CN105666801A - Sandwich tablet sample preparing die for epoxy resin and method - Google Patents
Sandwich tablet sample preparing die for epoxy resin and method Download PDFInfo
- Publication number
- CN105666801A CN105666801A CN201610236089.0A CN201610236089A CN105666801A CN 105666801 A CN105666801 A CN 105666801A CN 201610236089 A CN201610236089 A CN 201610236089A CN 105666801 A CN105666801 A CN 105666801A
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- Prior art keywords
- sandwich
- sample
- epoxy resin
- die
- tabletting
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/17—Component parts, details or accessories; Auxiliary operations
- B29C45/26—Moulds
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14467—Joining articles or parts of a single article
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14467—Joining articles or parts of a single article
- B29C2045/14532—Joining articles or parts of a single article injecting between two sheets
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Casting Or Compression Moulding Of Plastics Or The Like (AREA)
Abstract
The invention discloses a sandwich tablet sample preparing die for epoxy resin and a method. The sample preparing die is formed by aligning and overlapping a bottom layer mirror face plate, a bottom layer thin film, a middle thickness-setting die, an upper layer thin film and an upper layer mirror face plate. A cavity is formed in a middle thickness-setting interlayer. The sample preparing method includes the following steps of firstly, putting the bottom layer thin film on the bottom layer mirror face plate, and putting the middle thickness-setting interlayer on the bottom layer thin film; secondly, injecting epoxy resin in a die cavity of the middle thickness-setting interlayer through an injector; thirdly, covering with the upper layer thin film gradually from one side to the other side, and removing bubbles from the edge of the die if bubbles exist; fourthly, covering with the upper layer mirror face plate; fifthly, slowly putting a cast sample on a preheated press vulcanizer to be subjected to pressurization and time-shared curing, and taking out the sample after natural cooling and demolding. The prepared sample is high in quality and uniform in thickness, the sample of any thickness can be prepared, and the interference factors in the measurement process are greatly reduced.
Description
Technical field
The invention belongs to High-Voltage Insulation field of material technology, relate to a kind of brand-new epoxy specimens producing device and technique.
Background technology
The sample production technique of current epoxy resin is mainly casting method, first in preheated steel mold, pour into the epoxy resin mixed of certain volume, then pass through adjustment die angle or make liquid cover whole mould with Glass rod drain, being finally putting on the horizontal stand in baking oven timesharing is heating and curing, and technological process is as illustrated in fig. 1 and 2. The major defect of this technique is as follows:
1, the thickness controllability being limited the sample causing the method for building by mould processing technology and surface tension of liquid effect is more weak, it is impossible to manufacture the sample (particularly the thickness sample less than 500 μm) of any thickness.
2, the thickness evenness of this technique manufacture sample depends on the levelness of horizontal stand and the level condition of mould. The sample uneven distribution built is even, and sample various piece thickness difference is bigger. Easily because the reason of sample thickness causes conclusion mistake in measurement process.
3, in this technique sample solidification process, sample lower surface and contacting dies (steel) upper surface and air contact. The difference of heat-transfer matcrial and degree of oxidation causes that the different phenomenon of upper and lower surface color easily occurs in obtained sample. It is likely to have a certain impact to measurement.
4, because liquid-state epoxy resin viscosity is relatively larger, and when building the sample of thinner thickness under surface tension effects, this technique to build levelling process more difficult.
5, in incubator in the process of curing molding, because being uncovered above mould, sample is directly exposed in the environment of incubator. And it cannot be guaranteed that clean room in incubator in reality, may result in some impurity so in the curing process falls in sample and is cured to inside sample, causes obtained sample existing defects.
Summary of the invention
In order to overcome the drawbacks described above of existing technique, the invention provides a kind of sandwich tabletting sampling die for epoxy resin and method. The sample mass that the present invention prepares is high, and thickness is uniform, and can prepare the sample of any thickness, greatly reduces the interference factor in measurement process.
It is an object of the invention to be achieved through the following technical solutions:
A kind of sandwich tabletting sampling die for epoxy resin, is stacked together by bottom mirror board, bottom film, middle fixed thick mould, topmost thin film and the alignment of upper strata mirror board from bottom to top successively, and described centre is determined the centre of heavy parting and is provided with die cavity.
