JP3956906B2 - Resin sealing method and apparatus for electronic parts - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a resin sealing method and apparatus for an electronic component forming an electronic circuit.
[0002]
[Prior art]
As a conventional resin sealing and underfill forming method for an electronic component, a resin sealing and underfill forming method in which a sealing resin is supplied to a mounted electronic component by a dispenser and injected and filled is known.
[0003]
FIG. 12 is a cross-sectional view of a principal part of a conventional resin sealing device using a dispenser for resin sealing and underfill formation of electronic components.
[0004]
In FIG. 12, 1 is a circuit board having a multilayer structure made of a base material such as resin or ceramic for forming an electronic circuit used in an electronic device, and 2 is solder, gold or the like for forming the electronic circuit. The LGA and the BGA are active components mounted and mounted on the circuit board 1, and 3 is a passive component mounted and mounted on the circuit board 1 with solder for forming the electronic circuit.
[0005]
4 is an insulating base material made of a heat conductive material and an insulating material, or a filler material containing a heat conductive material, and a sealing resin having a low viscosity and a high fluidity, 5 is sealed with the sealing resin 4, The dispenser supplies the sealing resin 4 to a predetermined portion of the circuit board 1 by pressure such as hydraulic pressure and injects and fills it.
[0006]
Reference numeral 6 denotes a vacuum chamber made of a hard metal material such as stainless steel, which incorporates the above-described components and devices, and 7 denotes a vacuum pump for vacuuming the inside of the vacuum chamber 6.
[0007]
In the resin sealing apparatus constructed and arranged as described above, the vacuum pump 7 is driven to suck the vacuum chamber 6 to a predetermined vacuum (pressure). Next, a predetermined amount of sealing resin 4 is supplied by a dispenser 5 around the predetermined active component 2 and passive component 3 to be sealed, and then filled.
[0008]
Thereafter, the inside of the vacuum chamber 6 is opened to atmospheric pressure, and the sealing resin 4 is infiltrated and filled into the gaps between the active component 2 and the passive component 3 and the circuit board 1.
[0009]
For example, Patent Document 1 is known as prior art document information relating to this application.
[0010]
[Patent Document 1]
Japanese Patent Laid-Open No. 2001-217267
[Problems to be solved by the invention]
In the resin sealing and underfill forming method of the electronic component by the conventional dispenser, in the infiltration filling into the gap between the active component 2 and the passive component 3 and the circuit board 1 using the sealing resin 4 having a high filler content. Further, since the sealing resin 4 has high viscosity and low fluidity and is osmotic filling by a differential pressure between the vacuum pressure and the atmospheric pressure, there is a problem that an unfilled portion is generated.
[0012]
The present invention is intended to solve the above-described conventional problems, and a highly viscous and low fluid sealing resin having a high filler content is reliably and densely placed in the gap between the active component and the passive component and the circuit board. It is an object of the present invention to provide a resin sealing method for an electronic component and an apparatus therefor that can be infiltrated and filled to improve connection reliability and adhesion strength.
[0013]
[Means for Solving the Problems]
In order to achieve the above object, the present invention has the following configuration.
[0014]
According to the first aspect of the present invention, an electronic component for forming an electronic circuit is mounted and mounted in a vacuum pressurizing chamber having a switching valve and a leak valve for adjusting the internal vacuum pressure and atmosphere. The circuit board is inserted, and the periphery of the electronic component and the sealing resin are deaerated from the atmospheric pressure under vacuum pressure, injected and filled, and left for a predetermined time, and then pressurized by supplying a gaseous medium into the vacuum pressurizing chamber. An electronic component resin sealing method in which the sealing resin is filled with a differential pressure into a circuit board under an atmosphere, and then released to atmospheric pressure, wherein the sealing resin is injected and filled in a vacuum pressurizing chamber. The squeegee and the stencil have a printing application, and after the printing application, the sealing resin is semi-cured or fully cured by raising the temperature of the stencil, and then released to atmospheric pressure. Implemented power Between the components each other and, even gap between the circuit board, it is possible to sufficiently inject the sealing resin, the inside of the chamber at the time of atmospheric release, in the differential pressure to atmosphere atmospheric conditions from the atmosphere of a pressurized state Thus, it is possible to prevent the sealing resin filled in the gap between the mounted electronic component and the circuit board from being removed, that is, lost. Moreover, the effect that the load to an electronic component can be reduced when defoaming sealing resin is also acquired simultaneously.
