JP2007095918A - Jet wave generating device for mounting electronic component - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To enable to mount an electronic component in high reliability by further decreasing a leakage magnetic field or a stray current while improving maintainability. <P>SOLUTION: An R-ALIP type electromagnetic pump 300 is provided on the outside of a solder tank 101, and a driving body 301 in which an external core 301a and a moving magnetic field generating coil 301b are integrally formed is especially provided so as to be freely inserted and withdrawn. The solder tank 101 has permeability of at least one hundred times the permeability of solder and has permeability not less than the permeability of an internal core 303. The solder tank 101 is configured of an iron member having the thickness of not less than the thickness of the internal core 303, and is configured so that the magnetic field leaking from the R-ALIP type electromagnetic pump 300 provided outside the solder tank 101 does not leak into the solder, and a stray current due to an alternating field does not be generated. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

  The present invention relates to an electronic component mounting jet wave forming apparatus for soldering and mounting electronic components on a printed wiring board.

  The electromagnetic pump (LEP: linear electromagnetic pump) that generates a thrust force by directly applying an electromagnetic force to the medium to be delivered and uses this as the discharge force and suction force of the pump is roughly classified into an induction type. And conduction type. In general, there are many examples in which an induction type that does not require energization of a medium to be fed is used.

  The induction type electromagnetic pump is roughly classified into a flat linear type (FLIP type: flat linear induction pump), an annular linear type (ALIP type: annular linear induction pump), and a helical type (HIP type: helical induction pump). Each has its own configuration.

  As a technique of a jet wave forming apparatus for mounting electronic parts using an ALIP type electromagnetic pump, there is a technique of Patent Document 1. This technology is characterized in that the ALIP type electromagnetic pump itself can be operated and operated in the molten solder, energy loss is eliminated, and damage to electronic components is eliminated.

  In particular, the use of molten solder as a means for attenuating the leakage magnetic field from the electromagnetic pump is excellent. Further, consideration is given to preventing damage and stress from being applied to components that operate with minute electric power or low voltage due to leakage magnetic fields.

  As an example of the ALIP type electromagnetic pump, Patent Document 2 is a reference.

  The jet wave forming device for electronic component mounting using an induction type electromagnetic pump has extremely good reproducibility and stability of parameters for feeding molten solder, and can always be the same when the molten solder jet state can be maintained stably. It has the feature that it can be soldered and mounted under certain conditions, and stable soldering quality can be obtained.

  However, in the technique of Patent Document 1, since the ALIP type electromagnetic pump is provided in the solder, the electromagnetic pump must be pulled up in a state where the solder is melted when the electromagnetic pump is maintained or replaced. There was a problem.

Therefore, as disclosed in Patent Document 3, it has been considered to provide this ALIP type electromagnetic pump outside the tank wall of the solder tank. As a result, the molten solder is sucked into the thrust generating flow channel that is located outside the tank wall of the solder tank, and then the molten solder to be discharged is fed into the solder tank. Maintenance and replacement of the located ALIP type electromagnetic pump became easy.
JP 2003-142819 A JP-A-5-260719 2005-205479

  In the technology of Patent Document 1, since molten solder is used to attenuate the leakage magnetic field, that is, because the molten solder is made to act as a short ring (short band), current flows in the molten solder. There was a leak. Although the degree of this leakage is not a problem, it is predicted in the future that it will be necessary to further reduce this current due to rapid progress of microfabrication of a semiconductor as an electronic component. In addition, although the stainless steel member is generally used as a raw material of a solder tank, since a stainless steel member is a nonmagnetic material, it cannot supplement a leakage magnetic field.

  Further, in the technique of Patent Document 3, there is no means for blocking or supplementing the leakage magnetic field generated around the electromagnetic pump, and this leakage magnetic field has a problem of exposing the printed wiring board and the electronic components mounted thereon. . It is known that a large amount of this leakage magnetic field is generated at an end portion serving as a discharge port or a suction port of an electromagnetic pump.

