JP4027449B2 - 半導体薄膜及び半導体装置の作製方法 - Google Patents
半導体薄膜及び半導体装置の作製方法 Download PDFInfo
- Publication number
- JP4027449B2 JP4027449B2 JP33634196A JP33634196A JP4027449B2 JP 4027449 B2 JP4027449 B2 JP 4027449B2 JP 33634196 A JP33634196 A JP 33634196A JP 33634196 A JP33634196 A JP 33634196A JP 4027449 B2 JP4027449 B2 JP 4027449B2
- Authority
- JP
- Japan
- Prior art keywords
- film
- oxide film
- silicon
- heat treatment
- region
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Recrystallisation Techniques (AREA)
- Thin Film Transistor (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33634196A JP4027449B2 (ja) | 1996-02-23 | 1996-12-02 | 半導体薄膜及び半導体装置の作製方法 |
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8-61897 | 1996-02-23 | ||
| JP8-61898 | 1996-02-23 | ||
| JP6189796 | 1996-02-23 | ||
| JP6189896 | 1996-02-23 | ||
| JP33634196A JP4027449B2 (ja) | 1996-02-23 | 1996-12-02 | 半導体薄膜及び半導体装置の作製方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPH09289168A JPH09289168A (ja) | 1997-11-04 |
| JPH09289168A5 JPH09289168A5 (cg-RX-API-DMAC10.html) | 2004-11-18 |
| JP4027449B2 true JP4027449B2 (ja) | 2007-12-26 |
Family
ID=27297673
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33634196A Expired - Fee Related JP4027449B2 (ja) | 1996-02-23 | 1996-12-02 | 半導体薄膜及び半導体装置の作製方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP4027449B2 (cg-RX-API-DMAC10.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5063640B2 (ja) * | 2009-04-27 | 2012-10-31 | 株式会社半導体エネルギー研究所 | 半導体装置 |
| JP5770068B2 (ja) * | 2010-11-12 | 2015-08-26 | 株式会社半導体エネルギー研究所 | 半導体装置 |
Family Cites Families (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH02143417A (ja) * | 1988-11-24 | 1990-06-01 | Sharp Corp | 半導体装置の製造方法 |
| JPH06132218A (ja) * | 1992-10-15 | 1994-05-13 | Sony Corp | 半導体結晶の成長方法及びmos型トランジスタの作製方法 |
| JP2649325B2 (ja) * | 1993-07-30 | 1997-09-03 | 株式会社半導体エネルギー研究所 | 半導体装置の作製方法 |
| JP3041177B2 (ja) * | 1993-12-27 | 2000-05-15 | シャープ株式会社 | 半導体装置の製造方法 |
| JP3229750B2 (ja) * | 1994-02-22 | 2001-11-19 | 三洋電機株式会社 | 多結晶半導体膜、それを用いた半導体装置及び太陽電池 |
| JP3216861B2 (ja) * | 1995-04-10 | 2001-10-09 | シャープ株式会社 | 多結晶シリコン膜の形成方法および薄膜トランジスタの製造方法 |
| JP3476320B2 (ja) * | 1996-02-23 | 2003-12-10 | 株式会社半導体エネルギー研究所 | 半導体薄膜およびその作製方法ならびに半導体装置およびその作製方法 |
-
1996
- 1996-12-02 JP JP33634196A patent/JP4027449B2/ja not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH09289168A (ja) | 1997-11-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP4001702B2 (ja) | 半導体装置の作製方法 | |
| KR100447311B1 (ko) | 반도체박막,반도체장치및이의제조방법 | |
| US7812351B2 (en) | Thin film semiconductor device and its manufacturing method | |
| CN100388636C (zh) | 半导体薄膜及其制造方法以及半导体器件及其制造方法 | |
| JP3645380B2 (ja) | 半導体装置の作製方法、情報端末、ヘッドマウントディスプレイ、ナビゲーションシステム、携帯電話、ビデオカメラ、投射型表示装置 | |
| JP3753845B2 (ja) | 半導体装置の作製方法 | |
| JPH09289165A (ja) | 半導体薄膜およびその作製方法ならびに半導体装置およびその作製方法 | |
| JPH09289168A (ja) | 半導体薄膜およびその作製方法ならびに半導体装置およびその作製方法 | |
| JPH09289167A (ja) | 半導体薄膜およびその作製方法ならびに半導体装置およびその作製方法 | |
| CN100592480C (zh) | 薄膜半导体、半导体器件以及薄膜晶体管的制造方法 | |
| CN100502053C (zh) | 半导体器件 |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20070807 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20070911 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20071009 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20071010 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101019 Year of fee payment: 3 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101019 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20101019 Year of fee payment: 3 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111019 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20111019 Year of fee payment: 4 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121019 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20121019 Year of fee payment: 5 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20131019 Year of fee payment: 6 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |