JP3939440B2 - Substrate processing equipment - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a substrate processing apparatus for cleaning a surface of the substrate to be processed while rotating the plurality of rotating bodies on the outer periphery of the substrate to be processed, and a cleaning unit to the substrate processing apparatus. The present invention relates to a substrate processing apparatus such as a CMP apparatus using the processing apparatus.
[0002]
[Prior art]
A semiconductor wafer polished by a CMP (Chemical / Mechanical / Polishing) apparatus usually has a large amount of slurry, polishing chips or the like on both sides. In order to remove this, as shown in FIG. 7, the cleaning brushes 101 and 102 are in contact with each other over both surfaces of the semiconductor wafer 103 while rotating, and both surfaces of the semiconductor wafer 103 are simultaneously cleaned. At this time, as shown in FIG. 8, the semiconductor wafer 103 is clamped and rotated by a plurality of rotating bodies 104 arranged around the semiconductor wafer 103. The rotating body 104 is configured to rotate by applying a rotational force from a motor (not shown) via a belt.
[0003]
[Problems to be solved by the invention]
The belt for transmitting the rotational force of the motor to the rotating body 104 is normally replaced at a constant cycle. However, the actual situation is that the user determines the replacement work time according to the use state of the apparatus. Therefore, it is necessary to detect the occurrence of belt breakage due to variations in the life of the belt and to control this so as not to interfere with the processing of the series of semiconductor wafers 103.
[0004]
On the other hand, it is easy to mechanically detect the belt breakage, but there is a problem that it is inferior in terms of dust generation and reliability. If the cost is neglected, several types of non-contact methods are conceivable. However, it is basically an auxiliary function, so it is desirable to obtain it at a minimum cost because it is easily available.
[0005]
The present invention has been made in view of the above points, and can detect belt breakage reliably at low cost, and even if belt breakage is detected during processing, the apparatus is stopped after a series of predetermined processes are completed. An object of the present invention is to provide a substrate processing apparatus capable of performing the above.
[0006]
[Means for Solving the Problems]
In order to solve the above problems, the invention according to claim 1 is a state in which a plurality of rotating bodies are brought into contact with the outer periphery of the substrate to be processed, and the substrate to be processed is rotated while rotating the plurality of rotating bodies. In the substrate processing apparatus for processing the surface of the substrate to be processed, the substrate processing apparatus includes a drive shaft that supports the rotating body and a rotation driving mechanism that rotationally drives the driving shaft, and the rotation driving mechanism includes a plurality of rotating bodies. One of them has its drive shaft directly connected to the rotation shaft of the motor and the rotational force of the motor is transmitted, and the other rotary body transmits the rotation force of the drive shaft whose drive shaft is directly connected to the rotation shaft of the motor by the belt. The belt breakage detecting means for detecting the belt breakage is provided.
[0007]
According to a second aspect of the present invention, in the substrate processing apparatus according to the first aspect, when the belt breakage detecting means detects a belt breakage, the substrate processing apparatus is operated after at least a series of processes currently being performed. Control means for stopping is provided.
[0008]
According to a third aspect of the present invention, in the substrate processing apparatus according to the first or second aspect, the plurality of rotating bodies are composed of a plurality of rotating bodies divided into left and right, and the plurality of rotating bodies are divided into the left and right. configured to be able to sandwich the substrate to be processed number of the rotating body, the dog provided on the idler pulley to rotate with the belt of the rotation drive mechanism and traveling give a predetermined tension, the photo so as to straddle the dog A microsensor is provided, and belt breakage is detected from the timing of the light shielding pulse generated by the rotation of the dog.
[0010]
According to a fourth aspect of the present invention, the substrate to be processed mounted on the lower end surface of the top ring is brought into contact with the polishing surface of the upper surface of the turntable, and the substrate to be processed is rotated by the rotational movement of the turntable and the top ring. A polishing unit for polishing the substrate to be processed, a cleaning unit for cleaning the substrate to be processed after polishing, and a drying unit for drying the substrate to be processed after cleaning. At least the substrate to be processed is polished, washed, and dried. In the substrate processing apparatus that sequentially processes the substrate to be processed, the cleaning unit has a plurality of rotating bodies that contact the outer periphery of the substrate to be processed, and the substrate to be processed is rotated by rotating the rotating body with a rotation driving mechanism. The rotational drive mechanism includes a drive shaft that supports the rotating body and a rotational drive mechanism that rotationally drives the drive shaft, and one of the plurality of rotating bodies is driven by the drive shaft. The shaft is the rotating shaft of the motor As a result, the rotational force of the motor is transmitted, and the other rotating body is configured such that the rotational force of the drive shaft, whose drive shaft is directly connected to the rotational shaft of the motor, is transmitted by the belt, and detects belt breakage. If the belt breakage detecting means detects a belt breakage , all the substrates to be processed after the polishing unit continue each process until the final drying process is completed, and after the drying process is completed Control means for interrupting each process is provided.