  The present invention has been made to solve the above-described problems, and an object of the present invention is to mount an electronic component that further reduces the leakage magnetic field and stray current while improving the maintainability as described above. An object of the present invention is to provide a mechanism that enables electronic components to be mounted with high reliability by realizing a jet wave forming device.

  The jet wave forming apparatus for electronic component mounting according to the present invention is configured so that the magnetic field leaking from the ALIP type electromagnetic pump provided outside the solder tank does not leak into the solder so as not to cause stray current due to the alternating magnetic field. There is a feature in the composition.

  (1) That is, when one end of an annular linear induction pump (ALIP type) electromagnetic pump thrust pipe is sealed into a cap shape, the inner core inserted into the thrust pipe is attached to the axis of the inner core. A reversal flow path type in which a thrust flow path is formed between the thrust pipe and the inner core by providing a reversal flow path, and a feed flow path is formed by the thrust generation flow path and the reverse flow path When the thrust pipe of the electromagnetic linear pump (return through type annular linear induction pump) is installed on the tank wall of the solder bath, the outer core and the coil for generating the moving magnetic field are placed outside the thrust pipe. An electronic component mounting in which a reversing flow path of an inner core in which the reversing flow path is formed and an inflow port of a blower body are connected to form a jet wave of molten solder on the blower opening of the blower body. Jet wave A solder bath having a magnetic permeability of at least 100 times the magnetic permeability of the solder and having a magnetic permeability greater than or equal to the magnetic permeability of the inner core and a thickness greater than or equal to the thickness of the inner core 1 is a jet wave forming apparatus for mounting an electronic component which is made of an iron member having

  As a result, a magnetic circuit having a magnetic resistance equivalent to that of the core of the electromagnetic pump is formed in the solder bath, so that most of the magnetic field to be leaked from the electromagnetic pump passes through the solder bath, and the alternating magnetic field leaks into the solder. No longer. Therefore, stray current generated by the alternating magnetic field does not occur in the solder.

  (2) In the electronic component mounting jet wave forming apparatus according to (1), the electronic component mounting jet wave forming apparatus uses cast iron as a member of the solder tank and the inner core.

  Cast iron has a magnetic permeability of several thousand to 10,000 and has a magnetic permeability of 100 times or more that of solder or stainless steel. Therefore, most of the magnetic field leaking from the electromagnetic pump is captured and shielded by the solder bath. can do. In particular, by using cast iron having the same magnetic permeability for the inner core and the solder bath and making the thickness uniform or making the solder bath thicker, the capture of the leakage magnetic field is ensured.

  (3) In the jet wave forming apparatus for mounting electronic components according to the above (1) and (2), when an electrically insulating layer having erosion resistance against solder is formed on the surface of the iron member, the thickness thereof is 30 μm or more. 1 is a jet wave forming apparatus for mounting electronic parts formed in the above.

  Note that when an alternating magnetic field passes through a non-stratified member such as a transformer, that is, a solder bath or an inner core, an eddy current is generated in the solder bath or the inner core. For this reason, if the surface of the solder bath or the inner core is not electrically insulated, stray current may flow and spread in the solder. Therefore, the formation of stray current is prevented by forming an electrically insulating layer having erosion resistance on the surface. If this layer is subjected to solder erosion, it will not play its role, and if it is too thin, current may leak.

  According to the present invention, the ALIP type electromagnetic pump is provided outside the solder tank, and particularly the moving magnetic field generating coil is provided so as to be insertable / removable. Therefore, operations such as maintenance and replacement of the electromagnetic pump can be easily performed. .

  In addition, since the leakage magnetic field and stray current can be eliminated, it is possible to perform soldering mounting without damaging or stressing the mounted electronic components, and the electronic components can be mounted with high reliability. The effect of.

[First Embodiment]
Hereinafter, a configuration example of a jet wave forming apparatus for mounting electronic components in the present invention will be described.

