JP3898804B2 - Semiconductor wafer removal mechanism in the carrier case - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention has an effective configuration when taking out from a carrier case for storing semiconductor wafers. In particular, even when a semiconductor wafer is stored with a buffer sheet interposed between the two, it is ensured that the two are separated one by one. The present invention relates to a semiconductor wafer take-out mechanism in a carrier case that can be taken out.
[0002]
[Prior art]
Conventionally, when a semiconductor wafer is processed into an IC or the like, the work process is roughly divided into a pre-process for forming a circuit and a post-process for manufacturing a finished product. These pre-process and post-process are performed in separate factories. It is common to be working. Therefore, the semiconductor wafer processed in the previous process is transported to the factory in the subsequent process while being stored in the wafer cassette. The wafer cassette for transporting the semiconductor wafer is placed on the top and bottom of the shelf so that a handler of a manufacturing apparatus used in a subsequent process can be inserted into the wafer cassette and placed on the handler to be sucked and supported. It is formed so as to have a spatial margin in the interval.
[0003]
For this reason, when transporting a wafer cassette, there is a high possibility that the semiconductor wafer will collide with a portion in the carrier case due to vibration, and when handling the semiconductor wafer that requires careful handling because it requires fine processing. It was inconvenient. Therefore, a carrier case as shown in FIG. 6 has been developed in order to prevent inconvenience when the semiconductor wafer housed therein vibrates and receives an impact or becomes a final processed shape when moving. Has been.
[0004]
That is, as shown in FIG. 6, the carrier case 70 includes a cylindrical housing portion 71 that supports the semiconductor wafer, and a lid body 72 that supports and covers the semiconductor wafer W in the state where the semiconductor wafer W is stored in the cylindrical storage portion 71. It is configured. The cylindrical storage portion 71 is formed with a base portion 71a and a cylindrical portion 71b so as to have a slit 71c upright from the base portion 71a. Further, the lid 72 is configured to be detachably held in the cylindrical storage portion 71.
[0005]
Therefore, when the semiconductor wafer W is stored in the carrier case 70, a sponge S as a buffer material is disposed at the lowermost end, a buffer sheet P as a spacer for the semiconductor wafer is disposed thereon, and then the semiconductor wafer W is mounted. After that, the buffer sheets P and the semiconductor wafers W are alternately stacked, and a predetermined number of sheets are stored, and the cover 72 is supported by the lid 72 with a sponge S serving as a buffer material disposed at the uppermost position. The semiconductor wafer W is accommodated. Therefore, even if the carrier case 70 is transported, the semiconductor wafer W vibrates inside and collides with other parts without affecting the circuit characteristics of the semiconductor wafer W. It becomes the structure by which it becomes impossible to use in a process.
[0006]
When the semiconductor wafer is taken out from the transported carrier case 70 and is operated on the work line in the next process, the lid 72 of the carrier case 70 is removed, and a suction arm that sucks and supports the upper surface of the semiconductor wafer W is used. The semiconductor wafer is taken out from the carrier case 70.
[0007]
In addition, since many semiconductor manufacturing apparatuses are compatible with conventional wafer cassettes, the semiconductor wafers transported in the carrier case are once transferred to the wafer cassettes by hand, etc. Currently, we are working with handlers.
[0008]
[Problems to be solved by the invention]
However, there are the following problems when using the carrier case having the above-described configuration. That is, it is possible to take out the semiconductor wafer from the upper end side of the carrier case with the suction arm with the lid of the carrier case removed, but when the semiconductor wafer and the buffer sheet are left in the crimped state for a long time In some cases, the semiconductor wafer and the buffer sheet cannot be separated due to close contact due to static electricity or the like, and the semiconductor wafer cannot be taken out properly.
[0009]
The present invention was devised in view of the above-described problems, and provides a semiconductor wafer take-out mechanism in a carrier case capable of properly taking out a semiconductor wafer and accurately separating the semiconductor wafer and the buffer sheet. With the goal.
[0010]
[Means for Solving the Problems]
In order to achieve the above object, the present invention provides a mounting table on which a carrier case of a semiconductor wafer to be stacked and stored with a buffer sheet interposed therebetween, and is provided adjacent to the mounting table, A transfer arm for rotating and taking out a semiconductor wafer or a buffer sheet in a carrier case in a vertical direction; and a workpiece determination sensor for determining the semiconductor wafer or the buffer sheet in the carrier case; A semiconductor wafer take-out mechanism in the carrier case configured to vary the rotation angle position of the transfer arm after the semiconductor wafer or the buffer sheet is attracted by the signal.
