JP3885441B2

JP3885441B2 - Manufacturing method of molded body

Info

Publication number: JP3885441B2
Application number: JP2000000205A
Authority: JP
Inventors: 哲哉久保田; 公啓村上
Original assignee: Mitsubishi Chemical Corp
Current assignee: Mitsubishi Chemical Corp
Priority date: 1999-05-17
Filing date: 2000-01-05
Publication date: 2007-02-21
Anticipated expiration: 2020-01-05
Also published as: JP2001030274A

Description

【０００１】
【発明の属する技術分野】
本発明は、液状樹脂原料、曲型的には光硬化性樹脂からシートのような成形体を製造するための成形型に関するものである。特に本発明は、薄厚な成形体を成形後に容易に取り出すための成形型と成形型からの成形体取り出し方法に関するものである。
【０００２】
【従来の技術】
光硬化樹脂シートの成形方法として、従来、成形型のキャビティーに光硬化性樹脂を注入し、硬化させた後、成形型を分解し、成形型と成形体を離型して光硬化樹脂シートが成形されている。成形型を型開きする場合、板状成形型２ａ、２ｂをそれぞれ機械的又は真空吸着等により固定した後型開きする方法、あるいは板状成形型に取っ手等を加工又は取り付け、これを利用して型開きする方法、又は成形型のキャビティーにヘラ等を差し込んでこじる方法、成形型のキャビティーに加圧気体を引き込みながら型開きする方法などがあった。
【０００３】
【発明が解決しようとする課題】
しかしながら、板状成形型２ａ、２ｂがはみだしなく重なっていると、板状成形型２ａ、２ｂとをそれぞれ機械的に固定して分解する場合、その固定は容易ではなく、特にガラス等加工しにくい材料を板状成形型に使用する場合は特に困難であり、引き剥がしに必要な力を得にくいという問題があった。真空吸着による分解の場合、成形型温度が高温となっていると吸着パットが使用できず、吸着できたとしても熱により吸着パット部が軟化して、引き剥がしに必要な力を得られにくいという問題があった。
【０００４】
また、成形型のキャビティーにヘラ等を差し込む場合、キャビティーの間隔が広い場合はヘラを差し込むことが出来るが、狭い場合は容易ではなく、引き剥がしに必要な力を得にくく、また機械化が困難であった。
さらに、成形型を型開きする場合、成形型と成形体との密着が強固となると、成形型分解のための力が大きくなり容易には型開きできず、又型開きできたとしても成形体を破損せずに得ることは困難である。その問題は、成形体の厚さが薄い場合、また成形体の面積が大きい時により顕著であった。
成形型のキャビティーに加圧気体を吹き込みながら型開きする方法では、加圧気体による冷却で生じる成形型と成形体との線膨張係数差や、成形体の収縮応力を利用しているが、成形体の厚みが薄く大面積であった場合、加圧気体を吹き込む成形型のキャビティーが狭くなるため、加圧気体による均一な冷却が困難となる傾向がある。その結果成形体に不均一な内部応力が生じやすく、成形体を破損せずに得ることは困難であった。
従って本発明は、型開きが容易でかつ機械化が容易な成形型を提供するものである。
従って本発明は、容易に解体ができ、かつ機械化が可能な成形型と成形型からの成形体取り出し方法を提供するものである。
【０００５】
【課題を解決するための手段】
本願発明は、一対の板状成形型（以下、対のうち、一方を２ａ、他方を２ｂとする）をその一部が重なり合うことがないように所定間隔をおいて対向させると共に周辺部をシールしてキャビティーを形成し、該キャビティーに液状樹脂を注入後硬化させ成形体を製造し、板状成形型２ａと２ｂのどちらか一方を固定し、固定されていない板状成形型の少なくとも一方向において該成形型の一部がそれぞれ重なり合うことがない部分に力を加え型開きし、成形体を取り出すことを特徴とする成形体の製造方法である。
以上
【０００６】
【発明の実施の形態】
本発明に用いられる成形型１は、図１に示すように、一対の板状成形型２ａ、２ｂをその一部が重なり合うことがないように所定の間隔をおいて対向させ、その周辺部をシール材３でシールする。上記所定の間隔としては、０．１ｍｍ〜５ｍｍで本発明での特徴を表すことが出来る。好ましくは０．１ｍｍ〜３ｍｍであり、更に好ましくは０．１ｍｍ〜２ｍｍ、特に好ましくは０．１ｍｍ〜１ｍｍである。所定の間隔が０．１ｍｍより狭いと、成形体の機械的強度が小さくなり型開き時に割れ等を起こす恐れがあり、また、５ｍｍより広いと本願の方法によっても、従来の方法によっても型開きを行うことができる。
重なり合わない部分の長さ、幅又は面積は特に限定しないが、板状成形型２ａ、２ｂの固定を満足し、型開きに必要な治具等の力がかかる作用点として十分利用できる長さ、幅又は面積が望ましい。
【０００７】
板状成形型２ａ、２ｂは図１に示すように平板とするほか、目的に応じて湾曲又は波形状の板状体に賦形することができる。また、内面のみに波型、グレーティングレンズ構造等の物品形状又は模様等を付すことができる。
板状成形型２ａ、２ｂの材料は、用いる液状樹脂原料を硬化させる条件に耐えうるもであればよく、例えば、活性エネルギー線が透過し、熱又は溶媒によって容易にその形状が変形しない材料であっても、金属板等の活性エネルギー線を透過しない材料であってもよい。活性エネルギー線が透過する材料としては、例えばガラスやアクリル樹脂板等のプラスチック板等を用いることができる。一対の板状成形型は同一材料であっても互いに異なっていてもよい。
【０００８】
対向して設けられた板状成形型２ａ、２ｂの周縁部をシールするシール材３の材料は、用いる液状樹脂や溶媒、また活性エネルギー線、熱等の硬化条件に耐え、容易にその形状が変形しない材料が用いられ、これら条件を満たすものであれば特に制約されることはなく、ゴム、プラスチック、金属等を用いることができる。
シール材３は、厚手のものを使用すれば板状成形型２ａ、２ｂの間隔を規制するスペーサーとして作用するが、必要に応じて板状成形型２ａ、２ｂの間にスペーサー（図示せず）を介装しシール材としてテープ等を用いることもできる。
