JP3885303B2 - Method of manufacturing a light emitting substrate - Google Patents

Method of manufacturing a light emitting substrate Download PDF

Info

Publication number
JP3885303B2
JP3885303B2 JP23469997A JP23469997A JP3885303B2 JP 3885303 B2 JP3885303 B2 JP 3885303B2 JP 23469997 A JP23469997 A JP 23469997A JP 23469997 A JP23469997 A JP 23469997A JP 3885303 B2 JP3885303 B2 JP 3885303B2
Authority
JP
Grant status
Grant
Patent type
Prior art keywords
substrate
light emitting
bank
electrode
method
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP23469997A
Other languages
Japanese (ja)
Other versions
JPH1174082A (en )
Inventor
浩史 木口
貞男 神戸
Original Assignee
セイコーエプソン株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date

Links

Images

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/28Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
    • H01L27/32Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
    • H01L27/3241Matrix-type displays
    • H01L27/3281Passive matrix displays
    • H01L27/3283Including banks or shadow masks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/28Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
    • H01L27/32Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
    • H01L27/3241Matrix-type displays
    • H01L27/3244Active matrix displays
    • H01L27/3246Banks, i.e. pixel defining layers
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/0001Processes specially adapted for the manufacture or treatment of devices or of parts thereof
    • H01L51/0002Deposition of organic semiconductor materials on a substrate
    • H01L51/0003Deposition of organic semiconductor materials on a substrate using liquid deposition, e.g. spin coating
    • H01L51/0004Deposition of organic semiconductor materials on a substrate using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing, screen printing
    • H01L51/0005Deposition of organic semiconductor materials on a substrate using liquid deposition, e.g. spin coating using printing techniques, e.g. ink-jet printing, screen printing ink-jet printing
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED];
    • H01L51/5012Electroluminescent [EL] layer