[0015]
The invention according to claim 2 of the present invention, the vacuum pressure chamber having a switching valve and a leak valve for adjusting the internal vacuum pressure and atmosphere, electronic parts forming an electronic circuit mounted, is mounted The circuit board is inserted, and the periphery of the electronic component and the sealing resin are deaerated from the atmospheric pressure under vacuum pressure, injected and filled, and left for a predetermined time, and then pressurized by supplying a gaseous medium into the vacuum pressurizing chamber. A resin sealing method for an electronic component in which the sealing resin is filled into a circuit board with a differential pressure so as to be released to atmospheric pressure under an atmosphere, wherein the sealing resin is injected and filled by a movable dispenser and a stencil And the stencil is divided into two or more openings divided by a crosspiece, and a sealing resin is injected and filled into electronic parts corresponding to the openings. , After this injection filling Semi-curing or by curing the sealing resin by raising the temperature of the stencil, then is intended to open to atmospheric pressure, thereby to control with high precision the injection loading the required sealing resin, minimum With the limited amount of sealing resin, the effect of being able to reliably inject and fill the sealing resin into the gap between the mounted and mounted electronic component and the circuit board is obtained.
[0016]
In the invention according to claim 3 of the present invention, the upper surface of the divided stencil has a sealing resin injection pipe port penetrating the side surface of the opening, and a tip of a dispenser is inserted into the injection pipe port, The sealing resin is injected and filled through the injection pipe port, and this provides an effect that the sealing resin can be injected and filled along the immediate upper surface of the circuit board .
[0017]
According to a fourth aspect of the present invention, there is provided a vacuum pressurization chamber having a switching valve and a leak valve for adjusting an internal vacuum pressure and atmosphere, and an electronic component installed in the vacuum pressurization chamber. A circuit board holding base that can be fixed and held to move the mounted and mounted circuit board, a stencil provided on the board holding base and having an opening into which a sealing resin is injected and filled, and the seal A squeegee or dispenser for printing and applying a stop resin on a circuit board, and the stencil is a resin for electronic components incorporating a temperature rising body that is a temperature controllable heating medium or a cooling body that is a cooling medium Since this is a sealing device , the sealing resin can be fluidized and injected and filled with low viscosity, and a high vacuum atmosphere and a pressurized atmosphere can be set in the same chamber. ,vacuum The circuit board injected filled with sealing resin under, is the action and effect that it is possible to reduce the operation and working time for transferring to the pressurizing chamber is obtained.
[0018]
Invention of Claim 5 of this invention is a resin sealing apparatus of the electronic component of Claim 4, Comprising: A stencil is a division | segmentation stencil which has several opening part divided by the crosspiece , It becomes possible to control the sealing resin to a required injection filling amount with high accuracy, and an effect of being able to reliably inject and fill the sealing resin into the gap is obtained.
[0019]
The invention described in claim 6 of the present invention, the opening periphery underside of the stencil, disposed rubber packing made of an elastic body, by raising the substrate holder, by deforming compressing the rubber gasket, the 6. The resin sealing device for an electronic component according to claim 4, wherein the substrate holding table and the circuit board are brought into close contact with each other and pressed, whereby an interface between the stencil and the circuit board in the application of the sealing resin. Can be surely degassed from the upper surface of the stencil when the sealing resin injected and filled into the opening of the stencil is degassed in a vacuum pressure atmosphere. The effect is obtained.
[0027]
DETAILED DESCRIPTION OF THE INVENTION
(Embodiment 1)
Hereinafter, with reference to the drawings, the first aspect of the present invention will be described with reference to the drawings. In addition, about the component apparatus and member which were demonstrated by the prior art, the same symbol is provided and detailed description is abbreviate | omitted.
[0028]
FIG. 1 is a cross-sectional view of a principal part of a resin sealing (printing) apparatus for resin sealing and underfill formation of an electronic component according to Embodiment 1 of the present invention.
[0029]
In FIG. 1, 1 is a circuit board, 2 is an active component, 3 is a passive component, and 4 is a sealing resin. 8 is a substrate holding base made of a hard metal material for mounting and holding the circuit board 1 on the upper surface, 9 is a stencil made of a chemical, mechanical and heat-resistant metal material such as stainless steel, and has a predetermined resin thickness. An opening having a printing thickness of sealing and an area in a range where the sealing resin 4 in the circuit board 1 is injected and filled by printing is provided in the center portion.
