JPH0922916A - Removing device of soldered lid stuck and contained in vertical magazine - Google Patents

Abstract

PROBLEM TO BE SOLVED: To effectively remove soldered lids in a magazine one by one by inserting a wedge between the lid of the uppermost stage and the lid of a second stage via an expanding slot, separating both the lids, and then sucking and removing the lid of the uppermost stage from the upper opening. SOLUTION: The longitudinally moving air cylinder 27 of a lid separating mechanism 5 is moved from the state that the cylinder 27 is stopped, a wedge 26 fixed to the end of its rod 28 is inserted between the lid of the uppermost stage and the lid of the second stage via the expanding slot 11 of a vertical magazine 1 to separate both the lids therebetween. In this state, the vertically moving air cylinder 30 of a lid sucking and removing unit 6 is operated, the suction pad 33 fixed to the end is sucked to the lid of the uppermost stage, removed from the upper opening of the magazine 1, and the wedge 26 is moved back by the cylinder 27.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a device for taking out soldered lids stacked and housed in a vertical magazine, and more particularly to a vertical magazine for housing soldered lids for sealing a semiconductor ceramic package. The present invention relates to a device for taking out lids with solder that can be taken out one by one from a magazine.

[0002]

2. Description of the Related Art As shown in FIG. 7, a lid for sealing a semiconductor ceramic package has a solder layer d at a portion c corresponding to a sealing surface b of a package base portion a. As shown in FIG. 8, a plurality of the solder-equipped lids e are usually arranged on a tray f, stacked in a plurality of stages, and packaged and stored / stored to produce a semiconductor ceramic package. After the semiconductor chips are mounted on the line, that is, the package base portion a, in the production line for sealing the semiconductor chips, they can be taken out one by one continuously.

However, this soldered lid e is placed in a tray f.
In the case of a configuration in which multiple sheets are arranged in
It is necessary to wrap it so that the storage / storage space becomes large and the lid is not displaced. Therefore, in recent years, a vertical magazine g as shown in FIG. 9 is used, and a method in which the soldered lids e are stacked in the vertical magazine g is adopted.

In FIG. 9, the vertical magazine g is a planar rectangular synthetic resin magazine capable of accommodating a plurality of soldered lids e stacked. And
In the semiconductor ceramic package production line, the stacked lids e with solder are taken out one by one from the upper opening h of the vertical magazine g through the lid taking-out portion provided with a suction pad.

[0005]

However, the above-mentioned method has the following problems. That is, when the lid with solder is stacked in the vertical magazine, the solder of the solder layer d and the lid stacked thereon are adhered by pressing or rubbing by the weight of the lid. Therefore, it is not possible to take out the soldered lids one by one, so that the automation of the sealing line of the package base portion is hindered. In addition, the yield of the lid is reduced. There are problems such as.

The present invention has been made in response to the above problems, and its object is to reliably take out the soldered lids stored in the vertical magazine one by one. It is an object of the present invention to provide a device for taking out a lid with solder that can perform the above.

[0007]

As a means for solving the above-mentioned problems, a device for taking out soldered lids stacked and accommodated in a vertical magazine of the present invention is a vertical type having a vertical dividing groove. This is a device for taking out the soldered lids that are stacked and stored in the magazine one by one from the upper opening of the vertical magazine. Then, with the vertical magazine in which the soldered lids are stacked and housed in an upright state, the vertical magazine itself or a lift part for moving the soldered lid in the magazine up and down, and a vertical split groove of the vertical magazine. A lid separating mechanism portion having a wedge body that is inserted between the uppermost solder lid and the second solder lid of the vertical magazine to separate the two lids, and the upper opening of the vertical magazine Lid suction / removal section for sucking and picking up the uppermost soldered lid by a suction pad, a lid position detecting section for detecting the uppermost soldered lid in the vertical magazine, and the lid position detecting section The lift portion is stopped by a detection signal from the same and the wedge body is inserted between the uppermost solder lid and the second solder lid to separate the both lids. And it is configured to have a control unit for controlling the extraction of the solder with the lid of the outermost upper from the upper opening of the vertical-type magazine by the lid suction-extraction unit.

