JP2003317945A - Manufacturing method for device, device, and electronic apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a manufacturing method for a device, the device, and an electronic apparatus highly precisely forming a line width when forming a fine pattern on a substrate using a droplet delivery device. <P>SOLUTION: This manufacturing method for the device disposes a liquid body including a film material on a substrate P and forms a pattern composed of the film material. This method is provided with a process of forming banks 22 on the substrate P, a process of delivering the droplet 23 composed of the liquid body 23a between the banks 22 and 22 by the droplet delivery method, and a process of forming the pattern 24 by drying the delivered liquid body 23a. The width between adjoining banks 22 and 22 is formed narrower than the diameter of the droplet 23 of the liquid body 23a. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device manufacturing method, a device, and an electronic apparatus using a droplet discharge method.

[0002]

2. Description of the Related Art Conventionally, a photolithography method has been widely used as a method of manufacturing a fine wiring pattern of a semiconductor integrated circuit or the like. On the other hand, Japanese Patent Laid-Open No. 11-27467
No. 1 and Japanese Patent Laid-Open No. 2000-216330 disclose methods using a droplet discharge method. The techniques disclosed in these publications form a wiring pattern by arranging a material on a pattern forming surface by ejecting a liquid material containing a pattern forming material onto a substrate from a droplet ejection head. It is said to be very effective, such as being able to handle small-lot, multi-type production.

[0003]

By the way, in recent years, the density of circuits constituting devices has been further increased, and further miniaturization and thinning of wiring patterns are required, for example. However, when such a fine wiring pattern is to be formed by the method based on the droplet discharge method described above, it is difficult to obtain a sufficient wiring width accuracy, and a line narrower than the diameter of the droplet to be discharged. When width is required, there is a problem that it is extremely difficult to deal with it.

The present invention has been made in view of the above circumstances, and an object thereof is to accurately form a line width and the like when forming a fine pattern on a substrate using a droplet discharge device. Another object of the present invention is to provide a device manufacturing method, a device, and an electronic apparatus capable of performing the above.

[0005]

In order to solve the above-mentioned problems, in the device manufacturing method of the present invention, a device in which a liquid material containing a film material is arranged on a substrate to form a pattern made of the film material. In the manufacturing method, the step of forming a bank on the substrate, the step of ejecting droplets of the liquid material between the banks by a droplet ejection method, and the ejection of the ejected liquid material to form the pattern. And a width between the adjacent banks is formed to be narrower than a diameter of the liquid droplet of the liquid material.

According to this device manufacturing method, although droplets larger than the width between the adjacent banks are ejected, a part of the droplets is placed on the bank, but the fluidity of the droplets and Droplets enter between the banks due to a capillary phenomenon or the like, and as a result, a pattern having a width corresponding to the width between the banks is formed.

In the method for manufacturing the device, it is preferable that the liquid material contains a conductive material. By doing so, it is possible to form a wiring pattern having a particularly good accuracy in line width.

In the device manufacturing method, it is preferable that the surface of the substrate is lyophilic. In this way, since the substrate surface is lyophilic, the liquid material discharged into the groove is more likely to spread on the substrate, which allows the liquid material to fill the groove more uniformly. become.

In the device manufacturing method, it is preferable that at least the surface of the bank is subjected to a treatment for imparting liquid repellency. In this way, even if some of the ejected droplets are deposited on the bank, they are repelled from the bank and flow down into the groove because the bank surface is liquid repellent. Therefore, the discharged liquid material spreads on the substrate in the groove, and the groove is almost uniformly filled.

The device of the present invention is characterized by being formed by the above manufacturing method. This device has a pattern with which the line width defined in the groove formed by the bank is accurately matched.

An electronic apparatus of the present invention is characterized by including the above device. According to this electronic device, by having the pattern formed with high precision, it has excellent device performance.

[0012]

BEST MODE FOR CARRYING OUT THE INVENTION The present invention is described in detail below.
FIG. 1 is a diagram showing an example of a manufacturing apparatus suitable for carrying out the device manufacturing method of the present invention, and reference numeral IJ in FIG. 1 is a manufacturing apparatus. First, the manufacturing apparatus IJ will be described prior to describing the device manufacturing method of the present invention. This manufacturing apparatus IJ manufactures a device by forming various patterns by discharging (dripping) liquid droplets from the liquid droplet discharging head 1 onto the substrate P. It is composed of a device (inkjet device).

