JP4016550B2

JP4016550B2 - Manufacturing method of high frequency relay

Info

Publication number: JP4016550B2
Application number: JP33512999A
Authority: JP
Inventors: 貴俊林; 厚仲畑; 託嗣山下; 英俊竹山; 浩二佐川; 哲也山田
Original assignee: Matsushita Electric Works Ltd
Current assignee: Panasonic Electric Works Co Ltd
Priority date: 1999-11-25
Filing date: 1999-11-25
Publication date: 2007-12-05
Anticipated expiration: 2019-11-25
Also published as: JP2001155612A

Description

【０００１】
【発明の属する技術分野】
本発明は、高周波リレーの製造方法に関するものである。
【０００２】
【従来の技術】
従来の高周波リレーとしては図１１に示す構造のものがある。
【０００３】
この従来例は、リレー機構部を配設するベース１００と、このベース１００に被着されるケース１０１と、継鉄１０２，コイル１０３、鉄心１０４からなる電磁石ブロック１０５と、カードブロック１０６と、シールドボックス１０７と、カードブロック１０６側に設けられた可動接点ばね板１０８，１０８と、固定接点端子１０９ａ〜１０９ｄ等から構成されており、シールドボックス１０７は一枚の金属板から折り曲げ加工と打ち抜き加工によりボックス部とアース端子１１０…を一体形成している。
【０００４】
この従来例のカードブロック１０６は、略直方体状のカード１１２の長手方向一端部に設けた貫通孔に永久磁石１１３を介在させた一対の接極子１１４，１１４を配設し、一方の接極子１１４を上記電磁石ブロック１０５の鉄心１０４の一方の磁極面と継鉄１０２の一端部の先端部との間に位置させ、他方の接触子１１４の鉄心１０４の他方の磁極面と継鉄１０２の他端側の先端部との間に位置するように電磁石ブロック１０５上に載置する構成である。尚図中１１１は平衡ばねである。
【０００５】
【発明が解決しようとする課題】
ところで上記の従来例の可動接点ばね板１０８は、図１２に示すように上下幅が一様な短冊型に抜き形成されもので、その中央部をカードブロック１０６から垂下されている樹脂成形品のばね支持部１１５にインサートされて、カードブロック１０６に支持される構成となっているため、ばね支持部１１５で覆われている中央部の回りの誘電率が合成樹脂成形材の影響を受けて、覆われていない部位に比べて大きく、インピーダンスが小さくなってしまい、結果可動接点ばね板１０８のインピーダンスが部分的に小さくなり不整合が生じるという問題があった。
【０００６】
また従来例の可動接点板ばね板１０８はインサート成形を簡略化するために図１３に示すようにカードブロック１０６とは別部品の合成樹脂成形品の角柱状のばね支持部１１５にまずインサート成形されて、このばね支持部１１５とでばねブロックを構成し、このブロック化された後にばね支持部１１５の上端面をカードブロック１０６に接着固定してカードブロック１０６に支持されるようになっていた。そのため生産性が悪い上に、作業工数が増えて可動接点ばね板の変形が生じる恐れがあった。
【０００７】
本発明は、上述の点に鑑みて為されたもので、請求項１の発明の目的とするところは、可動接点ばね板を支持したカードの製作が効率良く行え、しかも可動接点ばね板の可動接点部位に金メッキを施す際に、無駄となる金メッキ材を低減した高周波リレーの製造方法を提供することにある。
【００１２】
【課題を解決するための手段】
請求項１の発明では、金属フープ材の両側に長手方向に沿って枠片を抜き形成するともに、各枠片の内側縁に連設される形で、金属フープ材の長手方向に直交するように内向きに連結片を一定間隔で一体に抜き形成し、且つ近接並行する対の連結片の先部対向側縁に連設される形で、互いに平行する可動接点ばね板を夫々一体に抜き形成し、この状態で両可動接点ばね板の両端部の同方向の片面に吹き付けメッキにより金メッキを施し、この金メッキ処理後、各枠片に対応する連結片及び可動接点ばね板が当該枠片から分離されない状態で、両側の枠片を独立分離させた後一方の枠片を裏返し、当該枠片の連結片に連設されている可動接点ばね板の両端方向と、他方の枠片の対となる連結片に連設されている可動接点ばね板の両端方向とが、枠片の長手方向に直交する方向の同一直線上に位置し、且つ両可動接点ばね板の板面の位置が板面方向に所定距離ずれるように両枠片を並行させ、この並行状態で同一直線上の一対の可動接点ばね板の夫々の中心部をインサートする形で合成樹脂成形材によりカードを成形し、該成形後各可動接点ばね板を連結片より分離して可動接点ばね板を支持したカードを得ることを特徴とする。
【００１８】
【発明の実施の形態】
以下本発明を一実施形態により説明する。
【００１９】
本実施形態は図２、図３に示すように合成樹脂成形材からなるベース１と、このベース１上に配設されるリレー機構部と、ベース１に被着する合成樹脂成形剤からなる箱状のケース２とで構成される。
【００２０】
リレー機構部の主要な構成である電磁石ブロック５は励磁コイル６を巻回したコイルボビン７と、コイルボビン７の中心透孔に貫挿させた鉄心８と、コイルボビン７の一端側にのぞいた鉄心８の一端を先部板面にかしめ固定して、この先部よりコイルボビン７に並行するように折り曲げてこの折曲片の先端をコイルボビン７の他端側に延長した継鉄９とから構成される。
【００２１】
この電磁石ブロック５は、コイルボビン７に設けたコイル端子１０、１０の下部を図４に示すようにベース１に設けた挿通孔１１よりベース１下面側に突出するようにベース１上に配置される。
【００２２】
電磁石ブロック５の励磁時に吸引駆動される接極子１２はＬ字状に曲げられた鉄片により形成され、一片１２ａをコイルボビン７の他端側に露出した鉄心８の他端に対向させるとともにその屈曲部の内隅を上記継鉄９の折曲片の先端に回動自在に当てるように配設される。また他片１２ｂの先端を後述するカード４の側面に当接させるようになっている。
【００２３】
ヒンジばね３は接極子１２の配設側のベース１上の一端部に設けた側壁２５の低位部１３に形成せる圧入溝１４に下部を圧入して配置され、一側端の上側より斜交いに延長形成した押さえ片３ａの先部で接極子１２の屈曲部の外隅を押圧して接極子１２の内隅部を継鉄９に押し当てて保持するようになっている。
【００２４】
電磁石ブロック５の配設部位と並行するベース１の片側上部には隔壁１５で電磁石ブロック５の配設部位と区切られ、隔壁１５及びベース１の一方側の側壁３６と両端の側壁２５とで囲まれたベース１上空間を接点部を内包するシールド部の配設部位としている。
