JP3952998B2

JP3952998B2 - Circuit board sealing device and sealing method thereof

Info

Publication number: JP3952998B2
Application number: JP2003179112A
Authority: JP
Inventors: 和宏村上; 成之奥本; 哲也津村
Original assignee: Panasonic Corp; Matsushita Electric Industrial Co Ltd
Current assignee: Panasonic Corp; Panasonic Holdings Corp
Priority date: 2003-06-24
Filing date: 2003-06-24
Publication date: 2007-08-01
Anticipated expiration: 2023-06-24
Also published as: JP2005019503A

Description

【０００１】
【発明の属する技術分野】
本発明は電子部品を実装した回路基板の封止装置及びその封止方法に関するものである。
【０００２】
【従来の技術】
従来の電子部品を搭載した回路基板の封止装置及びその封止方法として、スキージによる印刷封止が知られている。
【０００３】
図１２は、従来のスキージによる印刷封止装置及びその封止方法を説明する封止装置における印刷封止工程の断面図である。
【０００４】
図１２において、回路基板１０１は電子機器に使用される多層積層した樹脂やセラミック等より構成されている。電子部品として能動部品１０２は半田及び金等のＬＧＡ及びＢＧＡを有し回路基板１０１に実装されている。同様に受動部品１０３も半田にて回路基板１０１に実装されている。封止ペースト１０４は絶縁樹脂材料でできている。印刷孔版１０５は中央部に印刷形状に応じた開口部を有し、かつ所定の印刷厚みに設定された金属でできている。
【０００５】
スキージ１０６は印刷孔版１０５の上面を上下昇降し、さらに水平方向に可動する。このスキージ１０６はポリテトラフルオロエチレン等の剛体樹脂でできている。
【０００６】
基板支持台１０７は回路基板１０１を真空吸引等により保持し、金属等の材料で構成している。この基板支持台１０７は上下動作が可能である。
【０００７】
以上の構成によるスキージの印刷封止方法について説明する。
【０００８】
回路基板１０１に実装された能動部品１０２及び受動部品１０３の空隙を封止充填するために、回路基板１０１を基板支持台１０７により吸着保持し印刷孔版１０５に回路基板１０１が当接するまで上昇した後、スキージ１０６を印刷孔版１０５の上面まで下降させ、水平方向にスキージ１０６を移動させて封止ペースト１０４を孔版印刷する。その後に基板支持台１０７を下降し、印刷封止された回路基板１０１を基板支持台１０７より取外した後、恒温槽にて所定温度及び時間にて硬化していた。
【０００９】
この出願に関する先行技術文献情報としては、例えば、特許文献１が知られている。
【００１０】
【特許文献１】
特開平４−３４６２３５号公報
【００１１】
【発明が解決しようとする課題】
しかしながら、前記従来のスキージ１０６による回路基板の印刷封止装置及びその封止方法では、大気中での印刷封止であるために、能動部品１０２及び受動部品１０３と回路基板１０１の空隙に封止ペースト１０４を充填する際、封止ペースト１０４が空気を巻き込んだり、流動状態により充填が均一に行われず充填不足が生じる。さらに硬化時に封止ペースト１０４が一時的に低粘度化するために、本来充填すべき部分から封止ペースト１０４が流れ出す。このため、能動部品１０２や受動部品１０３を確実に封止できないため回路基板１０１の信頼性が劣化し、さらに硬化した封止ペースト１０４の平坦性が確保できず、実装機におけるこの回路基板１０１の実装性が悪くなるという課題を有していた。
【００１２】
本発明は前記課題を解決しようとするものであり、封止ペーストを均一に充填し、電子部品を確実に封止して平坦性を確保することにより、回路基板の信頼性を向上し、かつ実装性を向上することができる電子部品を搭載した回路基板の封止装置及びその封止方法を提供することを目的とするものである。
【００１３】
【課題を解決するための手段】
上記目的を達成するために以下の構成を有するものである。
【００１４】
本発明の請求項１に記載の発明は、支持体に取り付けた開口部を有する印刷基準プレートと、この印刷基準プレートの下部に配置した上下動が可能な基板支持台と、この基板支持台に搭載されて、凹部に電子部品を実装した回路基板を保持し上面に配置した印刷孔版とで前記回路基板を挟持する基板保持プレートと、前記印刷基準プレートの上部に配置されて、この印刷基準プレートの上面に沿って摺動し封止ペーストを前記回路基板上に充填するスキージと、少なくとも回路基板上に封止ペーストを充填する部分を真空とする真空チャンバとからなる構成を有しており、能動部品及び受動部品からなる電子部品と回路基板との空隙に充填された封止ペーストの流失を抑止することで電子部品を確実に封止し平坦性を確保できるとともに、印刷から硬化までの生産性及び作業性に優れるという作用効果を有する。
【００１５】
本発明の請求項２に記載の発明は、前記基板保持プレートは、ガラス、セラミック、またはステンレスや焼入れ処理を施した金属からなる耐熱反り及び平面度に優れた材料で構成した請求項１に記載の回路基板の封止装置であり、回路基板の下面に当接することで封止ペーストの封止精度が向上するという作用効果を有する。
【００１６】
本発明の請求項３に記載の発明は、前記基板保持プレートは、前記回路基板の外形の周囲に、前記印刷孔版と当接する部分に磁石を埋設した構成とした請求項１に記載の回路基板の封止装置であり、印刷孔版の基板保持プレートに対する脱着作業を容易に行うことができるという作用効果を奏する。
【００１７】
本発明の請求項４に記載の発明は、前記印刷孔版は、前記電子部品を実装した面積範囲に対して１ｍｍ以上広げた印刷範囲の開口面積を有する構成とした請求項１に記載の回路基板の封止装置であり、印刷孔版の開口面積を広げることで確実に電子部品を封止し信頼性を確保することができるという作用効果を有する。
【００１８】
本発明の請求項５に記載の発明は、前記印刷孔版は、開口部の外周に５度〜１５度の勾配傾斜を有し、封止ペーストの充填導入性と硬化後の離型性を向上させるシリコン樹脂の処理が施された、所望の厚みを有するステンレスからなる磁性体金属とした請求項１に記載の回路基板の封止装置であり、印刷孔版への封止ペーストの充填導入性を向上させ、かつ硬化後の印刷孔版の離型性を向上させることができるという作用効果を有する。
【００１９】
本発明の請求項６に記載の発明は、前記印刷基準プレートの開口部は、前記印刷孔版の外形と嵌合する寸法を有する請求項１に記載の回路基板の封止装置であり、印刷による封止ペーストの漏れを抑制することができるという作用効果を有する。
【００２０】
本発明の請求項７に記載の発明は、前記スキージは、所望の速度及び圧力で前記印刷孔版上を摺動可能とした請求項１に記載の回路基板の封止装置であり、任意の封止ペースト材料の粘度及びチクソ性に対応して、各実装部品間及び回路基板上面への封止ペーストの充填性を向上することができるという作用効果を有する。
【００２１】
本発明の請求項８に記載の発明は、前記スキージは、前記印刷孔版に対して４５度に配設され、その先端形状が１ｍｍ〜５ｍｍ面取りしたガラスエポキシからなる剛体樹脂とした請求項１に記載の回路基板の封止装置であり、各実装部品間及び回路基板上面への封止ペーストの充填性を向上し、印刷孔版との磨耗を抑止することができるという作用を有する。
【００２２】
本発明の請求項９に記載の発明は、前記基板支持台は、ヒータが内蔵され所望の温度に調整可能とした請求項１に記載の回路基板の封止装置であり、回路基板上面より印刷された封止ペースト粘度を低下させ、流動性を向上させて均一な充填ができるという作用効果を有する。
【００２３】
本発明の請求項１０に記載の発明は、印刷封止後の前記回路基板を、前記基板保持プレートと前記印刷孔版にて支持した状態で加圧保持するための、前記印刷孔版外周を固定保持するガイド板と、前記ガイド板と積層して、このガイド板の孔へ一部が挿入される押え板を設けてなる請求項１に記載の回路基板の封止装置であり、加圧により封止ペーストの充填を高密度化でき、充填による封止ペーストの厚みばらつきを抑制することができるという作用効果を有する。
【００２４】
本発明の請求項１１に記載の発明は、前記ガイド板は、前記印刷孔版と同孔寸法を有する請求項１に記載の回路基板の封止装置であり、封止ペーストの流出を抑制することができるという作用効果を有する。
【００２５】
本発明の請求項１２に記載の発明は、前記ガイド板は、オーバーフローによる前記封止ペーストの余剰量が印刷外周部の上方への排出流路を有する請求項１に記載の回路基板の封止装置であり、封止ペーストの充填を均一化することができるという作用効果を有する。
【００２６】
本発明の請求項１３に記載の発明は、前記押え板は、前記印刷孔版内に挿入可能であり、必要封止厚みの定位置にて加圧保持できるように構成した請求項１に記載の回路基板の封止装置であり、回路基板上面より所望の封止厚みが得られるという作用効果を有する。
【００２７】
本発明の請求項１４に記載の発明は、前記押え板の表面形状は、多数個取り前記回路基板の個々の回路ブロックの行列間に対して、前記回路基板と接触可能な凸形状を有する請求項１に記載の回路基板の封止装置であり、封止基板内の個々の回路ブロックの封止厚みばらつきを抑え、個々の回路ブロックの個片分割を可能にするという作用効果を有する。
【００２８】
本発明の請求項１５に記載の発明は、前記ガイド板及び前記押え板は、硬化後の離型性を向上するシリコン系樹脂による処理が施された金属及びポリテトラフルオロエチレンから構成した請求項１に記載の回路基板の封止装置であり、硬化後の離型性を向上させることができるという作用効果を有する。
【００２９】
本発明の請求項１６に記載の発明は、真空雰囲気にて封止ペーストを脱泡して、電子部品を実装した回路基板が面内において複数個割付された多数個取り回路基板の、前記電子部品と回路基板との空隙を真空状態とすることで、所望の真空雰囲気下にて、前記多数個取り回路基板の少なくとも一枚の前記空隙に、封止ペーストをスキージで一括印刷して充填した後、大気開放を行う回路基板の封止方法であって、印刷後の前記回路基板を、基板保持プレートと印刷孔版とで挟持した状態で、ガイド板を前記印刷孔版へ固定保持した後、押え板を前記ガイド板の孔へ挿入して加圧保持し、余剰な前記封止ペーストをオーバーフローさせて硬化する回路基板の封止方法であり、能動部品及び受動部品からなる電子部品と回路基板との空隙に対して、封止ペーストにボイドを巻込まず良好な流動性が得られ、硬化時に能動及び受動部品と空隙とに充填された封止ペーストの流出を抑止することで、電子部品を確実に封止し平坦性を確保することができるとともに、印刷から硬化までの生産性および作業性に優れるという作用効果を有する。さらに、印刷孔版の形状が異なる複数の回路基板や、多数個取り回路基板へ、封止ペーストの充填封止を同時に行うことが可能であるとともに、加圧により封止ペーストの充填を均一化して厚みばらつきを抑制することができる作用効果も同時に有する。
【００３０】
本発明の請求項１７に記載の発明は、前記押え板にて加圧保持した状態で、真空雰囲気にて所定時間保持した後に大気開放する請求項１６に記載の回路基板の封止方法であり、封止ペーストと押え板間に噛み込むエアーを脱泡させ、押え板の表面形状に封止ペーストを密着させることができるという作用効果を有する。
【００３１】
本発明の請求項１８に記載の発明は、前記押え板にて加圧保持した状態で、エアーなどの気体加圧雰囲気にて加熱保持し硬化する請求項１６に記載の回路基板の封止方法であり、回路基板や電子部品に対して封止ペーストの密着力を向上させることができるという作用効果を有する。
【００３２】
本発明の請求項１９に記載の発明は、前記押え板にて加圧保持した状態で、熱プレスにて所定の時間で加熱、加圧して硬化する請求項１６に記載の回路基板の封止方法であり、封止ペーストの硬化反応に応じて定圧硬化を可能にし、硬化時間を短縮することができるという作用を有する。
【００３６】
【発明の実施の形態】
（実施の形態１）
以下、実施の形態１について図面を用いて説明する。
【００３７】
図１は本発明の実施の形態１における電子部品を搭載した回路基板の封止装置の構成斜視図である。
【００３８】
図１において、封止装置の構造体の一部である支持体２７に取り付けられた開口部３０を有する印刷基準プレート８は鋼材等の金属からできている。この印刷基準プレート８の開口部３０の寸法と印刷孔版５の外形とは嵌合するように構成している。
【００３９】
基板支持台９はヒータ１１が内蔵され所望の温度に調整可能な鋼材等の金属からできている。この基板支持台９はシリンダ１０が駆動することで上下に摺動する。
【００４０】
そして、印刷基準プレート８の開口部３０の寸法と基板保持プレート７の外形寸法とは印刷孔版５と同様に嵌合するように設定している。
【００４１】
印刷孔版５は所望の印刷厚みを有するステンレス等の磁性体金属からできている。この印刷孔版５の開口部２６は回路基板１の外形に対して１ｍｍ以上広い印刷範囲の開口を有しており、開口部２６の断面は５度〜１５度の勾配傾斜を設けている。また、印刷孔版５の表面にはシリコン系樹脂等の処理が施されている。そして、印刷孔版５には基板保持プレート７に形成したピン２１に対応した孔２２（共に図示せず）を形成している。
【００４２】
基板保持プレート７はガラス、セラミック、ステンレス、焼き入れ処理を施した金属等の反り及び平面度に優れた耐熱性の材料からできている。
【００４３】
この基板保持プレート７の中央部には凹部２５を形成している。この凹部２５は回路基板１の外形と嵌合できるように設定し、回路基板１の位置決めを行っている。
【００４４】
さらに、基板保持プレート７の凹部２５を除く印刷孔版５と当接する平面部には磁石２８が配設されている。
【００４５】
前記印刷基準プレート８の上部には前記印刷基準プレート８の上面に沿って摺動し封止ペーストを回路基板上に充填するスキージ６が構成されている。このスキージ６は印刷孔版５に対して４５度に配設され、１ｍｍ〜５ｍｍ面取りされた先端形状を有するガラスエポキシ等の剛体樹脂からできている。
【００４６】
そしてスキージ６は回路基板１の巾より長手方向寸法が大きく、シリンダ１２による駆動で上下に摺動することにより圧力調整を適正に設定することができる。さらにスピードコントロールモータ（図示せず）の回転駆動をボールネジ１３にて伝達し、印刷基準プレート８の上面を適正な速度に調整して水平移動を行う。
【００４７】
真空チャンバ１４は前記の各構成機器を内蔵する金属と樹脂等によりできている。そして少なくとも回路基板１上に充填された封止ペースト部分を真空にする。
【００４８】
以上のように構成された電子部品搭載の回路基板の封止装置を用いた封止方法について図面を参照しながら説明する。
【００４９】
図２は電子部品を搭載した回路基板を充填封止する回路基板保持工程の断面図であり、基板支持台９に回路基板１を印刷孔版５と基板保持プレート７で挟持した状態を示している。
【００５０】
図３は電子部品を搭載した回路基板を充填封止する回路基板保持部材の構成斜視図である。
【００５１】
図３において１は電子機器に使用される樹脂、セラミック等よりなる多層基板を複数個割付した大判の回路基板である。
【００５２】