[0011]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described below with reference to the drawings. In this embodiment, a substrate cleaning apparatus will be described as an example of a substrate processing apparatus. FIG. 1 is a perspective view showing a configuration of a substrate cleaning apparatus according to the present invention. In FIG. 1, a semiconductor wafer 1 is carried between the left and right stages 2, 2 from the back side of the paper surface by a robot hand (not shown) that moves in the direction indicated by arrow B. A plurality of (three in the figure) rotating bodies 3-1, 3-2 and 3-3 are arranged on the left and right of each stage 2 and 2. When the positioning of the semiconductor wafer 1 is completed with the robot hand, the left and right stages 2 and 2 are moved in directions approaching each other as indicated by arrows A and A, and the semiconductor wafer 1 is clamped.
[0012]
Independent timing belts 5-1 and 5-5 are provided for the drive shafts 4-2 and 4-3 of the rotating bodies 3-2 and 3-3 of the left and right stages and the drive shaft 4-1 of the central rotating body 3-1. 2 is suspended. By starting the motor 6 connected to the drive shaft 4-1 of the central rotating body 3-1, when the rotating body 3-1 rotates in the direction of arrow C, the rotating bodies 3-2 and 3-3 are interlocked therewith. Also rotates in the direction of arrow C. Thereby, a rotational force is obtained and a rotational force is also applied to the semiconductor wafer 1.
[0013]
FIG. 2 is a view showing the semiconductor wafer 1 and the upper and lower cleaning brushes 7 and 8. In FIG. 2, while the upper and lower cleaning brushes 7 and 8 rotate, they simultaneously contact the semiconductor wafer and start cleaning. At this time, the cleaning liquid is supplied from the upper and lower cleaning nozzles 9 and 10.
[0014]
FIG. 3 is a plan view showing a rotation drive mechanism for rotating the rotating bodies 3-1 to 3-3 of the left and right stages 2 and 2. In FIG. 3, 12-1 is a timing pulley fixed to the drive shaft 4-1 of the rotating body 3-1, 12-2 is a timing pulley fixed to the driving shaft 4-2 of the rotating body 3-2, 12- Reference numeral 3 denotes a timing pulley fixed to the drive shaft 4-3 of the rotating body 3-3.
[0015]
Reference numerals 13-1 and 13-2 denote idler pulleys rotatably supported on shafts 11-1 and 11-2, respectively, as shown in FIG. One timing belt 5-1 is suspended on the timing pulleys 12-1, 12-2 and the idler pulley 13-1, and one timing belt 5-1 and 12-3 and the idler pulley 13-2 are provided with one timing. The belt 5-2 is suspended.
[0016]
The timing belts 5-1 and 5-2 have a predetermined size by moving the idler pulleys 13-1 and 13-2 in the directions indicated by arrows D by tension adjusting means (for example, tension adjusting bolts) (not shown). Tension can be applied.
[0017]
In the rotary drive mechanism having the above configuration, when the timing pulley 12-1 rotates by rotating the motor 6, the timing belts 5-1, 5-2 and the timing pulleys 12-2, 12-3 rotate in conjunction with the rotation. Then, the rotating bodies 3-1 to 3-3 rotate. Therefore, for example, even if the timing belt 5-1 is cut and no rotational force is transmitted to the timing pulley 12-2 and the rotating body 3-2, the timing pulley 12-3 is rotated by the rotation of the timing belt 5-2, and the rotating body 3 is rotated. -1 and the rotating body 3-3 transmit the rotational force of the motor 6.
[0018]
Since the diameters of the timing pulleys 12-1 and 12-2 and the diameters of the rotating bodies 3-1 to 3-3 are equal to each other, the rotating body 3-1 is applied when a rotational force is applied. ˜3-3 can be rotated at the same number of rotations.