【００２５】
このシールド部は並行配設される２枚のシールド板１６Ａ，１６Ｂから構成され、シールド部配設部位の両端側の側壁１５の内側面に沿うようにベース１上に図４（ａ）に示すように形成した各リブ１７の両側面に両シールド板１６Ａ，１６Ｂの両端部の対向面を接面させて配設される。
【００２６】
このリブ１７はベース１のシールド板１６Ａ，１６Ｂの位置決めを行うためのもので、両シールド板１６Ａ，１６Ｂの配設位置はリブ１７の成形精度により決まり、しかもシールド板１６Ａ，１６Ｂの対向面側を接面する構成であるためシールド板１６Ａ，１６Ｂの板厚のばらつきの影響を受けず、そのためシールド板１６Ａ，１６Ｂの内側の板面間距離を高精度に設定できる。
【００２７】
このシールド板１６Ａ，１６Ｂ間を２分する中心線上において、シールド板１６Ａ，１６Ｂの中央位置に対応する位置と、上記各リブ１７の近傍の位置とに図４（ａ）に示すように夫々設けた孔１８を介して固定接点端子１９ａ、１９ｂ、１９ｃを夫々貫設してあり、各固定接点端子１９ａ〜１９ｃの固定接点２０をシールド板１６Ａ，１６Ｂで囲まれた空間内に臨ませている。
【００２８】
ここでシールド部の配設部位の両端側にあるベース１の各側壁２５の上端には、接極子１２により駆動されるカード４の両端部に設けた回動枢軸部２１を支持してカード４をシールド部上方に橋架配置する支持部２２，２２を形成している。
【００２９】
カード４は可動接点ばね板２３Ａ，２３Ｂのインピーダンスに影響を与えるのを少なくし、特性インピーダンスの整合をとりやすくするために、空気の誘電率に近いテフロン（誘電率２．０）等の合成樹脂成形材料を使用した成形品からなり、上部両端面に回動枢軸部２１を一体形成するとともに下部両端部には可動接点ばね板２３Ａ，２３Ｂの中央部をインサート成形により支持したばね支持部２４を夫々設け、シールド部配設部位の上方に橋架配置されることで、可動接点ばね板２３Ａ，２３Ｂをシールド板１６Ａ，１６Ｂ間に配置するようになっている。
【００３０】
ここでカード４はベース１の両端側の側壁２５，２５の上端部に設けた回動支持部２２，２２により回動枢軸部２１が回動自在に支持されて橋架されるため、インサート成形によりばね支持部２４、２４に保持される可動接点ばね板２３Ａ，２３Ｂのベース１の上面に対する位置は高精度で設定されることになる。
【００３１】
回動枢軸部２１は図５（ａ）（ｂ）に示すように先部に正面断面が円形の軸部２１ａを形成するとともに、この軸部２１ａの背部に下部の正面断面が略逆三角形の回動支点部２１ｂを一体形成し、この回動支点部２１ｂの下端面を両側面にかけて円弧状の曲面としてその最下端位置を軸部２１ａの中心の高さ位置に一致させている。
【００３２】
一方、回動支持部２２は側壁２５の内側面に沿って形成されて上端面で回動支点部２１ｂを支持する支持台２２ａと、支持台２２ａに連続して側壁２５の上端部に形成され上端開放の角孔２２ｂとからなり、角孔２２ｂの両側内面間の距離を軸部２１ａの直径と同じとするとともに底部と上記回動支点部２１ｂの上端面の高さ位置までの距離を軸部２１ａの半径よりやや大きくし、軸部２１ａの下端と底部との間に隙間ができるようにしてある。
【００３３】
さてカード４の夫々のばね支持部２４にインサート成形により支持されている２枚の可動接点ばね板２３Ａ，２３Ｂは固定接点端子１９ａ〜１９ｃを結ぶ線の両側に偏倚配置されており、第１の可動接点ばね板２３Ａの両端部は中央の固定接点端子１９ａの固定接点２０の一面と、一端側の固定接点端子１９ｂの固定接点２０の一面とに対して夫々接触開離する可動接点を構成し、第２の可動接点ばね板２３Ｂの両端部は中央の固定接点端子１９ａの固定接点２０の他面と、他端側の固定接点端子１９ｂの固定接点２０の他面とに対して夫々接触開離する可動接点を構成するもので、これらの接触開離の動作はカード４の回動によって行われる。
【００３４】
シールド板１６Ａ，１６Ｂは夫々に近接する側の可動接点ばね板２３Ａ，２３Ｂのばね支持部２４を逃がすための逃げ部２６を中央から一端間の部位を反対方向へ曲げ加工により凹ませることで形成しており、この逃げ部２６両側のシールド板１６Ａ，１６Ｂの平坦面により可動接点ばね板２３Ａ，２３Ｂの両端部が固定接点２０より開離して移動したときに接触するアース接点部を構成する。
【００３５】
また各シールド板１６Ａ，１６Ｂは共に同じ形状であって、夫々２本のアース端子２７ａ，２７ｂを一体に形成している（図６、図７参照）。尚各シールド板１６Ａ、１６Ｂの夫々の端部から最も近いアース端子までの距離をアンテナ効果が生じないように開閉する信号の波長のλ／３０以下としている。
【００３６】
更にシールド板１６Ａ，１６Ｂはベース１に配設したときに固定接点端子１９ａと、１９ｂ又は１９ｃとの間に位置するように逃げ部２６の形成部位の一端にアース端子２７ａを形成しており、このアース端子２７ａは、逃げ部２６を形成する部位の一端部下端より内側方向に直角に折り曲げて、その先端がベース１に配設時に固定接点端子１８ａ〜１８ｃを結ぶ直線上に位置するように延長形成した幅広片２８ａの先端より更に下方に直角に折り曲げた垂下片２８ｂの下端部の一端から更に垂下延長した細幅の板片からなる。他方のアース端子２７ｂは逃げ部２６を形成する部位の他端近傍の逃げ部２６外の位置より内側方向に直角に折り曲げてその先端が、ベース１に配設時に固定接点端子１８ａ〜１８ｃを結ぶ直線上に位置するように延長形成した幅広片２８ａ’の先端より更に下方に直角に折り曲げた垂下片２８ｂ’の下端部の一端から更に垂下延長した細幅の板片からなる。
【００３７】
このように形成されたシールド板１６Ａ，１６Ｂはベース１上に点対称的に配置することで、アース端子２７ａ、２７ｂを中央の固定接点端子１９ａと、端部の固定接点端子１９ｂ或いは１９ｃの間に配置することができるようになっている。
【００３８】
而してシールド板１６Ａ、１６Ｂをシールド部配設部位に配設する際には、それらの両端部の対向面を上述したようにリブ１７，１７の両側面に当接して位置決めするとともに、夫々の各アース端子２７ａ、２７ｂを一体形成している垂下片２８ｂ，２８ｂ’の幅に対応させてベース１に貫通させた挿通孔２９…を介して各アース端子２７ａ、２７ｂをベース１下面側に突出させるとともに垂下片２８ｂ又は２８ｂ’を挿通孔２９に挿入する。
【００３９】
そして上記のようにシールド板１６Ａ，１６Ｂをシールド部配設部位に配設した後に、ベース１の両端の側壁２５，２５の回動支持部２２にカード４の両端の回動枢軸部２１を回動自在に支持させてカード４をシールド部配設部位上方に橋架配設することで、可動接点ばね板２３Ａを固定接点端子１９ａ，１９ｂとシールド板１６Ａの逃げ部２６との間に、また可動接点ばね板２３Ｂを固定接点端子１９ａ、１９ｃとシールド板１６Ａの逃げ部２６との間に配置することができるのである。
【００４０】