The present invention also provides a mounting table on which a carrier case of a semiconductor wafer to be stacked and accommodated with a buffer sheet interposed therebetween is mounted so as to be movable up and down, and a semiconductor wafer in the carrier case provided adjacent to the mounting table. Alternatively, a transfer arm that pivots and takes out the buffer sheet in a vertical direction, a spray mechanism disposed in the vicinity of the semiconductor wafer or the buffer sheet, and a workpiece determination sensor that determines the semiconductor wafer or the buffer sheet in the carrier case. And the rotation angle position of the transfer arm 4 after the semiconductor wafer W or the buffer sheet P is adsorbed is varied according to the signal of the workpiece discrimination sensor, and the transfer arm is a carrier. Semiconductor wafer in a carrier case that blows gas from the blowing mechanism when adsorbing the semiconductor wafer or buffer sheet in the case It was configured as a take-out mechanism.
Here, the workpiece discrimination sensor is configured to discriminate the color of the semiconductor wafer or the buffer sheet in the carrier case.
[0011]
Moreover, the said spray mechanism is good also as a structure provided with at least one of the arm side spray nozzle provided in the transfer arm side, and the fixed side spray nozzle provided in the carrier case vicinity mounted in the mounting base mentioned above.
[0012]
Further, the arm-side spray nozzle is disposed at least in the vicinity of a suction pad that sucks the semiconductor wafer or the buffer sheet of the transfer arm, and when the transfer arm sucks the semiconductor wafer or the buffer sheet, It is convenient to adopt a configuration in which the semiconductor wafer or the buffer sheet is disposed in the vicinity.
[0013]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings.
1 is a front view of a semiconductor wafer take-out mechanism in a carrier case, FIG. 2 is a plan view of the semiconductor wafer take-out mechanism in the carrier case, and FIG. 3 is a front view showing a main part of the semiconductor wafer take-out mechanism in the carrier case. FIGS. 4A, 4B, 4C, and 4D are principle diagrams showing the operating state of a semiconductor wafer take-out mechanism in the carrier case, and FIGS. 5A, 5B, and 5C are carrier cases. FIG. 6 is an exploded perspective view showing a carrier case of a semiconductor wafer. FIG. 6 is a principle view showing an operating state of a spray mechanism of a semiconductor wafer take-out mechanism.
[0014]
As shown in FIGS. 1 and 2, the semiconductor wafer W take-out mechanism 1 includes a mounting table 2 on which a carrier case 70 of the semiconductor wafer W is mounted, and a transfer arm 4 disposed adjacent to the mounting table 2. And an arm-side spray nozzle 6 as a spray mechanism provided on the transfer arm 4 side.
[0015]
The mounting table 2 includes a support table 2a for positioning and supporting the carrier case 70, a fixed guide 2b provided on the support table 2a, and a drive mechanism 3 for moving the support table 2a up and down. The drive mechanism 3 includes a drive motor 3a such as a servo motor, drive transmission means 3b such as a pulley and an endless belt operated by the drive motor 3a, a slide guide 3c for guiding the support table 2a, and the like. ing.
[0016]
In order to properly align the height of the carrier case 70, positioning sensors 7 and 7 as positioning means are provided around the mounting table 2, and the positioning sensor 7 and 7 and the drive mechanism 3 are interlocked. By doing so, the carrier case 70 is moved up and down to an appropriate position.
[0017]
As shown in FIG. 1 and FIG. 2, the transfer arm 4 is configured to rotate in the vertical direction, and an operating motor 4b, a rotating shaft 4a rotated by a predetermined angle by the operating motor 4b, The arm member 4c supported by the rotating shaft 4a, the mounting plate 4d provided on the tip side of the arm member 4c, the suction pads 5 (four places in the drawing) provided on the mounting plate 4d, and the arm side spray nozzle 6 and a workpiece discrimination sensor 11.
[0018]
The workpiece discrimination sensor 11 is for discriminating the semiconductor wafer W or the buffer sheet P by color when the suction pad 5 is sucked. The semiconductor wafer is detected by a signal from the workpiece discrimination sensor 11. It is comprised so that the rotation angle position of the transfer arm 4 after adsorption | suction of W or the buffer sheet P may be varied (refer FIG.4 (b) (d)).
