JP3932964B2 - Device manufacturing method and device manufacturing apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a method for forming a film on a substrate using a droplet discharge means, a method for manufacturing a device through a step of forming a film pattern on a substrate using a droplet discharge means, a device manufacturing apparatus, and the method And an electronic apparatus including the device.
[0002]
[Prior art]
Conventionally, a photolithography method has been widely used as a method for manufacturing a device having a fine wiring pattern such as a semiconductor integrated circuit, but it is disclosed in Japanese Patent Laid-Open Nos. 11-274671 and 2000-216330. In addition, a device manufacturing method using a droplet discharge means has attracted attention. The technology disclosed in the above publication forms a wiring pattern by disposing a liquid material containing a pattern forming material on a pattern forming surface from a nozzle provided in a droplet discharge means on a substrate. It is very effective in that it can be used for small-lot and multi-product production.
[0003]
[Problems to be solved by the invention]
In a method using a conventional droplet discharge means, for example, as shown in FIG. 7, a head 1 in which a plurality of nozzles n1, n2,... Are arranged in a line along the Y-axis direction is moved in the X-axis direction. The wiring patterns 21 and 22 extending along the X-axis direction were formed on the substrate P by discharging droplets from the nozzles n4 and n6 passing above the positions where the wiring patterns 21 and 22 were formed.
As described above, conventionally, since one nozzle n4 (or n6) is used to draw one wiring pattern 21 (or 22), when the nozzle n4 (or n6) is clogged. There is a problem that the wiring pattern 21 (or 22) to be drawn by the nozzle n4 (or n6) is not formed or partially drawn.
In addition to the example of such a wiring pattern, when the film is formed on the substrate by the droplet discharge means, if the nozzle is clogged, the liquid material is not provided in a part of the film. There was a problem that occurred.
[0004]
An object of the present invention is to provide a film forming method in which, when a film is formed on a substrate by using a droplet discharge means, the film is not broken even if the nozzle is clogged.
Another object of the present invention is to provide a device manufacturing method in which when a film pattern is formed on a substrate using a droplet discharge means, no leakage occurs in the film pattern even if the nozzle is clogged. An object of the present invention is to provide a device manufacturing apparatus, a device, and an electronic apparatus.
[0005]
[Means for Solving the Problems]
In order to solve the above problems, a device manufacturing method of the present invention is a device manufacturing method including a step of forming a wiring pattern on a substrate, and in the step of forming the wiring pattern, a plurality of methods are provided on the substrate. A unit region is set, and a plurality of unit regions that are linearly continuous with a width corresponding to one unit region are set as a wiring pattern forming region, and the liquid pattern is formed with respect to the wiring pattern forming region. After discharging the droplet of the liquid material from one nozzle of the droplet discharge means while moving the droplet discharge means, the one nozzle while further moving the droplet discharge means with respect to the wiring pattern formation region The liquid material droplets are ejected from another nozzle different from the above.
According to such a method, even if the nozzle of the droplet discharge means is clogged, it is possible to prevent the wiring pattern from being lost, and thus it is possible to suppress the occurrence of device manufacturing defects.
[0006]
When a plurality of unit regions (bits) are set on a substrate, a set of bits from which droplets are ejected becomes a film pattern. In the present invention, droplets are ejected to one bit using a plurality of nozzles. Since ejection is performed, it is possible to prevent the film pattern from being lost even if some nozzles are clogged.
[0007]
The film forming method of the present invention can be applied to a step of forming a film pattern on a substrate in a method of manufacturing a device.
That is, the device manufacturing method of the present invention is a device manufacturing method including a step of forming a film pattern on a substrate, and in the step of forming the film pattern, a plurality of unit regions are set on the substrate, Liquid droplets of liquid material are ejected from the nozzles of the droplet ejection means to a plurality of unit regions corresponding to the film pattern formation region, and droplets are ejected to each unit region using a plurality of nozzles. It is characterized by that.
According to such a method, even if the nozzle of the droplet discharge means is clogged, it is possible to prevent the film pattern from being lost, and thus it is possible to suppress the occurrence of device manufacturing defects.
[0008]
In the device manufacturing method of the present invention, if conductive fine particles are contained in the liquid material, it can be applied to a process of forming a wiring pattern on a substrate, and the wiring pattern can be applied even if the nozzle of the droplet discharge means is clogged. Can be prevented from being broken.