  FIG. 1 is a diagram for explaining an example of the configuration of a jet wave forming apparatus for mounting electronic components according to a first embodiment of the present invention, in which a solder tank portion is shown in a longitudinal section, and a configuration of a control system is shown in a block diagram. It is.

  FIG. 2 is a perspective view illustrating the whole of the jet wave forming apparatus for mounting electronic components according to the present invention.

  FIG. 3 shows a thrust pipe provided in the solder bath of the jet wave forming apparatus for mounting electronic components according to the present invention, an inner core inserted into the thrust pipe, an outer core movably provided in the thrust pipe, and a moving magnetic field. It is a disassembled perspective view explaining the insertion / extraction relationship of the coil for generation | occurrence | production. 1 to 3, the same components are denoted by the same reference numerals.

  Hereinafter, the configuration of a jet wave forming apparatus for mounting an electronic component according to a first embodiment of the present invention will be described with reference to FIGS.

  101 is a solder bath. A heater 109 is provided in the solder bath 101 along the bath bottom and bath wall, and the solder 100 accommodated in the solder bath 101 is heated and melted to be maintained at a target temperature. Has been.

  Reference numeral 201 denotes a temperature control device that controls the temperature of the solder 100. This temperature control device 201 is a mechanism for referring to the temperature detection result of the temperature sensor 106 and controlling the power supplied to the heater 109 so that the temperature of the solder 100 becomes a temperature instructed in advance.

  A thrust pipe 302 of the ALIP type electromagnetic pump 300 is provided in the thrust pipe mounting hole 108 at the bottom of the solder tank 101. The thrust pipe 302 is attached to the thrust pipe mounting hole 108 at the bottom of the tank by a method such as welding or screwing.

  In addition, a pipe-like inner core 303 having a reversing flow path 304 at its central axis is inserted into the thrust pipe 302 so as to be freely inserted and removed. And it is comprised so that the inversion flow path 304 of this inner core 303 and the inflow port 107 of the blowing body 102 may connect.

  The blower body 102 has a current plate 105 that regulates the flow of molten solder inside, and the blower opening 103 is located on the solder liquid surface. That is, when molten solder is jetted from the blowing port 103, a jet wave 110 is formed on the blowing port and flows down the guide plate 104 provided adjacent to the blowing port 103.

  The inner core 303 and the blower body 102 are fixed to the solder bath 101 so as to be attachable / detachable by support means (not shown).

  In addition, on the outside of the thrust pipe 302, a driving body 301 in which an outer core 301a for generating a moving magnetic field between the inner core 303 and a moving magnetic field generating coil 301b is integrally formed can be rotated and inserted / removed. Is provided. The driving body 301 (the outer core 301a and the moving magnetic field generating coil 301b) forms a thrust generating flow path 305 between the thrust pipe 302 and the inner core 303, and the molten solder 100 delivered from the thrust generating flow path 305. Is fed to the blower body 102 through the reverse flow channel 304 of the inner core 303.

  In addition, by making the drive body 301 rotatable, the adhesion to the thrust pipe 302 can be improved, and the optimum magnetic field distribution can be selected to stabilize the thrust. The ALIP type electromagnetic pump 300 having this configuration is referred to as a flow-reversing type annular linear induction pump (R-ALIP type) electromagnetic pump.

  In addition, since the shape of the outer core 301a can form the column shape of the ALIP type | mold electromagnetic pump 300, the external appearance is also a column shape normally. Further, the inner core 303 is also cylindrical, and a moving magnetic field is generated in an annular space between the outer core 301a and the inner core 303, that is, a flow path. And generate suction force. Note that the ALIP type electromagnetic pump disclosed in Patent Document 1 shown in the [Background Art] column is called a straight-through type because the flow path in the pump is linear.

  This R-ALIP type electromagnetic pump (hereinafter collectively referred to as an ALIP type electromagnetic pump) is connected to a multiphase AC power supply device 202 (for example, a VVVF type three phase inverter power supply device), and generates multiphase AC power to generate a magnetic field of the electromagnetic pump. Is supplied to the coil 301b.