Description

【0001】 [0001]
【発明の属する技術分野】 BACKGROUND OF THE INVENTION
本発明は発光ディスプレイに係わり、更に詳しくは有機発光材料(以後有機EL材料という)を用いた発光ディスプレイに関する。 The present invention relates to a light emitting display, and more particularly to a light emitting display using an organic light emitting material (hereinafter referred to as organic EL material).
【0002】 [0002]
【従来の技術】 BACKGROUND OF THE INVENTION
近年液晶表示体がワードプロセッサー、パーソナルコンピュータ等の表示部として盛んに用いられている。 Recently liquid crystal display body word processor, are extensively used as a display unit such as a personal computer. この液晶表示体は非発光素子であり、明るさの点、特に反射型ディスプレイで用いるとき問題となる。 The liquid crystal display element is a non-light-emitting element, in terms of brightness, a problem especially when used in reflective displays. ここへきて薄型、軽量の特徴を有する有機EL材料を用いた発光ディスプレイが注目されている。 Thin come here, the light emitting display has attracted attention using an organic EL material having the features of light weight.
【0003】 [0003]
この発光ディスプレイの断面図を図1に示す。 It shows a cross-sectional view of the light-emitting display in FIG. 図において1はアルミニウム電極を、2は有機EL材料を、3はITO透明電極を、4はガラス基板を、5は電源をそれどれ示す。 1 aluminum electrodes in FIG, 2 is an organic EL material, 3 an ITO transparent electrode, 4 is a glass substrate, 5 represents how the power it.
【0004】 [0004]
図よりわかる様に透明基板がわずかに厚みを要求される他はマイクロメータのオーダーであり、非常に薄いディスプレイである。 Besides the transparent substrate as seen from FIG. Is slightly required thickness is on the order of micrometers, a very thin display.
【0005】 [0005]
この発光ディスプレイの製造方法は以下の通りである。 Method of manufacturing the light emitting display is as follows. まず透明基板にスパッター法、又は蒸着法等によりITO透明電極を作製する。 First sputtering method on a transparent substrate, or to prepare an ITO transparent electrode by such as vapor deposition. しかる後、ホトリソグラフィー法等により所望の形状の電極を形成する。 Thereafter, an electrode having a desired shape by photolithography or the like. 更に、この基板状にスピンコート法、蒸着法等により有機EL材料を成膜し発光層とする。 Further, a spin coating method on the substrate shape, the organic EL material and the formed light-emitting layer by an evaporation method, or the like. 更にこの上に仕事関数の低い金属、例えば、マグネシウム、カルシウム、アルミニウム、リチウム、銀、あるいはこられ金属の合金を蒸着法、スパッター法等により成膜することにより対向電極とする。 Lower work function metal thereon, for example, a counter electrode magnesium, calcium, aluminum, lithium, silver or vapor deposition of metal alloy is this, by depositing by sputtering or the like.
【0006】 [0006]
以上が基本の工程であるが、発光効率を上げるために、更に透明電極と発光層の間にホール輸送層、例えば、N,N'−ジフェニル−N,N'−(2,4−ジメチルフェニル)−1,1'−ビフェニル−4,4'ジアミン層を設けてもよい。 The above is a basic process, the hole transport layer between to increase the luminous efficiency, further transparent electrode and the luminescent layer, for example, N, N'-diphenyl -N, N '- (2,4- dimethylphenyl ) -1,1'-biphenyl-4,4'-diamine layer may be provided. また発光層と対向電極の間に電子輸送層、例えば2−(4−ビフェニル)−5−(4−tert−ブチルフェニル)−1,3,4−オキシジアゾール層を設けてもよい。 The electron-transporting layer between the light-emitting layer and the counter electrode, for example, 2- (4-biphenyl)-5-(4-tert-butylphenyl) -1,3,4-oxadiazole layer may be provided.
【0007】 [0007]
この対向する電極間に電界を印可することにより発光させることが出来る。 It can be made to emit light by applying an electric field between the opposing electrodes. この発光ディスプレイの特徴として、10ボルト以下の電圧で駆動できることがある。 As a feature of the light emitting display, which may be driven by 10 volts or less voltage. この有機EL材料を用いた発光ディスプレイは将来有望な技術であるが、フルカラー化をねらう場合問題があった。 Although the light emitting display using the organic EL material is a promising technology, there is a problem when aiming full color. 即ち、赤、緑、青をどのように別々に区分けするかが問題であった。 In other words, red, green, how differently to partition the blue was a problem. . しかしここへきてリソグライフィー法等により電極上に発光層を仕切る土手を形成し、その土手内に吐出装置を用い赤、緑、青の有機EL材を溶解した溶液を吐出し、吐出後溶媒を乾燥除去し、発光層とする方法が注目されている。 But forming a bank for partitioning the light emitting layer on the electrode by lithography gley fee method come here, discharging red using discharge device within the bank, green, a solution of an organic EL material of blue, discharge the solvent removed by drying, a method of a light emitting layer has attracted attention.
【0008】 [0008]
【発明が解決しようとする課題】 [Problems that the Invention is to Solve
従来、土手はホトリソグラフィー法により形成されていた。 Conventionally, bank was formed by photolithography. そしてその形状は、図2、図3に示す様に矩形が一般的であった。 And the shape, FIG. 2, a rectangular were common as shown in FIG. 最近、逆テーパを付け、対向電極に接する土手の鋭角を利用し、土手に一種のマスクの役割をさせて、対向電極蒸着後の電極に切れ目をいれ、短冊状に電極を作る方法が提案されている。 Recently, with a reverse taper, using a sharp bank in contact with the counter electrode, and is not the role of a kind of mask bank, scored the electrode after the counter electrode deposition, the method of making the electrode have been proposed in strips ing.
