JP3929751B2 - Jet wave forming device for electronic component mounting - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention provides an electronic component mounting for soldering and mounting a soldered work such as a printed wiring board on which an electronic component is mounted and a jet wave of the solder to the printed wiring board. The present invention relates to a jet wave forming apparatus.
[0002]
The jet wave forming device requires a pump for forming the solder jet wave, and the molten solder supplied by the pump is supplied to the blow body of various shapes to be jetted from the blow hole. Forms solder jet waves. Of course, the solder in this case is heated by a heater or the like and is in a molten state.
[0003]
There are various types of pumps used in jet wave forming devices, and centrifugal pumps, spiral pumps, rotary vane pumps, piston pumps, etc. are known as pumps configured by mechanical mechanisms. ing. As electromagnetic pumps that directly apply electromagnetic force to a fluid, induction type electromagnetic pumps, conduction type electromagnetic pumps, and the like are known.
[0004]
Each of these pumps has advantages and disadvantages. For example, a pump composed of a mechanical mechanism generally has advantages such as high efficiency and low conversion loss to pump discharge energy with respect to input energy to the drive motor, but molten solder discharged from the pump. There are disadvantages such as unstable flow and fluctuation.
[0005]
On the other hand, the electromagnetic pump has the advantage that the flow of molten solder discharged from the pump is stable and well-equipped, but generally the conversion loss of the pump discharge energy with respect to the input energy is large and the efficiency is low, and a moving magnetic field is generated. A large amount of leakage magnetic field is generated from a mechanism, that is, a magnetic circuit composed of a coil for generating a moving magnetic field and a core, and this leakage magnetic field gives a worker a magnetic field exposure exceeding that of the natural world or is mounted on a printed wiring board. There is a problem that an induced voltage is generated particularly in an electronic component having a coil, and this induced voltage damages, stresses, or seriously damages a semiconductor component for small power, particularly, a small withstand voltage. The resistor (R), the capacitor (C), and the coil (L) are basic passive components that constitute an electronic circuit, and are used in all electronic circuits. Therefore, the coil is not a special electronic component.
[0006]
The present invention relates to a jet wave forming apparatus for mounting an electronic component using an induction type electromagnetic pump, and relates to a jet wave forming apparatus for mounting an electronic component that is configured to be highly efficient and have a very small leakage magnetic field.
[0007]
[Prior art]
An electromagnetic pump (LEP: linear electronic pump) that generates a thrust by directly applying an electromagnetic force to a medium to be supplied and generates a thrust and a suction force of the pump is roughly classified into an induction type (induction type). And the conduction type. In general, there are many examples in which an induction type that does not require energization of a medium to be fed is used.
[0008]
The induction-type electromagnetic pump is roughly classified into a flat linear type (FLIP type: flat linear induction pump), an annular linear type (ALIP type: annular linear induction pump), and a helical type (HIP type: helical induction pump). Each has a unique configuration.
[0009]
These electromagnetic pumps used in the jet wave forming apparatus are configured so that the magnetic field generating coil is generally provided in a low-temperature space outside the solder bath containing solder, that is, in the atmosphere. Examples thereof are disclosed in JP-A-49-65934, JP-A-58-122170, WO97 / 47422, JP-A-11-104817, and the like. In these examples, the FLIP type is used for the electromagnetic pump.
[0010]
Further, as described in Japanese Patent Application Laid-Open No. 58-122170 and Japanese Patent Application Laid-Open No. 11-104817, a means for preventing overheating of the magnetic field generating coil is provided.
[0011]
In other words, the magnetic field generating coil is provided at a position where it can be easily cooled, and further, cold air is supplied to the magnetic field generating coil by a cooling fan or the like, and its temperature rises excessively, so that the heat resistance of the magnetic field generating coil is increased. It is configured not to exceed the temperature. The heat-resistant temperature of the coil is usually determined by a temperature that can maintain and guarantee the insulation of the coil.
[0012]
The temperature rise of the magnetic field generating coil is caused by a copper loss caused by a current flowing in the coil itself, an iron loss caused by an eddy current generated in a core around which the coil is wound, etc., and a solder containing solder. It is also caused by heat conduction from the tank.
