JP3957699B2 - Optimization device, mounting device, and electronic component mounting system - Google Patents

Description

  The present invention relates to a technique for mounting an electronic component on a circuit board.

Various devices and methods have been proposed for improving the mounting efficiency of electronic components in a mounting device for mounting electronic components on a circuit board (Japanese Patent Laid-Open Nos. 9-81603 and 10-20997, JP-A-10-209682).
JP-A-9-81603 Japanese Patent Laid-Open No. 10-209697 JP-A-10-209682

  As high productivity in the mounting device is increasingly pursued, there is no difference in the mechanical performance of the mounting device itself between manufacturers. On the other hand, productivity can be greatly influenced by how the equipment can be operated without waste. Under such circumstances, the importance of optimization software that evenly distributes parts to mounting devices and eliminates waste between facilities and guarantees high productivity without waste even in one facility has been recognized. There is a demand for more efficient mounting of electronic components.

  In order to cope with such a demand, the present invention provides an optimization device, an optimization method, an optimization program, a recording medium recording the optimization program, and a mounting device for mounting electronic components more efficiently It is another object of the present invention to provide an electronic component mounting system.

  In order to achieve the above object, the present invention is an optimizing device for optimizing the mounting order of electronic components on one circuit board by two or more mounting devices, and for each type of electronic component, The first allocation to the mounting device is predetermined, and the first mounting time required for mounting the electronic component to the circuit board by the first allocation is calculated for each mounting device. Select two mounting devices from the devices, select one type of electronic component allocated to each of the two mounting devices, and allocate a total of two types of electronic components selected by both mounting devices. Allocation means for determining a second allocation interchanged between the two mounting apparatuses, and mounting the electronic component on the circuit board by the second allocation for each of the two mounting apparatuses Calculation hand to calculate the second wearing time And, using the first mounting time and the second mounting time, allocation allocation means that employs allocation that obtains a smaller mounting time among the first allocation and the second allocation. Features.

In order to achieve the above object, the present invention optimizes the mounting of the electronic component by each mounting device in an electronic component mounting system composed of two or more mounting devices for mounting electronic components on a circuit board. A first allocation unit that determines a first allocation to each mounting device for each type of electronic component, and is allocated to the mounting device by the first allocation for each mounting device. A first calculating means for calculating a first mounting time required for mounting all of the electronic components on the circuit board by the mounting device, and selecting any two mounting devices from the plurality of mounting devices. A second allocation unit that selects one type of electronic component allocated to each selected mounting device, and determines a second allocation by exchanging the selected two types of allocation with each other;
Second calculating means for calculating a second mounting time required for mounting all electronic components allocated to the mounting device by the second allocation to the circuit board by the mounting device for each mounting device; A comparison is made between the largest wearing time among the first wearing times calculated for the wearing device to be replaced selected by the second allocator and the largest wearing time among the second wearing times. Among the above allocation and the second allocation, there is provided an employment determination means for determining the employment of the allocation for obtaining a smaller wearing time.

  Here, the first allocating unit includes a number storage unit that stores the number of electronic components of the same type for each type of electronic component, and one electronic component of each type by a mounting board. In order to mount all the electronic components of the type by each mounting device on the circuit board for each type of electronic component, using the standard mounting time required for mounting on and the number of each type Mounting time calculating means for calculating required mounting time, and allocation determination for determining allocation of each type of electronic component to each mounting device using the calculated mounting time for each type of each mounting device and electronic component Means.

Here, the second allocating unit allocates the electronic component of the type to the specific mounting device in preference to other types of the types of electronic components that can be mounted only by the specific mounting device.
Here, the second allocating unit is configured so that, among the mounting time calculated for each mounting device and each type of electronic component, the mounting device and the type of electronic component having a mounting time smaller than a predetermined value, other mounting devices and Prior to the types of other electronic components, the types of the electronic components are allocated to the mounting device installed on the upstream process side.

  Here, each of the first calculation unit and the second calculation unit stores the number of electronic components of the same type to be mounted on the circuit board for each type of electronic component allocated to each mounting device. A number storage means, a total time calculating means for calculating a total mounting time indicating the total mounting time of all electronic components allocated to each mounting device, and an electronic component allocated to each mounting device. For each type, multiply the calculated total mounting time by the number of electronic components of that type, and further divide by the number of all electronic components allocated to the mounting device, Wearing time calculating means for calculating a wearing time, wherein the first calculating means and the second calculating means use the calculated wearing times as the first wearing time and the second wearing time, respectively.

  Here, each of the first calculation means and the second calculation means includes request output means, tact calculation means equal to the number of mounting apparatuses, and mounting time receiving means, and each tact calculation means includes each mounting apparatus. The request generation means outputs, for each mounting device, a type identifier for identifying the type of the component and the number of components allocated to the mounting device for each mounting device, and calculates each tact. The means calculates the time required to mount the electronic component on the circuit board by the corresponding mounting device based on the output type identifier and the number, outputs the calculated mounting time, the mounting time receiving means, The wearing time is received, and the first calculating means and the second calculating means respectively set the received wearing time as the first wearing time.

  Here, the first calculation unit and the second calculation unit each include a request output unit and a mounting time receiving unit, each mounting device includes a tact calculation unit, and the request generation unit includes the mounting For each device, a type identifier for identifying the type of the component and the number of components allocated to the mounting device are output to the mounting device, and each tact calculating means outputs the type identifier and the number of components to the output. Based on this, the time required for mounting the electronic component on the circuit board by the mounting device is calculated, the calculated mounting time is output, and the mounting time receiving means receives the mounting time, and the first calculating means And the second calculation means sets the received wearing time as the first wearing time.

  Here, each of the first calculation means and the second calculation means includes request output means, the same number of conversion means as the mounting device, tact calculation means and inverse conversion means, and mounting time receiving means, Means, each tact calculation means, and each inverse conversion means correspond to each mounting device, and the request generation means, for each mounting device, a type identifier for identifying the type of component for the mounting device, and the mounting The number of parts allocated to the device is output, and each conversion means converts the output type identifier and the number into the format determined for the corresponding mounting device, and each tact calculation means converts the converted type Based on the identifier and the number, the time required to mount the electronic component on the circuit board by the corresponding mounting device is calculated, and the calculated mounting time is output. Optimized for optimization equipment The wearing time receiving means receives the converted wearing time, and the first calculating means and the second calculating means respectively receive the converted wearing times received by the first wearing means. Time.

  Here, the optimization device that changes the moving speed information of the circuit board when mounting each electronic component further stores the moving speed information that stores the moving speed information of the circuit board for each type of electronic component. Means, allocation storage means for storing the allocation of electronic components of the type to each mounting device for each type of electronic component, and two mounting units connected in series from the plurality of mounting devices A selection means for selecting a device, and an electronic component in which the slowest slowest moving speed information is set among the types of electronic components allocated to the upstream mounting device among the selected two mounting devices The extraction means for extracting the type of the electronic device, and, among the selected two mounting devices, of the types of electronic components assigned to the downstream mounting device, the movement is faster than the extracted latest moving speed information Extraction means for extracting speed information In the moving speed storing means, the moving speed by the identifier, and a replacement means for replacing the slowest moving speed information.

  Here, one or more supply units that respectively supply one or more types of electronic components move to a suction position of the mounting head, and the mounting head sucks the electronic components from the supply unit and uses them in a mounting board. The optimizing device for optimizing the mounting order of the electronic components further includes: a first selecting unit that selects one of the plurality of electronic components to be a first electronic component; and other than the first electronic component For each of all the electronic components, one is selected as the second electronic component, and the mounting head included in the mounting device is positioned where the second electronic component is mounted from the position where the first electronic component is mounted The head movement time required for relative movement to the position and the supply unit movement required for the supply unit supplying the second electronic component to move to the suction position of the mounting head when mounting the second electronic component Time and said 2 calculating means for calculating a return movement time required for the supply unit supplying the first electronic component to move to the suction position of the mounting head after mounting the electronic component; and other than the first electronic component Based on the head movement time, the supply unit movement time, and the return movement time calculated for every electronic component, next to the first electronic component among all other electronic components except the first electronic component. The electronic component to be mounted includes selection means for selecting one electronic component.

  Here, one or more supply units that respectively supply one or more types of electronic components move to a mounting position of a mounting head that includes one or more nozzles, and the mounting head picks up the electronic components from the supply unit and circuit. The optimization device for optimizing the mounting order of the electronic components used in the mounting device for mounting all the electronic components on the circuit board by repeating the task of mounting on the substrate a plurality of times is further provided for each task. Task information storage means for storing task information including a mounting order of each electronic component in a task, a mounting position where each electronic component is mounted, and a supply unit position indicating a position of a supply unit that supplies each electronic component And first generation means for generating an X coordinate list in which the task information is rearranged in descending order of the X coordinates of the mounting positions of the electronic components indicated by the last mounting order in the task information. The second generation means for generating the Z coordinate list in which the task information is rearranged in descending order of the largest supply unit position in the task information, and the X coordinate list and the top of the Z coordinate list alternately in this order. And assigning means for assigning a mounting order to each task in accordance with the order of the selected tasks.

  Here, one or more supply units that respectively supply one or more types of electronic components move to a suction position of the mounting head, and the mounting head sucks the electronic components from the supply unit and uses them in a mounting board. The optimizing device for optimizing the mounting order of the electronic components further generates a virtual component plane including a position where the electronic component of the type is mounted for each type of electronic component, and generates the generated component plane Plane generating means for arranging the parts in a predetermined order, replacement means for changing the order of the component planes, optimum path generating means for generating an optimum path for connecting the components in each component plane, and in the component plane A solid path generation unit that generates a solid path that connects each component plane by connecting the path and a path in another component plane is included.

  Here, the first allocating unit includes a number storage unit that stores the number of electronic components of the same type for each type of electronic component, and one electronic component of each type by a mounting board. Standard mounting time required for mounting on a circuit board, or standard mounting time required for mounting on a circuit board by each mounting device per task, which is a series of operations from adsorption to mounting, and the number of each type For each type of electronic component, a mounting time calculation means for calculating a mounting time required for mounting all the electronic components of that type by the mounting device on the circuit board, and each mounting device and electronic component For each of the types, allocation determination means for determining allocation of each type of electronic component to each mounting device using the calculated mounting time is included.

  Here, the first allocating unit includes a number storage unit that stores the number of electronic components of the same type for each type of electronic component, and one electronic component of each type by a mounting board. Standard mounting time required for mounting to the circuit board, or standard mounting time required for mounting to the circuit board by each mounting device per task, which is a series of operations from adsorption to mounting, and the number of each type A mounting time for calculating the mounting time required to mount all the electronic components of that type by each mounting device on the circuit board for each type of electronic component using a tool that simulates the operation of the mounting equipment from Calculation means and allocation determination means for determining allocation of each type of electronic component to each mounting device using the calculated mounting time for each type of mounting device and each electronic component.

  Here, the optimization device that changes the tact information of the circuit board when each electronic component is mounted further includes a tact storage unit that stores the tact information of the circuit board for each type of electronic component, and an electronic For each type of component, an allocation storage means for storing the allocation of the electronic component of that type to each mounting device and two mounting devices connected in succession are selected from the plurality of mounting devices. Of the two mounting devices selected by the selection means, the electronic component type for which the latest latest tact information is set is extracted from the electronic component types allocated to the upstream mounting device. Extraction means and extraction means for extracting faster tact information than the extracted latest tact information among the types of electronic components allocated to the downstream mounting apparatus among the selected two mounting apparatuses And the tact In 憶 means, said extracted tact information, and a replacement means for replacing the slowest tact information.

Further, the present invention is an electronic component mounting system including one or more mounting devices for mounting electronic components on a circuit board, and includes the mounting device and the optimization device. The electronic component is mounted on the circuit board in accordance with the allocation determined by the optimization device.
The present invention is also a mounting device for mounting an electronic component on a circuit board, and the mounting device mounts the electronic component on the circuit board according to the allocation determined by the optimization device.

  Further, the present invention provides information for changing movement speed information of the circuit board when each electronic component is mounted in an electronic component mounting system including one or more mounting devices for mounting the electronic component on the circuit board. A generation device, for each type of electronic component, a moving speed storage means for storing moving speed information of the circuit board, and for each type of electronic component, allocation of the electronic component of that type to each mounting device A storage unit for storing allocation; a selection unit for selecting two consecutively connected mounting devices from the plurality of mounting devices; and an upstream side of the selected two mounting devices. Out of the types of electronic components allocated to the mounting device, the extraction means for extracting the type of electronic component for which the slowest slowest moving speed information is set, and the downstream side of the selected two mounting devices Allocate to mounting device Among the types of electronic components extracted, extraction means for extracting faster movement speed information than the extracted latest movement speed information, and the movement speed storage means, the extracted movement speed information is converted into the latest movement speed information. And replacement means for replacing with speed information.

  Here, the optimization device that changes the tact information of the circuit board when each electronic component is mounted further includes a tact storage unit that stores the tact information of the circuit board for each type of electronic component, and an electronic For each type of component, an allocation storage means for storing the allocation of the electronic component of that type to each mounting device and two mounting devices connected in succession are selected from the plurality of mounting devices. Of the two mounting devices selected by the selection means, the electronic component type for which the latest latest tact information is set is extracted from the electronic component types allocated to the upstream mounting device. Extraction means and extraction means for extracting faster tact information than the extracted latest tact information among the types of electronic components allocated to the downstream mounting apparatus among the selected two mounting apparatuses And the Taku In the storage means, said extracted tact information, and a replacement means for replacing the slowest tact information.