本発明で得られた成形体の曲げ弾性率は５０００ＭＰa以下であることが好ましい。曲げ弾性率が５０００ＭＰaを越えると成形体が堅くなり、型開きの際にかかる力により成形体に欠け等を生じる恐れがある。これは、成形体の厚みが薄く、また大面積の場合顕著である。
【０００９】
本発明に用いる板状成形型２ａ、２ｂはその少なくとも一方の内面に剥離層を有していてもよい。剥離層としては、液状樹脂原料が硬化する条件、例えば十分な活性エネルギー線や、硬化時に発生する熱等では容易にその形状を変形しない物質が用いられる。また、用いる液状原料樹脂に溶け出す等により、成形中に剥離層としての機能を失わないものが用いられる。
例えば、液状樹脂原料に光硬化性樹脂を用いる場合、板状成形型２ａ、２ｂの少なくとも一方に用いられる剥離層は、光硬化性樹脂を硬化させるのに充分な活性エネルギー線を透過する材料が用いられる。
【００１０】
この目的に適する材料としては、ポリスチレン系樹脂、環状ポリオレフィン系樹脂等の非晶性樹脂等、光硬化性樹脂との接着性の低い熱可塑性樹脂を用いることができる。ポリスチレン系樹脂としてはスチレン、ジメチルスチレン、ｏ−メチルスチレン、ｍ−メチルスチレンよりなる単独重合体および共重合体が挙げられ、環状ポリオレフィン系樹脂としては、日本ゼオン（株）製の商品名「ゼオネックス」、三井石油化学（株）製の商品名「アペル」等が挙げられる。また、その他の非晶性樹脂としては、ポリカーボネート、ポリアリレート、ポリエーテルスルフォン等が挙げられる。更に、パラフィン、ゼラチン等熱によって溶融若しくは軟化する物質、又は溶媒によって容易に溶解又は膨潤し得る材料を用いることができる。
【００１１】
剥離層の形成方法としては、剥離層形成材料をフィルム又はシート状に成形してこれを板状成形型２ａ、２ｂの内面に添着、または接着剤によって接着する方法、剥離層形成材料を溶融して板状成形型２ａ、２ｂ内面にコートする方法、剥離層形成材料を溶媒等に溶解した溶液をスピンコーター、バーコーター等の塗布装置により塗布後固化する方法、又は剥離層形成材料の溶融物もしくは溶媒等に溶解した溶液の中に浸漬させ、取り出した後固化する方法等が挙げられる。いずれの方法においても剥離層を均一になるように形成するのが好ましい。必要に応じて板状成形型２ａ、２ｂの内面に離型剤を塗布することもできる。また、紫外線照射後、その粘着力が低下する接着剤を塗布したフイルム、例えば接着剤付ＰＥＴフイルム当をラミネーターで板状成形型２ａ、２ｂ上に貼り付け剥離層として用いる等の方法も挙げられる。
剥離層の厚さは、板状成形型２ａ、２ｂを型開きする時に容易に成形体との剥離が行える範囲の厚さであればよい。
板状成形型と剥離層との密着強度は、型開きの際に０．１５Ｎ／２５ｍｍ以下であることが好ましく、更に好ましくは０．１Ｎ／２５ｍｍ以下である。密着強度が０．１５Ｎ／２５ｍｍより大きいと、成形型を型開きする為に板状成形型に加える力が大きくなり、板状成形型の破損や変形を生じ易くなり、この問題は特に大面積を成形する場合に起こりやすい。
【００１２】
こうして得られた成形型１を用いて対向する板状成形型２ａ、２ｂとシール材３で画成されたキャビティー５に液状樹脂原料を注入し、活性エネルギー線又は熱等により硬化させる。この際、必要に応じて成形型１を加熱あるいは冷却することができる。活性エネルギー線は、用いる液状樹脂原料を硬化させるものであればよく、例えば、紫外線等が挙げられる。活性エネルギー線の照射量及び熱量は、用いる液状樹脂原料を硬化させる量であればよい。
本発明に用いられる液状樹脂としては、例えば紫外線等の活性エネルギー線の照射により硬化する光硬化性樹脂や熱硬化樹脂等が用いられる。光硬化樹脂としては例えば、ラジカル反応性不飽和結合を有するアクリレート化合物よりなる樹脂組成物、ラジカル反応性不飽和結合を有するアクリレート化合物とチオール基を有するメルカプト化合物よりなる樹脂組成物、エポキシアクリレート、ウレタンアクリレート、ポリエステルアクリレート、ポリエーテルアクリレート等のオリゴマーを多官能アクリレートモノマーに溶融せしめた樹脂組成物等が挙げられる。一般に、これら光硬化性樹脂は活性エネルギー線によってラジカルを発生する光重合開始剤の存在下に使用される。
活性エネルギー線の照射又は熱により硬化が完了した後、板状成形型２ａ、２ｂを型開きし、成形体７を離型する。
【００１３】
成形体を取り出す際の成形型の型開き方法としては、図２、図３の例のように板状成形型２ｂを固定治具９で固定したあと、板状成形型２ａの板状成形型２ｂと重なり合っていない面８に力を加えて型開きする。型開きの力を加える方法としては、板状成形型２ｂの方から押し上げバー１０等を用いて上方へ板状成形型２ａを持ち上げるプッシュバー方式、板状成形型２ａの方向から爪状の治具を面８に引っかけて上方に持ち上げる方法等が挙げられるが、これらに限定するものではない。
【００１４】
また、面８に作用する力１１の分布としては、全面に均等な力を加え型開きしても良いが、好ましくは面８の少なくとも一方を力分布の頂点として型開きする方法が挙げられる。この場合、板状成形型を固定している側が力分布の頂点となるのがより好ましい。型開きの際、型開きをし易くするための処理、例えば型を加熱するなどの処理を行ってもよい。
スペーサー３をシール材として用いた場合には、成形体７へのクラック発生防止等より、成形型１の型開き前または成形型７の剥離前に取り除いておく方が望ましい。
板状成形型２ａ、２ｂを型開きした後、板状成形型２ａまたは２ｂに付着した成形体７を離型する方法としては、例えば、板状成形型２ａ側に剥離層４ａを介して成形体７が付着している場合、板状成形型２ａと離型層４ａの間、または成形体７と離型層４ａの間に鋭利な刃物等を差し込みながら離型させる方法、板状成形型２ａに密着していない成形体７の端面に、場合によっては剥離層４ｂを介して粘着テープ等を貼り付け成形体７を引き離す方法、あるいは、板状成形型２ａに密着している成形体７の端部の厚み方向側面に少なくとも一方向からエアーを吹き付け離型させる方法等が挙げられるが、これらに限定するものではない。
成形体７の剥離をし易くする方法、例えば剥離時の加温、型開きから成形体取り出しまでの間の保温、加温等を行っても良い。
【００１５】