[0019]
As shown in FIG. 4, the idler pulley 13-1 is rotatably supported by a fixed shaft 11-1 via a bearing 14. Further, a dog 15 is attached to the idler pulley 13-1, and rotates in conjunction with the rotation of the idler pulley 13-1. A photomicrosensor 16 is attached to the upper portion of the shaft 11-1 so as to straddle the dog 15 in the vicinity of the idler pulley 13-1.
[0020]
The rotation of the idler pulley 13-1 shields the light whenever the dog 15 passes between the photomicrosensors 16, and a pulse signal is emitted from the photomicrosensors 16. In addition, although illustration is abbreviate | omitted, the dog pulley 13-2 is similarly provided with a dog and is provided with a photomicrosensor for detecting the passage of the dog.
[0021]
For example, when the timing belt 5-1 is cut, the idler pulley 13-1 is stopped. As a result, the dog 15 does not pass between the photomicrosensors 16 and no pulse signal is emitted. Therefore, it is possible to detect that the timing belt 5-1 has been cut by not generating a pulse signal.
[0022]
FIG. 5 is a diagram showing a timing chart of belt outage determination. 5A is a sampling period of detection pulses, FIG. 5B is a counter setting period, FIG. 5C is a detection pulse (output pulse of the photomicrosensor 16), and FIG. (ON is normal, OFF is belt cut), FIG. 5 (e) is a counter reset signal. When a detection pulse is input during the sampling period T, the counter is set and the counter is turned ON. When the counter is turned on, the belt out judgment output is turned on, and it is judged that the belt is normal.
[0023]
At the end of the sampling period T, the counter is reset, but the belt out determination output is held ON for the step after data is determined. If the detection pulse disappears due to belt breakage or the like (when the photomicrosensor 16 is not shielded from light or continues to be shielded from light), the belt breakage determination output is turned off at the end of the sampling period T, and it is determined that the belt is broken.
[0024]
However, even if there is one or more belt breaks, the semiconductor wafer 1 can continue to rotate at least by the rotation of the rotating body 3-1 directly connected to the motor 6, and contact the outer periphery of the semiconductor wafer 1. Since the rotating bodies 3-2 and 3-3 are rotated by the frictional force generated when the semiconductor wafer 1 is rotated, it is not necessary to immediately interrupt the processing.
[0025]
FIG. 6 is a diagram showing an overall planar configuration of a CMP apparatus using the substrate cleaning apparatus having the above configuration. The CMP apparatus includes a polishing unit 20 that polishes a semiconductor wafer and a cleaning unit 30 that cleans the semiconductor wafer polished by the polishing unit 20.
[0026]
The polishing unit 20 has a turntable 21 in the center, a top ring unit 23 with a top ring 22 attached to both sides thereof, a dressing unit 26 with a dressing tool 24, and a workpiece delivery device 27. It is configured.
[0027]
The cleaning unit 30 has two workpiece transfer robots 31 and 32 movable in the direction of arrow E in the center thereof, and primary and secondary cleaning machines 33 and 34 and a spin dryer 35 are arranged in parallel on one side thereof. And two work reversing machines 36 and 37 are arranged in parallel on the other side.
[0028]
In the CMP apparatus configured as described above, when the cassette 41 containing the semiconductor wafers before polishing is set at the position shown in FIG. 6, the workpiece transfer robot 32 takes out the semiconductor wafers one by one from the cassette 41 and reverses the workpiece. Deliver to machine 37. The semiconductor wafer is reversed by a work reversing machine 37. Then, the semiconductor wafer is placed on the work delivery device 27 by the work transfer robot 32 from the reversing machine 37.
[0029]
The semiconductor wafer on the workpiece delivery device 27 is held (mounted) on the lower surface of the top ring unit 23 and the top ring 22 that rotate as indicated by the one-dot chain line arrow F, and is moved onto the turn table 21 and rotated. 21 is polished on the polishing surface 28. At this time, the abrasive liquid is supplied onto the polishing surface 28 of the turntable 21 from the abrasive liquid supply nozzle (not shown).
[0030]
The polished semiconductor wafer is returned to the workpiece transfer device 27 again, transferred to the workpiece reverser 36 by the workpiece transfer robot 31, and inverted by the workpiece reverser 36, and then the primary and secondary cleaning machines 33, 34. Then, the substrate is washed with a cleaning liquid such as pure water, then spin-dried by a spin dryer 35, and returned to the cassette 41 by a work transfer robot 32.