  Further, the present invention is an electronic component mounting system comprising one or more mounting devices for mounting electronic components on a circuit board, and information generation for changing tact information of the circuit board when mounting each electronic component. A tact storage means for storing circuit board tact information for each type of electronic component, and for each type of electronic component, the allocation of the electronic component of that type to each mounting device is stored. The allocation storage means, a selection means for selecting two consecutively connected mounting devices from the mounting device, and the upstream mounting device among the selected two mounting devices. Among the types of electronic components, the extraction means for extracting the type of the electronic component for which the latest latest tact information is set, and of the selected two mounting devices, are allocated to the downstream mounting device. Electronic parts Of the types, an extraction unit that extracts faster tact information than the extracted latest tact information, and a replacement unit that replaces the extracted tact information with the latest tact information in the tact storage unit. It is characterized by.

According to another aspect of the present invention, there is provided a computer-readable recording medium storing movement speed information of a circuit board for each type of electronic component, wherein the movement speed information replaced by the information generating device is stored. .
In the present invention, one or more supply units that respectively supply one or more types of electronic components move to the mounting position of the mounting head, and the mounting head sucks the electronic components from the supply unit and mounts them on the circuit board. An optimization device for optimizing a mounting order of electronic components used in the device, wherein a first selection unit that selects one of the plurality of electronic components and sets the first electronic component as a first electronic component; For every other electronic component except one, one is selected as the second electronic component, and the mounting head included in the mounting device is mounted from the position where the first electronic component is mounted. The head movement time required to move relatively to the position to be moved and the supply required to move the supply unit for supplying the second electronic component to the mounting position of the mounting head when mounting the second electronic component Department travel time and previous After the second electronic component is mounted, a calculation unit that calculates a return movement time required for the supply unit that supplies the first electronic component to move to the suction position of the mounting head; and other than the first electronic component Based on the head movement time, the supply unit movement time, and the return movement time calculated for each of the electronic components, the next to the first electronic component from among all the other electronic components except the first electronic component. A selection means for selecting one electronic component is provided as an electronic component to be mounted on the device.

  Here, the selection means calculates a sum of a value twice the return movement time and a supply movement time for every electronic component other than the first electronic component, and calculates the calculated head movement time and Corresponds to the smallest value among the values adopted for all other electronic components except the first electronic component by the computing means that adopts the larger one of the calculated sums. Electronic component selection means for selecting an electronic component to be mounted as an electronic component to be mounted next to the first electronic component.

Here, the mounting device includes a rotary mounting head, and the selection means is based on the calculated head moving time, supply unit moving time, return moving time, and half rotation time of the rotary mounting head. One electronic component is selected.
Further, according to the present invention, one or more supply units that respectively supply one or more types of electronic components move to a mounting position of a mounting head including one or more nozzles, and the mounting head sucks electronic components from the supply unit. An optimization device that optimizes the mounting order of electronic components used in a mounting device that mounts all electronic components on the circuit board by repeating the task of mounting on the circuit board multiple times. Task information that stores task information including a mounting order of each electronic component in the task, a mounting position where each electronic component is mounted, and a supply unit position indicating the position of the supply unit that supplies each electronic component A first generating unit that generates an X coordinate list in which the task information is rearranged in the descending order of the X coordinates of the mounting position of the electronic component indicated by the last mounting order in the task information in the storage means Second generation means for generating a Z coordinate list in which the task information is rearranged in descending order of the largest supply unit position in the task information, and in this order from the top of the X coordinate list and the Z coordinate list. And assigning means for selecting tasks alternately and assigning the mounting order to each task in accordance with the order of the selected tasks.

  Here, the optimization apparatus further includes a calculation unit that calculates a first total movement amount indicating a distance the head moves when executing all tasks in the mounting order allocated by the allocation unit; A task selection means for selecting a task, a replacement means for switching the mounting order of the two selected tasks, and a second total indicating a distance that the head moves when all tasks are executed in the replaced mounting order. Calculating means for calculating a movement amount; and adopting means for adopting the mounting order of all tasks corresponding to a minimum value among the first total movement amount and the second total movement amount.

  In the present invention, one or more supply units that respectively supply one or more types of electronic components move to the mounting position of the mounting head, and the mounting head sucks the electronic components from the supply unit and mounts them on the circuit board. An optimization device that optimizes the mounting order of electronic components used in the device, and for each type of electronic component, a virtual component plane including a position where the electronic component of the type is mounted is generated and generated A plane generating means for arranging the component planes in a predetermined order, a replacement means for changing the order of the respective component planes, an optimum path generating means for generating an optimum path for connecting the respective parts in each component plane, and a component plane And a three-dimensional path generating means for generating a three-dimensional path for connecting the respective component planes by connecting the paths in the other component planes.

  Here, for each component plane, the replacement means is configured to change the position of the mounting head from the exit electronic component, which is an electronic component on the original component plane, which is the component plane, to the electronic component on the previous component plane, which is another component plane. The extraction means for extracting the outlet electronic component whose movement time is within the movement time of the supply unit, and the number of outlet electronic components are calculated for each original component plane and each previous component plane to calculate the number of outlet candidates. , Calculating means for calculating the exit candidate total by adding the number of the exit electronic components for each original part plane, selecting the original part plane having the smallest exit candidate total as the first part plane, and selecting the selected first With respect to the component plane, a selection unit that selects the previous component plane having the largest number of exit candidates and sets it as the second component plane, and the component plane input that changes the order of the component planes in the order of the first component plane and the second component plane. Replacement means.

  Here, the extraction means sets a square area with one side as a distance corresponding to the moving time of the supply unit centered on the position where the exit electronic component is mounted, and the electronic component on the front part plane is set When included in the square area, it is determined that the movement time of the mounting head is within the movement time of the supply component.

  As described above, the present invention is an electronic component mounting system that includes two or more mounting devices that mount electronic components on a circuit board, and that optimizes the mounting of the electronic components by each mounting device. A first allocation unit that determines a first allocation to each mounting device for each type of electronic component, and all the devices allocated to the mounting device by the first allocation for each mounting device. A first calculating means for calculating a first mounting time required for mounting the electronic component on the circuit board by the mounting device, and selecting any two mounting devices from the plurality of mounting devices; A second allocation unit that selects one type of electronic component allocated to each mounting device and replaces the selected two types of allocation with each other to determine a second allocation; 2 allocation A second calculator for calculating a second mounting time required for mounting all the electronic components allocated to the mounting device to the circuit board by the mounting device; and the replacement selected by the second allocator. Of the first allocation and the second allocation, comparing the largest wearing time among the first wearing times calculated for the target wearing device and the largest wearing time among the second wearing times, Employment decision means for deciding the adoption of allocation for obtaining a smaller wearing time.

  According to this structure, there exists an effect that the mounting time in each mounting apparatus becomes more uniform. In this way, more efficient electronic component mounting can be achieved.

1. First Embodiment A mounting system 1 as a first embodiment according to the present invention will be described.
1.1 Configuration of Mounting System 1 As shown in FIG. 1, the mounting system 1 includes an optimization device 200, a production line LAN 131, a supply device 120, a cream solder printing machine 121, a cream solder printing inspection machine 122, and a high-speed adhesive application. Machine 123, high-speed placement machine 124, multifunctional placement machines 125 and 126, mounted component inspection machine 127, reflow device 128, appearance inspection machine 129, and storage device 130. The configuration of the mounting system 1 is not limited to the above. A configuration that does not include all the production apparatuses described above may be used. For example, some of the inspection machines described above may not be required. Further, there may be a plurality of high-speed mounting machines. Further, as described above, it may be configured by a single line in series, but may be configured by a plurality of parallel lines. Moreover, it is not limited to said order.

  Optimization device 200, supply device 120, cream solder printing machine 121, cream solder printing inspection machine 122, high-speed adhesive applicator 123, high-speed mounting machine 124, multi-function mounting machine 125, multi-function mounting machine 126, mounting component inspection machine 127, the reflow device 128, the appearance inspection machine 129, and the storage device 130 are connected via a production line LAN 131. Note that the above connection form is not limited to a LAN. For example, it may be connected by RS232C. In addition, data may be stored in a floppy disk and exchanged between devices without being connected by a network.

Supply device 120, cream solder printing machine 121, cream solder printing inspection machine 122, high-speed adhesive applicator 123, high-speed mounting machine 124, multi-function mounting machine 125, multi-function mounting machine 126, mounting component inspection machine 127, reflow apparatus 128 The appearance inspection machine 129 and the storage device 130 are arranged along the transport line in this order.
Each apparatus performs processing determined in each apparatus on the circuit board, and conveys the processed circuit board to the connected next-process apparatus. In this way, a circuit board is produced by sequentially performing processing by each device from the upstream process to the downstream process. Here, the upstream process is a process on the supply apparatus 120 side, and the downstream process is a process on the storage apparatus 130 side.

1.2 Each Production Device At the beginning of the process, the supply device 120 stocks a plurality of circuit boards in advance. Electronic components are not yet mounted on these circuit boards. Note that some parts may already be mounted by other lines. The circuit board also includes a double-sided board on which electronic components are mounted on both sides of the board. The supply device 120 supplies the circuit boards to the cream solder printer 121 one by one.

The cream solder printing machine 121 receives the circuit boards one by one from the supply device 120, prints the cream solder on the received circuit boards, and supplies the printed circuit board with the cream solder to the cream solder printing inspection machine 122. The printing inspection machine 122 receives the circuit boards one by one from the cream solder printing machine 121, inspects the state of the cream solder printed on the received circuit board, and the circuit board that has been inspected is subjected to the high-speed adhesive applicator 123. To supply.

The high-speed adhesive applicator 123 receives the circuit boards one by one from the cream solder printing inspection machine 122, applies an adhesive for adhering electronic components and the like onto the received circuit board, and the adhesive is applied. The supplied circuit board is supplied to the high-speed mounting machine 124.
The high-speed mounting machine 124 receives the circuit boards one by one from the high-speed adhesive applicator 123, mounts electronic components on the received circuit boards at high speed, and transfers the circuit boards on which the electronic components are mounted to the multi-function mounting machine 125. Supply.

The main components of the high speed mounting machine 124 are shown in FIG. The suction nozzle 243d provided at the lower end of the mounting head 243c sucks the component from the component supply unit 243f, recognizes the component, the mounting head 243c rotates to a predetermined position, and the component sucked by the suction nozzle 243d is circuit board. It is mounted at a predetermined position of 243e.
The high-speed mounting machine 124 and the multi-function mounting machine 125 are each a type of mounting machine that mounts electronic components on a circuit board. The high-speed mounting machine 124 is intended to mount a small number of types of electronic components on a circuit board at high speed, and the multi-function mounting machine 125 is intended to mount many types of odd-shaped electronic components on the circuit board. This is common in that electronic components are mounted on a circuit board.

The multi-function mounting machine 125 receives circuit boards one by one from the high-speed mounting machine 124, mounts electronic components on the received circuit boards, and supplies the circuit boards on which the electronic components are mounted to the multi-function mounting machine 126. .
The main components of the multi-function mounting machine 125 are shown in FIGS. 3 (a) and 3 (b). Four suction nozzles 262 to 265 are provided at the lower end of the mounting head 261. The suction nozzles 262 to 265 pick up a part from the part supply unit 266 and perform part recognition in the case of a normal part. In the case of components such as connectors, component recognition may not be performed depending on the chuck regulation. Next, the mounting head 261 moves to a predetermined position, and mounts each component sucked by the suction nozzles 262 to 265 at a predetermined position on the circuit board 267.

The multi-function placement machine 126 is the same as the multi-function placement machine 125.
The mounting component inspection machine 127 receives the circuit boards one by one from the multi-function mounting machine 126, inspects for missing or misplaced electronic components on the received circuit board, and sends the circuit board that has been inspected to the reflow device 128. Supply.
The reflow device 128 receives the circuit boards one by one from the mounting component inspection machine 127, melts the cream solder with respect to the received circuit boards, and supplies the circuit board in which the cream solder is melted to the appearance inspection machine 129.

The appearance inspection machine 129 receives the circuit boards one by one from the reflow device 128, and inspects the received circuit boards for the state of soldering, the state of components, and the like based on the appearance, and the circuit boards that have been inspected are stored in the storage device 130. Supply.
At the end of the process, the storage device 130 receives the circuit boards one by one from the appearance inspection machine 129 and stores the received circuit boards.

The transport line has two transport rails (referred to as dual lanes), and simultaneously supplies and transports two or four circuit boards at a time from the upstream process to the downstream process. It may be given. In the above description, the circuit boards are received one by one, but two sheets may be conveyed.
1.3 Configuration of Optimization Device 200 As shown in FIG. 4, the optimization device 200 includes a display unit 201, an input unit 202, an optimization unit 203, a transmission / reception unit 204, an information storage unit 205, conversion units 206 to 208, and It consists of tact calculation units 209 to 211.

Specifically, the optimization apparatus 200 is a computer system that includes a microprocessor and stores a computer program. The device achieves its functions by the microprocessor operating according to the computer program.
(1) Information storage unit 205
The information storage unit 205 includes a component table, a tact calculation unit correspondence table, a mounting machine type table, a tact table, and a component mounting table.

