JP3954870B2 - Building using under-floor temperature control device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to an underfloor temperature control device with good energy efficiency.
[0002]
[Prior art]
Conventionally, an underfloor temperature control device for a house 1 as shown in FIG. 5 is known (see Japanese Patent Application Laid-Open No. 06-272894).
[0003]
In this house 1, the air heated in the heat collecting layer 4 of the heat collecting surface 3 installed on the roof 2 is used as a heat source for the water heater 5, and the heat exchanger type ventilation fan 6 and the intake pipe 7 are used. Through the exhaust pipe 9 below the floor 8 and warming the underfloor heat storage section 11 having the concrete layer 11a together with the underfloor heating apparatus 10 having the heat medium pipes 10a, 10a and the like separately installed, It is configured to perform underfloor heating.
[0004]
In addition, what is described in Unexamined-Japanese-Patent No. 60-73226 etc. is known as another of this kind.
[0005]
[Problems to be solved by the invention]
However, in such a conventional apparatus, a heat collecting structure using solar heat is adopted as an energy source for underfloor heating.
[0006]
In such a heat collecting structure, there is a problem that the amount of solar heat is easily influenced by the weather, the heating performance becomes unstable, the sunshine is short, and the solar heat cannot be used when the temperature is low.
[0007]
For this reason, in addition to the heat energy collected on the heat collecting surface 3 of the roof portion 2 in combination with the conventionally known underfloor heating device 10, hot water heated by a hot water boiler or the like is used as the heat medium. It must be circulated through the pipe 10a for heating.
[0008]
Therefore, the structure below the floor 8 is complicated, and in addition to the heat exchanger type ventilation fan 6 and the equipment of the solar heat utilization device such as the intake pipe, the heat medium pipe 10a, the hot water supply boiler, etc. The facility for the floor heating device 10 must also be separately constructed, resulting in a problem that the facility cost increases.
[0009]
The present invention has been made paying attention to such conventional problems, and has an underfloor temperature control device and an underfloor temperature control device that have good thermal efficiency, suppress an increase in equipment cost, and can also reduce running costs. The purpose is to provide a building using
[0010]
[Means for Solving the Problems]
In order to achieve the above object, the invention according to claim 1 is directed to a heat pump device, a hot water storage tank connected to the heat pump device for storing hot water, and a circulation for guiding the hot water in the hot water storage tank to a space under the floor in the building. It features an underfloor temperature control device having a pipe and a circulation pump that sends hot water in the circulation pipe so as to circulate to the hot water storage tank.
[0011]
In the structure according to claim 1 configured as described above, the hot water heated by the heat pump device is stored in the hot water storage tank. Therefore, if necessary, the circulating pump is driven to enter the under floor space in the building. The hot water in the hot water storage tank can be circulated in the circulating pipe laid.
[0012]
For this reason, since the temperature under the floor can be adjusted at any time without being influenced by time, weather, etc., stable heating performance can be exhibited, and thermal efficiency is good.
[0013]
In addition, there is no need to separately provide other temperature control equipment, and if it is also used as a hot water supply device or the like, an increase in equipment cost can be suppressed.
[0014]
Furthermore, the foundation of prior SL building, have heat-insulating material is provided, the basic building insulation is performed in Rutotomoni, the floor was used bed under temperature control apparatus insulation material is not provided building It is characterized by being.
[0015]
This is than ash is configured from the foundation of the building provided with the heat insulating material, the heat does not escape to the outside, between the circulation pipe and the floor top surface, it is not necessary to provide a heat insulating material, Most of the heat is guided to the upper surface of the floor and is dissipated into the room from the upper surface of the floor.
[0016]
For this reason, the thermal efficiency can be further improved.
[0021]
According to a second aspect of the present invention, the heat pump apparatus includes a heat pump outdoor unit that is provided in the heat pump device and exhausts cold air to the atmosphere side by heat exchange with the atmosphere, and cool air exhausted from the heat pump outdoor unit is It features an underfloor temperature control device provided with a duct to be introduced into the underfloor space of the building.
[0022]
That is , the cold air exhausted from the heat pump outdoor unit provided in the heat pump device is introduced into the under-floor space by the duct.