成形体と剥離層を離型する必要がある場合は、板状成形型と剥離層を離型した後、または板状成形型が添着したままで、剥離層が付着した成形体を加熱して剥離層を溶融又は軟化させることによって離型することができる。また、剥離層が付着した成形体を剥離層を溶解する溶媒に浸漬、又は溶媒を塗布することによって剥離層を溶解もしくは膨潤させて除去することにより離型することもできる。剥離層を離型することによって、表面状態の優れた成形体を得ることができる。
【００１６】
【実施例】
以下、本発明の内容を実施例により更に詳細に説明するが、本発明は、その要旨を越えない限り以下の例に限定されるものではない。評価及び測定は以下の方法により行った。
（１）外観
成形型を型開きする際に、硬化後の成形体が破損しないか、目視により確認した。
（２）型開きし易さ
成形型を型開きする時の型開きしやすさを、下記の３段階で評価した。
○：型開き容易。 △：少し型開きしにくい。 ×：型開きしにくい。
（３）剥離層の厚さ
成形型の厚さと成形型上に完全硬化した剥離層が形成された厚さとの差を剥離層の厚さとした。測定機器はシックネスゲージを使用した。
（４）曲げ弾性率
下記試験条件以外はＪＩＳｋ７２０３に準拠して測定した。
試験速度１０mm/min、支点間距離３０ｍｍ
試料厚み１ｍｍ×幅２５ｍｍ×長さ５０ｍｍ
（５）板状成形型と剥離層との密着強度
剥離層を形成させた板状成形型を、硬化条件で処理した後測定した。
剥離層が薄い場合は、補強としてテープを貼り付け、テープ端部をオートグラフで引っ張り密着強度を測定した。用いる補強テープは、剥離層と十分密着し測定中に剥離層が剥がれないものを用いた。
測定条件：測定幅２５ｍｍ、１８０°剥離、測定速度１０mm/min
（６）成形キャビティーの間隔
ノギスにて測定した。
【００１７】
実施例１
成形型に一対のガラス製平板（縦４００ｍｍ×横４００ｍｍ×厚み４ｍｍ）を用い、成形型内面の剥離層としてゼオネックス（日本ゼオン（株）社製、商品名ゼオネックス４８０）をメシチレンに溶解させた溶液を、ガラス製平板上にスピンコーターを用いて塗布し、その後メシチレンを蒸発させ、成形型上に厚さ２μｍの剥離層を成形させた。成形型を剥離層が内面になるように対向させ、また、成形型がそれぞれ重ならない部分を２方向作るため成形型の対角線の延長方向に約１２ｍｍずらし、スペーサー及びシール材として幅１０ｍｍ、厚さ０．２ｍｍのシリコン板を用いキャビティーを形成させ周辺部をクリップでシールして成形型を形成した。
光硬化性樹脂には、ビス（オキシメチル）トリシクロ［５，２，１，０^2,6］デカンジメタクリレート９０重量部、ペンタエリスリトールテトラキス（β−チオプロピオネート）１０量部、光重合開始剤として２，４，６−トリメチルベンゾイルジフェニルホスフィンオキシド（ＢＡＳＦ社製「ルシリンＴＰＯ」）０．０５重量部、ベンゾフェノン０．０５重量部を均一に撹拌混合した後、脱泡して得た組成物を用いた。
この組成物を、成形型に注入し、ガラス面より上下両面から出力１６０Ｗ／ｃｍのメタルハライドランプで積算照射量が２７０００ｍｊ／ｃｍ²の紫外線を照射し硬化させた。その後成形型を図３の様に型開きし、成形体を取り出した。成形体に密着している剥離層は、メシチレンを用いて洗浄することにより取り除いた。評価及び測定結果を表１に示した。
実施例２
実施例１において、ガラス製平板を縦７５０ｍｍ×横７５０ｍｍ×厚さ６ｍｍのもの、またスペーサーとして幅１０ｍｍ、厚さ０．４ｍｍのシリコン板を用い、積算照射量が３００００ｍｊ／ｃｍ²とした以外は同例と同様とした。評価及び測定結果を表１に示した。
実施例３
実施例２において、光硬化性樹脂には、ビス（オキシメチル）トリシクロ［５，２，１，０^2,6］デカンジメタクリレート９４重量部、ペンタエリスリトールテトラキス（β−チオプロピオネート）６量部、としたた以外は同例と同様とした。評価及び測定結果を表１に示した。
実施例４
実施例１において、スペーサーとして幅１０ｍｍ、厚さ１ｍｍのシリコン板を用い、剥離層に密着強度が０．０７Ｎ／２５mmとなる５０μｍの粘着剤付透明ＰＥＴフイルムをラミネータでガラス製平板に貼り付け、積算照射量が２７０００ｍｊ／ｃｍ²とした。成形体を取り出した後、成形体に密着している粘着剤付ＰＥＴフイルムを手で剥がし成形体を取り出した。洗浄液にはＩＰＡを用いた。上記以外は同例と同様とした。評価及び測定結果を表１に示した。
実施例５
実施例４において、密着強度が０．１Ｎ／２５ｍｍとした以外は同例と同様とした。評価及び測定結果を表１に示した。
実施例６
実施例４において、密着強度が０．１５Ｎ／２５ｍｍとした以外は同例と同様とした。評価及び測定結果を表１に示した。
実施例７
実施例１において、光硬化性樹脂には、Ｐ−ビス（β−メタクリロイルオキシエチルチオ）キシリレン９４重量部、ペンタエリスリトールテトラキス（β−チオプロピオネート）６量部、光重合開始剤として２，４，６−トリメチルベンゾイルジフェニルホスフィンオキシド（ＢＡＳＦ社製「ルシリンＴＰＯ」）０．０５重量部、ベンゾフェノン０．０５重量部を均一に撹拌混合した後、脱泡して得た組成物を用いた。スペーサーとして幅１０ｍｍ、厚さ０．４ｍｍのシリコン板、積算照射量が３００００ｍｊ／ｃｍ²とした以外は同例と同様とした。評価及び測定結果を表１に示した。
実施例８
実施例７において、光硬化性樹脂にＰ−ビス（β−メタクリロイルオキシエチルチオ）キシリレン９６重量部、ペンタエリスリトールテトラキス（β−チオプロピオネート）４量部、光重合開始剤として２，４，６−トリメチルベンゾイルジフェニルホスフィンオキシド（ＢＡＳＦ社製「ルシリンＴＰＯ」）０．０５重量部、ベンゾフェノン０．０５重量部を均一に撹拌混合した後、脱泡して得た組成物を用いた。又、スペーサーの厚さを１ｍｍとした以外は同例と同様とした。評価及び測定結果を表１に示した。
比較例１
実施例１において、対向する成形型がそれぞれ重ならない部分を作らないようにし、ヘラ等でこじって分解した以外は同例と同様にシートを得た。評価及び測定結果を表１に示した。
比較例２
実施例３において、対向する成形型がそれぞれ重ならない部分を作らないようにし、ヘラ等でこじって分解した以外は同例と同様にシートを得た。評価及び測定結果を表１に示した。
比較例３
実施例３において、成形キャビティーを３ｍｍとし、対向する成形型がそれぞれ重ならない部分を作らないようにし、ヘラ等でこじって分解した以外は同例と同様にシートを得た。評価及び測定結果を表１に示した。
【００１８】
【表１】

