JP3927991B2 - Induction heating cooker - Google Patents

Description

  The present invention relates to an induction heating cooker, and more particularly to an induction heating cooker having a cooling device for cooling a circuit component that supplies a large current to an electromagnetic induction heating coil.

  The induction cooking device is highly safe because it uses a heating coil (electromagnetic induction coil) to form an eddy current at the bottom of the pan without using a flame, thereby heating the pan itself. Moreover, the induction heating cooker is a very excellent cooking utensil because it has high thermal efficiency and can save time and cost for cooking. For this reason, induction heating cookers have become more and more popular in recent years, with the momentum surpassing conventional gas cookers.

  Here, with reference to FIG. 26, for example, a conventional induction heating cooker disclosed in Patent Document 1 will be described below. The induction heating cooker 101 includes a heating coil 103 disposed substantially in the center of the housing 102, a blower fan 104 disposed at a corner portion, and a duct portion 105 covering the heating fan 103. Furthermore, the induction heating cooker 101 includes a power transistor 112 disposed near the discharge ports 110a and 110b of the duct portion 105, a rectifying power component 114, cooling fins 116 and 118 fixed thereto, and a frequency converter 120. Have FIG. 26 is a plan view after a top plate (not shown) is removed.

Since the power transistor 112 and the rectifying power component 114 process a large current supplied to the heating coil 103, the amount of heat generated during driving is significant. Therefore, in order for these parts 112 and 114 to function properly, it is necessary to cool them sufficiently by applying cooling air (airflow) to the cooling fins 116 and 118 described above.
Japanese Patent Laid-Open No. 62-17985

  However, the duct portion 105 covers the blower fan 104 but does not cover the power transistor 112 including the cooling fins 116 and 118, the rectifying power component 114, and the frequency conversion device 120, so that the cooling air discharged from the duct portion 105 is covered. Is blown (impacts) on the power transistor 112 and the rectifying power component 114 including the cooling fins 116 and 118, but most of the wind after colliding with these diffuses in all directions and cannot contribute to cooling. Therefore, in order to guarantee the normal function of the parts 112 and 114, it is necessary to increase the rotation speed of the blower fan 104. As a result, it is extremely difficult to reduce the noise caused by the high-speed rotation of the blower fan 104. It was.

  Therefore, the present invention has been made to solve these problems, and an induction heating cooker that substantially reduces noise generated by a blower fan by efficiently cooling a component that generates a large amount of heat, such as a power transistor. It aims at realizing.

  An induction heating cooker according to one aspect of the present invention includes a top plate, a heating coil disposed below the top plate, and a display unit disposed below the top plate so as to be visible from above. A wiring substrate, first and second circuit components mounted on the wiring substrate, a heat sink fixed to the first circuit component, the first and second circuit components, and the heat sink. A chamber including an air inlet and an air outlet, and a blower fan that supplies air to the air inlet of the chamber to form an air flow in the chamber, and the second circuit component includes the second circuit component. An airflow that is arranged on the downstream side of the airflow of one circuit component and is exhausted from the chamber is supplied to the display unit.

  According to the induction heating cooker of the present invention, by suppressing the amount of airflow (airflow) necessary to cool the first and second circuit components, the heat sink, and the display unit as much as possible, a blower fan (blower motor). The number of rotations can be reduced and the noise caused by these high-speed rotations can be substantially reduced.

Hereinafter, reference examples and embodiments of an induction heating cooker according to the present invention will be described with reference to the accompanying drawings. In the description of each reference example and embodiment, terms for indicating directions (for example, “upward”, “downward”, “right side”, “left side”, etc.) are used as appropriate for easy understanding. These terms are not intended to limit the invention.

Reference Example 1
Induction cooking devices are generally divided into two types: a type that is installed on a table as shown in FIG. 1 (stationary type) and a type that is incorporated into a system kitchen as shown in FIG. 8 (built-in type). However, the basic structure is the same in both cases. Here, Reference Example 1 will be described in detail below with reference to the stationary induction cooking device shown in FIGS. In FIG. 1, which is a perspective view of a stationary induction heating cooker according to Reference Example 1, the induction heating cooker 1 generally includes a top plate 4 made of glass or the like, a grill portion 5, a dial-type thermal power adjustment portion 6, and a display. A portion 7 and a vent hole 9 are provided. Moreover, the induction heating cooker 1 generates heat in the pan itself by forming an eddy current at the bottom of the pan and a heat radiation heater RH (Radiant Heater) that radiates heat generated by flowing an electric current through the electric resistance member to the pan. And an electromagnetic induction heater IH (Induction Heater). Each of the heat radiation heater RH and the electromagnetic induction heater IH has unique characteristics, and the induction heating cooker 1 that combines the different types of heaters is called a “combination heating type”.