[0023]
Therefore, it is possible to cool the underfloor space of the building without separately providing air conditioning equipment, and to suppress an increase in equipment cost, and it is possible to cool the underfloor using cold air that has been conventionally released to the atmosphere. Since it is possible, energy utilization efficiency is also good.
[0024]
Furthermore, the foundation of prior SL building, have heat-insulating material is provided, the basic building insulation is performed in Rutotomoni, the floor was used underfloor temperature controller which heat insulating material is not provided building It is characterized by.
[0025]
Thus is than ash arrangement, said from basic building insulation provided, along with not transmitted external heat, the floor portion, it is not necessary to provide a heat insulating material, floor temperature substantially equal to the temperature The temperature of the upper surface of the floor can be lowered.
[0026]
For this reason, the thermal efficiency can be further improved.
[0027]
DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiment 1
Next, the underfloor temperature control apparatus of Embodiment 1 of the present invention will be described with reference to the drawings.
[0028]
FIG.1 and FIG.2 shows the house 16 as a building using the underfloor temperature control apparatus 15 of Embodiment 1 of this invention. The same or equivalent parts as those in the conventional example will be described with the same reference numerals.
[0029]
First, in terms of configuration, in the underfloor temperature control device 15 of the first embodiment, a heat pump outdoor unit 17a that constitutes the heat pump device 17, and a hot water storage tank 18 that is connected to the heat pump device 17 and stores warm hot water. A circulation pump 19 is installed outside the house 16.
[0030]
Among these, the circulation pump 19 is connected to a circulation pipe 20 that guides the hot water in the hot water storage tank 18 to an underfloor space 21 in the house 16, and circulates the hot water in the circulation pipe 20 to the hot water storage tank 18. It is set as the structure which sends out.
[0031]
Moreover, in this Embodiment 1, as shown in FIG. 2, the heat insulating materials 23 and 23 are provided in the outer side surfaces 22b and 22c in the rising part 22a of the foundation 22 of the house 16, and the foundation A so-called basic heat insulating structure that performs heat insulation from the outside at 22 is used.
[0032]
And between the said circulation pipe 20 and the upper surface 24a of the floor part 24, it is set as the structure by which the heat insulating material is not provided.
[0033]
Next, the operation of the underfloor temperature control device of the first embodiment will be described.
[0034]
In the underfloor temperature control apparatus according to the first embodiment configured as described above, the hot water heated by the heat pump device 17 is stored in the hot water storage tank 18, so that the circulation pump 19 is driven as necessary. The hot water in the hot water storage tank 18 can be circulated in the circulation pipe 20 laid in the underfloor space 21 in the house 16.
[0035]
The hot and cold water having a constant temperature dissipates heat in the underfloor space 21 to heat the floor 24 of the house 16.
[0036]
For this reason, since the temperature of the underfloor can be adjusted at any time without being influenced by time, weather, etc. as in the prior art, stable heating performance can be exhibited, and thermal efficiency is good.
[0037]
For example, by operating the heat pump outdoor unit 17a using late-night power and heating the underfloor space 21 from night to morning, heating can be performed at a low running cost.
[0038]
Further, there is no need to separately provide other temperature control equipment. If the heat pump device 17 is also used as a hot water supply device or the like, an increase in equipment cost can be suppressed.
[0039]
Further, heat does not escape from the foundations 22 and 22 of the house 16 provided with the heat insulating materials 23 and 23, and a heat insulating material is provided between the circulation pipe 20 and the upper surface 24 a of the floor portion 24. Since there is no need to provide it, most of the heat is guided to the floor upper surface 24a and is dissipated from the floor upper surface 24a into the room of the house 16.
[0040]
For this reason, the thermal efficiency can be further improved.
[0041]
[Modification 1]
FIG. 3 shows a first modification of the underfloor temperature control device according to the first embodiment of the present invention.
[0042]
Note that the same or equivalent parts as those in the first embodiment are denoted by the same reference numerals, and different points will be mainly described.
[0043]
In the first modification, the circulation pipe 20 is embedded in the soil concrete 25 in the underfloor space 21.