[0009]
Further, the device manufacturing apparatus of the present invention includes a liquid droplet ejecting means having a plurality of nozzles for ejecting liquid material droplets, a stage that supports a substrate, and a movement for relatively moving the liquid droplet ejecting means. An apparatus for manufacturing a device, comprising: a control unit that controls the droplet discharge unit and the moving unit, wherein the control unit sets a plurality of unit regions on the substrate and A plurality of continuous unit areas having a width corresponding to one unit area is set as a pattern formation area, and the droplet discharge means is set to the length of the formation area with respect to the wiring pattern formation area. After the droplets are ejected from one nozzle while moving in the vertical direction, the droplet ejection means is moved relative to the stage, and the wiring pattern of the wiring pattern is transferred from another nozzle different from the one nozzle. form And performing control to eject droplets while moving the droplet discharge means in the longitudinal direction of the forming region for the region.
[0010]
According to the apparatus having such a configuration, even when the nozzle of the droplet discharge means is clogged, it is possible to prevent the film pattern formed on the substrate from being missing.
Moreover, this invention provides the device manufactured using the device manufacturing apparatus of this invention, and an electronic device provided with the device.
[0011]
Here, even if the droplet discharge method of the droplet discharge means in the present invention is a piezo jet method in which a liquid material (fluid) is discharged by the volume change of the piezoelectric element, the vapor is suddenly generated by the application of heat. It may be a system in which the liquid material is discharged by the generation.
[0012]
The liquid material in the present invention refers to a medium having a viscosity that can be discharged (dropped) from a nozzle of a droplet discharge means. It does not matter whether it is aqueous or oily. It is sufficient if it has fluidity (viscosity) that can be discharged from the nozzle, and even if a solid substance is mixed, it may be a fluid as a whole. In addition, the material contained in the liquid material may be one that has been heated to a melting point or higher and dissolved, or one that has been stirred as fine particles in a solvent. In addition to the solvent, a dye, pigment, or other functional material may be added. There may be.
[0013]
The film formation region in the present invention is, for example, a film pattern formation region in a device manufacturing method, for example, a wiring pattern formation region. A wiring pattern (electric circuit) is a member formed by an electrical cooperative relationship between circuit elements, and has specific electrical characteristics and certain electrical characteristics.
The substrate in the present invention indicates a flat substrate or a curved substrate. The pattern forming surface does not need to have a high hardness, and may be a flexible surface such as a film, paper, or rubber in addition to glass, plastic, or metal.
[0014]
DETAILED DESCRIPTION OF THE INVENTION
The embodiment described below is an embodiment in which the film forming method of the present invention is applied to the formation of a wiring pattern in the manufacture of a device. Therefore, this embodiment is also an embodiment of the device, the device manufacturing method, and the device manufacturing apparatus of the present invention.
FIG. 1 is a schematic perspective view showing an embodiment of a device manufacturing apparatus. The device manufacturing apparatus according to the present embodiment discharges (drops) droplets from the nozzles n1, n2,... Of the droplet discharge head (droplet discharge means) 1 onto the substrate P, thereby forming a wiring pattern constituting the device. Inkjet device for forming
[0015]
In FIG. 1, the inkjet apparatus IJ includes a head 1, an X-axis direction drive shaft 4, a Y-axis direction guide shaft 5, a control device CONT, a stage 7, a cleaning mechanism 8, a base 9, and a heater 15. And.
[0016]
The stage 7 supports the substrate P on which ink (liquid material) is provided by the ink jet apparatus IJ, and includes a fixing mechanism (not shown) that fixes the substrate P to a reference position.
[0017]
The head 1 is a multi-nozzle type head having a plurality of nozzles n1, n2,... (Not shown in FIG. 1) for discharging droplets, and the longitudinal direction of the head 1 coincides with the Y-axis direction. A plurality of nozzles n1, n2,... Are provided on the lower surface of the head 1 in a line along the Y-axis direction at regular intervals. From the discharge nozzles n1, n2,... Of the head 1, for example, ink (liquid material or liquid material) containing conductive fine particles is discharged onto the substrate P supported by the stage 7. Although not shown, a means for adjusting the angle of the head 1 may be provided so that the pitch between the nozzles can be adjusted, and the distance from the substrate P to the nozzles can be adjusted arbitrarily.
[0018]
An X-axis direction drive motor 2 is connected to the X-axis direction drive shaft 4. The X-axis direction drive motor 2 is a stepping motor or the like, and rotates the X-axis direction drive shaft 4 when a drive signal in the X-axis direction is supplied from the control device CONT. When the X-axis direction drive shaft 4 rotates, the head 1 moves in the X-axis direction.