[0019]
Further, as shown in FIGS. 3 and 5, the arm side spray nozzle 6 is disposed at the position of the slit 71 c of the carrier case 70 fixed to the mounting table 2 when the transfer arm 4 rotates. When the semiconductor wafer W or the buffer sheet P is sucked by the suction pad 5 from the opening 6a of the arm side spray nozzle 6 and the semiconductor wafer W (buffer sheet P) positioned at the uppermost end. By blowing air toward the buffer sheet P (semiconductor wafer W) next to the semiconductor wafer W (buffer sheet P), the buffer sheet is applied to the semiconductor wafer W (buffer sheet P) adsorbed by the suction pad 5. When P (semiconductor wafer W) is in close contact due to static electricity or the like, the buffer sheet P (semiconductor wafer W) is separated, and only the semiconductor wafer W (buffer sheet P) is accurately detected. It is possible to take out from the scan 70.
[0020]
As shown in FIGS. 1 and 2, a drop air nozzle 9 is disposed in the vicinity of the rotation shaft 4 a of the transfer arm 4, and a buffer sheet is provided below the operation start position of the transfer arm 4. A receiving bucket 10 is installed. Therefore, when the transfer arm 4 sucks and holds the buffer sheet P from the carrier case 70 and takes it home, the dropping air nozzle 9 is activated and the position of the suction pad 5 as shown by the arrow d in FIG. Therefore, the air for dropping the buffer sheet P is blown.
[0021]
As shown in FIGS. 1 and 2, a fixed-side spray nozzle 8 that is a spray mechanism may be installed at one position of the positioning sensor 7. The fixed side spray nozzle 8 is controlled such that air is sprayed at the same operation timing as the arm side spray nozzle 6. Although not shown, the arm side spray nozzle 6, the fixed side spray nozzle 8, the drop air nozzle 9 and the suction pad 5 are connected to a vacuum pump or a compressor for sucking or sending air through a connection hose or the like. Has been.
[0022]
Next, the operation of the take-out mechanism 1 will be described.
As shown in FIGS. 1 and 2, first, the carrier case 70 is placed along the fixed guide 2 b at the position of the support table 2 a of the mounting table 2. At this time, the support table 2a is movable further upward than the position shown in FIG. 1 so that the operator can easily place the carrier case 70 thereon. When the carrier case 70 is installed on the mounting table 2, the support table 2 a is lowered by the driving mechanism 3 and stands by.
[0023]
Next, as shown in FIG. 4A, when the transfer arm 4 rotates from the position of the virtual line to the position of the solid line and stops, as shown in FIG. 5A, the drive mechanism 3 of the mounting table 2 is obtained. As a result, the support table 2a is raised, and the drive mechanism 3 is stopped at the position where the upper surface of the semiconductor wafer W is detected by the operation of the positioning sensors 7 and 7. Therefore, the upper surface of the semiconductor wafer W or the buffer sheet P in the carrier case 70 is always arranged at the contact position of the suction pad 5.
[0024]
Next, as shown in FIGS. 5A and 5B, the workpiece discrimination sensor 11 determines whether the semiconductor wafer W or the buffer sheet P is at the uppermost end position in the carrier case 70 by the color. If the semiconductor wafer W is determined to be a semiconductor wafer W, the semiconductor wafer W is sucked by the suction pad 5 and air is blown from the opening 6 a of the arm-side spray nozzle 6. Further, at this time, as shown in FIGS. 5B and 5C, the support table 2a on which the carrier case 70 is placed is lowered by the drive mechanism 3 so as to overlap and adhere to the semiconductor wafer W due to static electricity or the like. The buffer sheet P that has been separated can be separated.
[0025]
Note that air may be blown at the moment when the transfer arm 4 is rotated to a position slightly away from the mounting table 2. Further, it is convenient to adopt a configuration in which air is blown from the fixed side blowing nozzle 8 in accordance with the timing of blowing air from the arm side blowing nozzle 6.
[0026]
As shown in FIG. 5C, when the suction pad 5 sucks and holds the semiconductor wafer W, the transfer arm 4 rotates from the position of the phantom line to the position of the solid line as shown in FIG. The semiconductor wafer W can be transferred to the next process. As shown in FIG. 2, since the robot arm 20 is disposed adjacent to the transfer arm 4, the robot arm 20 that has passed the robot arm 20 and received the semiconductor wafer W receives the semiconductor in the next process. The wafer W can be moved.
[0027]
Next, the buffer sheet P is located on the upper end side in the carrier case 70, and the buffer sheet P needs to be separated into a place different from the semiconductor wafer W. Therefore, sorting work is performed by the following process. That is, as shown in FIG. 4C, the transfer arm 4 that takes out the semiconductor wafer W and transfers it to the robot arm 20 (see FIG. 2) is again rotated from the position of the virtual line to the position of the solid line and stopped. To do. Then, as shown in FIGS. 5A and 5B, the support table 2a is lifted by the drive mechanism 3, and is supported at the position where the upper end of the buffer sheet P abuts against the suction pads 5 and 5 by the positioning sensors 7 and 7. The ascent of the table 2a is stopped.