【0009】 [0009]
尚、図2は矩形状の土手を有す、短冊上に区切られた透明電極付き基板上に有機EL材料を溶解した溶液を吐出装置により吐出する工程を示す概念図である。 Incidentally, FIG. 2 have a rectangular shape of the bank is a conceptual diagram showing a step of ejecting the solution discharge device by dissolving the organic EL material separated with transparent electrodes on the substrate on the strip. また、図3はマトリクス状に、TFT素子と、この素子と直結するITO透明電極とを配置した土手を有す基板上に、有機EL材料を溶解した溶液を吐出装置により吐出する工程を示す概念図である。 Further, FIG. 3 is in a matrix, the concepts illustrated and TFT elements, on a substrate having a bank arranged the ITO transparent electrode is directly connected with the device, a step of discharging by the discharge device a solution prepared by dissolving an organic EL material it is a diagram. 図2、3において21、31は有機EL材料を溶解した溶液を吐出するノズルを、22、32は有機EL材料を、23、33は土手を、24、34はITO透明電極を、25、35はガラス基板を、36は絶縁層を、37はTFT素子をそれぞれ示す。 The nozzle 21 and 31 in FIGS. 2 and 3 for discharging a solution of an organic EL material, an organic EL material 22 and 32, 23 and 33 the bank, 24 and 34 the ITO transparent electrode, 25 and 35 the glass substrate, 36 is an insulating layer, 37 denotes a TFT element.
【0010】 [0010]
従来の土手はこれらの図に示す様に、矩形であるか、透明電極に接する辺の方が短い、すなわち逆テーパを有する形状であった。 As conventional bank is shown in these figures, or a rectangular, towards the side in contact with the transparent electrode is short, i.e. a shape having a reverse taper. そのため、発光部分に対して有機EL材を打ち込む面積が狭くなる欠点が有る。 Therefore, disadvantage that the area of ​​implanting organic EL material becomes narrow there the light emitting portion. このため吐出装置による赤、緑、青をうち分けることが困難になる欠点があった。 Red due to this reason ejection device, green, there is a disadvantage that it is difficult to separate out the blue.
【0011】 [0011]
本発明はこの様な課題を解決するためになされたもので、その目的は吐出装置による有機EL材料を困難を伴うこと無く吐出でき、発光層間の交じり合いの無い、良好な発光ディスプレイを提供するためになされたものである。 The present invention has been made in order to solve such problems, and an object can discharge without difficulty an organic EL material by the discharge device, without mutual intermingle the light-emitting layers, to provide good light emitting display It has been made for.
【0012】 [0012]
【課題を解決するための手段】 In order to solve the problems]
上記課題を解決するために、本発明による発光基板の製造方法は、基板上に、第1電極と、発光層と、第2電極とが、この順に形成され、かつ、該発光層を仕切る土手とを有する発光基板の製造方法であって、底辺が対辺より長い断面形状である土手を有する金属型を用い、樹脂型を形成する工程と、前記基板と前記樹脂型とを接触させる工程と、前記基板と前記樹脂型との間に形成される空間にガラス前駆体を進入させて固化し、前記基板上に透明電極側に接する辺が対辺より長くなる断面形状となるよう前記土手を形成する工程と、前記土手で仕切られた領域に、有機EL材料を溶解した溶液をインクジェットプリンティング装置により吐出して前記発光層を形成する工程と、を備えることを特徴とする。 Bank in order to solve the above problems, the method of manufacturing the light emitting substrate according to the present invention, on a substrate, a first electrode, a light emitting layer, and a second electrode are formed in this order, and to partition the light-emitting layer a step the method for manufacturing a light emitting substrate, using a metal mold having a bank base is longer cross-sectional shape than the opposite side, contacting and forming a resin mold, and the resin mold and the substrate having the bets, solidified by advancing the glass precursor in a space formed between the resin type and the substrate, the side in contact with the transparent electrode side on the substrate to form the bank to be a cross-sectional shape that is longer than the opposite side a step, the regions divided by the bank, characterized in that it comprises a step of forming the light emitting layer by discharging by the solution of an organic EL material ink jet printing apparatus.
【0013】 [0013]
この様な土手を形成することにより発光面積に比べて、比較的大きく開いた、有機EL材料を受け止める部分を形成できる。 Compared to the light-emitting area by forming such a bank, a relatively large open portion for receiving the organic EL material can be formed. そのため吐出装置の振れのマージンも大きくなる。 Therefore also large margin of fluctuation of the ejection device.
【0014】 [0014]
【発明の実施の形態】 DETAILED DESCRIPTION OF THE INVENTION
以下実施例により詳しく説明する。 Described in more detail by the following examples.
【0015】 [0015]
(実施例1) (Example 1)
