JP3915870B2 - 高分子化合物、化学増幅レジスト材料及びパターン形成方法 - Google Patents
高分子化合物、化学増幅レジスト材料及びパターン形成方法 Download PDFInfo
- Publication number
- JP3915870B2 JP3915870B2 JP2000249269A JP2000249269A JP3915870B2 JP 3915870 B2 JP3915870 B2 JP 3915870B2 JP 2000249269 A JP2000249269 A JP 2000249269A JP 2000249269 A JP2000249269 A JP 2000249269A JP 3915870 B2 JP3915870 B2 JP 3915870B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- carbon atoms
- derivatives
- acid
- bis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 0 CC=C*O[N+](C(C)=*C)[O-] Chemical compound CC=C*O[N+](C(C)=*C)[O-] 0.000 description 1
Landscapes
- Materials For Photolithography (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Addition Polymer Or Copolymer, Post-Treatments, Or Chemical Modifications (AREA)
- Photosensitive Polymer And Photoresist Processing (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2000249269A JP3915870B2 (ja) | 1999-08-25 | 2000-08-21 | 高分子化合物、化学増幅レジスト材料及びパターン形成方法 |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11-238793 | 1999-08-25 | ||
| JP23879399 | 1999-08-25 | ||
| JP2000249269A JP3915870B2 (ja) | 1999-08-25 | 2000-08-21 | 高分子化合物、化学増幅レジスト材料及びパターン形成方法 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2001133979A JP2001133979A (ja) | 2001-05-18 |
| JP2001133979A5 JP2001133979A5 (enExample) | 2004-10-28 |
| JP3915870B2 true JP3915870B2 (ja) | 2007-05-16 |
Family
ID=26533898
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2000249269A Expired - Lifetime JP3915870B2 (ja) | 1999-08-25 | 2000-08-21 | 高分子化合物、化学増幅レジスト材料及びパターン形成方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3915870B2 (enExample) |
Families Citing this family (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6461789B1 (en) * | 1999-08-25 | 2002-10-08 | Shin-Etsu Chemical Co., Ltd. | Polymers, chemical amplification resist compositions and patterning process |
| TW588220B (en) * | 2000-04-04 | 2004-05-21 | Daikin Ind Ltd | Novel fluorine-containing polymer having group reactive with acid and chemically amplifying type photo resist composition prepared by using same |
| WO2001096963A1 (en) | 2000-06-13 | 2001-12-20 | Asahi Glass Company, Limited | Resist composition |
| KR20030076228A (ko) | 2000-06-21 | 2003-09-26 | 아사히 가라스 가부시키가이샤 | 레지스트 조성물 |
| JP4449176B2 (ja) * | 2000-06-30 | 2010-04-14 | 住友化学株式会社 | 化学増幅型レジスト組成物 |
| JP3945200B2 (ja) * | 2001-09-27 | 2007-07-18 | 信越化学工業株式会社 | 化学増幅レジスト材料及びパターン形成方法 |
| JP2003140345A (ja) * | 2001-11-02 | 2003-05-14 | Fuji Photo Film Co Ltd | ポジ型レジスト組成物 |
| US6723488B2 (en) * | 2001-11-07 | 2004-04-20 | Clariant Finance (Bvi) Ltd | Photoresist composition for deep UV radiation containing an additive |
| KR100498464B1 (ko) * | 2002-11-22 | 2005-07-01 | 삼성전자주식회사 | 불소 함유 감광성 폴리머, 이를 포함하는 레지스트 조성물및 레지스트 조성물을 이용한 패턴 형성 방법 |
| JP4222850B2 (ja) | 2003-02-10 | 2009-02-12 | Spansion Japan株式会社 | 感放射線性樹脂組成物、その製造法並びにそれを用いた半導体装置の製造方法 |
| JP5750476B2 (ja) * | 2013-07-22 | 2015-07-22 | 東京応化工業株式会社 | レジストパターン形成方法 |
-
2000
- 2000-08-21 JP JP2000249269A patent/JP3915870B2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP2001133979A (ja) | 2001-05-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US6579658B2 (en) | Polymers, resist compositions and patterning process | |
| JP3861966B2 (ja) | 高分子化合物、化学増幅レジスト材料及びパターン形成方法 | |
| JP3838329B2 (ja) | 高分子化合物、レジスト材料及びパターン形成方法 | |
| KR20010088333A (ko) | 고분자 화합물, 레지스트 재료 및 패턴 형성 방법 | |
| JP3844057B2 (ja) | 高分子化合物、レジスト材料及びパターン形成方法 | |
| JP3897088B2 (ja) | 化学増幅レジスト材料及びパターン形成方法 | |
| US6730451B2 (en) | Polymers, chemical amplification resist compositions and patterning process | |
| JP4132510B2 (ja) | 化学増幅型レジスト材料及びパターン形成方法 | |
| JP3804756B2 (ja) | 高分子化合物、化学増幅レジスト材料及びパターン形成方法 | |
| JP3915870B2 (ja) | 高分子化合物、化学増幅レジスト材料及びパターン形成方法 | |
| JP3981803B2 (ja) | 高分子化合物、レジスト材料及びパターン形成方法 | |
| KR100538500B1 (ko) | 고분자 화합물, 레지스트 재료 및 패턴 형성 방법 | |
| US6461791B1 (en) | Polymers, chemical amplification resist compositions and patterning process | |
| JP3861976B2 (ja) | 高分子化合物、化学増幅レジスト材料及びパターン形成方法 | |
| JP3797415B2 (ja) | 高分子化合物、レジスト材料及びパターン形成方法 | |
| JP3736606B2 (ja) | 高分子化合物、レジスト材料及びパターン形成方法 | |
| US6461789B1 (en) | Polymers, chemical amplification resist compositions and patterning process | |
| JP3687735B2 (ja) | 高分子化合物、化学増幅レジスト材料及びパターン形成方法 | |
| JP3844056B2 (ja) | 高分子化合物、レジスト材料及びパターン形成方法 | |
| JP3874061B2 (ja) | 高分子化合物、レジスト材料及びパターン形成方法 | |
| JP4255633B2 (ja) | レジスト材料及びパターン形成方法 | |
| JP4780262B2 (ja) | 高分子化合物、化学増幅レジスト材料及びパターン形成方法 | |
| JP3876968B2 (ja) | 高分子化合物、化学増幅レジスト材料及びパターン形成方法 | |
| JP4257480B2 (ja) | 高分子化合物、化学増幅レジスト材料及びパターン形成方法 | |
| US6461790B1 (en) | Polymers, chemical amplification resist compositions and patterning process |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20040422 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060809 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061006 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20061115 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20061213 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20070117 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20070130 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 Ref document number: 3915870 Country of ref document: JP Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20130216 Year of fee payment: 6 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160216 Year of fee payment: 9 |
|
| EXPY | Cancellation because of completion of term |