カード４を橋架配設する場合は、側壁２５側の回動支持部２２の角孔２２ｂ内に上端開口より軸部２１ａを嵌めるとともに、支点台２２ａの上端面に回動支点部２１ｂを図８に示すように載置させることで、カード４はベース１の両端側壁間に橋架される。これにより角孔２２と軸部２１ａとで水平方向の支持を、また支点台２２ａと回動支点部２１ｂとで上下方向の支持を分担し、且つ軸部２１ａの中心と支点台２２ａの上端面の位置を一致させることで１カ所で支持する場合に比べて確実に回動枢軸部２１を支持することができるようになっている。また軸部２１ａの下端が角孔２２ｂの底部より浮く状態にあるためベース１の成形時に発生するバリを逃がすことができる。
【００４１】
橋架配設したカード４は復帰ばね３１により常時シールド板１６Ａ方向に下部側面が押圧付勢される。この復帰ばね３１はベース１の側壁３６の片側内面に形成した圧入溝３２に基部３１ａを圧入し、基部３１ａの上部一端よりシールド板１６Ｂ方向へ延長形成したばね片３１ｂの先端をシールド板１６Ｂの上端より上方に位置するカード４の下部側面に弾接し、電磁石ブロック５が非励磁状態において、回動枢軸部２１を中心としてカード４を回動させて内側の可動接点ばね板２３Ａの両端部をシールド板１６Ａの逃げ部２６両端の近傍の板面に当接させ、外側の可動接点ばね板２３Ｂの両端部を固定接点端子１９ａ，１９ｃの固定接点２０，２０に接触させるようになっている。尚可動接点ばね板２３Ａ，２３Ｂの両端部の可動接点を構成する部位は二股に分割してある。
【００４２】
ここで図３（ａ）に示すように、ばね片３１ｂが押圧するカード４の側面部位の反対側の同じ位置にカード４の側面部位には接極子１２の他片１２ｂの先端が当接するようになっており、この当接部位及びばね片３１ｂの押圧部位が相対向して力のバランス（均衡）を図り、リレー動作が安定するようにしてある。また夫々の部位を図９に示すように側面より突出する凸部３３とし、ばね片３１ｂや他片１２ｂの当たる部分のずれを少なくして摩擦を防止している。
【００４３】
さてベース１に電磁石ブロック５，シールド板１６Ａ，１６Ｂ、固定接点端子１９ａ〜１９ｄ、可動接点ばね板２３Ａ，２３Ｂを含むカード４、接極子１２，ヒンジばね３，復帰ばね３１等のリレー機構部の部材を配設した後、復帰ばね３１やヒンジばね３のばね圧調整を行う場合には、これらばね３１，３が臨むベース１の側壁２５の開口２５ａや側壁３６の開口３６ａから容易に行うことができる。
【００４４】
ばね圧調整終了後ベース１の両端の側壁２５や両側の側壁３６を内部に収めるようにしてベース１にケース２を被着すれば、所望の高周波リレーが完成することになる。
【００４５】
ところで本実施形態の高周波リレーとしては、カード４の合成樹脂成形材の誘電率を上述のように空気に近い低い誘電率としても、ばね支持部２４で覆われる部分と、覆われない部分との間では誘電率が異なるため、インピーダンス整合をとりにくい。また製品としてインピーダンスが７５Ω（映像信号などの開閉に用いる場合）仕様のものと、５０Ω（無線用の通信信号を開閉する場合）仕様のものとが要求される。そこで、上記の誘電率の影響を考慮し、しかもインサート成形の金型の変更を招くことなく、伝送路の特性インピーダンスを調整してインピーダンス整合を図る手段として、本実施形態ではばね支持部２４にインサートされる可動接点ばね板２３Ａ，２３Ｂの中央部の形状を用いた。
【００４６】
つまり、図１（ａ）に示すようにばね支持部２４に覆われる可動接点ばね板２３の中央部に突出部３５や凹み３８を形成したり、同図（ｂ）に示すように更に孔３９を追加したり、また同図（ｃ）に示すように可動接点ばね板２３の中央部の板厚を細くしたり或いは太くすることによりインピーダンス調整を行って合成樹脂成形材の誘電率の影響を軽減と同時にインピーダンス整合を図っている。
【００４７】
またばね支持部２４を含むカード４の合成樹脂成形材として誘電率が大きなＰＢＴやＬＣＰを使用した場合にも、上記形状を調整することで、その影響を軽減することも可能である。
【００４８】
また可動接点ばね板２３の両端部に形成せる二股状の可動接点部位において、二股状に分ける溝の長さを異ならせることで形状変更しても良い。
【００４９】
更に上記の突出部３５，凹み３８，孔２９，板厚、更に分割の溝の内の少なくとも２つ以上の組み合わせを用いても勿論よい。
【００５０】
尚図１（ｃ）は板厚の違いを明瞭にするために、可動接点ばね板２３の板厚を強調して示している。
【００５１】
ところで可動接点ばね板２３Ａ、２３Ｂの板幅が負荷応力に耐えれない細い場合は中央部の板幅を幅広とすることで、負荷応力に耐えることが可能となる。一方高周波特性を良好にするためには可動接点ばね板２３Ａ，２３Ｂの下端縁をベース１に近づける必要がある。そこで上記のように中央部の板幅を広くしてインピーダンスの整合を図る場合には、中央部を除いた可動接点ばね板２３Ａ、２３Ｂの上下端縁を全長に亘って平行させ、中央部を上方へ突出させる形で幅広とすることで、負荷応力に耐え、しかも図３（ｂ）に示すように可動接点ばね板２３Ａ，２３Ｂの下端をベース１に近付けることができる。
【００５２】
而してこれらの可動接点ばね板２３Ａ，２３Ｂをインサート成形してばね支持部２４に保持したカード４を組立時に選択して組み込むことにより、高周波リレーの仕様を５０Ω或いは７５Ωの仕様とすることができる。ばね支持部２４外に出る部位の形状は５０Ω仕様も７５Ω仕様も同じであるので、ばね支持部２４を含むカード４の成形金型は何れの仕様にも使えるようなっている。
【００５３】
尚ケース２の天井面には、カード４の上端面に２カ所設けてある凹み部３４に夫々がはまる１対の回動支持部３４を２組設けてある。夫々の対はケース２をベース１上に被着する際の両側方向が反対となってもケース２の長手（両端）方向の１対の回動支持部３４の下部が夫々に対応する凹み部３７にはまるようなっている。そしてカード４側の凹み部３７の底部の高さ位置は、上記回動枢軸部２１の回動支点部２１ｂの下端の位置と同じ高さ位置となっており、ケース２を被着したときに凹み部３７に回動支持部３４がはまり、ベース１側だけでなく、ケース２側からもカード３を回動自在に支持して、リレーの取付方向によらずカード４の回動動作を安定させ、高周波特性の安定化を図っている。尚凹み部３７の底部は回動支持部３４の下面に当接した状態でカード４が両側方向に回動できるような円弧面に形成してある。
【００５４】
図１０は上述の可動接点ばね板２３Ａ，２３Ｂをインサート成形したカード４を製作する工程を示す。この図を用いてカード４が製作されるまでの工程を簡単に説明する。
【００５５】