実施例９
ガラス製平板（縦３００ｍｍ×横４００ｍｍ×厚み５ｍｍ）を対向する成形型が重ならない部分を作るため約８ｍｍずらし、スペーサーとして幅５ｍｍ、厚さ１ｍｍのシリコン板を用いキャビティーを形成させ周辺部をテープでシールして注入型を形成した。
光硬化性樹脂には、ビス（オキシメチル）トリシクロ［５．２．１．０^2,6］デカンジメタクリレート９４重量部、ペンタエリスリトールテトラキス（β−チオプロピオネート）６重量部、光重合開始剤として２，４，６−トリメチルベンゾイルジフェニルホスフィンオキシド（ＢＡＳＦ社製「ルシリンＴＰＯ」）０．０６重量部、ベンゾフェノン０．０４重量部を均一に撹拌混合した後、脱泡して得た組成物を用いた。
この組成物を、注入型に注入し、ガラス面より上下両面から出力１６０Ｗ／ｃｍのメタルハライドランプで積算照射量が２３０００ｍｊ／ｃｍ²の紫外線を照射し硬化させた。その後注入型全体を１５０℃のオーブンに投入し、成形型を型開きした。評価及び測定結果を表２に示した。
【００１９】
実施例１０
実施例９において、ガラス製平板に剥離層としてゼオネックス（日本ゼオン（株）社製、商品名ゼオネックス４８０）をキシレンに溶解させた溶液を、成形型上にスピンコーターを用いて塗布し、その後キシレンを蒸発させ、成形型上に厚さ５μｍのゼオネックス薄膜を成形させた。ゼオネックス薄膜面が内面になるように対向させ、スペーサーとして幅５ｍｍ、厚さ１ｍｍのシリコン板を用いキャビティーを形成させ周辺部をテープでシールして注入型を形成した以外は同例と同様とした。評価及び測定結果を表２に示した。
【００２０】
実施例１１
実施例１０において、ガラス製平板を縦７５０ｍｍ×横７５０ｍｍ×厚さ６ｍｍのもの、またスペーサーとして幅５ｍｍ、厚さ０．４ｍｍのシリコン板を用いた以外は同例と同様とした。評価及び測定結果を表２に示した。
【００２１】
実施例１２
実施例１０において、剥離層としてポリスチレン（三菱化学（株）社製、商品名ダイヤレックスＨＨ−１０２）をキシレンに溶解させた液槽に、成形型を浸漬させ、その後キシレンを蒸発させ、成形型上にポリスチレン薄膜を成形させた以外は同例と同様とした。評価及び測定結果を表２に示した。
【００２２】
比較例４
実施例９において、対向する成形型が重ならない部分を作らないようにし、ヘラ等でこじって型開きした以外は同例と同様にシートを得た。評価及び測定結果を表２に示した。
【００２３】
比較例５
実施例１０において、対向する成形型が重ならない部分を作らないようにし、ヘラ等でこじって型開きした以外は同例と同様にシートを得た。評価及び測定結果を表２に示した。
【００２４】
比較例６
実施例１１において、対向する成形型が重ならない部分を作らないようにし、ヘラ等でこじって型開きした以外は同例と同様にシートを得た。評価及び測定結果を表２に示した。
【００２５】
【表２】