  FIG. 2 is a plan view after the top plate of the induction heating cooker of FIG. 1 is removed. In FIG. 2, the induction heating cooker 1 includes an electric resistance member 11 supported on a support plate 10 and an electromagnetic induction coil 12 (hereinafter simply referred to as “heating coil”).

  Each of the cooling devices for the electric circuit components that drive the electric resistance member 11 and the heating coil 12 is disposed below the support plate 10. However, the present invention is not limited to the cooling of the heating coil 12 and the electric circuit components that drive the heating coil 12. Since it relates to the apparatus, a description of the cooling device for the heat radiation heater RH will be omitted. Note that a part of the support plate 10 may constitute the top plate of each cooling device described above.

3 is a perspective view of the cooling device according to Reference Example 1, FIG. 4 is a side sectional view taken along line IV-IV in FIG. 3, and FIG. 5 is a front sectional view seen from line VV in FIG. FIG. 6 is a plan view when the top plate of the cooling device of FIG. 3 is removed. In FIG. 3, the cooling device 20 according to the reference example 1 schematically includes a wiring board 22, a chamber 24 disposed thereon, and a fan hood 26. On the wiring board 22, as shown in FIG. 4A, a switching element for supplying a large current to the heating coil 12 and a first circuit component 28 that generates a large amount of heat, such as a diode bridge (power module), and the like Similarly, a second circuit component 30 having a large calorific value, such as a capacitor, is mounted. Further, a heat sink 32 for increasing the heat transfer coefficient is fixed on the first circuit component 28. As shown in FIG. 5A, the heat sink 32 has a plurality of cooling fins 33 extending upward to further enhance the heat dissipation effect. 4A, the chamber 24 disposed on the wiring board 22 has an intake port 34 and an exhaust port 36, and accommodates the first and second circuit components 28, 30 between the wiring board 22. To do. The fan hood 26 includes a blower fan 27 therein, and when the blower fan 27 is rotated by a blower motor (not shown), air is taken into the interior of the fan hood 26 from below as indicated by an arrow, and the chamber 24 is discharged from the blowout port 37. The airflow (wind) is sent to the intake port 34 of the engine. In this way, an air flow is formed in the air path formed between the wiring board 22 and the chamber 24.

  According to the cooling device 20 of the present invention, as shown in FIGS. 4A and 5A, the chamber 24 has a height H in a direction perpendicular to the surface of the wiring board 22 and the surface of the wiring board 22. It has a width W in a direction parallel to and perpendicular to the longitudinal direction from the air inlet 34 to the air outlet 36. At this time, the width W of the chamber 24 is configured to be substantially the same as the width of the heat sink 32 in the cross section where the heat sink 32 is disposed. Alternatively, the chamber 24 and the cooling fins 33 adjacent thereto are arranged so that the gap ΔW is at most 5 mm or less, more preferably 1 mm or less.

  The airflow flowing in the chamber 24 configured in this way flows intensively along the heat sink 32 (and the cooling fins 33) in the chamber 24 without diffusing in all directions, and these can be radiated extremely efficiently. In this way, it is possible to substantially reduce the amount of air flow (air volume) necessary to ensure the normal operation of the first circuit component 28 with a large heat generation amount to which the heat sink 32 is fixed. As a result, the rotational speeds of the blower fan 27 and the blower motor can be reduced, and noise due to these high-speed rotations can be considerably reduced.

  Similarly, as shown in FIGS. 4B and 5B, the height H of the chamber 24 is configured to be substantially the same as the height of the heat sink 32 in the cross section where the heat sink 32 is disposed. It is preferred that Alternatively, the chamber 24 and the cooling fin 33 are preferably arranged so that the gap ΔH is at most 5 mm or less, more preferably 1 mm or less. In the chamber 24 configured in this manner, the amount of airflow flowing between the cooling fins 33 can be further increased, and the cooling effect on the heat sink 32 can be further improved.

  4 and 6, the first and second circuit components 28 and 30 are accommodated in the chamber 24, and the second circuit component 30 is located downstream of the first circuit component 28 in the air flow. Since the first circuit component 28 such as a power module that generates the most heat and needs to be sufficiently cooled is preferentially cooled, the second circuit such as a capacitor is used by using the same airflow. The component 30 can be cooled. Therefore, the cooling effect by the predetermined air flow rate can be utilized to the maximum, and the minimum necessary air flow rate can be easily determined.