[0028]
Next, as shown in FIG. 5B, it is determined from the color that the workpiece discriminating sensor 11 discriminates the buffer sheet P. Then, as shown in FIGS. 5B and 5C, the buffer sheet P is sucked by the suction pad 5 and air is blown from the opening 6 a of the arm-side spray nozzle 6. Further, by lowering the support table 2a supporting the carrier case 70 at this time, the semiconductor wafer W stacked next can be separated without applying an impact even if it is in close contact with static electricity or the like. Thus, only the buffer sheet P can be sucked and held by the suction pad 5.
[0029]
Note that air may be blown at the moment when the transfer arm 4 is rotated to a position slightly away from the mounting table 2. Further, it is convenient to adopt a configuration in which air is blown from the fixed side blowing nozzle 8 in accordance with the timing of blowing air from the arm side blowing nozzle 6.
[0030]
Then, when the buffer sheet P is sucked and held by the suction pad 5, as shown in FIG. 4D, the transfer arm 4 is rotated from the position of the phantom line to the position of the solid line, and the suction pad 5 is moved to the buffer sheet P. Is moved to a position where it is supported in an inclined state. Further, when the transfer arm 4 sucks and holds the buffer sheet P and stops, the suction operation of the suction pad 5 is stopped, and the air nozzle 9 is operated to blow air to the buffer sheet P as indicated by the arrow. 1, the buffer sheet P is dropped from the suction pad 5 and stored in the buffer sheet receiving bucket 10 located below.
[0031]
As described above, even when the semiconductor wafer W and the buffer sheet P are stored in the carrier case 70 so as to be alternately arranged, the semiconductor wafer W and the buffer sheet P can be accurately separated, Even if each semiconductor wafer W and the buffer sheet P are in close contact with each other due to static electricity or the like, only the target semiconductor wafer W or the buffer sheet P can be reliably held and moved on the transfer arm 4 side.
[0032]
In addition, although the said arm side spray nozzle is set as the structure provided in one place in a mounting plate, you may arrange | position in multiple positions. Moreover, it is good also as a structure which can attach the arm side spray nozzle so that a movement is possible in the circumferential direction of an attachment board, and it is convenient in the case where there exists a thing where the position of the slit of a carrier case differs.
[0033]
Further, in the spray mechanism having the above configuration, the arm side spray nozzle has been mainly described. However, the fixed side spray nozzle is mainly used, and when the tip side of the fixed side spray nozzle blows air, the semiconductor wafer or the buffer sheet side is used. It may be configured such that the air is blown out by being moved close to each other, or configured to be stretchable so as to extend and approach.
[0034]
The arm-side spray nozzle and the fixed-side spray nozzle may be selectively used in accordance with the size of the semiconductor wafer, the material or thickness of the buffer sheet, and the like. The gas blown onto the semiconductor wafer or the buffer sheet may be other gas such as nitrogen gas in addition to the air in the working chamber, or may be an ionized gas for charge removal. The direction of the gas blown from the spraying mechanism may be a direction in which the semiconductor wafer and the buffer sheet are separated from each other, and even when sprayed from a direction parallel to the semiconductor wafer or the buffer sheet, the gas is inclined (in the vertical direction). It does not matter if it is sprayed from either direction.
[0035]
Furthermore, a mounting table is arranged in front of the robot arm. One is used for a carrier case with a buffer sheet interposed on the other, and a wafer cassette having a space in which a conventional robot arm can be inserted is mounted on the other. This configuration can be used to solve problems that cannot be dealt with even if the shape of the carrier case changes, regardless of the carrier case configuration, and without requiring troublesome work such as replacement work. It is possible to configure as a take-out mechanism that can take out the semiconductor wafer from
[0036]
【The invention's effect】
Since the present invention is configured as described above, the following excellent effects can be obtained.
(1) According to the configuration of the present invention, the transfer arm is ready to deliver the semiconductor wafer to the next process based on a signal from the workpiece discrimination sensor, and is tilted by a signal from the workpiece discrimination sensor. When the buffer sheet is sucked and held and stopped, the buffer sheet can be dropped from the suction pad and stored in the buffer sheet receiving bucket located below.
(2) When taking out a semiconductor wafer from the carrier case, even if there is a buffer sheet interposed between the semiconductor wafers, it is sucked by the transfer arm and blows air from the spray mechanism in the vicinity of the semiconductor wafer or the buffer sheet The semiconductor wafer or the buffer sheet is always sucked and supported by the transfer arm one by one and can be taken out from the carrier case. Therefore, it is convenient when the next process is performed from the transfer arm.
