CN113414914A - Preparation mold for epoxy resin plate for insulation in power industry - Google Patents
Preparation mold for epoxy resin plate for insulation in power industry Download PDFInfo
- Publication number
- CN113414914A CN113414914A CN202110524526.XA CN202110524526A CN113414914A CN 113414914 A CN113414914 A CN 113414914A CN 202110524526 A CN202110524526 A CN 202110524526A CN 113414914 A CN113414914 A CN 113414914A
- Authority
- CN
- China
- Prior art keywords
- supporting platform
- epoxy resin
- adjusting device
- groove
- movable plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C39/00—Shaping by casting, i.e. introducing the moulding material into a mould or between confining surfaces without significant moulding pressure; Apparatus therefor
- B29C39/22—Component parts, details or accessories; Auxiliary operations
- B29C39/26—Moulds or cores
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C33/00—Moulds or cores; Details thereof or accessories therefor
- B29C33/30—Mounting, exchanging or centering
- B29C33/308—Adjustable moulds
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
- B29K2063/00—Use of EP, i.e. epoxy resins or derivatives thereof, as moulding material
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
- B29L2007/00—Flat articles, e.g. films or sheets
- B29L2007/002—Panels; Plates; Sheets
Abstract
The invention relates to a preparation die for an epoxy resin plate for insulation in the power industry, in particular to a preparation die for an epoxy resin plate with controllable thickness. The device comprises a supporting platform with a groove, wherein a cover plate serving as an upper plane of a mold cavity is arranged on the upper plane of the supporting platform, and horizontal adjusting devices are arranged at four corners of a lower plane; a movable plate serving as a lower plane of a mold cavity is arranged in the groove, and scale marks are arranged on the side surface of the movable plate; a pouring port is arranged in the center of the cover plate, and a universal level gauge is arranged on the upper plane; the horizontal adjusting device consists of a first screw hole and a single-head hexagonal stud corresponding to the first screw hole; the lower part of the movable plate is connected with a height adjusting device, the height adjusting device consists of a second screw hole, a flat head screw and a nut, and the flat head screw and the nut correspond to the second screw hole, and the two nuts are fixed on the supporting platform. The invention can accurately manufacture epoxy resin plates with different thicknesses according to requirements and can improve the uniformity and the flatness of the plates.
Description
Technical Field
The invention relates to an epoxy resin plate preparation mold, in particular to an epoxy resin plate preparation mold with controllable thickness.
Background
The epoxy resin is used as an insulating material with high insulating strength, good mechanical property and environmental protection, is widely applied to a power system and provides an important insulating and supporting effect. The aging of the epoxy resin insulating material is related to the insulating quality of the power equipment, and the improvement of the voltage grade of the power transmission line also puts higher requirements on the insulating capability and the heat resistance of the epoxy resin. The research on the aging mechanism of epoxy resin and the modification of materials by various means is a research hotspot, and the first step of the research is to prepare a large number of epoxy resin plate samples.
The depth of the epoxy resin plate preparation mold commonly used in a laboratory at present can not be adjusted, so that the thickness of a prepared sample is fixed, and the requirements of experimental research under different conditions are not facilitated. And the levelness of the epoxy resin plate preparation mould commonly used in a laboratory cannot be adjusted, and the material may flow to a lower part in a long-time high-temperature curing process, so that the plate is not flat and uniform.
Disclosure of Invention
The epoxy resin plate preparation die for insulation in the power industry can accurately prepare epoxy resin plates with different thicknesses according to requirements, and can improve the uniformity and the flatness of the plates.