[0008]

According to the device for taking out a lid with solder of the present invention, a magazine having a vertical split groove is used as the vertical magazine, and the wedge body of the lid separating mechanism is vertically inserted through the split groove. Type soldering lid and 2
After inserting between the lid and the lid with solder on the stage to separate the lids, the lid adsorption / ejection section of the uppermost magazine of the vertical magazine adsorbs and removes the lid with solder on the top. This has an effect that the lids with solder stored in the vertical magazine can be taken out one by one with certainty.

Further, according to the device for taking out soldered lids of the present invention, the position of the uppermost soldered lid housed in the vertical magazine is detected by the lid position detecting section, and this detection is performed. The lift portion is stopped based on a signal, and the stroke between the soldered lid located at the uppermost stage and the suction pad of the lid suction / takeout portion is always constant, so that the soldered lid is opened from the upper opening of the vertical magazine. It has an effect that it can be taken out continuously and reliably at regular intervals.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION The best mode for carrying out the present invention will be described below with reference to the drawings. Here, FIG.
6 shows an embodiment of the present invention, FIG. 1 is a perspective view of the entire apparatus, FIG. 2 is an enlarged perspective view of a separation / removal mechanism portion of a lid with solder, and FIG. 3 is a separation / removal mechanism of lid with solder. 4 is a schematic view of the lift portion, FIG. 5 is a bottom view and a side view of the vertical magazine, and FIG. 6 is a side view of the wedge body.

The separation / takeout device for the soldered lids stacked and housed in the vertical magazine of the present invention is a line for mounting a semiconductor chip on the package substrate portion of a semiconductor ceramic package and sealing it with the soldered lid. Used in. Then, the best embodiment is roughly described by a lift portion 3 for raising a lid 2 with solder stacked in the vertical magazine 1 and the vertical magazine 1.
A lid position detecting section 4 for detecting the uppermost solder lid 2a, and the uppermost solder lid 2a and the second solder lid 2 housed in the vertical magazine 1.
It has a lid separating mechanism portion 5 for separating the lid b, a lid suction / takeout portion (pick and place unit) 6 for taking out the uppermost soldered lid 2a from the vertical magazine 1, and a control portion 7.

The vertical magazine 1 used in this embodiment is
As shown in FIG. 5, a trapezoidal lid holding piece 8 is provided at the bottom, and a flat rectangular tubular body 9 capable of stacking and storing a plurality of soldered lids 2 is formed. The magazine is made of synthetic resin and has a split groove 11 at a corner 10 in the direction. Here, the lid holding piece 8 is provided on each side of the cylindrical body 9 and has an X-shaped opening hole 12 formed in the center of the bottom portion.

As shown in FIGS. 1, 2 and 4, the lift portion 3 is erected on a horizontal machine base 14 along a vertical machine frame 13 and is stored in a stack in the vertical magazine 1. It comprises a lifter 15 for raising a plurality of soldered lids 2 one by one, and a magazine holding portion 16 for holding the vertical magazine 1. The lifter 15 is moved up and down by an induction motor 17 via a vertical feed screw unit 18 having an orthogonal transformation mechanism (not shown) and is held by a linear shaft 19 to move up and down.
A vertical movement arm 24 having a vertical axis 0, which is fitted to an X-shaped opening hole 12 provided at the center of the bottom of the vertical magazine 1 and pushes up the soldered lid 2 at the bottom. I have it. In addition, the magazine holding unit 16
Is a magazine mounting table 22 fixed to the vertical machine frame 13.
And a magazine holder 23 standing upright on the magazine mounting table 22, and the magazine mounting table 22 is provided with a through hole 25 through which the vertical moving arm 24 penetrates at the center thereof. Further, the lid position detection unit 4 is arranged on the vertical wall 23 a of the magazine holder 23 of the lift unit 3.

As shown in FIG. 2, the lid position detector 4 is a sensor for detecting the uppermost soldered lid 2a of the soldered lid 2 housed in a stack in the vertical magazine 1. , A photoelectric sensor is used, and the photoelectric sensor is arranged at a position facing the dividing groove 11 of the vertical magazine 1. Then, the uppermost solder lid 2a that rises through the lift portion 3 that rises in the vertical magazine 1 detects the position by blocking this optical path. Further, a lid separating mechanism section 5 is arranged facing the split groove 11 formed in the vertical magazine 1 mounted on the magazine mounting table 22 and on the upper side of the vertical magazine 1.