(Parts table)
As shown in FIG. 5, the component table is a data table having a plurality of component information including component names, component numbers, X coordinate values, Y coordinate values, angles θ, XY speeds, cameras, nozzles, and head speeds. It is.
The component information corresponds to the component mounted on the circuit board.

The part name is a name for identifying the type of the part. Here, the type of component does not indicate only the difference in the shape of components such as QFP, connector, and chip. Even if the shape of the component is the same, if the component name is different due to a difference in the resistance value of the component, it is a different type of component.
The component number is an identifier for individually identifying components to be mounted on the circuit board.

The X coordinate value and the Y coordinate value indicate the X coordinate value and the Y coordinate value of the position where the component identified by the component number is mounted on the circuit board.
The angle θ indicates an angle formed by the side surface of the component and the X axis when the component identified by the component number is rotated and mounted on the circuit board surface.
The XY speed indicates a speed when the circuit board moves on the XY plane.

The camera indicates the type of camera installed in the mounting device.
The nozzle indicates the type of nozzle provided in the head.
The head speed indicates a speed when the head of the mounting apparatus moves on the XY plane.
(Tact calculation part correspondence table)
As shown in FIG. 6, the tact calculation unit correspondence table is a data table having a plurality of pieces of correspondence information including the mounting device name and the tact calculation unit name.

The mounting device name is a name for identifying the mounting device.
The tact calculation unit name is a name for identifying the tact calculation unit of the optimization apparatus 200. Each correspondence information indicates that the mounting device identified by the mounting device name included in the correspondence information corresponds to the tact calculation unit identified by the tact calculation unit name included in the correspondence information. .

(Mounting device type table)
As shown in FIG. 7, the mounting device type table is a data table having a plurality of mounting device information including a mounting device name, a type, and the number of heads.
The mounting device name is a name for identifying the mounting device.
The type is an identifier that identifies the type of mounting device.

The number of heads indicates the number of heads that the mounting apparatus has.
(Tact table)
As shown in FIG. 8, the tact table is a data table having an area for storing a plurality of part tact information composed of a part name, a plurality of apparatus tact information, and the number.
The component tact information corresponds to the type of component mounted on the circuit board.

The part name is a name that identifies the type of the part.
Each device tact information includes a maximum tact and a mounting time.
The maximum tact is the minimum time of the time required to suck the component and mount it on the circuit board. The highest tact is written in the tact table in advance.
The implementation time is the time required for one task. Tasks include: (a) a component pick-up that moves the mounting head to the component supply unit and picks up an electronic component; (b) the mounting head moves in a shooting range on the recognition camera at a constant speed; FIG. 6 shows a series of operations of recognition scanning for photographing all the electronic components adsorbed to (c), and (c) component mounting for mounting electronic components on a circuit board.

The number indicates the number of components identified by the component name mounted on the circuit board.
(Parts mounting table)
As shown in FIG. 10, the component mounting table is a data table having a region for storing a plurality of component mounting information.
Each component mounting information includes a mounting device name, a total mounting time, and a set of one or more component names and mounting times.

The mounting device name is a name for identifying the mounting device.
The component name indicates the name of the component mounted by the mounting device identified by the mounting device name.
The mounting time indicates the time required for mounting the component.
When the component mounting information includes a plurality of combinations of component names and mounting times, each set is arranged in the component mounting information so as to indicate the order of mounting each component.

The total mounting time is a total value of the mounting times included in the component mounting information.
(2) Optimization unit 203
The optimization unit 203 performs provisional calculation of a tact table described later.
Next, the optimization unit 203 repeats a component distribution process, which will be described later, and a tact table calculation process, which will be described later, as many times as specified.

Next, the optimization unit 203 repeats a SWAP process described later and a tact table calculation process described later for the specified number of times. At each repetition, it is determined whether or not the line tact is smaller than the previously calculated run tact. If it is determined that the line tact is smaller, the repetition is terminated.
(Tact table temporary calculation)
The optimization unit 203 repeats the following processing for each mounting device.

(1) The optimization unit 203 reads the mounting device name from the mounting device type table, and reads the type and the number of heads corresponding to the read mounting device name from the mounting device type table.
(2) Next, the optimization unit 203 reads a tact calculation unit name corresponding to the read mounting device name from the tact calculation unit correspondence table, and selects a tact calculation unit.
(3) Next, the optimizing unit 203 repeats the following process for each component name mounted on the circuit board.

(3) -1 The optimization unit 203 reads the highest tact and the number corresponding to the mounting device and the component name from the tact table, reads the type and the number of heads corresponding to the mounting device from the mounting device type table, and The name, maximum tact, number, type, and number of heads are output to the conversion unit corresponding to the selected tact calculation unit.
(3) -2 The optimization unit 203 receives the mounting time from the tact calculation unit via the conversion unit, and stores the received mounting in an area for storing the component name and the mounting time corresponding to the mounting device in the tact table. Write time.

An example of a tact table in which the implementation time is written by the optimization unit 203 is shown in FIG. In this figure, a portion indicated by white letters indicates the mounting time written as described above.
(Distribution of parts)
The optimization unit 203 sorts components that can be mounted only by a specific mounting device to the mounting device, writes the component name and mounting time in the component mounting table, and calculates the total mounting time of the mounting device to which the components are allocated. Write the total mounting time in the component mounting table.

FIG. 10 shows an example of a component mounting table in which a component name indicating a component that can be mounted only by a specific mounting device and its mounting time are written by the optimization unit 203. In this figure, the part indicated by white letters indicates the part name and mounting time written as described above.
Next, the optimization unit 203 repeats the following for the remaining parts that are not distributed to any mounting device.

(1) Select the mounting device with the least total mounting time.
(2) Select the remaining parts from the top of the tact table.
(3) The selected part is distributed to the selected mounting device, and the part name and mounting time are written in the part mounting table.
(4) Calculate the total mounting time of the mounting device to which the component is distributed and write the total mounting time in the component mounting table.

In the state of the component mounting table shown in FIG. 10, an example of the component mounting table in which one set of component name and mounting time is further written by the optimization unit 203 is shown in FIG. In this figure, the part indicated by white letters indicates the part name and mounting time written as described above.
Next, FIG. 12 shows an example of a component mounting table in which the optimization unit 203 further writes the next set of component names and mounting times in the state of the component mounting table shown in FIG. In this figure, the part indicated by white letters indicates the part name and mounting time written as described above.

Finally, FIG. 13 shows an example of the component mounting table at the time when the component allocation by the optimization unit 203 is completed.
(Calculation of tact table)
The optimization unit 203 repeats the following processing for each mounting device.
(1) Select a tact calculator.

(2) The X coordinate value, Y coordinate value, angle θ, XY speed, camera, nozzle and head speed of all mounting points assigned to the mounting device are acquired from the component table, and all the mounting points acquired are obtained. The X coordinate value, Y coordinate value, angle θ, XY speed, camera, nozzle, and head speed are output to the conversion unit corresponding to the selected tact calculation unit.
(3) The total wearing time is received from the tact calculation unit via the conversion unit.

(4) The following processing is repeated for each component name mounted on the circuit board.
(4) -1 Tact is calculated by the following formula.
Tact = (number of parts) / (total number of parts distributed to the mounting device) × (total mounting time)
(4) -2 The calculated tact is overwritten in the mounting time area corresponding to the mounting device and the component in the tact table.

An example of the tact table obtained by the tact table calculation process by the optimization unit 203 is shown in FIG. In this figure, a portion indicated by white letters indicates the mounting time written as described above.
(SWAP processing)
The optimization unit 203 selects the mounting device Px having the maximum total mounting time from the component mounting table, and selects one component name Nx allocated to the selected mounting device Px. Next, another mounting device Py is selected, and one part name Ny allocated to the selected other mounting device Py is selected. Next, in the component mounting table, the optimization unit 203 replaces and writes the component name Nx and the component name Ny.

(3) Conversion units 206 to 208
The conversion unit 206 receives information from the optimization unit 203, converts the received information into a type suitable for the tact calculation unit 209, and outputs the converted information to the tact calculation unit 209.
Also, the conversion unit 206 receives information from the tact calculation unit 209, converts the received information into a type suitable for the optimization unit 203, and outputs the converted information to the optimization unit 203.

Since the conversion units 207 and 208 are the same as the conversion unit 206, description thereof is omitted.
(4) Tact calculation units 209 to 211
The tact calculation unit 209 receives the part name, maximum tact, number, type, and number of heads from the optimization unit 203 via the conversion unit 206.

(1) When the type is “rotary” or “1by1 robot”, the mounting time is calculated by the following formula.
Mounting time = Maximum tact of the part indicated by the received part name × Number of received parts Here, the maximum tact of the part indicated by the received part name is stored in advance by the tact calculation unit 209. This is a tact by the mounting device corresponding to the calculation unit 209.

(2) When the type is “simultaneous adsorption”, the mounting time is calculated by the following formula.
Mounting time = [number of persons / number of heads] × time per task Here, [] indicates a round-up operation. The time per task is stored in the tact calculation unit 209 in advance, and is a tact by the mounting device corresponding to the tact calculation unit 209.

When a plurality of component names are received, the mounting time is calculated for each component name as described above, the mounting times obtained by the calculation are totaled, and the total value is used as the mounting time.
Next, the tact calculation unit 209 outputs the calculated mounting time to the optimization unit 203 via the conversion unit 206.
Since the tact calculation units 210 and 211 are the same as the tact calculation unit 209, description thereof will be omitted.

(5) Display unit 201, input unit 202, and transmission / reception unit 204
The input unit 202 receives an input of an operation from a user. The display unit 201 displays information. The transmission / reception unit 204 transmits the information optimized by the optimization unit 203 to each production apparatus.
1.4 Operation of Optimization Device 200 The operation of the optimization device 200 will be described.

(1) Outline Operation of Overall Optimization Device 200 Outline operation of the optimization device 200 as a whole will be described using the flowchart shown in FIG.
The optimization unit 203 performs provisional calculation of the tact table (step S101).
Next, the optimization unit 203 sets the variable i to a value of 1 (step S102), compares the variable i with the specified number of times, and if the variable i is less than or equal to the specified number of times (step S103) (Step S104), a tact table is calculated (step S105), and a value of 1 is added to the variable i (step S106). Next, it returns to step S103 and repeats a process.

  When the variable i is greater than the specified number of times (step S103), the optimization unit 203 sets a value of 1 to the variable i (step S107), compares the variable i with the specified number of times, and the variable i is greater than the specified number of times. If it is smaller or equal (step S108), the optimization unit 203 performs SWAP processing (step S109) and calculates a tact table (step S110). Next, the optimization unit 203 determines whether or not the line tact has become small. When the line tact is small (step S111), the process ends.

Next, when it is larger or equal (step S111), a value of 1 is added to the variable i (step S112), and then the process returns to step S108 to repeat the process.
When the variable i is larger than the specified number of times (step S108), the optimization unit 203 ends the process.
(2) Tact Table Provisional Calculation Operation The tact table provisional calculation operation will be described with reference to the flowchart shown in FIG. The tact table provisional calculation operation described here is the details of step S101 in FIG.

The optimization unit 203 repeats steps S131 to S146 for each mounting device.
The optimization unit 203 reads the mounting device name from the mounting device type table (step S132), and reads the type and the number of heads corresponding to the read mounting device name from the mounting device type table (step S133).
Next, the optimization unit 203 reads the tact calculation unit name corresponding to the read mounting device name from the tact calculation unit correspondence table, and selects the tact calculation unit (step S134).

Next, the optimization unit 203 repeats steps S <b> 135 to S <b> 145 for each component name mounted on the circuit board.
The optimization unit 203 reads the highest tact and the number corresponding to the mounting device and the component name from the tact table, reads the type and the number of heads corresponding to the mounting device from the mounting device type table (step S136), and the component name The maximum tact, number, type, and number of heads are output to the conversion unit corresponding to the selected tact calculation unit (step S137).

  The conversion unit performs data conversion on the received part name, maximum tact, number, type, and number of heads, and converts the data type part name, maximum tact, number, type, and head according to the selected tact calculation unit. A number is generated (step S138), and the generated part name, maximum tact, number, type, and number of heads are output to the selected tact calculator (step S139).

The selected tact calculation unit calculates a mounting time based on the received part name, maximum tact, number, type, and number of heads (step S140), and outputs the calculated mounting time to the conversion unit (step S140). S141).
Next, the conversion unit performs data conversion on the received mounting time (step S142), and outputs the data converted mounting time to the optimization unit 203 (step S143).

Next, the optimization unit 203 writes the received mounting time in an area for storing the component name and the mounting time corresponding to the mounting device in the tact table (step S144).
(3) Component Distributing Operation The component distributing operation will be described with reference to the flowchart shown in FIG. The part distribution operation described here is the details of step S104 in FIG.

The optimization unit 203 sorts components that can be mounted only by a specific mounting device to the mounting device, writes the component name and mounting time in the component mounting table (step S161), and the total mounting time of the mounting device to which the components are allocated. And the total mounting time is written in the component mounting table (step S162).
Next, the optimization unit 203 determines whether there is a remaining part that has not been distributed to any of the mounting devices. If there is no remaining part (step S163), the process ends.