まず同図（ａ）に示すように打ち抜き工程で金属フープ材４０の両側に長手方向に枠片４１Ａ，４１Ｂを抜き形成するともに、各枠片４１Ａ，４１Ｂの内側縁より、金属フープ材４０の長手方向に直交するように内向きに連結片４２，４３を一定間隔で一体に抜き形成し、且つ近接並行する対の連結片４２，４３の先部対向側縁に連設される形で、可動接点ばね板２３Ａ，２３Ｂを夫々一体に抜き形成し、この状態で両可動接点ばね板２３Ａ，２３Ｂの両端部の同方向の片面に吹き付けメッキにより金メッキ（黒塗り部分）を施し、この金メッキ処理後、各枠片４１Ａ，４１Ｂに対応する連結片４２，４３及び可動接点ばね板２３Ａ，２３Ｂが当該枠片から切断分離しない状態で、両側の枠片４１Ａ，４１Ｂを切断分離させる。上記連結片４２，４３は背中合わせ状態で２枚が一体に連設されている形で抜き形成されているため、枠片４１Ａ，４１Ｂの切断分離時に２分される。尚４４は金属フープ材４０を送るためのパイロットピンが挿入されるパイロット孔である。
【００５６】
この枠片４１Ａ、４１Ｂを分離した後、同図（ｂ）に示すように一方の枠片、例えば４１Ｂを裏返した後、当該枠片４１Ｂの連結片４３に連設されている可動接点ばね板２３Ｂの両端方向と、もう一方の枠片４１Ａの対となる連結片４２に連設されている可動接点ばね板２３Ａの両端方向とが、枠片４１Ａ，４１Ｂの長手方向に直交する方向の同一直線上に位置し、且つ両可動接点ばね板２３Ａ，２３Ｂの板面の位置が板面方向に所定距離ずれるように両枠片４１Ａ，４１Ｂを並行配置し、この並行状態で同一直線上の一対の可動接点ばね板２３Ａ，２３Ｂの夫々の中心部をインサートする形で合成樹脂成形材によりカード４及びばね支持部２４を成形し、該成形後各可動接点ばね板２３Ａ，２３Ｂを連結片４２，４３より切断分離して可動接点ばね板２３Ａ，２３Ｂをばね支持部２４で一体支持したカード４を得る。
【００５７】
上述の方法によれば金メッキを行う際には金属フープ材４０の長手方向に隣接する可動接点ばね板２３Ａ，２３Ｂの間隔が小さく、しかも金メッキを施す面が同一方向となるため、金メッキ材を無駄にすることなく吹きつけメッキが行える。
【００５８】
つまり図１０（ｂ）のような配置で可動接点ばね板２３Ａ，２３Ｂを打ち抜き形成した場合、メッキ面が逆になるため、金メッキ材を両面側から吹き付ける必要があり、しかも金属フープ材４０の長手方向の可動接点ばね板の間隔が広くなるため、金メッキ材が無駄になる量が多くなるという問題がある。しかし本願発明の方法によれば、その量を少なくすることができ、コストダウンが図れる。
【００５９】
次に上述のように構成された本実施形態の高周波リレーの動作を説明する。
【００６０】
まず電磁石ブロック１が非励磁の状態では、復帰ばね３１の付勢によりカード４は電磁石ブロック５側へ移動する方向に回動した状態にあり、可動接点ばね板２３Ａは両端部がシールド板１６Ａの内面にアース端子２７ａ、２７ｂを通じて接地される。
【００６１】
一方可動接点ばね板２３Ｂは両端部が固定接点端子１９ａ，１９ｃの固定接点２０、２０に接触して両固定接点端子１９ａ、１９ｃ間を導通させる。
【００６２】
次に電磁石ブロック５を励磁すると、鉄心８に接極子１２の一片１２ａが吸引され、接極子１２は回動する。この回動によりその他片１２ｂがカード４を押して、復帰ばね３１の付勢に抗して反電磁石ブロック５を方向に回動させる。この回動により可動接点ばね板２３Ｂは両端部が固定接点２０，２０から開離してシールド板１６Ｂの内面に接触してアース端子２７ａ、２７ｂを介して接地される。
【００６３】
一方可動接点ばね板２３Ａは両端部を固定接点端子１９ａ，１９ｂの固定接点２０、２０に接触して両固定接点端子１９ａ、１９ｂ間を導通させる。この状態が図３（ａ）の状態である。
【００６４】
電磁石ブロック５の励磁を止めると、復帰ばね３１の付勢によりカード４は下部が電磁石ブロック５側へ移動するように回動して、可動接点ばね板２３Ａの両端部がシールド板１６Ａの内面に接触し、可動接点ばね板２３Ｂの両端部が固定接点端子１９ａ，１９ｃの固定接点２０、２０に接触する状態に戻る。
【００６５】
【発明の効果】
請求項１の発明は、金属フープ材の両側に長手方向に沿って枠片を抜き形成するともに、各枠片の内側縁に連設される形で、金属フープ材の長手方向に直交するように内向きに連結片を一定間隔で一体に抜き形成し、且つ近接並行する対の連結片の先部対向側縁に連設される形で、互いに平行する可動接点ばね板を夫々一体に抜き形成し、この状態で両可動接点ばね板の両端部の同方向の片面に吹き付けメッキにより金メッキを施し、この金メッキ処理後、各枠片に対応する連結片及び可動接点ばね板が当該枠片から分離されない状態で、両側の枠片を独立分離させた後一方の枠片を裏返し、当該枠片の連結片に連設されている可動接点ばね板の両端方向と、他方の枠片の対となる連結片に連設されている可動接点ばね板の両端方向とが、枠片の長手方向に直交する方向の同一直線上に位置し、且つ両可動接点ばね板の板面の位置が板面方向に所定距離ずれるように両枠片を並行させ、この並行状態で同一直線上の一対の可動接点ばね板の夫々の中心部をインサートする形で合成樹脂成形材によりカードを成形し、該成形後各可動接点ばね板を連結片より分離して可動接点ばね板を支持したカードを得るので、可動接点ばね板を一体に支持するカードを効率良く生産でき、しかも接着固定などの工程が不要であるため、可動接点ばね板が変形する恐れも殆どない方法であって、しかも金メッキを必要とする部位のみに的確に金メッキを施すことが可能で、その上吹きつけメッキする工程では可動接点ばね板間の間隔を小さくすることができるため、無駄となる金メッキ材が殆ど無くなり、コストの低減も図れる。
【図面の簡単な説明】
【図１】（ａ）は本発明の実施形態１に用いる可動接点ばね板の一例の正面図である。
（ｂ）は同上に用いる可動接点ばね板の別の例の正面図である。
（ｃ）は同上に用いる可動接点ばね板の他の例の斜視図である。
【図２】同上の分解斜視図である。
【図３】（ａ）は同上の平面断面図である。
（ｂ）は（ａ）のＡ−Ａ断面矢視図である。
【図４】（ａ）は同上に用いるベースの上面図である。
（ｂ）は同上に用いるベースの正面断面図である。
（ｃ）は同上に用いるベースの正面図である。
（ｄ）は同上に用いるベースの側面断面図である。
【図５】（ａ）は同上の要部の一部省略せる拡大断面図である。
（ｂ）は同上の要部の一部省略せる拡大正面図である。
【図６】（ａ）は同上の一方のシールド板の正面図である。
（ｂ）は同上の他方のシールド板の正面図である。
【図７】同上のシールド板の構成説明図である。
【図８】同上のカードの回動枢軸部の支持部位の説明図である。
【図９】同上のカードの側面図である。
【図１０】同上のカードの製造工程の説明図である。
【図１１】一従来例の分解斜視図である。
【図１２】同上のばね支持ブロックの斜視図である。
【図１３】同上に用いる可動接点ばね板の正面図である。
【符号の説明】
２４ばね支持部
２３可動接点ばね板
３５突起
３８切欠
３９孔[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for manufacturing a high frequency relay.