【００２６】
【発明の効果】
本発明の成形型、成形型からの成形体の取り出し方法によると、薄膜化が容易で、広面積の成形体を損傷なく得られると共に、容易に機械化や自動化ができ、成形体を生産性よく製造することができる。
【図面の簡単な説明】
【図１】本発明の実施例を示す成形型の部分切欠き斜視図である。
【図２】本発明の実施例を示す成形型の断面図である。
【図３】本発明の実施例を示す成形型の型開き例である。
【符号の説明】
１成形型
２ａ、２ｂ板状成形型
３シール材
４ａ、４ｂ剥離層
５キャビティー
６活性エネルギー線又は熱線
７成形体
８作用点（面）
９固定治具
１０押し上げバー
１１引き離し力[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a mold for producing a molded body such as a sheet from a liquid resin raw material, that is, from a photocuring resin. In particular, the present invention relates to a mold for easily removing a thin molded body after molding and a method for removing the molded body from the mold.
[0002]
[Prior art]
Conventionally, as a method for molding a photocurable resin sheet, a photocurable resin is injected into a cavity of a mold and cured, and then the mold is disassembled, and the mold and the molded body are released to form a photocurable resin sheet. Is molded. When the mold is opened, a method of opening the mold after fixing the

plate molds

2a and 2b by mechanical or vacuum suction, or processing or attaching a handle or the like to the plate mold, and using this There are a method of opening a mold, a method of inserting a spatula or the like into a cavity of a mold, and a method of opening a mold while drawing a pressurized gas into the cavity of the mold.
[0003]
[Problems to be solved by the invention]
However, if the plate-

shaped molds

2a and 2b are overlapped without protruding, when the plate-

shaped molds

2a and 2b are mechanically fixed and disassembled respectively, the fixing is not easy, and it is particularly difficult to process glass or the like. When using a material for a plate-shaped mold, it is particularly difficult and there is a problem that it is difficult to obtain a force necessary for peeling. In the case of decomposition by vacuum adsorption, if the mold temperature is high, the adsorption pad can not be used, and even if it can be adsorbed, the adsorption pad part is softened by heat and it is difficult to obtain the force necessary for peeling There was a problem.
[0004]
In addition, when inserting a spatula or the like into the mold cavity, a spatula can be inserted if the gap between the cavities is wide, but it is not easy if it is narrow, and it is difficult to obtain the force necessary for peeling, and mechanization is not possible. It was difficult.
Furthermore, when the mold is opened, if the adhesion between the mold and the molded body becomes strong, the force for disassembling the mold increases and the mold cannot be opened easily. It is difficult to get without breaking. The problem is more conspicuous when the thickness of the molded body is small and when the area of the molded body is large.
In the method of opening the mold while blowing pressurized gas into the cavity of the mold, the difference between the linear expansion coefficient between the mold and the molded body generated by cooling with the pressurized gas and the contraction stress of the molded body are used. When the molded body is thin and has a large area, the cavity of the molding die into which the pressurized gas is blown becomes narrow, so that uniform cooling with the pressurized gas tends to be difficult. As a result, non-uniform internal stress is easily generated in the molded body, and it is difficult to obtain the molded body without damaging it.
Accordingly, the present invention provides a mold that can be easily opened and mechanized.
Therefore, the present invention provides a mold that can be easily disassembled and that can be mechanized and a method for taking out the molded body from the mold.
[0005]
[Means for Solving the Problems]
In the present invention, a pair of plate-shaped molds (hereinafter, one of the pairs is referred to as 2a and the other as 2b) are opposed to each other at a predetermined interval so as not to partially overlap , and the peripheral portion is sealed. Then, a cavity is formed, a liquid resin is injected into the cavity and cured to produce a molded body , one of the plate-

shaped molds

2a and 2b is fixed, and at least one of the unfixed plate-shaped molds A method for producing a molded body, wherein a force is applied to a part where the molds do not overlap each other in one direction, the mold is opened, and the molded body is taken out.
[0006]
DETAILED DESCRIPTION OF THE INVENTION
As shown in FIG. 1, the mold 1 used in the present invention has a pair of plate-

shaped molds

2 a and 2 b facing each other at a predetermined interval so that a part thereof does not overlap, and a peripheral part thereof. Seal with sealing material 3. As the predetermined interval, the characteristics of the present invention can be expressed by 0.1 mm to 5 mm. Preferably they are 0.1 mm-3 mm, More preferably, they are 0.1 mm-2 mm, Most preferably, they are 0.1 mm-1 mm. If the predetermined distance is narrower than 0.1 mm, the mechanical strength of the molded body may be reduced and cracking may occur when the mold is opened. If it is wider than 5 mm, the mold opening may be performed by the method of the present application or the conventional method. It can be performed.
The length, width, or area of the non-overlapping portion is not particularly limited, but is sufficient to satisfy the fixing of the plate-

shaped molds

2a and 2b and can be used sufficiently as a point of application of a force necessary for opening the mold. Width or area is desirable.
[0007]
As shown in FIG. 1, the plate-

shaped molds

2a and 2b can be formed into a flat plate as shown in FIG. Further, only the inner surface can be provided with a wave shape, an article shape such as a grating lens structure, or a pattern.
The material of the plate-

shaped molds

2a and 2b may be any material as long as it can withstand the conditions for curing the liquid resin raw material to be used. For example, it is a material that transmits active energy rays and does not easily deform by heat or a solvent. Even if it exists, the material which does not permeate | transmit active energy rays, such as a metal plate, may be sufficient. As a material through which the active energy ray is transmitted, for example, a plastic plate such as glass or an acrylic resin plate can be used. The pair of plate-shaped molds may be made of the same material or different from each other.
[0008]
The material of the sealing material 3 that seals the peripheral portions of the plate-

shaped molds

2a and 2b that are provided facing each other can withstand the curing conditions such as the liquid resin and solvent used, active energy rays, heat, etc. A material that does not deform is used, and is not particularly limited as long as these conditions are satisfied. Rubber, plastic, metal, or the like can be used.
If a thick seal material 3 is used, it acts as a spacer for regulating the distance between the plate-

shaped molds

2a, 2b. If necessary, a spacer (not shown) is provided between the plate-

shaped molds

2a, 2b. A tape or the like can also be used as a sealing material.
It is preferable that the bending elastic modulus of the molded body obtained in the present invention is 5000 MPa or less. If the flexural modulus exceeds 5000 MPa, the molded body becomes stiff, and the molded body may be chipped due to the force applied during mold opening. This is remarkable when the molded body is thin and has a large area.
[0009]
The plate-

shaped molds

2a and 2b used in the present invention may have a release layer on at least one inner surface thereof. As the release layer, a material that does not easily deform its shape under conditions where the liquid resin raw material is cured, for example, sufficient active energy rays or heat generated during curing, is used. Moreover, the thing which does not lose the function as a peeling layer during shaping | molding by melt | dissolving in the liquid raw material resin to be used is used.
For example, when a photocurable resin is used as the liquid resin material, the release layer used in at least one of the plate-