[0019]
The Y-axis direction guide shaft 5 is fixed so as not to move with respect to the base 9. The stage 7 includes a Y-axis direction drive motor 3. The Y-axis direction drive motor 3 is a stepping motor or the like. When a drive signal in the Y-axis direction is supplied from the control device CONT, the stage 7 moves in the Y-axis direction.
[0020]
The control device CONT supplies the head 1 with a voltage for controlling droplet ejection. Further, a drive pulse signal for controlling movement of the head 1 in the X-axis direction is supplied to the X-axis direction drive motor 2, and a drive pulse signal for controlling movement of the stage 7 in the Y-axis direction is supplied to the Y-axis direction drive motor 3.
[0021]
The cleaning mechanism 8 is for cleaning the head 1. The cleaning mechanism 8 is provided with a Y-axis direction drive motor (not shown). By driving the drive motor in the Y-axis direction, the cleaning mechanism moves along the Y-axis direction guide shaft 5. The movement of the cleaning mechanism 8 is also controlled by the control device CONT.
[0022]
Here, the heater 15 is a means for heat-treating the substrate P by lamp annealing, and performs evaporation and drying of the solvent contained in the liquid material applied on the substrate P. The heater 15 is also turned on and off by the control device CONT. As a heat treatment means, a hot plate, a hot air blower, an electric furnace or the like may be used.
[0023]
In the present embodiment, the ink jet apparatus IJ forms a wiring pattern on the substrate P, and the ink is made of a liquid material containing conductive fine particles (metal fine particles) which are wiring pattern forming materials.
As the liquid (ink) containing conductive fine particles, a dispersion liquid in which conductive fine particles are dispersed in a dispersion medium is used. The conductive fine particles used here include fine particles of conductive polymer or superconductor in addition to metal fine particles containing any of gold, silver, copper, palladium, and nickel.
About these electroconductive fine particles, in order to improve dispersibility, the organic substance etc. can also be coated and used for the surface. Examples of the coating material that coats the surface of the conductive fine particles include organic solvents such as xylene and toluene, citric acid, and the like.
The particle diameter of the conductive fine particles is preferably 5 nm or more and 0.1 μm or less. If it is larger than 0.1 μm, the nozzles n1, n2,... Of the head 1 of the droplet discharge means are likely to be clogged, and discharge by the droplet discharge method becomes difficult. On the other hand, if the thickness is smaller than 5 nm, the volume ratio of the coating agent to the conductive fine particles becomes large, and the ratio of the organic matter in the obtained film becomes excessive.
[0024]
The liquid dispersion medium containing conductive fine particles preferably has a vapor pressure at room temperature of 0.001 mmHg to 200 mmHg (about 0.133 Pa to 26600 Pa). This is because if the vapor pressure is higher than 200 mmHg, the dispersion medium rapidly evaporates after discharge, making it difficult to form a good film.
The vapor pressure of the dispersion medium is more preferably 0.001 mmHg or more and 50 mmHg or less (about 0.133 Pa or more and 6650 Pa or less). This is because if the vapor pressure is higher than 50 mmHg, nozzle clogging due to drying tends to occur when droplets are ejected by the droplet ejection method, and stable ejection becomes difficult.
On the other hand, in the case of a dispersion medium whose vapor pressure at room temperature is lower than 0.001 mmHg, drying is slow and the dispersion medium tends to remain in the film, and a high-quality conductive film after heat and / or light treatment in the subsequent process. Is difficult to obtain.
[0025]
The dispersion medium to be used is not particularly limited as long as it can disperse the conductive fine particles and does not cause aggregation. Specifically, in addition to water, alcohols such as methanol, ethanol, propanol, butanol, n-heptane, n-octane, decane, toluene, xylene, cymene, durene, indene, dipentene, tetrahydronaphthalene, decahydronaphthalene , Hydrocarbon compounds such as cyclohexyl benzene, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol methyl ethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, 1,2-dimethoxyethane, bis (2-methoxy Ethyl) ether, ether compounds such as p-dioxane, propylene carbonate, γ-butyrolactone, N-methyl -2-pyrrolidone, dimethylformamide, dimethyl sulfoxide, it may be mentioned polar compounds such as cyclohexanone. Of these, water, alcohols, hydrocarbon compounds, and ether compounds are preferred and more preferred dispersions in terms of fine particle dispersibility, dispersion stability, and ease of application to the droplet discharge method. Examples of the medium include water and hydrocarbon compounds. These dispersion media can be used alone or as a mixture of two or more.