[0030]
The sealing resin 4 is supplied and accumulated in advance on one end of the upper surface of the stencil 9. 10 is built in the stencil 9 and can be controlled by a heating and temperature adjusting mechanism (not shown), and a heating element made of a heating medium such as water or oil. 11 is also built in the stencil 9 and is cooled and adjusted in temperature. It is a cooling body made of a cooling medium such as water or oil, which can be freely controlled by a mechanism (not shown).
[0031]
Reference numeral 12 denotes a rubber packing made of an elastic material for sealing installed near the outer periphery of the opening on the lower surface of the stencil 9, and 13 a horizontal sliding movement on the upper surface of the stencil 9, and a movable made of glass epoxy resin or hard rubber material. A squeegee 14 is a vacuum pressurizing chamber that incorporates the above-described components and members and is made of a hard metal material such as steel or stainless steel.
[0032]
15 is a supply door made of a hard resin material such as acrylic resin or epoxy resin, and is installed on the upper portion of the vacuum pressurization chamber 14, and 16 is a rubber material or silicon resin material for sealing the supply door 15 and the vacuum pressurization chamber 14. It is a double packing made of an elastic body.
[0033]
7 is a vacuum pump for evacuating the inside of the vacuum pressurizing chamber 14, 17 is a compressor for pressurizing the inside of the vacuum pressurizing chamber 14 with air as a gaseous medium, 18 is vacuum suction by the vacuum pump 7, and a compressor 15 is a switching valve made of a metal material such as brass for switching the air pressurization of the gas medium by 15 and serving as a switching mechanism.
[0034]
Reference numeral 19 denotes an operation valve, which is a leak valve made of a metal material such as brass for releasing the vacuum pressure atmosphere and the pressure atmosphere inside the vacuum pressure chamber 14 to atmospheric pressure.
[0035]
The operation of the resin sealing of the electronic component configured as described above and the resin sealing (printing) apparatus for forming the underfill will be described with reference to the drawings. FIGS. 2-5 is sectional drawing of the manufacturing process of resin sealing and underfill formation in Embodiment 1 of this invention.
[0036]
Reference numeral 20 denotes a sealed circuit board in which the sealing resin 4 injected and filled on the upper surface of the circuit board 1 is cured by heating by driving the heating element 10 in the stencil 9 and is semi-cured or fully cured. .
[0037]
First, as shown in FIG. 2, the supply door 15 of the vacuum pressurizing chamber 14 is opened, and the circuit board 1 on which the active component 2 and the passive component 3 are mounted is mounted on the substrate holder 8 and is fixed and held. To do.
[0038]
Thereafter, the supply door 15 is closed, and the substrate holder 8 is raised until the rubber packing 12 installed on the lower surface of the stencil 9 is compressed and brought into close contact.
[0039]
Then, the stencil 9 is heated to about 30 ° C. to 50 ° C. by driving the heating element 10, and the sealing resin 4 accumulated in advance on the upper surface of the stencil 9 is fluidized with low viscosity.
[0040]
In order to degas the gap between the active component 2 and the passive component 3 and the circuit board 1 and the sealing resin 4, the operation valve is operated to close the leak valve 19, and the switching valve 18 is operated to operate the vacuum pump. After connecting and releasing to the 7 side, the vacuum pump 7 is operated to set the inside of the vacuum pressurizing chamber 14 to an atmosphere of a high vacuum pressure of 200 Pa or less.
[0041]
Next, as shown in FIG. 3, by adjusting the opening / closing amount by operating the operation valve of the leak valve 19, the inside of the vacuum pressurizing chamber 14 is made an atmosphere of low vacuum pressure in the range of 300 Pa to 500 Pa, and the squeegee 13 is placed on the upper surface of the stencil 9. When passing through the opening portion, it is moved at a low speed, and the sealing resin 4 fluidized at a low viscosity to the opening portion of the stencil 9 is injected and filled by printing with the thickness of the stencil 9.
[0042]
After the sealing resin 4 is injected and filled into a predetermined portion of the circuit board 1 by printing, the sealing resin 4 is left in the atmosphere of the vacuum pressure for a certain period of time, and the air entrained by the rolling of the sealing resin 4 generated when the squeegee 13 is moved is removed. I care.