[0013]
On the other hand, a jet wave forming apparatus for mounting electronic components usually requires a solder jet wave having a width of 20 mm or more, a length of 350 mm or more, and a jet wave height of about 4 to 10 mm. That is, it is necessary to ensure sufficient contact time with the printed wiring board to ensure good solder wettability. Therefore, the maximum input power of an induction electromagnetic pump (hereinafter simply referred to as “electromagnetic pump”) for forming such a jet wave is usually about several kW.
[0014]
On the other hand, as described in WO97 / 47422, the flow path in which the electromagnetic pump applies a moving magnetic field to the solder to provide thrust, in turn, discharge force and suction force is narrow and long (for example, intervals of several mm) The length is about several tens of centimeters), and it is explained that it is necessary to clean as necessary. That is, it has been described that it is necessary to remove a nozzle that forms a jet wave, and to insert a slender bar or the like into this flow path to scrape off dirt such as dross attached. It is described that backwashing can be performed.
[0015]
Dross, such as solder oxide, has extremely strong adhesion, and usually does not peel off once attached. Therefore, when dross such as oxidized solder starts to adhere to the flow path of the electromagnetic pump, this gradually accumulates and becomes larger. As a result, the adhesion and deposits disturb the flow of solder in the flow path to form a non-uniform flow, and the jet waveform formed on the nozzle not only has a non-uniform wave height depending on the location. This is because an unstablely changing jet wave is formed, which lowers the soldering and mounting quality of the work to be soldered, that is, the printed wiring board.
[0016]
[Problems to be solved by the invention]
As described above, since the electromagnetic pump does not have a movable mechanism for rotating or reciprocating the parts, there is no wear part accompanying such movement, and the motor of the rotation driving means and the fluid of the reciprocating driving means are not present. There is a feature that does not require a motion mechanism such as a pressure actuator.
[0017]
However, the pump discharge relative to the input power to the electromagnetic pump, that is, the pump work, is small, energy efficiency is less than half compared to the rotary pump driven by the rotary motor, and it is extremely low in efficiency. There is a problem of increased consumption. In other words, most of the energy loss generated by the electromagnetic pump is released as heat generation (copper loss, iron loss, etc.), and this large amount of energy loss is cooled by forced cooling means such as a cooling fan, and is used as thermal energy in the atmosphere. This is because it needs to be discharged inside.
[0018]
In addition, in order to form a jet wave of the required magnitude, a maximum of several kW is usually required as the input power to the electromagnetic pump, and a moving magnetic field with a very strong magnetic field must be applied to the solder. Therefore, a large amount of leakage magnetic field is generated around the moving magnetic field generating coil and the core.
[0019]
This leakage magnetic field is an alternating magnetic field, and its strength is much higher than that of the natural world. Therefore, caution is required for the work of workers near the electromagnetic pump. In addition, when this leakage magnetic field acts on an electronic component to be mounted on a printed wiring board, an induced voltage is generated particularly in an electronic component having a coil, and the induced voltage is a semiconductor component for low power, particularly a semiconductor component for low voltage. There is a problem of damage, stress, and serious damage. In particular, as exemplified in JP-A-49-65934, WO97 / 47422, and the like, when an electromagnetic pump is arranged at a position below a blower body that forms a jet wave, Has the strongest leakage magnetic field acting on the electronic component.
[0020]
Furthermore, since the flow path of the electromagnetic pump is narrow and long as described above, dirt such as dross adheres and accumulates within a short period of time, and it is actually necessary to clean frequently. Moreover, it is extremely difficult and inefficient to remove the nozzle each time it is cleaned, insert a long and narrow bar into a narrow and long channel, and evenly scrape off the adhered dirt. That is, as described above, since the adhesion of dross is extremely strong, the action of backwashing practically does not reach the adhered / deposited dross.
[0021]
The object of the present invention is to increase the overall efficiency of the electromagnetic pump as seen in the entire jet wave forming device to the same level as that of a pump driven by a rotary motor, and further to reduce the leakage magnetic field to the limit. By realizing a jet wave forming apparatus for mounting electronic components that can easily and reliably perform the above operation, it is possible to perform a safe mounting operation with good soldering mounting quality of the electronic components.
[0022]
[Means for Solving the Problems]
The jet wave forming apparatus for electronic component mounting according to the present invention is configured so that all energy supplied to the electromagnetic pump is consumed in a solder bath containing solder, further attenuates the leakage magnetic field, It is characterized in that the cleaning work can be easily performed.