[0026]
The dispersoid concentration when the conductive fine particles are dispersed in a dispersion medium is preferably 1% by mass or more and 80% by mass or less, and can be adjusted according to the desired film thickness of the conductive film. If it exceeds 80% by mass, aggregation tends to occur and it becomes difficult to obtain a uniform film.
The surface tension of the conductive fine particle dispersion (ink) is preferably in the range of 0.02 N / m or more and 0.07 N / m or less. When ink is ejected by the droplet ejection method, if the surface tension is less than 0.02 N / m, the wettability of the ink composition with respect to the nozzle surface increases, and thus flight bending easily occurs, resulting in 0.07 N / m. This is because the shape of the meniscus at the tip of the nozzle is not stable and the control of the discharge amount and the discharge timing becomes difficult.
[0027]
In order to adjust the surface tension, a small amount of a surface tension regulator such as a fluorine-based, silicone-based, or nonionic-based material is added to the dispersion within a range that does not unduly reduce the contact angle with the surface from which the droplets are discharged. be able to. Nonionic surface tension modifiers improve the wettability of droplets on the surface where droplets are discharged, improve the leveling properties of the film, and help prevent the occurrence of coating crushing and the formation of distorted skin. Is.
The dispersion liquid may contain an organic compound such as alcohol, ether, ester, or ketone, if necessary.
[0028]
The dispersion preferably has a viscosity of 1 mPa · s to 50 mPa · s. When discharging from the inkjet head 1, if the viscosity is less than 1 mPa · s, the nozzle periphery is easily contaminated by the outflow of ink, and if the viscosity is more than 50 mPa · s, the nozzle hole is frequently clogged. This is because it becomes difficult to smoothly discharge droplets.
[0029]
The ink discharged from the head 1 onto the substrate P is converted into a conductive film (film formation) by heat treatment with the heater 15. In addition, depending on the ink component, it is converted into a conductive film (film formation) by light treatment.
[0030]
Next, a method for forming a wiring pattern using the above-described inkjet apparatus IJ will be described. In the following description, a plasma display device is taken as an example of the device, and an example in which a wiring pattern of the plasma display device is formed using the inkjet device IJ will be described.
[0031]
FIG. 2 is a diagram illustrating an example of a block diagram of a plasma display device. In FIG. 2, a plasma display device 52 includes an AC type plasma display panel 51 which is a matrix type color display device, and a drive unit 53 for selectively lighting a large number of cells constituting a screen. Become. The plasma display panel 51 is a surface discharge type plasma display panel in which a pair of sustain electrodes Xd and Yd are arranged in parallel, and an electrode matrix having a three-electrode structure in which the sustain electrodes Xd and Yd and the address electrodes A correspond to each cell. have. The sustain electrodes Xd and Yd extend in the line direction (horizontal direction) of the screen, and one of the sustain electrodes Yd is used as a scan electrode for selecting cells in line units during addressing. The address electrode A is a data electrode for selecting cells in units of columns and extends in the column direction (vertical direction). The drive unit 53 includes a controller 54, a frame memory 55, an X driver circuit 56, a Y driver circuit 57, an address driver circuit 58, and a power supply circuit (not shown). Multi-value video data DR, DG, and DB indicating the RGB luminance level (gradation level) of each pixel are input to the drive unit 53 together with various synchronization signals from an external device. The video data DR, DG, and DB are temporarily stored in the frame memory 55, converted into subframe data Dsf for each color by the controller 54, and stored in the frame memory 55 again. The subframe data Dsf is a set of binary data indicating whether or not the cells need to be lit in each subframe obtained by dividing one frame for gradation display. The X driver circuit 56 is responsible for voltage application to the sustain electrode Xd, and the Y driver circuit 57 is responsible for voltage application to the sustain electrode Yd. The address driver circuit 58 selectively applies an address electrode to the address electrode A according to the subframe data Dsf transferred from the frame memory 55.
[0032]
3A and 3B schematically show an enlarged part of the wiring pattern in the plasma display device shown in FIG. 2, and FIG. 3A shows the first discharge process. b) shows the second discharge step. In the following description, a procedure for forming wiring patterns 21 and 22 extending along the X-axis direction as shown in FIG. 3 will be described as an example.