shaped molds

2a and 2b is made of a material that transmits an active energy ray sufficient to cure the photocurable resin. Used.
[0010]
As a material suitable for this purpose, a thermoplastic resin having low adhesiveness to a photocurable resin such as an amorphous resin such as a polystyrene resin or a cyclic polyolefin resin can be used. Examples of the polystyrene resin include homopolymers and copolymers made of styrene, dimethyl styrene, o-methyl styrene, and m-methyl styrene, and examples of the cyclic polyolefin resin include a trade name “ZEONEX” manufactured by Nippon Zeon Co., Ltd. ”, Trade name“ Apel ”manufactured by Mitsui Petrochemical Co., Ltd., and the like. Other amorphous resins include polycarbonate, polyarylate, polyethersulfone, and the like. Furthermore, a substance that can be melted or softened by heat, such as paraffin or gelatin, or a material that can be easily dissolved or swelled by a solvent can be used.
[0011]
As a method for forming the release layer, a release layer forming material is formed into a film or a sheet, and the release layer forming material is attached to the inner surfaces of the plate-shaped

molds

2a and 2b, or adhered by an adhesive, and the release layer forming material is melted. A method of coating the inner surfaces of the plate-shaped

molds

2a and 2b, a method of applying a solution obtained by dissolving the release layer forming material in a solvent or the like using a coating apparatus such as a spin coater or a bar coater, or solidifying the release layer forming material Alternatively, a method of immersing in a solution dissolved in a solvent or the like and taking out and solidifying the solution may be used. In any method, it is preferable to form the release layer so as to be uniform. If necessary, a release agent can be applied to the inner surfaces of the plate-shaped

molds

2a and 2b. In addition, a method in which a film coated with an adhesive whose adhesive strength is reduced after ultraviolet irradiation, for example, a PET film with adhesive is applied to the plate-shaped

molds

2a and 2b with a laminator and used as a release layer. .
The thickness of the release layer may be a thickness that can be easily peeled off from the molded body when the plate-shaped

molds

2a and 2b are opened.
The adhesion strength between the plate-shaped mold and the release layer is preferably 0.15 N / 25 mm or less, more preferably 0.1 N / 25 mm or less when the mold is opened. If the adhesion strength is greater than 0.15 N / 25 mm, the force applied to the plate mold for opening the mold becomes large, and the plate mold tends to be damaged or deformed. This is likely to occur when molding.
[0012]
A liquid resin material is injected into the cavity 5 defined by the plate-shaped

molds

2a and 2b and the seal material 3 which are opposed to each other using the mold 1 thus obtained, and is cured by active energy rays or heat. At this time, the mold 1 can be heated or cooled as necessary. The active energy ray should just be what hardens the liquid resin raw material to be used, for example, an ultraviolet-ray etc. are mentioned. The irradiation amount and heat amount of the active energy ray may be an amount that cures the liquid resin raw material to be used.
As the liquid resin used in the present invention, for example, a photo-curing resin or a thermosetting resin that is cured by irradiation with active energy rays such as ultraviolet rays is used. Examples of the photo-curing resin include a resin composition comprising an acrylate compound having a radical reactive unsaturated bond, a resin composition comprising an acrylate compound having a radical reactive unsaturated bond and a mercapto compound having a thiol group, epoxy acrylate, urethane Examples thereof include a resin composition obtained by melting an oligomer such as acrylate, polyester acrylate, or polyether acrylate into a polyfunctional acrylate monomer. In general, these photocurable resins are used in the presence of a photopolymerization initiator that generates radicals by active energy rays.
After the curing is completed by irradiation with active energy rays or heat, the plate-shaped

molds

2a and 2b are opened, and the molded body 7 is released.
[0013]
As a mold opening method for taking out the molded body, as shown in FIGS. 2 and 3, the plate-shaped mold 2b is fixed by the fixing jig 9, and then the plate-shaped mold 2a is used. The mold is opened by applying a force to the surface 8 that does not overlap 2b. As a method of applying the mold opening force, a push bar method in which the plate-shaped mold 2a is lifted upward from the plate-shaped mold 2b by using a push-up bar 10 or the like, and a nail-shaped treatment is performed from the direction of the plate-shaped mold 2a. Although the method etc. which hook a tool on the surface 8 and lift it upwards are mentioned, it is not limited to these.
[0014]
Further, the distribution of the force 11 acting on the surface 8 may be performed by applying a uniform force to the entire surface, but preferably a method of opening the mold using at least one of the surfaces 8 as the apex of the force distribution. In this case, it is more preferable that the side on which the plate-shaped mold is fixed becomes the apex of the force distribution. When opening the mold, a process for facilitating the mold opening, for example, a process such as heating the mold may be performed.
When the spacer 3 is used as a sealing material, it is desirable to remove it before the mold 1 is opened or before the mold 7 is peeled off in order to prevent cracks in the molded body 7.
As a method of releasing the molded body 7 attached to the plate-shaped