[0002]
[Prior art]
A conventional high-frequency relay has a structure shown in FIG.
[0003]
In this conventional example, a base 100 on which a relay mechanism is disposed, a case 101 attached to the base 100, an electromagnetic block 105 including a yoke 102, a coil 103, and an iron core 104, a card block 106, a shield, It is composed of a box 107, movable contact springs 108, 108 provided on the card block 106 side, fixed contact terminals 109a to 109d, and the like. The shield box 107 is bent and punched from a single metal plate. The box portion and the ground terminals 110 are integrally formed.
[0004]
In the card block 106 of this conventional example, a pair of armatures 114, 114 each having a permanent magnet 113 interposed in a through hole provided at one end in the longitudinal direction of a substantially rectangular parallelepiped card 112 is disposed. Is positioned between one magnetic pole surface of the iron core 104 of the electromagnet block 105 and the tip of one end of the yoke 102, and the other magnetic pole surface of the iron core 104 of the other contact 114 and the other end of the yoke 102. It is the structure mounted on the electromagnet block 105 so that it may be located between the front-end | tip parts on the side. In the figure, reference numeral 111 denotes a balance spring.
[0005]
[Problems to be solved by the invention]
By the way, the movable contact spring plate 108 of the above-mentioned conventional example is formed by stripping into a strip shape having a uniform vertical width as shown in FIG. 12, and a resin molded product whose central portion is suspended from the card block 106. Since the structure is inserted into the spring support 115 and supported by the card block 106, the dielectric constant around the central portion covered by the spring support 115 is affected by the synthetic resin molding material, There is a problem in that the impedance is large compared to the uncovered portion and the impedance is reduced, and as a result, the impedance of the movable contact spring 108 is partially reduced and mismatch occurs.
[0006]
Further, in order to simplify the insert molding, the movable contact leaf spring 108 of the conventional example is first insert-molded into a prismatic spring support portion 115 of a synthetic resin molded product different from the card block 106 as shown in FIG. Thus, the spring support portion 115 constitutes a spring block, and after the block is formed, the upper end surface of the spring support portion 115 is bonded and fixed to the card block 106 and supported by the card block 106. Therefore on the productivity is low, there is a possibility that deformation of the movable contact spring plate occurs increasingly working steps.
[0007]
The present invention has been made in view of the above points. The object of the invention of claim 1 is to efficiently manufacture a card that supports the movable contact spring plate and to move the movable contact spring plate. An object of the present invention is to provide a method for manufacturing a high-frequency relay in which a gold plating material that is wasted when a contact portion is plated with gold is reduced .
[0012]
[Means for Solving the Problems]
According to the first aspect of the present invention, the frame pieces are cut out and formed along the longitudinal direction on both sides of the metal hoop material, and are connected to the inner edge of each frame piece so as to be orthogonal to the longitudinal direction of the metal hoop material. In this way, the connecting pieces are integrally formed at a predetermined interval inwardly, and the movable contact spring plates that are parallel to each other are integrally formed so as to be connected to the front-facing side edges of a pair of adjacent connecting pieces in parallel. In this state, gold plating is performed by spray plating on one side of both ends of both movable contact spring plates in the same direction, and after this gold plating process, the connecting pieces and the movable contact spring plates corresponding to each frame piece are removed from the frame pieces. In an unseparated state, after the frame pieces on both sides are separated independently, one frame piece is turned over, and both ends of the movable contact spring plate connected to the connecting piece of the frame piece and the other pair of frame pieces Both end directions of the movable contact spring plate connected to the connecting piece Both frame pieces are placed in parallel so that the positions of the plate surfaces of both movable contact spring plates are shifted by a predetermined distance in the plate surface direction. A card is formed from a synthetic resin molding material in the form of inserting the center of each of the pair of movable contact spring plates on the wire, and after the molding, each movable contact spring plate is separated from the connecting piece to support the movable contact spring plate. It is characterized by obtaining a card .
[0018]
DETAILED DESCRIPTION OF THE INVENTION
The present invention will be described below with reference to an embodiment.
[0019]
In this embodiment, as shown in FIGS. 2 and 3, a base 1 made of a synthetic resin molding material, a relay mechanism portion disposed on the base 1, and a box made of a synthetic resin molding agent that adheres to the base 1. It is comprised with the shape case 2. FIG.
[0020]
The electromagnet block 5 which is a main configuration of the relay mechanism section includes a coil bobbin 7 around which an exciting coil 6 is wound, an iron core 8 inserted through a central through hole of the coil bobbin 7, and an iron core 8 viewed on one end side of the coil bobbin 7. One end is caulked and fixed to the tip plate surface, and the yoke 9 is formed by bending the tip of the bent piece parallel to the coil bobbin 7 and extending the tip of the bent piece to the other end side of the coil bobbin 7.
[0021]
The electromagnet block 5 is arranged on the base 1 so that the lower portions of the coil terminals 10 and 10 provided on the coil bobbin 7 protrude toward the lower surface side of the base 1 from the insertion holes 11 provided in the base 1 as shown in FIG. .
[0022]
The armature 12 that is attracted and driven when the electromagnet block 5 is excited is formed of an iron piece bent in an L shape, and one piece 12a is opposed to the other end of the iron core 8 exposed on the other end side of the coil bobbin 7 and its bent portion. Is arranged so as to be able to turn freely on the tip of the bent piece of the yoke 9. Further, the tip of the other piece 12b is brought into contact with the side surface of the card 4 to be described later.
[0023]
The hinge spring 3 is disposed by press-fitting the lower portion into a press-fit groove 14 formed in the lower portion 13 of the side wall 25 provided at one end portion on the base 1 on the side where the armature 12 is disposed, and obliquely intersects from the upper side of one side end. In addition, the outer corner of the bent portion of the armature 12 is pressed by the tip portion of the presser piece 3a formed to extend, and the inner corner of the armature 12 is pressed against the yoke 9 and held.
[0024]
On one side of the base 1 parallel to the location of the electromagnet block 5, the partition 15 is separated from the location of the electromagnet block 5 by the partition 15, and is surrounded by the side wall 36 on one side of the partition 15 and the base 1 and the side walls 25 on both ends. The space above the base 1 is used as an arrangement site for the shield part including the contact part.
[0025]
This shield part is composed of two shield plates 16A and 16B arranged in parallel, and is shown on the base 1 as shown in FIG. 4 (a) along the inner side surface of the side wall 15 at both ends of the shield part placement site. The opposite surfaces of both end portions of the shield plates 16A and 16B are disposed on both side surfaces of the ribs 17 formed as described above.
[0026]
The ribs 17 are used for positioning the shield plates 16A and 16B of the base 1, and the positions of the shield plates 16A and 16B are determined by the molding accuracy of the ribs 17, and on the opposite surface side of the shield plates 16A and 16B. Is not affected by variations in the thickness of the shield plates 16A and 16B, so that the distance between the plate surfaces inside the shield plates 16A and 16B can be set with high accuracy.
[0027]
As shown in FIG. 4A, a position corresponding to the center position of the shield plates 16A and 16B and a position in the vicinity of the ribs 17 are respectively provided on the center line that bisects the space between the shield plates 16A and 16B. The fixed contact terminals 19a, 19b and 19c are respectively penetrated through the holes 18 so that the fixed contacts 20 of the respective fixed contact terminals 19a to 19c face the space surrounded by the shield plates 16A and 16B. .