２は半田及び金等のＬＧＡ及びＢＧＡを有し、回路基板１に搭載し実装された能動部品、そして３は半田にて回路基板１に搭載し実装された受動部品である。
【００５３】
まず、大気雰囲気中で能動部品２及び受動部品３を混載実装した（図示せず）回路基板１を、基板保持プレート７に形成した凹部２５にはめ込むことにより回路基板１の位置を決定する。この回路基板１を搭載した基板保持プレート７に印刷孔版５を搭載する。基板保持プレート７にはピン２１を配置し、このピン２１と印刷孔版５に形成したピン２１に対応した孔２２（図示せず）とをはめ合わす。特にピン２１は印刷孔版５と精度良く位置決めするために３ヶ所に設けている。３ヶ所に設けることにより幾何学的に位置が決まり、回路基板１に封止ペースト４を充填する面積を決定する。
【００５４】
印刷孔版５は磁性材料で形成されており、基板保持プレート７に埋め込んだ磁石プレート２８による磁力で、回路基板１を上下方向に動かないように保持している。
【００５５】
また、印刷孔版５には離形テープ２９（図示せず）を開口部２６の側壁および表裏面の周辺に設けている。離形テープ２９の材質としてはポリテトラフルオロエチレン等封止樹脂と硬化固着しない材料であればよい。さらに、離形テープ２９以外に離形剤を印刷孔版５の表面に塗布してもかまわない。
【００５６】
次に、基板支持台９に回路基板１を前記印刷孔版５と基板保持プレート７で挟持して構成された部材を搭載する。基板支持台９の外形寸法と基板保持プレート７の外形寸法は同寸法に設定している。基板支持台９に形成した位置固定板２３を基板保持プレート７に形成した固定凹部２４にはめ合わすことにより、基板支持台９に基板保持プレート７を固定し位置決めを行う。
【００５７】
次に、図４に示すように基板支持台９はシリンダ１０（図示せず）による駆動で上下方向に摺動し印刷基準プレート８に形成した開口部３０と印刷孔版５を嵌合させ、印刷基準プレート８の開口部３０の上面と基板支持台９に搭載した回路基板１を、前記印刷孔版５と基板保持プレート７で挟持して構成された部材の印刷孔版５の上面との高さ方向の位置合わせを行う。
【００５８】
位置合わせには基板支持台９に設けた高さ固定治具３１が印刷基準プレート８に当接することにより高さ方向の位置を決定している。
【００５９】
なお、機械的に高さ固定治具３１を直接印刷基準プレート８に当て、高さ方向の位置を決定したが、光学的に非接触で高さ方向の位置を決定する方法としても良い。
【００６０】
印刷基準プレート８の開口部３０と基板支持台９とのＸ・Ｙ軸の位置合わせは、あらかじめ印刷基準プレート８を固定する際に、印刷基準プレート８に設けた長孔（図示せず）で調整を行い固定する。
【００６１】
そして、真空チャンバ１４内を１０Ｐａの真空度まで真空ポンプ（図示せず）にて真空引きを行う。
【００６２】
真空チャンバ１４の内部が真空度１０Ｐａに到達してから所定の時間だけ真空保持し、能動部品２及び受動部品３等の電子部品と回路基板１との空隙を真空状態にすると同時に印刷基準プレート８上に予め塗布し蓄えられた封止ペースト４の脱泡を行う。
【００６３】
次に、スキージ６を印刷基準プレート８の上面に接するまで下降させ、その後、所定の押し付け圧力を維持しながら、所定の速度で印刷基準プレート８及び印刷孔版５上を摺動し、スキージ６は印刷基準プレート８の孔部を通過した後に停止する。そして、さらに真空保持を所定の時間行う。これによりスキージ６による能動部品２及び受動部品３と回路基板１との空隙部分に充填した封止ペースト４の脱泡を行う。
【００６４】
次に、図５に示すように真空チャンバ１４に取り付けられたバルブ（図示せず）を開放し、真空チャンバ１４の内部を大気開放することにより、真空と大気の差圧力で能動部品２及び受動部品３と回路基板１との空隙に充填した封止ペースト４に均一な押しつけ力が加わることになり、封止ペースト４の充填密度を均一化することができる。
【００６５】
そして、大気雰囲気中で基板支持台９が下降し、基板保持プレート７と印刷孔版５とで挟持され封止ペースト４を充填封止された回路基板１から構成した部材を基板支持台９より取外す。
【００６６】
最後に、図６に示すように印刷封止された回路基板１は、基板保持プレート７と印刷孔版５に挟持された状態で恒温槽１５内へ投入し、所定の温度及び時間にて硬化させた後、常温まで冷却し基板保持プレート７と印刷孔版５より封止硬化後の回路基板１を取外して、電子部品搭載の回路基板の封止を完成させるものである。
【００６７】
以上のように、本実施の形態１における電子部品を搭載した回路基板１の封止装置及びその封止方法は、回路基板１を基板保持プレート７と印刷孔版５にて挟持し、真空雰囲気にて印刷孔版５上をスキージ６で封止ペースト４を変動させることにより真空印刷を行い、基板保持プレート７と印刷孔版５にて挟持された状態で封止後の前記回路基板１を硬化する部材からなる構成を有しており、能動部品２及び受動部品３と回路基板１との空隙に対して、封止ペースト４がボイドを巻込まず良好な流動性が得られ、能動部品２及び受動部品３に対するストレスを緩和し、同時に硬化時に能動部品２及び受動部品３と空隙に充填された封止ペースト４の流失を抑止し、確実に電子部品を封止することができ、厚みバラツキの低減が可能となり、印刷から硬化までの生産性及び作業性に優れるという効果を奏するものである。
【００６８】
尚、本実施の形態１では真空状態から大気開放する差圧を１回としたが、真空状態から大気開放する差圧を２回以上繰返し行うと、上記実施の形態１の効果に加え、能動部品２及び受動部品３と回路基板１との空隙への封止ペースト４の充填密度の均一化が図れるという効果を奏するものである。
【００６９】
また、本実施の形態１では、能動部品２及び受動部品３が混載し実装された回路基板１の印刷枚数を１枚として説明したが、印刷孔版５及び基板保持プレート７を２組台以上でかつ、印刷基準プレート８に設けられた開口部３０を複数個設けて前記台数と同等にすることにより、上記実施の形態１の効果に加え、回路基板１は２枚以上同時に印刷することも可能になるという更なる効果を奏するものである。
【００７０】
（実施の形態２）
以下、実施の形態２について説明する。
【００７１】
図７は本発明の実施の形態２における電子部品を搭載した回路基板の封止装置の構成斜視図である。
【００７２】
なお、実施の形態１の図１で説明したものと同一のものは同一の符号を付与し、詳細な説明は省略する。本実施の形態２の実施の形態１との相違点は、封止印刷後の加圧を利用した硬化に関する点である。
【００７３】
図７において回路基板１６は封止ペースト４を充填した後の回路基板であり、基板保持プレート７と印刷孔版５にて挟持されている。
【００７４】
ガイド板１７は印刷孔版５と同孔寸法を有し、その内部は開口部３３が形成され、さらにオーバーフローによる封止ペースト４の余剰量を、印刷外周部の上方へ排出するための排出流路１９を有するシリコン系樹脂等の処理が施された金属及びポリテトラフルオロエチレンで構成している。
【００７５】
押え板１８はガイド板１７の印刷孔版内に挿入可能で、かつ必要封止厚みまで定位置にて加圧保持が可能で、さらに表面形状が多数個取り回路基板の個々の回路基板の行列間に対して、回路基板１６と接触可能な凸形状を有する複数個割付けされたシリコン系樹脂等の処理が施された金属及びポリテトラフルオロエチレンで構成している。
【００７６】
以上のように構成された電子部品を搭載した回路基板の封止装置について、以下にその動作を図面を参照しながら説明する。
【００７７】
図８〜図１１は電子部品を搭載した回路基板の封止における各工程図である。
【００７８】
図８に示すように印刷封止された回路基板１６は、基板保持プレート７と印刷孔版５に挟持された状態であり、上記状態における印刷孔版５の上面にガイド板１７をボルト（図示せず）にて固定し保持する。
【００７９】
次に、図９に示すように押え板１８をガイド板１７の孔３３に挿入し、押え板１８の凹面３４を印刷孔版５の上面より０．１ｍｍ〜０．２ｍｍ程高く設定しており、かつ凸面３５が回路基板１６の上面と接触するように設定している。
【００８０】
回路基板１６に充填された封止ペースト４は、押え板１８により圧力が加わると同時に封止ペースト４の充填体積が決まるため、封止に必要な封止ペースト４以外はガイド板１７の印刷外周部の上方への排出流路１９より余剰ペースト２０として流出する。
【００８１】
この状態のまま図１０に示すように再度真空チャンバ１４内へ投入し、真空ポンプ（図示せず）にて真空チャンバ１４内を１０Ｐａの真空度にした後、所定の時間をその真空度に保持する。真空チャンバ１４に取り付けられたバルブ（図示せず）を開放して大気開放し、封止ペースト４と押え板１８間に発生するエアーを脱泡して押え板１８の表面形状に封止ペースト４を密着させる。
【００８２】
最後に、図１１に示すように封止ペースト４を充填した回路基板１６を、基板保持プレート７と印刷孔版５とガイド板１７及び押え板１８にて保持された状態にて恒温槽１５内へ投入し、所定の温度及び時間にて硬化させた後、常温まで冷却する。
【００８３】
その後、押え板１８、ガイド板１７、基板保持プレート７及び印刷孔版５より回路基板１６を取外して電子部品搭載の回路基板の充填封止を行うものである。
【００８４】
以上のように本実施の形態２における電子部品を搭載した回路基板の封止装置及びその封止方法は、充填封止後の回路基板１６を基板保持プレート７と印刷孔版５にて挟持した状態で、ガイド板１７を印刷孔版５へ固定保持し、押え板１８をガイド板１７の孔へ挿入し加圧保持して余剰ペースト２０を流出させ、その後封止ペースト４を硬化するという工程からなる。加圧により封止ペースト４の充填密度を均一化し、かつ印刷による封止ペースト４の厚みバラツキを抑制するという効果を奏するものである。
【００８５】
尚、本実施の形態２では恒温槽１５内での封止ペースト４の硬化について説明したが、エアーや窒素等の気体雰囲気中で加熱し封止ペースト４を硬化することにより、上記実施の形態１の効果に加え回路基板１、能動部品２及び受動部品３に対して封止ペースト４の密着力が向上するという更なる効果を奏するものである。
【００８６】
尚また、本実施の形態２では恒温槽１５内での封止ペースト４の硬化について説明したが、熱プレスにて加圧加熱中に封止ペースト４を硬化してもよい。この場合は上記実施の形態２の効果に加え、封止ペースト４の硬化反応に応じて定圧硬化を可能にし、さらに硬化時間を短縮できるという更なる効果を奏するものである。
【００８７】
【発明の効果】
以上のように本発明の回路基板の封止装置によれば、支持体に取り付けた開口部を有する印刷基準プレートと、この印刷基準プレートの下部に配置した上下動が可能な基板支持台と、この基板支持台に搭載されて、凹部に電子部品を実装した回路基板を保持し上面に配置した印刷孔版とで前記回路基板を挟持する基板保持プレートと、前記印刷基準プレートの上部に配置されて、この印刷基準プレートの上面に沿って摺動し封止ペーストを前記回路基板上に充填するスキージと、少なくとも回路基板上に封止ペーストを充填する部分を真空とする真空チャンバとからなる構成とすることにより、能動部品及び受動部品とからなる電子部品と回路基板との空隙に対して、封止ペーストにボイドが巻込まれない良好な流動性が得られるので、これら能動部品及び受動部品に対するストレスを緩和するとともに、硬化時に能動部品及び受動部品と空隙とに充填された封止ペーストの流出を抑止することができる。その結果、封止ペーストを確実に充填することができるので、信頼性が向上するとともに、封止ペーストの厚みばらつきを低減し、印刷から硬化までの生産性及び作業性に優れるという効果を奏するものである。
【図面の簡単な説明】
【図１】本発明の実施の形態１における電子部品を搭載した回路基板の封止装置の構成斜視図
【図２】同実施の形態１における電子部品を搭載した回路基板を封止する回路基板保持工程の断面図
【図３】同実施の形態１における電子部品を搭載した回路基板を封止する回路基板保持部材の構成斜視図
【図４】同実施の形態１における電子部品を搭載した回路基板を封止する真空印刷工程の断面図
【図５】同実施の形態１における電子部品を搭載した回路基板を封止する大気開放工程の断面図
【図６】同実施の形態１における電子部品を搭載した回路基板を封止する硬化工程の断面図
【図７】本発明の実施の形態２における電子部品を搭載した回路基板の封止装置の構成斜視図
【図８】同実施の形態２における電子部品を搭載した回路基板を加圧封止するガイド板取付工程の断面図
【図９】同実施の形態２における電子部品を搭載した回路基板を加圧封止する押え板の挿入工程の断面図
【図１０】同実施の形態２における電子部品を搭載した回路基板を加圧封止する真空脱泡工程の断面図
【図１１】同実施の形態２における電子部品を搭載した回路基板を加圧封止する恒温槽工程の断面図
【図１２】従来の電子部品を搭載した回路基板の封止装置の印刷封止工程の断面図
【符号の説明】
１回路基板
５印刷孔版
６スキージ
７基板保持プレート
８印刷基準プレート
９基板支持台
１０シリンダ
１１ヒータ
１２シリンダ
１３ボールネジ
１４真空チャンバ
２５凹部
２６，３０開口部
２７支持体
２８磁石[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a circuit board sealing device on which electronic components are mounted and a sealing method therefor.
[0002]
[Prior art]
As a conventional circuit board sealing device on which electronic components are mounted and a sealing method therefor, printing sealing with a squeegee is known.
[0003]
FIG. 12 is a cross-sectional view of a printing sealing process in a sealing device for explaining a conventional printing sealing device using a squeegee and a sealing method thereof.
[0004]
In FIG. 12, a circuit board 101 is composed of multi-layered resin or ceramic used for electronic equipment. The active component 102 as an electronic component has LGA and BGA such as solder and gold and is mounted on the circuit board 101. Similarly, the passive component 103 is also mounted on the circuit board 101 with solder. The sealing paste 104 is made of an insulating resin material. The printing stencil 105 has an opening corresponding to the printing shape at the center and is made of a metal set to a predetermined printing thickness.
[0005]
