CN113786870B - Method for manufacturing flexible base with microstructure protrusions for thin film chip bonding - Google Patents
Method for manufacturing flexible base with microstructure protrusions for thin film chip bonding Download PDFInfo
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- CN113786870B CN113786870B CN202111069043.1A CN202111069043A CN113786870B CN 113786870 B CN113786870 B CN 113786870B CN 202111069043 A CN202111069043 A CN 202111069043A CN 113786870 B CN113786870 B CN 113786870B
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- flexible base
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502707—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by the manufacture of the container or its components
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B01—PHYSICAL OR CHEMICAL PROCESSES OR APPARATUS IN GENERAL
- B01L—CHEMICAL OR PHYSICAL LABORATORY APPARATUS FOR GENERAL USE
- B01L3/00—Containers or dishes for laboratory use, e.g. laboratory glassware; Droppers
- B01L3/50—Containers for the purpose of retaining a material to be analysed, e.g. test tubes
- B01L3/502—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures
- B01L3/5027—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip
- B01L3/502715—Containers for the purpose of retaining a material to be analysed, e.g. test tubes with fluid transport, e.g. in multi-compartment structures by integrated microfluidic structures, i.e. dimensions of channels and chambers are such that surface tension forces are important, e.g. lab-on-a-chip characterised by interfacing components, e.g. fluidic, electrical, optical or mechanical interfaces
Abstract
The invention provides a method for manufacturing a flexible base with micro-structure protrusions for thin film chip bonding, and belongs to the field of micro-nano manufacturing. The base is used for bonding of a film chip and belongs to the field of micro-nano manufacturing. Firstly, a molded film chip is used as a male die, and a flexible female die conformal with the structure of the film chip is obtained through a casting molding process; and then, manufacturing a microstructure bulge surrounding the structure shape of the female die on the flexible female die by utilizing a photoetching process, thereby obtaining the flexible base with the microstructure bulge. And performing auxiliary bonding on the thin film chip by using the flexible base to strengthen the bonding strength around the microstructure of the thin film chip. The invention can manufacture a concave die conformal with the film chip structure according to the film chip structure; and the shape and the structure height of the microstructure bulge can be controlled by utilizing the photoetching technology, so that the bonding of the film chip is controlled.
Description
Technical Field
The invention belongs to the field of micro-nano manufacturing, and relates to a method for manufacturing a flexible base with a microstructure bulge for bonding a thin film chip.
Background
A Microfluidic Chip (Microfluidic Chip) is a Chip which integrates basic functional units such as a liquid storage tank, a channel, a reaction tank and the like on an operation platform with a square size and is used for completing different biochemical reactions. The polymer material is one of the mainstream materials for the research of the manufacture of the microfluidic chip. In order to make the polymer material show higher flexibility advantage, researchers propose to process a microchannel network structure on a polymer film, and form a film microfluidic chip by a bonding technology. The method has the advantages of less material consumption, lower cost, more contribution to centrifugal sample injection and the like.
In the manufacturing process of the thin film microfluidic chip, bonding is one of important process steps, and the chip can form a channel and a chamber only through effective bonding. In order to prevent the thin film structure from being damaged during the bonding process, the thin film structure needs to be protected. Therefore, the thin film chip requires a mount as a support when the thin film chip is bonded. For the mount, it is required that the mount and the thin film chip have a matched structural shape and size.
Disclosure of Invention
In light of the above-mentioned technical problems, the present invention provides a method for manufacturing a flexible base with micro-structure bumps for thin film chip bonding.
The technical scheme adopted by the invention is as follows:
a manufacturing method of a flexible base with a microstructure bulge for bonding a film chip comprises the steps of firstly, using a molded film chip as a male mold, and obtaining the flexible base with a female mold structure conformal to the structure of the film chip through a casting molding process; and then, manufacturing a microstructure bulge surrounding the shape of the concave die structure on the flexible base by utilizing a photoetching process to obtain the flexible base with the microstructure bulge. The invention utilizes the flexible base to carry out auxiliary bonding of the thin film chip so as to strengthen the bonding strength around the microstructure of the thin film chip. The method comprises the following steps:
1) and bonding the formed film chip in a container with a semi-closed space in a glue bonding mode to prepare the male die with the flexible base.
2) The flexible material prepolymer and the curing agent are fully mixed according to a certain mass ratio (the ratio of the flexible material prepolymer to the curing agent can be changed according to specific requirements). And after the mixture is uniformly stirred, performing degassing operation by using a vacuum oven until no obvious bubbles exist in the uniformly mixed flexible material.
3) Pouring the flexible material prepared in the step 2) into a male die of the flexible base, placing the flexible base on a leveled horizontal table, and cooling to room temperature until the flexible material is completely cured.
4) And (3) demolding the cured flexible base in the step 3) to obtain the high-fidelity replication structure of the thin film chip.
5) And (4) after the surface modification treatment is carried out on the flexible base in the step 4), coating photoresist on the surface of the flexible base, which is in contact with the male die, in a rotating manner, filling the flexible base structure, and curing.
6) And 5) spin-coating the photoresist thickness on the photoresist film on the flexible base obtained in the step 5) according to different local bonding strength requirements to meet the height requirement of the microstructure.