  In FIG. 6, the cooling fins 33 are illustrated so as to extend in parallel to the longitudinal direction from the intake port 34 to the exhaust port 36, but the shape of the cooling fins 33 is not limited to this. For example, as shown in FIG. 7, you may extend so that it may incline with respect to a longitudinal direction. Thus, by causing the airflow to collide with the cooling fins 33 at a predetermined angle, the jet collision cooling effect is obtained, so that the cooling fins 33 can be cooled more efficiently.

Reference Example 2
Next, Reference Example 2 will be described in detail below with reference to the built-in induction heating cooker shown in FIGS. In FIG. 8, the induction heating cooker 2 generally includes a top plate 4 made of glass or the like, a grill portion 5, a dial-type thermal power adjustment portion 6, first and second display portions 7 and 8, and a vent hole 9. Is provided. The induction heating cooker 2 is called “double IH type” because it has two electromagnetic induction heaters IH on the right and left sides in addition to one heat radiation heater RH arranged in the center back.

FIG. 9 is a plan view after the top plate 4 of the induction heating cooker 2 of FIG. 8 is removed, and FIG. 10 is a plan view of the cooling devices 20a and 20b shown in FIG. FIG. 11 is a side sectional view taken along line XI-XI in FIG. 10. As shown in FIG. 9, one electric resistance member 11 and two heating coils 12 a and 12 b are arranged on the support plate 10. Similarly, as shown in FIG. 10, cooling devices 20 a and 20 b corresponding to the heating coils 12 a and 12 b are provided below the support plate 10. Each of the cooling devices 20a and 20b according to the reference example 2 has the same configuration as that of the cooling device 20 according to the reference example 1, and therefore, the description of the overlapping contents is omitted. Similarly, the description regarding the cooling device for the heat radiation heater RH is omitted here.

As shown in FIG. 10, each cooling device 20a, 20b according to Reference Example 2 includes chambers 24a, 24b that form air passages, including air inlets 34a, 34b communicating with the air outlet 37 of one fan hood 26. . The airflow (wind) formed by one cooling fan 27 flows into these two air paths. (In FIG. 10, the chambers 24a and 24b from which the top plate has been removed are shown.) In FIG. 10, the cooling devices 20a and 20b are arranged in a plane region from the air inlets 34a and 34b to the wiring boards 22a and 22b. A bottom plate 38 as shown in FIG. 11 is provided. Alternatively, instead of providing the bottom plate 38, each cooling device 20a, 20b may share one continuous wiring board. And each cooling device 20a, 20b has the same structure except that the distance to the heat sink 32 is relatively longer from one to the other, so the cooling device 20a arranged on the right side of FIG. 10 will be described below. .

The cooling device 20a according to the reference example 2 includes a partition wall 40 disposed between the heat sink 32 and the second circuit component 30, as shown in FIG. Similarly, the partition wall 40 is connected to the wall portion 41 constituting the chamber 24a at one end, and is located downstream of the first circuit component 28 and upstream of the second circuit component 30. A partition opening 42 is provided at the end. That is, the first and second circuit components 28 and 30 are disposed on the right side and the left side with respect to the partition wall 40 in the chamber 24a. At this time, after the airflow sent from the air inlet 34a of the chamber 24a flows along the heat sink 32 (and the first circuit component 28) in the direction indicated by the arrow A in the plan view of FIG. 10 and the cross-sectional view of FIG. Controlled by the partition wall 40 and the end wall 44 of the chamber 24a, the air flow direction is changed by approximately 180 ° in the direction indicated by the arrow B in the plan view of FIG. 10 and flows along the second circuit component 30. That is, the air path of the cooling device 20a according to the reference example 2 is configured to change the direction by about 180 ° by providing the partition wall 40.

According to the cooling device 20 a configured as described above, the first and second circuit components 28 and 30 are accommodated in the chamber 24 a and the second circuit component 30 is the same as the cooling device 20 according to the first reference example. Is disposed downstream of the first circuit component 28 in the air flow, the second circuit component 30 can be cooled using the same air flow after the first circuit component 28 is cooled. Thus, the cooling effect by the predetermined air flow rate can be utilized to the maximum extent.

