JP3951418B2 - Ｔａｂ用接着剤付きテープおよび半導体集積回路接続用基板ならびに半導体装置 - Google Patents

Ｔａｂ用接着剤付きテープおよび半導体集積回路接続用基板ならびに半導体装置 Download PDF

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Publication number
JP3951418B2
JP3951418B2 JP05987798A JP5987798A JP3951418B2 JP 3951418 B2 JP3951418 B2 JP 3951418B2 JP 05987798 A JP05987798 A JP 05987798A JP 5987798 A JP5987798 A JP 5987798A JP 3951418 B2 JP3951418 B2 JP 3951418B2
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JP
Japan
Prior art keywords
adhesive
tape
tab
semiconductor device
integrated circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP05987798A
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English (en)
Japanese (ja)
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JPH11260865A5 (https=
JPH11260865A (ja
Inventor
幸綱 小西
幹弘 小倉
将次 木越
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toray Industries Inc
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Toray Industries Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by Toray Industries Inc filed Critical Toray Industries Inc
Priority to JP05987798A priority Critical patent/JP3951418B2/ja
Publication of JPH11260865A publication Critical patent/JPH11260865A/ja
Publication of JPH11260865A5 publication Critical patent/JPH11260865A5/ja
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/701—Tape-automated bond [TAB] connectors

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  • Wire Bonding (AREA)
  • Adhesive Tapes (AREA)
  • Adhesives Or Adhesive Processes (AREA)
JP05987798A 1998-03-11 1998-03-11 Ｔａｂ用接着剤付きテープおよび半導体集積回路接続用基板ならびに半導体装置 Expired - Fee Related JP3951418B2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP05987798A JP3951418B2 (ja) 1998-03-11 1998-03-11 Ｔａｂ用接着剤付きテープおよび半導体集積回路接続用基板ならびに半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP05987798A JP3951418B2 (ja) 1998-03-11 1998-03-11 Ｔａｂ用接着剤付きテープおよび半導体集積回路接続用基板ならびに半導体装置

Publications (3)

Publication Number Publication Date
JPH11260865A JPH11260865A (ja) 1999-09-24
JPH11260865A5 JPH11260865A5 (https=) 2005-09-02
JP3951418B2 true JP3951418B2 (ja) 2007-08-01

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ID=13125831

Family Applications (1)

Application Number Title Priority Date Filing Date
JP05987798A Expired - Fee Related JP3951418B2 (ja) 1998-03-11 1998-03-11 Ｔａｂ用接着剤付きテープおよび半導体集積回路接続用基板ならびに半導体装置

Country Status (1)

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JP (1) JP3951418B2 (https=)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003327669A (ja) 2002-05-13 2003-11-19 Hitachi Chem Co Ltd エポキシ樹脂組成物及び接着剤
KR100860098B1 (ko) 2008-02-29 2008-09-26 주식회사 이녹스 반도체 패키지용 접착 필름
JP5934171B2 (ja) 2013-11-29 2016-06-15 インターナショナル・ビジネス・マシーンズ・コーポレーションＩｎｔｅｒｎａｔｉｏｎａｌ Ｂｕｓｉｎｅｓｓ Ｍａｃｈｉｎｅｓ Ｃｏｒｐｏｒａｔｉｏｎ インターボーザの厚さ決定方法、コンピュータプログラム、インターボーザおよびチップ実装構造体
CN113801605B (zh) * 2021-11-10 2022-03-25 宁波申山新材料科技有限公司 一种低表面能压敏胶粘带及其加工方法

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Publication number Publication date
JPH11260865A (ja) 1999-09-24

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