The squeegee 106 moves up and down on the upper surface of the printing stencil 105 and further moves in the horizontal direction. The squeegee 106 is made of a rigid resin such as polytetrafluoroethylene.
[0006]
The board support 107 holds the circuit board 101 by vacuum suction or the like and is made of a material such as metal. The substrate support 107 can move up and down.
[0007]
A method for printing and sealing a squeegee with the above configuration will be described.
[0008]
In order to seal and fill the gap between the active component 102 and the passive component 103 mounted on the circuit board 101, the circuit board 101 is sucked and held by the board support 107 and moved up until the circuit board 101 comes into contact with the printing stencil 105. Then, the squeegee 106 is lowered to the upper surface of the printing stencil 105, and the squeegee 106 is moved in the horizontal direction so that the sealing paste 104 is stencil printed. Thereafter, the substrate support 107 was lowered, and the printed circuit board 101 was removed from the substrate support 107, and then cured at a predetermined temperature and time in a thermostatic bath.
[0009]
For example, Patent Document 1 is known as prior art document information relating to this application.
[0010]
[Patent Document 1]
JP-A-4-346235
[0011]
[Problems to be solved by the invention]
However, in the circuit board printing and sealing apparatus and the sealing method thereof using the conventional squeegee 106, since the printing sealing is performed in the atmosphere, the active component 102, the passive component 103, and the circuit board 101 are sealed in the gap. When the paste 104 is filled, the sealing paste 104 entrains air, or the filling is not performed uniformly due to the flow state, resulting in insufficient filling. Further, since the sealing paste 104 temporarily lowers in viscosity at the time of curing, the sealing paste 104 flows out from the portion to be originally filled. For this reason, since the active component 102 and the passive component 103 cannot be reliably sealed, the reliability of the circuit board 101 is deteriorated, and the flatness of the cured sealing paste 104 cannot be ensured. There was a problem that the mountability deteriorated.
[0012]
The present invention is intended to solve the above-mentioned problems, and by filling the sealing paste uniformly, sealing the electronic components securely and ensuring flatness, thereby improving the reliability of the circuit board, and It is an object of the present invention to provide a circuit board sealing device on which an electronic component capable of improving mountability and a sealing method therefor are provided.
[0013]
[Means for Solving the Problems]
In order to achieve the above object, the present invention has the following configuration.
[0014]
  According to the first aspect of the present invention, there is provided a printing reference plate having an opening attached to a support, a substrate support that is arranged below the printing reference plate and capable of moving up and down, and the substrate support. MountedAndWith a printed stencil that holds a circuit board with electronic components mounted in the recess and is placed on the top surfaceSaidSubstrate holding plate that holds the circuit boardWhen,Placed on top of the printing reference plateThisSlide along the top surface of the printing reference plateSaidA squeegee for filling a circuit board and a vacuum chamber for vacuuming at least a portion for filling a sealing paste on the circuit boardWhenThe electronic component is reliably sealed and flatness is ensured by suppressing the loss of the sealing paste filled in the gap between the electronic component consisting of active and passive components and the circuit board. In addition, it has the effect of being excellent in productivity and workability from printing to curing.
[0015]
  The invention according to claim 2 of the present invention isSaidBoard holding plate,Glass, ceramic,OrStainless steel or hardened metalConsist of2. The circuit board sealing device according to claim 1, wherein the circuit board sealing device is made of a material having excellent heat warpage and flatness, and has an effect of improving the sealing accuracy of the sealing paste by contacting the lower surface of the circuit board. Have.
[0016]
  The invention according to claim 3 of the present invention isSaidBoard holding plate,Around the outer shape of the circuit board,The circuit board sealing device according to claim 1, wherein a magnet is embedded in a portion in contact with the printing stencil, and the operation effect of being able to easily attach and detach the printing stencil to the board holding plate. Play.
[0017]
  The invention according to claim 4 of the present invention isSaidPrinting stencilThe aboveThe circuit board sealing device according to claim 1, wherein the circuit board sealing device has a configuration in which an opening area of a printing range expanded by 1 mm or more with respect to an area range in which an electronic component is mounted. It has the effect of sealing electronic parts and ensuring reliability.
[0018]
  The invention according to claim 5 of the present invention isSaidPrinting stencil,Having an inclination of 5 to 15 degrees on the outer periphery of the opening,Improves sealing paste filling and mold release properties after curingSilicone resin treatment was applied,Stainless steel with desired thicknessConsist ofThe circuit board sealing device according to claim 1, wherein the device is a magnetic metal, which improves the filling and introducing property of the sealing paste into the printing stencil and improves the release property of the cured printing stencil. Has the effect of being able to.
[0019]
  The invention according to claim 6 of the present invention providesSaidThe opening of the printing reference plateThe aboveThe circuit board sealing device according to claim 1, which has a size that fits with the outer shape of the printing stencil plate, and has an operational effect that leakage of sealing paste due to printing can be suppressed.
[0020]
  The invention according to claim 7 of the present invention providesSaidSqueegeeSlidable on the printing stencil at a desired speed and pressure2. The circuit board sealing device according to claim 1, wherein the filling property of the sealing paste between the mounting components and on the upper surface of the circuit board is improved corresponding to the viscosity and thixotropy of any sealing paste material. It has the effect of being able to.
[0021]
  The invention according to claim 8 of the present invention providesSaidSqueegeeSaidGlass epoxy with 45mm chamfering at 1 to 5mm chamfered at 45 degrees to printing stencilConsist ofThe circuit board sealing device according to claim 1, wherein the circuit board sealing device is made of a rigid resin, and can improve the filling property of the sealing paste between the mounted components and the upper surface of the circuit board, and can suppress wear with the printing stencil. It has the action.