  Thus, in the present invention, as shown in FIG. 1, the ALIP type electromagnetic pump 300 is provided outside the bath wall of the solder bath 101, and the thrust generating flow that is located outside the bath wall of the solder bath 101 is provided. The molten solder was sucked into the passage 305, and then the molten solder to be discharged was fed into the solder bath. Therefore, the maintenance and replacement of the ALIP type electromagnetic pump 300 located outside the solder bath 101 are facilitated.

  The multiphase AC power supply device 202 has a configuration in which its output voltage, frequency, power, etc. are arbitrarily adjusted and controlled by communication with the control device 203.

  The control device 203 includes a computer system, and includes an instruction operation unit 204 such as a keyboard, a display unit 205 such as an LCD, and a CPU, ROM, RAM, hard disk, and the like (not shown). The CPU in the control device 203 can perform various controls by reading the program stored in the hard disk onto the RAM and executing it.

  The control device 203 is configured to control the operation of the above-described multiphase AC power supply device 202 according to an instruction from the instruction operation unit 204. In addition, the above-described temperature control device 201 is also configured to be controlled by arbitrarily adjusting control characteristics such as power supplied to the heater 109, temperature, and PID through communication with the control device 203.

  Note that the melting point of solder varies depending on the type of solder. For example, in a conventionally used tin-lead solder (for example, 37% lead and the balance being tin), the temperature is about 183 ° C. Moreover, it is about 199 degreeC in the lead-free solder tin-zinc solder (for example, zinc 9% and remainder is tin). Furthermore, it is about 220 ° C. for tin-silver-copper solder (for example, about 3.5% silver, about 0.7% copper, and the balance being tin).

  Therefore, depending on the type of solder used, the temperature of the solder used when soldering and mounting the printed wiring board, which is the work to be soldered, varies, but the heat resistance temperature of the electronic components mounted on the printed wiring board is taken into consideration For this reason, there are most examples of being used in the range of about 220 ° C to 260 ° C.

  For the solder bath 101 and the inner core 303, cast iron (402 and 404 in FIG. 4 described later) such as FCD-400 and FCD-500 (JIS) is used. Here, the thickness of the solder bath 101 is set to be equal to or greater than the thickness of the inner core 303. This is because the magnetic resistance is inversely proportional to the cross-sectional area. That is, by making the thickness of the solder bath 101 equal to or greater than the thickness of the inner core 303, most of the leakage magnetic field from the electromagnetic pump 300 is captured by the solder bath 101 in the thrust pipe mounting hole 108 and is contained in the solder bath 101. That is, leakage into the solder 100 can be prevented. A route indicated by a broken-line arrow 199 in FIG. 1 and FIG.

  As described above, most of the moving magnetic field from the outer core 301a of the electromagnetic pump 300 to the inner core 303 through the thrust generation passage 305 returns to the outer core 301a through the reverse route. A leakage magnetic field is likely to be generated at the end of the electromagnetic pump 300 serving as an outlet, but this can be prevented from leaking into the solder.

  Further, stainless steel conventionally used as a member of the solder bath 100 is a non-magnetic member, and solder is also a non-magnetic member (the magnetic permeability is about several tens or less at the maximum). On the other hand, the magnetic permeability of an iron member such as cast iron is about several thousand to 10,000, and the leakage magnetic field is captured by the solder bath 100 having a small magnetic resistance due to the difference of 100 times or more. Moreover, since the solder bath 101 is made of an iron member having a permeability equal to or higher than the permeability of the inner core 303 of the electromagnetic pump 300, the leakage magnetic field can be reliably captured.

  In addition, an eddy current is generated when an alternating magnetic field is passed through the conductor. Therefore, an electrical insulator layer (401 and 403 shown in FIG. 4 to be described later) having durability against solder, that is, erosion resistance is formed on the surface of the solder bath 101 and the inner core 303. Prevents eddy currents from flowing into the solder and becoming stray currents.