[0031]
A substrate cleaning apparatus having the configuration shown in FIGS. 1 to 3 is used for the primary and secondary cleaning machines 33 and 34 of the CMP apparatus having the above configuration. As described above, the semiconductor wafer after being polished by the polishing unit 20 has slurry, polishing scraps, and the like attached to both sides of the semiconductor wafer. In order to remove this slurry, polishing debris, etc., the entire surface of the semiconductor wafer is simultaneously cleaned, and subsequently returned to the same position of the original cassette 41 through the drying process of the spin dryer 35.
[0032]
What should be noted here is that if the semiconductor wafer is left as it is after polishing, slurry and polishing chips adhere to the wafer surface, and it becomes difficult to remove, and the yield is extremely deteriorated.
[0033]
Therefore, even when it is determined that the belt has run out, the polishing process, the cleaning process, and the drying process in the polishing unit 20 and the cleaning unit 30 are not immediately stopped, and at least the semiconductor wafers in the polishing unit 20 and the subsequent semiconductor wafers are processed as they are. When the semiconductor wafer in the polishing unit 20 is polished, cleaned by the primary and secondary cleaning machines 33 and 34, spin-dried by the spin dryer 35, and returned to the cassette 41 by the work transfer robot 31 It is necessary to interrupt all processing.
[0034]
Therefore, the control device for controlling the CMP apparatus does not stop the CMP apparatus immediately even when it is determined that the primary and secondary cleaning machines 33 and 34 are out of belt, and performs processing when the belt is determined to be out. The apparatus is configured to stop operating after performing a series of processes of the substrate to be processed, that is, a polishing process, a cleaning process, and a drying process.
[0035]
In the above-described embodiment, the substrate processing apparatus has been described with respect to the substrate cleaning apparatus for cleaning the semiconductor wafer 1 and the CMP apparatus using the substrate processing apparatus as the cleaning unit. However, the present invention is limited to the cleaning of the semiconductor wafer. For example, cleaning and polishing of a substrate such as a CD may be used.
[0036]
Further, the substrate processing apparatus is not limited to the substrate cleaning apparatus, and a plurality of rotating bodies are brought into contact with the outer periphery of the substrate to be processed, and the surface of the substrate to be processed is rotated while rotating the plurality of rotating bodies. Any substrate processing apparatus that performs processing can be used.
[0037]
【The invention's effect】
As described above, according to the invention described in each claim, the following excellent effects can be obtained.
[0038]
According to the first aspect of the present invention, the apparatus includes a drive shaft that supports the rotating body and a rotation drive mechanism that rotationally drives the drive shaft, and the rotation drive mechanism includes one of the plurality of rotating bodies. The driving shaft is directly connected to the rotating shaft of the motor and the rotational force of the motor is transmitted, and the other rotating body is configured so that the rotational force of the driving shaft directly connected to the rotating shaft of the motor is transmitted by the belt. Since the belt breakage detecting means for detecting the belt breakage is provided, even if one or more belts are broken, the rotating body in which the drive shaft is directly connected to the rotation shaft of the motor continues to rotate, so the processing is immediately interrupted. Never happen. Further, it is possible to detect the occurrence of a belt breakage, including variations in belt life.
[0039]
According to the second aspect of the present invention, when the belt breakage detecting means detects the belt breakage, the control means for stopping the operation of the substrate processing apparatus after at least a series of processes currently being processed is provided. Is not interrupted, and the yield of the processed substrate is not drastically reduced.
[0040]
According to the third aspect of the present invention, a dog is provided on the idler pulley that gives a predetermined tension to the belt and rotates as the vehicle runs, and a photomicrosensor is provided so as to straddle the dog. Since the belt breakage is detected from the pulse timing, the belt breakage can be reliably detected with a simple configuration and at a low cost.
[0042]
According to the invention described in claim 4 , when the belt breakage detecting unit detects the belt breakage , all the substrates to be processed after the polishing unit continue the respective processes until the final drying process is completed, and the drying is performed. Since the control means is provided to interrupt each process after the process is completed, the rotating body with the drive shaft directly connected to the rotating shaft of the motor continues to rotate even if one or more belts are cut off. Is not interrupted, and each process can be continued until the last drying process is completed for all the substrates to be processed, and a process with a high yield can be performed.
[Brief description of the drawings]
FIG. 1 is a diagram showing a configuration of a substrate cleaning apparatus according to the present invention.