  If there are remaining parts (step S163), the mounting device having the smallest total mounting time is selected (step S164), the remaining parts are selected from the head of the tact table (step S165), and the selected part is selected. The component name and the mounting time are written in the component mounting table (step S166), the total mounting time of the mounting device to which the component is allocated is calculated, and the total mounting time is written in the component mounting table (step S167). ).

Next, it returns to step S163 and repeats a process.
(4) Tact Table Calculation Operation The tact table calculation operation will be described with reference to the flowchart shown in FIG. The tact table calculation operation described here is the details of step S105 and step S110 in FIG.

The optimization unit 203 repeats steps S181 to S194 for each mounting device.
The optimization unit 203 selects a tact calculation unit (step S182), and calculates the X coordinate value, Y coordinate value, angle θ, XY speed, camera, nozzle, and head speed of all mounting points assigned to the mounting apparatus. Conversion from the component table (step S183), and the X coordinate value, Y coordinate value, angle θ, XY speed, camera, nozzle, and head speed of all the acquired mounting points corresponding to the selected tact calculation unit (Step S184).

The corresponding conversion unit performs data conversion on the X coordinate value, Y coordinate value, angle θ, XY speed, camera, nozzle, and head speed of all mounting points, and outputs the data to the selected tact calculation unit (step S185). ).
The selected tact calculator calculates the total mounting time based on the X coordinate value, Y coordinate value, angle θ, XY speed, camera, nozzle and head speed of all mounting points (step S186). The total mounting time is output to the conversion unit (step S187).

The conversion unit performs data conversion on the total mounting time (step S188), and outputs the total mounting time after the data conversion to the optimization unit 203 (step S189).
Next, the optimization unit 203 repeats steps S190 to S193 for each component name mounted on the circuit board.
The optimization unit 203 calculates the tact by the following formula.

Tact = (number of parts) / (total number of parts allocated to the mounting device) × (total mounting time) (step S191)
Next, the optimization unit 203 overwrites the calculated tact in the mounting time area corresponding to the mounting device and the component in the tact table (step S192).
(5) Operation of SWAP Process The operation of the SWAP process will be described with reference to the flowchart shown in FIG. The operation of the SWAP process described here is the details of step S109 in FIG.

  The optimization unit 203 selects a mounting device Px having the maximum total mounting time from the component mounting table (step S211), and then selects one component name Nx allocated to the selected mounting device Px. (Step S212), another mounting device Py is selected (Step S213), and one component name Ny allocated to the selected other mounting device Py is selected (Step S214). Next, in the component mounting table, the optimization unit 203 replaces and writes the component name Nx and the component name Ny (step S215).

1.5 Summary According to the technique disclosed in Japanese Patent Application Laid-Open No. 10-209697, a single standard or maximum mounting tact preset for each component is used, and components are mounted on a plurality of mounting apparatuses. Since the allocation is determined, there is a problem that the total mounting time in each mounting device is not always equal when components are actually mounted in each mounting device.

On the other hand, as described above, according to the first embodiment, since allocation of components to a plurality of mounting devices is determined based on the tact calculated for all components allocated to each mounting device, When components are actually mounted in each mounting device, it is expected that the total mounting time in each mounting device is more even than that in the prior art.
1.6 Modification As with the mounting system 1, the mounting system as a modified example of the first embodiment includes an optimization device 200b, a high-speed mounting machine 124b, a multi-function mounting machine 125b, It is comprised from the multifunction mounting machine 126b and other production apparatuses (not shown).

The optimization apparatus 200b includes a display unit 201, an input unit 202, an optimization unit 203, a transmission / reception unit 204b, and an information storage unit 205.
The high-speed mounting machine 124b includes a high-speed mounting unit that performs high-speed mounting of electronic components, a conversion unit 206b, and a tact calculation unit 209b. The multi-function mounting machine 125b includes a multi-function mounting unit that performs multi-function mounting of electronic components. The conversion unit 207b and the tact calculation unit 210b are configured. The multi-function mounting machine 126b includes a multi-function mounting unit that performs multi-function mounting of electronic components, a conversion unit 208b, and a tact calculation unit 211b.

Moreover, in the said modification, the component to which the same code | symbol as 1st Embodiment was attached | subjected is the structure same as the component of 1st Embodiment.
The conversion units 206b, 207b, and 208b have the same configuration as the conversion units 206, 207, and 208 of the first embodiment. Also, the tact calculation units 209b, 210b, and 211b have the same configuration as the tact calculation units 209, 210, and 211 of the first embodiment. The transmission / reception unit 204b is between the optimization unit 203 and the conversion unit 206b. Information is transmitted / received between the optimization unit 203 and the conversion unit 207b and between the optimization unit 203 and the conversion unit 208b.

As described above, in this modification, the conversion unit 206 and the tact calculation unit 209 included in the optimization apparatus 200 according to the first embodiment are moved to the high-speed wearing machine 124, and the conversion unit 207 and the tact calculation unit are transferred. 210 is moved to the multi-function mounting machine 125, and the conversion unit 208 and the tact calculation unit 211 are moved to the multi-function mounting machine 126.
Further, the optimization apparatus may be configured as follows in the above-described component distribution in step S104.

  The optimization device may allocate the electronic components to each mounting device using a standard mounting time required for mounting each type of electronic component on the circuit board by each mounting device. In addition, the optimization device allocates electronic components to each mounting device by using a standard mounting time required for mounting on the circuit board by each mounting device per task, which is a series of operations from suction to mounting. Also good. Further, these may be combined.

  In addition, the optimization device uses a standard mounting time required for mounting on the circuit board and a tool (computer program) for simulating the operation of the mounting equipment from the number of each type, and Each time the mounting time required for mounting all the electronic components of the corresponding type by the mounting devices on the circuit board may be obtained, and the electronic components may be allocated to the mounting devices using the determined mounting time.

2. Second Embodiment The mounting system 1 according to the second embodiment has the same configuration as the mounting system 1 according to the first embodiment.
Here, it demonstrates centering on difference with the mounting system 1 of 1st Embodiment.
2.1 Configuration of Optimization Device 200 (1) Information Storage Unit 205
The information storage unit 205 stores a component name list and a component mounting table.
(Part name list)
As shown in FIG. 21, the component name list is a data table having a plurality of component information including a component name, a component thickness, an XY speed, a shape code, a nozzle, and a camera.

The part thickness indicates the dimension in the height direction of the part.
The shape code is an identifier for specifying the shape of the part.
Since the part name, XY speed, nozzle, and camera are as described above, description thereof is omitted.
(Parts mounting table)
As shown in FIG. 22, the component mounting table includes an area for storing one or more component names for each mounting device name.

Since the mounting device name and the component name are as described above, description thereof is omitted.
(Optimization unit 203)
The optimization unit 203 rearranges the component information included in the component name list in ascending order of the component thickness. An example of a part name list rearranged in ascending order of part thickness is shown in FIG.
Next, the optimization unit 203 distributes each component to each mounting device. Since the distribution of the parts to the mounting device has been described above, the description thereof will be omitted. An example of the component mounting table generated by the optimization unit 203 after the distribution to the mounting device is shown in FIG.

As shown in this figure, the components identified by the component names “A” and “B” are distributed to the mounting device identified by the mounting device name “MSR1”, and the component names “C”, “D”, “ The components identified by “E” and “F” are distributed to the mounting device identified by the mounting device name “MSR2”.
Next, the optimization unit 203 extracts all sets of the pre-process mounting apparatus and the post-process mounting apparatus, and repeats the following processing for each extracted group. Here, the pre-process mounting apparatus is a mounting apparatus on the upstream process side, and the post-process mounting apparatus is a mounting apparatus installed on the downstream process side from the pre-process mounting apparatus.

(1) The slowest XY speed Vmin is extracted from the parts allocated to the pre-process mounting device.
(2) Extract all the speeds faster than the XY speed Vmin for the parts allocated to the post-process mounting device.
(3) Replace the extracted XY speed with the XY speed Vmin.

An example of a part name list in which the XY speed by the optimization unit 203 is replaced is shown in FIG.
2.2 Operation of Optimization Device 200 The operation of the optimization device 200 will be described with reference to the flowchart shown in FIG.
The optimization unit 203 rearranges the component information included in the component name list in ascending order of the component thickness (step S300), and then distributes each component to each mounting device (step S301).

The optimization unit 203 selects one set of the pre-process mounting apparatus and the post-process mounting memory (Step S302). If all the groups have already been selected (step S303), the process is terminated.
When the unselected group remains (step S303), the optimization unit 203 extracts the slowest XY speed Vmin from the parts allocated to the pre-process mounting device (step S304), and the post-process. For parts distributed to the mounting device, all speeds faster than the XY speed Vmin are extracted (step S305). Next, the optimization unit 203 replaces the extracted XY speed with the XY speed Vmin (step S306). Next, it returns to step S302 and repeats a process.

2.3 Summary As described above, according to the mounting system 1 of the second embodiment, the XY speed of a component distributed to the mounting device in the post-process is the component distributed to the mounting device in the previous process. Therefore, the parts mounted by the mounting device in the previous process move from a predetermined position or jump out of the circuit board during the mounting operation in the mounting device in the subsequent process. There is nothing.

The optimization device may be controlled using tact information of the circuit board when electronic components are mounted instead of the moving speed described above.
3. Third Embodiment A mounting system 1 according to a third embodiment has the same configuration as the mounting system 1 according to the first embodiment.

Here, it demonstrates centering on difference with the mounting system 1 of 1st Embodiment.
As shown in FIG. 25, the high-speed placement machine 124 includes a component supply unit 301. The component supply unit 301 is provided with a plurality of parts cassettes in parallel. One parts cassette supplies one kind of parts. The component supply unit 301 moves in the left-right direction of the drawing. This direction is called the Z axis.

The high speed mounting machine 124 also includes a rotary head 302. The rotary head 302 sucks components from one parts cassette at the suction position. Next, the rotary head 302 rotates halfway, and the sucked component is mounted on the circuit board 303 at the mounting position.
The rotary head 302 is mounted with a plurality of components on the circuit board 303 while repeatedly sucking and mounting the components.

The letters “A”, “B”, “C”... Displayed on the circuit board 303 indicate parts. Further, the arrows displayed on the circuit board 303 indicate the order in which components are mounted.
3.1 Configuration of Optimization Device 200 (1) Information Storage Unit 205
The information storage unit 205 has a movement tact table.

As shown in FIG. 26, the movement tact table includes an area for storing a plurality of sets of part name, XY movement amount, XY movement tact, Z movement amount, Z movement tact, return tact, and total movement tact. Each set corresponds to each component mounted on the circuit board.
The part name is a name for identifying the part.
The XY movement amount indicates the distance from the position where the previous part is mounted to the position where the part is mounted when the part is mounted.

The XY movement tact is the time required for the head to move the distance indicated by the XY movement amount.
When the component is mounted, the Z movement amount is determined based on whether the component cassette for supplying the previous component exists at the suction position of the head when the type of the component is different from the previous component. The distance by which the component supply unit moves in the Z direction so that the supplied parts cassette is present at the suction position of the head is shown.

The Z movement tact is the time required for the component supply unit to move the distance indicated by the Z movement amount.
The return tact is to supply the previous part from the state in which the parts cassette for supplying the part is present at the suction position of the head when the type of the part is different from the previous part after mounting the part. The distance by which the parts supply unit moves in the Z direction so that the parts cassette exists at the head suction position is shown.

The total movement tact is a time calculated by the following equation.
Total movement tact = Max {(XY movement tact), ((Z movement tact) + (return tact) × 2)}
(2) Optimization unit 203
The optimization unit 203 rearranges the component information included in the component name list in ascending order for the mounting tact. Next, the component name list in which the component information is rearranged in ascending order with respect to the mounting tact is divided into a plurality of groups including the component information having the same mounting tact. Each group is assigned to each mounting device. Here, a group including a short mounting tact is assigned to the mounting device on the upstream side. Next, the optimization unit 203 rearranges the component information included in the group for each group in descending order of the number.

Next, the optimization unit 203 obtains a component R0 that is closest to the origin of the head from the components of the first group assigned to the most upstream mounting device.
Next, the optimization unit 203 repeats the following for the remaining parts.
(1) The XY movement amount from the component R0 is calculated for all other components.
(2) XY movement tact from R0 is calculated for all other parts.

(3) The Z movement amount from R0 is calculated for all other parts.
(4) Calculate Z movement tact from R0 for all other parts.
(5) The return tact from R0 is calculated for all other parts.
(6) Calculate the total movement tact for all other parts using the following formula.
Total movement tact = Max {(XY movement tact), ((Z movement tact) + (return tact) × 2)}
(7) Select the smallest one from the calculated total movement tact.

(8) A path is connected from R0 to the part R1 corresponding to the selected total movement tact.
(9) Let component R1 be component R0.
Next, when there is a path that causes tact loss, the optimization unit 203 divides the path that becomes tact loss to generate a plurality of clusters, and then the divided path so that the tact is minimized. Reconnect.

3.2 Operation of Optimization Device 200 The operation of the optimization device 200 will be described with reference to the flowcharts shown in FIGS.
The optimization unit 203 rearranges the component information included in the component name list in ascending order for the mounting tact (step S321), sorts the component information included in the component name list into a plurality of groups, and groups them to each mounting device. (Step S322), and rearrange component information in descending order of number for each group (step S323).