[0023]
(1) Solder mounting is performed by forming a jet wave by supplying the solder accommodated in the solder bath to the soldered part of the printed wiring board on which a large number of electronic components are mounted. An electronic component mounting jet wave forming apparatus that is configured as follows.
[0024]
That is, a heating means for heating the solder accommodated in the solder bath, a temperature measuring means for measuring the temperature of the solder, and a temperature control means for maintaining the solder at a predetermined temperature in a molten state are provided. The molten solder is stored with its liquid level exposed to the atmosphere, and the blowing port of the blowing body is disposed on the liquid level of the molten solder. Applying a magnetic field that moves to the solder to the lower position of the body to give a discharge force ALIP type Electromagnetic pump And a thrust generation flow path formed in an annular shape is connected to form a jet wave in the blower outlet of the blower body by molten solder discharged in an annular shape Including the moving magnetic field generating coil and the core, the entire structure is immersed in the solder in the solder bath. The entire surface of the ALIP type electromagnetic pump is covered with the molten solder, and this is configured as a short band against a magnetic field leaking from the ALIP type electromagnetic pump, and the ALIP type electromagnetic pump is surrounded by a solder bath through the molten solder. All of the polyphase AC power supplied to the ALIP type electromagnetic pump is consumed in the solder bath and conducted to the molten solder for use in heating. Configure as follows.
[0025]
By configuring in this way, the entire electromagnetic pump, that is, the entire surface is submerged in the solder. Therefore, all of the loss generated by the electromagnetic pump, that is, thermal energy, is not leaked to the outside of the solder bath. Conducted by solder and used as heating energy for this solder.
[0026]
Therefore, since the loss generated in the electromagnetic pump is used as energy for heating the solder, the amount of energy supplied to the heating means for the solder controlled by the temperature control means can be reduced accordingly. Become.
[0027]
That is, all the energy supplied to the electromagnetic pump and the heating means is supplied to the solder in the solder bath, and there is no energy discharged as unnecessary energy, so that the overall energy efficiency of the jet wave forming device can be significantly improved. It becomes like this.
[0028]
Also, the magnetic field that is going to leak from the electromagnetic pump to the outside is a short ring (or called a short band, etc., which is a solder that surrounds the entire surface of the electromagnetic pump) against the leakage magnetic field, and is well known in the technical field of power transformers, etc. As a result, the magnetic field cannot leak to the outside of the solder bath. That is, it does not leak to the outside of the jet wave forming device, and the leakage magnetic field does not affect the worker, the printed wiring board, and the electronic component.
[0029]
Of course, as the electromagnetic pump used here, any type of electromagnetic pumps of FLIP type, ALIP type, and HIP type can be used, and the same effects as those described above can be obtained.
[0030]
(2) In the jet wave forming apparatus for electronic component mounting of (1) above ,in front Record ALIP type Electromagnetic pump Annular An inner core that forms the annular thrust generating flow path in the thrust generating flow path Through the mouth of the body It is configured so that it can be inserted and removed.
[0031]
An ALIP (annular linear induction pump) type electromagnetic pump forms an annular thrust generating flow path centering on the inner core, and by removing this inner core, this flow path becomes pipe-shaped. By inserting a cleaning means such as a cylindrical brush having the same shape as the above (for example, a cleaning means having a shape like a cup cleaning tool), cleaning can be performed very easily. Also, the removed inner core can be easily cleaned outside the solder bath.
[0032]
In addition, since the annular thrust generation flow path, that is, the thrust generation flow path having a circular curved longitudinal section has a characteristic that dross is difficult to adhere, A The LIP type electromagnetic pump requires less frequency of cleaning.
[0033]
As a result, the thrust of the electromagnetic pump can be easily maintained constantly and the cost required for the cleaning work (maintenance work) of the electromagnetic pump can be greatly reduced. This is because such cleaning work needs to be performed as overtime after the production engineer finishes the production operation time (normal working hours) of the printed wiring board production factory.
[0034]
Note that the ALIP type electromagnetic pump has a characteristic that a leakage magnetic field is less likely to be generated than the FLIP type electromagnetic pump.