That is, the manufacturing apparatus IJ has a droplet discharge head 1, an X-axis direction drive shaft 4, and a Y-axis direction guide shaft 5.
The control unit CONT, the stage 7, the cleaning mechanism 8, the base 9, and the heater 15 are provided. The stage 7 supports the substrate P on which the liquid material is provided by the manufacturing apparatus IJ, and includes a fixing mechanism (not shown) that fixes the substrate P at the reference position.

The droplet discharge head 1 is a multi-nozzle type head having a plurality of discharge nozzles, and is arranged so that the long side direction of the rectangular bottom surface and the Y-axis direction are aligned with each other. Is. The plurality of ejection nozzles are arranged on the bottom surface of the droplet ejection head 1 in the Y-axis direction at regular intervals. From the discharge nozzle of the droplet discharge head 1, a liquid containing a film material such as conductive fine particles is discharged onto the substrate P supported by the stage 7.

An X-axis direction drive motor 2 is connected to the X-axis direction drive shaft 4. The X-axis direction drive motor 2 is composed of a stepping motor or the like, and is configured to rotate the X-axis direction drive shaft 4 when a drive signal in the X-axis direction is supplied from the control device CONT. When the drive shaft 4 in the X-axis direction rotates, the droplet discharge head 1 moves in the X direction.
It is designed to move in the axial direction. The Y-axis direction guide shaft 5 is fixed to the base 9 so as not to move. The stage 7 is equipped with a Y-axis direction drive motor 3. The Y-axis direction drive motor 3 is composed of a stepping motor or the like, and is configured to move the stage 7 in the Y-axis direction when a drive signal in the Y-axis direction is supplied from the control device CONT.

The control unit CONT is configured to supply a signal for controlling droplet ejection to the droplet ejection head 1. Further, a drive pulse signal for controlling the movement of the droplet discharge head 1 in the X-axis direction is supplied to the X-axis direction drive motor 2, and a drive pulse signal for controlling the movement of the stage 7 in the Y-axis direction is further supplied to the Y-axis direction drive motor 3. Are configured to be supplied respectively. The cleaning mechanism 8 cleans the droplet discharge head 1. The cleaning mechanism 8 is provided with a drive motor (not shown) for moving in the Y-axis direction, and the driving of the drive motor causes the cleaning mechanism to move along the Y-axis direction guide shaft 5. It has become. The movement of the cleaning mechanism 8 is also controlled by the controller CONT. The heater 15 is configured to heat the substrate P by lamp annealing in this example, and evaporates and dries the dispersion medium contained in the liquid material coated on the substrate P. The power supply of the heater 15 is also controlled by the controller CONT.

Next, as an example of a method of manufacturing a device of the present invention using such a manufacturing apparatus IJ, an example of a manufacturing method including a wiring pattern forming step will be described. In this example, first, the substrate P is prepared, and the surface of the substrate (the surface on which the wiring pattern is formed) is subjected to the lyophilic treatment. The material of the substrate P is appropriately selected and used according to the type of device to be manufactured such as glass, silicon, and resin and the site of this device.

As the lyophilic treatment, although different depending on the type of the substrate P, for example, when glass is used as the substrate P, a plasma treatment method (O ₂ plasma treatment method) in which oxygen is used as a treatment gas in the atmosphere is adopted. To be done. In particular,
It is performed by irradiating the substrate P with oxygen in a plasma state from the plasma discharge electrode. The conditions of the O ₂ plasma treatment are, for example, a plasma power of 100 to 800 kW, an oxygen gas flow rate of 50 to 100 ml / min, and a plate transport speed of the substrate P to the plasma discharge electrode of 0.5 to 10 mm / s.
ec, the substrate temperature is 70 to 90 ° C.

After the substrate P has been lyophilically processed in this manner, as shown in FIG. 2A, a bank having a band 21 in a plan view having a groove 21 of a predetermined width by forming a pair on the substrate P. 22 and 22 are formed. That is, first, a resin bank layer (not shown) made of an acrylic resin, a polyimide resin, or the like is formed on the substrate P, and then patterning is performed by using a resist technique, if necessary, and a photolithography technique and an etching technique. As a result, the band-shaped banks 22 having a predetermined thickness are formed. The banks 22 formed in this manner are tapered so that the width on the upper side is narrower and the width on the bottom side is wider, as described later. It is preferable because it is easy to flow.