  As this layer, a ceramic layer, a nitride layer, an intermetallic compound layer (eg, iron-aluminum intermetallic compound), etc. can be used, but it is porous or has pores or cracks. must not. On the other hand, if the thickness is too thin, leakage current is likely to occur, and dielectric breakdown is likely to occur. Also, it is easily destroyed by erosion from the solder.

  In addition, the present inventor has found that durability of at least 5 years can be obtained if the thickness of the layer is 30 μm or more from several years of use, and a jet wave for mounting electronic components on the production site The conclusion that the durability equivalent to the overhaul time of the forming equipment can be secured was obtained.

  4A and 4B are cross-sectional views for explaining the formation of the erosion-resistant insulating layer of the solder bath 101 and the inner core 303 shown in FIG. 1, wherein FIG. 4A is a partial cross-sectional view of the solder layer, and FIG. Corresponds to a partial cross-sectional view.

  As shown in FIG. 4A, the solder tank 101 uses cast iron 402 as its member. An erosion resistant insulating layer 401 having a thickness of 30 μm or more is formed on the surface of the solder bath 101.

  As shown in FIG. 4B, the inner core 303 uses cast iron 404 as its member. An erosion resistant insulating layer 403 having a thickness of 30 μm or more is also formed on the surface of the inner core 303.

  Since the solder bath 101 touches the solder only on the inner side of the solder bath 101, the erosion-resistant insulating layer 401 may be formed only on the inner side of the solder bath 101, but may also be formed on the outer surface. . On the other hand, since all the surfaces of the inner core 303 come into contact with the solder, the erosion-resistant insulating layer 403 is formed on all the surfaces of the inner core 303.

  On the other hand, since the thrust pipe 302 needs to be made of a nonmagnetic member, a stainless steel member is usually used. Although the stainless steel member has erosion resistance, it cannot be said that the erosion resistance is necessarily sufficient for the bell-rich lead-free solder. Therefore, it is preferable to use titanium that is further excellent in erosion resistance.

  The magnetic susceptibility of titanium is the same as that of aluminum and is a non-magnetic member. The thermal conductivity of titanium is 17 [W / m · K], and the thermal conductivity of stainless steel (SUS304) is equivalent to 16 [W / m · K]. For reference, the electrical resistivity of titanium is 0.55 [μΩ · m], and the electrical resistivity of stainless steel (SUS304) is equivalent to 0.72 [μΩ · m]. The electrical resistivity of tin used for tin-rich lead-free solder is 0.12 [μΩ · m], and the electrical resistivity of copper is 0.017 [μΩ · m]. The specific resistance is 5 to 30 times that of tin-rich lead-free solder and copper. Therefore, it can be said that the thrust pipe 302 is preferably made of a titanium material from the viewpoint of conducting the heat loss derived from the drive resistance 301 to the solder and cooling the drive body 301 to effectively use the heat loss.

  Although the moving magnetic field directly penetrates through the thrust pipe 302, it is configured not to be located on the inner surface of the solder tank like the solder tank 101 itself or the inner core 303, so that an overcurrent generated in the thrust pipe 302 is not generated. The stray current hardly spreads in the solder 100 in the solder bath 101. However, in order to prevent erosion by the solder 100 and to completely prevent the eddy current from spreading as a stray current, the thrust pipe 302 is also provided with an electrically insulating layer that is erosion resistant to the solder. It is also significant to form.

  As described above, according to the jet wave forming apparatus for mounting an electronic component of the present embodiment, the ALIP electromagnetic pump 300 is provided outside the solder bath 101, and in particular, the moving magnetic field generating coil 301b is provided so as to be freely inserted and removed. Therefore, operations such as maintenance and replacement of the electromagnetic pump can be easily performed.

  Further, the solder bath 101 has a magnetic permeability of at least 100 times the magnetic permeability of the solder, and has a magnetic permeability that is equal to or higher than the magnetic permeability of the inner core 303, and a thickness that is equal to or greater than the thickness of the inner core 303. Because it is made of an iron member that has a magnetic field, it is possible to eliminate the leakage magnetic field and stray current, and it is possible to perform the soldering mounting without damaging or stressing the mounted electronic component, and the mounting of the electronic component is high. Can be done in reliability.