As shown in FIGS. 1 and 2, the lid separating mechanism portion 5 includes a soldering lid 2a at the uppermost stage of the soldering lid 2 which is stacked and accommodated in the vertical magazine 1 and soldering at the second stage. A mechanism for separating from the lid 2b, a wedge body 26 that is inserted between the lids 2a and 2b through the split groove 11 of the vertical magazine 1, and a front-rear moving air cylinder 27 that operates the wedge body 26. Consists of. Wedge 26
Is attached to the tip of the rod 28 of the longitudinal air cylinder 27 by L
It is fixed via a character-shaped guide plate 29. Here, as shown in FIG. 6, the wedge body 26 is formed of wedge-shaped urethane rubber having a flat bottom surface and a tapered front end. As the wedge 26,
The tip angle α is about 10 ° to 18 °, preferably 15 °
The thickness t is about 1.5 mm and the width is narrower than the dividing groove 11 of the vertical magazine 1. However, an arbitrary one can be selected and used depending on the appearance such as the thickness of the lid. The front-rear moving air cylinder 27
Are fixed to the vertical machine casing 13. Further, above the vertical magazine 1, there is arranged a lid suction / removal section 6 for picking up and placing the uppermost soldered lid 2a separated by inserting the wedge 26 between the lids 2a and 2b. .

As shown in FIGS. 1 and 2, the lid suction / removal section 6 picks up the soldered lid 2 housed in the vertical magazine 1 and puts it on a sealing line (not shown) of the package substrate section. It is a pick-place unit for placing on the package substrate portion sent by (1), and includes a vertically moving air cylinder 30 and a horizontally moving air cylinder 31. The vertically moving air cylinder 30 has a suction pad 33 at the tip of its rod 32, and this suction pad 33 is held by a linear shaft 34 and is connected to a vacuuming unit 35. The left / right moving air cylinder 31 places the soldered lid 2 sucked by the suction pad 19 via the block 36 holding the vertically moving air cylinder 30. And
The lift unit 3, the lid separating mechanism unit 5, and the lid suction / removal unit 6 are connected to the control unit 7.

The control unit 7 controls the vertical drive of the lift unit 3, the vertical drive of the wedge body 26 of the lid separating mechanism unit 5, and the vertical and horizontal movement of the suction pad 33 of the lid suction / removal unit 6. Consists of.

Next, the operation of the lid removing device of the above-described embodiment will be described with reference to FIGS. First, as shown in FIG. 1, the vertical magazine 1 in which a plurality of lids 2 with solder are stacked and stored is placed on the magazine mounting table 22 of the lift unit 3 and held by the magazine holder 23, and then the control unit. When a start signal is input to 7, the induction motor 17 of the lift section 3 is activated, and the vertical feed screw unit 18 of the lift section 3 and the vertical movement block 2 are moved.
The vertical movement arm 24 moves upward via 0. Then, when the uppermost lid 2a with solder in the vertical magazine 1 blocks the optical path of the photoelectric sensor of the lid position detection unit 4, the photoelectric sensor detects this and transmits a detection signal to the control unit 7,
The induction motor 17 of the lift section 3 stops, and the lifter 15 of the lift section 3 stops. Next, this control unit 7
The lid separation mechanism unit 5 is operated by the programmable controller of.

That is, from the state where the front-rear moving air cylinder 27 of the lid separating mechanism portion 5 is stopped (see FIG. 3a),
The front-rear moving air cylinder 27 moves, and the wedge body 26 fixed to the tip of the rod 28 passes through the split groove 11 of the vertical magazine 1 and is soldered to the uppermost solder lid 2a and the second solder solder. It is inserted into the lid 2b to separate the lids 2a and 2b from each other (see FIG. 3b). In this state, the vertically moving air cylinder 30 of the lid suction and take-out portion 6 is operated, and the suction pad 33 fixed to the tip thereof is sucked onto the uppermost lid 2a with solder (see FIG. 3c). At the same time as taking out from the upper opening 1a of the vertical magazine 1 (see FIG. 3d), the wedge body 26 is moved backward by the front-rear moving air cylinder 27. Then, when the lid 2 with solder is taken out from the vertical magazine 1 via the suction pad 33, the laterally moving air cylinder 31 of the lid suction and take-out portion 6 is operated next, and the lid 2 with solder is placed at a predetermined position. To implement.

