JP4008730B2 - 組み合わせ式高速光学粗面計及び偏光解析器 - Google Patents

組み合わせ式高速光学粗面計及び偏光解析器 Download PDF

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Publication number
JP4008730B2
JP4008730B2 JP2002085531A JP2002085531A JP4008730B2 JP 4008730 B2 JP4008730 B2 JP 4008730B2 JP 2002085531 A JP2002085531 A JP 2002085531A JP 2002085531 A JP2002085531 A JP 2002085531A JP 4008730 B2 JP4008730 B2 JP 4008730B2
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Japan
Prior art keywords
optical signal
polarized light
reflected
phase
incident
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Expired - Lifetime
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JP2002085531A
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English (en)
Japanese (ja)
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JP2002365232A5 (enExample
JP2002365232A (ja
Inventor
ダブリュ．ミークス スティーブン
カディナー ラスミン
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ケーエルエー−テンコール テクノロジーズ コーポレイション
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Priority claimed from US09/818,199 external-priority patent/US20020015146A1/en
Priority claimed from US09/861,280 external-priority patent/US6757056B1/en
Application filed by ケーエルエー−テンコール テクノロジーズ コーポレイション filed Critical ケーエルエー−テンコール テクノロジーズ コーポレイション
Publication of JP2002365232A publication Critical patent/JP2002365232A/ja
Publication of JP2002365232A5 publication Critical patent/JP2002365232A5/ja
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    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G01B11/06—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material
    • G01B11/0616—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness for measuring thickness ; e.g. of sheet material of coating
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
    • H01L22/10—Measuring as part of the manufacturing process
    • H01L22/12—Measuring as part of the manufacturing process for structural parameters, e.g. thickness, line width, refractive index, temperature, warp, bond strength, defects, optical inspection, electrical measurement of structural dimensions, metallurgic measurement of diffusions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Optical Radar Systems And Details Thereof (AREA)
JP2002085531A 2001-03-26 2002-03-26 組み合わせ式高速光学粗面計及び偏光解析器 Expired - Lifetime JP4008730B2 (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US09/818,199 US20020015146A1 (en) 1997-09-22 2001-03-26 Combined high speed optical profilometer and ellipsometer
US09/818199 2001-05-18
US09/861,280 US6757056B1 (en) 2001-03-26 2001-05-18 Combined high speed optical profilometer and ellipsometer
US09/861280 2001-05-18

Publications (3)

Publication Number Publication Date
JP2002365232A JP2002365232A (ja) 2002-12-18
JP2002365232A5 JP2002365232A5 (enExample) 2005-11-04
JP4008730B2 true JP4008730B2 (ja) 2007-11-14

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ID=27124244

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2002085531A Expired - Lifetime JP4008730B2 (ja) 2001-03-26 2002-03-26 組み合わせ式高速光学粗面計及び偏光解析器

Country Status (4)

Country Link
EP (1) EP1245922B1 (enExample)
JP (1) JP4008730B2 (enExample)
AT (1) ATE467810T1 (enExample)
DE (1) DE60236337D1 (enExample)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6798512B2 (en) 2001-08-09 2004-09-28 Therma-Wave, Inc. Multiple beam ellipsometer
US7224471B2 (en) * 2003-10-28 2007-05-29 Timbre Technologies, Inc. Azimuthal scanning of a structure formed on a semiconductor wafer
SE0303048L (sv) * 2003-11-17 2004-12-28 Optonova Ab Förfarande och anordning för beröringsfri avsyning och inmätning av ytegenskaper och ytdefekter på en materialyta
JP4748353B2 (ja) * 2005-08-04 2011-08-17 大日本印刷株式会社 異物検査装置
DE102007043937B4 (de) * 2006-09-13 2010-10-07 Innovent E.V. Verfahren zur Bestimmung der Dicke und des Brechungsindex von optisch transparenten Schichten auf optisch transparenten planparallelen Substraten
SG152187A1 (en) * 2007-10-25 2009-05-29 Asml Netherlands Bv Inspection method and apparatus, lithographic apparatus, lithographic processing cell and device manufacturing method
CN102192882B (zh) * 2011-03-11 2013-01-09 山东大学 利用锁相放大器进行磁光椭偏测量的测量方法
US12416580B2 (en) 2018-05-07 2025-09-16 Unm Rainforest Innovations Method and system for in-line optical scatterometry
US11473901B2 (en) 2018-05-29 2022-10-18 Hitachi High-Tech Corporation Height measurement device in which optical paths projected on the sample at different incidence angles
US11043239B2 (en) * 2019-03-20 2021-06-22 Kla Corporation Magneto-optic Kerr effect metrology systems
WO2021087345A1 (en) * 2019-11-01 2021-05-06 Unm Rainforest Innovations In-line angular optical multi-point scatterometry for nanomanufacturing systems
CN115388765B (zh) * 2022-08-10 2023-10-24 睿励科学仪器（上海）有限公司 用于椭偏量测系统的自动聚焦装置
JP2025044916A (ja) * 2023-09-20 2025-04-02 株式会社Ｓｃｒｅｅｎホールディングス 観察装置、観察方法および基板処理装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4585348A (en) * 1981-09-28 1986-04-29 International Business Machines Corporation Ultra-fast photometric instrument
US4674875A (en) 1983-12-09 1987-06-23 Hitachi, Ltd. Method and apparatus for inspecting surface defects on the magnetic disk file memories
US4906844A (en) * 1988-08-12 1990-03-06 Rockwell International Corporation Phase sensitive optical monitor for thin film deposition
JP3140664B2 (ja) 1995-06-30 2001-03-05 松下電器産業株式会社 異物検査方法及び装置
US5694214A (en) 1996-01-08 1997-12-02 Hitachi Electronics Engineering Co., Ltd. Surface inspection method and apparatus
NL1006016C2 (nl) * 1997-05-09 1998-11-10 Univ Delft Tech Ellipsometer met twee lasers.
JPH112512A (ja) 1997-06-11 1999-01-06 Super Silicon Kenkyusho:Kk ウェーハの光学式形状測定器
US6134011A (en) 1997-09-22 2000-10-17 Hdi Instrumentation Optical measurement system using polarized light
US6157444A (en) 1997-11-28 2000-12-05 Hitachi, Ltd. Defect inspection apparatus for silicon wafer

Also Published As

Publication number Publication date
EP1245922B1 (en) 2010-05-12
ATE467810T1 (de) 2010-05-15
DE60236337D1 (de) 2010-06-24
EP1245922A1 (en) 2002-10-02
JP2002365232A (ja) 2002-12-18

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