[0033]
First, the control device CONT of the ink jet device IJ includes a plurality of lattice-shaped bits (unit regions) a1, b1, c1,... On the substrate P as shown by broken lines in FIGS. Set the bitmap. In this embodiment, the individual bits a1, b1, c1,... Are set in a square shape.
[0034]
(First discharge process)
First, as shown in FIG. 3A, the control device CONT discharges droplets to a plurality of bits corresponding to the formation regions of the wiring patterns 21 and 22 based on the bitmap set on the substrate P. To do. In the example of this figure, the first bit group c1, c2, c3... Corresponds to the formation region of the first wiring pattern 21, and the second bit group corresponds to the formation region of the second wiring pattern 22. e1, e2, e3... correspond to each other.
Specifically, the head 1 is moved in the X-axis direction with respect to the substrate P, and the first bit group c1, c2, c3... Corresponding to the formation region of the first wiring pattern 21 is formed. A droplet is ejected from the fourth nozzle n4 that moves above the region. At this time, droplets are also ejected from the sixth nozzle n6 moving above the formation region to the second bit groups e1, e2, e3,... Corresponding to the formation region of the second wiring pattern 22. .
[0035]
(Second discharge process)
Subsequently, droplets are ejected from the nozzles other than the fourth nozzle n4 used in the first ejection process to the first bit group c1, c2, c3..., And the second bit group e1, Also for e2, e3, etc., droplets are ejected from nozzles other than the sixth nozzle n6 to perform overcoating.
In the present embodiment, as shown in FIG. 3B, when the head 1 moves from one end side of the stage 7 to the other end side in the X-axis direction in the first discharge step, the stage 7 is moved in the Y-axis direction. Control is performed so that the head 1 moves by one bit (downward in the figure), and then the head 1 moves from the other end side of the stage 7 to one end side in the X-axis direction.
Then, the head 1 is moved to the first bit group c1, c2, c3... Corresponding to the formation region of the first wiring pattern 21 while moving in the X-axis direction opposite to the movement in the first discharge process. On the other hand, droplets are discharged from the fifth nozzle n5 that moves above the formation region. At this time, droplets are also ejected from the seventh nozzle n7 moving above the formation region to the second bit groups e1, e2, e3,... Corresponding to the formation region of the second wiring pattern 22. .
[0036]
As described above, the wiring patterns 21 and 22 are formed by performing the ejection process at least twice by changing the nozzles in the formation regions of the wiring patterns 21 and 22.
Note that after the first discharge process, after the droplets on the substrate P are annealed using the heater 15 shown in FIG. 1, the second discharge process can be performed, or the first time without annealing. A second discharge step may be performed immediately after the discharge step.
[0037]
According to the present embodiment, for example, even if clogging occurs in the fourth nozzle n4 that should eject droplets to the first bit groups c1, c2, c3,. In the process, since droplets are discharged from the fifth nozzle n5 to the first bit groups c1, c2, c3..., As a result, the first bit groups c1, c2, c3. Therefore, disconnection of the first wiring pattern 21 can be prevented.
Therefore, it is possible to suppress the occurrence of manufacturing defects such as disconnection in the manufacturing process and manufacture a plasma display device with high reliability with high yield.
[0038]
In the above embodiment, the example of applying the device manufacturing method of the present invention to the case of manufacturing a plasma display device has been described. However, the present invention is not limited thereto, for example, a device having a wiring pattern having a plurality of forms, for example, Of course, the present invention can also be applied to the formation of a wiring pattern in the manufacture of an organic electroluminescence device, the formation of a wiring pattern in the manufacture of a liquid crystal display device, or the formation of a wiring pattern in the manufacture of an electrophoretic device.
Further, the present invention is not limited to the formation of a wiring pattern, and can be applied to the formation of various film patterns in the manufacture of various devices such as an insulating film, a reflective film, and an overcoat.
Further, the present invention is not limited to device manufacturing and can be applied to various film forming processes.
[0039]
Hereinafter, an example of an electronic apparatus including the plasma display device manufactured by the manufacturing method of the above embodiment will be described.
FIG. 4 is a perspective view showing an example of a mobile phone. In this figure, reference numeral 1000 denotes a mobile phone body, and reference numeral 1001 denotes a display unit using the plasma display device.
[0040]
FIG. 5 is a perspective view showing an example of a wristwatch type electronic apparatus. In this figure, reference numeral 1100 indicates a watch body, and reference numeral 1101 indicates a display unit using the above plasma display device.