Further, the cooling device 20 according to the reference example 1 has a structure elongated in a predetermined longitudinal direction as shown in FIG. 6, whereas the cooling device 20a according to the reference example 2 has an air flow direction as shown in FIG. Therefore, the cooling device 20a can be configured in an arbitrary shape. In other words, the cooling device 20a according to the reference example 2 has a direction in which the airflow flowing along the first circuit component 28 flows along the second circuit component 30 as compared with the cooling device 20 according to the reference example 1. Since it is designed to be substantially different from the direction, the limited space in the induction heating cooker 2 can be utilized more effectively and flexibly.

Similar to the reference example 1, according to the cooling device 20a of the reference example 2, the width of the heat sink 32 disposed between the partition wall 40 and the side wall 46 of the chamber 24a is substantially equal to the distance from the partition wall 40 to the side wall 46 of the chamber 24a. The partition 40 is arranged so that the gaps between the partition 40 and the side wall 46 and the heat sink 32 are at most 5 mm or less, more preferably 1 mm or less. Thus, the airflow flowing in the chamber 24a flows intensively along the heat sink 32 (and the cooling fins 32) in the chamber 24a without diffusing in all directions, and these can be radiated extremely efficiently. As a result, it is possible to substantially reduce the amount of airflow (airflow) necessary to ensure the normal operation of the first circuit component 28, and by reducing the rotational speed of the blower fan 27 and the blower motor, Noise due to these high speed rotations can be considerably reduced.

Similar to Reference Example 1, although the height H of the chamber 24a is not shown in detail, it is preferable that the height H of the chamber 24a be substantially the same as the height of the heat sink 32 in the cross section where the heat sink 32 is disposed. Thus, the amount of airflow flowing between the cooling fins 32 can be further increased, and the cooling effect on the heat sink 32 can be further improved.

Embodiment 1 FIG.
The first embodiment according to the present invention will be described in detail below with reference to FIGS. The cooling device of Embodiment 1 is the same as the cooling device of Reference Example 2 except that the exhaust port of the chamber is formed on the top plate of the chamber above the second circuit component and below the heating coil. The description of the overlapping contents is omitted.

12 is a plan view of the cooling device according to Embodiment 1 , and FIG. 13 is a plan view after the top plate of the chamber shown in FIG. 12 is removed. FIG. 14 is a sectional view taken along line XIV-XIV in FIG. As described above, in the cooling devices 20a and 20b of the first embodiment, the exhaust ports 36a and 36b of the chambers 24a and 24b are disposed below the heating coil 12 as shown in FIGS. 30 is disposed on a top plate 25 located above 30. According to the thus configured cooling devices 20a and 20b, the heating coil 12 can be further cooled using the airflow exhausted from the exhaust ports 36a and 36b.

  FIGS. 15 and 16 are similar to FIGS. 12 and 14, respectively, and show alternative exhaust ports. Instead of the single exhaust port 36a, 36b shown in FIGS. 12 and 14, a plurality of small holes 48a, 48b shown in FIGS. 15 and 16 may be formed. A plurality of small holes 48a and 48b having a smaller diameter than the exhaust ports 36a and 36b are provided to form a jet. When the jet collides with the heating coil 12, a remarkably excellent cooling effect (impact jet cooling effect) is obtained, so that the heating coil 12 can be cooled more efficiently.

  FIG. 17 is a view similar to FIG. 12 and shows an alternative exhaust port. And as shown in FIG. 17, the cooling effect by a jet flow is controlled by changing the diameter of the small hole 48 toward the airflow downstream side, and the heating coil 12 can be cooled. Alternatively, although not shown, the same effect can be obtained by changing the formation density of the small holes 48 on the upstream side of the airflow with the formation density on the downstream side of the airflow.

  Incidentally, the second display unit 8 (see FIGS. 8 and 18) such as a liquid crystal display or an LED indicator that can be visually recognized from above the top plate 4 does not generate a large amount of heat, but the heating coil 12 and Since it arrange | positions in the position adjacent to the pan (not shown) heated on it, it is heated considerably by the radiant heat from these. Therefore, the airflow exhausted from the exhaust ports 36a and 36b formed in the chamber top plate 25 is guided and supplied to the second display unit 8 through a duct (tube) 50 as shown in FIG. This can be efficiently cooled.

In the above context, the heating coil 12 and the second display unit 8 can be said to be cooled parts that require cooling. According to the cooling devices 20a and 20b according to the first embodiment, the heating coil 12 and the second display unit 8 are exhausted from the exhaust ports 36a and 36b. These airflows can be guided to the parts to be cooled to cool them.