[0035]
DETAILED DESCRIPTION OF THE INVENTION
The electronic component mounting jet wave forming apparatus of the present invention can be realized in the following embodiments.
[0036]
(1) Configuration
An embodiment of a jet wave forming apparatus for mounting electronic components according to the present invention will be described with reference to FIGS. 1A and 1B are diagrams for explaining an embodiment of a jet wave forming apparatus for mounting electronic components according to the present invention. FIG. 1A is a longitudinal sectional view, and FIG. 1B is an overall view of an inner core. It is a perspective view. FIG. 2 is a perspective view for explaining the whole embodiment of the jet wave forming apparatus for mounting electronic components. In FIG. 1, the control system for the electromagnetic pump and the control system for the solder temperature are shown in a block diagram.
[0037]
That is, a heater 4 is provided along the tank wall 3 (or the tank bottom 2) in the solder tank 1 held by the casing 17, and the solder 5 accommodated in the solder tank 1 is heated and melted. , And is configured to maintain the target temperature. The temperature of the solder 5 is controlled by the temperature control device 6, and the temperature control device 6 refers to the temperature detection result of the temperature sensor 7, and sets the temperature of the solder 5 to the heater 4 so that the temperature is instructed in advance. This is a mechanism for controlling the power supplied.
[0038]
In addition, the chamber body 8 that regulates the flow of the solder 5 and links the blower body 15 and the electromagnetic pump 12 engages the suspension portion 9 with the upper edge portion 1a of the solder bath 1 and fixes it with the screw 10. It is. A handle 11 provided in the hanging portion 9 is a member used when the chamber body 8, the electromagnetic pump 12, and the blower body 15 are also pulled up from the solder tank 1.
[0039]
One of the chamber bodies 8 is provided with a fitting hole 21 for fitting the discharge port 13 of the ALIP type electromagnetic pump 12 fixed by a screw 22, and the blower body 15 is fitted to the other. A fitting hole 23 is provided. A flow guide plate 41 for adjusting the flow of the solder 5 is provided in the chamber body 8.
[0040]
Since the outer core 18 (details not shown) can be arranged and formed in a columnar shape, the ALIP type electromagnetic pump 12 usually has a columnar appearance as well. The inner core 19 is also cylindrical, and a moving magnetic field is generated in the annular space between the outer core 18 and the inner core 19, that is, the flow path (thrust generation flow path) 20 formed by the convex pieces 19 a. A thrust is applied to the solder 5 of the path 20 to move it, and a discharge force and a suction force are generated. The ALIP type electromagnetic pump 12 having the configuration illustrated in FIG. 1 is called a straight-through type because the flow path 20 in the electromagnetic pump 12 is linear. A moving magnetic field generating coil 42 (not shown in detail) is wound around the outer core 18.
[0041]
The discharge port 13 of the electromagnetic pump 12 is fitted into the fitting hole 21 of the chamber body 8 and fixed by a screw 22. The wiring pipe 28 provided in the electromagnetic pump 12 connects a moving magnetic field generating coil 42 in the outer core 18 of the electromagnetic pump 12 and a multiphase AC power supply device (for example, a VVVF type three-phase inverter power supply device) 29, This is a member through which wiring for supplying multiphase AC power to the moving magnetic field generating coil 42 of the electromagnetic pump 12 is passed.
[0042]
The multi-phase AC power supply device 29 is configured such that its output voltage and frequency are arbitrarily adjusted and set by communication with the control device 30. The control device 30 is configured by a computer system, and includes an instruction operation unit 31 such as a keyboard and a display unit 32 such as an LCD. The operation of the multiphase AC power supply device 29 is activated by an instruction from the instruction operation unit 31. It is the structure to control.
[0043]
An inner core 19 provided by a convex piece 19a at the center of the ALIP type electromagnetic pump 12 is provided so as to be freely inserted and removed, and a handle 25 for insertion / extraction work is provided on the liquid surface 5a side of the end. Further, a raised portion 36 is provided in the middle of the handle 25, and the flow of the solder 5 discharged from the discharge port 13 of the electromagnetic pump 12 acts so as to be uniformly diffused by the raised portion 36. Although not shown in detail, the tip of the convex piece 19a of the inner core 19 near the suction port 34 is inserted and rotated into an “L” -shaped recess provided in the wall of the flow path 20 so as to be fitted. By comprising, the internal core 19 can be fixed so that insertion or extraction is possible.