Next, the optimization unit 203 obtains a component R0 that is close to the origin of the head from the components of the first group (step S324).
Next, the optimization unit 203 determines whether or not there are remaining parts. If there are any parts (step S325), the optimization unit 203 calculates the XY movement amount from the part R0 for all other parts. (Step S326), XY movement tact from R0 is calculated for all other parts (Step S327), Z movement amount from R0 is calculated for all other parts (Step S328), and all other parts are calculated. The Z movement tact from R0 is calculated for the part (step S329), and the return tact from R0 is calculated for all other parts (step S330).

Next, the optimizing unit 203 calculates the total movement tact for all other parts by the following formula.
Total movement tact = Max {(XY movement tact), ((Z movement tact) + (return tact) × 2)} (step S331)
Next, the optimization unit 203 selects the smallest one from the calculated total movement tact (step S332), and connects a path from R0 to the component R1 corresponding to the selected total movement tact (step S333).

Next, the optimization unit 203 sets the component R1 as the component R0 (step S334), returns to step S325, and repeats the process.
The optimization unit 203 determines whether or not there are any remaining parts. If there is no remaining part (step S325), and if there is a tact loss path (step S335), the tact loss path is present. Are divided to generate a plurality of clusters (step S336), and then the divided paths are reconnected so that the tact is minimized (step S337), and the process is terminated.

When there is no tact loss path (step S335), the optimization unit 203 ends the process.
3.3 Summary As described above, since the component mounting order is determined based on the Z movement tact and the return tact in addition to the XY movement tact, a large movement in the Z direction is reduced.

3.4 Modification A mounting system as a modification of the third embodiment will be described.
FIGS. 29 and 30 are views of the rotary head provided in the high-speed mounting machine 124 as seen from the lower direction.
The rotary head R101 shown in FIG. 29 is at time t4. The rotary head R101 rotates clockwise around the point P11. The rotary head R101 is provided with eight nozzles N11, N12, N13, N14, N15,. At time t4, the nozzle N11 is located at the suction point P1, and the nozzle N15 is located at the mounting point P2.

The nozzle N14 sucks the part “A” (part number “A1”), the nozzle N13 sucks the part “A” (part number “A2”), and the nozzle N12 picks up the part “A”. (Part number “A3”) is adsorbed. The nozzle N11 is about to pick up the part “B” (part number “B1”) at time t4.
The rotary head R102 shown in FIG. 30 is at time t8 after the rotary has made a half rotation from time t4. At time t8, the nozzle N11 is located at the mounting point P2, and the nozzle N15 is located at the suction point P1.

The nozzle N11 is about to mount the component “B” (component number “B1”) on the circuit board.
FIG. 31 is a time chart showing the movement of the component supply unit in the Z direction and the change of the sucked component and the mounted component with time. The horizontal axis shows the passage of time.
At time t <b> 0 to t <b> 3, the component supply unit is positioned so that the nozzle at the suction point from the parts cassette that supplies the component “A” can suck the component “A”.

At time t1, the nozzle N14 sucks the part “A” (part number “A1”).
At time t2, the nozzle N13 sucks the part “A” (part number “A2”).
At time t3, the nozzle N12 sucks the part “A” (part number “A3”).
At times t3 to t4, the component supply unit moves so that the nozzle at the suction point can suck the component “B” from the parts cassette that supplies the component “B”.

At time t3, the nozzle N11 sucks the part “B” (part number “B1”).

At time t5 after the rotary has made a half rotation from time t1, nozzle N14 mounts component “A” (component number “A1”) on the circuit board.
Similarly, at times t6 and t7, each nozzle mounts the component “A” on the circuit board.
At time t8 after the rotary has rotated halfway from time t4, the nozzle N11 mounts the component “B” (component number “B1”) on the circuit board.

As described above, the Z movement tact is further delayed by a half rotation of the rotary.
Therefore, in the third embodiment, the optimization unit 203 may add a time corresponding to a half rotation of the rotary when calculating the Z movement tact. Further, when calculating the total movement tact, a Z movement tact in which the time corresponding to the half rotation of the rotary is added is used.
4). Fourth Embodiment A mounting system 1 according to a fourth embodiment has the same configuration as the mounting system 1 according to the first embodiment.

Here, it demonstrates centering on difference with the mounting system 1 of 1st Embodiment.
As shown in FIG. 32, the multi-function mounting machine 125 includes a component supply tray 401. On the component supply tray 401, a plurality of one type of components are arranged. One type of component is supplied on the component supply tray 401. A component supply unit (not shown) moves one of the plurality of component supply trays to the suction position of the head 402. The moving direction of the component supply tray is called the Z axis.

The multifunction mounting machine 125 includes a head 402. The head 402 is provided with a plurality of nozzles. Each nozzle sucks a component from one component supply tray 401 at the suction position.
In addition, the multi-function mounting machine 125 includes a camera 403.
When the component is sucked, the head 402 moves in the imaging range 404 by the camera 403, and further, the sucked component is mounted on the circuit board 405 at each mounting position.

The rotary head 302 is mounted with a plurality of components on the circuit board 303 while repeatedly sucking and mounting the components.
The letters “A”, “B”, “C”... Displayed on the circuit board 405 indicate components. An arrow displayed on the drawing indicates a trajectory along which the head 402 moves.
4.1 Configuration of Optimization Device 200 (1) Information Storage Unit 205
The information storage unit 205 includes a part name list, a Z-axis list, a plurality of task lists, a final mounting point list, a maximum Z coordinate list, a task pair list, and a mounting order list.

(Part name list)
As shown in FIG. 33 as an example, the component name list stores a plurality of component name information including a component name, number, nozzle, and other items.
The part name is a name for identifying the part.
The number indicates the number of components mounted on the circuit board to be mounted.

The nozzle is an identifier indicating the type of nozzle.
(Z-axis list)
As shown in FIG. 35 as an example, the Z-axis list includes an area for storing a plurality of pieces of Z-axis information including part names and Z coordinates.
The part name is a name for identifying the part.

The Z coordinate value indicates the position of a parts cassette or tray in a part supply unit that supplies a part indicated by a corresponding part name.
(Task list)
As shown in FIG. 37 as an example, each task list includes an area for storing a task number and a plurality of pieces of task information.

  Here, the task is that the mounting head moves to the component supply unit, picks up a plurality of electronic components, and then the mounting head moves the shooting range on the recognition camera at a constant speed. A series of operations in which all the electronic components sucked by the head are photographed and then the mounting head mounts the plurality of electronic components on the circuit board will be described. By executing a plurality of tasks, the component is mounted on the circuit board by one mounting device.

Each task list includes the same number of mounting information as the number of nozzles of the mounting head.
The task number is a number for identifying a task.
Each task information includes a mounting order, a component name, a component number, an X coordinate value, a Y coordinate value, a Z coordinate value, and other items.
The mounting order indicates the mounting order of components corresponding to the mounting information in the task.

The part name is a name for identifying the part to be mounted.
The part number is an identification number for individually identifying the part.
The X coordinate value and the Y coordinate value are respectively an X coordinate value and a Y coordinate value indicating a position where the component is mounted on the circuit board.
The Z coordinate value is a Z coordinate value indicating the position of a cassette or a tray that supplies the component in the component supply unit.

(Final mounting point list)
As shown in FIG. 38 as an example, the final mounting point list includes an area for storing a plurality of final mounting point information including a task number and an X coordinate value of the final mounting point.
The task number is a number for identifying a task.
The X coordinate value of the final mounting point indicates the X coordinate value of the position where the last mounted component is arranged on the circuit board in the task.

(Maximum Z coordinate list)
As shown in FIG. 39 as an example, the maximum Z coordinate list includes an area for storing a plurality of pieces of maximum Z coordinate information including task numbers and maximum Z coordinate values.
The task number is a number for identifying a task.
The maximum Z coordinate value indicates the maximum value among the Z coordinate values indicating the position of the cassette or the tray in the component supply unit that supplies the component to be mounted in the task.

(Task pair list)
As shown in FIG. 40 as an example, the task pair list includes a plurality of pieces of task pair information including a variable a, a previous task number, and a subsequent task number.
The task pair information is information indicating two tasks that are successively executed.
The variable a is a variable used in the return optimization method described later.

The previous task number is an identification number for identifying the preceding task.
The subsequent task number is an identification number for identifying a subsequent task.
(Implementation order list)
As shown in FIG. 41 as an example, the mounting order list is a data table that stores information indicating the order in which each task is executed.

The mounting order list includes an area for storing a plurality of mounting order information including a mounting order and a task number.
The mounting order indicates the order in which the task is executed by the mounting apparatus.
The task number is an identification number for identifying the task.
(2) Optimization unit 203
The optimization unit 203 rearranges the part name information included in the part name list stored in the information storage unit 205 in descending order of the number. A parts name list rearranged in descending order of the number is shown in FIG.

Next, the optimization unit 203 calculates the average X coordinate value Xm and Y coordinate value Ym on the circuit board for each component indicated by the component name stored in the component name list, using the following formula. calculate.
(formula)
Xm = {X0 + X1 +... + Xn} / n
Ym = {Y0 + Y1 +... + Yn} / n
Here, n indicates the number of one component mounted on the circuit board.

A plan view of the circuit board 421 is shown in FIG. In this figure, when the four components indicated by the component name “A” are mounted on the circuit board 421, the positions 431 to 434 of the components mounted on the circuit board 421 and the above formula are used. A position 422 indicated by the calculated X coordinate value Xm and Y coordinate value Ym is shown.
Next, it is assumed that the optimization unit 203 mounts components at positions indicated by the calculated X coordinate value Xm and Y coordinate value Ym for each component in the order of the component name information stored in the component name list. In this case, the Z coordinate value of the parts cassette or tray in the parts supply unit is determined so that the movement in the Z direction is minimized in order to suck the parts. Next, the determined Z coordinate value is written in the Z-axis list in association with the component indicating the component. An example of the Z-axis list generated in this way is shown in FIG.

As described above, the optimization unit 203 determines the Z coordinate value for each part in the order of the part name information stored in the part name list. Therefore, as the number of parts increases, the part supply in the Z-axis direction is further increased. The movement is set to be less.
Next, the optimization unit 203 rearranges the component name information included in the component name list using the nozzle or tool included in the component name information as a key to generate a plurality of groups. FIG. 36 shows a component name list in which the component name information is rearranged in this way. Here, the component name information including the nozzle “S” forms “Group 1”, the component name information including the nozzle “M” forms “Group 2”, and the component name information including the nozzle “L” is “ Group 3 "is formed.

Next, the optimization unit 203 determines allocation to tasks for all components included in the component table, and generates a plurality of task lists. An example of the generated task list is shown in FIG.
Next, the optimization unit 203 determines a pass by the return optimization method for each nozzle or for each cassette / tray. Details of the return optimization method will be described later.

Next, the optimization unit 203 searches for the point that can be mounted earliest on the circuit board for each group, and connects the cassette path and the tray path.
(Path decision operation by return optimization method)
The path determination operation by the return optimization method of the optimization unit 203 will be described.
For each task, the optimization unit 203 extracts the X coordinate value in the task information including the final mounting order in the task list corresponding to the task, the task number for identifying the task, and the extracted X The final mounting point information is paired with the coordinate value, and the generated final mounting point information is written in the final mounting point list.

Next, the optimization unit 203 rearranges all the final mounting point information included in the final mounting point list in descending order of the X coordinate values of the final mounting points, and the rearranged final mounting point information is the final mounting point list. Overwrite to. An example of the final mounting point list is shown in FIG.
Next, for each task, the optimization unit 203 obtains the maximum Z coordinate value in the task list corresponding to the task, and is composed of a task number for identifying the task and the obtained maximum Z coordinate value. The maximum Z coordinate information is written into the maximum Z coordinate list. In this way, the maximum Z coordinate list is generated. An example of the maximum Z coordinate list is shown in FIG. Next, the optimization unit 203 rearranges all the maximum Z coordinate information included in the generated maximum Z coordinate list in descending order of the maximum Z coordinate, and overwrites the rearranged maximum Z coordinate information on the maximum Z coordinate list. .

Next, the optimizing unit 203 repeatedly executes the following processing while changing the variable a starting from a value of 1 and incrementing the variable a until the number of tasks is reached.
(1) The task identified by the task number included in the a-th final mounting point information from the top of the final mounting point list is set as the destination task of the a-th task pair.
(2) The task identified by the task number included in the a-th maximum Z coordinate information from the top of the maximum Z-coordinate list is set as the post-task of the a-th task pair.

(3) Task pair information including a variable a, a destination task number for identifying the destination task, and a post task number for identifying the post task is generated, and the generated task pair information is written in the task pair list.
Next, the optimization unit 203 extracts one piece of task information having the final mounting order from all the task lists, and further has the maximum X coordinate value from the plurality of extracted task information. Implementation in which task information is extracted, a mounting order “1” is assigned to a task identified by a task number included in a task list including the extracted task information, and the task number and the mounting order “1” are paired Order information is generated, and the generated mounting order information is written in the mounting order list.

Next, the optimization unit 203 repeatedly executes the following processing until the mounting order is assigned to all the tasks, starting from a value of 1 and adding the variable a by 1.
(1) A task number for identifying a task in the mounting order a is obtained from the mounting order list.
(2) Using the task identified by the obtained task number as a destination task, task pair information including the destination task number for identifying the destination task is obtained from the task list.