ITO電極幅40マイクロメータ、電極間10マイクロメータで配置された短冊状電極付きガラス基板に非感光性ポリイミドSE−812(日産化学製)を、回転速度2000rpm、回転時間20秒の条件でスピンコートした。 ITO electrode width 40 micrometers, non-photosensitive polyimide SE-812 in a strip-shaped electrode-attached glass substrates arranged at 10 micrometers between the electrodes (produced by Nissan Chemical), rotational speed 2000 rpm, spin coating at a rotational time 20 seconds did. この基板を80度C30分間プレベークした後、マスクをし、露光した。 After prebaking the substrate 80 ° C30 minutes, the mask was exposed. 露光後、エッチングを行い、160度Cで30分間ポストベークをし、図4に示す土手付き基板を得た。 After exposure, etching, and the post-baked for 30 minutes at 160 ° C, to obtain a bank with the substrate shown in FIG. 図において41は土手を、42はITO透明電極を、43はガラス基板を示す。 41 embankment in FIG, 42 is an ITO transparent electrode, 43 denotes a glass substrate. この基板に赤、緑、青の有機EL材を溶解する溶液をディスペンサにより吐出した。 Red substrate, green, and discharge by a solution dispenser for dissolving the organic EL material and blue. 最後にMg/Ag(1:10)合金を蒸着し、透明電極に直交するように電極を形成し、対向電極とした。 Finally deposited Mg / Ag (1:10) alloy, to form an electrode so as to be orthogonal to the transparent electrode and a counter electrode.
【0016】 [0016]
このようにして得た発光ディスプレイをマトリクス駆動した。 The light emitting display in this manner were obtained and matrix driving.
【0017】 [0017]
(実施例2) (Example 2)
図5に示す土手の形状を有す金属型と、シリコン樹脂(東芝シリコーン製)を用いシリコン樹脂型を作成した。 A metal mold having a shape of a bank shown in FIG. 5, to obtain silicon resin type using silicon resin (manufactured by Toshiba Silicone). この型をTFT素子とこのTFT素子に直結したITO透明電極がマトリクス上に形成されたガラス基板に密着させ、この型の回りにガラス前駆体(ETSBー7000、テー・エス・ビー開発センター製)を設置し、シリコン樹脂型と基板の形成する空間にガラス前駆体を室温で進入させた。 The mold is brought into close contact with the glass substrate directly to the ITO transparent electrode is formed in a matrix and the TFT element in the TFT element, a glass precursor around this type (ETSB over 7000, manufactured by tape es Bee Development Center) the assembled and glass precursor is advanced at room temperature in the space to form a silicone resin type and the substrate. 進入が完結したところで室温に放置し固化させた、固化したところでシリコン樹脂型を取り外し、200度Cで2時間焼成し、図6に示すような土手付き基板を得た。 Approach was allowed to stand solidified to room temperature was complete, remove the silicone resin type where solidified, calcined for 2 hours at 200 ° C, to obtain a bank with substrate as shown in FIG. 図において61は土手を、62はITO透明電極を、63はガラス基板を、64は絶縁層を、65はTFT素子をそれぞれ示す。 61 embankment in FIG, 62 is an ITO transparent electrode, 63 is a glass substrate, 64 is an insulating layer, 65 denotes a TFT element. この基板の土手の間にインクジェットプリンティング装置を用い、赤、緑、青の有機EL材料を溶かした溶液を吐出した。 Using an inkjet printing device during the bank of the substrate was discharged red, green, a solution of an organic EL material of blue. その後、乾燥、溶媒除去してから、リチウム2%入りアルミニウムをスパッター法によりスパッタして対向電極とした。 Thereafter, drying, after solvent removal, was a counter electrode was sputtered by sputtering method 2% containing lithium aluminum hydride.
【0018】 [0018]
【発明の効果】 【Effect of the invention】
以上述べたように本発明の発光ディスプレイは、吐出装置を用い効率よく、各色の発光層間の混ざりもなく製造できる。 The light-emitting display of the present invention as described may efficiently using the discharge device can be manufactured without mixing of colors of light-emitting layers.
【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS
【図1】発光ディスプレイの断面図。 Figure 1 is a cross-sectional view of a light emitting display.
【図2】短冊状の電極を有す発光ディスプレイの製造工程を示す概念図。 Figure 2 is a conceptual diagram showing a light emitting display having a strip-shaped electrodes.
【図3】マトリクス状にTFT素子とITO電極を有す発光ディスプレイの製造工程を示す概念図。 Conceptual view showing the manufacturing process of Figure 3 light-emitting display having a TFT element and the ITO electrodes in a matrix.
【図4】本発明の発光ディスプレイの土手の形状を示す断面図。 Sectional view showing a shape of a bank of light emitting display of the present invention; FIG.
【図5】本発明の発光ディスプレイの土手の形成するシリコン樹脂型とシリコン樹脂型を形成する金型を示す断面図。 5 is a sectional view showing a mold for forming a silicon resin type and a silicon resin type which forms the bank of light emitting display of the present invention.
【図6】本発明の発光ディスプレイの土手の形状を示す断面図。 6 is a sectional view showing the shape of a bank of light emitting display of the present invention.
【符号の説明】 DESCRIPTION OF SYMBOLS
1. 1. アルミニウム電極2. Aluminum electrode 2. 有機EL材料3. Organic EL material 3. ITO透明電極4. ITO transparent electrode 4. ガラス基板5. Glass substrate 5. 電源21. Power source 21. ノズル22. Nozzle 22. 有機EL材料23. Organic EL material 23. 土手24. Bank 24. ITO透明電極25. ITO transparent electrode 25. ガラス基板31. Glass substrate 31. ノズル32. Nozzle 32. 有機EL材料33. Organic EL material 33. 土手34. Bank 34. ITO透明電極35. ITO transparent electrode 35. ガラス基板36. Glass substrate 36. 絶縁層37. Insulating layer 37. TFT素子41. TFT element 41. 土手42. Bank 42. ITO透明電極43. ITO transparent electrode 43. ガラス基板51. Glass substrate 51. 金型52. Mold 52. シリコン樹脂型61. Silicon resin type 61. 土手62. Bank 62. ITO透明電極63. ITO transparent electrode 63. ガラス基板64. Glass substrate 64. 絶縁層65. Insulating layer 65. TFT素子 TFT element