[0043]
Next, as shown in FIG. 4, after the drive of the vacuum pump 7 is stopped, the leak valve 19 is opened by operating the operation valve, and the inside of the vacuum pressurizing chamber 14 is opened to the atmospheric pressure.
[0044]
After the inside of the vacuum pressurizing chamber 14 is opened to the atmospheric pressure, the leak valve 19 is closed by operating the operation valve, the switching valve 18 is operated and connected to the compressor 17 side to open, and then the compressor 17 is driven. Then, the inside of the vacuum pressurizing chamber 14 is set to a pressurized atmosphere of 0.5 MPa or more, and the sealing resin 4 is infiltrated and filled into the gaps between the active component 2 and the passive component 3 and the circuit board 1 by the differential pressure.
[0045]
After that, as shown in FIG. 5, the stencil 9 is heated to a temperature of 30 ° C. to 50 ° C. to 100 ° C. or more by driving the heating element 10 in the atmosphere of the pressurization in the vacuum pressurizing chamber 14. The sealing resin 4 is semi-cured or fully cured by leaving it for a certain period of time.
[0046]
After semi-curing or main curing, the leak valve 19 is opened by operating the operation valve to open the interior of the vacuum pressurizing chamber 14 to atmospheric pressure.
[0047]
The semi-cured or fully-cured sealed circuit board 20 formed with resin sealing and underfill is removed from the substrate holding base 8, and the supply door 15 is opened and taken out from the vacuum pressurizing chamber 14, and then the stencil 9 is cooled. The body 11 is cooled again to a temperature of 30 ° C. to 50 ° C. by driving the body 11.
[0048]
As described above, in the resin sealing (printing) apparatus for resin sealing and underfill formation of the electronic component in the first embodiment, the atmosphere inside the vacuum pressurizing chamber is changed from the vacuum pressure to the pressurization. Resin sealing and underfill formation at predetermined locations on the circuit board are performed by the generated differential pressure, and the sealing resin is reliably and accurately placed between the high-density mounting electronic components and between the low-profile mounting electronic components and the circuit components. It is possible to inject and fill densely.
[0049]
(Embodiment 2)
Hereinafter, the invention described in the sixth to ninth aspects of the present invention will be described using the second embodiment with reference to the drawings. FIG. 6 is a cross-sectional view of a principal part of a resin sealing device for resin sealing and underfill formation of an electronic component according to Embodiment 2 of the present invention.
[0050]
The main difference between FIG. 6 in the second embodiment and FIG. 1 in the first embodiment is that the dispenser for supplying the sealing resin 4 is disposed inside the vacuum pressurizing chamber 14. And stencil structure.
[0051]
In FIG. 6, 5 is a dispenser in which the sealing resin 4 is enclosed so as to be movable in the horizontal and vertical directions, and the sealing resin 4 is supplied and injected and filled by pressure of air or oil.
[0052]
21 is a divided stencil plate made of a metal material such as stainless steel, and a finished product of a sealed circuit board that is divided into individual pieces at the central portion with a thickness of a predetermined resin-sealing filling (that is, printing in the first embodiment). A plurality of openings divided by bars are provided in the size size. Reference numeral 22 denotes an injection pipe port for the sealing resin 4 penetrating from the upper surface of the divided stencil plate 21 to the opening side surface of the divided stencil plate 21.
[0053]
The operation of the resin sealing of the electronic component configured as described above and the resin sealing device for underfill formation will be described with reference to the drawings. 7 to 11 are sectional views of manufacturing steps for resin sealing and underfill formation according to Embodiment 2 of the present invention.
[0054]
First, as shown in FIG. 7, the supply door 15 of the vacuum pressurizing chamber 14 is opened, and the circuit board 1 on which the active component 2 and the passive component 3 are mounted is mounted on the substrate holder 8 and fixed and held. .
[0055]
Thereafter, the supply door 15 is closed, and the substrate holder 8 is raised until the rubber packing 12 installed on the lower surface of the divided stencil 21 is compressed and brought into close contact. Then, the divided stencil plate 21 is heated to about 30 ° C. to 50 ° C. by driving the temperature raising body 10.
[0056]
In order to degas the gap between the active component 2 and the passive component 3 and the circuit board 1 and the sealing resin 4, the operation valve is operated to close the leak valve 19, and the switching valve 18 is operated to operate the vacuum pump. After connecting and releasing to the 7 side, the vacuum pump 7 is operated to set the inside of the vacuum pressurizing chamber 14 to an atmosphere of a high vacuum pressure of 200 Pa or less.