mold

2a or 2b after the plate-shaped

mold

2a or 2b is opened, for example, molding is performed on the plate-shaped mold 2a side through the release layer 4a. When the body 7 is adhered, a method of releasing the mold while inserting a sharp blade or the like between the plate-shaped mold 2a and the release layer 4a, or between the molded body 7 and the mold release layer 4a, a plate-shaped mold A method in which an adhesive tape or the like is attached to the end face of the molded body 7 not in close contact with 2a via a release layer 4b in some cases, or the molded body 7 is pulled apart, or a molded body 7 in close contact with the plate-shaped mold 2a. Examples of the method include, but are not limited to, a method in which air is blown and released from at least one direction on the side surface in the thickness direction of the end portion.
A method for facilitating peeling of the molded body 7, for example, heating at the time of peeling, heat retention from opening the mold to taking out the molded body, warming, etc. may be performed.
[0015]
When it is necessary to release the molded body and the release layer, the molded body with the release layer attached is heated after releasing the plate-shaped mold and release layer or with the plate-like mold attached. The release layer can be released by melting or softening. Moreover, it can also release by immersing the molded object to which the peeling layer adhered to the solvent which melt | dissolves a peeling layer, or apply | coating a solvent, dissolving or swelling a peeling layer, and removing. By releasing the release layer, a molded article having an excellent surface state can be obtained.
[0016]
【Example】
Hereinafter, the contents of the present invention will be described in more detail by way of examples. However, the present invention is not limited to the following examples unless it exceeds the gist. Evaluation and measurement were performed by the following methods.
(1) When opening the external appearance mold, whether or not the cured molded body was damaged was visually confirmed.
(2) Ease of mold opening Ease of mold opening when the mold was opened was evaluated in the following three stages.
○: Easy mold opening. Δ: Slightly difficult to open. X: It is difficult to open the mold.
(3) Release layer thickness The difference between the thickness of the mold and the thickness at which the completely cured release layer was formed on the mold was taken as the thickness of the release layer. The measuring instrument used was a thickness gauge.
(4) Flexural modulus Measured according to JIS k7203 except for the following test conditions.
Test speed 10mm / min, distance between fulcrums 30mm
Sample thickness 1mm x width 25mm x length 50mm
(5) Adhesive strength between plate-shaped mold and release layer A plate-shaped mold on which a release layer was formed was measured after being treated under curing conditions.
When the release layer was thin, a tape was applied as a reinforcement, and the end of the tape was pulled with an autograph to measure the adhesion strength. The reinforcing tape to be used was one that sufficiently adhered to the release layer and did not peel off during the measurement.
Measurement conditions: measurement width 25 mm, 180 ° peeling, measurement speed 10 mm / min
(6) Measured with a caliper between the molding cavities.
[0017]
Example 1
A solution in which ZEONEX (product name: ZEONEX 480, manufactured by Nippon Zeon Co., Ltd., trade name) is dissolved in mesitylene as a release layer on the inner surface of the mold, using a pair of glass flat plates (length 400 mm x width 400 mm x thickness 4 mm) as the mold. Was applied onto a glass flat plate using a spin coater, and then mesitylene was evaporated to form a 2 μm-thick release layer on the mold. The mold is opposed so that the release layer is on the inner surface, and in order to create two directions where the mold does not overlap each other, the mold is shifted about 12 mm in the diagonal direction of the mold, and the spacer and seal material are 10 mm wide and thick. A cavity was formed using a 0.2 mm silicon plate, and the periphery was sealed with a clip to form a mold.
The photo-curable resin includes 90 parts by weight of bis (oxymethyl) tricyclo [5,2,1,0 ^2,6 ] decanedimethacrylate, 10 parts by weight of pentaerythritol tetrakis (β-thiopropionate), and photopolymerization is started. A composition obtained by uniformly stirring and mixing 0.05 parts by weight of 2,4,6-trimethylbenzoyldiphenylphosphine oxide ("Lucirin TPO" manufactured by BASF) and 0.05 parts by weight of benzophenone as an agent, followed by defoaming Was used.
This composition was poured into a mold and cured by irradiating with ultraviolet rays having an integrated irradiation amount of 27000 mj / cm ² from the upper and lower surfaces of the glass with a metal halide lamp having an output of 160 W / cm. Thereafter, the mold was opened as shown in FIG. 3, and the molded body was taken out. The release layer adhered to the molded body was removed by washing with mesitylene. The evaluation and measurement results are shown in Table 1.
Example 2
In Example 1, a glass flat plate having a length of 750 mm × width of 750 mm × thickness of 6 mm, a silicon plate having a width of 10 mm and a thickness of 0.4 mm as a spacer, and an integrated irradiation amount of 30000 mj / cm ² were used. The same as the same example. The evaluation and measurement results are shown in Table 1.
Example 3
In Example 2, the photocurable resin includes 94 parts by weight of bis (oxymethyl) tricyclo [5,2,1,0 ^2,6 ] decanedimethacrylate, 6 amount of pentaerythritol tetrakis (β-thiopropionate). The same as the above example except that the part was changed. The evaluation and measurement results are shown in Table 1.
Example 4
In Example 1, a silicon plate having a width of 10 mm and a thickness of 1 mm was used as a spacer, and a 50 μm adhesive transparent PET film with an adhesive strength of 0.07 N / 25 mm was attached to a glass flat plate with a laminator. The integrated irradiation dose was 27000 mj / cm ² . After taking out the molded body, the pressure-sensitive adhesive PET film adhered to the molded body was peeled off by hand to take out the molded body. IPA was used as the cleaning liquid. Except for the above, this example was the same as the above example. The evaluation and measurement results are shown in Table 1.
Example 5
In Example 4, it was the same as that of Example except that the adhesion strength was 0.1 N / 25 mm. The evaluation and measurement results are shown in Table 1.
Example 6
In Example 4, it was the same as that of Example except that the adhesion strength was 0.15 N / 25 mm. The evaluation and measurement results are shown in Table 1.
Example 7
In Example 1, the photocurable resin includes 94 parts by weight of P-bis (β-methacryloyloxyethylthio) xylylene, 6 parts by weight of pentaerythritol tetrakis (β-thiopropionate), and 2, as a photopolymerization initiator. A composition obtained by uniformly stirring and mixing 0.05 parts by weight of 4,6-trimethylbenzoyldiphenylphosphine oxide (“Lucirin TPO” manufactured by BASF) and 0.05 parts by weight of benzophenone was used. The same as the example except that the spacer was a silicon plate having a width of 10 mm and a thickness of 0.4 mm, and the integrated dose was 30000 mj / cm ² . The evaluation and measurement results are shown in Table 1.
Example 8
In Example 7, 96 parts by weight of P-bis (β-methacryloyloxyethylthio) xylylene, 4 parts by weight of pentaerythritol tetrakis (β-thiopropionate) as a photocurable resin, 2,4,4 as photopolymerization initiators. A composition obtained by uniformly stirring and mixing 0.05 parts by weight of 6-trimethylbenzoyldiphenylphosphine oxide (“Lucirin TPO” manufactured by BASF) and 0.05 parts by weight of benzophenone was used. Moreover, it was the same as that of the same example except the thickness of the spacer having been 1 mm. The evaluation and measurement results are shown in Table 1.
Comparative Example 1
In Example 1, a sheet was obtained in the same manner as in the same example except that the portions where the opposing molds did not overlap each other were not made, and they were broken apart with a spatula or the like. The evaluation and measurement results are shown in Table 1.
Comparative Example 2
In Example 3, a sheet was obtained in the same manner as in the same example except that the portions where the opposing molds did not overlap each other were not made, and they were broken apart with a spatula or the like. The evaluation and measurement results are shown in Table 1.
Comparative Example 3
In Example 3, a sheet was obtained in the same manner as in Example 3 except that the molding cavity was 3 mm, the portions where the opposing molds did not overlap each other were not formed, and the plate was broken apart with a spatula or the like. The evaluation and measurement results are shown in Table 1.
[0018]
[Table 1]