Claims (1)

  1. 基板上に、第1電極と、発光層と、第2電極とが、この順に形成され、かつ、該発光層を仕切る土手とを有する発光基板の製造方法であって、 On a substrate, a first electrode, a light emitting layer, and the second electrode are formed in this order, and a method for manufacturing a light emitting substrate having a bank for partitioning the light emitting layer,
    底辺が対辺より長い断面形状である土手を有する金属型を用い、樹脂型を形成する工程と、 A base of a metal mold having a bank is a long cross-sectional shape than the opposite side, forming a resin mold,
    前記基板と前記樹脂型とを接触させる工程と、 A step of contacting the resin mold and the substrate,
    前記基板と前記樹脂型との間に形成される空間にガラス前駆体を進入させて固化し、前記基板上に透明電極側に接する辺が対辺より長くなる断面形状となるよう前記土手を形成する工程と、 Solidified by advancing the glass precursor in a space formed between the resin type and the substrate, the side in contact with the transparent electrode side on the substrate to form the bank to be a cross-sectional shape that is longer than the opposite side and a step,
    前記土手で仕切られた領域に、有機EL材料を溶解した溶液をインクジェットプリンティング装置により吐出して前記発光層を形成する工程と、を備えることを特徴とする発光基板の製造方法。 Method of manufacturing a light-emitting substrate, characterized in that it comprises a region partitioned by the bank, and forming the light emitting layer by the solution of an organic EL material discharged by ink jet printing apparatus.
JP23469997A 1997-08-29 1997-08-29 Method of manufacturing a light emitting substrate Expired - Fee Related JP3885303B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23469997A JP3885303B2 (en) 1997-08-29 1997-08-29 Method of manufacturing a light emitting substrate

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23469997A JP3885303B2 (en) 1997-08-29 1997-08-29 Method of manufacturing a light emitting substrate

Publications (2)

Publication Number Publication Date
JPH1174082A true JPH1174082A (en) 1999-03-16
JP3885303B2 true JP3885303B2 (en) 2007-02-21

Family

ID=16975027

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23469997A Expired - Fee Related JP3885303B2 (en) 1997-08-29 1997-08-29 Method of manufacturing a light emitting substrate

Country Status (1)