Next, the bank 2 thus formed
A liquid repellent treatment is performed on Nos. 2 and 22 to make the surface water repellent. As the water repellent treatment, for example, a plasma treatment method (CF _{4) using} tetrafluoromethane as a treatment gas in the atmosphere is used.
Plasma treatment method) is adopted. Conditions for the CF ₄ plasma treatment are, for example, plasma power of 100 to 800 kW,
The flow rate of tetrafluoromethane gas is 50 to 100 ml / min,
The substrate transfer speed with respect to the plasma discharge electrode is 0.5 to 10
The substrate temperature is set to 20 mm / sec and 70 to 90 ° C.
The processing gas is not limited to tetrafluoromethane (carbon tetrafluoride), and other fluorocarbon-based gas can be used.

By performing such a liquid repellent treatment, fluorine groups are introduced into the resins constituting the banks 22 and 22 to impart liquid repellency thereto. Here, the acrylic resin and the polyimide resin have a property that they are more easily fluorinated (water repellent) when pretreated with O ₂ plasma. Therefore, the lyophilic treatment for the substrate P performed earlier may be performed after the banks 22 and 22 are formed. Although the water repellent treatment on the banks 22 and 22 has some influence on the surface of the substrate P that has been subjected to the lyophilic treatment, the introduction of the fluorine group by the water repellent treatment is performed especially when the substrate P is made of glass or the like. Substrate P
Does not substantially impair its lyophilicity, ie wettability. Further, the bunks 22 and 22 may be formed of a material having water repellency (for example, a resin material having a fluorine group) so that the water repellency treatment may be omitted.

Next, using the manufacturing apparatus IJ, as shown in FIG.
As shown in (b), the liquid droplets 2 from the droplet discharge head 1 are directed toward the groove 21 between the water-repellent banks 22, 22.
3 is discharged and the liquid 23a is placed in the groove 21. In addition,
In this example, the diameter D of the droplet 23 is larger than the width W of the groove 21 formed by the banks 22 and 22 (in this example, the width of the opening of the groove 21). Specifically, the width W at the opening of the groove is about 10 μm or less, and the diameter D of the droplet 23 is 1
It is about 5 to 20 μm. Where liquid 2
Since 3a forms a wiring pattern as a pattern in this example, 3a contains the following conductive fine particles.

As the liquid containing the conductive fine particles,
A dispersion liquid in which conductive fine particles are dispersed in a dispersion medium is used. As the conductive fine particles used here, in addition to metal fine particles containing any of gold, silver, copper, palladium and nickel, conductive polymer and superconductor fine particles are used. These conductive fine particles can be used by coating the surface thereof with an organic substance or the like in order to improve the dispersibility. Examples of the coating material for coating the surface of the conductive fine particles include organic solvents such as xylene and toluene, citric acid and the like. The particle size of the conductive fine particles is preferably 5 nm or more and 0.1 μm or less.
This is because if it is larger than 0.1 μm, the nozzles of the head of the droplet discharge device described later are likely to be clogged, and discharge by the droplet discharge method becomes difficult. On the other hand, if it is less than 5 nm, the volume ratio of the coating agent to the conductive fine particles becomes large, and the ratio of organic substances in the obtained film becomes excessive.

A liquid dispersion medium containing conductive fine particles has a vapor pressure of 0.001 mmHg or more and 200 at room temperature.
It is preferably mmHg or less (about 0.133 Pa or more and 26600 Pa or less). This is because when the vapor pressure is higher than 200 mmHg, the dispersion medium evaporates rapidly after ejection, and it becomes difficult to form a good film. Also,
Vapor pressure of dispersion medium is 0.001mmHg or more and 50mmHg
It is more preferable that it is not more than about 0.133 Pa and not more than 6650 Pa. If the vapor pressure is higher than 50 mmHg,
This is because when the droplets are ejected by the droplet ejection method, nozzle clogging due to drying is likely to occur and stable ejection becomes difficult.
On the other hand, when the dispersion medium has a vapor pressure of less than 0.001 mmHg at room temperature, the drying is slowed and the dispersion medium is likely to remain in the film, resulting in a good quality conductive film after the heat and / or light treatment in the subsequent step. Is difficult to obtain.

The dispersion medium used is not particularly limited as long as it can disperse the above-mentioned conductive fine particles and does not cause aggregation. Specifically, in addition to water, alcohols such as methanol, ethanol, propanol, butanol, n-heptane, n-octane, decane, toluene, xylene, cymene, durene, indene, dipentene, tetrahydronaphthalene, decahydronaphthalene. , Hydrocarbon compounds such as cyclohexylbenzene,
Further, ethylene glycol dimethyl ether, ethylene glycol diethyl ether, ethylene glycol methyl ethyl ether, diethylene glycol dimethyl ether, diethylene glycol diethyl ether, diethylene glycol methyl ethyl ether, 1,2-dimethoxyethane, bis (2-methoxyethyl) ether, p-
Examples include ether compounds such as dioxane, and polar compounds such as propylene carbonate, γ-butyrolactone, N-methyl-2-pyrrolidone, dimethylformamide, dimethyl sulfoxide, and cyclohexanone. Of these, water, alcohols, hydrocarbon compounds, and ether compounds are preferable, and more preferable dispersion, from the viewpoints of dispersibility of fine particles, stability of dispersion liquid, and ease of application to the droplet discharge method. Examples of the medium include water and hydrocarbon compounds. These dispersion media can be used alone or as a mixture of two or more kinds.