[0022]
  The invention according to claim 9 of the present invention providesSaidSubstrate support stand,The circuit board sealing device according to claim 1, wherein a heater is incorporated and the temperature can be adjusted to a desired temperature, and the viscosity of the sealing paste printed from the upper surface of the circuit board is lowered to improve fluidity and uniform. It has the effect of being able to be filled.
[0023]
  The invention according to claim 10 of the present invention isSaidCircuit boardSaidBoard holding plate andSaidIn order to hold the pressure while supported by the printing stencil,SaidA guide plate for fixing and holding the outer periphery of the printing stencil and the guide plate are laminated.This2. The circuit board sealing device according to claim 1, further comprising a pressing plate that is partially inserted into the hole of the guide plate, wherein the filling of the sealing paste can be densified by pressurization, and the sealing is performed by filling. It has the effect that the thickness variation of the paste can be suppressed.
[0024]
  The invention according to claim 11 of the present invention providesSaidThe guide plateThe aboveThe circuit board sealing device according to claim 1, which has the same hole size as that of the printing stencil plate, and has an effect of being able to suppress the outflow of the sealing paste.
[0025]
  The invention according to claim 12 of the present invention providesSaidThe guide plate,Due to overflowSaid2. The circuit board sealing device according to claim 1, wherein the surplus amount of the sealing paste has a discharge flow path to the upper side of the outer periphery of the printing, and has an effect that the filling of the sealing paste can be made uniform. Have.
[0026]
  The invention according to claim 13 of the present invention providesSaidPresser plate isThe aboveCan be inserted into the printing stencilYes,2. The circuit board sealing device according to claim 1, wherein the circuit board sealing device is configured to be capable of being pressurized and held at a predetermined position of the required sealing thickness, and has an effect that a desired sealing thickness can be obtained from the upper surface of the circuit board.
[0027]
  The invention according to claim 14 of the present invention providesSaidThe surface shape of the presser plate is,ManySaidFor the matrix of individual circuit blocks on the circuit board,Said2. The circuit board sealing device according to claim 1, wherein the circuit board sealing device has a convex shape that can come into contact with the circuit board, and a variation in sealing thickness of the individual circuit blocks in the sealing substrate is suppressed, and the individual circuit blocks are divided into pieces. It has the effect of making possible.
[0028]
  The invention according to claim 15 of the present invention isSaidGuide plate andSaidThe holding plate isImprove releasability after curingSilicon resinbyThe circuit board sealing device according to claim 1, which is composed of a treated metal and polytetrafluoroethylene, and has an effect of improving the releasing property after curing.
[0029]
  According to the sixteenth aspect of the present invention, the sealing paste is defoamed in a vacuum atmosphere.The,A plurality of circuit boards on which a plurality of circuit boards on which electronic components are mounted are arranged in a plane, and the plurality of circuit boards are placed in a vacuum state so that the plurality of circuit boards are placed in a desired vacuum atmosphere. A method of sealing a circuit board in which at least one gap of a circuit board is filled with a paste by collectively printing a sealing paste with a squeegee, and then released to the atmosphere. After the guide plate is fixedly held to the printing stencil while being held between the holding plate and the printing stencil, the presser plate is inserted into the hole of the guide plate and held under pressure to overflow excess sealing paste. HardenA circuit board sealing method for a gap between an electronic component composed of active and passive components and a circuit board.,Sealing pasteInGood fluidity without voids, active and passive components and voids during curingWhenBy suppressing the outflow of the sealing paste filled in,The electronic component can be reliably sealed to ensure flatness, and has the effect of being excellent in productivity and workability from printing to curing.Furthermore, it is possible to simultaneously fill and seal a plurality of circuit boards having different printing stencil shapes or multiple circuit boards, and to uniformly fill the sealing paste by applying pressure. At the same time, there is an effect that can suppress variation in thickness.
[0030]
  The invention according to claim 17 of the present invention providesSaidIn a state where pressure is held by the presser plate,The circuit board sealing method according to claim 16, wherein the circuit board is released to the atmosphere after being held for a predetermined time in a vacuum atmosphere,Air entrained between the sealing paste and the presser plate can be defoamed to allow the sealing paste to adhere to the surface shape of the presser plateIt has the effect of.
[0031]
  The invention according to claim 18 of the present invention providesSaidIn a state where pressure is held by the presser plate,Claims that are cured by heating and holding in a pressurized atmosphere such as air16The circuit board sealing method according to claim 1,The adhesion of the sealing paste to circuit boards and electronic components can be improved.It has the effect of.
[0032]
  The invention according to claim 19 of the present invention providesSaidIn a state where pressure is held by the presser plate,Predetermined time with heat presssoClaims to cure by heating and pressurizing16The circuit board sealing method described in 1) has an effect of enabling constant-pressure curing according to the curing reaction of the sealing paste and shortening the curing time.
[0036]
DETAILED DESCRIPTION OF THE INVENTION
(Embodiment 1)
Hereinafter, Embodiment 1 will be described with reference to the drawings.
[0037]
FIG. 1 is a configuration perspective view of a circuit board sealing device on which electronic components are mounted according to Embodiment 1 of the present invention.
[0038]
In FIG. 1, a printing reference plate 8 having an opening 30 attached to a support 27 that is a part of a structure of a sealing device is made of metal such as steel. The size of the opening 30 of the printing reference plate 8 and the outer shape of the printing stencil 5 are configured to be fitted.