[0044]
On the other hand, the blower body 15 fitted in the fitting hole 23 on the blower body 15 side of the chamber body 8 is fixed by a screw 38 that passes through the sleeve portion 39 so that only it can be easily replaced, The fixing screw 38 is exposed on the liquid surface 5a of the solder 5 so that the replacement work can be easily performed. Although not shown, there may be provided a rectifying means composed of a perforated plate or the like inside the blower body 15. In general, when the type of the printed wiring board (not shown), that is, the mounting state of the electronic component is different, the blower body 15 gives an optimum jet wave shape and the like to obtain the best soldering mounting quality. Used as a replacement.
[0045]
The jet wave 27 flowing down the guide plate 16 provided at the blower opening 37 of the blower body 15 is formed by the molten solder 5. In FIG. 2, for easy understanding of the drawing, the jet wave 27 is indicated by a broken line, and the structure of the blowout body 15 is drawn so as to be easily understood.
[0046]
The melting point of the solder 5 varies depending on the type of the solder 5. Conventionally used tin-lead solder (for example, 37% lead and the balance is tin) is about 183 ° C., and lead-free solder tin-zinc solder (for example, zinc 9) % With the balance being tin) at about 199 ° C., tin-silver-copper solder (eg about 3.5% silver, about 0.7% copper with the balance being tin) at about 220 ° C., and so on.
[0047]
Therefore, although the temperature of the solder 5 used for soldering and mounting of the printed wiring board varies depending on the type of the solder 5 used, the heat resistance temperature of the electronic component mounted on the printed wiring board is taken into consideration, so that the temperature is about 220 ° C. Most examples are used in a range of about ~ 260 ° C.
[0048]
Therefore, the electromagnetic pump 12 that is used by immersing the entirety of the solder 5 in the molten state needs to have a heat resistance temperature at least equal to or higher than the melting point of the solder 5. A heat-resistant temperature exceeding about ~ 260 ° C is required. In addition, a durability time exceeding the service life of the jet wave forming device is required.
[0049]
The heat-resistant temperature of the electromagnetic pump 12 is determined by the heat-resistant temperature of the insulation of the magnetic field generating coil used in the electromagnetic pump 12, and is approximately 3 × 105 hours or more at a temperature of 650 ° C. due to the composite insulation of mica and alumina. (A study on the high-temperature electric charging lifetime of mica-alumina composite insulation) Hisayo Mitsui Ryoji Kumazawa Toshie Aizawa Tatsuo Okamoto Tetsuo Ito Masaki Kanegami Electric A, 117, 8 (1997). This is a durable time of more than 30 years with 24-hour operation. Further, the technology of the electromagnetic pump 12 to which such a technology is applied is also known (for example, Japanese Patent Publication No. 5-57821).
[0050]
(2) Operation
When electric power is supplied from the multiphase AC power supply device 29, a magnetic field that moves from the suction port 34 side to the discharge port 13 side is generated in the flow path 20 of the electromagnetic pump 12, and the moving magnetic field causes the same direction as the moving direction thereof. The solder 5 that has obtained the thrust to the position moves from the suction port 34 to the discharge port 13, and the solder 5 in the solder bath 1 is supplied to the chamber body 8.
[0051]
The solder 5 supplied to the chamber body 8 by the electromagnetic pump 12 is adjusted in flow by the raised portion 36 provided on the handle 25 of the inner core 19, the flow guide plate 41 provided on the chamber body 8, and the like. 15 is jetted from the blowing port 37, and a jet wave 27 is formed on the blowing port 37. Then, the solder 5 on which the jet wave 27 is formed is circulated back to the solder tank 1.
[0052]
Although not shown, the printed wiring board on which the electronic components are soldered and mounted is brought into contact with the jet wave 27 of the jet wave forming device while being transported to the transport conveyor, and the solder 5 is supplied to the soldered portion and soldered. The implementation is completed.