Reference Example 3
Reference Example 3 according to the present invention will be described in detail below with reference to FIGS. The cooling device of Reference Example 3 further includes a point where the wiring substrate has a substrate opening between the first and second circuit components, and a back chamber disposed on the back surface of the wiring substrate and communicating with the substrate opening. Except for this point, the configuration is the same as that of the cooling device of Reference Example 2 , and thus the description of the overlapping contents is omitted.

  The first circuit component 28 that generates a large amount of heat, such as a power module for supplying a large current to the heating coils 12a and 12b, transmits a large amount of heat not only to the heat sink 32 but also to the wiring boards 22a and 22b. Therefore, like the heat sink 32 on the front surface side of the wiring boards 22a and 22b, it is extremely preferable to provide means for radiating heat from the wiring boards 22a and 22b on the back surface side.

FIG. 19 is a plan view after the top plate of the chamber of the cooling device according to Reference Example 3 is removed, and FIG. 20 shows a modification thereof. FIG. 21 is a sectional view taken along line XXI-XXI in FIG. The cooling devices 20a and 22b of Reference Example 3 provide one means for supplying an airflow that flows along the back surfaces of the wiring boards 22a and 22b. That is, in FIG. 19 or FIG. 20, as described above, the wiring boards 22a, 22b have the board openings 52a, 52b between the first and second circuit components 28, 30, and the board openings 52a, 52b, A back chamber 54 (see FIG. 21) communicating with 52b is formed. The back chamber 54 includes a wall portion (not shown) provided at the same position as the partition wall 40, the end wall 44, and the side wall 46 on the back surface of the wiring boards 22a and 22b, and the back surface indicated by a broken line in FIG. It is comprised by end wall 56a, 56b and the baseplate 58 shown in FIG.

  In the cooling devices 20 a and 20 b configured as described above, the airflow that flows along the first circuit component 28 collides with the end wall 44, and a part thereof flows toward the second circuit component 30. The other part flows into the back chamber 54 through the substrate openings 52a and 52b. Thus, the back surfaces of the wiring boards 22a and 22b can be efficiently cooled by the airflow flowing into the back chamber 54.

Reference Example 4
Reference Example 4 according to the present invention will be described in detail below with reference to FIGS. The cooling device of Reference Example 4 has the same configuration as that of the cooling device of Reference Example 2 except that it further includes a back chamber that communicates with the air inlet. That is, the cooling device of Reference Example 4 provides another means for forming an airflow that flows along the back surface of the wiring board.

FIG. 22 is a view similar to FIG. 11 of the cooling device according to Reference Example 4 , and shows a back chamber 60 different from Reference Example 3 communicating with the air inlet of the chamber, and FIG. 23 is a line XXII-XXII in FIG. It is sectional drawing seen from. 24 is a view similar to FIG. 23 and shows a modification of the back chamber 60 shown in FIG. The back surface chamber 60 shown in FIGS. 22 and 23 communicates with the air inlet 34 of the chamber 24, and as shown in FIG. 19 of Reference Example 3 , on the back side of the wiring substrate 22a, the partition wall 40, the end wall 44, and the side wall 46 It is comprised by the wall part (not shown) provided in the same position, and the baseplate 58 as shown in FIG. In the cooling device 20a configured in this manner, the airflow formed by the blower fan 27 flows above the wiring board 22a and also flows into the back surface chamber 60 below the wiring board 22a. Thus, the back surface of the wiring board 22a can be efficiently cooled by the airflow flowing through the back surface side air passage formed by the back surface chamber 60. At this time, by adjusting the distance between the wiring board 22a and the bottom plate 58, the air flow rate flowing into the back chamber 60 can be controlled.

  In FIG. 23, the back surface chamber 60 is shown to have the same width as the front surface chamber 24a of the wiring board 22a. In particular, the wiring board 22a is disposed at the position where the first circuit component 28 is mounted. Since it needs to be cooled, as shown in FIG. 24, the width of the back surface chamber 60 can be made narrower at this position to increase the speed of the airflow and improve the cooling effect. In this way, the air flow rate can be reduced as much as possible, the rotational speed of the blower fan 27 can be reduced, and the noise can be substantially reduced.

Reference Example 5
Reference Example 5 according to the present invention will be described in detail below with reference to FIG. As shown in FIG. 25, the induction heating cooker 2 of Reference Example 5 includes at least two cooling devices 20a and 20b, and the exhaust port of one cooling device 20a communicates with the intake port of the other cooling device 20b. Except for the above, the configuration is the same as that of the cooling devices 20a and 20b of Reference Example 2 , and therefore, the description of the overlapping contents is omitted.