A kind of sandwich tabletting method for making sample for epoxy resin, comprises the steps:
One, bottom film is placed on bottom mirror board, then heavy parting is determined in centre is placed on bottom film.
Two, determine in the die cavity of heavy parting in centre by syringe injection ring epoxy resins.
Three, cover topmost thin film, if epiphragma process has bubble to another side cover gradually in the past from side, bubble is arrived in die edge and gets rid of.
Four, covering upper strata mirror board, between each layer, alignment is stacked together and is combined into sandwich structure sample;
Five, to putting in vulcanizing press pressurization elevated cure without relative displacement thereafter between each layer of sandwich structure sample that would be combined into, after its natural cooling, sample is taken out in the demoulding.
Present invention have the advantage that
1, mirror face stainless steel is easily processed, and die cost is cheap, and in any combination, only can need to change and middle determine heavy parting and realize one module multiple usages.
2, only with syringe, the epoxy resin liquid of certain volume need to be injected in mould at the sample preparation initial stage, angle need not be adjusted and make epoxy resin liquid levelling, enter bubble without because of its flow process simultaneously, cause the internal existing defects of sample.
3, the thickness that the thickness of obtained sample is determined heavy parting by centre completely determines, thickness controllability is strong, it may be achieved sample thickness is precisely controlled, and obtained sample each several part thickness is uniform, it is possible to meet relative thickness error precision requirement.
4, in the curing process, epoxy resin is in air-tight state, and introduced contaminants will not fall into sample and forms internal flaw, without because sample is directly exposed oxidized in atmosphere.
5, in the curing process, sample is conducted heat by sample upper and lower surface either directly through corrosion resistant plate, because of contact material difference, sample upper and lower surface will not cause that sample color and the extent of reaction are different, and sample is direct and contact heater plate, the reaction temperature of sample is controlled relatively stricter, is conducive to solidifying better.
6, the two-sided transparent mould release membrance of silicone oil PET used is mantle, is conducive to getting rid of air, and this kind of film transparency is high, it is simple to observe in sample and have bubble-free, and can get rid of in time.
7, use the two-sided transparent mould release membrance of silicone oil PET can release agent-free, from without leaving one layer of releasing agent at specimen surface after demoulding, and specimen surface smoothness is high, it is possible to reaches requirement of experiment, sample need not be carried out grinding process.
Accompanying drawing explanation
Fig. 1 is the process flow diagram of casting method;
Fig. 2 is the process chart of casting method;
Fig. 3 is sandwich tabletting sample preparation device structural representation;
Fig. 4 is that the A-A of Fig. 3 is to sectional view;
Fig. 5 is the middle structural representation determining heavy parting;
Fig. 6 is the process chart of sandwich tabletting sample preparation method;
Fig. 7 is the process flow diagram of sandwich tabletting sample preparation method.
Detailed description of the invention
Below technical scheme is further described, but is not limited thereto, every technical solution of the present invention modified or equivalent replaces, without deviating from the spirit and scope of technical solution of the present invention, all should be encompassed in protection scope of the present invention.
Detailed description of the invention one: as in Figure 3-5, the sandwich tabletting sampling die of the epoxy resin that present embodiment provides is determined heavy parting 3, topmost thin film 4 and upper strata mirror board 5 alignment stacked together by bottom mirror board 1, bottom film 2, centre successively from bottom to top, and described centre is determined the centre of heavy parting 3 and is provided with die cavity 6.
In present embodiment, described bottom mirror board 1 and upper strata mirror board 5 are mirror face stainless steel plate.
In present embodiment, described bottom film 2 and topmost thin film 4 are the two-sided transparent mould release membrance of silicone oil PET.
In present embodiment, it is 0.2～1mm that the thickness of heavy parting 3 is determined in described centre.
In present embodiment, the cross section of described die cavity 6 can be processed into arbitrary shape according to actual needs, for instance oval, square, circular, dumb-bell shape etc.
Detailed description of the invention two: present embodiment is for E51 epoxy resin, it is provided that the sandwich tabletting method for making sample of a kind of epoxy resin, as shown in Figures 6 and 7, specifically comprises the following steps that
1,50gE-51 epoxy resin-base is put into 70 DEG C of preheatings in vacuum drying oven and within 30 minutes, reduces its viscosity.