[0053]
In such an induction type electromagnetic pump 12, the solder 5 is heated by the induced current flowing in the solder 5 as disclosed in Japanese Patent Application Laid-Open No. 49-65934. Furthermore, in the jet wave forming apparatus for mounting electronic parts according to the present invention, the entire electromagnetic pump 12, that is, the entire surface thereof is submerged in the solder 5. It is used as energy for heating the solder 5 without leaking to the outside of the tank 1. Moreover, the solder 5 that encloses the electromagnetic pump 12 is an extremely excellent heat conductor as compared with gas, and the solder 5 acts as an excellent cooling medium to cool the electromagnetic pump 12. Therefore, the input power can be greatly increased as compared with the conventional case where the electromagnetic pump 12 is used in the atmosphere. That is, it is possible to operate with a high capacity while being small.
[0054]
As described above, the power supplied to the heater 4 that heats the solder 5 can be reduced by the loss generated by the electromagnetic pump 12. That is, the overall efficiency as a jet wave forming device for mounting electronic components can be significantly improved as compared with a conventional device using an electromagnetic pump. That is, in the electronic device mounting jet wave forming apparatus of the present invention, all of the effective power supplied to the electromagnetic pump 12 can be supplied to the apparatus without omission. In addition, since the cooling means described in Japanese Patent Application Laid-Open No. 58-122170 and Japanese Patent Application Laid-Open No. 11-104817 is unnecessary, the power used for such cooling can be saved.
[0055]
As a result, the energy efficiency of the electromagnetic pump 12 when viewed from the entire jet wave forming device can be increased to the same level as a pump driven by a rotary motor.
[0056]
Further, since the entire electromagnetic pump 12, that is, the entire surface is submerged in the solder 5, the magnetic field to be leaked from the electromagnetic pump 12 to the outside of the electromagnetic pump 12 is leaked by the solder 5 surrounding the entire surface of the electromagnetic pump 12. It acts as a perfect short ring (short band) for this, and this leakage magnetic field can be short-circuited and attenuated almost completely. That is, the magnetic field cannot leak to the outside of the solder bath 1. A technique called a short ring or a short band is well known in the technical field such as a power transformer.
[0057]
Therefore, even if an operator performs work in the vicinity of the electronic component mounting jet wave forming apparatus, the work can be performed safely without worrying about exposure to the magnetic field. Further, even if the electromagnetic pump 12 is disposed directly below the blower body 15 forming the jet wave 27, the printed wiring board transported onto the blower body 15 for mounting electronic components and its mounting The leakage magnetic field does not act on the component, and no unnecessary induced voltage is generated in the electronic component having coils during the mounting operation, and the operation of the printed circuit board on which the electronic component is mounted and the electronic circuit is operated. Soldering and mounting operations can be performed without affecting performance.
[0058]
For example, when an electronic component having a coil is mounted on a semiconductor input circuit that operates at low power or a low voltage, the voltage induced in the coil may damage or stress the semiconductor input element. In some cases, the expected performance may not be obtained for the electronic circuit in which the electronic component is completely soldered and mounted. For example, the input voltage of a communication device or an electrocardiograph is about several n [V] (10-9 [V]) and is composed of an extremely sensitive input circuit. It is easily damaged. Note that examples of such electronic circuits are not limited to these and exist in a wide variety.
[0059]
As described above, the resistor (R), the capacitor (C), and the coil (L) are basic passive components that constitute the electronic circuit, and are used in the electronic circuit as much as possible. Therefore, the coil is not a special electronic component.
[0060]
On the other hand, the electronic component mounting jet wave forming apparatus of this embodiment is configured so that the inner core 19 of the ALIP type electromagnetic pump 12 can be inserted and removed. Therefore, when dirt such as oxidized solder or dross adheres to the flow path 20 of the electromagnetic pump 12 due to long-time operation, the inner core 19 is held and removed by a stenosis holder such as pliers. Thus, the inside of the flow path 20 in the form of a pipe can be easily cleaned. That is, a non-wetting member with respect to the solder 5, for example, a cylindrical brush such as a cup cleaning tool composed of a stainless steel member, a carbon member, or the like is placed in the flow path (thrust generation flow path) 20 of the electromagnetic pump 12. If it inserts in, dirt in channel 20 can be removed easily. Also, the dirt on the removed inner core 19 can be easily removed with a brush or cloth. Therefore, the cleaning operation is extremely easy, and the cleaning operation can be completed in a short time.
[0061]
Furthermore, since the annular flow path 20, that is, the flow path 20 having a circular curved cross section, has a characteristic that dross or the like does not easily adhere to the circular flow path 20, the cleaning frequency is less than that of the FILP type electromagnetic pump. It becomes like this.