[0039]
The substrate support 9 is made of a metal such as a steel material in which a heater 11 is incorporated and can be adjusted to a desired temperature. The substrate support 9 is slid up and down when the cylinder 10 is driven.
[0040]
The dimensions of the opening 30 of the printing reference plate 8 and the outer dimensions of the substrate holding plate 7 are set so as to be fitted in the same manner as the printing stencil 5.
[0041]
The printing stencil 5 is made of a magnetic metal such as stainless steel having a desired printing thickness. The opening 26 of the printing stencil 5 has an opening having a wide printing range of 1 mm or more with respect to the outer shape of the circuit board 1, and the cross section of the opening 26 is provided with a gradient of 5 to 15 degrees. Further, the surface of the printing stencil 5 is treated with a silicon resin or the like. The printing stencil 5 is provided with holes 22 (both not shown) corresponding to the pins 21 formed on the substrate holding plate 7.
[0042]
The substrate holding plate 7 is made of a heat-resistant material having excellent warpage and flatness such as glass, ceramic, stainless steel, and a metal subjected to quenching treatment.
[0043]
A concave portion 25 is formed in the central portion of the substrate holding plate 7. The recess 25 is set so that it can be fitted to the outer shape of the circuit board 1 to position the circuit board 1.
[0044]
Further, a magnet 28 is disposed on the flat portion of the substrate holding plate 7 that is in contact with the printing stencil 5 except for the concave portion 25.
[0045]
A squeegee 6 that slides along the upper surface of the printing reference plate 8 and fills the circuit board with a sealing paste is formed on the printing reference plate 8. This squeegee 6 is disposed at 45 degrees with respect to the printing stencil 5 and is made of a rigid resin such as glass epoxy having a tip shape chamfered by 1 mm to 5 mm.
[0046]
The squeegee 6 has a longer dimension in the longitudinal direction than the width of the circuit board 1, and the pressure adjustment can be appropriately set by sliding up and down by driving by the cylinder 12. Further, the rotational drive of a speed control motor (not shown) is transmitted by the ball screw 13 to adjust the upper surface of the printing reference plate 8 to an appropriate speed and perform horizontal movement.
[0047]
The vacuum chamber 14 is made of a metal, a resin, or the like that contains the above-described components. Then, at least the sealing paste portion filled on the circuit board 1 is evacuated.
[0048]
A sealing method using the sealing device for a circuit board mounted with an electronic component configured as described above will be described with reference to the drawings.
[0049]
FIG. 2 is a cross-sectional view of a circuit board holding process for filling and sealing a circuit board on which electronic components are mounted, and shows a state in which the circuit board 1 is sandwiched between a printing stencil 5 and a board holding plate 7 on a board support base 9. .
[0050]
FIG. 3 is a configuration perspective view of a circuit board holding member that fills and seals a circuit board on which electronic components are mounted.
[0051]
In FIG. 3, reference numeral 1 denotes a large circuit board in which a plurality of multilayer boards made of resin, ceramic or the like used in electronic equipment are assigned.
[0052]
Reference numeral 2 denotes an active component mounted and mounted on the circuit board 1 with LGA and BGA such as solder and gold, and reference numeral 3 denotes a passive component mounted and mounted on the circuit board 1 with solder.
[0053]
First, the position of the circuit board 1 is determined by fitting the circuit board 1 (not shown) in which the active component 2 and the passive component 3 are mounted in an air atmosphere into the recess 25 formed in the substrate holding plate 7. A printing stencil 5 is mounted on a substrate holding plate 7 on which the circuit board 1 is mounted. Pins 21 are arranged on the substrate holding plate 7, and the pins 21 and holes 22 (not shown) corresponding to the pins 21 formed on the printing stencil plate 5 are fitted together. In particular, the pins 21 are provided at three positions for positioning with the printing stencil 5 with high accuracy. The positions are determined geometrically by providing them at three locations, and the area for filling the circuit board 1 with the sealing paste 4 is determined.
[0054]
The printing stencil 5 is made of a magnetic material, and holds the circuit board 1 so as not to move in the vertical direction by the magnetic force generated by the magnet plate 28 embedded in the board holding plate 7.
[0055]
The printing stencil 5 is provided with a release tape 29 (not shown) around the side wall and front and back surfaces of the opening 26. The release tape 29 may be made of any material that does not cure and adhere to a sealing resin such as polytetrafluoroethylene. Further, a release agent other than the release tape 29 may be applied to the surface of the printing stencil 5.
[0056]
Next, a member configured to sandwich the circuit board 1 between the printing stencil 5 and the substrate holding plate 7 is mounted on the substrate support 9. The external dimensions of the substrate support 9 and the external dimensions of the substrate holding plate 7 are set to the same dimensions. The position fixing plate 23 formed on the substrate support 9 is fitted into the fixing recess 24 formed on the substrate holding plate 7 to fix the substrate holding plate 7 to the substrate support 9 and perform positioning.
[0057]
Next, as shown in FIG. 4, the substrate support 9 is driven by a cylinder 10 (not shown) to slide up and down to fit the opening 30 formed in the printing reference plate 8 and the printing stencil 5 to perform printing. Height direction between the upper surface of the opening 30 of the reference plate 8 and the upper surface of the printing stencil 5 of a member constituted by sandwiching the circuit board 1 mounted on the substrate support 9 with the printing stencil 5 and the substrate holding plate 7 Perform position alignment.
[0058]
For alignment, the height fixing jig 31 provided on the substrate support base 9 abuts on the printing reference plate 8 to determine the position in the height direction.
[0059]
Although the height fixing jig 31 is mechanically applied directly to the printing reference plate 8 and the position in the height direction is determined, a method of determining the position in the height direction optically without contact may be used.
[0060]