[0028]
Here, at the upper end of each side wall 25 of the base 1 on both ends of the shield part, the pivot 4 is provided on both ends of the card 4 driven by the armature 12 to support the card 4. Support portions 22 and 22 are formed so as to be bridged above the shield portion.
[0029]
The card 4 has less influence on the impedance of the movable contact spring plates 23A and 23B, and in order to easily match the characteristic impedance, a synthetic resin such as Teflon (dielectric constant 2.0) close to the dielectric constant of air. It consists of a molded product using a molding material, and the pivot shaft 21 is integrally formed on both upper and lower end faces, and the spring support portions 24 that support the center of the movable contact spring plates 23A and 23B by insert molding are formed on both lower ends. The movable contact spring plates 23A and 23B are arranged between the shield plates 16A and 16B by providing the bridges and arranging the bridges above the shield portion arrangement portions, respectively.
[0030]
Here, the card 4 is bridged by the pivotal pivot 21 being pivotally supported by the pivot supports 22, 22 provided at the upper ends of the side walls 25, 25 on both ends of the base 1. The positions of the movable contact spring plates 23A and 23B held by the spring support portions 24 and 24 with respect to the upper surface of the base 1 are set with high accuracy.
[0031]
As shown in FIGS. 5 (a) and 5 (b), the rotary pivot portion 21 has a shaft portion 21a having a circular front cross section at the front portion, and a lower front cross section at the back portion of the shaft portion 21a. The rotation fulcrum portion 21b is integrally formed, and the lower end surface of the rotation fulcrum portion 21b is formed as an arcuate curved surface on both side surfaces so that the lowermost end position thereof coincides with the center height position of the shaft portion 21a.
[0032]
On the other hand, the rotation support portion 22 is formed along the inner surface of the side wall 25 and is formed at the upper end portion of the side wall 25 continuously with the support base 22a that supports the rotation fulcrum portion 21b at the upper end surface. The upper end is a square hole 22b, and the distance between the inner surfaces of both sides of the square hole 22b is the same as the diameter of the shaft portion 21a, and the distance from the bottom portion to the height position of the upper end surface of the rotation fulcrum portion 21b is an axis. It is slightly larger than the radius of the portion 21a so that a gap is formed between the lower end and the bottom portion of the shaft portion 21a.
[0033]
Now, the two movable contact spring plates 23A and 23B supported by insert molding on the respective spring support portions 24 of the card 4 are biased and arranged on both sides of the line connecting the fixed contact terminals 19a to 19c. Both end portions of the movable contact spring plate 23A constitute a movable contact that contacts and separates from one surface of the fixed contact 20 of the center fixed contact terminal 19a and one surface of the fixed contact terminal 19b of one end side. The both ends of the second movable contact spring plate 23B are in contact with the other surface of the fixed contact 20 of the central fixed contact terminal 19a and the other surface of the fixed contact 20 of the other fixed contact terminal 19b. The movable contacts are separated, and the contact breaking operation is performed by the rotation of the card 4.
[0034]
The shield plates 16A and 16B are formed by denting a portion between one end from the center in an opposite direction by bending a relief portion 26 for releasing the spring support portion 24 of the movable contact spring plates 23A and 23B on the adjacent side. The flat surfaces of the shield plates 16A and 16B on both sides of the escape portion 26 constitute an earth contact portion that contacts when both end portions of the movable contact spring plates 23A and 23B move away from the fixed contact 20 and move.
[0035]
The shield plates 16A and 16B have the same shape, and two ground terminals 27a and 27b are integrally formed (see FIGS. 6 and 7). Note that the distance from the end of each shield plate 16A, 16B to the nearest ground terminal is set to λ / 30 or less of the wavelength of the signal to be opened and closed so that the antenna effect does not occur.
[0036]
Further, when the shield plates 16A and 16B are disposed on the base 1, a ground terminal 27a is formed at one end of the formation portion of the relief portion 26 so as to be positioned between the fixed contact terminal 19a and 19b or 19c. The ground terminal 27a is bent at a right angle inward from the lower end of one end of the portion where the relief portion 26 is formed, and its tip is positioned on a straight line connecting the fixed contact terminals 18a to 18c when disposed on the base 1. It consists of a narrow-width plate piece that extends further from one end of the lower end portion of the hanging piece 28b that is bent at a right angle further downward than the tip of the extended wide piece 28a. The other ground terminal 27b is bent at a right angle inward from the position outside the escape portion 26 near the other end of the portion where the escape portion 26 is formed, and the tip thereof connects the fixed contact terminals 18a to 18c when disposed on the base 1. It consists of a narrow-width plate piece extending further from one end of the lower end portion of the hanging piece 28b 'bent at a right angle further downward than the tip of the wide piece 28a' formed so as to be positioned on a straight line.
[0037]
The shield plates 16A and 16B formed in this manner are arranged point-symmetrically on the base 1, so that the ground terminals 27a and 27b are located between the center fixed contact terminal 19a and the end fixed contact terminal 19b or 19c. Can be placed in.
[0038]
Thus, when the shield plates 16A and 16B are disposed at the shield portion disposition site, the opposing surfaces of both ends thereof are positioned in contact with both side surfaces of the ribs 17 and 17 as described above, respectively. The ground terminals 27a and 27b are formed on the lower surface side of the base 1 through insertion holes 29 penetrating the base 1 in correspondence with the width of the hanging pieces 28b and 28b 'integrally forming the ground terminals 27a and 27b. The hanging piece 28b or 28b ′ is inserted into the insertion hole 29 while protruding.
[0039]
Then, after the shield plates 16A and 16B are disposed at the shield portion placement sites as described above, the pivotal pivot portions 21 at both ends of the card 4 are rotated around the pivot support portions 22 at the side walls 25 and 25 at both ends of the base 1. The movable contact spring plate 23A is movable between the fixed contact terminals 19a and 19b and the escape portion 26 of the shield plate 16A by moving the card 4 so as to be movable and bridged above the shield portion. The contact spring plate 23B can be disposed between the fixed contact terminals 19a and 19c and the relief portion 26 of the shield plate 16A.
[0040]
When the card 4 is bridged, the shaft portion 21a is fitted from the upper end opening into the square hole 22b of the rotation support portion 22 on the side wall 25 side, and the rotation fulcrum portion 21b is arranged on the upper end surface of the fulcrum base 22a. The card 4 is bridged between both side walls of the base 1 by being placed as shown in FIG. Thereby, the horizontal hole 22 and the shaft portion 21a support in the horizontal direction, and the fulcrum base 22a and the rotation fulcrum portion 21b share the vertical support, and the center of the shaft portion 21a and the upper end surface of the fulcrum base 22a. By matching these positions, the pivotal pivot 21 can be reliably supported as compared with the case where it is supported at one place. Further, since the lower end of the shaft portion 21a is in a state of floating from the bottom portion of the square hole 22b, burrs generated when the base 1 is molded can be released.
[0041]
The card 4 arranged in the bridge is always pressed and biased by the return spring 31 in the direction of the shield plate 16A. The return spring 31 press-fits a base 31a into a press-fit groove 32 formed on one side inner surface of the side wall 36 of the base 1, and the tip of a spring piece 31b formed extending from the upper end of the base 31a toward the shield plate 16B is formed on the shield plate 16B. The card 4 is elastically contacted to the lower side surface of the card 4 located above the upper end, and the electromagnet block 5 is in a non-excited state so that the card 4 is rotated around the rotation pivot 21 to connect both end portions of the inner movable contact spring plate 23A. The shield plate 16A is brought into contact with the plate surface in the vicinity of both ends of the escape portion 26, and both end portions of the outer movable contact spring plate 23B are brought into contact with the fixed contacts 20, 20 of the fixed contact terminals 19a, 19c. In addition, the site | part which comprises the movable contact of the both ends of movable contact spring board 23A, 23B is divided | segmented into the fork.