[0037]
(3) Since the spray mechanism uses one or both of a configuration in which the arm side spray nozzle is provided on the transfer arm side or a configuration in which the fixed side spray nozzle is provided in the vicinity of the carrier case, the buffer sheet interposed between the semiconductor wafers It is possible to cope with different materials and thicknesses. In addition, by adopting a configuration in which the arm side spray nozzle or the fixed side spray nozzle is selectively used, it is possible to appropriately cope with the semiconductor wafer or the buffer sheet taken out from the carrier case.
[0038]
(4) By providing the arm-side spray nozzle on the transfer arm, air can be sprayed in the vicinity of the semiconductor wafer or the buffer sheet, depending on the case where the semiconductor wafer or the buffer sheet is in close contact. Separation can be performed accurately, and the semiconductor wafer can be taken out accurately.
[Brief description of the drawings]
FIG. 1 is a front view of a semiconductor wafer take-out mechanism in a carrier case of the present invention.
FIG. 2 is a plan view of a semiconductor wafer take-out mechanism in a carrier case according to the present invention.
FIG. 3 is a front view showing a main part of a semiconductor wafer take-out mechanism in a carrier case according to the present invention.
FIGS. 4A, 4B, 4C, and 4D are principle views showing an operating state of a semiconductor wafer take-out mechanism in a carrier case of the present invention.
FIGS. 5A, 5B, and 5C are principle views showing an operating state of a spray mechanism of a semiconductor wafer take-out mechanism in a carrier case of the present invention.
FIG. 6 is an exploded perspective view showing a carrier case of a semiconductor wafer.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Extraction mechanism 2 Mounting base 2a Support table 2b Fixed guide 3 Drive mechanism 3a Drive motor 3b Drive transmission means 3c Slide guide 4 Transfer arm 4a Rotating shaft 4b Actuation motor 4c Arm member 4d Mounting plate 5 Suction pad 6 Arm side blowing nozzle (Blowing mechanism)
7 Positioning sensor 8 Fixed side spray nozzle (spray mechanism)
9 Air nozzle for dropping 10 Buffer sheet receiving bucket 11 Work determination sensor 20 Robot arm 70 Carrier case

Claims (6)

  A mounting table for placing a semiconductor wafer carrier case to be stacked and stored with a buffer sheet interposed therebetween, and a semiconductor wafer or a buffer sheet in the carrier case provided vertically. A transfer arm that pivots in a direction to take out, and a work discrimination sensor that discriminates a semiconductor wafer or a buffer sheet in the carrier case,
  A semiconductor wafer take-out mechanism in a carrier case, wherein a rotation angle position of the transfer arm after the semiconductor wafer or the buffer sheet is attracted is made different according to a signal of the work discrimination sensor.   2. The semiconductor wafer take-out mechanism according to claim 1, wherein the workpiece discrimination sensor discriminates the color of the semiconductor wafer or the buffer sheet in the carrier case. A mounting table for mounting vertically movably a carrier case of a semiconductor wafer which is interposed housed laminated between the buffer sheet, provided adjacent to the mounting table, the semiconductor wafer or buffer sheets in the carrier case, vertical A transfer arm that pivots in the direction to be taken out, a spray mechanism disposed in the vicinity of the semiconductor wafer or the buffer sheet, and a workpiece discrimination sensor that discriminates the semiconductor wafer or the buffer sheet in the carrier case ,
It is configured to vary the rotation angle position of the transfer arm after the semiconductor wafer or the buffer sheet is attracted by the signal of the workpiece discrimination sensor, and
A semiconductor wafer take-out mechanism in a carrier case, wherein when the transfer arm adsorbs a semiconductor wafer or a buffer sheet in the carrier case, gas is blown from the blowing mechanism. The spray mechanism according to claim 3, characterized in that it comprises an arm side spray nozzles provided on the transfer arm, at least one of the fixed spray nozzles provided in the vicinity of the carrier casing to be placed on the mounting table A semiconductor wafer removal mechanism in the carrier case. The arm-side spray nozzle is disposed at least in the vicinity of a suction pad that sucks the semiconductor wafer or the buffer sheet of the transfer arm, and when the transfer arm sucks the semiconductor wafer or the buffer sheet, The semiconductor wafer take-out mechanism in the carrier case according to claim 4 , wherein the semiconductor wafer take-out mechanism is arranged at a position close to the semiconductor wafer or the buffer sheet.   4. The semiconductor wafer takeout mechanism in a carrier case according to claim 3, wherein the workpiece discrimination sensor discriminates the color of the semiconductor wafer or the buffer sheet in the carrier case.

Images