[0062]
In the present embodiment, as shown in FIG. 2, the grip 25 of the inner core 19 that appears in the blower opening 37 of the blower body 15 in a state where the solder 5 is not jetted is narrowed like pliers. The inner core 19 can be removed from the electromagnetic pump 12 by being pulled out by the holder.
[0063]
(3) Other configuration examples
With reference to FIG. 3 and FIG. 4, another embodiment of the jet wave forming apparatus for mounting electronic components according to the present invention will be described. FIG. 3 is a diagram showing a cross section of another configuration example of the present invention, and FIG. 4 is a perspective view for explaining the whole configuration of the other configuration example. In FIG. 3, an electromagnetic pump control system and a solder temperature control system are depicted in a block diagram. Further, in FIG. 4, in order to make the drawing easy to understand, the jet wave 27 is indicated by a broken line, and the structure of the blowout body 15 is drawn so as to be easy to understand.
[0064]
The other embodiment is different from the previous embodiment in that the ALIP type electromagnetic pump 12 is provided immediately below the blower body 15 in the previous embodiment, whereas this other embodiment. In the example, as illustrated in FIG. 3, the ALIP type electromagnetic pump 12 is provided at a position slightly below the blower body 15 and slightly laterally. Therefore, the chamber body 8 is also configured to have a horizontal flow path portion 8a as illustrated in FIG.
[0065]
And the handle 25 for insertion / extraction work provided in the inner core 19 of the electromagnetic pump 12 is configured so as to always appear on the liquid surface 5 a of the solder 5 on the side of the blower body 15. The inner core 19 can be inserted and removed through the hole 24. Therefore, when the inner core 19 of the electromagnetic pump 12 is inserted into the electromagnetic pump 12, the communication hole 24 of the chamber body 8 is closed by the fitting body 26 provided in the handle 25.
[0066]
The operation of the electronic component mounting jet wave forming apparatus configured as described above is basically the same as that in the above embodiment, but in this other embodiment, as shown in FIG. Even when the rectifying means composed of the plate 40 is provided and the inner core 19 of the ALIP type electromagnetic pump 12 cannot be inserted / removed from the blower opening 37 of the blower body 15, the inner core 19 from the liquid surface 5 a side of the solder 5. The internal core 19 inserted into the thrust generation flow path 20 of the electromagnetic pump 12 and the thrust generation flow path 20 can be easily cleaned.
[0067]
In the above embodiment, an example in which the ALIP type electromagnetic pump 12 is used in consideration of cleaning workability is shown. However, instead of the ALIP type electromagnetic pump 12, a FLIP type electromagnetic pump or a HIP type electromagnetic pump is used. An electromagnetic pump can also be used. In the case of the FLIP type electromagnetic pump, the thrust generation flow path 20 is an elongated slit-shaped flow path, so that the cleaning workability of the flow path 20 is relatively deteriorated. In addition, dross and the like are easily attached as compared with the ALIP type electromagnetic pump.
[0068]
FIG. 5 is a diagram showing a cross section of a configuration example using a FLIP electromagnetic pump. The control system of the electromagnetic pump and the control system of the solder temperature are drawn in block diagrams.
[0069]
That is, it can be realized by providing a FLIP electromagnetic pump 43 instead of the ALIP electromagnetic pump. As shown in FIG. 5, the FLIP type electromagnetic pump 43 has no internal core, and a thrust generation flow path sandwiched between a core 44 and a coil 45 wound around the core 44 (both not shown in detail). 46 has a flat slit shape.
[0070]
Although not shown, there is also a FLIP electromagnetic pump in which an electric circuit is configured by providing a core 44 and a coil 45 only on one side of the thrust generation flow path 46 and providing a relative core on the other side.
[0071]
Further, since the HIP type electromagnetic pump can be configured in the same manner as in the above example, specific illustration is omitted.
[0072]
【The invention's effect】
As described above, according to the jet wave forming apparatus for mounting electronic components of the present invention, the overall efficiency as the jet wave forming apparatus, specifically, the power efficiency can be increased, thereby realizing significant energy saving. An electromagnetic pump type jet wave forming device can be realized.