[Second Embodiment]
Hereinafter, with reference to FIG. 5, the structure of the electronic component mounting jet wave forming apparatus according to the second embodiment of the present invention will be described.

  FIG. 5 is a view for explaining an example of the configuration of a jet wave forming apparatus for mounting electronic components according to a second embodiment of the present invention, in which a solder bath portion is shown in a longitudinal section, and a configuration of a control system is shown in a block diagram. It is. In addition, the same code | symbol is attached | subjected to the same thing as FIG. In addition, the difference between the configuration of the present embodiment and the configuration of the first embodiment shown in FIG. 1 is to increase the volume of the solder bath without changing the maximum dimension of the electronic component mounting jet wave forming device. The recess 111 is provided so that the driver 301 (the outer core 301a and the moving magnetic field generating coil 301b) can be fitted into the bottom of the solder bath 101.

  Further, with such a configuration, heat loss generated in the electromagnetic pump 300 is not only from the thrust generation flow path 305 but also from the driving body 301 (the external core 301a and the moving magnetic field generating coil 301b) and the solder tank 101 and the inside thereof. It is possible to directly conduct to the solder 100 and to increase the overall energy efficiency as seen in the entire soldering apparatus.

  Furthermore, since the entire electromagnetic pump 300 is covered with the solder tank 101, which is an iron member, the generation of a leakage magnetic field can be more reliably prevented.

  By increasing the volume of the solder bath 101 and increasing the amount of solder accommodated, it becomes possible to reduce the amount of decrease in the solder temperature when the work to be soldered comes into contact with the jet wave. There is an advantage that the solder temperature can be stably maintained during production.

  As described above, the jet wave forming apparatus for mounting an electronic component according to the present invention is configured so that the magnetic field leaking from the ALIP electromagnetic pump 300 provided outside the solder bath 101 does not leak into the solder, and the alternating magnetic field. It is characterized in that it is configured not to generate stray current due to.

  First, one end of the thrust pipe of an annular linear induction pump (ALIP type) electromagnetic pump 300 is sealed to form a cap shape, and at the same time, the inner core 303 is inserted into the axial core of the thrust pipe 302. A reverse flow path 304 is provided along the thrust pipe 302 and the inner core 303 to form a thrust generation flow path 305, and the thrust generation flow path 305 and the reverse flow path 304 form a feed flow path. When the thrust pipe 302 of the reverse flow type annular linear induction pump (R-ALIP type) electromagnetic pump 300 is provided on the bath wall of the solder bath 100, the outer core 301a and the movement A magnetic field generating coil 301b (driving body 301) is mounted on the outside of the thrust pipe 302, and a reversal of the inner core 303 in which a reversal channel 304 is formed. An electronic component mounting jet wave forming device in which a path 304 and an inlet 107 of the blower body 102 are connected to form a jet wave 110 of molten solder on the blower opening 103 of the blower body 102, and The solder bath 101 has a magnetic permeability that is at least 100 times the magnetic permeability of the solder, and has a magnetic permeability that is equal to or higher than the magnetic permeability of the internal core 303, and a thickness that is equal to or greater than the thickness of the internal core 303. It consists of an iron member.

  With this configuration, a magnetic circuit having a magnetic resistance equivalent to that of the core of the electromagnetic pump 300 is formed in the solder bath 101, and most of the magnetic field to be leaked from the electromagnetic pump 300 passes through the solder bath 300. Magnetic field will not leak into the solder. Therefore, stray current generated by the alternating magnetic field does not occur in the solder.

  Further, in the jet wave forming apparatus for mounting an electronic component having the above-described configuration, cast iron is used as a member for the solder bath 101 and the inner core 303. The magnetic permeability of cast iron is about several thousand to 10,000 and has a permeability of 100 times or more that of solder or stainless steel member. Therefore, most of the magnetic field to be leaked from the electromagnetic pump 300 is captured by the solder bath. Can be shielded. In particular, by using cast iron having the same magnetic permeability for the inner core 303 and the solder bath 101, and by making the thickness uniform or the solder bath thicker, the capture of the leakage magnetic field is ensured.