[0041]
FIG. 6 is a perspective view showing an example of a portable information processing apparatus such as a word processor or a personal computer. In this figure, reference numeral 1200 denotes an information processing apparatus, reference numeral 1202 denotes an input unit such as a keyboard, reference numeral 1204 denotes an information processing apparatus body, and reference numeral 1206 denotes a display unit using the plasma display device.
[0042]
Since the electronic devices shown in FIGS. 4 to 6 include the plasma display device according to the above-described embodiment, it is possible to realize an electronic device with excellent reliability with reduced manufacturing defects.
[0043]
【The invention's effect】
As described above, according to the present invention, when a film is formed on a substrate using the droplet discharge means, a plurality of lattice unit areas are set on the substrate, and each unit area corresponding to the film formation area is set. On the other hand, since the droplets are ejected a plurality of times using a plurality of nozzles, it is possible to prevent the film from being broken even if the nozzles are clogged.
[Brief description of the drawings]
FIG. 1 is a schematic perspective view showing an example of a device manufacturing apparatus of the present invention.
FIG. 2 is a block diagram of a plasma display device as an example of a device to which the device manufacturing method of the present invention is applied.
3A and 3B are diagrams for explaining an embodiment of a device manufacturing method of the present invention, where FIG. 3A is an explanatory view showing a first discharge step, and FIG. 3B is an explanatory view showing a second discharge step.
FIG. 4 is an explanatory diagram illustrating an example of an electronic apparatus including the device of the invention.
FIG. 5 is an explanatory diagram illustrating an example of an electronic apparatus including the device of the invention.
FIG. 6 is an explanatory diagram illustrating an example of an electronic apparatus including the device of the invention.
FIG. 7 is a diagram illustrating a process of forming a wiring pattern using a droplet discharge unit in a conventional example.
[Explanation of symbols]
1 Head (Droplet ejection means)
2 X-axis direction drive motor (moving means)
3 Y-axis direction drive motor (moving means)
4 X axis direction drive shaft (moving means)
5 Y-axis direction guide shaft (moving means)
21 1st wiring pattern 22 2nd wiring pattern CONT Control apparatus IJ Inkjet apparatus (device manufacturing apparatus)
P substrate n1, n2, n3... Nozzle a1, b1, c1... Bit (unit area)

Claims (6)

A device manufacturing method including a step of forming a wiring pattern on a substrate,
In the step of forming the wiring pattern,
A plurality of unit regions are set on the substrate, and a plurality of unit regions that are linearly continuous with a width corresponding to one unit region are set as a wiring pattern formation region,
After discharging the droplets of the liquid material from one nozzle of the droplet discharge means while moving the droplet discharge means in the length direction of the formation region with respect to the formation region of the wiring pattern, the wiring pattern A device characterized by discharging droplets of the liquid material from another nozzle different from the one nozzle while moving the droplet discharge means in the length direction of the formation region with respect to the formation region. Production method.   The device manufacturing method according to claim 1, wherein the liquid material contains conductive fine particles.   3. The device manufacturing method according to claim 1, wherein a plurality of wiring patterns extending substantially parallel to each other are simultaneously formed on the substrate.   The movement direction of the droplet discharge means when discharging droplets from the one nozzle and the movement direction of the droplet discharge means when discharging droplets from the other nozzle are opposite to each other. The device manufacturing method according to claim 1, wherein the device is a device. An apparatus for manufacturing a device, comprising: a droplet discharge means including a plurality of nozzles for discharging liquid material droplets; and a moving means for relatively moving a stage supporting a substrate and the droplet discharge means. ,
Control means for controlling the droplet discharge means and the moving means;
The control unit sets a plurality of unit regions for the substrate, and sets a plurality of unit regions that are linearly continuous with a width corresponding to one unit region as a wiring pattern formation region,
After discharging the droplet discharge means from one nozzle while moving the droplet discharge means in the length direction of the formation region with respect to the formation area of the wiring pattern, the droplet discharge means is moved relative to the stage. And moving the droplet discharge means from the other nozzles different from the one nozzle to the wiring pattern formation region while controlling the droplet discharge while moving the droplet discharge means in the length direction of the formation region. An apparatus for manufacturing a device. A plurality of the nozzles are arranged in a row in the droplet discharge means,
6. The control unit according to claim 5, wherein after the droplets are ejected from the one nozzle, the droplet ejection unit is moved relative to the stage in the arrangement direction of the nozzles. The manufacturing apparatus of the described device.

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