By continuously performing this operation until all the soldered lids 2 stacked and stored in the vertical magazine 1 are exhausted, the soldered lids 2 are securely separated one by one. , Can be taken out from the vertical magazine 1. Therefore, according to the embodiment of the present invention, the wedge body 26 is inserted between the uppermost stage 2a of the vertical magazine 1 and the second lid 2a, 2b with solder to separate the two lids 2a, 2b from each other. However, since it can be taken out from the upper opening 1a of the vertical magazine 1, the yield of the lid can be improved and the package sealing line can be automated.

It should be noted that the present invention is not limited to the above-described embodiments, but includes configurations that can be modified and implemented within a range that does not change the gist of the present invention. By the way, vertical magazine 1
The lid position of the uppermost soldered lid that is stacked and stored inside is detected indirectly by detecting the upper movement state by the thickness of the lid at any position to detect the uppermost soldered lid. It may be in the form of. Further, although the case where the lid in the magazine is raised has been described in the embodiment, the magazine itself may be raised.

[Brief description of drawings]

FIG. 1 is a perspective view showing an external appearance of a lid removing device of the present invention.

FIG. 2 is an enlarged perspective view of a separation / removal mechanism portion of the lid with solder according to the present invention.

FIG. 3 is an explanatory view of a separation / removal mechanism of a lid with solder according to the present invention.

FIG. 4 is a schematic view of a lift unit according to the present invention.

FIG. 5 is a bottom view and a side view of the vertical magazine of the present invention.

FIG. 6 is a side view of the wedge body of the present invention.

FIG. 7 is a perspective view of a lid with solder and a package base portion.

FIG. 8 is a perspective view of a tray accommodating a lid with solder.

FIG. 9 is a perspective view of a vertical magazine used in a conventional method.

[Explanation of symbols]

1 ... Vertical magazine, 1a ... Upper opening, 2 ...
-Solder lid, 2a ... Top solder lid, 2b ... Second stage solder lid, 3 ... Lift section, 4 ... Lid position detection section, 5 ... Lid separation Mechanism part, 6 ... Lid suction / removal part (pick / place unit), 7 ... Control part, 8 ... Lid holding piece, 9 ... Planar rectangular tubular body, 10 ... Vertical Direction corners, 11 ... split grooves, 12 ... X-shaped opening hole at the center of the bottom, 13 ... Vertical machine frame, 14 ... Horizontal machine base, 15.
..Lifters, 16 ... Magazine holders, 17 ...
Induction motor, 18 ... Vertical feed screw unit, 19 ... Linear shaft, 20 ... Vertical movement block, 22 ... Magazine mounting table, 23 ... Magazine holder, 23a ... Vertical wall, 24 ... Vertical movement arm, 25 ... Through hole, 26 ... Wedge body, 27 ...
Front-rear moving air cylinder, 28 ... Rod of front-rear moving air cylinder 27, 29 ... L-shaped guide plate, 30 ...
-Up and down moving air cylinder, 31 ... Horizontal moving air cylinder, 32 ... Rod, 33 ... Suction pad, 34
... Linear shaft, 35 ... Vacuum unit,
36 ... Block, a ... Package base, b ...
..Sealing surface, c ... Location corresponding to sealing surface, d ...
Solder layer, e ... Lid with solder, f ... Tray, g
... Vertical magazine, h ... Top opening

Claims (1)

[Claims] 1. A soldering lid take-out device for taking out, one by one, a lid with solder stacked and housed in a vertical magazine having a vertical split groove, the take-out lid taking out one by one from an upper opening of the vertical magazine. With the vertical magazine in which soldered lids are stacked and housed in an upright state, the vertical magazine itself or a lift part for raising or lowering the soldered lid in the magazine and a vertical split groove of the vertical magazine A lid separating mechanism portion having a wedge body which is inserted between the uppermost solder lid and the second solder lid of the die magazine to separate the lids, and the upper opening of the vertical magazine. A lid adsorption / removal unit that adsorbs and takes out the uppermost soldered lid with an adsorption pad, a lid position detection unit that detects the uppermost soldered lid in the vertical magazine, and the lid. While stopping the lift portion by a detection signal from the lead position detection portion, the wedge body is inserted between the uppermost solder lid and the second solder lid, and the both lids are separated, And the lid adsorption
A device for taking out soldered lids stacked and accommodated in a vertical magazine, having a control unit for controlling taking out of the uppermost soldered lid from the upper opening of the vertical magazine .