[0057]
Further, after the dispenser 5 at the upper part of the divided stencil plate 21 is moved to the position immediately above the injection pipe port 22, the tip of the dispenser 5 is inserted into the injection pipe port 22 on the upper surface.
[0058]
Next, as shown in FIG. 8, by operating the dispenser 5, the sealing resin 4 is deaerated in the gaps between the active component 2 and the passive component 3 and the circuit board 1 via the injection pipe port 22. Fill by injection.
[0059]
When the sealing resin 4 passes through the injection tube port 22, the sealing resin 4 becomes low viscosity and fluidizes by heating with the divided stencil plate 21. The filling and filling of the sealing resin 4 by the operation of the dispenser 5 is repeated in the same operation with respect to each of the plurality of openings divided by the crosspieces at the finished product size size divided into pieces.
[0060]
Next, as shown in FIG. 9, by adjusting the opening / closing amount by operating the operation valve of the leak valve 19, the inside of the vacuum pressurizing chamber 14 is made an atmosphere of low vacuum pressure in the range of 300 Pa to 500 Pa, and the active component 2 and the passive component. The sealing resin 4 is infiltrated and filled into the gap between the circuit board 1 and the circuit board 1 by a differential pressure.
[0061]
Next, as shown in FIG. 10, the dispenser 5 is operated again so that the thickness of the resin sealing in the circuit board 1 becomes the set thickness, and the active component 2 and the passive component 3 and the circuit board 1 are placed in the gaps. The sealing resin 4 is injected and filled through the injection pipe port 22 while degassing. It repeats with respect to each of several opening part divided by the crosspiece in the finished product dimension size similarly divided into pieces.
[0062]
Then, after the drive of the vacuum pump 7 is stopped inside the vacuum pressurizing chamber 14, the leak valve 19 is opened to the atmospheric pressure by operating the operation valve. After the inside of the vacuum pressurizing chamber 14 is opened to atmospheric pressure, the leak valve 19 is closed by operating the operation valve, the switching valve 18 is connected to the compressor 17 side and operated, and the inside of the vacuum pressurizing chamber 14 is set to 0. The atmosphere is pressurized to 5 MPa or more, and the sealing resin 4 is infiltrated and filled into the gaps between the active component 2 and the passive component 3 and the circuit board 1 by a differential pressure.
[0063]
After that, as shown in FIG. 11, the inside of the vacuum pressurization chamber 14 is heated to the temperature of 30 ° C. to 50 ° C. to 100 ° C. or more by driving the temperature rising body 10 in the pressurized atmosphere. The sealing resin 4 is semi-cured or fully cured by leaving it for a certain period of time.
[0064]
After semi-curing or main curing, the leak valve 19 is opened by operating the operation valve to open the interior of the vacuum pressurizing chamber 14 to atmospheric pressure.
[0065]
The semi-cured or fully-cured sealed circuit board 20 formed with resin sealing and underfill is removed from the substrate holding base 8 and is taken out from the vacuum pressurizing chamber 14 by opening the supply door 15. It is cooled again to a temperature of 30 ° C. to 50 ° C. by driving the cooling body 11.
[0066]
As described above, the resin sealing device for resin sealing and underfill formation of the electronic component according to the second embodiment includes the electronic component and the circuit board on which the (primary) sealing resin injection filling is mounted. As much as the gap is filled directly around the mounting component, and the next (secondary) sealing resin is injected and filled in an amount that will give a predetermined resin sealing thickness, ensuring accuracy and reliability. In addition, it can be densely sealed with resin.