FIG. 2 is a view showing a semiconductor wafer and upper and lower cleaning brushes of a substrate cleaning apparatus according to the present invention.
FIG. 3 is a plan view showing a rotational drive mechanism of left and right stages of the substrate cleaning apparatus according to the present invention.
FIG. 4 is a view showing a dog and a photomicrosensor attached to an idler pulley for detecting belt breakage.
FIG. 5 is a timing chart of belt outage determination.
FIG. 6 is a diagram showing an overall planar configuration of a CMP apparatus according to the present invention.
FIG. 7 is a view showing a semiconductor wafer and upper and lower cleaning brushes of a conventional substrate cleaning apparatus.
FIG. 8 is a diagram illustrating a configuration of a substrate rotation mechanism of a conventional substrate cleaning apparatus.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Semiconductor wafer 2 Stage 3-1 to 3 Rotating body 4-1 to 3 Drive shaft 5-1, 2 Timing belt 6 Motor 7 Cleaning brush 8 Cleaning brush 9 Cleaning nozzle 10 Cleaning nozzle 11-1, 2 Shaft 12-1, 2 Timing pulley 13-1, 2, idler pulley 14 Bearing 15 dog 16 Photomicrosensor 20 Polishing unit 21 Turntable 22 Top ring 23 Top ring unit 24 Dressing tool 26 Dressing unit 27 Work delivery device 28 Polishing surface 30 Cleaning unit 31 Work transfer Robot 32 Work transfer robot 33 Primary cleaning machine 34 Secondary cleaning machine 35 Spin dryer 36 Work reversing machine 37 Work reversing machine 41 Cassette

Claims (4)

In a substrate processing apparatus for processing a surface of a substrate to be processed in a state where a plurality of rotating bodies are brought into contact with the outer periphery of the substrate to be processed and the substrate to be processed is rotated while rotating the plurality of rotating bodies.
A drive shaft that supports the rotating body, and a rotational drive mechanism that rotationally drives the drive shaft;
The rotary drive mechanism has one of the plurality of rotating bodies whose driving shaft is directly connected to the rotating shaft of the motor to transmit the rotational force of the motor, and the other rotating body has the driving shaft of the motor. It is configured so that the rotational force of the drive shaft directly connected to the rotation shaft is transmitted by the belt,
A substrate processing apparatus, comprising belt breakage detecting means for detecting the belt breakage. The substrate processing apparatus according to claim 1,
A substrate processing apparatus, comprising: a control means for controlling stop of the substrate processing apparatus after at least a series of processes currently being processed is executed when the belt out detection means detects belt out. In the substrate processing apparatus according to claim 1 or 2,
The plurality of rotating bodies are composed of a plurality of rotating bodies divided into left and right, and are configured such that the substrate to be processed can be sandwiched between the plurality of rotating bodies divided into the left and right ,
A dog is provided on the idler pulley that applies a predetermined tension to the belt of the rotational drive mechanism and rotates as the vehicle runs, and a photomicrosensor is provided across the dog. And a substrate processing apparatus. A substrate to be processed attached to the lower end surface of the top ring is brought into contact with the polishing surface of the top surface of the turntable, a polishing unit for polishing the substrate to be processed by the rotational movement of the turntable and the top ring, and a substrate to be polished A substrate processing for processing a substrate to be processed by sequentially performing a polishing process, a cleaning process, and a drying process on at least the substrate to be processed, including a cleaning unit for cleaning the substrate to be processed and a drying unit for drying the substrate to be processed after cleaning. In the device
The cleaning unit has a plurality of rotating bodies that contact the outer periphery of the substrate to be processed, and is configured to rotate the substrate to be processed by rotating the rotating body with a rotation driving mechanism.
The rotational drive mechanism includes a drive shaft that supports the rotating body and a rotational drive mechanism that rotationally drives the drive shaft, and one of the plurality of rotating bodies has a drive shaft as a rotational shaft of a motor. The rotational force of the motor is directly transmitted and the other rotating body is configured such that the rotational force of the drive shaft whose direct drive shaft is directly connected to the rotational shaft of the motor is transmitted by the belt,
A belt breakage detecting means for detecting the belt breakage,
When the belt breakage detecting unit detects a belt breakage , all the substrates to be processed after the polishing unit continue the processes until the final drying process is completed, and interrupt the processes after the drying process is completed. A substrate processing apparatus comprising a control means for performing the above operation.

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