When the conductive fine particles are dispersed in the dispersion medium, the dispersoid concentration is preferably 1% by mass or more and 80% by mass or less, and can be adjusted according to the desired film thickness of the conductive film. . If it exceeds 80% by mass, aggregation is likely to occur, and it becomes difficult to obtain a uniform film. The surface tension of the dispersion liquid (liquid material) of the conductive fine particles is 0.02 N /
It is preferably in the range of m or more and 0.07 N / m or less.
When the liquid material is discharged by the droplet discharge method, the surface tension is 0.0
When it is less than 2 N / m, the wettability of the ink composition with respect to the nozzle surface is increased, so that flight bending is apt to occur, and the ink composition is less than 0.
When it exceeds 07 N / m, the shape of the meniscus at the tip of the nozzle is not stable, which makes it difficult to control the ejection amount and the ejection timing.

In order to adjust the surface tension, a small amount of a fluorine-based, silicone-based, nonionic-based surface tension adjusting agent or the like may be added to the dispersion liquid as long as the contact angle with the substrate S is not unduly lowered. it can. The nonionic surface tension adjusting agent is useful for improving the wettability of the liquid to the substrate, improving the leveling property of the film, and preventing the occurrence of crushing of the coating film and the occurrence of orange peel skin. The dispersion may contain an organic compound such as alcohol, ether, ester or ketone, if necessary.

The dispersion has a viscosity of 1 mPa · s or more 50
It is preferably mPa · s or less. When ejecting by the droplet ejection method, if the viscosity is less than 1 mPa · s, the peripheral area of the nozzle is easily contaminated by the outflow of ink, and if the viscosity is more than 50 mPa · s, the clogging frequency in the nozzle hole This is because it becomes difficult to smoothly discharge the liquid droplets.

When such a droplet 23 of the liquid 23a is discharged from the droplet discharge head 1 and the liquid 23a is placed in the groove 21, the diameter 23 of the droplet 23 is larger than the width W of the groove 21. Therefore, as shown by the chain double-dashed line in FIG. 2 (c), a part thereof is placed on the banks 22 and 22. However, since the surfaces of the banks 22 and 22 are lyophobic and have a tapered shape, the droplets 23 portion on the banks 22 and 22 are repelled from the banks 22 and 22,
Furthermore, the capillarity of the groove 21 causes it to flow down into the groove 21, so that the droplet 23 enters the groove 21 as shown by the solid line in FIG.

The liquid 23a discharged into the groove 21 or flowing down from the banks 22 and 22 is more likely to spread because the substrate P is lyophilic. The groove 21 is evenly filled. Therefore, even though the width W of the groove 21 is narrower (smaller) than the diameter D of the droplet 23,
The liquid droplets 23 (liquid material 23a) discharged toward the inside of 1 are
The groove 21 satisfactorily enters the groove 21 and is uniformly embedded therein.

Then, the liquid material 23a in the groove 21 is dried by the heater 15, the dispersion medium contained in the liquid material 23a is evaporated, dried, and the conductive fine particles are sintered. As shown in (d), a conductive pattern as a continuous film, that is, the wiring pattern 24 is obtained. In addition, when it is desired to obtain a sufficient film thickness of the obtained wiring pattern 24, the discharging of the droplets 23 and the drying are repeated a plurality of times, and finally the sintering is performed to obtain the wiring pattern 24 having a desired film thickness. .

In the device manufacturing method including the step of forming the wiring pattern 24, the banks 22 and 2 are formed.
Since the liquid droplets 23 of the liquid material 23a are discharged into the groove 21 according to No. 2, the liquid material 23a disposed in the groove 21 can be spread on the substrate P and embedded in the groove 21 almost uniformly, and thus formed. The wiring pattern 24 is set to the banks 22 and 22.
The line width defined by the groove 21 can be accurately matched.