(3) The post task number is obtained from the obtained task pair information.
(4) Using the mounting order list, it is determined whether or not the mounting order is assigned to the post-task identified by the obtained post-task number.
(5) -1 If there is an assignment, it is determined whether there is an unassigned task to which the mounting order is not assigned. If there is an unassigned task, among the remaining tasks, X of the final mounting point The mounting order “a + 1” is assigned to the task having the largest coordinate.

(5) -2 When there is no assignment, the mounting order “a + 1” is assigned to the subsequent task.
Next, the optimization unit 203 calculates the amount of head movement for each task as described below.
A plan view showing the positional relationship between the circuit board 451 and the head 441 is shown in FIG. In this figure, the head 441 is provided with a plurality of nozzles 443, 444,. Each nozzle is separated by an offset 450.

The nozzles 443 and 444 provided in the head 441 suck the components N1 and N2, respectively, and mount the components N1 and N2 at the mounting points 452 and 453, respectively. Here, if the coordinates of the mounting points 452 and 453 are (100, 200) and (200, 200), respectively, the movement amount ΔX of the center point 442 of the head in the X-axis direction is the center of the head in the Y-axis direction. The movement amount ΔY of the point 442 is respectively
ΔX = X coordinate of the mounting point of N2−X coordinate of the mounting point of N1−Offset = 200−100−20 = 80
ΔY = Y coordinate of the mounting point of N2−Y coordinate of the mounting point of N1 = 200−200 = 0
It becomes.

In this way, the optimization unit 203 calculates the amount of movement of the center point of the head in consideration of the offset.
Next, the optimization unit 203 calculates a total P1 of head movement amounts of all tasks.
Next, the optimization unit 203 sets a value of 1 to the variable task1, sets (variable task1 + 1) to the variable task2, calculates the head movement amount for each task, and sums the head movement amounts of all tasks. Calculate the length.

Next, the optimization unit 203 swaps the mounting order of the task 1 and the task 2, calculates the head movement amount for each task, and calculates the total nlength of the head movement amounts of all tasks.
Next, the optimization unit 203 compares the sum total length and the sum total length, and adopts the post-replacement mounting order when the sum sum length is greater than or equal to the sum total length. When the sum total length is smaller than the sum total length, the mounting order before replacement is adopted.

Next, the optimization unit 203 adds 1 to task2, compares task2 with the number of tasks, and if task2 is less than or equal to the number of tasks, repeats the above processing.
When task2 is larger than the number of tasks, the optimization unit 203 adds a value of 1 to task1, compares task1 with the number of tasks, and when task1 is smaller than or equal to the number of tasks, the above processing is performed. repeat.

When task1 is larger than the number of tasks, the optimization unit 203 calculates the head movement amount for each task in the replaced task mounting order, and calculates the total head movement amount P2 of all the tasks. .
Next, the optimization unit 203 compares P2 and P1, and if P2 is smaller than P1, substitutes P2 for P1 and repeats the above processing.

If P2 is greater than or equal to P1, the optimization unit 203 ends the process.
4.2 Operation of Optimization Device 200 The operation of the optimization device 200 will be described.
(1) Outline Operation of Optimization Unit 203 Outline operation of the optimization unit 203 will be described with reference to a flowchart shown in FIG.

  The optimization unit 203 rearranges the part name information included in the part name list in descending order of the number (step S401), calculates an average value on the circuit board for each part in the part name list (step S402), and A Z-axis list is generated by determining Z based on the average value calculated every time (step S403), and the component name information included in the component name list is rearranged by using a nozzle (or tool) as a key to create a plurality of groups. (Step S404), allocation of mounting points to all tasks is determined, and a task list is generated (Step S405).

Next, the optimization unit 203 determines a path by the return optimization method for each nozzle or for each cassette / tray (step S406), and searches for a point that can be mounted on the circuit board earliest for each group ( In step S407, the cassette path and the tray path are connected (step S408).
(2) Path Determination Operation by Return Optimization Method The path determination operation by the return optimization method will be described with reference to the flowcharts shown in FIGS.

  The optimization unit 203 obtains the X coordinate of the final mounting point of each task, generates a final mounting point list (step S421), and rearranges the final mounting point list in descending order of the X coordinate of the final point (step S422). The maximum Z coordinate of the component type is obtained for each task, a maximum Z coordinate list is generated (step S423), and the generated maximum Z coordinate list is rearranged in descending order of the maximum Z coordinate (step S424).

  Next, the optimization unit 203 sets the variable a to 1 (step S425), sets the a-th task in the final mounting point list as the previous task of the a-th task pair (step S426), and sets the maximum Z coordinate list. The a-th task is set as the post-task of the a-th task pair (step S427), 1 is added to the variable a (step S428), and the variable a is compared with the number of tasks. If it is smaller or equal (step S429), the process returns to step S426 and the process is repeated.

When the variable a is larger than the number of tasks (step S429), the optimization unit 203 assigns the mounting order “1” to the task having the maximum X coordinate of the final mounting point (step S430).
Next, the optimization unit 203 sets a value of 1 to the variable a (step S431), obtains a task in the mounting order a from the mounting order list (step S432), and sets a pair having the obtained task as a previous task as a task. It is obtained from the list (step S433), a subsequent task is obtained from the obtained pair (step S434), and it is determined whether or not the mounting order is assigned to the subsequent task using the mounting order list (step S435). If there is an unassigned task to which the mounting order is not assigned (step S436), and if there is an unassigned task (step S437), among the remaining tasks, the final mounting point is determined. The mounting order “a + 1” is assigned to the task having the largest X coordinate (step S438), and a value of 1 is added to the variable a (step S439). In, the process returns to step S432.

If there is no assignment (step S436), the optimization unit 203 assigns the mounting order “a + 1” to the subsequent task (step S440), adds a value of 1 to the variable a (step S439), and then step S432. Return to and repeat the process.
When there is no unassigned task (step S437), the optimization unit 203 calculates the head movement amount for each task (step S441), and calculates the total head movement amount P1 of all tasks (step S442). ), 1 is set in the variable task1 (step S443), (variable task1 + 1) is set in the variable task2 (step S444), and the head movement amount is calculated for each task (step S445). Is calculated (step S446), the mounting order of task 1 and task 2 is switched (step S447), the head movement amount is calculated for each task (step S448), and the head movement of all tasks is calculated. The total amount nlength is calculated (step S449).

  Next, the optimization unit 203 compares the sum total length and the sum total length, and when the sum sum length is greater than or equal to the sum total length (step S450), adopts the replacement mounting order (step S452). When the sum total length is smaller than the sum total length (step S450), the mounting order before replacement is adopted (step S451).

Next, the optimization unit 203 adds 1 to task2 (step S453), compares task2 with the number of tasks, and if task2 is less than or equal to the number of tasks (step S454), The process returns to S445 and is repeated.
If task2 is larger than the number of tasks (step S454), the optimization unit 203 adds 1 to task1 (step S455), compares task1 with the number of tasks, and whether task1 is smaller than the number of tasks. Or when it is equal (step S456), it returns to step S444 and repeats a process.

When task1 is larger than the number of tasks (step S456), the optimization unit 203 calculates the amount of head movement for each task in the replacement task mounting order (step S457), and the heads of all tasks are calculated. The total amount P2 of movement is calculated (step S458).
Next, the optimization unit 203 compares P2 and P1, and if P2 is smaller than P1 (step S459), substitutes P2 for P1 (step S460), returns to step S443, and repeats the processing. .

If P2 is greater than or equal to P1 (step S459), the optimization unit 203 ends the process.
4.3 Summary As described above, according to the fourth embodiment, it is possible to determine a path in which the XY movement task is optimal in consideration of nozzle replacement and the like.

Here, an example of the locus of each task according to the conventional technique is shown in FIG. An example of the locus of each task according to the fourth embodiment is shown in FIG. Comparing these figures, it can be seen that according to the present invention, the trajectory of each task is less interlaced.
When determining the position of the cassette (or tray) of the component supply unit for each component, the optimization unit may be configured as follows.

For one cassette Z1 (Z-axis), the total movement time of paths from Z1 to all parts with the part name “A” is calculated by the following formula.
Total travel time of Z1 path = Σ (speed × distance i)
Here, the speed is the moving speed of the head, and the distance i is the distance from the position of the cassette Z1 of the component supply unit to the component i with the component name “A”.

The optimization unit calculates the total movement time of the paths for all cassettes (or trays) as described above.
Next, the optimization unit selects the smallest one of the calculated path movement times, and selects the cassette (or tray) corresponding to the selected path movement total with the part name “A”. Used for parts.

The other parts are determined in the same manner.
When cassettes (or trays) overlap, the optimization unit selects them in order of the number of parts.
5). Fifth Embodiment A mounting system 1 according to a fifth embodiment has the same configuration as the mounting system 1 according to the first embodiment.

Here, it demonstrates centering on difference with the mounting system 1 of 1st Embodiment.
As shown in FIG. 51, the optimization apparatus 200 of the fifth embodiment assumes that the circuit board surface is composed of a plurality of component planes formed for each component type, rearranges the component planes, An optimized path in the component plane is determined, and a three-dimensional path connecting the component planes is generated, thereby determining the order of mounting the components on the circuit board.

5.1 Configuration of Optimization Device 200 The configuration of the optimization device 200 will be described.
(1) Optimization unit 203
(Part plane generation)
The optimization unit 203 rearranges all the part name information included in the part name list in the descending order of the XY speed and the descending order of the number using the XY speed and the number as keys. Here, the component name list is the same as the component name list shown in FIG. 21, and each component name information indicates the number of components indicated by the component name included in the component name information. Includes number. Next, the optimization unit 203 writes the rearranged component name information in the plane list.

The parts name list generated in this way constitutes a plurality of groups. Each group includes part name information including the same XY speed, and each group is arranged in descending order of the XY speed.
In each group, the part name information is arranged in descending order of the number included in the part name information.

Next, the optimization unit 203 generates each component plane by regarding each component name information as corresponding to each component plane.
FIG. 51 shows a conceptual diagram showing each component plane generated in this way. As shown in this figure, the component planes 511, 512,... Correspond to component name information including component names “A”, “B”,. The component planes 511, 512, and 513 belong to the group “SP1”, and the components 514, 515, and so on belong to the group “SP2”. “SP1” and “SP2” respectively indicate XY speeds, and “SP1”> “SP2”. The component planes included in each group are rearranged in descending order of number.

(Sort parts plane)
The optimization unit 203 selects one original part plane 521 as shown in FIG. It is assumed that components identified by the component name “A” are mounted on the original component plane 521 at positions 531 to 535.
The optimization unit 203 selects one previous part plane from the remaining part planes. It is assumed that components identified by the component name “B” are mounted at positions 541 to 544 on the front component plane.

  The optimization unit 203 sets, for the positions 531 to 535, square areas 551 to 555 having the positions as the center points and a side length of ΔZ on the original part plane 521. Here, ΔZ indicates the amount of movement of the component supply unit from the component mounted on the original component plane 521 to the component mounted on the previous component plane. Specifically, ΔZ is 1 second in time units and 15 mm in distance units.

  Next, the optimization unit 203 determines whether or not each of the positions 541 to 544 is included in the region 551, and counts the number of included positions. The optimization unit 203 similarly counts the number of positions for the regions 552 to 555 as well. The counted numbers are summed to calculate an exit candidate total from the original part plane to the destination part plane, and the calculated exit candidate total is written in the corresponding area of the exit candidate list.

In the same manner as described above, the optimization unit 203 sets each component plane as the original component plane, sets all other component planes as the previous component planes, and sets exit candidate meters from the respective component planes to the respective previous component planes. Calculate. Write in the appropriate area of the exit candidate list.
Next, the optimization unit 203 calculates an exit candidate total by summing the exit candidate total for each original part plane in the exit candidate list, and sets the calculated exit candidate total to a corresponding area of the exit candidate list. Write. An example of the generated exit candidate list is shown in FIG.

  Next, the optimization unit 203 selects one original part plane having the smallest total exit candidate from the exit candidate list. The original part plane selected in this way is set as the first part plane. Among the selected original part planes, the previous part plane with the largest number of exit candidate meters is selected. The tip part plane selected in this way is set as the second part plane. By repeating the above, a plurality of component planes and the order of these component planes are determined.

The above procedure will be described in detail using the exit candidate list shown in FIG. 54 as an example.
(1) The optimization unit 203 selects one original part plane having the smallest total exit candidate from the exit candidate list. In the exit candidate list shown in FIG. 54, the exit candidate totals are “5”, “4”, and “3”, and the smallest exit candidate total is “3”. Here, the original part planes “D” and “E” whose exit candidate total is “0” are excluded. The smallest exit candidate total is “3” and the original part plane “C” has. Therefore, the optimization unit 203 selects the original part plane “C”. The original part plane “C” thus selected is set as the first part plane.

(2) Next, the optimization unit 203 selects a previous part plane having the largest number of exit candidate totals from the selected original part plane “C”. The exit candidate totals of the original part plane “C” are “1”, “2”, “0”, and “0”. Since the most exit candidate total is “2”, the front part plane “B” is selected. The tip part plane “B” thus selected is set as a second part plane.
As described above, the order of the two component planes from the component plane “C” to the component plane “B” is determined.

Similarly, by repeating the above, the order of the three component planes from the component plane “C” to the component plane “B” and from the component plane “B” to the component plane “A” is determined.
The component plane information included in the plane list is rearranged according to the order of the plurality of component planes thus determined.
54. The order generated by the exit candidate list shown as an example in FIG. 54 is coincidentally the same as the order shown by the plane list shown as an example in FIG. 53. Therefore, the component planes included in the plane list by the above rearrangement. The order of information does not change.