[0042]
Here, as shown in FIG. 3A, the tip of the other piece 12b of the armature 12 is brought into contact with the side portion of the card 4 at the same position opposite to the side portion of the card 4 pressed by the spring piece 31b. The contact part and the pressing part of the spring piece 31b are opposed to each other so as to balance the force and stabilize the relay operation. Further, as shown in FIG. 9, each portion is formed as a convex portion 33 protruding from the side surface, so that friction between the spring piece 31 b and the other piece 12 b is reduced to reduce friction.
[0043]
The base 1 has a relay mechanism such as an electromagnetic block 5, shield plates 16A and 16B, fixed contact terminals 19a to 19d, a card 4 including movable contact spring plates 23A and 23B, an armature 12, a hinge spring 3 and a return spring 31. When the spring pressure of the return spring 31 and the hinge spring 3 is adjusted after the members are disposed, it is easily performed from the opening 25a of the side wall 25 of the base 1 and the opening 36a of the side wall 36 where the springs 31 and 3 face. Can do.
[0044]
If the case 2 is attached to the base 1 so that the side walls 25 on both ends and the side walls 36 on both sides of the base 1 are accommodated inside after the spring pressure adjustment is completed, a desired high frequency relay is completed.
[0045]
By the way, as a high frequency relay of this embodiment, even if the dielectric constant of the synthetic resin molding material of the card | curd 4 is made into the low dielectric constant close | similar to air as mentioned above, the part covered with the spring support part 24 and the part which is not covered Since the dielectric constant differs between the two, it is difficult to achieve impedance matching. Further, the product is required to have an impedance specification of 75Ω (when used for opening and closing video signals) and a product of 50Ω (when opening and closing wireless communication signals) specifications. Therefore, in the present embodiment, the spring support portion 24 is used as a means for adjusting the characteristic impedance of the transmission line and adjusting the impedance without considering the influence of the dielectric constant and without changing the insert molding die. The shape of the central part of the movable contact spring plates 23A and 23B to be inserted was used.
[0046]
That is, as shown in FIG. 1A, a protrusion 35 and a recess 38 are formed at the center of the movable contact spring plate 23 covered with the spring support 24, or as shown in FIG. Or by adjusting the impedance by reducing or increasing the thickness of the central portion of the movable contact spring plate 23 as shown in FIG. Impedance matching is aimed at simultaneously with mitigation.
[0047]
Further, even when PBT or LCP having a large dielectric constant is used as the synthetic resin molding material of the card 4 including the spring support portion 24, the influence can be reduced by adjusting the shape.
[0048]
In forked movable contact portion to form the both end portions of the movable contact spring plate 23 may be reshaped by the this to vary the length of the groove divided into bifurcated.
[0049]
Further, it is of course possible to use a combination of at least two of the protrusions 35, the recesses 38, the holes 29, the plate thickness, and the divided grooves.
[0050]
In FIG. 1C, the thickness of the movable contact spring plate 23 is emphasized to clarify the difference in plate thickness.
[0051]
However if narrow the plate width of the movable contact spring plate 23A, 23 B is not withstand the load stress by the plate width of the center portion and wide, it is possible to withstand the applied stress. On the other hand, in order to improve the high frequency characteristics, it is necessary to bring the lower end edges of the movable contact spring plates 23A and 23B closer to the base 1. So when achieving wide to impedance matching plate width of the center portion as described above, the upper and lower edges of the movable contact spring plate 23A, 23 B, except for the central portion is parallel over the entire length, the central portion By making the width wide by projecting upward, it is possible to withstand load stress and to bring the lower ends of the movable contact spring plates 23A and 23B closer to the base 1 as shown in FIG.
[0052]
Therefore, the specifications of the high-frequency relay can be made 50Ω or 75Ω by inserting the movable contact spring plates 23A and 23B and selecting and incorporating the card 4 held on the spring support 24 at the time of assembly. it can. Since the shape of the portion that goes out of the spring support 24 is the same for both the 50Ω specification and the 75Ω specification, the molding die of the card 4 including the spring support 24 can be used for any specification.
[0053]
In addition, on the ceiling surface of the case 2, two sets of a pair of rotation support portions 34 are provided, each of which fits into two recessed portions 34 provided on the upper end surface of the card 4. Each pair is a recess in which the lower part of the pair of rotation support portions 34 in the longitudinal (both ends) direction of the case 2 corresponds to each other even when both side directions when the case 2 is attached to the base 1 are reversed. 37. And the height position of the bottom part of the recessed part 37 by the side of the card | curd 4 is the same height position as the position of the lower end of the rotation fulcrum part 21b of the said rotation pivot part 21, When the case 2 is attached A rotation support portion 34 is fitted in the recessed portion 37, and the card 3 is supported not only from the base 1 side but also from the case 2 side, so that the rotation operation of the card 4 can be stabilized regardless of the relay mounting direction. To stabilize the high-frequency characteristics. The bottom of the recessed portion 37 is formed in an arcuate surface that allows the card 4 to turn in both directions in contact with the lower surface of the turning support portion 34.
[0054]
FIG. 10 shows a process of manufacturing the card 4 in which the above-described movable contact spring plates 23A and 23B are insert-molded. The process until the card 4 is manufactured will be briefly described with reference to FIG.
[0055]
First, as shown in FIG. 5A, the frame pieces 41A and 41B are formed by being punched out on both sides of the metal hoop material 40 in the punching process, and the metal hoop material 40 is formed from the inner edges of the frame pieces 41A and 41B. The connecting pieces 42, 43 are integrally formed at regular intervals in an inward direction so as to be orthogonal to the longitudinal direction, and are connected to the front-facing side edge of the pair of connecting pieces 42, 43 in close proximity to each other, The movable contact spring plates 23A and 23B are formed integrally with each other, and in this state, gold plating (blacked portion) is applied by spray plating to one side of the both ends of both movable contact spring plates 23A and 23B in the same direction. Thereafter, the frame pieces 41A and 41B on both sides are cut and separated in a state where the connecting pieces 42 and 43 and the movable contact spring plates 23A and 23B corresponding to the frame pieces 41A and 41B are not cut and separated from the frame pieces. Since the connecting pieces 42 and 43 are formed so as to be connected together in a back-to-back state, the connecting pieces 42 and 43 are divided into two when the frame pieces 41A and 41B are cut and separated. Reference numeral 44 denotes a pilot hole into which a pilot pin for feeding the metal hoop material 40 is inserted.