[0044]
A heat insulating material 27 is provided between the soil concrete 25 and the ground surface 26.
[0045]
Next, the effect | action of this modification 1 is demonstrated.
[0046]
In the first modification, the heat energy of the circulation pipe 20 is stored in the soil concrete 25 and gradually dissipated, whereby the heating is leveled.
[0047]
For this reason, the thermal efficiency can be further improved.
[0048]
Moreover, since the heat insulating material 27 is provided between the soil concrete 25 and the ground surface 26, the thermal energy escaping from the soil concrete 25 to the ground surface 26 can be reduced. Therefore, the thermal efficiency can be further improved.
[0049]
Other configurations and operational effects are the same as or equivalent to those of the first embodiment, and thus description thereof is omitted.
[0050]
Embodiment 2
FIG. 4 shows an underfloor temperature control apparatus according to Embodiment 2 of the present invention. Note that the same or equivalent parts as those in the first embodiment are denoted by the same reference numerals, and different points will be mainly described.
[0051]
In the second embodiment, a heat insulating material (not shown) is provided at the rising portion of the foundation 22 of the house 116 as a building, and a so-called basic heat insulating structure that performs heat insulation from the outside with the foundation 22 is used.
[0052]
The underfloor temperature control device 30 according to the second embodiment includes a heat pump device 30 a that constitutes the underfloor temperature control device 30 outside the house 116.
[0053]
The heat pump device 30a is provided with a hot water storage tank 31 for storing warm hot water.
[0054]
The heat pump device 30a is connected to a heat pump outdoor unit 32 that exhausts cool air to the atmosphere side through heat exchange with the atmosphere.
[0055]
The heat pump outdoor unit 32 is arranged adjacent to the outside position of the foundation 22 so that an exhaust port 32a for exhausting cold air faces the housing 116 side.
[0056]
The exhaust port 32a is connected to a duct 33 that penetrates the foundation 22 inward and outward and introduces cool air exhausted from the exhaust port 32a into the under-floor space 21 of the building. .
[0057]
Further, the foundation 22 through which the duct 33 penetrates is provided on the foundation 22 on the opposite side of the building, and a duct portion 34 for guiding the cold air introduced into the under-floor space 21 to the outside is provided inside and outside the foundation 22. It is formed so as to penetrate in the direction.
[0058]
Next, the operation of the second embodiment will be described.
[0059]
In the underfloor temperature control device 30 according to the second embodiment, the cold air exhausted from the heat pump outdoor unit 32 provided in the heat pump device 30 a is introduced into the underfloor space 21 of the house 116 by the duct 33.
[0060]
For this reason, it is possible to cool the underfloor space 21 of the house 116 without providing a separate air conditioner, thereby suppressing an increase in equipment cost, and using the cold air that has been conventionally discharged to the atmosphere and discarded. Therefore, energy use efficiency is also good.
[0061]
Further, external heat is not transmitted from the foundation 22 of the house 116 provided with the heat insulating material, and it is not necessary to provide a heat insulating material on the floor portion 24, and the temperature is substantially equal to the temperature of the underfloor space 21. The temperature of the upper surface of the floor portion 24 can be lowered.
[0062]
For this reason, the thermal efficiency can be further improved.
[0063]
Other configurations and operational effects are the same as or equivalent to those of the first embodiment, and thus the description thereof is omitted.
[0064]
As described above, the first and second embodiments and the first modification of the present invention have been described in detail with reference to the drawings. However, the specific configuration is not limited to the first and second embodiments and the first modification. Even if there is a design change or the like within a range not departing from the gist of the invention, it is included in the present invention.
[0065]
For example, in the first or second embodiment, the heat insulating materials 23 and 23 are provided on the outer side surfaces 22b and 22c of the rising portion 22a of the foundation 22 of the house 16, but the invention is not limited thereto. Any one of the inner and outer double-sided portions 22b and 22c may be provided, and the heat insulating material 23 may not be provided on the inner and outer both-side surface portions 22b and 22c.