(Generate optimization path in the component plane)
The optimization unit 203 repeats the following for each component plane.
(1) Select one exit candidate in the part plane
(2) Next, in order to reduce the tact, all the components are connected in order with the selected exit candidate as a starting point, and one cluster is generated.

(3) If there is a route in which tact loss occurs, the route is cut to generate a plurality of clusters.
(Generate 3D path)
The optimization unit 203 generates a path connecting the clusters in the Z-axis direction so that the Z movement of the clusters on each component plane becomes small. Here, in each component plane, each exit candidate is an end point of a path to another component plane.

(2) Information storage unit 205
The information storage unit 205 has a plane list and an exit candidate list.
(Plane list)
As shown in FIG. 53 as an example, the plane list includes an area for storing a plurality of pieces of part plane information including part names, XY speeds, numbers, and other items.

Since the part name, the XY speed, and the number are as described above, the description is omitted.
(Exit candidate list)
As shown in FIG. 54 as an example, the exit candidate list includes an area for storing an exit candidate total to the destination part plane for each original part plane. Moreover, the area | region which memorize | stores an exit candidate total is provided for every original component plane.

Since the exit candidate total and the exit candidate total are as described above, description thereof will be omitted.
5.2 Operation of Optimization Device 200 The operation of the optimization device 200 will be described.
(1) Overall Outline Operation of Optimization Device 200 The overall outline operation of the optimization device 200 will be described with reference to the flowchart shown in FIG.

  The optimization unit 203 rearranges the part name list in descending order of XY speed and descending number of parts to generate a part plane (step S501), and then rearranges the part plane to generate a plane list (step S501). S502), an optimization path in the component plane is generated to generate a cluster (step S503), and the cluster of each component plane is connected to the cluster in the Z-axis direction so that the Z movement is reduced. To generate a solid path (step S504).

(2) Component Plane Rearrangement Operation The component plane rearrangement operation will be described with reference to the flowchart shown in FIG.
The optimization unit 203 generates an exit candidate list (step S510), selects an original part plane having the smallest exit candidate total (step S511), and when selection is completed (step S512), The component plane information included in the plane list is rearranged according to the order of the component planes (step S514), and the rearrangement operation is terminated.

If the selection has not been completed (step S512), a destination part candidate with the largest number of exit candidates is selected from the selected source part planes (step S513), and then the process returns to step S511 to repeat the process.
(3) Generation of Optimization Path in Component Plane The operation of generating an optimization path in the component plane will be described with reference to the flowchart shown in FIG.

In steps S531 to S535, the optimization unit 203 repeats the following for each component plane.
The optimization unit 203 selects one exit candidate in the component plane (step S532). Next, one cluster is generated by connecting all the parts in order with the selected exit candidate as a starting point so that the tact is reduced (step S533). Next, if there is a tact loss route, the tact loss route is cut to generate a plurality of clusters (step S534).

5.3 Summary According to the fifth embodiment, virtual component planes are generated for each type of electronic component, arranged in a predetermined order, and the order of each component plane is changed. By generating the optimal path for connecting the parts, and connecting the path in the part plane to the path in the other part plane, a solid path that connects each part plane is generated, so the shortest path can be determined. . Further, the electronic component to be mounted next can be determined in the Z movement tact.

6). Other Embodiments Although the present invention has been described based on the above embodiments, the present invention is of course not limited to the above embodiments. That is, the following cases are also included in the present invention.
(1) The present invention may be the method described above. Further, the present invention may be a computer program that realizes these methods by a computer, or may be a digital signal composed of the computer program.

  The present invention also provides a computer-readable recording medium such as a floppy (registered trademark) disk, hard disk, CD-ROM, MO, DVD, DVD-ROM, DVD-RAM, and semiconductor memory. Or the like. Further, the present invention may be the computer program or the digital signal recorded on these recording media.

In the present invention, the computer program or the digital signal may be transmitted via an electric communication line, a wireless or wired communication line, a network represented by the Internet, or the like.
The present invention may be a computer system including a microprocessor and a memory, wherein the memory stores the computer program, and the microprocessor operates according to the computer program.

In addition, the program or the digital signal is recorded on the recording medium and transferred, or the program or the digital signal is transferred via the network or the like, and is executed by another independent computer system. It is good.
(2) The above embodiment and the above modifications may be combined.
(The invention's effect)
As described above, the present invention is an electronic component mounting system that includes two or more mounting devices that mount electronic components on a circuit board, and that optimizes the mounting of the electronic components by each mounting device. A first allocation unit that determines a first allocation to each mounting device for each type of electronic component, and all the devices allocated to the mounting device by the first allocation for each mounting device. A first calculating means for calculating a first mounting time required for mounting the electronic component on the circuit board by the mounting device, and selecting any two mounting devices from the plurality of mounting devices; A second allocating unit that selects one type of electronic component allocated to each mounting device and replaces the selected two types of allocation with each other to determine a second allocation; 2 allocation A second calculator for calculating a second mounting time required for mounting all the electronic components allocated to the mounting device to the circuit board by the mounting device; and the replacement selected by the second allocator. Of the first allocation and the second allocation, comparing the largest wearing time among the first wearing times calculated for the target wearing device and the largest wearing time among the second wearing times, Employment decision means for deciding the adoption of allocation for obtaining a smaller wearing time.

According to this structure, there exists an effect that the mounting time in each mounting apparatus becomes more uniform. In this way, more efficient electronic component mounting can be achieved.
Here, the first allocating unit includes a number storage unit that stores the number of electronic components of the same type for each type of electronic component, and one electronic component of each type by a mounting board. In order to mount all the electronic components of the type by each mounting device on the circuit board for each type of electronic component, using the standard mounting time required for mounting on and the number of each type Mounting time calculating means for calculating required mounting time, and allocation determination for determining allocation of each type of electronic component to each mounting device using the calculated mounting time for each type of each mounting device and electronic component Means.

According to this configuration, since the allocation to each mounting device is determined based on the total mounting time calculated using the standard mounting time and number determined for each type of electronic component, It can be reliably allocated to the mounting device.
Here, the second allocating unit allocates the electronic component of the type to the specific mounting device in preference to other types of the types of electronic components that can be mounted only by the specific mounting device.

According to this configuration, since the specific type of electronic component is allocated to the specific mounting device, the specific type of electronic component can be reliably mounted on the circuit board.
Here, the second allocating unit is configured so that, among the mounting time calculated for each mounting device and each type of electronic component, the mounting device and the type of electronic component having a mounting time smaller than a predetermined value, other mounting devices and Prior to the types of other electronic components, the types of the electronic components are allocated to the mounting device installed on the upstream process side.

According to this configuration, since the electronic component with a short mounting time is allocated to the mounting device installed in the upstream process, the high-speed mounting component is allocated to the mounting device in the upstream process, and the low-speed mounting component is allocated to the downstream process. Can be assigned to a mounting device.
Here, each of the first calculation unit and the second calculation unit stores the number of electronic components of the same type to be mounted on the circuit board for each type of electronic component allocated to each mounting device. A number storage means, a total time calculating means for calculating a total mounting time indicating the total mounting time of all electronic components allocated to each mounting device, and an electronic component allocated to each mounting device. For each type, multiply the calculated total mounting time by the number of electronic components of that type, and further divide by the number of all electronic components allocated to the mounting device, Wearing time calculating means for calculating a wearing time, wherein the first calculating means and the second calculating means use the calculated wearing times as the first wearing time and the second wearing time, respectively.

According to this configuration, for each type of electronic component allocated to each mounting device, the calculated total mounting time is multiplied by the number of electronic components of that type, and all the electronic components allocated to the mounting device are By dividing by the number, the mounting time of all the electronic components of the type is calculated, so that a time closer to the actual mounting time can be calculated.
Here, each of the first calculation means and the second calculation means includes request output means, tact calculation means equal to the number of mounting apparatuses, and mounting time receiving means, and each tact calculation means includes each mounting apparatus. The request generation means outputs, for each mounting device, a type identifier for identifying the type of the component and the number of components allocated to the mounting device for each mounting device, and calculates each tact. The means calculates the time required to mount the electronic component on the circuit board by the corresponding mounting device based on the output type identifier and the number, outputs the calculated mounting time, the mounting time receiving means, The wearing time is received, and the first calculating means and the second calculating means respectively set the received wearing time as the first wearing time.

According to this configuration, since each of the first calculation unit and the second calculation unit includes a tact calculation unit corresponding to each mounting device, it is possible to calculate an appropriate mounting time according to the configuration of the mounting device. it can.
Here, the first calculation unit and the second calculation unit each include a request output unit and a mounting time receiving unit, each mounting device includes a tact calculation unit, and the request generation unit includes the mounting For each device, a type identifier for identifying the type of the component and the number of components allocated to the mounting device are output to the mounting device, and each tact calculating means outputs the type identifier and the number of components to the output. Based on this, the time required for mounting the electronic component on the circuit board by the mounting device is calculated, the calculated mounting time is output, and the mounting time receiving means receives the mounting time, and the first calculating means And the second calculation means sets the received wearing time as the first wearing time.

According to this configuration, each mounting device includes a corresponding tact calculation unit, and thus an appropriate mounting time can be calculated according to the configuration of the mounting device.
Here, each of the first calculation means and the second calculation means includes request output means, the same number of conversion means as the mounting device, tact calculation means and inverse conversion means, and mounting time receiving means, Means, each tact calculation means, and each inverse conversion means correspond to each mounting device, and the request generation means, for each mounting device, a type identifier for identifying the type of component for the mounting device, and the mounting The number of parts allocated to the device is output, and each conversion means converts the output type identifier and the number into the format determined for the corresponding mounting device, and each tact calculation means converts the converted type Based on the identifier and the number, the time required to mount the electronic component on the circuit board by the corresponding mounting device is calculated, and the calculated mounting time is output. Optimized for optimization equipment The wearing time receiving means receives the converted wearing time, and the first calculating means and the second calculating means respectively receive the converted wearing times received by the first wearing means. Time.

According to this configuration, since the conversion unit and the reverse conversion unit perform conversion and reverse conversion according to each mounting device, information conversion and reverse conversion can be performed in accordance with the data format unique to each mounting device.
Further, the present invention provides information for changing movement speed information of the circuit board when each electronic component is mounted in an electronic component mounting system including one or more mounting devices for mounting the electronic component on the circuit board. A generation device, for each type of electronic component, a moving speed storage means for storing moving speed information of the circuit board, and for each type of electronic component, allocation of the electronic component of that type to each mounting device A storage unit for storing allocation; a selection unit for selecting two consecutively connected mounting devices from the plurality of mounting devices; and an upstream side of the selected two mounting devices. Out of the types of electronic components allocated to the mounting device, the extraction means for extracting the type of electronic component for which the slowest slowest moving speed information is set, and the downstream side of the selected two mounting devices Allocate to mounting device Among the types of electronic components extracted, extraction means for extracting faster movement speed information than the extracted latest movement speed information, and the movement speed storage means, the extracted movement speed information is converted into the latest movement speed information. And replacement means for replacing with speed information.

According to this configuration, it is possible to generate an information table of electronic components in which the XY speed of the mounting device in the downstream process is changed so as not to exceed the XY speed of the mounting device in the upstream process.
In the present invention, one or more supply units that respectively supply one or more types of electronic components move to the mounting position of the mounting head, and the mounting head sucks the electronic components from the supply unit and mounts them on the circuit board. An optimization device for optimizing a mounting order of electronic components used in the device, wherein a first selection unit that selects one of the plurality of electronic components and sets the first electronic component as a first electronic component; For every other electronic component except one, one is selected as the second electronic component, and the mounting head included in the mounting device is mounted from the position where the first electronic component is mounted. The head movement time required to move relatively to the position to be moved and the supply required to move the supply unit for supplying the second electronic component to the mounting position of the mounting head when mounting the second electronic component Department travel time and previous After the second electronic component is mounted, a calculation unit that calculates a return movement time required for the supply unit that supplies the first electronic component to move to the suction position of the mounting head; and other than the first electronic component Based on the head movement time, the supply unit movement time, and the return movement time calculated for each of the electronic components, the next to the first electronic component from among all the other electronic components except the first electronic component. Selection means for selecting one electronic component as an electronic component to be mounted on the device.

According to this configuration, the component supply unit that supplies the electronic components does not move greatly, and tact loss can be reduced.
Here, the selection means calculates a sum of a value twice the return movement time and a supply movement time for every electronic component other than the first electronic component, and calculates the calculated head movement time and Corresponds to the smallest value among the values adopted for all other electronic components except the first electronic component by the computing means that adopts the larger one of the calculated sums. Electronic component selection means for selecting an electronic component to be mounted as an electronic component to be mounted next to the first electronic component.

According to this configuration, the sum of the value twice the return movement time and the supply movement time is calculated, and the larger one of the calculated head movement time and the calculated sum is adopted. Can be predicted more accurately.
Here, the mounting device includes a rotary mounting head, and the selection means is based on the calculated head moving time, supply unit moving time, return moving time, and half rotation time of the rotary mounting head. One electronic component is selected.