  Furthermore, in the jet wave forming apparatus for mounting electronic components according to each of the above configurations, an electrical insulating layer having corrosion resistance to solder is formed on the surface of the iron member, and the thickness thereof is formed to be 30 μm or more. And

  When an alternating magnetic field passes through a member that is not layered, such as a transformer, that is, the solder bath 101 and the inner core 303, an eddy current is generated in the solder bath 101 and the inner core 303. For this reason, if the surface of the solder bath or the inner core is not electrically insulated, stray current may flow and spread in the solder. Therefore, the formation of stray current is prevented by forming an electrically insulating layer having erosion resistance on the surface. If this layer is subjected to solder erosion, it will not play its role, and if it is too thin, current may leak.

  The electronic component mounting jet wave forming apparatus according to the present invention is used when an electronic component is soldered and mounted on a printed wiring board. According to the present invention, the maintenance downtime of the jet wave forming apparatus for mounting electronic components can be shortened, and high-reliability soldering mounting that does not affect the electronic components due to leakage magnetic field or stray current can be realized with high productivity. Will be able to.

It is a figure explaining an example of composition of a jet wave formation device for electronic parts mounting showing a 1st embodiment of the present invention. It is a perspective view explaining the whole picture of the jet wave formation device for electronic parts mounting of the present invention. The thrust pipe provided in the solder tub of the jet wave forming apparatus for electronic component mounting according to the present invention, the inner core inserted into the thrust pipe, the outer core detachably provided in the thrust pipe, and the moving magnetic field generating coil It is a disassembled perspective view explaining the insertion / extraction relationship. It is sectional drawing explaining formation of the erosion-resistant insulating layer of the solder tank shown in FIG. 1, and an inner core. It is a figure explaining an example of the composition of the jet wave formation device for electronic parts mounting showing a 2nd embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 Solder 101 Solder tank 106 Temperature sensor 109 Heater 201 Temperature control apparatus 202 Multiphase alternating current power supply device 203 Control apparatus 204 Instruction operation part 300 Inverted ALIP type electromagnetic pump 301 Driver 301a External core 301b Coil for moving magnetic field 302 Thrust pipe 303 Inner core 304 Reversing flow path 305 Thrust generating flow path 401, 403 Electrical insulation layer 402, 404 Cast iron

Claims (3)

A jet wave for mounting electronic components, in which molten solder contained in a solder bath is subjected to a discharge force by an annular linear electromagnetic pump to cause the molten solder to jet from the blower body and to form a jet wave on the blower. A forming device,
In the annular linear electromagnetic pump, one end of the thrust pipe of the annular linear electromagnetic pump is sealed into a cap shape, and the reverse flow is performed along the axis of the inner core inserted inside the thrust pipe. By providing a path, a thrust generation flow path is formed between the thrust pipe and the inner core, and a flow path reversal type annular linear is formed by the thrust generation flow path and the reverse flow path. Further, the thrust pipe is connected to a hole provided in the tank wall of the solder tank, and an outer core and a moving magnetic field generating coil of the annular linear electromagnetic pump are disposed outside the thrust pipe. And the inversion channel and the inflow port provided in the blowing body are connected to each other,
The solder bath has a magnetic permeability of at least 100 times the magnetic permeability of the solder, has a magnetic permeability of the internal core or higher, and has a thickness of the internal core or more. A jet wave forming apparatus for mounting an electronic component, characterized by comprising an iron member.   2. A jet wave forming apparatus for mounting electronic components according to claim 1, wherein cast iron is used as a member of the solder bath and the inner core.   3. The thickness of the solder bath and the inner core is formed to be 30 μm or more in addition to the formation of an electrically insulating layer having erosion resistance against the solder. Jet wave forming device for electronic component mounting.

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