The alignment of the X and Y axes between the opening 30 of the printing reference plate 8 and the substrate support base 9 is performed by a long hole (not shown) provided in the printing reference plate 8 when the printing reference plate 8 is fixed in advance. Adjust and fix.
[0061]
Then, the inside of the vacuum chamber 14 is evacuated by a vacuum pump (not shown) to a degree of vacuum of 10 Pa.
[0062]
The inside of the vacuum chamber 14 is kept vacuum for a predetermined time after the degree of vacuum reaches 10 Pa, and the gap between the electronic component such as the active component 2 and the passive component 3 and the circuit board 1 is brought into a vacuum state, and at the same time, the printing reference plate 8 Defoaming of the sealing paste 4 previously applied and stored thereon is performed.
[0063]
Next, the squeegee 6 is lowered until it comes into contact with the upper surface of the printing reference plate 8 and then slides on the printing reference plate 8 and the printing stencil 5 at a predetermined speed while maintaining a predetermined pressing pressure. It stops after passing through the hole of the printing reference plate 8. Further, vacuum holding is performed for a predetermined time. Thus, the sealing paste 4 filled in the gap between the active component 2 and the passive component 3 and the circuit board 1 by the squeegee 6 is defoamed.
[0064]
Next, as shown in FIG. 5, the valve (not shown) attached to the vacuum chamber 14 is opened, and the inside of the vacuum chamber 14 is opened to the atmosphere. A uniform pressing force is applied to the sealing paste 4 filled in the gap between the component 3 and the circuit board 1, and the filling density of the sealing paste 4 can be made uniform.
[0065]
Then, the substrate support 9 is lowered in the air atmosphere, and the member constituted by the circuit board 1 sandwiched between the substrate holding plate 7 and the printing stencil 5 and filled with the sealing paste 4 is removed from the substrate support 9. .
[0066]
Finally, the circuit board 1 printed and sealed as shown in FIG. 6 is put into the thermostat 15 while being sandwiched between the substrate holding plate 7 and the printing stencil 5 and cured at a predetermined temperature and time. Then, it is cooled to room temperature, the circuit board 1 after the sealing and curing is removed from the substrate holding plate 7 and the printing stencil 5, and the sealing of the circuit board mounted with electronic components is completed.
[0067]
As described above, in the sealing device and the sealing method for the circuit board 1 on which the electronic component according to the first embodiment is mounted, the circuit board 1 is sandwiched between the substrate holding plate 7 and the printing stencil plate 5 and is in a vacuum atmosphere. A member that performs vacuum printing on the printing stencil 5 by changing the sealing paste 4 with a squeegee 6 and cures the circuit board 1 after sealing while being sandwiched between the substrate holding plate 7 and the printing stencil 5 In the gap between the active component 2 and the passive component 3 and the circuit board 1, the sealing paste 4 does not entrap the void, and good fluidity can be obtained. The active component 2 and the passive component 3 can be reduced, and at the same time, the active component 2 and the passive component 3 and the sealing paste 4 filled in the gap can be prevented from flowing out during curing, and the electronic component can be reliably sealed, and thickness variation can be reduced. Possible, mark In which an effect that is excellent in productivity and workability to cure from.
[0068]
In the first embodiment, the differential pressure for releasing the atmosphere from the vacuum state is set to once. However, if the differential pressure for releasing the atmosphere from the vacuum state is repeated twice or more, in addition to the effect of the first embodiment, the active pressure is increased. The effect is that the filling density of the sealing paste 4 in the gaps between the component 2 and the passive component 3 and the circuit board 1 can be made uniform.
[0069]
In the first embodiment, the number of printed circuit boards 1 on which the active component 2 and the passive component 3 are mixedly mounted has been described as one. However, the printing stencil plate 5 and the substrate holding plate 7 are composed of two or more sets. In addition to the effect of the first embodiment, by providing a plurality of openings 30 provided in the printing reference plate 8 and making it equal to the number, it is possible to print two or more circuit boards 1 simultaneously. It has the further effect of becoming.
[0070]
(Embodiment 2)
The second embodiment will be described below.
[0071]
FIG. 7 is a configuration perspective view of a circuit board sealing device on which electronic components are mounted according to Embodiment 2 of the present invention.
[0072]
In addition, the same thing as what was demonstrated in FIG. 1 of Embodiment 1 is provided with the same code | symbol, and detailed description is abbreviate | omitted. The difference between the second embodiment and the first embodiment is that it relates to curing using pressure after sealing printing.
[0073]
In FIG. 7, the circuit board 16 is a circuit board after being filled with the sealing paste 4, and is sandwiched between the board holding plate 7 and the printing stencil 5.
[0074]
The guide plate 17 has the same hole size as the printing stencil 5 and has an opening 33 formed therein, and a discharge passage for discharging an excess amount of the sealing paste 4 due to overflow to the upper part of the printing outer peripheral portion. 19 and a polytetrafluoroethylene made of a treated metal such as a silicon-based resin.
[0075]
The presser plate 18 can be inserted into the printing stencil of the guide plate 17 and can be pressed and held at a fixed position up to the required sealing thickness. On the other hand, it is made of a metal and polytetrafluoroethylene which have been subjected to processing such as a plurality of allocated silicon-based resins having a convex shape that can come into contact with the circuit board 16.
[0076]
The operation of the circuit board sealing device on which the electronic component configured as described above is mounted will be described below with reference to the drawings.
[0077]
8 to 11 are process diagrams for sealing a circuit board on which electronic components are mounted.
[0078]
As shown in FIG. 8, the printed circuit board 16 is sandwiched between the substrate holding plate 7 and the printing stencil 5, and a guide plate 17 is bolted to the upper surface of the printing stencil 5 in the above state (not shown). ) To fix and hold.
[0079]