2, take out preheated epoxy resin-base and add 40g methyl hexahydrophthalic anhydride firming agent, 0.5g Imidizole accelerator.
3, mixed liquor is placed in 70 DEG C of thermostatical oil baths, and makes firming agent mix homogeneously with epoxy matrix with motor stirrer stirring 30min.
4, the solution mixed is put into evacuation stirring aerofluxus two hours in vacuum drying oven, till bubble-free precipitates out.
5, first bottom PET film is placed on bottom mirror face stainless steel plate, then centre is determined heavy parting is placed in bottom PET film (two template sizes are identical, alignment be stacked together).
6, inject respective volume epoxy resin (somewhat interference) with syringe to determine in the die cavity of heavy parting in centre.
7, cover upper strata PET film, epiphragma process going over (avoiding producing bubble) if there being bubble to another side cover gradually from side, bubble being arrived in die edge and gets rid of.
8, upper strata mirror face stainless steel plate is covered.
9, the sample built slowly is put on preheated vulcanizing press, starts pressurization (pressure setting is 15Mp) and open automatic dental filling switch. And start timing, and it is maintained at 80 DEG C of 2h, is warming up to 100 DEG C again and keeps 2h, be finally warming up to 120 DEG C and keep closing after 4h heater switch, after its natural cooling, sample is taken out in the demoulding.
Claims (10)
1. the sandwich tabletting sampling die for epoxy resin, it is characterized in that described sandwich tabletting sampling die is stacked together by bottom mirror board, bottom film, middle fixed thick mould, topmost thin film and the alignment of upper strata mirror board from bottom to top successively, described centre is determined the centre of heavy parting and is provided with die cavity.
2. the sandwich tabletting sampling die for epoxy resin according to claim 1, it is characterised in that described bottom mirror board and upper strata mirror board are mirror face stainless steel plate.
3. the sandwich tabletting sampling die for epoxy resin according to claim 1, it is characterised in that described bottom film and topmost thin film are the two-sided transparent mould release membrance of silicone oil PET.
4. the sandwich tabletting sampling die for epoxy resin according to claim 1, it is characterised in that it is 0.2～1mm that the thickness of heavy parting is determined in described centre.
5. the sandwich tabletting sampling die for epoxy resin according to claim 1, it is characterised in that the cross section of described die cavity is arbitrary shape.
6. the sandwich tabletting method for making sample for epoxy resin, it is characterised in that described sandwich tabletting method for making sample step is as follows:
One, bottom film is placed on bottom mirror board, then centre is determined heavy parting is placed on bottom film;
Two, determine in the die cavity of heavy parting by syringe injection ring epoxy resins in centre;
Three, cover topmost thin film, epiphragma process is gone over to another side cover gradually from side, if there being bubble, bubble being arrived in die edge and gets rid of;
Four, covering upper strata mirror board, between each layer, alignment is stacked together and is combined into sandwich structure sample;
Five, putting in vulcanizing press pressurization elevated cure without relative displacement between each layer of sandwich structure sample that would be combined into, after its natural cooling, sample is taken out in the demoulding.
7. the sandwich tabletting method for making sample for epoxy resin according to claim 6, it is characterised in that bottom mirror board and upper strata mirror board are mirror face stainless steel plate.
8. the sandwich tabletting method for making sample for epoxy resin according to claim 6, it is characterised in that described bottom film and topmost thin film are the two-sided transparent mould release membrance of silicone oil PET.
9. the sandwich tabletting method for making sample for epoxy resin according to claim 6, it is characterised in that it is 0.2～1mm that the thickness of heavy parting is determined in described centre.