[0067]
【The invention's effect】
As described above, according to the resin sealing method and apparatus for electronic components of the present invention , the sealing resin is defoamed between the electronic components mounted on the circuit board at a high density and in the gap with the circuit board. after the coating amount is reliably injected filling is controlled with high accuracy, because then opened to the atmospheric pressure, even at high sealing resin with filler content, is reliably and precisely penetrate filled into the void Thus , the mechanical reliability of the circuit board , the reliability of the electrical connection, and the adhesion strength can be improved.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view of a principal part configuration of a resin sealing (printing) apparatus for resin sealing and underfill formation of an electronic component according to a first embodiment of the present invention. 3 is a cross-sectional view of a printing filling process in the manufacturing process. FIG. 4 is a cross-sectional view of a pressing process in the manufacturing process. FIG. 5 is a cross-sectional view of a curing process in the manufacturing process. Cross-sectional view of the principal part of a resin sealing device for resin sealing and underfill formation of electronic parts. FIG. 7 is a cross-sectional view of a vacuum suction process in the manufacturing process. FIG. 8 is a cross-sectional view of a primary injection filling process in the manufacturing process. 9 is a sectional view of a vacuum differential pressure process in the manufacturing process. FIG. 10 is a sectional view of a secondary injection filling process in the manufacturing process. FIG. 11 is a sectional view of a curing process in the manufacturing process. Resin sealing Main portion configuration sectional view of a resin sealing apparatus according to dispensers for fine underfill forming EXPLANATION OF REFERENCE NUMERALS
DESCRIPTION OF SYMBOLS 1 Circuit board 2 Active component 3 Passive component 4 Sealing resin 5 Dispenser 6 Vacuum chamber 7 Vacuum pump 8 Substrate holding base 9 Plating plate 10 Heating body 11 Cooling body 12 Rubber packing 13 Squeegee 14 Vacuum pressurization chamber 15 Supply door 16 Double Packing 17 Compressor 18 Switching valve 19 Leak valve 20 Sealed circuit board 21 Divided hole plate 22 Injection pipe port

Claims (6)

An electronic component for forming an electronic circuit is mounted in a vacuum pressurizing chamber having a switching valve and a leak valve for adjusting the internal vacuum pressure and atmosphere, and a circuit board on which the electronic circuit is mounted is inserted, The sealing resin is deaerated from the atmospheric pressure under vacuum pressure, injected and filled, allowed to stand for a predetermined time, and then the sealing resin is supplied to the circuit board under a pressurized atmosphere in which a gaseous medium is supplied into the vacuum pressure chamber. This is a resin sealing method for electronic parts that is filled with a differential pressure and then released to atmospheric pressure. The filling and filling of the sealing resin is performed by printing and coating with a squeegee and a stencil in a vacuum pressurizing chamber. A resin sealing method for an electronic component, characterized in that the sealing resin is semi-cured or fully cured by raising the temperature of the stencil after coating, and then released to atmospheric pressure . An electronic component for forming an electronic circuit is mounted in a vacuum pressurizing chamber having a switching valve and a leak valve for adjusting the internal vacuum pressure and atmosphere, and a circuit board on which the electronic circuit is mounted is inserted, The sealing resin is deaerated from the atmospheric pressure under vacuum pressure, injected and filled, allowed to stand for a predetermined time, and then the sealing resin is supplied to the circuit board under a pressurized atmosphere in which a gaseous medium is supplied into the vacuum pressure chamber. This is a resin sealing method for electronic components that is filled with differential pressure soaking and then released to atmospheric pressure, and the sealing resin is injected and filled in two or more portions using a movable dispenser and a stencil. At the same time, the stencil is divided into stencil plates having a plurality of openings divided by crosspieces, and an electronic component corresponding to these openings is injected and filled with sealing resin, and the temperature of the divided stencil is raised after this filling. Sealing tree The semi-cured or by the curing, then the resin encapsulation method of the electronic component, characterized in that the opening to the atmospheric pressure. The upper surface of the divided stencil plate has a sealing resin injection pipe port penetrating through the side surface of the opening. The tip of the dispenser is inserted into the injection pipe port, and the sealing resin is injected via the injection pipe port. The resin sealing method of the electronic component according to claim 2 to be filled . A vacuum pressurization chamber having a switching valve and leak valve for adjusting the internal vacuum pressure and atmosphere, and a circuit board mounted and mounted with electronic components installed in the vacuum pressurization chamber A movable substrate holding table, a stencil provided on the substrate holding table and having an opening into which a sealing resin is injected and filled in a central portion, and for printing and applying the sealing resin on a circuit board A squeegee or a dispenser, wherein the stencil is a resin sealing device for an electronic component having a built-in temperature raising body that is a heating medium whose temperature can be freely controlled or a cooling body that is a cooling medium . 5. The resin sealing device for an electronic component according to claim 4, wherein the stencil is a divided stencil having a plurality of openings divided by bars . A rubber packing made of an elastic material is disposed on the lower surface of the outer periphery of the opening of the stencil, and the substrate holding table is raised to deform and compress the rubber packing so that the substrate holding table and the circuit board are in close contact with each other and pressed. resin sealing device for an electronic component according to claim 4 or claim 5 performed.

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