopper is brought into contact with the suction unit to release the restraint by the spring. Contact IC card manufacturing equipment. The antenna coil suction pad is provided with play at a position where the antenna coil is mounted on a carrier jig for carrying the antenna coil, and the antenna coil mounted within the play range is biased. be, the non-contact IC card manufacturing apparatus according to any one of claims 1 to 3, characterized in that it has a mechanism for adsorbing defining a position where the antenna coil is always present.

Images