In order to achieve the purpose, the invention adopts the following technical scheme:
the utility model provides a controllable epoxy panel preparation mould of thickness which main characterized in that: the device comprises a supporting platform (1) internally provided with a groove (2), wherein a cover plate (3) serving as the upper plane of a mold cavity is arranged on the upper plane of the supporting platform (1), and horizontal adjusting devices (5) are arranged at four corners of the lower plane; a movable plate (4) serving as a lower plane of a mold cavity is arranged in the groove (2), and scale marks (6) are arranged on the side surface of the groove; a pouring gate (7) is arranged in the center of the cover plate (2), and a universal level gauge (8) is arranged on the upper plane; the horizontal adjusting device (5) consists of a first screw hole (9) and a single-head hexagonal stud (10) corresponding to the first screw hole; the lower part of the movable plate (4) is connected with a height adjusting device (6), the height adjusting device (6) consists of a second screw hole (11), a flat head screw (12) and a nut (13), and the two nuts (13) are fixed on the supporting platform (1).
Further, the length of the supporting platform (1) is 15.0cm, the width is 15.0cm, and the height is 5.0 cm; the length of the groove (2) is 10.0cm, the width is 10.0cm, and the depth is 2.0 cm; the cover plate (3) is 15.0cm long, 15.0cm wide and 1.0cm thick; the movable plate (4) is 10.0cm long, 10.0cm wide and 1.0cm thick.
Furthermore, the supporting platform (1) has 5 screw holes in total, the number of the first screw holes for the horizontal adjusting device (5) is 4, and the first screw holes correspond to 4 single-head hexagonal studs (10); the number of the second screw holes (11) for the height adjusting device (5) is 1, and the second screw holes correspond to the flat head screws (12) and the nuts (13).
Furthermore, the levelness of the supporting platform (1) can be adjusted by rotating the single-head hexagonal stud (10), and the universal level gauge (8) can be used for observing whether the supporting platform (1) is horizontal or not.
Further, the height of the movable plate (4), namely the depth of a mold cavity, can be adjusted by rotating the grub screw (12); the depth range of the mold cavity is 1.0mm-5.0 mm; the scale marks (6) on the side surfaces of the groove (2) can be used for observing the specific depth of the mold cavity.
Furthermore, the supporting platform (1), the cover plate (3) and the movable plate (4) are made of high-temperature-resistant transparent high borosilicate glass.
Drawings
FIG. 1 is a schematic structural view of a thickness-controllable epoxy resin plate manufacturing mold according to the present invention;
in the figure: 1. a support platform; 2. a groove; 3. a cover plate; 4. a movable plate; 5. a leveling device; 6. scale lines; 7. pouring a mouth; 8. a universal level; 9. a first screw hole; 10. a single-headed hexagonal screw; 11. a second screw hole; 12. a flat head screw; 13. and a nut.
Detailed Description
The present invention will be further explained with reference to the drawings attached to the specification.
As shown in figure 1, the thickness-controllable epoxy resin plate preparation mold provided by the invention comprises a supporting platform (1) with a groove (2) arranged therein, wherein a cover plate (3) serving as an upper plane of a mold cavity is arranged on an upper plane of the supporting platform (1), and horizontal adjusting devices (5) are arranged at four corners of a lower plane; a movable plate (4) serving as a lower plane of a mold cavity is arranged in the groove (2), and scale marks (6) are arranged on the side surface of the groove; a pouring gate (7) is arranged in the center of the cover plate (2), and a universal level gauge (8) is arranged on the upper plane; the horizontal adjusting device (5) consists of a first screw hole (9) and a single-head hexagonal stud (10) corresponding to the first screw hole; the lower part of the movable plate (4) is connected with a height adjusting device (6), the height adjusting device (6) consists of a second screw hole (11), a flat head screw (12) and a nut (13), and the two nuts (13) are fixed on the supporting platform (1).
The length of the supporting platform (1) is 15.0cm, the width is 15.0cm, and the height is 5.0 cm; the length of the groove (2) is 10.0cm, the width is 10.0cm, and the depth is 2.0 cm; the cover plate (3) is 15.0cm long, 15.0cm wide and 1.0cm thick; the movable plate (4) is 10.0cm long, 10.0cm wide and 1.0cm thick.