In the above example, the width W of the groove 21 formed by the banks 22 and 22 is made smaller than the diameter D of the droplet 23. However, the present invention is not limited to this, and the width W of the groove 21 is a droplet. Of course, it may be wider than the diameter D of 23,
Even in that case, it is possible to form a pattern that accurately matches the line width defined in the groove 21.

Examples of devices obtained by such a process of forming the wiring pattern 24 include organic electroluminescence devices, liquid crystal display devices, plasma displays, electro-optical devices such as electrophoretic devices, and semiconductor devices. The present invention can be applied to the formation of various wiring patterns used for manufacturing these devices. Further, in the present embodiment, an example in which the wiring pattern is formed by a liquid material containing conductive fine particles is shown, but the present invention is not particularly limited to this, and for example, a liquid material containing insulating fine particles may be formed by a liquid droplet ejecting device. It may be discharged to be applied to the formation of an insulating pattern. Examples of the above-mentioned insulating fine particles include, for example, inorganic insulating fine particles such as silicon oxide, silicon nitride, alumina, and magnesia, and insulating fine particles made of an insulating polymer and the like, and dispersions applicable to these insulating fine particles. What is dispersed in a medium is used.

Further, the electronic apparatus of the present invention uses, for example, a device as an electro-optical device having the wiring pattern 24 as a display unit, and specifically, the one shown in FIG. FIG. 3A is a perspective view showing an example of a mobile phone. In FIG. 3A, reference numeral 600 denotes a mobile phone main body, and 601 denotes a display unit including the device. FIG. 3B is a perspective view showing an example of a portable information processing device such as a word processor and a personal computer. Figure 3
In (b), 700 is an information processing device, 701 is an input unit such as a keyboard, 703 is an information processing main body, and 702 is a display unit including the device. Figure 3 (c)
FIG. 3 is a perspective view showing an example of a wrist watch type electronic device. In FIG. 3 (c), reference numeral 800 indicates the timepiece main body, and 801 indicates the display unit including the device. Figure 3 (a)
Since the electronic devices shown in (c) to (c) include a device having a pattern formed with high accuracy as a display unit, the electronic device has excellent display performance.

[0036]

As described above, according to the present invention, by ejecting a droplet larger than the width of the adjacent bank, although a part of the droplet is placed on the bank, The liquid droplets enter between the banks due to the fluidity or the capillary phenomenon, and as a result, a pattern having a width matching the width between the banks can be formed.

[Brief description of drawings]

FIG. 1 is a perspective view showing a schematic configuration of an example of a manufacturing apparatus suitable for carrying out a manufacturing method of the present invention.

FIGS. 2A to 2D are side cross-sectional views of a main part for explaining a pattern forming process according to the present invention in order of processes.

3A and 3B are diagrams showing a specific example of an electronic device, in which FIG. 3A is a perspective view showing an example applied to a mobile phone, and FIG. 3B is a perspective view showing an example applied to an information processing device;
(C) is a perspective view showing an example when applied to a wristwatch type electronic device.

[Explanation of symbols]

IJ ... Manufacturing apparatus, 1 ... Droplet ejection head, 21 ... Groove, 22
... bank, 23 ... droplet, 23a ... liquid material, 24 ... wiring pattern (pattern), P ... substrate

Front page continuation (51) Int.Cl. ⁷ Identification code FI theme code (reference) H05B 33/14 H05B 33/22 Z 33/22 G02F 1/13 101 // G02F 1/13 101 B41J 3/04 101Z F Term (reference) 2C056 FA02 FA15 FB01 2H088 EA22 EA27 FA17 FA18 FA30 HA01 HA02 HA04 MA20 3K007 AB18 DB03 FA01 4F041 AA05 AA17 AB01 BA01 4M104 BB04 BB05 BB07 BB08 BB09 DD51

Claims (6)

[Claims] 1. A method of manufacturing a device, in which a liquid material containing a film material is arranged on a substrate to form a pattern made of the film material, the method comprising a step of forming a bank on the substrate and a droplet discharge method. A step of discharging droplets of the liquid material between the banks; and a step of drying the discharged liquid material to form the pattern, wherein the width between the adjacent banks is defined by the liquid of the liquid material. A method for manufacturing a device, wherein the device is formed to have a diameter smaller than that of the droplet. 2. The method for manufacturing a device according to claim 1, wherein the liquid material contains a conductive material. 3. The device manufacturing method according to claim 1, wherein the surface of the substrate is subjected to a lyophilic treatment. 4. The method for manufacturing a device according to claim 1, wherein a treatment for imparting liquid repellency is performed on at least the surface of the bank. 5. A device formed by the manufacturing method according to claim 1. 6. An electronic apparatus comprising the device according to claim 5.