[0073]
In addition, since the magnetic field leaking from the electromagnetic pump can be attenuated completely, damage and stress to the human body, electronic components, and thus the electronic circuit are severely affected by the mounting of the electronic components on the printed wiring board. There will be no adverse effects such as damage, and soldering and mounting work can be performed with confidence.
[0074]
Furthermore, by using an ALIP type electromagnetic pump having an inner core that can be inserted and removed, immersed in solder, dirt such as dross attached to the thrust generation flow path of the electromagnetic pump can be easily cleaned. As a result, the maintenance cost associated with the cleaning operation can be greatly reduced. In addition, the quality of soldering mounting can always be stably maintained in a good state.
[0075]
Since the ALIP type electromagnetic pump has a characteristic that dross or the like does not easily adhere to the annular flow path, the frequency of cleaning can be reduced.
[0076]
As a result, it is possible to reduce the cost associated with the production of electronic parts of a work to be soldered, such as a printed wiring board, and to improve and stably maintain the soldering quality. Furthermore, there is no fear of damaging, stressing, or seriously damaging the electronic components mounted on the printed wiring board, and there is no worry of giving unnecessary magnetic field exposure to workers. Therefore, it becomes possible to mount electronic components with peace of mind.
[Brief description of the drawings]
FIG. 1 is a diagram for explaining an embodiment of a jet wave forming apparatus for mounting electronic components according to the present invention.
FIG. 2 is a diagram for explaining the whole embodiment of the jet wave forming apparatus for mounting electronic components.
FIG. 3 is a diagram showing a cross section of another configuration example of the present invention.
[Fig. 4] Fig. 4 is a diagram for describing the entire configuration example.
FIG. 5 is a diagram showing a cross section of a configuration example using a FLIP type electromagnetic pump.
[Explanation of symbols]
1 Solder bath
1a Upper edge
2 tank bottom
3 tank wall
4 Heater
5 Solder
5a Liquid level
6 Temperature controller
7 Temperature sensor
8 Chamber body
8a Horizontal flow path
9 Hanging part
10 Screw
11 Handle
12 Electromagnetic pump
13 Discharge port
15 Blowout body
16 Information board
17 Case
18 outer core
19 Internal core
19a Convex piece
20 channels
21 Fitting hole
22 screws
23 Fitting hole
24 communication hole
25 Handle
26 Fitting body
27 Jet wave
28 Pipe for wiring
29 Multiphase AC power supply
30 Control device
31 Support operation part
32 Display section
34 Suction mouth
36 Raised part
37 Air outlet
38 screws
39 Sleep Club
40 perforated plate
41 Flow guide plate
42 coils
43 FLIP type electromagnetic pump
44 core
45 coils
46 flow path (thrust generation flow path)

Claims (2)

Electronic component mounting in which solder contained in a solder bath is jetted from the blower body's blowing port to form a jet wave and supplied to the soldered part of a printed wiring board on which a large number of electronic components are mounted. A jet wave forming device,
A heating means for heating the solder contained in the solder bath, a temperature measuring means for measuring the temperature of the solder, and a temperature control means for maintaining the solder at a predetermined temperature in a molten state,
The molten solder is stored with its liquid surface exposed to the atmosphere, and the blowing port of the blowing body is disposed on the liquid surface of the molten solder. The blower body is blown by molten solder discharged in an annular shape by connecting thrust generating flow paths formed in an annular shape of an ALIP type electromagnetic pump that applies a magnetic field moving to the solder to a lower position to give a discharge force. A jet wave is formed at the mouth, and the whole including the moving magnetic field generating coil and the core is submerged in the solder of the solder bath, and the entire surface of the ALIP electromagnetic pump is covered with the molten solder. Is configured as a short band against a magnetic field leaking from the ALIP type electromagnetic pump, and the ALIP type electromagnetic pump is surrounded by a solder bath with the molten solder interposed therebetween. Utilizing all types multiphase supplied to the electromagnetic pump AC power to heating by conduction to the molten solder is consumed by the solder bath,
A jet wave forming device for mounting electronic components. The inner core to form a thrust-generating passage of said annular before Symbol said annular thrust-generating passage of ALIP type electromagnetic pump comprises provided removably inserted through mouthpiece of the mouthpiece body,
The jet wave forming apparatus for mounting an electronic component according to claim 1.

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