[0056]
After the frame pieces 41A and 41B are separated, one frame piece, for example, 41B is turned over as shown in FIG. 4B, and then the movable contact spring plate is connected to the connecting piece 43 of the frame piece 41B. The direction of both ends of 23B and the direction of both ends of the movable contact spring plate 23A connected to the connecting piece 42 which is a pair of the other frame piece 41A are the same in the direction perpendicular to the longitudinal direction of the frame pieces 41A and 41B. Both frame pieces 41A and 41B are arranged in parallel so that the positions of the plate surfaces of both movable contact spring plates 23A and 23B are shifted by a predetermined distance in the plate surface direction. The card 4 and the spring support 24 are molded from a synthetic resin molding material in such a manner that the respective center portions of the movable contact spring plates 23A and 23B are inserted, and after the molding, the movable contact spring plates 23A and 23B are connected to the connecting pieces 42, Can be cut and separated from 43 Point spring plate 23A, 23B to obtain the card 4 which is integrally supported by the spring support portion 24.
[0057]
According to the above method, when performing gold plating, the distance between the movable contact spring plates 23A and 23B adjacent in the longitudinal direction of the metal hoop material 40 is small, and the surfaces to be plated with gold are in the same direction. Spray plating can be performed without making
[0058]
That Figure 1 0 (b) the movable contact spring plate 23A in the arrangement, such as, when forming punched 23B, since the plating surface is reversed, it is necessary to blow gold plating material from both sides, yet the metal hoop material 40 Since the distance between the movable contact spring plates in the longitudinal direction becomes wider, there is a problem that the amount of the gold plating material is wasted. However, according to the method of the present invention, the amount can be reduced and the cost can be reduced.
[0059]
Next, the operation of the high frequency relay of the present embodiment configured as described above will be described.
[0060]
First, when the electromagnet block 1 is in a non-excited state, the card 4 is rotated in the direction of moving toward the electromagnet block 5 by the urging of the return spring 31, and the movable contact spring plate 23A has both ends of the shield plate 16A. The inner surface is grounded through ground terminals 27a and 27b.
[0061]
On the other hand, both end portions of the movable contact spring plate 23B come into contact with the fixed contacts 20 and 20 of the fixed contact terminals 19a and 19c to conduct between the fixed contact terminals 19a and 19c.
[0062]
Next, when the electromagnet block 5 is excited, the piece 12a of the armature 12 is attracted to the iron core 8, and the armature 12 rotates. Due to this rotation, the other piece 12b pushes the card 4 and rotates the counter electromagnet block 5 in the direction against the bias of the return spring 31. By this rotation, both ends of the movable contact spring plate 23B are separated from the fixed contacts 20 and 20 and contact the inner surface of the shield plate 16B, and are grounded via the ground terminals 27a and 27b.
[0063]
On the other hand, the movable contact spring plate 23A is brought into contact with the fixed contacts 20 and 20 of the fixed contact terminals 19a and 19b at both ends to conduct between the fixed contact terminals 19a and 19b. This state is the state of FIG.
[0064]
When the excitation of the electromagnet block 5 is stopped, the card 4 rotates so that the lower part moves to the electromagnet block 5 side by the urging of the return spring 31, and both end portions of the movable contact spring plate 23A are brought into contact with the inner surface of the shield plate 16A. The both ends of the movable contact spring plate 23B come into contact with the fixed contacts 20, 20 of the fixed contact terminals 19a, 19c.
[0065]
【The invention's effect】
According to the first aspect of the present invention, the frame pieces are cut and formed along the longitudinal direction on both sides of the metal hoop material, and are connected to the inner edge of each frame piece so as to be orthogonal to the longitudinal direction of the metal hoop material. In this way, the connecting pieces are integrally formed at a predetermined interval inwardly, and the movable contact spring plates that are parallel to each other are integrally formed so as to be connected to the front-facing side edges of a pair of adjacent connecting pieces in parallel. In this state, gold plating is performed by spray plating on one side of both ends of both movable contact spring plates in the same direction, and after this gold plating process, the connecting pieces and the movable contact spring plates corresponding to each frame piece are removed from the frame pieces. In an unseparated state, after the frame pieces on both sides are separated independently, one frame piece is turned over, and both ends of the movable contact spring plate connected to the connecting piece of the frame piece and the other pair of frame pieces Both ends of the movable contact spring plate connected to the connecting piece The two frame pieces are placed in parallel so that the positions of the plate surfaces of the two movable contact spring plates are shifted by a predetermined distance in the plate surface direction. A card in which a center portion of each of the pair of movable contact spring plates is inserted by molding a synthetic resin molding material, and after the molding, each movable contact spring plate is separated from the connecting piece to support the movable contact spring plate. Therefore, it is possible to efficiently produce a card that integrally supports the movable contact spring plate, and since there is no need for a process such as bonding and fixing, the movable contact spring plate is hardly deformed and is gold-plated. It is possible to accurately apply gold plating only to the parts that need to be used, and in the spray plating process, the distance between the movable contact spring plates can be reduced, so there is almost no wasted gold plating material. Ri, thereby also reducing costs.
[Brief description of the drawings]
FIG. 1 (a) is a front view of an example of a movable contact spring plate used in Embodiment 1 of the present invention.
(B) is a front view of another example of the movable contact spring plate used in the above.
(C) is a perspective view of another example of the movable contact spring plate used in the above.
FIG. 2 is an exploded perspective view of the above.
FIG. 3A is a plan sectional view of the same.
(B) is an AA cross-sectional arrow view of (a).
FIG. 4A is a top view of a base used in the above.
(B) is front sectional drawing of the base used for the same as the above.
(C) is a front view of the base used in the above.
(D) is side sectional drawing of the base used for the same as the above.
FIG. 5A is an enlarged cross-sectional view in which a part of the main part is omitted.
(B) is an enlarged front view in which a part of the main part is omitted.
FIG. 6A is a front view of one of the shield plates of the same.
(B) is the front view of the other shield board same as the above.
FIG. 7 is a diagram for explaining the configuration of the shield plate same as above.
FIG. 8 is an explanatory view of a support portion of a pivoting pivot portion of the card of the above.
FIG. 9 is a side view of the same card.
FIG. 10 is an explanatory diagram of the card manufacturing process.
FIG. 11 is an exploded perspective view of a conventional example.
FIG. 12 is a perspective view of the spring support block.
FIG. 13 is a front view of a movable contact spring plate used in the above.
[Explanation of symbols]
24 Spring support part 23 Movable contact spring plate 35 Protrusion 38 Notch 39 Hole

Claims

The frame pieces are formed on both sides of the metal hoop material in the longitudinal direction, and the connecting pieces are formed inwardly so as to be orthogonal to the longitudinal direction of the metal hoop material in such a manner as to be connected to the inner edge of each frame piece. The movable contact springs that are parallel to each other are integrally formed by punching and forming at a constant interval and connected to the front-facing side edges of a pair of connecting pieces that are close to each other in parallel. Gold plating is performed by spray plating on one side in the same direction of both ends of the movable contact spring plate, and after this gold plating process, the connecting piece and the movable contact spring plate corresponding to each frame piece are not separated from the frame piece. After the frame pieces are independently separated, one frame piece is turned over and connected to both ends of the movable contact spring plate connected to the connecting piece of the frame piece and to the connecting piece that is a pair of the other frame piece. The direction of both ends of the movable contact spring plate is perpendicular to the longitudinal direction of the frame piece A pair of movable contacts on the same straight line in this parallel state so that both frame pieces are parallel to each other so that the positions of the plate surfaces of both movable contact spring plates are shifted by a predetermined distance in the plate surface direction. A card is formed from a synthetic resin molding material in the form of inserting each central portion of the spring plate, and after the molding, each movable contact spring plate is separated from a connecting piece to obtain a card that supports the movable contact spring plate. A method for manufacturing a high-frequency relay.