According to this configuration, it is possible to predict the mounting time more accurately in a mounting apparatus including a rotary mounting head.
Further, according to the present invention, one or more supply units that respectively supply one or more types of electronic components move to a mounting position of a mounting head including one or more nozzles, and the mounting head sucks electronic components from the supply unit. An optimization device that optimizes the mounting order of electronic components used in a mounting device that mounts all electronic components on the circuit board by repeating the task of mounting on the circuit board multiple times. Task information that stores task information including a mounting order of each electronic component in the task, a mounting position where each electronic component is mounted, and a supply unit position indicating the position of the supply unit that supplies each electronic component A first generating unit that generates an X coordinate list in which the task information is rearranged in the descending order of the X coordinates of the mounting position of the electronic component indicated by the last mounting order in the task information in the storage means Second generation means for generating a Z coordinate list in which the task information is rearranged in descending order of the largest supply unit position in the task information, and in this order from the top of the X coordinate list and the Z coordinate list. And assigning means for selecting tasks alternately and assigning the mounting order to each task in accordance with the order of the selected tasks.

According to this configuration, tasks are alternately selected in this order from the top of the X coordinate list and the Z coordinate list, and the mounting order is assigned to each task according to the selected task order. There is an effect that there is less.
Here, the optimization apparatus further includes a calculation unit that calculates a first total movement amount indicating a distance the head moves when executing all tasks in the mounting order allocated by the allocation unit; A task selection means for selecting a task, a replacement means for switching the mounting order of the two selected tasks, and a second total indicating a distance that the head moves when all tasks are executed in the replaced mounting order. Calculating means for calculating a movement amount; and adopting means for adopting the mounting order of all tasks corresponding to a minimum value among the first total movement amount and the second total movement amount.

According to this configuration, it is possible to adopt a mounting order with a shorter mounting time.
In the present invention, one or more supply units that respectively supply one or more types of electronic components move to the mounting position of the mounting head, and the mounting head sucks the electronic components from the supply unit and mounts them on the circuit board. An optimization device that optimizes the mounting order of electronic components used in the device, and for each type of electronic component, a virtual component plane including a position where the electronic component of the type is mounted is generated and generated A plane generating means for arranging the component planes in a predetermined order, a replacement means for changing the order of the respective component planes, an optimum path generating means for generating an optimum path for connecting the respective parts in each component plane, and a component plane And a solid path generating means for generating a solid path for connecting the component planes by connecting the paths in the other component planes.

According to this configuration, a virtual component plane is generated for each type of electronic component, arranged in a predetermined order, the order of each component plane is changed, and an optimal path for connecting each component is generated in each component plane. Then, by connecting a path in the component plane and a path in another component plane, a three-dimensional path connecting each component plane is generated, so that the shortest path can be determined.
Here, for each component plane, the replacement means is configured to change the position of the mounting head from the exit electronic component, which is an electronic component on the original component plane, which is the component plane, to the electronic component on the previous component plane, which is another component plane. The extraction means for extracting the outlet electronic component whose movement time is within the movement time of the supply unit, and the number of outlet electronic components are calculated for each original component plane and each previous component plane to calculate the number of outlet candidates. , Calculating means for calculating the exit candidate total by adding the number of the exit electronic components for each original part plane, selecting the original part plane having the smallest exit candidate total as the first part plane, and selecting the selected first With respect to the component plane, a selection unit that selects the previous component plane having the largest number of exit candidates and sets it as the second component plane, and the component plane input that changes the order of the component planes in the order of the first component plane and the second component plane Replacement means. In addition, the extraction means sets a square area having a side corresponding to the moving time of the supply unit with the position where the exit electronic component is mounted as a center, and the square set by the electronic component on the front part plane If included in the region, it is determined that the moving time of the mounting head is within the moving time of the supply component.

  According to this configuration, the electronic component to be mounted next can be determined in the Z movement tact.

1 is a block diagram showing a configuration of a mounting system 1. FIG. It is a perspective view which shows the main components of the high-speed mounting machine 124. (A) It is a perspective view which shows the main components of the multifunction mounting machine 125. The state which has mounted | worn with an electronic component is shown. (B) It is a perspective view which shows the main components of the multifunction mounting machine 125. The state which is adsorbing electronic parts is shown. 2 is a block diagram showing a configuration of an optimization apparatus 200. FIG. It is an example which shows the data structure of a components table. It is an example which shows the data structure of a tact calculation part corresponding | compatible table. It is an example which shows the data structure of a mounting apparatus type table. It is an example which shows the data structure of a tact table. An example of a tact table in which mounting time is written by the optimization unit 203 is shown. It is an example which shows the data structure of a component mounting table. An example of a component mounting table in which one set of component name and mounting time is written is shown. Further, an example of a component mounting table in which the next set of component names and mounting times is written is shown. An example of a component mounting table at the time when the component allocation by the optimization unit 203 is completed is shown. An example of a tact table obtained by a tact table calculation process by the optimization unit 203 is shown. 4 is a flowchart showing an outline operation of the optimization apparatus 200 as a whole. It is a flowchart which shows the operation | movement of temporary calculation of a tact table. It is a flowchart which shows operation | movement of distribution of components. It is a flowchart which shows the operation | movement of calculation of a tact table. It is a flowchart which shows operation | movement of a SWAP process. It is a block diagram which shows the structure of the mounting system as a modification of 1st Embodiment. It is an example which shows the data structure of a component name list. It is an example which shows the data structure of a component mounting table. An example of a part name list in which the XY speed by the optimization unit 203 is replaced is shown. 3 is a flowchart showing the operation of the optimization apparatus 200. 4 is a conceptual diagram showing a positional relationship among a component supply unit 301, a rotary head 302, and a circuit board 303 in a high-speed placement machine 124. An example of the data structure of a movement tact table is shown. 3 is a flowchart showing the operation of the optimization apparatus 200. Continued to FIG. 3 is a flowchart showing the operation of the optimization apparatus 200. It continues from FIG. It is the figure which looked at the rotary head with which the high-speed mounting machine 124 is provided from the lower direction. The rotary head at time t4 is shown. It is the figure which looked at the rotary head with which the high-speed mounting machine 124 is provided from the lower direction. The rotary head at time t8 is shown. It is a time chart which shows the movement of the component supply part to a Z direction with time progress, and the change of the component attracted | sucked and the component mounted. It is a conceptual diagram which shows the positional relationship of the component supply tray with which the multi-function mounting machine 125 is equipped, a mounting head, and a circuit board. It is an example which shows the data structure of a component name list. A plan view of the circuit board 421 is shown in FIG. It is an example which shows the data structure of a Z-axis list. A part name list in which the part name information is rearranged is shown. It is an example which shows the data structure of a task list. It is an example which shows the data structure of the final mounting point list. It is an example which shows the data structure of the maximum Z coordinate list. It is an example which shows the data structure of a task pair list. It is an example which shows the data structure of a mounting order list. 4 is a plan view showing a positional relationship between a circuit board 451 and a head 441. FIG. 5 is a flowchart showing an outline operation of an optimization unit 203. It is a flowchart which shows the determination operation | movement of the path | pass by a return optimization method. Continued to FIG. It is a flowchart which shows the determination operation | movement of the path | pass by a return optimization method. Continue to FIG. It is a flowchart which shows the determination operation | movement of the path | pass by a return optimization method. Continued to FIG. It is a flowchart which shows the determination operation | movement of the path | pass by a return optimization method. Continue to FIG. It is a flowchart which shows the determination operation | movement of the path | pass by a return optimization method. Continue from FIG. An example of the locus | trajectory of each task by a prior art is shown. An example of the locus of each task by a 4th embodiment is shown. A plurality of virtual part planes are shown. A position where the electronic component is mounted on the original component plane and a square area are shown. An example of the data structure of a plane list is shown. An example of the data structure of an exit candidate list is shown. 3 is a flowchart showing an overall operation of the optimization apparatus 200. It is a flowchart which shows the operation | movement of rearrangement of a component plane. It is a flowchart which shows the operation | movement of the production | generation of the optimization path | pass in a component plane.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Mounting system 120 Supply apparatus 121 Printing machine 122 Printing inspection machine 123 High-speed adhesive applicator 124 High-speed mounting machine 124b High-speed mounting machine 125 Multi-functional mounting machine 125b Multi-functional mounting machine 126 Multi-functional mounting machine 126b Multi-functional mounting machine 127 Mounting parts Inspection machine 128 Reflow device 129 Appearance inspection machine 130 Storage device 131 Production line LAN
200 optimization device 200b optimization device 201 display unit 202 input unit 203 optimization unit 204 transmission / reception unit 204b transmission / reception unit 205 information storage unit 206 conversion unit 206b conversion unit 207 conversion unit 207b conversion unit 208 conversion unit 208b conversion unit 209 tact calculation unit 209b Tact calculation unit 210 Tact calculation unit 210b Tact calculation unit 211 Tact calculation unit 211b Tact calculation unit

Claims (4)

One or more supply units that respectively supply one or more types of electronic components move to the mounting position of the mounting head, and the electronic components used in the mounting apparatus that mounts the electronic components on the circuit board by sucking the electronic components from the supply unit An optimization device for optimizing the mounting order of
First selection means for selecting one of the electronic components to be a first electronic component;
For every electronic component other than the first electronic component, one is selected as a second electronic component, and a mounting head provided in the mounting device is configured to move the first electronic component from a position where the first electronic component is mounted. The head moving time required for relatively moving to the position where the two electronic components are mounted, and when the second electronic component is mounted, the supply unit that supplies the second electronic component moves to the mounting position of the mounting head. A supply unit movement time required for movement and a return movement time required for the supply unit supplying the first electronic component to move to the suction position of the mounting head after mounting the second electronic component are calculated. A calculation means;
Based on the head movement time, the supply unit movement time, and the return movement time calculated for every other electronic component except the first electronic component, from among all the other electronic components except the first electronic component Selection means for selecting one electronic component as an electronic component to be mounted next to the first electronic component,
The selection means includes
For every electronic component other than the first electronic component, a sum of a value twice the return movement time and a supply movement time is calculated, and the larger of the calculated head movement time and the calculated sum Computing means adopting the value of
The electronic component corresponding to the minimum value among the values adopted for all other electronic components except the first electronic component by the arithmetic means is an electronic component to be mounted next to the first electronic component. And an electronic component selection means for selecting. The mounting device includes a rotary mounting head,
2. The electronic device according to claim 1, wherein the selection unit selects one electronic component based on the calculated head movement time, supply unit movement time, return movement time, and half-rotation time of the rotary type mounting head. The optimization device described in 1. One or more supply units that respectively supply one or more types of electronic components move to the mounting position of the mounting head, and the electronic components used in the mounting apparatus that mounts the electronic components on the circuit board by sucking the electronic components from the supply unit An optimization method used in an optimization device for optimizing the mounting order of
A first selection step of selecting one of the electronic components to be a first electronic component;
For every electronic component other than the first electronic component, one is selected as a second electronic component, and a mounting head provided in the mounting device is configured to move the first electronic component from a position where the first electronic component is mounted. The head moving time required for relatively moving to the position where the two electronic components are mounted, and when the second electronic component is mounted, the supply unit that supplies the second electronic component moves to the mounting position of the mounting head. A supply unit movement time required for movement and a return movement time required for the supply unit supplying the first electronic component to move to the suction position of the mounting head after mounting the second electronic component are calculated. A calculation step;
Based on the head movement time, the supply unit movement time, and the return movement time calculated for every other electronic component except the first electronic component, from among all the other electronic components except the first electronic component A selection step of selecting one electronic component as an electronic component to be mounted next to the first electronic component,
The selection step includes
For every electronic component other than the first electronic component, a sum of a value twice the return movement time and a supply movement time is calculated, and the larger of the calculated head movement time and the calculated sum An arithmetic substep that employs the value of
An electronic component that mounts an electronic component corresponding to the minimum value among the values adopted for all other electronic components except the first electronic component by the calculation sub-step after the first electronic component And an electronic component selection sub-step to be selected. One or more supply units that respectively supply one or more types of electronic components move to the mounting position of the mounting head, and the electronic components used in the mounting apparatus that mounts the electronic components on the circuit board by sucking the electronic components from the supply unit An optimization program used by a computer to optimize the mounting order of
A first selection step of selecting one of the electronic components to be a first electronic component;
For every electronic component other than the first electronic component, one is selected as a second electronic component, and a mounting head provided in the mounting device is configured to move the first electronic component from a position where the first electronic component is mounted. The head moving time required for relatively moving to the position where the two electronic components are mounted, and when the second electronic component is mounted, the supply unit that supplies the second electronic component moves to the mounting position of the mounting head. A supply unit movement time required for movement and a return movement time required for the supply unit supplying the first electronic component to move to the suction position of the mounting head after mounting the second electronic component are calculated. A calculation step;
Based on the head movement time, the supply unit movement time, and the return movement time calculated for every other electronic component except the first electronic component, from among all the other electronic components except the first electronic component A selection step of selecting one electronic component as an electronic component to be mounted next to the first electronic component;
The selection step includes
For every electronic component other than the first electronic component, a sum of a value twice the return movement time and a supply movement time is calculated, and the larger of the calculated head movement time and the calculated sum An arithmetic substep that employs the value of
An electronic component that mounts an electronic component corresponding to the minimum value among the values adopted for all other electronic components except the first electronic component by the calculation sub-step after the first electronic component And an electronic component selection sub-step to be selected.

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