Example 9
A glass flat plate (length 300 mm x width 400 mm x thickness 5 mm) is shifted by about 8 mm to create a part where the opposing molds do not overlap, and a cavity is formed by using a silicon plate with a width of 5 mm and a thickness of 1 mm as a spacer. An injection mold was formed by sealing with tape.
The photocurable resin includes 94 parts by weight of bis (oxymethyl) tricyclo [5.2.1.0 ^2,6 ] decanedimethacrylate, ⁶ parts by weight of pentaerythritol tetrakis (β-thiopropionate), and photopolymerization is started. A composition obtained by uniformly stirring and mixing 0.06 part by weight of 2,4,6-trimethylbenzoyldiphenylphosphine oxide ("Lucirin TPO" manufactured by BASF) and 0.04 part by weight of benzophenone as agents. Was used.
This composition was poured into an injection mold and cured by irradiating with ultraviolet rays having an integrated irradiation amount of 23000 mj / cm ² from the upper and lower surfaces of the glass surface with a metal halide lamp having an output of 160 W / cm. Thereafter, the entire injection mold was put into an oven at 150 ° C., and the mold was opened. The evaluation and measurement results are shown in Table 2.
[0019]
Example 10
In Example 9, a solution obtained by dissolving ZEONEX (trade name: ZEONEX 480, manufactured by Nippon Zeon Co., Ltd.) in xylene as a release layer on a glass flat plate was applied onto a mold using a spin coater, and then xylene. The ZEONEX thin film having a thickness of 5 μm was formed on the mold. The same as the above example except that the ZEONEX thin film surface is opposed to the inner surface, a silicon plate having a width of 5 mm and a thickness of 1 mm is used as a spacer, a cavity is formed, and the periphery is sealed with tape to form an injection mold. did. The evaluation and measurement results are shown in Table 2.
[0020]
Example 11
In Example 10, a glass flat plate having a length of 750 mm, a width of 750 mm, and a thickness of 6 mm was used, and a silicon plate having a width of 5 mm and a thickness of 0.4 mm was used as a spacer. The evaluation and measurement results are shown in Table 2.
[0021]
Example 12
In Example 10, a mold was immersed in a liquid tank in which polystyrene (trade name: Dialex HH-102, manufactured by Mitsubishi Chemical Corporation) was dissolved in xylene as a release layer, and then xylene was evaporated to form a mold. The same as the above example except that a polystyrene thin film was formed thereon. The evaluation and measurement results are shown in Table 2.
[0022]
Comparative Example 4
In Example 9, a sheet was obtained in the same manner as in Example 9 except that the portions where the opposing molds did not overlap were not formed, and the mold was opened with a spatula or the like. The evaluation and measurement results are shown in Table 2.
[0023]
Comparative Example 5
In Example 10, a sheet was obtained in the same manner as in the same example except that the portions where the opposing molds did not overlap were not formed and the mold was opened with a spatula or the like. The evaluation and measurement results are shown in Table 2.
[0024]
Comparative Example 6
In Example 11, a sheet was obtained in the same manner as in the same example except that the portions where the opposing molds did not overlap were not formed and the mold was opened with a spatula or the like. The evaluation and measurement results are shown in Table 2.
[0025]
[Table 2]

[0026]
【The invention's effect】
According to the molding die of the present invention and the method for removing the molded product from the molding die, it is easy to make a thin film, and a molded product of a large area can be obtained without damage, and can be easily mechanized and automated, and the molded product can be produced with high productivity. Can be manufactured.
[Brief description of the drawings]
FIG. 1 is a partially cutaway perspective view of a mold showing an embodiment of the present invention.
FIG. 2 is a sectional view of a mold showing an embodiment of the present invention.
FIG. 3 is a mold opening example of a mold showing an embodiment of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1

Mold

2a, 2b Plate-shaped mold 3

Sealing material

4a, 4b Release layer 5 Cavity 6 Active energy ray or heat ray 7 Molded body 8 Action point (surface)
9 Fixing jig 10 Push-up bar 11 Pulling force

Claims

A pair of plate-shaped molds (hereinafter, one of the pairs is referred to as 2a and the other as 2b) are opposed to each other at a predetermined interval so as not to partially overlap , and the peripheral portion is sealed to form a cavity Forming a molded body by injecting a liquid resin into the cavity and curing it , fixing one of the plate-shaped molds 2a and 2b, and in at least one direction of the unfixed plate-shaped mold A method for producing a molded body, comprising: applying a force to a portion where a part of the mold does not overlap each other, opening the mold, and taking out the molded body .

The method for producing a molded article according to claim 1 , wherein the interval between the cavities is in a range of 0.1 mm to 5 mm.

The method for producing a molded body according to claim 1 or 2, wherein a release layer is interposed between the inner surfaces of the pair of plate-shaped molds.

The method for producing a molded body according to claim 3, wherein the adhesion strength between the plate-shaped mold and the release layer is 0.15 N / 25 mm or less when the mold is opened.

5. The release layer according to claim 3 or 4, wherein the release layer is obtained by applying a solution of a release layer forming material dissolved in a melt or a solvent to the inner surface of the plate-shaped mold and then curing. Manufacturing method of a molded object .

The method for producing a molded body according to any one of claims 3 to 5, wherein the release layer is made of an amorphous resin.

The method for producing a molded article according to any one of claims 3 to 6, wherein the release layer is made of a polystyrene resin or a cyclic polyolefin resin.