Country Link
JP (1) JP3885303B2 (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100244185B1 (en) * 1997-09-18 2000-02-01 구자홍 Organic electroluminescence device and method for fabricating the same
WO2001039272A1 (en) * 1999-11-29 2001-05-31 Koninklijke Philips Electronics N.V. Organic electroluminescent device and a method of manufacturing thereof
JP4827294B2 (en) * 1999-11-29 2011-11-30 株式会社半導体エネルギー研究所 The method for manufacturing a film forming apparatus and light emitting device
JP4748147B2 (en) * 2000-02-25 2011-08-17 セイコーエプソン株式会社 Organic el device
JP2002231445A (en) * 2001-01-31 2002-08-16 Dainippon Printing Co Ltd El element and method of manufacture
KR20040039384A (en) * 2001-09-24 2004-05-10 코닌클리케 필립스 일렉트로닉스 엔.브이. Assembly for a thin-film optical device, organic electroluminescent display device and method of manufacturing same
JP4425531B2 (en) * 2002-08-21 2010-03-03 富士通株式会社 Organic el device and manufacturing method thereof
KR100508002B1 (en) 2002-09-03 2005-08-17 엘지.필립스 엘시디 주식회사 fabrication method of an organic electro-luminescence device using nozzle coating
DE10324880B4 (en) * 2003-05-30 2007-04-05 Schott Ag A process for the production of OLEDs
KR101007717B1 (en) 2003-11-28 2011-01-13 삼성전자주식회사 Pattern mask and display device using the same, and method of manufacturing thereof
KR100705312B1 (en) * 2004-03-22 2007-04-10 엘지전자 주식회사 Organic Electro Luminescence Device And Fabricating Method Thereof

Also Published As

Publication number Publication date Type
JPH1174082A (en) 1999-03-16 application

Similar Documents

Publication Publication Date Title
US6023371A (en) Color conversion material, and organic electroluminescent color display using the same
US20050077816A1 (en) Organic light emitting device, manufacturing method thereof, and display unit
US6468819B1 (en) Method for patterning organic thin film devices using a die
US6013538A (en) Method of fabricating and patterning OLEDs
US6087772A (en) Organic electroluminecent display device suitable for a flat display and method of forming the same
US6037712A (en) Organic electroluminescence display device and producing method thereof
US20030025446A1 (en) Manufacturing method and structure of OLED display panel
US6091196A (en) Organic electroluminescent display device and method of manufacture thereof
US6712661B1 (en) Method for manufacturing electroluminescence device
US5701055A (en) Organic electoluminescent display panel and method for manufacturing the same
US20060012280A1 (en) Deposition mask and method for manufacturing organic light emitting display using the same
US6312837B1 (en) Optical element and method of manufacturing the same
EP0732868A1 (en) Organic electroluminescent display panel and method for manufacturing the same
US5952037A (en) Organic electroluminescent display panel and method for manufacturing the same
US20050073243A1 (en) Light emitting device and method of manufacturing the same
US6249084B1 (en) Electroluminescence display panel and production method of the same
JP2009218156A (en) El panel and method of manufacturing el panel
US20030197466A1 (en) Light emitting device and method of manufacturing the same
JPH1126156A (en) Organic el multicolor light emitting display device
JP2007186740A (en) Mask, film deposition method, light emitting device, and electronic equipment
EP1073090A2 (en) Field emission display device using carbon nanotubes and manufacturing method thereof
WO2001063975A1 (en) Organic el device and method of manufacture thereof
EP0773707A2 (en) Method of forming an organic electroluminescent display panel
JPH10335068A (en) Light emitting-type display device
JPH1012377A (en) Manufacture of active matrix type organic el display body

Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20040610

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20040610

A977 Report on retrieval

Free format text: JAPANESE INTERMEDIATE CODE: A971007

Effective date: 20060713

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060725

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20060821

A131 Notification of reasons for refusal

Free format text: JAPANESE INTERMEDIATE CODE: A131

Effective date: 20060912

A521 Written amendment

Free format text: JAPANESE INTERMEDIATE CODE: A523

Effective date: 20061003

TRDD Decision of grant or rejection written
A01 Written decision to grant a patent or to grant a registration (utility model)

Free format text: JAPANESE INTERMEDIATE CODE: A01

Effective date: 20061031

A61 First payment of annual fees (during grant procedure)

Free format text: JAPANESE INTERMEDIATE CODE: A61

Effective date: 20061113

R150 Certificate of patent or registration of utility model

Free format text: JAPANESE INTERMEDIATE CODE: R150

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101201

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20101201

Year of fee payment: 4

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111201

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20111201

Year of fee payment: 5

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121201

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20121201

Year of fee payment: 6

FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20131201

Year of fee payment: 7

LAPS Cancellation because of no payment of annual fees