  The induction heating cooker 2 configured in this way can cool another cooling device 20b using the same airflow after cooling one cooling device 20a. Thus, the cooling effect by the predetermined airflow can be maximized and the air flow rate can be suppressed as much as possible, so that the noise from the blower fan 27 can be minimized.

It is a perspective view of the stationary induction heating cooking appliance by the reference example 1. FIG. It is a top view after removing the top plate of the induction heating cooking appliance of FIG. It is a perspective view of the cooling device by the reference example 1. FIG. (A) is side surface sectional drawing seen from the IV-IV line of FIG. 3, (b) shows the modification. (A) is front sectional drawing of FIG. 3 seen from the VV line | wire of FIG. 3, (b) shows the modification. It is a top view when the top plate of the cooling device of FIG. 3 is removed. The modification of the cooling fin shown in FIG. 6 is shown. It is a perspective view of the built-in type induction heating cooking appliance by the reference example 2. FIG. It is a top view after removing the top plate of the induction heating cooking appliance of FIG. It is a top view of the cooling device by the reference example 2, Comprising: It is a top view when the top plate is removed. It is side surface sectional drawing seen from the XI-XI line of FIG. It is a top view of the cooling device by Embodiment 1 , Comprising: The exhaust port formed in the top plate of a chamber is shown. It is the same figure as FIG. 12, Comprising: It is a top view after removing the top plate of a chamber. Sectional drawing seen from the XIV-XIV line | wire of FIG. 13 is shown. It is a figure similar to FIG. 12, Comprising: An alternative exhaust port is shown. FIG. 15 is a view similar to FIG. 14, showing an alternative exhaust port. It is a figure similar to FIG. 12, Comprising: An alternative exhaust port is shown. It is the same figure as FIG. 14, Comprising: The duct part which guides airflow to the 2nd display part is shown. It is a top view after removing the top plate of the chamber of the cooling device by the reference example 3 , Comprising: A board | substrate opening part is shown. FIG. 20 is a view similar to FIG. 19 showing an alternative substrate opening. FIG. 12 is a view similar to FIG. 11 showing the back chamber. It is a figure similar to FIG. 11 of the cooling device by the reference example 4 , Comprising: A back surface chamber is shown. It is sectional drawing seen from the XXII-XXII line | wire of FIG. 10, Comprising: A back surface chamber is shown. FIG. 24 is a view similar to FIG. 23 showing an alternative backside chamber. It is a top view after removing the top plate of the chamber of the cooling device by reference example 5 . It is a top view after removing the top plate of the housing | casing of the cooling device by a prior art.

Explanation of symbols

1, 2: Induction heating cooker, 4: Top plate, 5: Grill part, 6: Dial type thermal power adjustment part, 7, 8: Display part, 9: Vent, 10: Support plate, 11: Electric resistance member, 12: heating coil (electromagnetic induction coil), 20: cooling device, 22: wiring board, 24: chamber, 25: top plate, 26: fan hood, 27: blower fan, 28: first circuit component, 30: first 2 circuit parts, 32: heat sink, 33: cooling fin, 34: air inlet, 36: air outlet, 37: air outlet, 38: bottom plate, 40: partition wall, 42: partition wall opening, 44: end wall, 46: Side wall, 48: small hole, 50: duct, 52: substrate opening, 54: back chamber, 56: back end wall, 58: bottom plate, 60: back chamber.

Claims (3)

An induction heating cooker,
A top plate;
A wiring board;
First and second circuit components mounted on the wiring board;
A heat sink fixed to the first circuit component;
A chamber containing the first and second circuit components and the heat sink and having an air inlet and an air outlet;
A heating coil disposed below the top plate and over the chamber;
A display unit disposed below the top plate so as to be visible from above adjacent to the heating coil,
A blower fan that supplies air to the inlet of the chamber and forms an air flow in the chamber;
The second circuit component is disposed on the downstream side of the air flow of the first circuit component,
The first and second circuit components are cooled and the air flow exhausted from the exhaust port of the chamber is raised from below the display unit toward the display unit, so that the air flow is applied to the back surface of the display unit. Induction heating cooker featuring. Providing a duct for guiding the airflow exhausted from the chamber;
The induction heating cooker according to claim 1, wherein the display unit is provided between the top plate and the duct unit.   The induction heating cooker according to claim 1, further comprising a duct for guiding the airflow exhausted from the chamber to the back surface of the display unit.

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