7) After curing, manufacturing a mask plate with the shape and the size of the microstructure according to the required reinforced bonding shape and pattern, and carrying out photoetching development on the cured flexible base with the photoresist by using the mask plate.
8) After development, a flexible mount with microstructured bumps for thin film die bonding was obtained.
Further, the mass ratio of the PDMS prepolymer to the curing agent is preferably 10: 1.
compared with the prior art, the invention has the beneficial effects that:
1. the high-fidelity replication structure can be obtained by the flexible material in a pouring mode, and the manufacturing process is simple and the manufacturing cost is low.
2. By utilizing the photoetching technology, the bonding strength of any position can be improved according to different bonding strength requirements.
3. The step-shaped step microstructure protrusion can be manufactured according to different bonding strength requirements of different positions.
Drawings
In order to more clearly illustrate the embodiments or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below.
FIG. 1 is a diagram of the room temperature cure of a flexible material of the present invention;
FIG. 2 is a schematic view of a spin-on photoresist for a flexible mount of the present invention;
FIG. 3 is a schematic view of the flexible base of the present invention;
FIG. 4 is a schematic view of a PDMS flexible base with microstructure protrusions according to the present invention.
In the figure: 1 flexible base, 2 thin film chip, 3 SU-82150 photoresist, 4 SU-82015 photoresist and 5 mask.
Detailed Description
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict. The present invention will be described in detail below with reference to the embodiments with reference to the attached drawings.
A method for manufacturing a flexible base with microstructure bulges for thin film chip bonding comprises the following steps:
bonding the formed film chip in a container with a semi-closed space by using an adhesive to prepare a male die of the flexible base; and (2) mixing the PDMS prepolymer and a curing agent according to the mass ratio of 10: 1, and fully mixing. After stirring uniformly, the vacuum oven is used for degassing for 3min at room temperature until no obvious bubbles exist in the uniformly mixed PDMS. And pouring the prepared PDMS into a male die mould of the flexible base, placing the mould on a leveled horizontal table, and keeping the room temperature for 48 hours until the PDMS is completely cured. And demolding the cured PDMS flexible base to obtain a high-fidelity replication structure of the film chip 2, wherein the thickness of the replication structure is 15 mm. And (3) carrying out surface modification treatment, such as oxygen plasma treatment, on the surface of the PDMS flexible base, which is in contact with the male die mold, so as to improve the surface hydrophilicity of the PDMS flexible base and improve the adhesiveness of the PDMS and the photoresist. And (3) spin-coating SU-82015 photoresist 4 on the surface of the PDMS flexible base subjected to surface modification treatment, filling the structure of the flexible base 1, and curing. According to different local bonding strength requirements, SU-82150 photoresist 3 is spin-coated (SU-82150 photoresist 3 can be spin-coated for several times) to meet the requirement of microstructure height, SU-82150 photoresist 3 is spin-coated for two times in the example, and the thickness of the SU-82150 photoresist film is 200 μm. After curing, the cured flexible base with the photoresist is photoetched by using the manufactured mask 5 with the shape and the size of the microstructure. After development, a PDMS flexible mount with microstructured bumps was obtained for thin film chip bonding.
The above-mentioned embodiments only express the embodiments of the present invention, but not should be understood as the limitation of the scope of the invention patent, it should be noted that, for those skilled in the art, many variations and modifications can be made without departing from the concept of the present invention, and these all fall into the protection scope of the present invention.
Claims (1)
1. A method for manufacturing a flexible base with microstructure bulges for thin film chip bonding is characterized by comprising the following steps:
1) bonding the formed film chip in a container with a semi-closed space by using an adhesive to prepare a male die of the flexible base;
2) mixing a PDMS prepolymer and a curing agent according to a mass ratio of 10: 1, fully mixing; after stirring uniformly, performing room temperature degassing operation for 3min by using a vacuum oven until no obvious bubbles exist in the uniformly mixed PDMS;
3) pouring the prepared PDMS into a male mold of the flexible base, placing the PDMS on a leveled horizontal table, and keeping the temperature at room temperature for 48h until the PDMS is completely cured;
4) demolding the cured PDMS flexible base to obtain a high-fidelity replication structure of the thin film chip (2), wherein the thickness of the replication structure is 15 mm;
5) performing surface modification treatment on one surface of the PDMS flexible base, which is in contact with the male die, and performing oxygen plasma treatment to improve the surface hydrophilicity of the PDMS flexible base and further improve the adhesiveness of PDMS and photoresist; coating SU-82015 photoresist (4) on the surface of the PDMS flexible base subjected to surface modification treatment in a spinning mode, filling the structure of the flexible base (1) with the photoresist, and curing;
6) according to different local bonding strength requirements, spinning SU-82150 photoresist (3) to meet the microstructure height requirement, specifically, spinning SU-82150 photoresist (3) twice to obtain SU-82150 photoresist film with the thickness of 200 μm;
7) after curing, carrying out photoetching development on the cured flexible base with the photoresist by using the manufactured mask (5) with the shape and the size of the microstructure;
8) after development, a PDMS flexible mount with microstructured bumps was obtained for thin film chip bonding.
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| US20080233011A1 (en) * | 2007-03-23 | 2008-09-25 | 3M Innovative Properties Company | Microfluidic devices |
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