Next, as shown in FIG. 9, the presser plate 18 is inserted into the hole 33 of the guide plate 17, and the concave surface 34 of the presser plate 18 is set to be about 0.1 mm to 0.2 mm higher than the upper surface of the printing stencil 5, Further, the convex surface 35 is set so as to be in contact with the upper surface of the circuit board 16.
[0080]
Since the sealing paste 4 filled in the circuit board 16 is pressurized by the pressing plate 18 and the filling volume of the sealing paste 4 is determined at the same time, the printing outer periphery of the guide plate 17 other than the sealing paste 4 necessary for sealing is used. It flows out as a surplus paste 20 from the discharge channel 19 above the part.
[0081]
In this state, as shown in FIG. 10, the vacuum chamber 14 is again charged, and the vacuum chamber 14 is evacuated to 10 Pa with a vacuum pump (not shown), and then the vacuum is maintained for a predetermined time. To do. A valve (not shown) attached to the vacuum chamber 14 is opened to open the atmosphere, air generated between the sealing paste 4 and the presser plate 18 is defoamed, and the surface of the presser plate 18 is sealed. Adhere.
[0082]
Finally, as shown in FIG. 11, the circuit board 16 filled with the sealing paste 4 is held in the thermostat 15 while being held by the board holding plate 7, the printing stencil 5, the guide plate 17 and the holding plate 18. After being charged and cured at a predetermined temperature and time, it is cooled to room temperature.
[0083]
Thereafter, the circuit board 16 is removed from the pressing plate 18, the guide plate 17, the substrate holding plate 7 and the printing stencil 5, and the circuit board mounted with electronic components is filled and sealed.
[0084]
As described above, in the circuit board sealing device and the sealing method on which the electronic component is mounted in the second embodiment, the circuit board 16 after filling and sealing is held between the board holding plate 7 and the printing stencil 5. Then, the guide plate 17 is fixedly held to the printing stencil plate 5, the presser plate 18 is inserted into the hole of the guide plate 17 and held under pressure to discharge the excess paste 20, and then the sealing paste 4 is cured. . This brings about the effect of making the filling density of the sealing paste 4 uniform by pressurization and suppressing the thickness variation of the sealing paste 4 by printing.
[0085]
In addition, in this Embodiment 2, although hardening of the sealing paste 4 in the thermostat 15 was demonstrated, the said Embodiment is heated by heating in gas atmosphere, such as air and nitrogen, and hardening the sealing paste 4. In addition to the effect 1, the further effect that the adhesion of the sealing paste 4 to the circuit board 1, the active component 2, and the passive component 3 is improved is achieved.
[0086]
In addition, in the second embodiment, the curing of the sealing paste 4 in the thermostatic chamber 15 has been described. However, the sealing paste 4 may be cured during pressure heating with a hot press. In this case, in addition to the effect of the second embodiment, a constant pressure curing can be performed according to the curing reaction of the sealing paste 4 and further the curing time can be shortened.
[0087]
【The invention's effect】
  As described above, according to the circuit board sealing device of the present invention, the printing reference plate having the opening attached to the support, and the substrate support base that can be moved up and down arranged under the printing reference plate, Mounted on this substrate support baseAndWith a printed stencil that holds a circuit board with electronic components mounted in the recess and is placed on the top surfaceSaidSubstrate holding plate that holds the circuit boardWhen,Placed on top of the printing reference plateThisSlide along the top surface of the printing reference plateSaidA squeegee for filling a circuit board and a vacuum chamber for vacuuming at least a portion for filling a sealing paste on the circuit boardWhenActive components and passive componentsWhenSealing paste against the gap between the electronic component and circuit boardInvoidButEntrainmentThisNo good fluidity is obtainedBecause,theseRelieve stress on active and passive componentsAs well asPrevents outflow of sealing paste filled in active and passive components and voids during curingbe able to. as a result,Sealing pasteCan be reliably filled, improving the reliability and reducing the thickness variation of the sealing paste,This has the effect of being excellent in productivity and workability from printing to curing.
[Brief description of the drawings]
FIG. 1 is a configuration perspective view of a circuit board sealing device on which an electronic component is mounted according to a first embodiment of the present invention.
FIG. 2 is a cross-sectional view of a circuit board holding process for sealing a circuit board on which an electronic component is mounted according to the first embodiment.
3 is a configuration perspective view of a circuit board holding member for sealing a circuit board on which an electronic component is mounted according to the first embodiment. FIG.
4 is a cross-sectional view of a vacuum printing process for sealing a circuit board on which an electronic component is mounted according to Embodiment 1. FIG.
FIG. 5 is a cross-sectional view of the air release process for sealing the circuit board on which the electronic component is mounted in the first embodiment.
6 is a cross-sectional view of a curing process for sealing the circuit board on which the electronic component is mounted according to Embodiment 1. FIG.
7 is a structural perspective view of a circuit board sealing device on which an electronic component is mounted according to a second embodiment of the present invention. FIG.
FIG. 8 is a cross-sectional view of a guide plate attachment process for pressure-sealing a circuit board on which electronic components are mounted according to the second embodiment.
FIG. 9 is a cross-sectional view of a pressing plate insertion process for pressure-sealing a circuit board on which an electronic component is mounted according to the second embodiment;
10 is a cross-sectional view of a vacuum defoaming step for pressure-sealing a circuit board on which an electronic component is mounted in the second embodiment. FIG.
11 is a cross-sectional view of a thermostatic chamber process for pressure-sealing a circuit board on which an electronic component is mounted according to the second embodiment. FIG.
FIG. 12 is a cross-sectional view of a printing sealing process of a circuit board sealing device on which a conventional electronic component is mounted.
[Explanation of symbols]
1 Circuit board
5 printing stencil
6 Squeegee
7 Substrate holding plate
8 Print reference plate
9 Substrate support
10 cylinders
11 Heater
12 cylinders
13 Ball screw
14 Vacuum chamber
25 recess
26, 30 opening
27 Support
28 Magnet