The supporting platform (1) is provided with 5 screw holes in total, the number of the first screw holes for the horizontal adjusting device (5) is 4, and the first screw holes correspond to 4 single-head hexagonal studs (10); the number of the second screw holes (11) for the height adjusting device (5) is 1, and the second screw holes correspond to the flat head screws (12) and the nuts (13).
The levelness of the supporting platform (1) can be adjusted by rotating the single-head hexagonal stud (10), and the universal level meter (8) can be used for observing whether the supporting platform (1) is horizontal or not.
The height of the movable plate (4), namely the depth of a mold cavity, can be adjusted by rotating the flat head screw (12); the depth range of the mold cavity is 1.0mm-5.0 mm; the scale marks (6) on the side surfaces of the groove (2) can be used for observing the specific depth of the mold cavity.
The supporting platform (1), the cover plate (3) and the movable plate (4) are made of high-temperature-resistant transparent high borosilicate glass.
When the device is used, firstly, the flat head screw (12) is rotated, the movable plate (4) is adjusted to a proper height through the observation of the scale marks (6) on the side surface of the groove (2), and the thickness of the prepared epoxy resin plate is ensured to meet the requirement of experimental research; then, rotating the single-end hexagonal stud (10), and judging whether the supporting platform (1) is horizontal or not by observing the universal level meter (8) to ensure that the uniformity and the flatness of the prepared epoxy resin plate meet the requirements of experimental research; then placing the mold into an oven for preheating for 30min at the temperature of 80 ℃, taking out the mold, uniformly spraying a release agent in the mold cavity, injecting a liquid epoxy resin material into the mold cavity through a pouring gate (7) in the middle of a cover plate (2), and stopping when the mold cavity is observed to be filled with the epoxy resin; and finally, curing according to a curing curve of between 80 ℃ for 2h and 120 ℃ for 2h, and cooling and demolding after curing is finished.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (6)
1. The utility model provides an electric power industry is insulating with epoxy panel preparation mould which main characterized in that: the device comprises a supporting platform (1) internally provided with a groove (2), wherein a cover plate (3) serving as the upper plane of a mold cavity is arranged on the upper plane of the supporting platform (1), and horizontal adjusting devices (5) are arranged at four corners of the lower plane; a movable plate (4) serving as a lower plane of a mold cavity is arranged in the groove (2), and scale marks (6) are arranged on the side surface of the groove; a pouring gate (7) is arranged in the center of the cover plate (2), and a universal level gauge (8) is arranged on the upper plane; the horizontal adjusting device (5) consists of a first screw hole (9) and a single-head hexagonal stud (10) corresponding to the first screw hole; the lower part of the movable plate (4) is connected with a height adjusting device (6), the height adjusting device (6) consists of a second screw hole (11), a flat head screw (12) and a nut (13), and the two nuts (13) are fixed on the supporting platform (1).
2. The epoxy resin plate preparation mold for electric power industry insulation as claimed in claim 1, wherein: the length of the supporting platform (1) is 15.0cm, the width is 15.0cm, and the height is 5.0 cm; the length of the groove (2) is 10.0cm, the width is 10.0cm, and the depth is 2.0 cm; the cover plate (3) is 15.0cm long, 15.0cm wide and 1.0cm thick; the movable plate (4) is 10.0cm long, 10.0cm wide and 1.0cm thick.
3. The epoxy resin plate preparation mold with controllable thickness as claimed in claim 1, wherein: the supporting platform (1) is provided with 5 screw holes in total, the number of the first screw holes for the horizontal adjusting device (5) is 4, and the first screw holes correspond to 4 single-head hexagonal studs (10); the number of the second screw holes (11) for the height adjusting device (5) is 1, and the second screw holes correspond to the flat head screws (12) and the nuts (13).