[0066]
Moreover, in the said Embodiment 2, the duct part 34 which guide | induces the cold air introduce | transduced in the said under-floor space 21 to the foundation 22 on the opposite side of a building with the foundation 22 with which the said duct 33 was penetrated outside. Although it is formed so as to penetrate inward and outward, a fan device may be installed in this duct portion 34.
[0067]
In this case, by driving the fan device, the cool air introduced into the building floor space 21 is more smoothly discharged to the outside, and the cooling performance can be improved.
[0068]
【The invention's effect】
As described above, in the device according to claim 1, since the hot water heated by the heat pump device is stored in the hot water storage tank, the circulating pump is driven as necessary to Hot water in the hot water storage tank can be circulated in a circulation pipe laid in the underfloor space.
[0069]
For this reason, since the temperature under the floor can be adjusted at any time without being influenced by time, weather, etc., stable heating performance can be exhibited, and thermal efficiency is good.
[0070]
In addition, there is no need to separately provide other temperature control equipment, and if it is also used as a hot water supply device or the like, an increase in equipment cost can be suppressed.
[0071]
Furthermore, from the basic building before Symbol provided insulation, the heat does not escape to the outside, between the circulation pipe and the floor top surface, it is not necessary to provide a heat insulating material, most of the heat is the floor It is guided to the upper surface and diverges indoors from the upper surface of the floor.
[0072]
For this reason, the thermal efficiency can be further improved.
[0076]
Then, cool air exhausted from the heat pump outdoor unit provided in front Symbol heat pump apparatus, by the duct is introduced into the building floor space.
[0077]
Therefore, it is possible to cool the underfloor space of the building without separately providing air conditioning equipment, and to suppress an increase in equipment cost, and it is possible to cool the underfloor using cold air that has been conventionally released to the atmosphere. Since it is possible, energy utilization efficiency is also good.
[0078]
Furthermore, from the basic building before Symbol provided insulation, with not transmitted external heat, between the circulation pipe and the floor top surface, it is not necessary to provide a heat insulating material, floor temperature and substantially equal The temperature of the upper surface of the floor can be lowered to the temperature.
[0079]
For this reason, a practically beneficial effect that heat efficiency can be further improved is exhibited.
[Brief description of the drawings]
FIG. 1 is a schematic diagram for explaining the overall configuration of an underfloor temperature control device according to a first embodiment of the present invention.
FIG. 2 is a schematic diagram illustrating the configuration of the underfloor in the underfloor temperature control device of the first embodiment.
FIG. 3 is a schematic diagram for explaining the configuration of the underfloor in the underfloor temperature control device of the first modification of the first embodiment.
FIG. 4 is a schematic diagram illustrating the overall configuration of the underfloor temperature control apparatus according to the second embodiment.
FIG. 5 is a schematic diagram of a building for explaining the overall configuration of a conventional underfloor temperature control device.
[Explanation of symbols]
15,30 Under-floor temperature control device 16,116 House (building)
17 Heat pump devices 17a and 32 Heat pump outdoor unit 18 Hot water storage tank 19 Circulation pump 20 Circulation pipe 21 Underfloor space 23 and 27 Heat insulation material 24 Floor portion 24a Top surface 25 Soil concrete 26 Ground surface

Claims (2)

A heat pump device, a hot water storage tank connected to the heat pump device for storing warm hot water, a circulation pipe for guiding the hot water in the hot water storage tank to the space under the floor of the building without contacting the ground surface , and the hot water in the circulation pipe a building with a floor under temperature control device that having a circulation pump for sending to circulate the hot water storage tank,
The foundation of the building is provided with a heat insulating material, the building is insulated with the foundation, and no heat insulating material is provided between the circulation pipe and the upper surface of the floor portion. And a building. Provided the heat pump apparatus, the heat exchange with the atmosphere, it has a heat pump outdoor unit for exhausting the cooling air to the atmosphere, a cold air exhausted from the heat pump outdoor unit, provided with a duct for introducing a building floor space a building with a floor under temperature control apparatus,
The building is characterized in that a heat insulating material is provided on the foundation of the building, the building is heat-insulated on the foundation, and no heat insulating material is provided on the floor portion.

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