Claims

And printing a reference plate having an opening attached to the support, and the substrate support capable of vertical movement arranged in the lower part of the reference printing plate, are mounted on the substrate support, the circuit mounting electronic components on the recess a substrate holding plate to sandwich the circuit board between the printed stencil disposed on the upper surface to hold the substrate, is disposed over the reference printing plate, a sliding and sealing paste along the upper surface of the printed reference plate It said circuit and a squeegee to fill on a substrate, at least a sealing device of a circuit board comprising a vacuum chamber to vacuum the portion of filling the sealing paste on the circuit board.

The substrate holding plate, glass, ceramic sealing apparatus for circuit board according or claim 1 in which heat warpage and is constituted by a material having excellent flatness made of metal subjected to stainless steel or quenching treatment.

The substrate holding plate, around the outer shape of the circuit board, the printed stencil a sealing device of the circuit substrate according to claim 1 where the structure is embedded a magnet abutting portion.

The printing stencil is sealing device of the circuit substrate according to claim 1 which has a structure having an open area of the print range spread over 1mm relative area coverage that implements the electronic component.

The printing stencil has a slope inclination of 5 degrees to 15 degrees to the outer periphery of the opening, the process of the silicone resin to improve the releasability of the cured and filling introduction of the sealing paste has been applied, the desired sealing device of the circuit substrate according to claim 1 in which the magnetic metal consisting of stainless steel having a thickness.

The opening of the printed reference plate, sealing device of the circuit substrate according to claim 1 having dimensions outer mating of the printing stencil.

The circuit board sealing device according to claim 1, wherein the squeegee is slidable on the printing stencil at a desired speed and pressure .

The squeegee, the disposed 45 degrees to the printing stencil, the sealing device of the circuit substrate according to claim 1 in which the tip shape is a rigid body resin made of glass epoxy that 1mm~5mm chamfered.

The circuit board sealing device according to claim 1, wherein the substrate support base includes a heater and can be adjusted to a desired temperature.

Said circuit board after printing encapsulation, for dwell while supporting at the substrate holding plate and the printing stencil, and a guide plate for fixing and holding said printing stencil periphery, laminated with said guide plate 2. The circuit board sealing device according to claim 1, further comprising a pressing plate partially inserted into the hole of the guide plate.

The circuit board sealing device according to claim 1, wherein the guide plate has the same hole size as the printing stencil.

The guide plate is sealed device of the circuit substrate according to claim 1, the excess amount of the sealing paste by overflow has a discharge flow path to the upper printing the outer peripheral portion.

The pressing plate, the printing in the stencil can be inserted, sealing devices of the circuit board according to claim 1 configured to allow pressurized held in place on the required sealing thickness.

The surface shape of the pressing plate, to the inter-matrix of the individual circuit blocks of the multi-piece the circuit board, sealing devices of the circuit board according to claim 1 having a possible convex contact with the circuit board.

Wherein the guide plate and the pressing plate, sealing device of the circuit substrate according to claim 1, treatment with silicone resin to improve the releasability of the cured were made of metal and polytetrafluoroethylene decorated.

The sealing paste is degassed in a vacuum atmosphere, and the gap between the electronic component and the circuit board of the multi- chip circuit board in which a plurality of circuit boards on which electronic components are mounted is allocated in a plane is set in a vacuum state. Thus, in a desired vacuum atmosphere, at least one of the multi-cavity circuit boards is filled with a paste paste that is collectively printed with a squeegee and then released to the atmosphere. a is, the circuit board after printing, while sandwiched between the substrate holding plate and the printing stencil, after fixing holding the guide plate to the printing stencil, by inserting the holding plate to the guide plate hole A method of sealing a circuit board, wherein the circuit board is cured by pressurization and overflowing excess sealing paste .

Wherein while holding pressure at the pressing plate, the sealing method of a circuit board according to claim 16 which is opened to the atmosphere after a predetermined time held in a vacuum atmosphere.

Wherein while holding pressure at the pressing plate, the sealing method of a circuit board according to claim 16 which is cured by heating held by gas pressurized atmosphere such as air.

Wherein while holding pressure at the pressing plate, heating at a predetermined time by hot pressing, encapsulating method of the circuit board according to claim 16 which is cured under pressure.