4. The epoxy resin plate preparation mold for electric power industry insulation as claimed in claim 1, wherein: the levelness of the supporting platform (1) can be adjusted by rotating the single-head hexagonal stud (10), and the universal level meter (8) can be used for observing whether the supporting platform (1) is horizontal or not.
5. The epoxy resin plate preparation mold for electric power industry insulation as claimed in claim 1, wherein: the height of the movable plate (4), namely the depth of a mold cavity, can be adjusted by rotating the flat head screw (12); the depth range of the mold cavity is 1.0mm-5.0 mm; the scale marks (6) on the side surfaces of the groove (2) can be used for observing the specific depth of the mold cavity.
6. The epoxy resin plate preparation mold for electric power industry insulation as claimed in claim 1, wherein: the supporting platform (1), the cover plate (3) and the movable plate (4) are made of high-temperature-resistant transparent high borosilicate glass.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110524526.XA CN113414914A (en) | 2021-05-13 | 2021-05-13 | Preparation mold for epoxy resin plate for insulation in power industry |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110524526.XA CN113414914A (en) | 2021-05-13 | 2021-05-13 | Preparation mold for epoxy resin plate for insulation in power industry |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113414914A true CN113414914A (en) | 2021-09-21 |
Family
ID=77712367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110524526.XA Pending CN113414914A (en) | 2021-05-13 | 2021-05-13 | Preparation mold for epoxy resin plate for insulation in power industry |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113414914A (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4223865A (en) * | 1978-08-18 | 1980-09-23 | Flores Salomon S | Molding assembly for forming winding arbors |
| JP2001030274A (en) * | 1999-05-17 | 2001-02-06 | Mitsubishi Chemicals Corp | Molding tool and molding body taking-out method |
| JP2014188999A (en) * | 2013-03-28 | 2014-10-06 | Mitsubishi Aircraft Corp | Molding device for fiber-reinforced plastic member, and method for molding the same |
| CN206030354U (en) * | 2016-09-08 | 2017-03-22 | 哈尔滨理工大学 | A mould for pouring epoxy resin nanocomposite disc sample |
| CN206374097U (en) * | 2016-12-30 | 2017-08-04 | 恩平市汇雄车品有限公司 | One kind nail bottom wire ring novel negative ion automatic foot-mat makes mould |
| CN210820516U (en) * | 2019-07-09 | 2020-06-23 | 四川大学 | Adjustable clamp plate mould of thickness |
| CN211389787U (en) * | 2019-11-06 | 2020-09-01 | 哈尔滨理工大学 | Thickness-controllable die of epoxy resin composite material for electrical property test |
-
2021
- 2021-05-13 CN CN202110524526.XA patent/CN113414914A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4223865A (en) * | 1978-08-18 | 1980-09-23 | Flores Salomon S | Molding assembly for forming winding arbors |
| JP2001030274A (en) * | 1999-05-17 | 2001-02-06 | Mitsubishi Chemicals Corp | Molding tool and molding body taking-out method |
| JP2014188999A (en) * | 2013-03-28 | 2014-10-06 | Mitsubishi Aircraft Corp | Molding device for fiber-reinforced plastic member, and method for molding the same |
| CN206030354U (en) * | 2016-09-08 | 2017-03-22 | 哈尔滨理工大学 | A mould for pouring epoxy resin nanocomposite disc sample |
| CN206374097U (en) * | 2016-12-30 | 2017-08-04 | 恩平市汇雄车品有限公司 | One kind nail bottom wire ring novel negative ion automatic foot-mat makes mould |
| CN210820516U (en) * | 2019-07-09 | 2020-06-23 | 四川大学 | Adjustable clamp plate mould of thickness |
| CN211389787U (en) * | 2019-11-06 | 2020-09-01 | 哈尔滨理工大学 | Thickness-controllable die of epoxy resin composite material for electrical property test |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20210921 |
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| WD01 | Invention patent application deemed withdrawn after publication |