10. the sandwich tabletting method for making sample for epoxy resin according to claim 6, it is characterised in that the cross section of described die cavity is arbitrary shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610236089.0A CN105666801A (en) | 2016-04-15 | 2016-04-15 | Sandwich tablet sample preparing die for epoxy resin and method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610236089.0A CN105666801A (en) | 2016-04-15 | 2016-04-15 | Sandwich tablet sample preparing die for epoxy resin and method |
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| CN105666801A true CN105666801A (en) | 2016-06-15 |
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| CN201610236089.0A Pending CN105666801A (en) | 2016-04-15 | 2016-04-15 | Sandwich tablet sample preparing die for epoxy resin and method |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106482996A (en) * | 2016-10-28 | 2017-03-08 | 南京理工大学 | A kind of preparation facilitiess of miniature circular celluloid sheets sample and method |
| CN106872226A (en) * | 2017-01-04 | 2017-06-20 | 浙江大学 | By making the method that the imitative body of solid is corrected to agricultural product optical characteristics detection means by oneself |
| CN110355932A (en) * | 2019-06-21 | 2019-10-22 | 西安交通大学 | A kind of preparation facilities and method of multi-layer dielectric material |
| CN110357754A (en) * | 2019-07-25 | 2019-10-22 | 西北工业大学 | A kind of lamination solid propellant molding die and preparation process |
| CN111077101A (en) * | 2019-12-12 | 2020-04-28 | 湖北航天化学技术研究所 | Preparation method of film sample for infrared spectrum quantitative analysis |
| CN114018679A (en) * | 2021-10-19 | 2022-02-08 | 深圳市卓宝科技股份有限公司 | Sample preparation method for non-cured coiled material |
| CN116021693A (en) * | 2022-12-21 | 2023-04-28 | 安徽佳力奇先进复合材料科技股份公司 | Liquid resin casting sample preparation die and method |
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| CN102564816A (en) * | 2010-12-23 | 2012-07-11 | 中国石油化工股份有限公司 | Sample preparation method of viscous solid matter and one-hole sample preparation mold used by same |
| CN102721581A (en) * | 2011-03-30 | 2012-10-10 | 中国石油化工股份有限公司 | Sample-preparing method for viscous solid substances and multihole sample-preparing mould used therein |
| JP5071214B2 (en) * | 2008-04-14 | 2012-11-14 | 富士通株式会社 | Electronic device casing and method of manufacturing electronic device casing |
| CN205572901U (en) * | 2016-04-15 | 2016-09-14 | 哈尔滨理工大学 | A sandwich preforming system original mold utensil for epoxy |
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Patent Citations (4)
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| JP5071214B2 (en) * | 2008-04-14 | 2012-11-14 | 富士通株式会社 | Electronic device casing and method of manufacturing electronic device casing |
| CN102564816A (en) * | 2010-12-23 | 2012-07-11 | 中国石油化工股份有限公司 | Sample preparation method of viscous solid matter and one-hole sample preparation mold used by same |
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| CN205572901U (en) * | 2016-04-15 | 2016-09-14 | 哈尔滨理工大学 | A sandwich preforming system original mold utensil for epoxy |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106482996A (en) * | 2016-10-28 | 2017-03-08 | 南京理工大学 | A kind of preparation facilitiess of miniature circular celluloid sheets sample and method |
| CN106872226A (en) * | 2017-01-04 | 2017-06-20 | 浙江大学 | By making the method that the imitative body of solid is corrected to agricultural product optical characteristics detection means by oneself |
| CN106872226B (en) * | 2017-01-04 | 2023-09-29 | 浙江大学 | Method for correcting agricultural product optical characteristic detection device through self-made solid imitation body |
| CN110355932A (en) * | 2019-06-21 | 2019-10-22 | 西安交通大学 | A kind of preparation facilities and method of multi-layer dielectric material |
| CN110355932B (en) * | 2019-06-21 | 2020-06-19 | 西安交通大学 | Preparation device and method of multilayer dielectric material |
| CN110357754A (en) * | 2019-07-25 | 2019-10-22 | 西北工业大学 | A kind of lamination solid propellant molding die and preparation process |
| CN111077101A (en) * | 2019-12-12 | 2020-04-28 | 湖北航天化学技术研究所 | Preparation method of film sample for infrared spectrum quantitative analysis |
| CN114018679A (en) * | 2021-10-19 | 2022-02-08 | 深圳市卓宝科技股份有限公司 | Sample preparation method for non-cured coiled material |
| CN114018679B (en) * | 2021-10-19 | 2024-03-26 | 深圳市卓宝科技股份有限公司 | Non-solidified coiled material sample preparation method |
| CN116021693A (en) * | 2022-12-21 | 2023-04-28 | 安徽佳力奇先进复合材料科技股份公司 | Liquid resin casting sample preparation die and method |
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Application publication date: 20160615 |
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